TWI769664B - Testing apparatus and testing equipment using the same - Google Patents

Testing apparatus and testing equipment using the same Download PDF

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TWI769664B
TWI769664B TW110101611A TW110101611A TWI769664B TW I769664 B TWI769664 B TW I769664B TW 110101611 A TW110101611 A TW 110101611A TW 110101611 A TW110101611 A TW 110101611A TW I769664 B TWI769664 B TW I769664B
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electronic components
testing
test
conveyor
pick
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TW110101611A
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TW202229887A (en
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張原龍
曾智達
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鴻勁精密股份有限公司
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Abstract

The present invention reveals a testing apparatus, including a testing mechanism, a transporting mechanism, and a pressing mechanism. The testing mechanism has a socket for testing an electronic component being placed therein. The transporting mechanism has a transporter for transporting the electronic component. The pressing mechanism has a presser which is capable of moving along a second axis. The presser is aiming toward the socket. The transporter is adapted for carrying and moving the electronic component to a position between the presser and the socket. The presser then picks the electronic component and presses the electronic component on the socket after the transporter leaves. With the electronic component portaging of the transporter, the presser is then constructed within single axis motion. Location and alignment of the electronic component can precisely performed.

Description

測試裝置及其應用之測試設備Test equipment and test equipment for its application

本發明提供一種提高壓移器將電子元件移入測試器之入料精準性的測試裝置。The invention provides a testing device for improving the feeding accuracy of the pressure shifter for moving electronic components into the tester.

在現今,電子元件日趨微小精密,若電子元件之接點與測試裝置之探針具有接觸誤差,將會影響測試品質;目前測試裝置於機台設置測試座,以供承置及測試電子元件,一載台將待測電子元件輸送至測試座之側方,一壓移機構之第一驅動器驅動壓移器作X軸向位移至載台上方,並以第二驅動器驅動壓移器作Z軸向位移於載台取出待測電子元件,第一驅動器再驅動壓移器作X軸向反向位移,將待測電子元件移載至測試座之上方,第二驅動器再驅動壓移器作Z軸向位移將待測電子元件移入測試座執行測試作業;惟,壓移機構利用第一驅動器及第二驅動器帶動壓移器作二個軸向位移,壓移器易因第一驅動器與第二驅動器之連接組裝誤差,而影響將電子元件移入測試座之入料精準性 ;因此,如何提高壓移器之入料精準性相當重要。 Nowadays, electronic components are becoming more and more tiny and precise. If there is a contact error between the contacts of the electronic components and the probes of the test device, the test quality will be affected. At present, the test device is equipped with a test seat on the machine table for holding and testing electronic components. A carrier transports the electronic components to be tested to the side of the test seat, a first driver of a pressing and moving mechanism drives the displacement device to move the X-axis to the top of the platform, and the second driver drives the displacement device to be the Z-axis Take out the electronic component to be tested on the moving stage, the first driver then drives the pressure shifter to move in the reverse direction of the X axis, and transfers the electronic component to be tested to the top of the test seat, and the second driver drives the pressure shifter to do Z The axial displacement moves the electronic component to be tested into the test seat to perform the test operation; however, the pressure-shift mechanism uses the first driver and the second driver to drive the pressure-shifter to perform two axial displacements. The connection and assembly error of the driver affects the feeding accuracy of moving the electronic components into the test seat ; Therefore, how to improve the feeding accuracy of the pressure shifter is very important.

本發明之目的一,提供一種測試裝置,包含測試機構、輸送機構及壓移機構,測試機構於作業區設有測試器,以供測試電子元件,輸送機構設有輸送器,以供輸送電子元件,壓移機構於作業區設有作第二軸向位移之壓移器,壓移器相對於測試器,利用輸送器輸送電子元件至壓移器與測試器之間,壓移器於作業區作單一之第二軸向位移於輸送器取出待測電子元件,並於輸送器離開後,壓移器作第二軸向位移將待測電子元件準確移入測試座執行測試作業,藉以壓移器於作業區作單一軸向位移,以縮減其他軸向作動時序及移載誤差,進而提高壓移器之入料精準性及測試品質。The first objective of the present invention is to provide a testing device, which includes a testing mechanism, a conveying mechanism and a pressing and moving mechanism. The testing mechanism is provided with a tester in the work area for testing electronic components, and the conveying mechanism is provided with a conveyor for conveying electronic components. , The pressure-shift mechanism is provided with a pressure-shifter for the second axial displacement in the working area. The pressure-shifter is opposite to the tester. The conveyor is used to transport electronic components between the pressure-shifter and the tester. The pressure-shifter is located in the working area. Perform a single second axial displacement on the conveyor to take out the electronic components to be tested, and after the conveyor leaves, the pressure shifter makes a second axial displacement to accurately move the electronic components to be tested into the test seat to perform the test operation, thereby pressing the shifter A single axial displacement is performed in the working area to reduce the timing and transfer errors of other axial movements, thereby improving the feeding accuracy and test quality of the pressure shifter.

