JP2007333697A - Method of calibrating electronic component test apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of calibration capable of accurately calibrating the relative position of an imaging means to a socket. <P>SOLUTION: This method of calibration comprises the placing step of placing a tool 60 on the socket 71 while inserting contact pins 72 into insertion holes 62, the moving step of moving the tool 60 to an alignment device 43, the first imaging step of imaging the tool 60 positioned at the alignment device 43 by a device camera 434, the second imaging step of imaging the socket 71 by a socket camera 414, a first recognizing step of recognizing the relative position of the device camera 434 to the socket 71 according to the image information imaged in the first step, and the second recognizing step of recognizing the relative position of the socket camera 414 to the socket 71 according to the image information imaged in the second imaging step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention is an electronic device for accurately testing various electronic components (hereinafter, also referred to as IC devices) such as semiconductor integrated circuit elements with respect to a socket by using an imaging means such as a CCD camera. The present invention relates to a calibration method for calibrating the relative position of an imaging means with respect to a socket after changing the type of IC device in a component testing apparatus.

  In an electronic component testing apparatus called a handler (Handler), a large number of IC devices accommodated in a tray are transported into a handler, and the IC devices are brought into electrical contact with a test head. (Also referred to as a tester). When the test is completed, the IC devices that have been tested are paid out from the test head and placed on the tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

  Among these handlers, it is conventionally known that the IC device is positioned with high accuracy with respect to the socket before contact with the socket using image processing technology in order to prevent miscontact between the IC device and the socket. (For example, refer to Patent Document 1).

  Usually, since the socket on the test head is manufactured according to the type of the IC device, the socket is replaced with another socket corresponding to the IC device every time the type of the IC device is changed. Therefore, in the handler using the image processing technique, it is necessary to calibrate the position of the CCD camera with respect to the socket after replacement (see, for example, Patent Document 2).

International Publication No. 03/075023 Pamphlet JP 2001-51018 A

  It is an object of the present invention to provide a calibration method for an electronic component test apparatus that can accurately calibrate the relative position of an image pickup means with respect to a socket.

  In order to achieve the above object, according to the present invention, a socket imaging means for imaging a socket and device imaging means for imaging an electronic device under test are provided, and the electronic device under test is connected to the socket by an alignment device. In the electronic component testing apparatus for testing the electronic device under test by moving the electronic device under test in electrical contact with the socket after the positioning with respect to the socket, the socket imaging device for the socket and the socket A calibration method for calibrating the relative position of a device imaging means, wherein a placing step for placing a jig on the socket, and the moving means for placing the jig placed on the socket by the alignment means In a state where the temperature applied to the electronic device under test is set to the first temperature, In the first imaging step in which the device imaging means images the jig positioned in the alignment means, and the temperature applied to the electronic device under test is set to the first temperature, the socket is connected to the socket. A second imaging step for imaging by the imaging unit; a first recognition step for recognizing a first relative position of the device imaging unit with respect to the socket based on image information captured in the first step; A second recognition step of recognizing a first relative position of the socket imaging means with respect to the socket based on the image information imaged in the second imaging step. A calibration for placing the jig on the socket while inserting the contact pin of the socket into the insertion hole formed on the jig. Down method is provided (see claim 1).

  In the present invention, the jig is placed on the socket while inserting the contact pin of the socket into the insertion hole of the jig, the moving means is moved to the alignment means, and the device imaging means moves the jig. An image is taken and the relative position of the device imaging means with respect to the socket is recognized from the image information. At this time, since the relative position of the device imaging means with respect to the socket is recognized based on the jig positioned with respect to the socket with reference to the contact pin itself of the socket, calibration with high accuracy can be performed.

  Although not particularly limited in the above invention, the insertion hole is preferably formed in the jig so as to correspond to the arrangement of contact pins of the socket (see claim 2).

  Although not particularly limited in the above invention, the jig positioned in the alignment means is set in the state where the temperature applied to the electronic device under test is set to a second temperature different from the first temperature. A third imaging step for imaging by the device imaging means, and a third recognition for recognizing a second relative position of the device imaging means with respect to the socket based on the image information imaged in the third imaging step. Preferably, the method further comprises a step (see claim 3).

  The effect of thermal expansion is reflected in the calibration by recognizing the relative position of the device imaging means with respect to the socket while the temperature applied to the electronic device under test is set to a second temperature different from the first temperature. Therefore, calibration with high accuracy is possible.

