JPS62127677A - Heating device for parts - Google Patents

Heating device for parts

Info

Publication number
JPS62127677A
JPS62127677A JP26878085A JP26878085A JPS62127677A JP S62127677 A JPS62127677 A JP S62127677A JP 26878085 A JP26878085 A JP 26878085A JP 26878085 A JP26878085 A JP 26878085A JP S62127677 A JPS62127677 A JP S62127677A
Authority
JP
Japan
Prior art keywords
duct
cover
parts
preheating
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26878085A
Other languages
Japanese (ja)
Other versions
JPH0335630B2 (en
Inventor
Takuya Hosoda
細田 卓谷
Masayuki Ishii
政幸 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ando Electric Co Ltd
Original Assignee
Ando Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ando Electric Co Ltd filed Critical Ando Electric Co Ltd
Priority to JP26878085A priority Critical patent/JPS62127677A/en
Publication of JPS62127677A publication Critical patent/JPS62127677A/en
Publication of JPH0335630B2 publication Critical patent/JPH0335630B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

PURPOSE:To heat parts speedily while movement distance is short by covering a heating device for the parts in double structure consisting of a duct and a cover and heating the parts in the duct by utilizing contacting heat conduction and forcible convention of ambient temperature in combination. CONSTITUTION:The duct 5 is constituted covering the outer periphery of a preheating table 2 and the cover 6 is constituted covering the duct 5. Dry air from injection ports 9 and 10 is sent in the hollow part s of preheating table and heat-return table 12 and between the outside of the preheating table 2 and the inside of the duct 5 and dry air passed through the hollow part of the heat-return table 12 is sent in between the outside of the duct 5 and the inside of the cover 6.The parts 4 which move on the preheating table 2 by a transport table 1 are heated by the heat conduction from the preheating table 2 while its outer periphery is heated with heating air in the duct 5. The parts 4 exiting from a testing device 8 passes over the heat-return table 12 covered with only the cover 6 and is heated speedily up to the temperature of the dry air without any dew condensation.

Description

【発明の詳細な説明】 (a)発明の技術分野 この発明は、半導体なとの部品を温度試験する場合など
に使用する部品の加熱装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a heating device for parts used in temperature testing of semiconductor parts.

(b)発明の目的 この発明は、部品を保管場所から温度試験装置のある所
まで搬送して温度試験をし、温度試験終了後、部品を常
温に戻して別の保管場所まで移動するような場合に、部
品が温度試験装置に到着すれば、すぐに温度試験ができ
るように搬送の途中で部品を加熱するようにした加熱装
置において、加熱区間が短く、かつ温度試験が終った部
品を室温に放置しても部品が結露しないようにした加熱
装置の提供を目的とする。
(b) Purpose of the Invention This invention involves transporting parts from a storage location to a location with a temperature testing device, performing a temperature test, returning the parts to room temperature after the temperature test, and transporting them to another storage location. In some cases, a heating device that heats parts during transportation so that a temperature test can be performed immediately after the parts arrive at the temperature test equipment has a short heating period, and the parts that have undergone the temperature test are brought to room temperature. To provide a heating device which prevents dew condensation on parts even if left for a long time.

(C)発明の実施例 最初に、この発明による要部構成図を第1図に示す。(C) Examples of the invention First, FIG. 1 shows a main part configuration diagram according to the present invention.

第1図の1は運搬台、2は予熱台、3は駆動機構、4は
部品、12は熱戻し台である。
In FIG. 1, 1 is a transport platform, 2 is a preheating table, 3 is a drive mechanism, 4 is a component, and 12 is a heat return table.

部品4を運搬台1に載せたとき、部品4が不安定になら
ないような形に運搬台1を構成する。部品4にリード線
がついている場合は、このリード線が入るような穴を運
搬台1にあけ、この穴にリード線を挿入すれば、部品4
を安定した形で運搬台1に載せることができる。
The carrier 1 is constructed in such a way that the component 4 does not become unstable when the component 4 is placed on the carrier 1. If the part 4 has a lead wire attached, make a hole in the carrier 1 to accommodate the lead wire, insert the lead wire into this hole, and the part 4
can be placed on the carrier 1 in a stable manner.