本發明之目的二,提供一種測試裝置,更包含取像機構,取像機構設有至少一取像器,取像器位移至壓移器與測試器之間,以取像測試器及壓移器所移載之電子元件,並將取像資料傳輸至處理器,以供壓移器微調電子元件之位置,使電子元件之接點更加精準對位測試座之探針,進而提高電子元件測試品質。The second objective of the present invention is to provide a testing device, further comprising an image capturing mechanism, the image capturing mechanism is provided with at least one imager, and the imager is displaced between the pressure shifter and the tester to capture the image of the tester and the pressure shifter. The electronic components transferred by the device are transferred, and the image data is transmitted to the processor, so that the position of the electronic components can be fine-tuned by the pressure shifter, so that the contacts of the electronic components can be more accurately aligned with the probes of the test seat, thereby improving the testing of electronic components. quality.

本發明之目的三,提供一種測試裝置,更包含第一拾取機構,第一拾取機構設有第一拾取具,以於第一換料區對輸送器取放待測電子元件及已測電子元件,進而提高取放料作業效能。The third object of the present invention is to provide a testing device, further comprising a first pick-up mechanism, the first pick-up mechanism is provided with a first pick-up tool for picking and placing the electronic components to be tested and the electronic components that have been tested on the conveyor in the first refueling area , thereby improving the efficiency of picking and unloading operations.

本發明之目的四,提供一種測試裝置,更包含第一拾取機構、第二拾取機構,以及具有第一輸送器及第二輸送器之輸送機構,輸送機構之第一輸送器沿第一軸向位移至第一換料區或作業區,以供第一拾取機構或壓移器取放待測電子元件及已測電子元件,輸送機構之第二輸送器沿第一軸向位移至第二換料區或作業區,以供第二拾取機構或壓移器取放待測電子元件及已測電子元件,藉以第一拾取機構及第二拾取機構搭配輸送機構之第一輸送器、第二輸送器,進而提高測試產能。The fourth object of the present invention is to provide a testing device further comprising a first pick-up mechanism, a second pick-up mechanism, and a conveying mechanism having a first conveyor and a second conveyor, the first conveyor of the conveying mechanism is along the first axial direction It is moved to the first material changing area or working area for the first pick-up mechanism or pressure shifter to pick and place the electronic components to be tested and the electronic components that have been tested. The second conveyor of the conveying mechanism is displaced along the first axis to the second changing The material area or working area is used for the second pick-up mechanism or pressure shifter to pick and place the electronic components to be tested and the tested electronic components, so that the first pick-up mechanism and the second pick-up mechanism are matched with the first conveyor and the second conveyor of the conveying mechanism. to improve test throughput.

本發明之目的五,提供一種測試裝置,更包含溫控機構,溫控機構於壓移機構之機架內部設有一測試空間,並於測試空間輸入乾燥空氣,以防止結露,溫控機構另於壓移機構或測試機構設有溫控件,使電子元件於模擬日後使用環境溫度下執行測試作業,進而提高測試品質。The fifth object of the present invention is to provide a test device, further comprising a temperature control mechanism. The temperature control mechanism is provided with a test space inside the frame of the pressure-shift mechanism, and dry air is input into the test space to prevent dew condensation. The pressure-moving mechanism or the testing mechanism is provided with a temperature control, so that the electronic components can perform the test operation under the simulated environment temperature in the future, thereby improving the test quality.

本發明之目的六,提供一種測試設備,包含機台、供料裝置、收料裝置、本發明測試裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料容置器,以供容置至少一待測電子元件;收料裝置配置於機台,並設有至少一收料容置器,以供容置至少一已測電子元件;本發明測試裝置配置於機台,並設有測試機構、輸送機構及壓移機構,以供輸送及測試電子元件;中央控制裝置以控制及整合各裝置作動而執行自動化作業。The sixth object of the present invention is to provide a testing equipment, including a machine, a feeding device, a receiving device, the testing device of the present invention and a central control device, the feeding device is arranged on the machine, and is provided with at least one feeding container , for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine, and there is at least one receiving container for accommodating at least one electronic component that has been tested; the testing device of the present invention is arranged on the machine , and has a testing mechanism, a conveying mechanism and a pressing and moving mechanism for conveying and testing electronic components; the central control device controls and integrates the actions of each device to perform automated operations.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:

請參閱圖1、2、3,本發明測試設備包含機台10、供料裝置20、收料裝置30、本發明第一實施例之測試裝置40及中央控制裝置(圖未示出)。1, 2, and 3, the testing equipment of the present invention includes a machine 10, a feeding device 20, a receiving device 30, a testing device 40 according to the first embodiment of the present invention, and a central control device (not shown).