  Although not particularly limited in the above invention, based on the first and second relative positions of the device imaging means with respect to the socket recognized in the first and third recognition steps, the electronic device under test is A first calculating step of calculating a third relative position of the device imaging means with respect to the socket when the temperature to be applied is set to a third temperature different from the first and second temperatures; It is preferable (see claim 4).

  By calculating the relative position of the device imaging means with respect to the socket in a state in which the temperature applied to the electronic device under test is set to a third temperature different from the first and second temperatures, the thermal expansion is performed in the calibration. The impact can be reflected in more detail.

  Although not particularly limited in the above invention, the socket imaging means images the socket in a state where the temperature applied to the electronic device under test is set to a second temperature different from the first temperature. An imaging step; and a fourth recognition step of recognizing a second relative position of the socket imaging means with respect to the socket based on the image information captured in the fourth imaging step. Is preferable (see claim 5).

  The effect of thermal expansion is reflected in the calibration by recognizing the relative position of the socket imaging means with respect to the socket while the temperature applied to the electronic device under test is set to a second temperature different from the first temperature. Therefore, calibration with high accuracy is possible.

  Although not particularly limited in the above invention, the electronic device under test is based on the first and second relative positions of the socket imaging means with respect to the socket recognized in the second and fourth recognition steps, respectively. And a second calculating step of calculating a third relative position of the socket imaging means with respect to the socket when the temperature applied to the socket is set to a third temperature different from the first and second temperatures. (See claim 6).

  By calculating the relative position of the socket imaging means with respect to the socket in a state in which the temperature applied to the electronic device under test is set to a third temperature different from the first and second temperatures, the thermal expansion is performed in the calibration. The impact can be reflected in more detail.

  In order to achieve the above object, according to the present invention, a socket imaging means for imaging a socket and device imaging means for imaging an electronic device under test are provided, and the electronic device under test is connected to the socket by an alignment device. In the electronic component testing apparatus for testing the electronic device under test by moving the electronic device under test in electrical contact with the socket after the positioning with respect to the socket, the device imaging means relative to the socket A calibration jig used for calibrating a position, wherein a base member is placed on the socket, and an insertion hole into which the contact pin of the socket can be inserted corresponds to the arrangement of the contact pins Thus, a calibration jig formed on the base member is provided (see claim 7). .

  In the present invention, since the calibration jig is positioned on the socket with reference to the socket contact pin itself, calibration with high accuracy can be performed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1 and 2, the electronic component testing apparatus 1 according to the embodiment of the present invention includes a handler 10, a test head 70, and a tester 80, and the test head 70 and the tester 80 are connected via a cable 81. It is connected.

  The handler 10 includes a storage unit 20, a loader unit 30, a test unit 40, and an unloader unit 50. The handler 10 supplies an IC device under test from the storage unit 20 to the test unit 40 via the loader unit 30, and a contact arm 420. Presses the IC device against the socket 71 of the test head 70, and the tester 80 executes the test of the IC device via the test head 70 and the cable 81. Then, the unloader unit 50 selects the tested IC device according to the test result. The data is stored in the storage unit 20 while being classified.

<Storage unit 20>
The storage unit 20 includes a supply tray stocker 21, a classification tray stocker 22, an empty tray stocker 23, and a tray transport device 24, and can store IC devices under test before and after the test. ing.

  The supply tray stocker 21 houses a plurality of supply trays stacked, and a plurality of pre-test IC devices are mounted on each supply tray. In the present embodiment, as shown in FIG. 1, the storage unit 20 is provided with two supply tray stockers 21. In the present invention, the number of supply tray stockers 21 is not particularly limited to this.

  The classification tray stocker 22 accommodates a plurality of classification trays stacked, and a plurality of tested IC devices are mounted on each classification tray. In the present embodiment, as shown in FIG. 1, the storage unit 20 is provided with four sorting tray stockers 22. By providing four classification tray stockers 22, it is possible to sort and store IC devices into a maximum of four classifications according to the test results. In other words, it is possible not only to classify non-defective products and defective products, but also to classify non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become. In the present invention, the number of sorting tray stockers is not particularly limited to this.

  The empty tray stocker 23 stores a plurality of empty trays stacked. Each empty tray is a tray that is empty when all the IC devices mounted on the supply tray are supplied to the loader unit 30.

