TW201423120A - Electronic component operation unit, operation method and operation apparatus applied thereof - Google Patents

Abstract

Disclosed are an electronic component operation unit, an operation method and an operation apparatus applied thereof. At least a transfer placement apparatus, at least an operation section, at least an image capturing apparatus and a sampling comparison apparatus are provided on a machine table for the operation unit. The transfer placement apparatus is movable and transfers an electronic component to execute an operation to a position of the operation section. A holding base for placement of the electronic component is provided in the operation section so as to execute a preset operation for the electronic component. The image capturing apparatus captures images of the electronic component on the transfer placement apparatus in a path of moving the transfer placement apparatus or moving the holding base corresponding to the operation section, and transmits real-time video data obtained by capturing the images to the sampling comparison apparatus. The sampling comparison apparatus carries out comparison between the real-time video data and the sample video data stored in database, and further executes an alignment adjustment operation; accordingly, the real-time video data of the electronic component is acquired at the position above the holding base by the image capturing apparatus, and through the comparison by the sampling comparison apparatus, the electronic component on the transfer placement apparatus is placed in the holding base of the operation section accurately after the alignment adjustment operation is executed, such that practical effect of executing the operation effectively can be achieved.

Description

Electronic component working unit, working method and working equipment thereof

In particular, the present invention provides an operating device for an electronic component working unit, a working method and an application thereof, which can accurately position an electronic component on a transfer pick-and-place device in a mounting seat of a working area, thereby effectively performing the work.

Nowadays, electronic components are actively developing toward small, compact and small-sized micro-contacts. Therefore, the precision of the small-sized micro-contact electronic components placed in the mounting of the working area is quite high, and if the accuracy is slightly deviated, even Electronic components cannot be effectively performed in the mounting member, and the quality of the work is reduced.

Taking the tester of the electronic component as an example, please refer to FIG. 1 , which is a patent application of Taiwan Patent Application No. 96194417, which can be applied to the precise transfer of electronic components. The machine platform includes a feeding device 10, an input conveying device 11, a working area 12, an output conveying device 13 and a receiving device 14; the input conveying device 11 is an electronic device to be tested on the feeding device 10. The components are respectively transported to the feeding carrier 121 in the working area 12, and the electronic components that are completed on the first and second receiving carriers 122, 123 in the working area 12 are transported by the output conveying device 13 according to the detection result. The sorting device 14 is placed in a sort. Referring to FIG. 2, the work area 12 includes a test station 124, an image capture mechanism 125, a first receiving carrier 122 on the side of the test station 124, a supply carrier 121 on the other side of the test station 124, and a second The receiving carrier 123, the first transfer pick-and-place 126 and the second transfer pick-and-place 127; wherein the top of the feeding carrier 121 is provided with a plurality of bottom mask hollow holes for bearing the test The socket 1211 of the electronic component, each of the sockets 1211 is provided with a plurality of adjusting members 1212, 1213 and 1214 which can be servo motors and arranged in different axial directions, and the adjusting members 1212, 1213 and 1214 can be used to drive the socket 1211. The displacement of the XY two-axis and the θ angle, and the slide carrier 1215 is provided below the feeding carrier 121, and the input end conveying device can be placed in the feeding portion of the working area 12 to place the electronic component to be tested. After the socket 1211 is mounted, the electronic component to be tested is transferred to the image capturing mechanism 125 by the slide rail group 1215, and the image is taken. And the adjusting member 1212, 1213, 1214 drives the socket 1211 to compensate for the XY two-axis and the θ angle, and can precisely adjust the placement of the electronic component to be tested, and the first and second receiving carriers 122, 123 is for receiving the completed electronic component, and the first and second receiving carriers 122, 123 are fixedly positioned relative to the test station 124 in a fixed manner for the first and second transfer pickers 126 The 127 and the output end conveying device perform a receiving operation, and the image taking mechanism 125, which is located in the side of the feeding carrier 121, is a CCD image capturing device, and is disposed under the transparent platen of the machine table, and is connected by a line. The signal is sent to the central controller, and after the feeding carrier 121 transfers the electronic component to the image capturing mechanism 125, the image capturing signal is transmitted to the central controller, and the deviation is calculated by the central controller. The amount, and then the respective seats 1211 of the feeding carrier 121 are compensated for position or angle compensation, so that the electronic components are accurately and correctly placed for the first transfer picker 126 to be taken out and transferred to the test station 124. Perform a test job on it.