供料裝置20配置於機台10,並設有至少一供料容置器21,以供容置至少一待測電子元件,於本實施例,供料裝置20由機台10之前段部朝向後段部輸送具複數個待測電子元件之供料容置器21;收料裝置30配置於機台10,並設有至少一收料容置器31,以供容置至少一已測電子元件,於本實施例,收料裝置30由機台10之後段部朝向前段部輸送具複數個已測電子元件之收料容置器31;中央控制裝置以控制及整合各裝置作動而執行自動化作業。The feeding device 20 is disposed on the machine 10 and is provided with at least one feeding container 21 for accommodating at least one electronic component to be tested. In this embodiment, the feeding device 20 faces from the front section of the machine 10 The rear section conveys a plurality of feeding containers 21 for the electronic components to be tested; the receiving device 30 is arranged on the machine table 10 and is provided with at least one feeding container 31 for accommodating at least one electronic component to be tested , in this embodiment, the receiving device 30 conveys the receiving container 31 with a plurality of tested electronic components from the rear section of the machine 10 to the front section; the central control device controls and integrates the actions of each device to perform automated operations .

本發明第一實施例之測試裝置40配置於機台10,包含測試機構、輸送機構及壓移機構,以供輸送及測試電子元件。The testing device 40 according to the first embodiment of the present invention is disposed on the machine 10 and includes a testing mechanism, a conveying mechanism and a pressing and moving mechanism for conveying and testing electronic components.

測試機構於作業區A設有至少一測試器,以供測試電子元件;測試器具有電性連接之電路板411及測試座412,電路板411本身可具有測試程式,或者電性連接一測試機;於本實施例,電路板411電性連接一測試機413,測試座412具有複數支探針,並供承置及測試電子元件。The testing institution is provided with at least one tester in the work area A for testing electronic components; the tester has a circuit board 411 and a test seat 412 that are electrically connected, and the circuit board 411 itself may have a test program, or be electrically connected to a tester ; In this embodiment, the circuit board 411 is electrically connected to a tester 413, and the test seat 412 has a plurality of probes, and is used to hold and test electronic components.

輸送機構設有至少一輸送器,輸送器位移於第一換料區B1及作業區A,以供輸送電子元件;更進一步,輸送器可為轉盤或載台,而作旋轉運動或直線運動以輸送電子元件,輸送器可設有至少一定位部件,供定位電子元件,定位部件可為承槽、抽氣孔或夾具等,不受限於本實施例;例如輸送器可為轉盤,轉盤開設複數個承槽供承置電子元件,轉盤作旋轉運動,將待測電子元件由第一換料區B1輸送至作業區A,以及將已測電子元件由作業區A輸送至第一換料區B1;於本實施例,輸送機構以輸送驅動源421驅動一為第一載台422之輸送器作第一軸向X線性位移,第一載台422設有複數個承槽供承置電子元件 ,並將待測電子元件由第一換料區B1輸送至作業區A,且位於測試座412之上方,以及將已測電子元件由作業區A輸送至第一換料區B1。 The conveying mechanism is provided with at least one conveyor, and the conveyor is displaced in the first refueling area B1 and the working area A for conveying electronic components; further, the conveyor can be a turntable or a stage, and performs a rotary motion or a linear motion to For conveying electronic components, the conveyor can be provided with at least one positioning component for positioning the electronic components, and the positioning component can be a groove, a suction hole or a clamp, etc., which is not limited to this embodiment; for example, the conveyor can be a turntable, and the turntable has a plurality of Each slot is used to hold electronic components, and the turntable rotates to transport the electronic components to be tested from the first changing area B1 to the working area A, and the electronic components that have been tested are transported from the working area A to the first changing area B1 ; In this embodiment, the conveying mechanism drives a conveyer for the first carrier 422 to make the first axial X-linear displacement with the delivery drive source 421, and the first carrier 422 is provided with a plurality of grooves for supporting electronic components , and transport the electronic components to be tested from the first refueling area B1 to the working area A, which is located above the test seat 412 , and transport the electronic components under test from the working area A to the first changing area B1 .