第1図では、予熱台2の上部と熱戻し台12の−1一部
を凹形に構成し、予熱台2の凹形と熱戻し台12の凹形
が連続するように配置している。
In FIG. 1, the upper part of the preheating table 2 and the -1 part of the heat return table 12 are configured to have a concave shape, and are arranged so that the concave shape of the preheating table 2 and the concave shape of the heat return table 12 are continuous. .

そして、予熱台2の凹形と熱戻し台■2の凹形に入るよ
うに運搬台2の■側の−・部を凸形にし、運搬台1が予
熱台2の上部と熱戻し台12の上部を移動できるように
している。
Then, the - part on the ■ side of the carrier 2 is made convex so that it fits into the concave shape of the preheating table 2 and the concave shape of the heat return table The top part can be moved.

駆動機構3は運搬台Jが予熱台2の上部と熱戻し台12
の−L部を移動していくようにするためのもので、駆動
機構3からアーム7が運搬台1の前部に伸びている。
The drive mechanism 3 has a transport platform J that connects the upper part of the preheating table 2 and the heat return table 12.
An arm 7 extends from the drive mechanism 3 to the front part of the carrier 1.

第1図から駆動機構3でアーム7を矢印方向に移動する
と、アーム7は運搬台1の’JA ffi<を押しなが
ら移動していくので、運搬台1が予熱台2の上部と熱戻
し台12の−1一部を移動していくようになる。
As shown in Fig. 1, when the arm 7 is moved in the direction of the arrow by the drive mechanism 3, the arm 7 moves while pressing 'JAffi< on the carrier 1, so that the carrier 1 is connected to the upper part of the preheating table 2 and the heat return table. -1 part of 12 will be moved.

予熱台2と熱戻し2台12は運搬金工の移動力向に沿っ
て内部を中空にしており、この中空部分に加熱空気を送
り込むようにする。
The preheating table 2 and the two heat return units 12 are hollow in the interior along the direction of the moving force of the transporting metal work, and heated air is sent into the hollow parts.

通常の温度試験で使用する一度範囲は、0°C〜70°
Cの範囲なので、この温度範囲の加熱空気を予熱台2の
端部から予熱台2の中空部分に送り込むようにする。
The once range used in normal temperature tests is 0°C to 70°
C, the heated air in this temperature range is sent into the hollow part of the preheating table 2 from the end of the preheating table 2.

また、ダクト5の外側とカバー6の内側には、熱戻し台
12の中空部分を通過した乾燥空気を送り込むようにす
る。
Furthermore, dry air that has passed through the hollow part of the heat return table 12 is fed into the outside of the duct 5 and the inside of the cover 6.

次に、この発明による実施例のi[面図を第2図に、側
面図を第3図に示す。
Next, a top view of an embodiment according to the present invention is shown in FIG. 2, and a side view is shown in FIG. 3.

第2図と第3図の5はダクト、6はカバー、8は試験装
置、9と10は汀大II、11は吹出し口である。
In FIGS. 2 and 3, 5 is a duct, 6 is a cover, 8 is a test device, 9 and 10 are pipes II, and 11 is an outlet.

ダクト5は予熱台2の外周を覆うように構成されており
、カバー6はダクト5を覆うように構成されている。
The duct 5 is configured to cover the outer periphery of the preheating table 2, and the cover 6 is configured to cover the duct 5.

第3図のダクト5の長さはLlであり、カバー6の長さ
はLlより長いL2である。
The length of the duct 5 in FIG. 3 is Ll, and the length of the cover 6 is L2, which is longer than Ll.

したがって、第3図の両側部分はダクト5がなく、カバ
ー6だけの部分になっている。
Therefore, there is no duct 5 on both sides of FIG. 3, and there is only a cover 6.

第2図の予熱台2の中空部分に加熱空気を送り込むこ七
は説明済みであるか、同じ加熱空気を予熱台2の外側と
ダクト5の内側との間にも送り込むようにする。すなわ
ち、注入口9は第2図に示)ように予熱台2の中空部分
とダク)・5内に開口している。
The process of sending heated air into the hollow part of the preheating table 2 in FIG. That is, the injection port 9 opens into the hollow part of the preheating table 2 and the duct 5 as shown in FIG.

