JP2001021617A - Method for carrying electronic part and its device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the simultaneous inspection of plural electronic parts by simplifying the constitution of a carrying device depending on the shape of electronic parts. SOLUTION: A wafer sheet to which electronic parts are attached like a matrix is held by a wafer frame 24, and this is supplied to a measuring part 1. The wafer fame 24 is image picked-up by cameras 6 and 7, and the position of each electronic part is calculated based on the pictures of the cameras. The wafer frame 24 is carried to a test station 4 by an xyzθ table 5. The table 5 is controlled so that the terminal of each electronic part can be brought into contact with a socket 11 based on the calculated position information of the electronic part. A classifying part 2 classifies and houses each electronic part on the wafer frame 24 according to the position information obtained by the measuring part 1 and the inspected result.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for transporting electronic components.

[0002]

2. Description of the Related Art Conventionally, there has been known a transfer device (handler) for automatically supplying electronic components such as ICs which have been assembled to a test system and automatically classifying and storing the electronic components based on test results. FIG. 9 is a plan view showing the configuration of such a transport device. Loading tray stocker 41
It houses a tray on which a number of ICs to be inspected are placed. The XY arm 42 lifts the two ICs on the tray by vacuum suction and transports them to the hot plate 43 or the feeding stage 44. XY arm 4
2 transports the IC onto a hot plate 43 provided with a heater for heating the IC when the IC is subjected to a high temperature test, and transports the IC onto a feeding stage 44 in other cases.

Subsequently, the XY arm 45 is connected to the IC on the hot plate 43 or the feeding stage 44.
Is lifted by vacuum suction, and the test carriers 46a, 46
c. Since the test carriers 46a and 46c are used alternately, the XY arm 45 carries the IC to the free test carrier. Next, the test head (not shown) vacuum-adsorbs and lifts the two ICs on the test carriers 46a and 46c, and
Convey up. An inspection device (not shown) performs an electrical inspection on the IC on the test station 47. After the completion of the inspection, the test head moves to the test carriers 46b,
The IC is transported to 6d.

Next, the XY arm 48 vacuum-adsorbs and lifts the two ICs on the test carriers 46b and 46d for which inspection has been completed, and sorts them by a sorting idle stage 49.
Convey up. IC Sorting Idol Stage 4
Once mounted on 9, the heated IC is now cooled. The XY arm 50 lifts the two ICs on the sorting idle stage 49 by vacuum suction and transports them onto a tray stored in the tray stocker 51. The above operation is repeated until there is no more IC on the tray stored in the loading tray stocker 41.

[0005]

As described above, in the transfer apparatus shown in FIG. 9, two ICs are inspected at the same time. However, in the transfer device of FIG. 9, since the individual ICs placed on the tray of the loading tray stocker 41 are transferred to the test station 47, if three or more simultaneous inspections are to be performed, the test station 47 In addition, the XY arms 42 and 45, the feeding stage 44, the test carriers 46a, 46b, 46c, and 46
It is necessary to change the design of d etc. and make mechanical adjustments,
There is a problem that it is difficult to cope with a plurality of simultaneous inspections. Such a problem becomes more serious as the number of simultaneous inspections increases. In addition, since there are many mechanisms that depend on the shape of the electronic component to be inspected for the same reason, there is a problem that when changing the component to be inspected, complicated parts replacement work and adjustment work are required. . SUMMARY An advantage of some aspects of the invention is to provide a method and a device for transporting an electronic component in which a configuration that depends on the shape of the electronic component is reduced and a simultaneous inspection of a plurality of electronic components can be easily performed. It is intended to provide a device.

[0006]

According to the present invention, there is provided a method for transporting electronic parts, wherein a wafer sheet (23) on which a plurality of electronic parts (20) are stuck in a matrix is held by a wafer frame (24). The measurement object is supplied to the measurement unit as an object to be measured, the object to be measured is imaged by a camera (6, 7), and the position of each electronic component in the object to be measured is calculated based on the image of the camera. Is transported to the test station (4), and the terminal (21) of each electronic component is brought into contact with the socket (11) for inspection based on the calculated position information of the electronic component. In the method for transporting electronic components according to the present invention, when the device under test after the inspection is classified by the classifying unit (2), each electronic component in the device under test is converted into each electronic component obtained by the measuring unit (1). They are classified and stored according to the position information of the parts and the inspection results.