壓移機構於作業區A設有至少一壓移器,壓移器相對於測試器,壓移器作第二軸向Z位移,以於輸送器取放電子元件,並於測試器取放及壓接電子元件;於本實施例,壓移機構於機台10設置機架431,機架431裝配壓移驅動源,壓移驅動源可為線性馬達、壓缸或包含馬達及傳動組;於本實施例,壓移驅動源於機架431設置馬達432,馬達432驅動一為皮帶輪組433之傳動組,皮帶輪組433傳動另一為螺桿螺座組之傳動組,螺桿螺座組呈第二軸向Z配置,並以螺桿434帶動一承載件435作第二軸向Z位移,承載件435於相對測試座412之位置設有微調器436,微調器436裝配壓移器437,並依取像資料,而可微調壓移器437之位置,壓移器437供壓接及取放電子元件。The pressure-shift mechanism is provided with at least one pressure-shifter in the operation area A. The pressure-shifter is relative to the tester, and the pressure-shifter performs a second axial Z displacement, so as to pick and place the electronic components on the conveyor, and pick and place the tester and the tester. crimping electronic components; in this embodiment, a frame 431 is set on the machine table 10 for the pressing mechanism, and the frame 431 is equipped with a pressing driving source. The pressing driving source can be a linear motor, a pressing cylinder, or a motor and a transmission group; in In this embodiment, the driving of the pressure movement comes from the motor 432 provided in the frame 431. The motor 432 drives one of the transmission groups of the pulley group 433, and the belt pulley group 433 drives the other transmission group of the screw screw seat group. The screw screw seat group is the second Axial Z is arranged, and a bearing member 435 is driven by a screw 434 to make a second axial Z displacement. The bearing member 435 is provided with a fine-tuning device 436 at a position relative to the test seat 412. Like data, the position of the pressure shifter 437 can be fine-tuned, and the pressure shifter 437 is used for crimping and picking and placing electronic components.

測試裝置更包含取像機構,取像機構設有至少一取像器,取像器以供取像測試器及電子元件;更進一步,取像器連接一處理器,將取像資料傳輸至處理器,處理器判別電子元件之接點與測試座412之探針是否對位,更佳者 ,取像機構可供判別壓移器437是否具有電子元件或測試座412是否殘留電子元件等;於本實施例,取像機構以取像驅動源441驅動取像器442作第一軸向X、第二軸向Z及第三軸向Y位移,以於作業區A取像測試座412及壓移器437所移載之電子元件,而供壓移器437微調電子元件之位置,使電子元件之接點更加精準對位測試座412之探針。 The testing device further includes an image capturing mechanism, the image capturing mechanism is provided with at least one image capturing device, and the image capturing device is used for capturing the image testing device and electronic components; further, the image capturing device is connected to a processor to transmit the image capturing data to the processing unit. The processor determines whether the contacts of the electronic components and the probes of the test seat 412 are aligned or not, which is better , the imaging mechanism can be used to determine whether the pressure shifter 437 has electronic components or whether the test seat 412 has residual electronic components; , the second axis Z and the third axis Y are displaced to capture the electronic components transferred by the test seat 412 and the pressure shifter 437 in the working area A, and for the pressure shifter 437 to fine-tune the position of the electronic components, so that the electronic components The contacts of the components are more precisely aligned with the probes of the test seat 412 .

測試裝置更包含第一拾取機構,第一拾取機構設有第一拾取具,以供於第一換料區B1對輸送器取放電子元件;於本實施例,第一拾取機構以第一驅動源451驅動第一拾取具452作第一軸向X、第二軸向Z及第三軸向Y位移,第一拾取具452於供料裝置20、收料裝置30及第一換料區B1之第一載台422移載待測電子元件或已測電子元件。The testing device further includes a first pick-up mechanism, and the first pick-up mechanism is provided with a first pick-up tool for picking and placing electronic components on the conveyor in the first material changing area B1; in this embodiment, the first pick-up mechanism is driven by the first The source 451 drives the first pickup 452 to move in the first axis X, the second axis Z and the third axis Y, and the first pickup 452 is located in the feeding device 20, the receiving device 30 and the first changing area B1 The first stage 422 transfers the electronic components to be tested or the electronic components that have been tested.

測試裝置更包含溫控機構,溫控機構於壓移機構之機架431內部設有一測試空間461,並於壓移機構或測試機構設有溫控件,以供溫控電子元件 ,使電子元件於模擬日後使用環境溫度下執行測試作業,進而提高測試品質;更進一步,溫控機構於測試空間461輸入乾燥空氣,以防止結露;於本實施例,溫控機構於測試空間461連接一流體輸送管462,流體輸送管462輸送乾燥空氣至測試空間461,以降低測試空間461之露點而防止結露,溫控機構另於壓移機構之承載件435裝配溫控件463,溫控件463可為加熱件、致冷晶片或具流體之座體,於本實施例,溫控件463為致冷晶片,以供對電子元件執行冷測作業。 The test device further includes a temperature control mechanism. The temperature control mechanism is provided with a test space 461 inside the frame 431 of the pressure-shift mechanism, and a temperature control mechanism is provided in the pressure-shift mechanism or the test mechanism for temperature-controlled electronic components. , so that the electronic components perform the test operation under the simulated environment temperature in the future, thereby improving the test quality; further, the temperature control mechanism inputs dry air in the test space 461 to prevent condensation; in this embodiment, the temperature control mechanism is in the test space 461 A fluid delivery pipe 462 is connected, and the fluid delivery pipe 462 delivers dry air to the test space 461 to reduce the dew point of the test space 461 and prevent condensation. The element 463 can be a heating element, a cooling chip or a base with fluid. In this embodiment, the temperature control 463 is a cooling chip, which is used to perform cold testing operations on electronic components.