In this design, an image capturing mechanism 125 for the CCD image picker is disposed under the transparent platen of the machine for the feeding carrier 121 to transfer the electronic components to the image capturing device, and the feeding carriers 121 are respectively The seat 1211 is compensated for position or angle, so that the electronic components are accurately and correctly placed for the first transfer picker 126 to be taken out and transferred to the test station 124 for performing the test operation; During the process of removing and transferring the electronic component on the feeding carrier 121, the first transfer handler 126 will move to the positional error or assembly gap or movement problem. When the test station 124 is tested, the electronic component may be slightly offset, and it may not be accurately placed in the test station 124. That is, the design allows the electronic component to be accurately and correctly placed on the feeding carrier 121, but in the first shift. The loader 126 is placed in an important stage of the test station 124, but may cause a slight shift of the electronic components. This situation is slightly accurate for today's electronic components that require small-sized micro-contacts. There is a deviation, which may result in the inability to perform the job effectively. And reduce the quality of the work.

In view of this, the present inventors have developed a working unit that can accurately place electronic components into a work area to perform work and improve quality in response to the development trend of small-sized electronic components, which is the design object of the present invention.

An object of the present invention is to provide an electronic component working unit and a working method, wherein the working unit is provided with at least one transfer pick-and-place device, at least one working area, at least one image capturing device and a sampling comparison device on the machine table. The transfer pick-and-place device is movable to transfer the electronic components of the work to be executed to the working area, and the work area is provided with a socket for the electronic component to be placed to perform preset on the electronic component. The image capturing device is configured to take an image of the electronic component on the transfer pick-and-place device when the transfer device is moved in a path that moves the pick-and-place device or moves to a position above the mounting seat of the work area, and the image is obtained. The real-time image data is transmitted to the sampling comparison device, and the real-time image data is compared with the sample image data stored in the database by the sampling comparison device, and the alignment adjustment operation is further performed; thereby, the transfer operation is performed by using the transfer When the loading device moves corresponding to the bearing seat of the working area, and then the image capturing device performs image capturing, the structural error or assembly gap or moving positioning of the loading and unloading device itself can be largely eliminated. The resulting offset error, and thus the correct real-time image data, and through the comparison of the sampling comparison device, after performing the alignment adjustment operation, the electronic components on the transfer pick-and-place device can be accurately placed in the operation. In the housing of the district, the practical benefits of effective execution of the operation are achieved.

The second object of the present invention is to provide a working device for applying an electronic component working unit, the working device comprising a feeding device, a receiving device, a working unit, an input end conveying device, an output end conveying device and a central control unit, and feeding The device is disposed on the machine platform for accommodating at least one electronic component to be executed, and the receiving device is disposed on the machine platform for accommodating at least one electronic component for completing the operation, and the working unit is disposed on the machine platform. And providing at least one transfer pick-and-place device, at least one working area and at least one pair of position checking devices for performing preset operations on the electronic components, wherein the input end conveying device and the output end conveying device are disposed on the machine table, The utility model is used for inputting the electronic components on the feeding device into the working unit and outputting the electronic components from the working unit to the receiving device. The central control unit is used for controlling and integrating the operations of the devices to perform the automatic operation, thereby achieving the practical benefit of improving the working efficiency. .