Further, the electronic component conveying apparatus of the present invention is provided in the measuring section (1), and converts a wafer sheet (23) on which a plurality of electronic components (20) are attached in a matrix form into a wafer frame (24). Cameras (6, 7) for imaging the object to be measured held by the camera, a transport mechanism (5) for transporting the object to the test station (4) of the measuring section, and a camera in the object to be measured based on the image of the camera. A control device that calculates the position of each electronic component, and controls the transport mechanism so that the terminal (21) of each electronic component comes into contact with the socket (11) for inspection based on the calculated position information of the electronic component. (31)
And In addition, as one configuration example of the electronic component transport device of the present invention, when the classifying unit (2) classifies the device under test after the inspection, each of the electronic components in the device under test is classified by the measuring unit (1). The electronic components are classified and stored according to the obtained position information and the inspection results of the electronic components.

[0008]

Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1A is a plan view showing a configuration of a transport device according to an embodiment of the present invention.
1B is a front view of the transfer device in FIG. 1A, and FIG. 1C is a left side view of the transfer device in FIG. 1 is divided into a measuring unit 1 and a classification unit 2. Measuring unit 1
Includes an alignment station 3 for imaging electronic components to calculate the position of the electronic components and a test station 4 for inspecting the electronic components.

Here, electronic components to be transported, inspected, sorted and stored in this embodiment will be described.
In the present embodiment, a plurality of electronic components are supplied to a transfer device in a form called a wafer frame. FIG. 2A is a plan view of a wafer frame, and FIG. 2B is an enlarged plan view of an electronic component mounted on the wafer frame.

The electronic component in this embodiment is a CSP
(Chip Scale Package) type IC20. CS
The P package is a leadless type package in which an electrode pad 21 is formed on the back surface of a resin-sealed package, and is directly soldered to a mounting substrate by solder bumps formed on the electrode pad 21.

In order to manufacture such a CSP type IC 20, a semiconductor wafer is divided into individual chips (dicing), and a plurality of cut chips are mounted on a lead frame (die bonding) as in a normal package. After the electrodes of the chip and the lead frame are connected by wires (wire bonding), they are sealed with resin (molding).

Subsequently, portions of the lead frame other than the electrode pads on the back surface of the package are removed by etching.
In this state, the packages are connected by the mold resin. The plate 22a has a plurality of ICs 20 manufactured in the above-described steps arranged in a matrix, and the plates 22b and 22c have the same configuration.

The plates 22a, 22b, 22c are
It is attached to a wafer sheet 23 made of an adhesive resin tape. At this time, the plates 22a, 22b,
All the ICs 20 in 22c are attached to the sheet 23 such that the surface facing the electrode pad 21 is in contact with the wafer sheet 23 and the electrode pad 21 is exposed on the upper surface. Then, the wafer sheet 23 is held by the ring-shaped wafer frame 24. This wafer frame 24
Are provided with notches 25a and 25b for positioning.

After the plates 22a, 22b and 22c are attached to the wafer sheet 23, dicing grooves are formed in the mold resin, and the plates 22a, 22b and 22c are divided into individual ICs 20. Thereby, the plate 22
Each of the ICs 20 a, 22 b, and 22 c is in a state of being attached and fixed in a matrix by the wafer sheet 23. The wafer frame 24 is supplied to the transfer device in the form described above.

The measuring section 1 includes an XYZθ table 5 as a transfer mechanism for mounting the wafer frame 24 and transferring it to the test station 4, cameras 6 and 7 installed downward above the alignment station 3, and an XYZ
the camera 8 mounted on the θ table 5 upward,
When the YZθ table 5 is at a predetermined load / unload position, a bar code reader 9 installed to be able to read the bar code of the wafer frame 24 on the table 5 and an upper part of the test station 4 are provided. And a test head 10.