請參閱圖1、4,第一拾取機構以第一驅動源451驅動第一拾取具452作第一軸向X、第二軸向Z及第三軸向Y位移,於供料裝置20之供料容置器21取出待測電子元件51,並移載至第一換料區B1,第一拾取具452將待測電子元件51移入位於第一換料區B1之第一載台422。Please refer to FIGS. 1 and 4 , the first pickup mechanism drives the first pickup 452 by the first drive source 451 to move the first axis X, the second axis Z, and the third axis Y, to supply the feeding device 20 The material container 21 takes out the electronic components 51 to be tested, and transfers them to the first changing area B1 , and the first pick-up tool 452 moves the electronic components 51 to be tested into the first stage 422 located in the first changing area B1 .

請參閱圖5,輸送機構以輸送驅動源421驅動第一載台422作第一軸向X線性位移,第一載台422將待測電子元件51由第一換料區B1輸送至作業區A,且位於壓移器437與測試座412之間,令待測電子元件51對應於壓移器437;壓移機構以馬達432驅動皮帶輪組433及螺桿螺座組之螺桿434,令螺桿434帶動承載件435作單一之第二軸向Z向下位移,承載件435帶動微調器436及壓移器437同步向下位移,由於第一載台422輸送待測電子元件51對應於壓移器437,壓移器437毋需作複數個不同軸向位移,壓移器437可直接於第一載台422取出待測電子元件51,進而防止壓移器437因複數個不同軸向驅動器之組裝誤差而移載偏置待測電子元件51。Please refer to FIG. 5 , the conveying mechanism drives the first stage 422 to make a first axial X-linear displacement by the conveying drive source 421 , and the first stage 422 conveys the electronic component 51 to be tested from the first refueling area B1 to the working area A , and is located between the pressure shifter 437 and the test seat 412, so that the electronic component 51 to be tested corresponds to the pressure shifter 437; the pressure shift mechanism drives the pulley set 433 and the screw 434 of the screw screw base set by the motor 432, so that the screw 434 drives The carrier 435 is displaced downward in a single second axis Z, and the carrier 435 drives the trimmer 436 and the pressure shifter 437 to move downward synchronously. Since the first carrier 422 transports the electronic component 51 under test corresponding to the pressure shifter 437 , the pressure shifter 437 does not need to perform a plurality of different axial displacements, and the pressure shifter 437 can directly take out the electronic component 51 to be tested on the first stage 422, thereby preventing the pressure shifter 437 from assembling errors due to a plurality of different axial drivers Then, the electronic component 51 under test is shifted and biased.

請參閱圖2、6,輸送機構以輸送驅動源421驅動第一載台422作第一軸向X線性反向位移,第一載台422由作業區A位移至第一換料區B1,而退出壓移器437與測試座412之間;由於待測電子元件51於第一載台422內可能發生微量位移,為更加提高壓移器437之入料精準性,取像機構以取像驅動源441驅動取像器442作第三軸向Y位移至作業區A,且位於壓移器437與測試座412之間,令取像器442向下取像測試座412之探針,以及向上取像壓移器437所移載之待測電子元件51的接點,並將取像資料傳輸至處理器(圖未示出),處理器判別待測電子元件51的接點與測試座412之探針是否具有微量偏移,若無,於取像器442復位後,壓移器437將待測電子元件51移入測試座412,若有,壓移機構利用微調器436微調壓移器437及待測電子元件51之位置,使待測電子元件51之接點更加精準對位測試座412之探針,進而提高測試品質。Please refer to FIGS. 2 and 6 , the conveying mechanism drives the first stage 422 by the conveying drive source 421 to perform a first axial X-linear reverse displacement, the first stage 422 is displaced from the working area A to the first material changing area B1, and Exit between the pressure shifter 437 and the test seat 412; since the electronic component 51 to be tested may have a slight displacement in the first stage 422, in order to further improve the feeding accuracy of the pressure shifter 437, the imaging mechanism is driven by the imaging The source 441 drives the image finder 442 to move to the working area A in the third axis Y, and is located between the pressure shifter 437 and the test seat 412, so that the image finder 442 takes the probe of the test seat 412 downward, and upward The contacts of the electronic component 51 under test carried by the image shifter 437 are captured, and the captured data are transmitted to the processor (not shown in the figure), and the processor determines the contacts of the electronic component 51 to be tested and the test seat 412 Whether the probe has a slight offset, if not, after the imager 442 is reset, the pressure shifter 437 moves the electronic component 51 to be tested into the test seat 412, if so, the pressure shifter 436 is used by the pressure shift mechanism to fine-tune the pressure shifter 437 and the position of the electronic component 51 to be tested, so that the contacts of the electronic component 51 to be tested are more accurately aligned with the probes of the test seat 412, thereby improving the test quality.