ダクト5内と予熱台2の中空部分に注入された加熱空気
は、吹出し口11から外気に放出される。
The heated air injected into the duct 5 and the hollow part of the preheating stand 2 is discharged to the outside air from the outlet 11.

この結果、運搬台1で予熱台2のにを移動していく部品
4は、予熱台2からの熱伝導による加熱ときもに、ダク
ト5内の加熱空気で外周を加熱されていく。
As a result, the outer periphery of the component 4 being moved from the preheating table 2 on the transport platform 1 is heated by the heated air in the duct 5 while being heated by heat conduction from the preheating table 2.

また、ダクト5の外側とカバー6の内側との間には、熱
戻し台12の中空部分を通過させた後の乾燥空気を送り
込むようにしている。この乾燥空気の温度は、通常25
℃に保たれる。
Furthermore, dry air that has passed through the hollow portion of the heat return table 12 is fed between the outside of the duct 5 and the inside of the cover 6. The temperature of this dry air is usually 25
kept at ℃.

第3図では、注入口10から乾燥空気を注入し、カバー
8の両端から外気に吹出している。
In FIG. 3, dry air is injected from the inlet 10 and blown out from both ends of the cover 8 to the outside air.

ダクト5とカバー6の間に乾燥した空気を送り込む理由
は、予熱台2、部品4およびダクト5に湿気を含んだ外
気が触れないようにするためである。
The reason why dry air is sent between the duct 5 and the cover 6 is to prevent the preheating stand 2, the parts 4, and the duct 5 from coming into contact with moisture-containing outside air.

例えば、外気温が30℃のときに0℃の温度試験をする
場合は温度差が30°にもなり、第3図の左端から部品
4を入れていくとき、予熱台2、部品4およびダクト5
が外気に触れ、結露が発生し、水滴がつくことがある。
For example, when performing a temperature test at 0°C when the outside temperature is 30°C, the temperature difference will be as much as 30°. 5
When exposed to outside air, condensation may occur and water droplets may form.

また、ダクト5とカバー6の間を一定温度に保っていれ
ば、いつも同じ条件で部品4を試験温度にすることがで
きるようになる。
Furthermore, if the temperature between the duct 5 and the cover 6 is maintained at a constant temperature, the component 4 can always be brought to the test temperature under the same conditions.

また、第3図の試験装置8で温度試験が終った部品4を
すぐ外気温の中に出すと、部品4に結露がてきることが
ある。例えば、試験温度かO′Cで外気l−か30℃の
ときは、温度差のため部品4の表面に水滴がつくように
なり、部品4が劣化する原因になる。
Furthermore, if the component 4 that has been subjected to the temperature test in the testing apparatus 8 of FIG. 3 is immediately exposed to the outside temperature, dew condensation may form on the component 4. For example, when the test temperature is O'C and the outside air is 30C, water droplets will form on the surface of the component 4 due to the temperature difference, causing the component 4 to deteriorate.

第3図では、試験装置8を出た部品4は、ダクト5がな
く、カバー6だけで覆われた熱戻し台12の上部を通過
する。この部分には乾燥空気が送り込まれているので、
試験温度と乾燥空気との間に温度差があっても結露か生
ずることはなく、部品4は乾燥空気の温度まで急速に加
熱されていく。
In FIG. 3, the part 4 leaving the test apparatus 8 passes over the top of the heat return table 12, which is covered only by a cover 6, without the duct 5. Since dry air is pumped into this area,
Even if there is a temperature difference between the test temperature and the dry air, no condensation will occur and the part 4 will be rapidly heated to the temperature of the dry air.

カバー6だけの部分を通過すると、部品4は外気−の中
に取り出されるが、外気温と乾燥空気の温度とは、あま
り差がないので、ここでは部品4に結露かできることは
ない。
When the part 4 passes through only the cover 6, it is taken out into the outside air, but since there is not much difference between the outside temperature and the temperature of the dry air, no dew condensation forms on the part 4 here.

