JPH0429589Y2 - - Google Patents
Info
- Publication number
- JPH0429589Y2 JPH0429589Y2 JP1987077134U JP7713487U JPH0429589Y2 JP H0429589 Y2 JPH0429589 Y2 JP H0429589Y2 JP 1987077134 U JP1987077134 U JP 1987077134U JP 7713487 U JP7713487 U JP 7713487U JP H0429589 Y2 JPH0429589 Y2 JP H0429589Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- water absorption
- hot air
- lower surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 238000010521 absorption reaction Methods 0.000 claims description 22
- 238000007664 blowing Methods 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 3
- 229920001410 Microfiber Polymers 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000005156 Dehydration Diseases 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Drying Of Solid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、プリント基板乾燥装置に関するもの
である。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed circuit board drying device.
プリント基板製造工程においては、エツチング
や現像等の化学処理を行つたプリント基板を水洗
する関係上、これの乾燥が必要とされ、一般に熱
風による乾燥が実施されていた。
In the printed circuit board manufacturing process, drying of the printed circuit board that has been subjected to chemical treatments such as etching and development is required because it is washed with water, and drying is generally performed using hot air.
ところが、十分な乾燥を行なう為には100℃〜
150℃というような高温熱風を使用しなければな
らないと共に、このような高温雰囲気中に比較的
長時間晒さなければならなく、その為、プリント
基板に歪が発生し、そり曲つてしまうという欠点
があつた。
However, in order to perform sufficient drying, the temperature must be 100℃~
It is necessary to use hot air at a temperature of 150℃ and to expose it to such a high temperature atmosphere for a relatively long time, which has the disadvantage of causing distortion and warping of the printed circuit board. It was hot.
なお、係るそり曲りは、プリント基板を構成し
ている、紙基材フエノール樹脂若しくはガラス基
材エポキシ樹脂等の非金属体と、金属体（銅箔）
との熱膨脹差に基づいて発生するから、熱風温度
を出来る限り低温にするのが好ましいが、これで
は十分な乾燥が困難、特に、プリント基板のスル
ホール中の水分を除去するのが困難であつた。 It should be noted that such warping occurs between a non-metallic body such as a paper-based phenolic resin or a glass-based epoxy resin, which constitutes a printed circuit board, and a metal body (copper foil).
It is preferable to keep the hot air temperature as low as possible, but this makes it difficult to achieve sufficient drying, and in particular, it is difficult to remove moisture from the through-holes of printed circuit boards. .
本考案は。このようなことに着目し、これを解
決すべく各方面から鋭意検討の結果、吸水ローラ
によるプリント基板の上下両面側からの脱水に続
いて、前記上下両面側からの冷風乾燥を行い、更
に続いて、前記上下両面側からの熱風乾燥を行う
ようにすれば、プリント基板のそり曲りを発生さ
せずに十分な乾燥を行うことができることを見出
したのである。 This idea is. Focusing on this, and as a result of intensive studies from various angles to solve this problem, we dehydrated the printed circuit board from both the top and bottom sides using a water absorption roller, followed by cold air drying from the top and bottom sides, and then The inventors have discovered that by performing hot air drying from both the upper and lower surfaces, sufficient drying can be achieved without causing warpage of the printed circuit board.
すなわち、本考案に係るプリント基板乾燥装置
は、水洗されたプリント基板を一方々向へ搬送す
るローラコンベアの一地点に、搬送される前記プ
リント基板の上下面夫々に接触し得るように、真
空ポンプに接続された吸水ローラの一対を配設す
ると共に、前記吸水ローラよりも搬送方向下流一
地点に、搬送される前記プリント基板の上下面
夫々に向つて吹付けし得るように冷風吹出しノズ
ルの一対を配設し、更に、前記吸水ローラと前記
熱風吹出しノズル間に、搬送される前記プリント
基板の上下面夫々に向つて吹付けし得るように冷
風吹出しノズルの一対を配設したことを特徴とす
るものである。
That is, in the printed circuit board drying apparatus according to the present invention, a vacuum pump is installed at one point of the roller conveyor that transports the washed printed circuit board in one direction so that it can contact the upper and lower surfaces of the printed circuit board being transported. A pair of water absorption rollers connected to the water absorption roller are disposed, and a pair of cold air blowing nozzles are provided at a point downstream of the water absorption roller in the conveyance direction so as to spray the cool air toward the upper and lower surfaces of the printed circuit board being conveyed, respectively. furthermore, a pair of cold air blowing nozzles are arranged between the water absorption roller and the hot air blowing nozzle so as to spray the air onto the upper and lower surfaces of the printed circuit board being conveyed, respectively. It is something to do.