  Although the supply tray, the classification tray, and the empty tray are not particularly illustrated, all of them are trays having the same shape in which a plurality of recesses capable of accommodating IC devices are formed. In this embodiment, for convenience, the IC device before the test. Is referred to as a supply tray, a tray on which a tested IC device is mounted is referred to as a classification tray, and a tray on which no IC device is mounted is referred to as an empty tray.

  Although not shown in particular, each of the stockers 21 to 23 is provided with an elevator that can move along the Z-axis direction, so that a plurality of stacked trays can be moved up and down.

  As shown in FIG. 1, the tray transport device 24 includes a support rail 241, a movable head 242, and a suction head 243, and can move the tray along the X-axis direction and the Z-axis direction. Yes. The tray transport device 24 has an operation range including a supply tray stocker 21, an empty tray stocker 23, and a sorting tray stocker 22.

  The support rail 241 is provided on the base 11 of the handler 10 along the X-axis direction. The movable head 242 is supported by the support rail 241 so as to be movable along the X-axis direction. The four suction pads 243 are mounted downward on the movable head 242 and can be moved along the Z-axis direction by an actuator (not shown).

  The tray transfer device 24 supplies all pre-test IC devices to the loader unit 30 and moves empty trays that have become empty from the supply tray stocker 21 to the empty tray stocker 23. Also, the tray transport device 24 transfers the empty tray from the empty tray stocker 23 to the classification tray stocker 22 when the classification tray is full of tested IC devices.

<Loader unit 30>
The loader unit 30 includes a first device transport device 31, a heat plate 32, and two first buffer units 33. After the IC device before the test is taken out from the storage unit 20 and a predetermined thermal stress is applied, It can be supplied to the test unit 30.

  As shown in FIG. 1, the first device transport apparatus 31 includes a support rail 311, a movable rail 312, a movable head 313, and a suction pad 314, and four IC devices are arranged in the XYZ axis direction. It is possible to move along. The first device transport apparatus 31 has an operation range including the supply tray stocker 21, the heat plate 32, and the first buffer unit 33.

  The support rail 311 is provided on the base 11 of the handler 10 along the Y-axis direction. The movable rail 312 is supported between the two support rails 311 so as to be movable along the Y-axis direction. The movable head 313 is provided on the movable rail 312 so as to be movable along the X-axis direction. The suction pad 314 is mounted downward on the movable head 313 and can be moved along the Z-axis direction by an actuator (not shown).

  The first device transport device 31 transports four IC devices at a time from the supply tray of the supply tray stocker 21 to the heat plate 32, and after a predetermined thermal stress is applied to the IC devices by the heat plate 32. Further, the IC device is moved from the heat plate 32 to the first buffer unit 33.

  The heat plate 32 is, for example, a metal plate having a heat source (not shown) in the lower part, and can apply a predetermined thermal stress to the IC device before the test. On the upper surface of the heat plate 32, a plurality of recesses 321 capable of accommodating IC devices are formed.

  As shown in FIG. 1, the first buffer unit 33 includes an actuator 331 and a movable head 332, and can move the IC device from the loader unit 30 region to the test unit 40 region. Yes.

  The actuator 331 is provided on the base 11 of the handler 10 so as to extend and contract along the X-axis direction. The movable head 332 is fixed to the tip of the drive shaft of the actuator 331. Four concave portions 333 that can accommodate IC devices are formed on the upper surface of the movable head 332.

  The first buffer unit 33 extends the actuator 331 when the four IC devices are dropped into the concave portions 333 of the movable head 332 by the first device transport device 31, and starts the test unit from the region of the loader unit 30. Four IC devices are moved to 40 areas at a time.

<Test unit 40>
The test unit 40 includes a device moving device 41 and four alignment devices 43. After the IC device before the test is accurately positioned with respect to the socket 71 using an image processing technique, the socket 71 of the test head 70 is used. It is possible to press the IC device onto the device.

  As shown in FIG. 2, a space 12 is formed below the test unit 40, the test head 70 is inserted into the space 12, and the test head 70 is positioned below the test unit 40.

  As shown in FIGS. 2 and 3, an opening 11 a is formed in the substrate 11 of the handler 10 in the test unit 40. In addition, four sockets 71 are mounted on the top of the test head 70. As shown in FIG. 4, each socket 71 includes a large number of contact pins 722 arranged so as to correspond to the input / output terminals of the IC device. A socket 71 mounted on the top of the test head 70 faces the inside of the handler 10 through the opening 11a.