In order to make the reviewer further understand the present invention, it is better to The embodiment and the drawings are detailed as follows: Referring to Figures 3 and 4, the working unit 20 of the present invention is provided with at least one transfer pick-and-place device 21, at least one working area 22, at least one on the machine table. The image capturing device 23 and the sampling and comparing device 24; the transfer picking and placing device 21 is movable to transfer the electronic components of the work to be executed to the working area 22 position. In the embodiment, the transfer loading and unloading device 21 The first feeding stage 211 and the first receiving stage 212 on the first side of the working area 22, the second feeding stage 213 and the second receiving stage 214 on the second side of the working area 22 are included. And moving the first transfer picker 215 between the work area 22 and the first supply stage 211 and the first receiving stage 212, and moving to the work area 22 and the second supply stage 213 and the second collection a second transfer carrier 216 between the loading stations 214; the first supply carrier 211 on the first side of the working area 22 has at least one first supply holder 2111 for receiving at the feeding position The electronic component of the job to be executed can be moved to a side position corresponding to the working area 22, and the first receiving stage 212 has at least one first receiving socket 2121. And moving to a side position corresponding to the working area 22 to receive the electronic components of the work and moving to the receiving position, the second feeding stage 213 located on the second side of the working area 22 has at least a second The feeding socket 2131 is configured to receive the electronic component of the work to be performed at the feeding position, and can be moved to the lateral position of the corresponding working area 22, and the second receiving stage 214 has at least one second receiving receiving The seat 2141 is movable to a side position corresponding to the working area 22 to receive the electronic component of the work and moved to the receiving position, and the first transfer picker 215 is movable to the first side of the first side. The loading stage 211 is positioned to transfer the electronic components of the first feeding stage 211 to be executed to the working area 22 position, or to transfer the electronic components of the working area 22 to the first receiving stage 212. The second transfer picker 216 is movable to the second feed stage 213 position on the second side to transfer the electronic components of the second supply stage 213 to be executed to the work area 22 position. , or transfer the electronic components of the work area 22 to the second receiving stage 214; One less work area 22, the work area 22 is an electronic component that can be placed into the work to be executed to perform a preset job on the electronic component, and the preset work can be printing, molding, appearance inspection or electrical test, etc. , In the embodiment, the working area 22 performs an electrical test operation, and a test circuit board 221 is disposed in the working area 22, and a mounting seat 222 for placing the electronic component on the test circuit board 221 is disposed. In this embodiment, in order to perform an electrical test operation, a plurality of electrical contacts 223 connected to the circuit board 221 are disposed in the socket 222 for electrically contacting the pins or solder balls of the electronic component. Point 223; in order to enable the first transfer pick-and-place 215 or the second transfer pick-and-place 216 to accurately place the electronic components in the socket 222, and the pins or solder balls of the electronic components can be accurately The electrical contact 223 in the electrical contact holder 222 is provided with an image capturing device 23, a sampling comparison device 24 and a alignment adjusting device 25, and the image capturing device 23 is a CCD image capturing device 231. The electronic component on the first transfer picker 215 or the second transfer picker 216 can be imaged in a path in which the first transfer picker 215 or the second transfer picker 216 moves. And transmitting the obtained real-time image data to the sampling comparison device 24; please refer to FIG. 5, or the image capturing device 23 When the first transfer picker 215 or the second transfer picker 216 moves to a position above the receiving seat 222 corresponding to the working area 22, the first transfer picker 215 or the second transfer pick-and-place The electronic component on the device 216 takes an image and transmits the captured image data to the sampling comparison device 24; see Figures 3 and 5, the sampling comparison device 24 is provided with a database for storing sample image data. (not shown) and the controller (not shown), the real-time image data can be compared with the sample image data. If the error range is exceeded, the alignment adjustment device 25 is aligned. In the embodiment, the alignment adjusting device 25 is mounted on the first transfer pick-and-place 215 or the second transfer pick-and-place 216 to mount a multi-layer adjustment platform to the first transfer pick-and-place 215. For example, the upper part of the adjusting platform is a fixed seat 251. The first sliding seat 253 is driven by the X-axis adjusting member 252 to be X-axis sliding. The first sliding seat 253 is provided with a Y-receivable portion. The axial adjustment member 254 is driven to slide in the Y direction and can be driven by the angle adjustment member 255 for angle adjustment. The second sliding seat 256, the first transfer carrier 215 pick-and-place electronic nozzle 2151 is fixed under the second sliding seat 256; since the multi-layer adjustment platform has been a conventional technique, its action is not Elaborate The component can be aligned on the first transfer pick-and-place 215 or the second transfer pick-and-place 216; the comparison is performed via the sampling comparison device 24, and the alignment adjustment is completed if the error range is exceeded or the error range is exceeded. The electronic component is then directly lowered into the mounting seat 222 by the first transfer pick-and-place 215 or the second transfer pick-and-place 216, so that the pins or solder balls of the electronic components can be accurately electrically contacted. The electrical contacts 223 are placed in the holder 222.