The XYZθ table 5 is arranged in the horizontal direction (X,-
X direction), longitudinal direction (Y, -Y direction), vertical direction (Z,
−Z direction), and can rotate in θ and −θ directions about a central axis along the Z direction.
The camera 8 moves in the left-right direction and the front-back direction according to the movement of the XYZθ table 5.

Below the test head 10, two sockets 11 for obtaining electrical connection between the IC 20 and an inspection device (not shown) are provided. Although parts of the housing are omitted in FIG. 1 for easy reading, the cameras 6 and 7, the barcode reader 9, and the test head 10 are fixed to the housing of the measurement unit.

On the other hand, the classification unit 2 includes a wafer frame 24
A XY table 13 that is movable in the left-right direction and the front-rear direction and has a suction mechanism for a wafer frame 24; a push-up pin 14 that peels off the IC 20 from the wafer sheet 23 for classifying and storing the IC 20; I
X which is a pickup mechanism for sorting and storing C20
And a Y arm 15.

The push-up pin 14 is attached to the center of the XY table 13 and can move up and down. There is an opening in the center of the XY table 13,
The push-up pin 14 rises through this opening, and
The wafer sheet 23 holding one IC 20 located at the center of the table 13 is cut. As a result, the IC 20 can be taken out of the wafer frame 24.

Next, the operation of the transfer device according to the present embodiment will be described. FIG. 3 is a block diagram of a control device for controlling the transfer device of the present embodiment, and FIG. 4 is a flowchart for explaining the operation of the transfer device. First, the control device 31
Performs calibration of the transfer device (step 1).
01). At the time of calibration, a jig (not shown) having a mark for positioning is attached to the XYZθ table 5. This mark is located above the camera 8 and can be picked up by the camera 8.
It is also possible to image from.

The controller 31 moves the XYZθ table 5 so that the positioning jig is located directly below the camera 6. The camera 6 images the jig mounted on the table 5, and image data obtained by the camera 6 is sent to the control device 31. Similarly, the camera 8 captures an image of the jig mounted on the table 5, and image data obtained by the camera 8 is sent to the control device 31.

Subsequently, the control device 31 moves the XYZθ table 5 so that the positioning jig is located directly below the camera 7. The camera 7 images the jig mounted on the table 5, and image data obtained by the camera 7 is sent to the control device 31.

The images taken by the cameras 6 to 8 include the above-described positioning marks. Therefore, when each image data obtained by the cameras 6 to 8 is subjected to image processing to calculate mark coordinates in each image,
The positional relationship between the cameras can be obtained from the mark coordinates and the table movement amount at the time of imaging. When calculating coordinates using the images of the cameras 6 to 8 in the subsequent processing,
The control device 31 corrects the coordinate values based on the positional relationship obtained here. After imaging by the cameras 6 to 8, the positioning jig is removed from the table 5.

Next, the control device 31 controls the test head 10
The XYZθ table 5 is moved so that the socket 11 provided on the camera 8 is located directly above the camera 8. Camera 8
An image of the socket 10 is taken, and image data obtained by the camera 8 is sent to the control device 31.

The control device 31 performs image processing on the image data obtained by the camera 8 to determine the X and Y coordinates of the socket 11. Accordingly, the amount of displacement of the socket 11 with respect to a preset position can be obtained. The control device 31 can contact the electrode pad 21 of the IC 20 with the socket 11 in an inspection described later.
Can be controlled in consideration of the amount of positional deviation of.

After the calibration is completed, the control device 31
Moves the XYZθ table 5 to the load / unload position (step 102). Next, the operator
The wafer frame 24 is placed on the YZθ table 5 (step 103). At this time, the operator operates the wafer frame 2 so that the notches 25a and 25b of the wafer frame 24 and the pins provided on the table 5 bite each other.
4 is placed.