  The device moving device 41 includes a support rail 411, a movable rail 412, and a movable head 413, and can move the IC device along the XYZ axis direction. The device moving device 41 has an operation range including the socket 71 and the alignment device 43 that face the handler 10 through the opening 11a.

  The support rail 411 is provided on the base 11 of the handler 10 along the Y-axis direction. The movable rail 412 is supported between the two support rails 411 so as to be movable along the Y-axis direction. The movable head 413 is supported by the movable rail 412 so as to be movable along the X-axis direction.

  As shown in FIG. 1, in this embodiment, two movable rails 412 are supported between two support rails 411 so as to be independently movable. Therefore, while one movable rail 412 moves to the alignment device 43 to align the position of the IC device, the other movable rail 412 can move onto the socket 71 to test the IC device. It has become.

  As shown in FIG. 5, the movable head 413 includes a socket camera 414, an actuator 415, and four contact arms 420. The four contact arms 420 are mounted downward on the movable head 413 so as to correspond to the arrangement of the four sockets 71 provided on the test head 70. In FIG. 5, only one contact arm 420 is shown for convenience, but actually, as shown in FIG. 1, the four contact arms 420 are arranged in a 2 × 2 array, and the tip of the drive shaft of the actuator 415. It is attached to.

  The socket camera 414 is, for example, a CCD camera fixed downward on the movable rail 412 via the camera support member 416, and can image the socket 71 of the test head 70. The socket camera 414 is used to recognize the position and posture of the socket 71.

  The actuator 415 is fixed to the movable rail 412 so that it can expand and contract along the Z-axis direction, and four contact arms 420 are attached to the tip of the drive shaft.

  Each contact arm 420 includes a fixed-side contact arm 421, a lock-and-free mechanism 422, and a grip-side contact arm 423.

  The fixed-side contact arm 421 is fixed at its upper end to the drive shaft of the actuator 415, and is connected to the grip-side contact arm 423 via the lock-and-free mechanism 422 at its lower end.

  Although not particularly shown, the lock-and-free mechanism 422 uses relative pressure to move the grip-side contact arm 423 relative to the stationary-side contact arm 421 along the XY plane and rotate it relative to the Z-axis. Can be constrained or unconstrained. The lock-and-free mechanism 422 also has a centering function for matching the central axis of the fixed contact arm 421 with the central axis of the gripping contact arm 423.

  The grip-side contact arm 423 is provided with a suction pad 424 for sucking and holding the IC device at the lower end thereof, and an annular contact member 425 so as to cover the periphery thereof.

  In addition, a heater 426 and a temperature sensor 427 are embedded in the gripping side contact arm 423. By detecting the temperature of the grip-side contact arm 423 with the temperature sensor 427, the temperature of the IC device is indirectly measured, and the heater 426 is turned on / off based on this measured value, whereby the heat plate 32 The applied thermal stress can be maintained.

  As shown in FIG. 5, the alignment apparatus 43 includes a stage 431, a mirror 433, and a device camera 434. By aligning the position and posture of the gripping contact arm 423 that is in contact with the stage 431, an IC is provided. It is possible to position the device with respect to the socket 71 with high accuracy. In this embodiment, corresponding to the fact that the device moving device 41 includes two movable heads 413, two sets of four alignment devices 43 are provided as shown in FIG.

  The stage 431 can be moved along the XY plane and rotated around the Z axis by a motor mechanism (not shown). Further, an opening 432 having an inner diameter through which an IC device can pass and an annular contact member 425 can contact is formed at a substantially central portion of the stage 431.

  When the grip-side contact arm 423 comes into contact with the stage 431 and the stage 431 moves when the lock-and-free mechanism 422 is unconstrained, the grip-side contact arm 423 follows the movement of the grip-side contact arm 423. The position of the IC device held by the contact arm 423 is aligned.

  The device camera 434 is, for example, a CCD camera installed horizontally along the XY plane, and images an IC device sucked and held by the gripping-side contact arm 423 through the mirror 433 and the opening 432 of the stage 431. It is possible. This device camera 434 is used every time before the test to position the IC device relative to the socket 71 before pressing the IC device against the socket 71.

  As shown in FIG. 6, the device camera 434 and the socket camera 414 described above are connected to the image processing device 44, and the captured image information can be transmitted to the image processing device 44.