請參閱圖1、2、7,於取像器442退出壓移器437與測試座412之間後,壓移機構以馬達432驅動皮帶輪組433及螺桿螺座組之螺桿434,令螺桿434帶動承載件435作單一之第二軸向Z向下位移,承載件435帶動微調器436、壓移器437及待測電子元件51於作業區A作同步向下位移,令壓移器437精準地將待測電子元件51移入測試座412內,使待測電子元件51之接點準確壓接測試座412之探針而執行測試作業,溫控機構之溫控件463可使待測電子元件51於模擬日後使用環境溫度下執行測試作業,進而提高測試品質。Please refer to FIGS. 1 , 2 and 7 , after the image finder 442 exits between the pressure shifter 437 and the test seat 412 , the pressure shift mechanism drives the pulley set 433 and the screw 434 of the screw base set with the motor 432 , so that the screw 434 drives the The carrier 435 is displaced downward in a single second axis Z, and the carrier 435 drives the trimmer 436, the pressure shifter 437 and the electronic component 51 to be tested to move downward synchronously in the work area A, so that the pressure shifter 437 is precisely moved downward. Move the electronic component 51 to be tested into the test seat 412, so that the contacts of the electronic component 51 to be tested are accurately pressed against the probes of the test seat 412 to perform the test operation, and the temperature control 463 of the temperature control mechanism can make the electronic component 51 to be tested 51 The test operation is performed under the simulated ambient temperature for future use, thereby improving the test quality.

因此,於測試完畢,壓移器437將已測電子元件51移出測試座412 ,第一載台422位移至壓移器437之下方,以承置已測電子元件51,並將已測電子元件51由作業區A輸送至第一換料區B1,以供第一拾取具452於第一載台422取出已測電子元件51,並依測試結果,將已測電子元件51移載至收料裝置30收置分類。 Therefore, after the test is completed, the pressure shifter 437 moves the tested electronic component 51 out of the test seat 412 , the first stage 422 is displaced below the pressure shifter 437 to hold the tested electronic components 51 , and the tested electronic components 51 are transported from the working area A to the first changing area B1 for the first pick-up tool 452 takes out the tested electronic components 51 from the first stage 422, and according to the test results, transfers the tested electronic components 51 to the receiving device 30 for storage and sorting.

請參閱圖8、9,本發明第二實施例之測試裝置40配置有相同第一實施例之測試機構、輸送機構及壓移機構,更包含配置第一拾取機構、取像機構及溫控機構,本發明第二實施例之測試裝置40與第一實施例差異在於更包含第二拾取機構及具第一輸送器、第二輸送器之輸送機構。Please refer to FIGS. 8 and 9 , the testing device 40 according to the second embodiment of the present invention is equipped with the same testing mechanism, conveying mechanism, and pressing mechanism as in the first embodiment, and further includes a first picking mechanism, an imaging mechanism, and a temperature control mechanism. The difference between the testing device 40 of the second embodiment of the present invention and the first embodiment is that it further includes a second pickup mechanism and a conveying mechanism with a first conveyor and a second conveyor.

輸送機構之第一輸送器及第二輸送器沿第一軸向X位移,以於第一換料區B1、作業區A及第二換料區B2輸送電子元件;更進一步,第一輸送器可輸送待測電子元件,第二輸送器可輸送已測電子元件,或者第一輸送器及第二輸送器可輸送待測電子元件及已測電子元件,又第一輸送器及第二輸送器可各自以獨立之輸送驅動源驅動位移,或者以同一輸送驅動源驅動第一輸送器及第二輸送器位移,依作業需求,不受限於本實施例;於本實施例,輸送機構之第一輸送器為第一載台422,第二輸送器為第二載台423,並以同一輸送驅動源421驅動第一載台422及第二載台423沿第一軸向X位移,使第一載台422位移於第一換料區B1及作業區A輸送待測電子元件,並使第二載台423位移於作業區A及第二換料區B2輸送已測電子元件。The first conveyor and the second conveyor of the conveying mechanism are displaced along the first axis X, so as to convey electronic components in the first changing area B1, the working area A and the second changing area B2; further, the first conveyor The electronic components to be tested can be transported, the second conveyor can transport the electronic components tested, or the first conveyor and the second conveyor can transport the electronic components to be tested and the electronic components tested, and the first conveyor and the second conveyor can transport the electronic components to be tested. The displacement can be driven by an independent conveying drive source, or the displacement of the first conveyor and the second conveyor can be driven by the same conveying drive source. According to the operation requirements, it is not limited to this embodiment; in this embodiment, the first conveyor of the conveying mechanism One conveyor is the first stage 422, the second conveyor is the second stage 423, and the first stage 422 and the second stage 423 are driven by the same conveying driving source 421 to displace along the first axis X, so that the A carrier 422 is moved to the first changing area B1 and the working area A to transport the electronic components to be tested, and the second carrier 423 is moved to the working area A and the second changing area B2 to deliver the tested electronic components.