When the wafer frame 24 is placed on the XYZθ table 5, the control device 31 reads the barcode affixed to the wafer frame 24 with the barcode reader 9 (step 104). This barcode
An ID code unique to each wafer frame is shown.
The control device 31 uses this ID code as an identification number of the wafer frame 24 for information management.

The controller 31 controls the XYZθ table 5 to attract the wafer sheet 23 and the wafer frame 24, and then moves the XYZθ table 5 to the alignment station 3 (step 105). At this time, the notch 25a provided in the wafer frame 24 is located below the camera 6, and the camera 6 captures an image of the notch 25a. Subsequently, the control device 31 moves the XYZθ table 5 by a predetermined amount in the X direction. At this time, the notch 25b provided in the wafer frame 24 is located below the camera 6, and the camera 6 captures an image of the notch 25b.

The control device 31 performs image processing on the image data obtained by the camera 6 to obtain the X and Y coordinates of the notches 25a and 25b (step 106). This allows
It is possible to obtain the amount of positional deviation of the notches 25a and 25b with respect to a preset position, that is, the amount of positional deviation of the wafer frame 24, and correct an error in the frame position.

Next, the control device 31 performs an alignment process (step 107). FIG. 5 is a flowchart for explaining the alignment processing. First, the control device 31 moves the XYZθ table 5 so that the upper right apex and the lower right apex of the plate 22a are located below the cameras 6 and 7, respectively (step 201).

The cameras 6 and 7 each have a plate 22a.
The upper right vertex and lower right vertex of are imaged. The control device 31 performs image processing on the image data obtained by the camera 6, extracts the electrode pad 21 of the IC 20 located at the upper right vertex of the plate 22a, and obtains the X and Y coordinates of the center of the IC 20. This coordinate is defined as the coordinate of the upper right vertex of the plate 22a. Further, the control device 31 performs image processing on the image data obtained by the camera 7 to extract the electrode pads 21 of the IC 20 located at the lower right vertex of the plate 22a,
The X and Y coordinates of the center of 20 are obtained. The coordinates are set as the coordinates of the lower right vertex of the plate 22a (Step 202).

Subsequently, the control device 31 controls the plate 22a.
After moving the XYZθ table 5 such that the upper left vertex and lower left vertex of the plate 22 are located below the cameras 6 and 7, respectively, the coordinates of the upper left vertex and lower left vertex of the plate 22a are obtained in the same manner as described above (step 203). Next, the control device 31
After moving the XYZθ table 5 so that the upper right vertex and the lower right vertex of the plate 22b are located below the cameras 6 and 7, respectively, the coordinates of the upper right vertex and the lower right vertex of the plate 22b are obtained (step 204). Then, the control device 31 moves the XYZθ table 5 so that the upper left vertex and the lower left vertex of the plate 22b are located below the cameras 6 and 7, respectively, and then obtains the coordinates of the upper left vertex and the lower left vertex of the plate 22b (step). 205).

In the same manner, the controller 31 calculates the coordinates of the upper right vertex and the lower right vertex of the plate 22c (step 206), and calculates the coordinates of the upper left vertex and the lower left vertex of the plate 22c (step 207). The control device 31 stores the calculated vertex coordinates of the plates 22a, 22b, and 22c, and ends the alignment processing.

Next, the controller 31 moves the XYZθ table 5 to the test station 4 (step 1).
08), an inspection process is performed (step 109). FIG.
FIG. 7 is a flowchart for explaining the inspection process.
It is a perspective view showing a situation of inspection processing. In FIG. 7, 1
7a and 17b are pins that engage with the notches 25a and 25b, respectively.

First, the control device 31 moves the XYZθ table 5 so that the IC 20 in the plate 22a to be inspected is located immediately below the socket 11 (step 301). In the inspection of the IC 20, the electrode pad 21
And the socket 11 need to be in accurate contact,
The angle correction in the θ or -θ direction by the XYZ θ table 5 is also performed.