  The image processing device 44 includes an image processing processor, ROM, RAM, and the like (not shown), performs image processing on image information captured by the device camera 434 when testing an IC device, and holds a grip-side contact arm. It is possible to recognize the position and posture of the IC device attracted and held at 423. Further, the image processing apparatus 44 calculates an alignment amount necessary for relatively matching the position and posture of the recognized IC device with the preset position and posture of the socket 71, and this alignment amount is calculated. 43 control devices 435. The control device 435 of the alignment device 43 controls the motor mechanism (not shown) of the alignment device 43 based on the alignment amount to align the position and posture of the IC device.

  Furthermore, the image processing apparatus 44 according to the present embodiment includes an extraction unit 441 that can perform image processing on image information captured by the cameras 414 and 434 and extract the position and orientation of the socket 71 and the IC device. The recognition unit 442 can recognize the relative position of the cameras 414 and 434 with respect to the socket 71 based on the extraction result of the extraction unit 441, and the socket 71 according to the amount of change in the temperature applied to the IC device. And a calculation unit 444 that calculates the amount of change in the relative position of the cameras 414 and 434. A calibration method performed when changing the type of IC device using the extraction unit 441, the recognition unit 442, and the calculation unit 443 will be described in detail later.

  It should be noted that reference calibration for setting a reference coordinate system used in common by the socket camera 414 and the device camera 434 may be performed when the electronic component testing apparatus 1 is installed or started up. This reference calibration is performed, for example, by imaging the gauge with the coordinate axes printed on a transparent board by the socket camera 414 and the device camera 434, respectively.

<Unloader unit 50>
As shown in FIG. 1, the unloader unit 50 includes two second buffer units 51 and a second device transport device 52, and carries out the tested IC devices from the test unit 40, and these IC devices. Can be moved to the storage unit 20 while sorting according to the test result.

  Similar to the first buffer unit 33, the second buffer unit 51 includes an actuator 511 and a movable head 512, and can move the IC device from the region of the test unit 40 to the region of the unloader unit 50. It has become.

  The actuator 511 is provided on the base 11 of the handler 10 so as to extend and contract along the X-axis direction. The movable head 512 is fixed to the tip of the drive shaft of the actuator 511. Four concave portions 513 that can accommodate IC devices are formed on the upper surface of the movable head 512.

  The second buffer unit 51 shortens the actuator 511 when the four IC devices are dropped into the respective concave portions 513 of the movable head 512 by the device moving device 41, so that the region of the unloader unit 50 is changed from the region of the test unit 40. 4 IC devices are moved at a time.

  Similar to the first device transport apparatus 31, the second device transport apparatus 52 includes a support rail 521, a movable rail 522, a movable head 523, and a suction pad 524, and four IC devices are XY— It can be moved along the Z-axis direction. The second device transport device 52 has an operation range including the second buffer unit 51 and the four sorting tray stockers 22.

  The support rail 521 is provided on the base 11 of the handler 10 along the Y-axis direction. The movable rail 522 is supported between the two support rails 521 so as to be movable along the Y-axis direction. The movable head 523 is provided on the movable rail 522 so as to be movable along the X-axis direction. The suction pad 524 is mounted downward on the movable head 523 and can be moved along the Z-axis direction by an actuator (not shown).

  The second device transport device 52 moves the tested IC device from the second buffer unit 51 to the classification tray of the classification tray stocker 22 according to the test result.

  Hereinafter, the method for aligning the positions of IC devices by the electronic component testing apparatus 1 according to the present embodiment will be outlined with reference to FIG.

  The IC device supplied from the storage unit 20 to the test unit 40 via the loader unit 30 is attracted and held by the contact arm 420 of the device moving device 41 and moved to the stage 431 of the alignment device 43. The device camera 434 images the IC device gripped by the grip-side contact arm 423 through the opening 432 in a state where the grip-side contact arm 423 is in contact with the stage 431, and the image information is image processing apparatus. (Step S200). The image processing device 44 performs image processing on the image information and calculates the position and orientation of the IC device (step S210).

  Next, the position and orientation of the IC device calculated in step S210 are compared with the position and orientation of the socket 71 recognized in advance (step S220). In this comparison, when the position and orientation of the IC device are relatively coincident with the position and orientation of socket 71 (YES in step S220), the alignment of the position and orientation of the IC device is completed.