Referring to FIG. 6 , in order to establish the sample image data of the sampling comparison device 24 , in the embodiment, the sampling comparison device 24 further includes a movable image finder 241 , wherein the mobile image finder 241 is The mirror group and the CCD image picker can be moved to the position between the socket 222 of the working area 22 and the first transfer pick-and-place 215 or the second transfer pick-and-place 216, and the movable image finder 241 Since the prism group is installed, the electronic component on the first transfer handler 215 or the second transfer handler 216 and the holder 222 of the work area 22 can be simultaneously bidirectionally positioned through the prism group. Taking the image, the CCD imager takes the image of the lens group, and obtains the image data of the relative position between the electronic component and the mounting base 222, and finally transmits the image data to the controller for comparison. If the result exceeds the error value, the alignment adjustment device 25 performs the alignment adjustment, and after the alignment adjustment is completed, the image is taken by the CCD image pickup unit 231 of the image capturing device 23 to obtain the correct sample image data, and further stored. In the database, the sample image data is created in the database.

Referring to FIG. 7, the present invention performs a process of establishing a sample image data by the first transfer handler 215 to transfer the electronic component 26 to the upper position of the holder 222 of the work area 22 before performing the work. The movable image pickup unit 241 of the sampling device 24 is moved to the position between the mounting base 222 of the working area 22 and the electronic component 26 on the first transfer pick-and-place unit 215, and the movable image pickup unit 241 is moved. The bidirectional position acquisition is performed, and the image data is transmitted to the controller of the sampling comparison device 24, and if the comparison result exceeds the error value, the alignment adjustment program is further performed by the registration adjustment device 25, such as After the error value is not exceeded or the alignment adjustment procedure is completed, the CCD imager 231 of the image capturing device 23 takes an image. In the embodiment, the CCD imager 231 is connected to the pin or tin of the electronic component 26. The ball is imaged and further stored in a database to create sample image data in the database.

Referring to FIG. 8 , in the present invention, the loading and unloading process is performed first, and the electronic components of the work to be executed are transferred to the corresponding working area 22 by the transfer pick-and-place device 21, in this embodiment, The first feeding stage 211 of the transfer pick-and-place device 21 transfers the electronic component 26a of the first feeding holder 2111 to be executed to the lateral position of the corresponding working area 22, and the first transfer pick-and-place device 215 and move to a position above the first supply stage 211 to draw the electronic component 26a of the work to be performed. Referring to FIG. 9, the first transfer picker 215 then transfers the electronic component 26a of the work to be performed, and the first transfer picker 215 can move to the position shown in FIG. 4 in the moving path. In the present embodiment, the first transfer picker 215 is moved to an upper position corresponding to the holder 222 of the work area 22.

Referring to FIG. 10, in order to enable the electronic component 26a of the work to be performed to be accurately placed in the mounting seat 222 of the working area 22, the imaging comparison program is performed, which is performed by the CCD of the image capturing device 23. The image finder 231 takes an image of the electronic component 26a on the first transfer pick and place 215 to be executed. In the embodiment, the CCD imager 231 is a pin or tin of the electronic component 26a to be executed. The ball performs image capturing of the real-time image data, and then transmits the real-time image data to the sampling comparison device 24, and the sampling comparison device 24 compares with the sample image data established in the database, if the comparison result is in the error value The next operation program can be performed. If the comparison result exceeds the error value, the alignment adjustment program is further executed. In this embodiment, the electronic component to be executed is transferred by the first transfer handler 215. After the 26a is corresponding to the upper position of the mounting base 222 of the working area 22, the image data of the instant image is taken, that is, the final position before the alignment is taken, and the first transfer picker 215 itself can be excluded. Structural error or Means a gap or offset error problems caused by mobile positioning, thereby attainable correct real-time image data. After the image matching program is completed, if the comparison result of the image matching program exceeds the error value, the alignment adjustment program needs to be further performed. In this embodiment, the alignment adjustment program is taken by the first transfer. Multi-layer on the 215 The X-axis adjustment member 252, the Y-axis adjustment member 254 and the angle adjustment member 255 of the adjustment platform enable the electronic component 26a to perform an alignment adjustment procedure on the first transfer handler 215.