The position of the IC 20 to be inspected can be calculated from the coordinates of each vertex of the plate 22a obtained by the alignment process and the number of ICs 20 in the plate 22a, ie, the number in the X direction and the number in the Y direction. . In the present embodiment, since two sockets 11 are provided, the number of ICs 20 to be inspected is also two.

Subsequently, the controller 31 raises the XYZθ table 5 to the measured height (moves in the Z direction),
Electrode pad 21 and socket 1 of IC 20 to be inspected
1 (step 302). Control device 31
Instructs the inspection device 32 to start the inspection, and the inspection device 32 electrically connected to the IC 20 to be inspected via the socket 11 performs an electrical inspection on the two ICs 20 (step 303).

After the inspection, the control device 31 lowers the XYZθ table 5 (moves in the −Z direction) (step 3).
04). Then, the control device 31 determines whether or not a plurality of inspections are specified (step 305). If the plurality of inspections is specified, the controller 31 repeats the operations of steps 302 to 304 by the specified number of times. repeat.

Next, the control device 31 controls the I
It is determined whether the C20 remains on the plate 22a (step 306). If the IC20 to be inspected remains, the IC20 to be inspected is positioned just below the socket 11 as in step 301. XYZ
The θ table 5 is moved (step 307). The control device 31 repeats the operations of steps 302 to 307 until all the ICs 20 on the plate 22a have been inspected.

In step 306, the control device 31
When the inspection of all the ICs 20 on the plate 22a is completed and it is determined that the IC 20 to be inspected does not remain in the plate 22a, it is next determined whether or not the plate to be inspected remains (step 308). When the plate to be inspected remains, the control device 31 returns to the next plate 22 to be inspected as in step 301.
X so that the IC 20 of FIG.
The YZθ table 5 is moved (step 309).

The control device 31 repeats the operations of steps 302 to 307 until all the ICs 20 on the plate 22b have been inspected, and likewise repeats all the I / O operations on the plate 22c.
Inspect C20. Thus, the inspection processing ends.
The control device 31 stores the inspection result of each IC 20 of the plates 22a, 22b, 22c for each IC. When a plurality of inspections are performed, only the final inspection result is stored.

Next, the controller 31 moves the XYZθ table 5 to the load / unload position, and releases the suction of the wafer sheet 23 and the wafer frame 24 (step 110). After the inspection in the measuring section 1, the wafer frame 24 is transported to the separating section 2 (step 11).
1). When the wafer frame 24 is supplied to the holding mechanism 12, the control device 31 controls the holding mechanism 12 to clamp and hold the wafer frame 24 (step 11).
2).

At this time, the wafer frame 24 is held so that the notches 25a and 25b and the pins provided on the holding mechanism 12 bite each other, so that the wafer frame 24 is fixed at a predetermined position. The control device 31 moves the XY table 13 to the pickup position (the position immediately below the wafer frame 24 held by the holding mechanism 12) (step 113).

Next, the control device 31 performs a classification process (step 114). FIG. 8 is a flowchart for explaining the classification processing. First, the control device 31 determines the center of the XY table 13, that is, the push-up pin 14 according to the coordinates of each IC 20 obtained by the measurement unit 1 and the inspection result.
The XY table 13 is moved so that is positioned directly below the non-defective IC 20 of the wafer frame 24, and the XY arm 15 is moved so that the suction nozzle of the XY arm 15 is positioned directly above this non-defective IC 20 (step 40).
1).

Subsequently, the control device 31 operates the XY table 1
3 is controlled to suck the wafer sheet 23 (step 402). Next, the control device 31 sets the XY arm 15
Then, the suction nozzle is moved down to contact the non-defective IC 20 (step 403).

Good product I by suction nozzle of XY arm 15
After confirming the adsorption of C20, the control device 31 sets the push-up pin 1
4 is raised (step 404). As a result, the non-defective IC 20 is easily separated from the wafer sheet 23 connected to the surrounding ICs, and the non-defective IC 20 is separated from the surroundings.