  If the position and orientation of the IC device and the position and orientation of the socket 71 are not relatively matched in step S220 (NO in step S220), the image processing apparatus 44 sets the position and orientation of the IC device to the socket 71. An alignment amount that is relatively matched to the position and orientation is calculated (step S230).

  Next, the lock-and-free mechanism 422 unlocks the relative movement of the grip-side contact arm 423 with respect to the fixed-side contact arm 421 (step S240), and the stage 431 of the alignment device 43 moves the alignment amount. The grip-side contact arm 423 follows this moving operation, thereby aligning the position and posture of the IC device (step S250).

  Next, the image processing apparatus 44 compares the position and orientation of the IC device with the preset position and orientation of the socket 71 again (step S260), and if these do not relatively match (step S260). If NO in S260, the process returns to step S230 to calculate the necessary alignment amount.

  In the comparison in step S260, when the position and posture of the IC device and the position and posture of the socket relatively match (YES in step S260), the lock-and-free mechanism 422 causes the fixed-side contact arm 421 to move. The relative movement of the grip-side contact arm 423 with respect to is locked (step S270).

  When the above-described alignment processing of the position and orientation of the IC device is completed, the device moving device 41 moves the IC device to the socket 71 and presses the IC device against the socket 71, so that the contact between the input / output terminal of the IC device and the socket 71 is reached. The pin 72 is brought into electrical contact, and in this state, the tester 80 performs a test of the IC device via the cable 81 and the test head 70.

  Hereinafter, the calibration method according to the present embodiment will be described.

  First, the configuration of the calibration jig 60 used for the calibration will be described.

  The calibration jig 60 is a jig used for calibration for calibrating the relative position of the device camera 434 with respect to the socket 71 when the socket 71 is exchanged in accordance with the exchange of the type of IC device.

  As shown in FIGS. 8 and 9, the calibration jig 60 includes a base member 61 placed on a socket 71. Examples of the material constituting the base member 61 include a synthetic resin material having excellent heat resistance such as liquid crystal plastic (LCP).

  A large number of insertion holes 62 are formed in the base member 61. Each insertion hole 62 has an inner diameter that is approximately 10 μm larger than the outer diameter of the contact pin 72 of the socket 71, so that the contact pin 72 can be inserted. The many insertion holes 62 are arranged in the base member 61 so as to correspond to the arrangement of the contact pins 72 in the socket 71.

  In addition, when forming the insertion hole 62 in the base member 61, since the high coincidence with the contact pin 72 of the socket 71 is requested | required, the base member 61 is processed by the manufacturing process of the socket 71, and the insertion hole 62 is formed. It is preferable to form.

  Next, a calibration method according to the present embodiment will be described with reference to FIG.

  In the electronic component testing apparatus 1 according to this embodiment, since the heater 426 is embedded in the heat plate 32 and the contact arm 420 provided in the loader unit 30, a thermal stress of, for example, about room temperature to + 125 ° C. is applied to the IC device. In this state, the IC device can be tested. For this reason, thermal stress applied to the IC device may cause thermal expansion of mechanical elements of the electronic component test apparatus such as a contact arm, and an error may occur in the relative position of the cameras 414 and 434 with respect to the socket 71.

  Therefore, in the present embodiment, when changing the type of IC device, first, with the temperature applied to the IC device set to 25 ° C., calibration processing from steps S101 to S108 described below is performed, and the socket 71 is set. A relative position as a reference of the cameras 414 and 434 is set.

  In the calibration at the applied temperature of 25 ° C., first, the operator places the jig 60 on the socket 71 of the test head 70 (step S101). At this time, the contact pin 72 of the socket 71 is inserted into each insertion hole 62 of the jig 60, whereby the jig 60 is positioned with high accuracy with respect to the socket 71.

  Next, the device moving apparatus 41 moves the jig 60 from the socket 71 to the stage 431 of the alignment apparatus 43 (step S102), and the device camera 434 is cured in a state where the gripping side contact arm 423 is in contact with the stage 431. The tool 60 is imaged (step S103).

  Next, the device moving device 41 moves the socket camera 414 onto the socket 61 in a state where the jig 60 is not placed on the socket 71 (step S104), and the socket camera 414 images the socket 71 (step S105). ).