以下、実施例について図面に基いて述べると、
第１図において、１はローラコンベア、２ａ，２
ｂはローラ、３ａ，３ｂは冷風吹出しノズル、４
ａ，４ｂは熱風吹出しノズルを夫々示し、ローラ
コンベア１は、右回りに回転駆動され得るように
装着されている下方のローラ１ａ群と、この駆動
ローラ１ａに圧接されて従動され得るように装着
されている上方のローラ１ｂ群とで構成されてい
る。
Below, examples will be described based on the drawings.
In Fig. 1, 1 is a roller conveyor, 2a, 2
b is a roller, 3a, 3b are cold air blowing nozzles, 4
4b and 4b respectively indicate hot air blowing nozzles, and the roller conveyor 1 is equipped with a lower group of rollers 1a that are mounted so that they can be driven to rotate clockwise, and a group of lower rollers 1a that are mounted so that they can be pressed against and driven by this driving roller 1a. and the upper roller group 1b.
また、吸水ローラ２ａは、右回りに回転駆動さ
れ得るように装着されていると共に吸水ローラ２
ｂは吸水ローラ２ａに圧接されて従動され得るよ
うに装着されている。 Further, the water absorption roller 2a is mounted so that it can be rotated clockwise, and the water absorption roller 2a is
b is mounted so that it can be pressed against and driven by the water absorption roller 2a.
なお、両吸水ローラ２ａ，２ｂは、第２図にお
いて示されているように、その一端が閉塞され、
かつ中空部に多数の孔５を貫通させた軸本体６
と、孔５が貫通されている中空部上に装着された
極細繊維及び高分子弾性体でなる吸水層７とで構
成され、軸本体６の開口端と真空ポンプ８とは配
管９等を介して接続されている。 In addition, both water absorption rollers 2a and 2b are closed at one end, as shown in FIG.
and a shaft body 6 having a plurality of holes 5 passing through the hollow part.
and a water-absorbing layer 7 made of ultrafine fibers and polymeric elastic material mounted on the hollow part through which the hole 5 is penetrated, and the open end of the shaft body 6 and the vacuum pump 8 are connected via piping 9 etc. connected.
冷風吹出しノズル３ａ，３ｂも、ダクト１０を
介してブロワ１１と接続され、また、熱風吹出し
ノズル４ａ，４ｂも、ダクト１２を介してヒータ
１３と接続され、更に、ヒータ１３は、ダクト１
４を介してブロワ１５に接続されている。 The cold air blowing nozzles 3a, 3b are also connected to the blower 11 via the duct 10, and the hot air blowing nozzles 4a, 4b are also connected to the heater 13 via the duct 12.
It is connected to the blower 15 via 4.
次に、本装置による乾燥態様について述べる
と、図示されていない駆動装置が起動されてロー
ラコンベア１のローラ１ａ群及び吸水ローラ２ａ
が駆動されると共に真空ポンプ８、ブロワ１１，
１５が起動され、ノズル３ａ，３ｂから常温の冷
風が吹き出され、かつノズル４ａ，４ｂから30〜
50℃の熱風が吹き出される。 Next, to describe the drying mode by this device, a drive device (not shown) is started to dry the rollers 1a group of the roller conveyor 1 and the water absorption roller 2a.
are driven, and the vacuum pump 8, blower 11,
15 is activated, cold air at room temperature is blown out from the nozzles 3a and 3b, and 30~ is blown out from the nozzles 4a and 4b.