Referring to Figures 11 and 12, after the image matching program is completed, if the comparison result is within the error value or exceeds the error value but the alignment adjustment program is completed, then the nesting execution operation program is executed, which causes the first shift The loading and unloading device 215 is lowered, and the electronic component 26a of the work to be executed is placed in the receiving seat 222 of the working area 22 to perform the work. In this embodiment, the electronic work to be executed is performed in the first transfer pick-and-place device 215. After the component 26a is transferred to the upper surface of the mounting base 222, the image capturing device 23 and the sampling comparison device 24 are used to perform an image capturing comparison program of the instant image data, thereby effectively improving the structure of the first transfer pick-and-place device 215. The error caused by the error or the assembly gap or the movement positioning causes the pin or the solder ball of the electronic component 26a to be accurately electrically contacted with the electrical contact 223 in the socket 222 to The electrical test operation is performed efficiently and the correct test result is obtained. In the embodiment, the electrical test operation is performed by using a pressure measurement method, and the first transfer carrier 215 is to perform an operation of the electronic device. The component 26a is placed in the work area 22 After 222, the first transfer picker 215 is kept pressed against the electronic component 26a of the work to be performed to ensure that the pins or solder balls of the electronic component 26a to be executed can be electrically contacted. Electrical contacts 223 in the housing 222. In addition, when the first transfer handler 215 is pressed against the electronic component 26a of the work to be performed to perform the electrical test operation, the second transfer handler 216 is moved to the position of the second supply stage 213, and is ready to be performed. The feeding program is moved, and the electronic component 26b of another work to be performed in the second feeding stage 213 is sucked.

Referring to FIG. 13, after the work area 22 completes the electrical test operation of the electronic component 26a, the transfer and discharge process is performed, and the electronic component of the completed work is removed from the work area 22 by the transfer pick-and-place device 21, in this embodiment. The first loading carrier 215 removes the electronic component 26a from the mounting base 222 of the working area 22, and the electronic component 26a is placed on the first receiving stage 212. The first receiving load is carried. The stage 212 then transfers the electronic component 26a of the completed job to the receiving position; at this time, since the first transfer picker 215 has been removed from the work area 22, The second transfer handler 216 takes over the transfer of the electronic component 26b of the job to be executed to the position of the work area 22 to perform the same shifting program, the image matching program, the stocking execution program, and the shifting and discharging program.

Referring to FIG. 14 , when the working unit 20 of the present invention is applied to a working device, the test sorting machine is taken as an example, and the feeding machine is provided with a feeding device 30, an input conveying device 40, a working unit 20, and an output end. The conveying device 50 and the receiving device 60; the input conveying device 40 is configured to convey the electronic components of the feeding device 30 to be tested to the first feeding stage 211 and the second feeding stage 213 of the working unit 20, respectively. The electronic components of the first receiving platform 212 and the second receiving carrier 214 of the working unit 20 that complete the testing operation are transported by the output conveying device 50 to the receiving device 60 according to the test result, and the central control unit is disposed. It is used to control and integrate the operation of each device to perform automated operations and achieve practical benefits of improving operational efficiency.