  The extraction unit 441 of the image processing apparatus 44 performs image processing on the image information captured by the device camera 44 in step S <b> 103, and based on the position and arrangement of the insertion holes 62 formed in the jig 60. Then, the position and orientation of the jig 60 in the image information are extracted. Based on this position and orientation, the recognition unit 442 recognizes the relative position and orientation of the device camera 434 with respect to the socket 71 (step S106).

  Next, the extraction unit 441 of the image processing device 44 performs image processing on the image information captured by the socket camera 414 in step S105, and based on the position and arrangement of each contact pin provided in the socket 71. Then, the position and orientation of the socket 71 in the image information are extracted. Based on this position and orientation, the recognition unit 442 recognizes the relative position and orientation of the socket camera 414 with respect to the socket 71 (step S107).

  Based on the relative position of the device camera 434 with respect to the socket 71 recognized in step S40, the position and orientation of the socket 71 used in step S220 and step S260 of FIG. 7 are set.

  Furthermore, in this embodiment, even in the state where the temperature applied to the IC device is set to 50 ° C., 75 ° C., 100 ° C., and 125 ° C., the calibration process of steps S101 to S107 is performed sequentially, The relative positions and postures of the cameras 414 and 434 with respect to the socket 71 are recognized (steps S110 to S140).

  Next, the calculation unit 443 of the image processing device 44 calculates the amount of change in the relative position of the cameras 414 and 434 relative to the socket 71 according to the amount of change in the temperature applied to the IC device based on the recognition results in steps S100 to S140. Calculation is performed (step S150).

  Specifically, the difference between the relative position recognized in steps S110 to S140 is calculated based on the relative position at the applied temperature 25 ° C. recognized in step S100, and the difference is determined according to the applied temperature. The amount of change in the relative position is calculated and stored.

  The calibration process is completed through the above steps S100 to S150. In the actual test, when the application temperature of the IC device is set to 25 ° C., the device moving device 41 and the alignment device are based on the relative positions of the cameras 414 and 434 with respect to the socket 71 recognized in step S100 in FIG. 43 is driven.

  On the other hand, when the application temperature of the IC device is changed to 50 ° C., 75 ° C., 100 ° C. or 125 ° C., the change amount of the relative position corresponding to the application temperature stored in the image processing device 44 is called. Based on the change amount, the position of the contact arm 420 and the alignment amount of the stage 431 are adjusted.

  Furthermore, when the application temperature of the IC device is set to 80 ° C., for example, the image processing apparatus 44 performs linear interpolation based on the change amount when the application temperature is 75 ° C. and the change amount when the application temperature is 100 ° C. Using this method, the change amount of the relative position when the applied temperature is set to 80 ° C. is calculated, and the position of the contact arm 420 and the alignment amount of the stage 431 are adjusted based on this change amount.

  As described above, in the present embodiment, the relative position of the device camera 434 with respect to the socket 71 is recognized based on the calibration jig 60 that is positioned with respect to the socket 71 using the contact pin 72 itself of the socket 71 as a reference. Calibration with high accuracy can be performed.

  In this embodiment, in addition to the relative position when the application temperature to the IC device is set to 25 ° C., calibration is performed by setting the application temperature to 50 ° C., 75 ° C., 100 ° C., and 125 ° C. Since the correction amount of the relative position according to the temperature change is calculated, the influence of thermal expansion can be reflected in the calibration, and more accurate calibration can be performed.

The embodiment described above is described in order to facilitate understanding of the present invention, and is not described in order to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

In the above-described embodiment, it has been described that the calibration is executed a plurality of times by changing the applied temperature each time the IC device type is changed. However, the present invention is not particularly limited to this. For example, when the electronic component testing apparatus 1 is installed or started, calibration is performed by setting the applied temperatures to 25 ° C., 50 ° C., 75 ° C., 100 ° C., and 125 ° C., and the amount of change in the relative position according to the temperature change In advance, it is possible to execute only calibration at an applied temperature of 25 ° C. when changing the type of IC device, thereby shortening the calibration time.

Further, in the above-described embodiment, a total of five patterns are set from 25 ° C. to 25 ° C. as the application temperature for calibration, but the present invention is not particularly limited to this. For example, a total of 11 patterns may be set in increments of 10 ° C. from 25 ° C. As the number of calibration patterns increases, the influence of thermal expansion can be accurately reflected in the calibration.

In the present embodiment, the application temperature of the IC device has been described as 25 ° C. to 125 ° C. However, the present invention is not particularly limited to this, and the present invention is also applied when a low temperature is applied to the IC device. Can do.