Hot air of 50℃ is blown out.
また、これと並行して前工程から送られて来
る、水洗されたプリント基板１６が左側から右側
へ向つて搬送される。 Further, in parallel with this, the washed printed circuit board 16 sent from the previous process is transported from the left side to the right side.
而して、プリント基板１６が一対の吸水ローラ
２ａ，２ｂでニツプされながら脱水され、プリン
ト基板１６の上下面に付着している水分の大部分
が除去される。なお、その際、吸水ローラ２ａ，
２ｂの毛細管現象による吸水と、陰圧による吸水
とにより水分が除去される。 Thus, the printed circuit board 16 is dehydrated while being nipped by the pair of water absorption rollers 2a and 2b, and most of the moisture adhering to the upper and lower surfaces of the printed circuit board 16 is removed. In addition, at that time, the water absorption roller 2a,
Moisture is removed by water absorption due to capillary phenomenon 2b and water absorption due to negative pressure.
続いて、一対のノズル３ａ，３ｂから吹き出さ
れる常温の冷風により、プリント基板１６の上下
面の残存水分が除去されるが、この場合において
は、加圧されている冷風によつてプリント基板１
６のスルホール中の水分が吹き飛ばされる。 Subsequently, residual moisture on the upper and lower surfaces of the printed circuit board 16 is removed by cold air at room temperature blown out from the pair of nozzles 3a and 3b. In this case, the pressurized cold air removes the remaining moisture from the printed circuit board 1
The moisture in the through holes in No. 6 is blown away.
このように、本装置においては、最初に、吸水
ローラ２ａ，２ｂにより、プリント基板１６の上
下面から粗脱水し、そして、これでは除去し得な
かつた残存水分、特に、スルホール中の水分を、
プリント基板１６の上下両面側から加圧冷風で吹
き飛ばして除去することができ、従つて、プリン
ト基板１６を加熱しないでほぼ完全に脱水するこ
とができる。 In this way, in this apparatus, first, the water absorption rollers 2a and 2b roughly dehydrate the upper and lower surfaces of the printed circuit board 16, and then the residual moisture that could not be removed by this method, especially the moisture in the through holes, is removed.
It can be removed by blowing away with pressurized cold air from both the upper and lower sides of the printed circuit board 16, and therefore, the printed circuit board 16 can be almost completely dehydrated without being heated.
なお、このように脱水処理しても、プリント基
板１６は、これに浸透されている水分により湿り
気を有しているが、続いて、一対のノズル４ａ，
４ｂから吹き出される30〜50℃という低温熱風に
より、プリント基板１６の上下面の前記湿り気を
瞬時的に除去、すなわち、加熱雰囲気中に長時間
晒さなくとも除去することができる。 Although the printed circuit board 16 remains moist due to the moisture that has permeated into it even after the dehydration treatment, the printed circuit board 16 is subsequently exposed to the pair of nozzles 4a,
The moisture on the upper and lower surfaces of the printed circuit board 16 can be instantly removed by the low-temperature hot air of 30 to 50 DEG C. blown from the printed circuit board 4b, that is, the moisture can be removed without exposing the printed circuit board 16 to a heated atmosphere for a long time.
その為、加熱によりプリント基板がそり曲つて
しまうといつた問題を完全に解消することができ
ると共に十分、かつ迅速に乾燥することができ
る。 Therefore, it is possible to completely eliminate the problem of warping of the printed circuit board due to heating, and it is also possible to dry the printed circuit board sufficiently and quickly.
以上、一実施例について述べたが、本考案にお
いては、吸水ローラは、上述した極細繊維及び高
分子弾性体でなる吸水層を装着したものに限定さ
れず、他の適当な材で吸水層を構成したものであ
つてもよいと共にその軸本体の構造についても、
いかなる構造ものであつてもよい。 Although one embodiment has been described above, in the present invention, the water absorption roller is not limited to the one equipped with the water absorption layer made of the above-mentioned ultrafine fibers and polymeric elastic material, but the water absorption layer is made of other suitable materials. As for the structure of the shaft body,
It may have any structure.