第二拾取機構設有第二拾取具,以供於第二換料區B2對第二輸送器執行移載電子元件作業;於本實施例,第二拾取機構以第二驅動源471驅動第二拾取具472作第一軸向X、第二軸向Z及第三軸向Y位移,第二拾取具472於收料裝置30及第二載台423移載已測電子元件,依作業需求,第一拾取機構之第一拾取具452則於供料裝置20及第一載台422移載待測電子元件,進而有效提高測試產能。The second pick-up mechanism is provided with a second pick-up tool for transferring electronic components to the second conveyor in the second material changing area B2; in this embodiment, the second pick-up mechanism uses the second drive source 471 to drive the second pick-up The pickup 472 is displaced in the first axis X, the second axis Z and the third axis Y. The second pickup 472 transfers the tested electronic components on the receiving device 30 and the second stage 423, according to the operation requirements, The first pick-up tool 452 of the first pick-up mechanism transfers the electronic components to be tested on the feeding device 20 and the first stage 422, thereby effectively improving the testing capacity.

10:機台 20:供料裝置 21:供料容置器 30:收料裝置 31:收料容置器 40:測試裝置 411:電路板 412:測試座 413:測試機 421:輸送驅動源 422:第一載台 423:第二載台 431:機架 432:馬達 433:皮帶輪組 434:螺桿 435:承載件 436:微調器 437:壓移器 441:取像驅動源 442:取像器 451:第一驅動源 452:第一拾取具 461:測試空間 462:流體輸送管 463:溫控件 471:第二驅動源 472:第二拾取具 51:電子元件 A:作業區 B1:第一換料區 B2:第二換料區 X:第一軸向 Z:第二軸向 Y:第三軸向 10: Machine 20: Feeding device 21: Feed container 30: Receiving device 31: Receiving container 40: Test device 411: circuit board 412: Test seat 413: Tester 421: Conveying drive source 422: The first stage 423: Second stage 431: Rack 432: Motor 433: Pulley set 434: Screw 435: Carrier 436: Spinner 437: Shifter 441: Image acquisition drive source 442: Viewfinder 451: First drive source 452: First Pickup 461: Test Space 462: Fluid Delivery Tube 463: Temperature control 471: Second drive source 472: Second Pickup 51: Electronic Components A: work area B1: The first refueling area B2: The second refueling area X: the first axis Z: the second axis Y: the third axis

圖1:本發明測試設備之示意圖。 圖2:本發明測試裝置第一實施例之俯視圖。 圖3:本發明測試裝置第一實施例之前視圖。 圖4:本發明測試裝置第一實施例之使用示意圖(一)。 圖5:本發明測試裝置第一實施例之使用示意圖(二)。 圖6:本發明測試裝置第一實施例之使用示意圖(三)。 圖7:本發明測試裝置第一實施例之使用示意圖(四)。 圖8:本發明測試裝置第二實施例之俯視圖。 圖9:本發明測試裝置第二實施例之前視圖。 Figure 1: Schematic diagram of the testing equipment of the present invention. FIG. 2 is a top view of the first embodiment of the testing device of the present invention. Figure 3: Front view of the first embodiment of the testing device of the present invention. FIG. 4 is a schematic diagram (1) of the use of the first embodiment of the testing device of the present invention. FIG. 5 is a schematic diagram (2) of the use of the first embodiment of the testing device of the present invention. FIG. 6 is a schematic diagram (3) of the use of the first embodiment of the testing device of the present invention. FIG. 7 is a schematic diagram (4) of the use of the first embodiment of the testing device of the present invention. FIG. 8 is a top view of the second embodiment of the testing device of the present invention. Figure 9: Front view of the second embodiment of the testing device of the present invention.