FIG. 1 is a plan view showing an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is an enlarged view of a portion III in FIG. FIG. 4 is a plan view of the socket as viewed from above. FIG. 5 is a schematic cross-sectional view of the contact arm and the alignment apparatus in the embodiment of the present invention. FIG. 6 is a block diagram showing the configuration of the image processing apparatus and its periphery in the embodiment of the present invention. FIG. 7 is a flowchart showing an IC device position alignment method according to an embodiment of the present invention. FIG. 8 is a plan view showing a calibration jig according to the embodiment of the present invention. 9 is a cross-sectional view taken along line IX-IX in FIG. FIG. 10 is a flowchart showing a calibration method according to the embodiment of the present invention. FIG. 11 is a partial plan view showing a state in which the calibration jig according to the embodiment of the present invention is placed on the socket. 12 is a cross-sectional view taken along line XII-XII in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 10 ... Handler 40 ... Test part 41 ... Device movement apparatus 414 ... Socket camera 420 ... Contact arm 43 ... Alignment apparatus 431 ... Stage 434 ... Device camera 44 ... Image processing apparatus 60 ... Calibration jig 61 ... Base member 62 ... Insertion hole 70 ... Test head 71 ... Socket 72 ... Contact pin

Claims (7)

A socket image pickup means for picking up an image of the socket; and a device image pickup means for picking up an electronic device under test. The positioning device positions the electronic device under test with respect to the socket by an alignment device, and the moving device moves the electronic device under test. Calibration method for calibrating the relative positions of the socket imaging means and the device imaging means with respect to the socket in an electronic component testing apparatus for testing the electronic device under test by bringing a component into electrical contact with the socket Because
A placing step for placing a jig in the socket;
A moving step in which the moving means moves the jig placed on the socket to the alignment means;
A first imaging step in which the device imaging means images the jig located on the alignment means in a state where the temperature applied to the electronic device under test is set to the first temperature;
A second imaging step in which the socket imaging means images the socket in a state where the temperature applied to the electronic device under test is set to a first temperature;
A first recognition step for recognizing a first relative position of the device imaging means with respect to the socket based on the image information imaged in the first step;
A second recognition step for recognizing a first relative position of the socket imaging means with respect to the socket based on the image information imaged in the second imaging step,
A calibration method for placing the jig on the socket while inserting a contact pin of the socket into an insertion hole formed on the jig in the placing step.   The calibration method according to claim 1, wherein the insertion hole is formed in the jig so as to correspond to an arrangement of contact pins of the socket. In a state in which the temperature applied to the electronic device under test is set to a second temperature different from the first temperature, the device imaging unit images the jig positioned in the alignment unit. Imaging step;
The third recognition step of recognizing a second relative position of the device imaging means with respect to the socket based on the image information imaged in the third imaging step. Calibration method.   Based on the first and second relative positions of the device imaging means with respect to the socket recognized in the first and third recognition steps, respectively, the temperature applied to the electronic device under test is set to the first and second 4. The calibration method according to claim 3, further comprising a first calculation step of calculating a third relative position of the device imaging unit with respect to the socket in a case where the third temperature different from the temperature of 2 is set. A fourth imaging step in which the socket imaging means images the socket in a state where the temperature applied to the electronic device under test is set to a second temperature different from the first temperature;
5. The fourth recognition step of recognizing a second relative position of the socket imaging unit with respect to the socket based on the image information captured in the fourth imaging step. The calibration method according to any one of the above.   Based on the first and second relative positions of the socket imaging means with respect to the socket recognized in the second and fourth recognition steps, respectively, the temperature applied to the electronic device under test is set to the first and second The calibration method according to claim 5, further comprising a second calculation step of calculating a third relative position of the socket imaging unit with respect to the socket when the temperature is set to a third temperature different from the second temperature. A socket image pickup means for picking up an image of the socket; and a device image pickup means for picking up an electronic device under test. The positioning device positions the electronic device under test with respect to the socket by an alignment device, and the moving device moves the electronic device under test. A calibration jig used for calibrating the relative position of the device imaging means with respect to the socket in an electronic component test apparatus for testing the electronic device under test by bringing a component into electrical contact with the socket. And
A base member mounted on the socket;
A calibration jig formed in the base member so that an insertion hole into which the contact pin of the socket can be inserted corresponds to the arrangement of the contact pins.

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