一例として、外気温度と試験温度の差が30℃のとき、
部品温度と試験温度との差が1℃以内に近づくまでの時
間は、従来の空気対流だけの加熱装置では1時間以」二
が必要であったが、この発明による実施例装置によれば
、3分以下で達成することができる。
As an example, when the difference between the outside temperature and the test temperature is 30°C,
In conventional heating devices using only air convection, it took more than 1 hour for the difference between the component temperature and the test temperature to approach within 1°C, but according to the embodiment device of the present invention, It can be accomplished in less than 3 minutes.

第1図と第3図の実施例では、熱戻し台12により、部
品4を加熱状態から室温に戻しているが、予熱台2を延
長し、乾燥空気は第3図の右端からカバー6内に注入す
るようにしてもよい。
In the embodiments shown in FIGS. 1 and 3, the component 4 is returned from the heated state to room temperature using the heat return table 12, but the preheating table 2 is extended and the dry air is introduced into the cover 6 from the right end in FIG. It may also be injected into the

(d)発明の効果 この発明によれば、部品の加熱装置をダクトとカバーの
二重構造で覆っており、ダクト内の部品を接触熱伝導と
周囲温度による強制対流を併用して加熱しているので、
移動距離が短い間に部品を急速に加熱することができる
(d) Effects of the Invention According to this invention, the component heating device is covered with a double structure of a duct and a cover, and the components inside the duct are heated by a combination of contact heat conduction and forced convection due to the ambient temperature. Because there are
Parts can be heated quickly over short travel distances.

また、試験終了後の部品が乾燥した空気内を通過するよ
うにしているので、部品に結露ができるのを防くことが
できる。
Furthermore, since the parts are passed through dry air after the test, it is possible to prevent dew condensation from forming on the parts.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明による要部構成図、 第2図はこの究明による実施例の正面図、第3図はこの
発明による実施例の側面図。 1・・・・・・運搬台、2・・・・・・予熱台、3・・
・・・・駆動機構、4・・・・・・部品、5・・・・・
・ダクト、6・・・・・・カバー、7・・・  f− ・・・アーム、8・・・・・・試験装置、9・・・・・
・注入口、10・・・・・・注入口、11・・・・・・
吹出し口、12・・・・・・熱戻し台。 代理人  弁理士  小 俣 欽 司 第  ]  1 図  2  図 部品         運搬台
FIG. 1 is a block diagram of the main parts according to this invention, FIG. 2 is a front view of an embodiment based on this research, and FIG. 3 is a side view of an embodiment according to this invention. 1...Transportation stand, 2...Preheating stand, 3...
... Drive mechanism, 4 ... Parts, 5 ...
・Duct, 6... Cover, 7... f-... Arm, 8... Test device, 9...
・Inlet, 10... Inlet, 11...
Air outlet, 12...Heat return table. Agent: Patent Attorney Kinji Omata] 1 Figure 2 Parts Transport platform

Claims (1)