上述したように、本考案によると、水洗された
プリント基板を乾燥させる乾燥装置に関し、プリ
ント基板のそり曲りを防止しながら、スルホール
中の水分は勿論のこと、基板表面に付着されてい
る水分及び基板に浸透されている水分も十分に、
かつ迅速に除去し得る乾燥装置を得ることができ
る。
As described above, the present invention relates to a drying device for drying a printed circuit board that has been washed with water, while preventing the printed circuit board from warping and removing not only moisture in the through holes but also moisture attached to the surface of the substrate. Sufficient moisture has penetrated into the substrate.
Moreover, a drying device that can be quickly removed can be obtained.
第１図はプリント基板乾燥装置の概略構成を示
す図、第２図は吸水ローラの縦断面図である。
１……ローラコンベア、２ａ，２ｂ……吸水ロ
ーラ、３ａ，３ｂ……冷風吹出しノズル、４ａ，
４ｂ……熱風吹出しノズル、８……真空ポンプ、
１６……乾燥しようとするプリント基板。
FIG. 1 is a diagram showing a schematic configuration of a printed circuit board drying device, and FIG. 2 is a longitudinal sectional view of a water absorption roller. 1...Roller conveyor, 2a, 2b...Water absorption roller, 3a, 3b...Cold air blowing nozzle, 4a,
4b...Hot air blowing nozzle, 8...Vacuum pump,
16...Printed circuit board about to dry.
Claims (1)
ローラコンベアの一地点に、搬送される前記プリ
ント基板の上下面夫々に接触し得るように、真空
ポンプに接続された吸水ローラの一対を配設する
と共に、前記吸水ローラよりも搬送方向下流一地
点に、搬送される前記プリント基板の上下面夫々
に向つて吹付けし得るように熱風吹出しノズルの
一対を配設し、更に、前記吸水ローラと前記熱風
吹出しノズル間に、搬送される前記プリント基板
の上下面夫々に向つて吹付けし得るように冷風吹
出しノズルの一対を配設したことを特徴とするプ
リント基板乾燥装置。 A pair of water absorption rollers connected to a vacuum pump are disposed at one point on a roller conveyor that conveys the washed printed circuit board in one direction so as to be able to contact the upper and lower surfaces of the conveyed printed circuit board, respectively. At the same time, a pair of hot air blowing nozzles is disposed at a point downstream of the water absorption roller in the conveyance direction so as to spray the hot air toward the upper and lower surfaces of the printed circuit board being conveyed, and A printed circuit board drying apparatus characterized in that a pair of cold air blowing nozzles is disposed between the hot air blowing nozzles so as to blow air toward the upper and lower surfaces of the printed circuit board being transported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987077134U JPH0429589Y2 (en) | 1987-05-21 | 1987-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987077134U JPH0429589Y2 (en) | 1987-05-21 | 1987-05-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63185272U JPS63185272U (en) | 1988-11-29 |
| JPH0429589Y2 true JPH0429589Y2 (en) | 1992-07-17 |
Family
ID=30924856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987077134U Expired JPH0429589Y2 (en) | 1987-05-21 | 1987-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429589Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4961610B2 (en) * | 2008-03-06 | 2012-06-27 | 株式会社前川製作所 | Food drying method and apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5125764A (en) * | 1974-08-27 | 1976-03-02 | Fujitsu Ltd | Purintobanno datsusuikansohoho |
| JPS617063B2 (en) * | 1978-08-30 | 1986-03-04 | Hitachi Ltd |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS617063U (en) * | 1984-06-18 | 1986-01-16 | 日本電気株式会社 | Water droplet removal device in plate holes |
-
1987
- 1987-05-21 JP JP1987077134U patent/JPH0429589Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5125764A (en) * | 1974-08-27 | 1976-03-02 | Fujitsu Ltd | Purintobanno datsusuikansohoho |
| JPS617063B2 (en) * | 1978-08-30 | 1986-03-04 | Hitachi Ltd |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63185272U (en) | 1988-11-29 |
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