Then, the control device 31 controls the XY arm 15
After raising the suction nozzle (step 405), the push-up pin 14 is lowered (step 406), and the suction of the wafer sheet 23 by the XY table 13 is stopped (step 407). Next, the control device 31
The suction nozzle of the XY arm 15 that holds the suction 20 is moved to the release position on the tray 16 (step 4).
08).

The controller 31 lowers the suction nozzle of the XY arm 15 (step 409), and after confirming the lowering of the XY arm 15, stops the vacuum suction (step 410).
Subsequently, the suction nozzle of the XY arm 15 is raised (Step 411). Thus, the non-defective IC 20 is placed on the tray 16.

Next, the control device 31 moves the XY arm 15 to a predetermined idle position (step 412).
Then, control device 31 determines whether or not non-defective IC 20 remains on wafer frame 24 (step 4).
13) If the non-defective IC 20 remains, step 4
01 to 412 are performed.

In this way, the non-defective ICs 20 on the wafer frame 24 are sequentially conveyed to empty places on the tray 16, and the classification process ends when no non-defective ICs 20 are left on the wafer frame 24. Finally, the control device 31
Controls the holding mechanism 12 to release the fixing of the wafer frame 24 (step 115).

As described above, in the present invention, a wafer sheet 23 on which a plurality of electronic components (ICs 20) are stuck in a matrix is held by a wafer frame 24 of a predetermined shape and supplied to a transfer device as a measured object. I do.
Therefore, the mechanism that depends on the shape of the electronic component is only the socket 11 in the measuring unit 1 and only the push-up pin 14 and the XY arm 15 in the classifying unit 2, making it easier to replace parts and adjust the machine when changing the parts to be inspected than before. Becomes

When changing the number of simultaneous inspections,
What is necessary is just to change the data of the socket 11 and the control device 31 according to the number, and the simultaneous inspection of a plurality of electronic components can be easily performed. Further, since it is only necessary to attach the matrix-shaped electronic components supplied from the manufacturer to the wafer sheet 23, there is no need to arrange the electronic components on the tray of the loading tray stocker 41 as in the transfer device of FIG. Can be improved.

Further, since the electronic components are attached to the wafer sheet 23 and transported to the test station 4, no transport failure occurs in the measuring section 1, and the transport is difficult with a conventional transport device such as TSSOP. It can handle very small parts. In addition, since the electronic component is attached to the wafer sheet 23, the amount of displacement of the electronic component generated during the transport period between the measuring unit 1 and the classifying unit 2 is reduced to a negligible error amount for the classifying unit 2. It stops (the positioning accuracy in the classification unit 2 may be lower than the positioning accuracy in the measurement unit 1).

Therefore, the position information of each electronic component obtained by the measuring unit 1 can be used, and there is no need to install a camera for obtaining position information in the classifying unit 2. Does not need to be newly calculated. In the present embodiment, a CSP type IC has been described as an example of an electronic component. However, the present invention is not limited to this, and it goes without saying that other electronic components may be used.

In this embodiment, the measuring unit 1 and the classifying unit 2 are integrated, and the wafer frame 24 that has been inspected by the measuring unit 1 is automatically transported by the transport mechanism. Since it takes time to classify, it does not take much time. Therefore, the measuring unit 1 and the classifying unit 2 may be provided separately.
4 may be transported by the operator.

When the measuring unit 1 and the classifying unit 2 are separate units, the control unit 31 of the measuring unit uses the position information of each electronic component (the coordinates of each vertex of the plate and the number of electronic components in the X and Y directions in the plate). Or the coordinates of all electronic components) and the inspection result may be sent to the classifying unit 2 together with the ID code of the wafer frame 24. The control unit of the classifying unit 2 converts the ID code of the wafer frame 24 supplied to the holding mechanism 12 into The data from the measurement unit 1 corresponding to the ID code read by the bar code reader may be used for the classification process.