【特許請求の範囲】 1 部品(4)を載せる運搬台(1)と、 運搬台(1)を移動できるように構成し、移動方向に沿
って内部を中空にした予熱台(2)と、予熱台(2)上
の運搬台(1)を移動させる駆動機構(3)と、 運搬台(1)の移動方向の寸法がL1で、予熱台(2)
の外周を覆うダクト(5)と、 運搬台(1)の移動方向の寸法がL1より長いL2で、
ダクト(5)の外周を覆うカバー(6)とを備え、 予熱台(2)の中空部分に加熱空気を送り込むとともに
、予熱台(2)の外側とダクト(5)の内側との間に前
記加熱空気を送り込み、 ダクト(5)の外側とカバー(6)の内側との間に乾燥
空気を送り込むようにし、 部品(4)を載せた運搬台(1)を予熱台(2)の上に
載せ、この運搬台(1)を駆動機構(3)で移動させ、
ダクト(5)内からダクト(5)のないカバー(6)の
部分を部品(4)が通過し、前記乾燥空気内を通過して
からカバー(6)の外側に部品(4)を運び出すことを
特徴とする部品の加熱装置。
[Claims] 1. A carrier (1) on which a component (4) is placed; a preheating platform (2) configured to be able to move the carrier (1) and having a hollow interior along the moving direction; A drive mechanism (3) for moving the carrier (1) on the preheating table (2), the dimension of the carrier (1) in the moving direction is L1, and the preheating table (2)
a duct (5) that covers the outer periphery of the transport platform (1);
A cover (6) that covers the outer periphery of the duct (5) is provided to send heated air into the hollow part of the preheating stand (2), and a cover (6) that covers the outer periphery of the duct (5), and a Inject heated air and dry air between the outside of the duct (5) and the inside of the cover (6), and place the carrier (1) carrying the parts (4) on the preheating table (2). the carrier (1) is moved by the drive mechanism (3),
The part (4) passes from inside the duct (5) through the part of the cover (6) where the duct (5) does not exist, and after passing through the dry air, the part (4) is carried out to the outside of the cover (6). A heating device for parts featuring:
JP26878085A 1985-11-29 1985-11-29 Heating device for parts Granted JPS62127677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26878085A JPS62127677A (en) 1985-11-29 1985-11-29 Heating device for parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26878085A JPS62127677A (en) 1985-11-29 1985-11-29 Heating device for parts

Publications (2)

Publication Number Publication Date
JPS62127677A true JPS62127677A (en) 1987-06-09
JPH0335630B2 JPH0335630B2 (en) 1991-05-28

Family

ID=17463182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26878085A Granted JPS62127677A (en) 1985-11-29 1985-11-29 Heating device for parts

Country Status (1)

Country Link
JP (1) JPS62127677A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008142754A1 (en) * 2007-05-18 2008-11-27 Advantest Corporation Electronic component testing device and electronic component testing method
JP2013152094A (en) * 2012-01-24 2013-08-08 Shibuya Kogyo Co Ltd Article inspection device and article classification apparatus including the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008142754A1 (en) * 2007-05-18 2008-11-27 Advantest Corporation Electronic component testing device and electronic component testing method
JPWO2008142754A1 (en) * 2007-05-18 2010-08-05 株式会社アドバンテスト Electronic component testing apparatus and electronic component testing method
JP2013152094A (en) * 2012-01-24 2013-08-08 Shibuya Kogyo Co Ltd Article inspection device and article classification apparatus including the same

Also Published As

Publication number Publication date
JPH0335630B2 (en) 1991-05-28

Similar Documents

Publication Publication Date Title
KR101183713B1 (en) Capsule formation
JPS5984846U (en) Handling equipment for IC devices
JPH04132388U (en) vacuum dryer
MC193A1 (en) Method and apparatus for cleaning solvents, in particular for the dry cleaning industry.
JPS62127677A (en) Heating device for parts
KR940003238B1 (en) Reflowing soldering device
KR920702179A (en) Heat treatment apparatus and drying method of functional thin film using the same
DE59909468D1 (en) Component for thermal insulation
JP2018530746A (en) Apparatus for removing test contacts in a test contact configuration
JPS5844974B2 (en) Material testing equipment for breaking, etc.
SE8300968D0 (en) IMPROVED LOAD HANDLING APPARATUS
TR23995A (en) MANUFACTURING PROCEDURE AND TASTE OF THIS PROCEDURE DEVICE
FR2402629A1 (en) PROCESS AND APPARATUS FOR DRYING CERAMIC ARTICLES
JPS62204173A (en) Aging device
JP3388565B2 (en) IC test equipment
CN212492972U (en) Vacuum sample storage and heating device
JPH0429589Y2 (en)
SE0003297D0 (en) Methods and apparatus for pressing hardening
KR101633962B1 (en) Sample holder device having fuction of controlling temperature, sample thermal annealing and surface analyzing apparatus using the same
SU1000702A1 (en) Dryer
JPH021561U (en)
JPS6110207Y2 (en)
JPH06341762A (en) Heat treatment oven
JP2956217B2 (en) Wire bonding heating apparatus and wire bonding heating method
JPS6362785U (en)