JP2004296773A - Method and device for controlling temperature of substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature controlling device for the substrate in a manufacturing line whose foot space is reduced without requiring need for holding the substrate for a prescribed length of time. <P>SOLUTION: A temperature controlling device 1 comprises a conveying means 3 for conveying a substrate 2, a nozzle 4 having a slit discharging outlet 4a arranged in the conveying path of the conveying means and extending in a direction for traversing the conveying path, a gas supplying means 5 for supplying gas to the nozzle, and a temperature controlling means 6 for controlling the temperature of the gas. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate temperature management device, and more particularly to a device for heating or cooling a substrate.
[0002]
[Prior art]
In the process of manufacturing semiconductors and liquid crystal displays, a process of heating the substrate for the purpose of evaporating the solvent remaining in the resist film applied to the substrate and improving the adhesion strength between the resist film and the substrate, a process called so-called baking Has been done several times. The baking process includes pre-baking performed after applying a resist to a substrate and before exposure, and post-baking performed after exposure and development. In these steps, since strict temperature control is required for the substrate, it is generally known to heat the substrate using a hot plate. Further, in order to quickly send the heated substrate to the next processing step, the high-temperature substrate may be left standing on a water-cooled cooling plate to be cooled.
[0003]
[Problems to be solved by the invention]
However, when a plate is used for heating or cooling a substrate, the substrate needs to be once settled on the plate by a transfer means such as a robot hand and held for a certain period of time until the substrate reaches a predetermined temperature. This is one of the causes. In addition, since the plate on which the substrate is to be settled needs an area larger than the area of the substrate, an increase in the area occupied by the plate as the size of the substrate increases has become a problem.
[0004]
Therefore, an object of the present invention is to provide a substrate temperature management apparatus in which the area occupied by the apparatus in a production line is small and it is not necessary to hold the substrate for a predetermined time.
[0005]
[Means for Solving the Problems]
Hereinafter, the present invention will be described. In addition, in order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are added in parentheses, but the present invention is not limited to the illustrated embodiment.
[0006]
The temperature management method according to the present invention solves the above-described problem by controlling the temperature of the substrate (2) by controlling the temperature of the substrate by blowing a gas on the substrate (2) being transported in a direction crossing the transport path of the substrate. Resolve.
[0007]
According to the temperature management method of the present invention, since the gas is blown in the direction crossing the substrate transport path, the gas is blown over the entire surface of the substrate by passing the substrate at the position where the gas is blown. Then, since heat exchange is performed between the blown gas and the substrate, temperature control is realized over the entire surface of the substrate. In addition, since it is only necessary to provide a nozzle for ejecting gas in the substrate transfer path, the area of the production line does not increase. Since the temperature of the substrate is controlled during the transfer of the substrate, the throughput of the production line does not decrease. In particular, the temperature management method of the present invention does not need to control the temperature of the entire substrate, and is suitable for a process in which only the temperature of the substrate surface needs to be controlled.
[0008]
The substrate temperature management device (1) of the present invention is provided with a transfer means (3) for transferring a substrate (2), and is disposed on a transfer path of the transfer means, and ejects gas in a direction traversing the transfer path. The above-mentioned problem is solved by providing possible nozzles (4, 20,..., 20) and gas supply means (5) for supplying gas to the nozzles.
[0009]
According to the temperature management device of the present invention, the above-described temperature management method of the present invention can be realized. The temperature of the gas supplied to the nozzle may or may not be controlled. If the temperature of the gas is not controlled, a gas at room temperature (normal temperature) is blown, so that the heated substrate can be cooled to room temperature. Further, the nozzles may be capable of spraying gas uniformly in a direction transverse to the transport path.
[0010]
The temperature management device of the present invention may include a temperature control means (6) for controlling the temperature of the gas supplied to the nozzle. In this case, the temperature of the substrate can be heated or cooled to an arbitrary temperature by controlling the temperature of the gas. Also, accurate temperature control of the substrate is facilitated. In addition, the temperature control unit may control the temperature of the gas between the gas supply unit and the nozzle, may control the temperature of the gas held by the gas supply unit, or the gas supply unit may The temperature of the gas to be taken in may be controlled.