Conventional part:

10‧‧‧Feeding device

11‧‧‧Input conveyor

12‧‧‧Working area

121‧‧‧Feeding vehicle

1211‧‧ ‧ socket

1212‧‧‧Adjustment

1213‧‧‧Adjustment

1214‧‧‧Adjustment

1215‧‧‧Slide group

121‧‧‧First receiving vehicle

123‧‧‧Second receiving vehicle

124‧‧‧Test Station

125‧‧‧Image agency

126‧‧‧First transfer picker

127‧‧‧Second transfer picker

13‧‧‧Output conveyor

14‧‧‧ Receiving device

Part of the invention:

20‧‧‧Operating unit

21‧‧‧Transfer pick and place device

211‧‧‧First feeding platform

2111‧‧‧First supply seat

212‧‧‧First receiving platform

2121‧‧‧First receiving receptacle

213‧‧‧Second feed stage

2131‧‧‧Second feed holder

214‧‧‧Second receiving platform

2141‧‧‧Second receipt holder

215‧‧‧First transfer picker

2151‧‧‧ nozzle

216‧‧‧Second transfer picker

22‧‧‧Working area

221‧‧‧Test circuit board

222‧‧‧ socket

223‧‧‧Electrical contacts

23‧‧‧Image capture device

231‧‧‧CCD imager

24‧‧‧Sampling comparison device

241‧‧‧Mobile Imager

25‧‧‧ alignment adjustment device

251‧‧‧ fixed seat

252‧‧‧X axial adjustment

253‧‧‧First sliding seat

254‧‧‧Y axial adjustment

255‧‧‧Angle adjustment

256‧‧‧Second sliding seat

26a‧‧‧Electronic components

26b‧‧‧Electronic components

30‧‧‧Feeding device

40‧‧‧Input conveyor

50‧‧‧Output conveying device

60‧‧‧ receiving device

Figure 1: Schematic diagram of the configuration of the Taiwan patent application No. 96194417 in the test classification machine.

Figure 2: Schematic diagram of the configuration of the operating area of Taiwan Patent Application No. 96194417.

Figure 3: Schematic diagram of the configuration of the working unit of the present invention (1).

Figure 4: Schematic diagram of the configuration of the working unit of the present invention (2).

Fig. 5 is a view showing another embodiment of the image pickup device of the working unit of the present invention.

Figure 6 is a schematic view of the sampling unit of the working unit of the present invention.

Figure 7: Schematic diagram of the operation of the working unit of the present invention (1).

Figure 8: Schematic diagram of the operation of the working unit of the present invention (2).

Figure 9: Schematic diagram of the operation of the working unit of the present invention (3).

Figure 10: Schematic diagram of the operation of the working unit of the present invention (4).

Figure 11: Schematic diagram of the operation of the working unit of the present invention (5).

Figure 12: Schematic diagram of the operation of the working unit of the present invention (6).

Figure 13: Schematic diagram of the operation of the working unit of the present invention (7).

Figure 14: Schematic diagram of the configuration of the working unit of the present invention applied to the working equipment.

20‧‧‧Operating unit

21‧‧‧Transfer pick and place device

211‧‧‧First feeding platform

2111‧‧‧First supply seat

212‧‧‧First receiving platform

2121‧‧‧First receiving receptacle

213‧‧‧Second feed stage

2131‧‧‧Second feed holder

214‧‧‧Second receiving platform

2141‧‧‧Second receipt holder

215‧‧‧First transfer picker

216‧‧‧Second transfer picker

22‧‧‧Working area

221‧‧‧Test circuit board

222‧‧‧ socket

223‧‧‧Electrical contacts

23‧‧‧Image capture device

231‧‧‧CCD imager

24‧‧‧Sampling comparison device

241‧‧‧Mobile Imager

Claims (10)