10:機台 10: Machine

411:電路板 411: circuit board

412:測試座 412: Test seat

413:測試機 413: Tester

421:輸送驅動源 421: Conveying drive source

422:第一載台 422: The first stage

431:機架 431: Rack

432:馬達 432: Motor

433:皮帶輪組 433: Pulley set

434:螺桿 434: Screw

435:承載件 435: Carrier

436:微調器 436: Spinner

437:壓移器 437: Shifter

441:取像驅動源 441: Image acquisition drive source

442:取像器 442: Viewfinder

451:第一驅動源 451: First drive source

452:第一拾取具 452: First Pickup

461:測試空間 461: Test Space

462:流體輸送管 462: Fluid Delivery Tube

463:溫控件 463: Temperature control

A:作業區 A: work area

B1:第一換料區 B1: The first refueling area

X:第一軸向 X: the first axis

Z:第二軸向 Z: the second axis

Claims (8)

一種測試裝置,包含:測試機構:於作業區設有至少一測試器,以供測試電子元件;輸送機構:設有至少一輸送器,該輸送器位移於第一換料區及該作業區,以供輸送電子元件;壓移機構:於該作業區設有機架,以供裝配壓移驅動源,該壓移驅動源驅動承載件作第二軸向位移,該承載件裝配至少一壓移器,該壓移器相對於該測試器,可作該第二軸向位移於該輸送器取放電子元件,並於該測試器取放及壓接電子元件,該承載件於相對該測試器之位置裝配微調器,該微調器裝配該壓移器,以供獨立微調該壓移器。 A testing device, comprising: a testing mechanism: at least one tester is provided in an operation area for testing electronic components; a conveying mechanism: at least one conveyor is provided, and the conveyor is displaced in the first refueling area and the operation area, For conveying electronic components; press-shift mechanism: a frame is arranged in the operation area for assembling a press-shift drive source, the press-shift drive source drives the carrier to perform a second axial displacement, and the carrier is equipped with at least one press-shifter , the pressure shifter can make the second axial displacement relative to the tester to pick and place electronic components on the conveyor, and pick and place and crimp electronic components on the tester. The carrier is opposite to the tester. The position is equipped with a trimmer, and the trimmer is equipped with the pressure shifter for independent fine adjustment of the pressure shifter. 如請求項1所述之測試裝置,更包含溫控機構,該溫控機構於該壓移機構之該機架內部設有測試空間,並設有流體輸送管以供輸送乾燥空氣至該測試空間。 The test device according to claim 1, further comprising a temperature control mechanism, the temperature control mechanism is provided with a test space inside the rack of the pressure-displacement mechanism, and a fluid conveying pipe is provided for conveying dry air to the test space . 如請求項1所述之測試裝置,更包含溫控機構,該溫控機構於該壓移機構或該測試機構設有溫控件,以供溫控電子元件。 The test device as claimed in claim 1 further comprises a temperature control mechanism, and the temperature control mechanism is provided with a temperature control device in the pressure-shift mechanism or the test mechanism for temperature control electronic components. 如請求項1所述之測試裝置,更包含第一拾取機構,該第一拾取機構設有第一拾取具,以供於該第一換料區對該輸送器取放電子元件。 The testing device according to claim 1, further comprising a first pick-up mechanism, and the first pick-up mechanism is provided with a first pick-up tool for picking and placing electronic components on the conveyor in the first material changing area. 如請求項4所述之測試裝置,其該輸送機構設有第一輸送器及第二輸送器,以於該第一換料區、該作業區及第二換料區輸送電子元件,該測試裝置更包含第二拾取機構,該第二拾取機構設有第二拾取具,以供於該第二換料區對該第二輸送器取放電子元件。 The test device according to claim 4, wherein the conveying mechanism is provided with a first conveyor and a second conveyor for conveying electronic components in the first material changing area, the working area and the second material changing area, the test The device further includes a second pick-up mechanism, and the second pick-up mechanism is provided with a second pick-up tool for picking and placing electronic components from the second conveyor in the second material changing area. 如請求項1至5中任一項所述之測試裝置,更包含取像機構,該取像機構設有至少一取像器,該取像器以供於該作業區取像該測試器及電子元件。 The testing device according to any one of claims 1 to 5, further comprising an image capturing mechanism, the image capturing mechanism is provided with at least one imager, the imager is used for capturing the tester in the working area and the Electronic component. 如請求項6所述之測試裝置,其該取像機構設有取像驅動源,以供驅動該取像器作第一軸向、第二軸向及第三軸向位移。 The testing device according to claim 6, wherein the image pickup mechanism is provided with an image pickup drive source for driving the image pickup device to displace in the first axial direction, the second axial direction and the third axial direction. 一種測試設備,包含:機台;供料裝置:配置於該機台,並設有至少一供料容置器,以供容置至少一待測電子元件;收料裝置:配置於該機台,並設有至少一收料容置器,以供容置至少一已測電子元件;至少一如請求項1所述之測試裝置:配置於該機台,以供輸送及測試電子元件;中央控制裝置:以控制及整合各裝置作動而執行自動化作業。 A testing equipment, comprising: a machine; a feeding device: arranged on the machine, and provided with at least one feeding container for accommodating at least one electronic component to be tested; a receiving device: arranged on the machine , and is provided with at least one receiving container for accommodating at least one tested electronic component; at least one test device as described in claim 1: configured on the machine for conveying and testing electronic components; central Control device: to control and integrate the actions of various devices to perform automated operations.
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