[0011]
In the temperature management device of the present invention, the nozzle may be a nozzle (4) having a slit-shaped discharge port (4a) extending in a direction crossing the transport path. In this case, the gas is uniformly ejected from the slit-shaped discharge port, and the temperature is controlled uniformly in the direction traversing the transfer path. Therefore, the operation of the temperature control device such as the transfer speed of the substrate and the flow rate of the gas is performed. Is adjusted, uniform temperature control is performed over the entire surface of the substrate. For example, uniform temperature control over the entire surface of the substrate may be realized by keeping the substrate transfer speed, gas flow rate, and gas temperature constant.
[0012]
In the temperature management device of the present invention, the nozzles may be a plurality of nozzles (20 ... 20) arranged at equal intervals in a direction crossing the transport path. In this case, the gas is blown uniformly over the direction traversing the transport path by the plurality of nozzles arranged, and the temperature is controlled uniformly over the direction. By adjusting the operation of the temperature management device such as the transfer speed and the gas flow rate, uniform temperature control can be performed over the entire surface of the substrate.
[0013]
In the temperature management device according to the aspect of the invention, the transfer unit may transfer the substrate at a constant speed, the gas supply unit may supply the gas to the nozzle at a constant flow rate, and the temperature control unit may control the gas flow. The temperature may be maintained at a constant temperature. In this case, since the same temperature change occurs at the same time in each part of the substrate, the heat history becomes uniform over the entire surface of the substrate. Therefore, temperature control in a heating step that requires a uniform heat history over the entire surface of the substrate, such as post baking, can be easily performed. In addition, there is no possibility of overshoot unlike a heating method using radiant heat, for example.
[0014]
In the temperature management device according to the aspect of the invention, as the nozzle, a nozzle having the discharge port facing one surface of the substrate and a nozzle having the discharge port facing the other surface of the substrate may be provided. . In this case, since heat exchange between the substrate and the gas is performed from both sides of the substrate, the temperature of the substrate is more quickly controlled.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows a substrate temperature control apparatus 1 according to the present invention. The temperature management device 1 is provided on a production line that forms a pattern on a substrate by, for example, photolithography. The temperature management device 1 is applicable to various heating processes or cooling processes. For example, the temperature management device 1 may be provided in a transport path of the substrate 2 to the coater and used to cool the substrate, or may be used to cool the substrate from the coater to the exposure apparatus. May be used for pre-baking by being provided in the transport path of the developing device, or may be provided for the post-baking by being provided in a transport path from the developing device.
[0016]
The temperature control device 1 includes a transfer device 3 for transferring the substrate 2 in the direction of arrow A, a nozzle 4 having a slit-shaped discharge port 4 a extending in a direction crossing the arrow A, and a gas supply for supplying air to the nozzle 4. The apparatus includes a device 5 and a temperature control device 6 installed between the gas supply device 5 and the nozzle 4 to control the air temperature.
[0017]
The transport device 3 is configured to include, for example, transport rollers 7 and an electric motor (not shown) that rotationally drives the transport rollers 7. The substrate 2 on the transport rollers 7 can be transported. The discharge port 4a has a length over the entire width of the substrate 2 and is opened at a constant width over the entire width of the substrate 2. The gas supply device 5 includes, for example, a fan (not shown) and an electric motor (not shown) for driving the fan to rotate, and controls the rotation speed of the electric motor to feed air at an arbitrary flow rate. It is possible. If the temperature management device 1 is for heating, the temperature control device 6 is configured to include, for example, an electric heater (not shown), and adjusts the temperature of the electric heater so that air from the gas supply device 5 can be heated to an arbitrary temperature. The temperature can be raised up to. If the temperature management device 1 is for cooling, the temperature control device 6 is configured to include, for example, a heat exchanger (not shown), and the air from the gas supply device 5 can be arbitrarily adjusted by adjusting the temperature of the heat exchanger. Coolable to temperature.
[0018]
Next, the operation of the temperature management device 1 will be described.
[0019]
When the substrate 2 is placed on the transfer device 3, the temperature control device 1 drives the gas supply device 5 to supply air to the nozzle 4 at a constant flow rate, and the air is kept constant by the temperature control device 6. Adjust to temperature. Further, the temperature management device 1 rotates the rollers 7... 7 at a constant angular velocity, and conveys the substrate 2 in the direction of arrow A. By such an operation of the temperature control device 1, the substrate 2 passes from the end 2a under the discharge port 4a, and is sequentially heated from the end 2a to the end 2b by the hot air or the cool air 8 jetted from the discharge port 4a. Or cooled.