An electronic component working unit includes: a working area: a mounting base for positioning an electronic component to be executed to perform a preset operation on the electronic component; and a loading and unloading device: Having at least one transfer pick-and-place device for transferring the electronic components of the work to be performed to the mounting seat of the work area, and moving the electronic components of the work area receiving work from the mounting seat; the image capturing device: Obtaining an image of the electronic component on the transfer pick-and-place device when the transfer pick-and-place device moves the path of the transfer pick-and-place device or when the transfer pick-and-placer moves to the position of the mount corresponding to the work area Instant image data of electronic components; sampling comparison device: a database for storing sample image data and a controller for performing comparison to compare the real-time image data transmitted by the image capturing device with the sample image data of the data library . The electronic component working unit according to claim 1, wherein the working area is provided with a test circuit board, and the test circuit board is provided with a mounting seat for placing the electronic component on the position, and the mounting seat is disposed. And a plurality of electrical contacts connected to the circuit board for electronic components to position and perform electrical test operations. The electronic component working unit according to claim 1, wherein the transfer loading and unloading device is provided with at least one feeding stage, a receiving stage and at least one moving on the feeding stage in the working area, A transfer picker between the work area and the receiving stage. The electronic component working unit according to claim 1, wherein the sampling comparison device further comprises a movable image capturing device, wherein the movable image capturing device is a prism group and a CCD image capturing device, and It can be moved to the position between the bearing seat of the working area and the transfer pick-and-place device to simultaneously perform the bidirectional position image capturing of the electronic components on the transfer pick-and-place device and the mounting base of the working area, thereby obtaining the electronic components and The image data of the relative position between the seats is taken and transmitted to the controller for comparison, and then the image capturing device is taken to obtain the correct sample image data and stored in the data. Library. The electronic component working unit according to Item 1 or 4 of the patent application scope further includes a matching adjustment device, wherein when the sampling comparison device compares the instantaneous image data with the sample image data and has an error, or moves When the image pickup device transmits the image data of the relative position between the electronic component and the socket to the controller for comparison and has an error, the electronic component can be aligned. The electronic component working unit according to claim 5, wherein the alignment adjusting device is configured to mount a multi-layer adjusting platform on the transfer pick-and-place device, wherein the upper portion of the adjusting platform is a fixing seat, and the fixing frame is provided with a lower frame. The first sliding seat for X-axis sliding can be driven by the X-axis adjusting member, and the Y-axis adjusting member can be driven by the Y-axis adjusting member to be Y-axis sliding and can be driven by the angle adjusting member for angle adjustment. The second sliding seat, the suction nozzle of the pick-and-place pick-and-place electronic component is fixed under the second sliding seat, and the electronic component is aligned directly on the transfer pick-and-place device. An electronic component working method includes: establishing a sample image data program: transferring, by a transfer pick-and-place device of a transfer pick-and-place device, an electronic component of a work to be executed to a position of a socket of a corresponding work area, and then sampling The movable image pickup device of the comparison device moves to the position between the mounting seat of the working area and the electronic component on the transfer pick-and-place device for two-way position image capturing, and transmits the image capturing data to the controller for comparison And the image capturing device takes image and stores it in the database, and the sample image data is created in the database; the loading and feeding program: the electronic component of the work to be executed is transferred by the transfer pick and place device of the transfer loading device to the corresponding The position of the mounting area of the working area; the image matching program: when the transfer picker moves in the path or when the transfer picker moves corresponding to the position of the mounting area of the working area, the image capturing device is transferred The electronic component of the work to be performed on the pick and place device performs image capturing of the instant image data, and then transmits the instant image data to the sampling comparison device, and the sampling comparison device is immediately The image data is compared with the sample image data in the database; the loading execution program: after the image matching program is completed, the electronic components of the work to be executed are placed in the mounting area of the work area by the transfer pick and place device. Execute the job inside. According to the method for operating an electronic component according to claim 7, wherein the method for establishing a sample image data is transmitted to the controller for comparison, and if the comparison result exceeds the error value, the alignment adjustment is further performed. After the program completes the alignment adjustment program, the image capturing device takes image and stores it in the database, and the sample image data is created in the database. According to the electronic component operation method of claim 7, wherein if the comparison result exceeds the error value, the alignment adjustment program is further executed, and after the alignment adjustment procedure is completed, the registration is performed. Execute the operating program. An operation device for applying an electronic component working unit includes: a feeding device: is disposed on a machine platform for holding an electronic component to be executed; and a receiving device is disposed on the machine platform for receiving The electronic component for completing the operation; the working unit is disposed on the machine table, and is provided with at least one working area, a loading and unloading device, an image capturing device and a sampling comparison device according to the first item of the patent application scope. The utility model is used for performing preset operations on the electronic components; the input end conveying device is: the electronic component of the feeding device to be executed is sent to the working unit; the output conveying device is the electronic component for completing the testing operation on the working unit. The job results are sorted and placed in the receiving device. Central Control Unit: Used to control and integrate the various units to perform automated operations.