[0020]
The transfer speed of the substrate 2 by the transfer device 3, the flow rate of the air supplied by the gas supply device 5, and the temperature of the air adjusted by the temperature control device 6 depend on the types of processing such as pre-bake and post-bake, and It may be set appropriately according to various conditions such as the material of the resist being formed and the thickness of the substrate. For example, hot air may be ejected from the discharge port 4a toward the transport path of the substrate 2 at a wind speed of 10 m or more per second.
[0021]
The present invention is not limited to the embodiments described above, but may be implemented in various forms.
[0022]
The shape, number, and arrangement of the nozzles may be appropriately changed. For example, as shown in FIG. 2A, a plurality of nozzles 20... 20 may be arranged at equal intervals in a direction transverse to the transport path of the substrate 2. Further, as shown in FIG. 2B, a plurality of nozzles 4... 4 having slit-shaped discharge ports may be arranged in a direction crossing the transport path of the substrate 2. Further, as shown in FIG. 3A, a plurality of nozzles 4... 4 may be arranged side by side in the transport direction of the substrate, and hot air or cold air 8 may be blown onto the substrate 2. As shown in FIG. 3B, the nozzles 4 may be arranged up and down with respect to the transport path, and hot air or cold air 8 may be simultaneously blown onto the substrate 2 from above and below.
[0023]
The conveying means is not limited to the roller conveyor, and various means such as a cart and a belt may be applied as long as the hot air or the cold air 8 can be blown onto the surface of the substrate 2 while conveying the substrate 2. be able to. Further, the transport state of the substrate 2 does not need to be horizontal, and the substrate 2 can be transported in various states as long as the substrate 2 can be heated by blowing hot air or cold air 8 thereon.
[0024]
When the substrate is cooled by the temperature management device 1, the substrate 2 may be cooled by omitting the temperature control device 6 and blowing air at room temperature (normal temperature) onto the substrate 2.
[0025]
The heating part of the temperature control device 1 may be surrounded by an insulated chamber so as not to be affected by the room temperature or the temperature of the conveyor. The hot air blown out from the nozzle 4 may be exhausted from the chamber, or may be returned to the gas supply device 5 and circulated.
[0026]
【The invention's effect】
As described above, according to the present invention, the gas is blown in the direction traversing the transport path of the substrate, so that the substrate passes through the position where the gas is blown, so that the gas is spread over the entire surface of the substrate. Sprayed. Then, since heat exchange is performed between the blown gas and the substrate, temperature control is realized over the entire surface of the substrate. In addition, since it is only necessary to provide a nozzle for ejecting gas in the substrate transfer path, the area of the production line does not increase. Since the temperature of the substrate is controlled during the transfer of the substrate, the throughput of the production line does not decrease. In particular, the temperature management method of the present invention does not need to control the temperature of the entire substrate, and is suitable for a process in which only the temperature of the substrate surface needs to be controlled.
[Brief description of the drawings]
FIG. 1 is a diagram showing an embodiment of a substrate temperature management device according to the present invention.
FIG. 2 is a diagram showing a modified example of a nozzle.
FIG. 3 is a diagram showing a modification of the arrangement location of nozzles.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Temperature management device 2 Substrate 3 Transfer device 4 Nozzle 4a Discharge port 5 Gas supply device 6 Temperature control device

Claims (7)

A method of controlling the temperature of a substrate, comprising blowing a gas onto a substrate being transported in a direction transverse to a transport path of the substrate to control the temperature of the substrate. Transport means for transporting the substrate, a nozzle arranged on the transport path of the transport means, capable of ejecting gas in a direction transverse to the transport path, and gas supply means for supplying gas to the nozzle A substrate temperature management device, characterized in that: The temperature management device according to claim 2, further comprising a temperature control unit configured to control a temperature of a gas supplied to the nozzle. 4. The substrate temperature management device according to claim 2, wherein the nozzle has a slit-shaped discharge port extending in a direction crossing the transport path. 5. The substrate temperature management device according to claim 2, wherein the nozzles are a plurality of nozzles arranged at equal intervals in a direction crossing the transport path. The transfer means transfers the substrate at a constant speed,
The gas supply means supplies the gas to the nozzle at a constant flow rate,
The temperature control device according to any one of claims 2 to 5, wherein the temperature control device keeps the temperature of the gas at a constant temperature. 7. The nozzle according to claim 2, wherein the nozzle includes a nozzle having the discharge port directed to one surface of the substrate, and a nozzle having the discharge port directed to the other surface of the substrate. The temperature management device according to any one of claims 1 to 7.

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