[0057]

According to the present invention, a wafer sheet having a plurality of electronic components attached in a matrix and held by a wafer frame is supplied as an object to be measured to a measuring section, so that the shape of the electronic component is improved. Since the number of dependent mechanisms can be reduced as compared with the related art, parts replacement and machine adjustment according to the change of the inspection target part are easier than before. When the number of simultaneous inspections is changed, the socket may be changed in accordance with the number, so that simultaneous inspection of a plurality of electronic components can be easily performed. Further, since it is only necessary to attach the matrix-shaped electronic components supplied from the manufacturer to the wafer sheet, there is no need to arrange the electronic components on the tray of the loading tray stocker as in the related art, and the workability can be improved. . In addition, since the electronic components are attached to the wafer sheet and transported to the test station, transport failure does not occur in the measurement unit, and it is possible to cope with extremely small components that were difficult to transport with the conventional transport device. .

Further, when the device under test after the inspection is classified by the classifying unit, each electronic component in the device under test is classified and stored according to the position information of each electronic component obtained by the measuring unit and the inspection result. There is no need to install a camera for acquiring position information in the classifying unit, and it is not necessary for the classifying unit to newly calculate the position of each electronic component.

[Brief description of the drawings]

FIG. 1 is a plan view, a front view, and a left side view illustrating a configuration of a transport device according to an embodiment of the present invention.

FIG. 2 is a plan view of a wafer frame and an enlarged plan view of an electronic component mounted on the wafer frame.

FIG. 3 is a block diagram of a control device that controls the transport device of FIG. 1;

FIG. 4 is a flowchart for explaining the operation of the transport device of FIG. 1;

FIG. 5 is a flowchart for explaining an alignment process.

FIG. 6 is a flowchart for explaining an inspection process.

FIG. 7 is a perspective view showing an inspection process.

FIG. 8 is a flowchart illustrating a classification process.

FIG. 9 is a plan view showing a configuration of a conventional transport device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Measurement part, 2 ... Classification part, 3 ... Alignment station, 4 ... Test station, 5 ... XYZθ table,
6, 7, 8 ... camera, 9 ... barcode reader, 10 ... test head, 11 ... socket, 12 ... holding mechanism, 13 ...
XY table, 14 push-up pin, 15 XY arm, 16 tray, 20 IC, 21 electrode pad, 2
2a, 22b, 22c: plate, 23: wafer sheet, 24: wafer frame, 25a, 25b: notch, 31: control device, 32: inspection device.

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 2G003 AA07 AF05 AG01 AG11 AG16 4M106 AA01 AA02 AA04 BA14 CA50 DH03 DH11 DJ02 DJ07 DJ11 DJ38 DJ40

Claims (4)

[Claims] 1. A method for transporting electronic components, wherein the electronic components are transported to a test station of a measuring unit, and after the inspection is completed, the electronic components are classified and stored in a classification unit, wherein a plurality of electronic components are attached in a matrix. The wafer sheet held by the wafer frame is supplied to the measuring section as the object to be measured, the object to be measured is imaged by a camera, and the position of each electronic component in the object to be measured is calculated based on the image of the camera. And transporting the device under test to a test station, and bringing a terminal of each electronic component into contact with a socket for inspection based on the calculated position information of the electronic component. 2. The method for transporting electronic components according to claim 1, wherein when the device under test after the inspection is classified by the classifying unit, each electronic component in the device under test is obtained by the measuring unit. A method of transporting electronic components, wherein the electronic components are sorted and stored according to the position information and the inspection result. 3. A transporting device for electronic components, comprising: a measuring unit for inspecting electronic components; and a classifying unit for classifying and storing the electronic components, wherein the conveying unit is provided in the measuring unit, and a plurality of electronic components are attached in a matrix. A camera that images the DUT holding the attached wafer sheet by a wafer frame, a transport mechanism that transports the DUT to the test station in the measurement unit, and individual electronic devices in the DUT based on the camera images A control device that calculates a position of the component, and controls the transport mechanism so that a terminal of each electronic component comes into contact with a socket for inspection based on the calculated position information of the electronic component. Parts transfer device. 4. The electronic component carrier according to claim 3, wherein the classifying unit classifies the device under test after the inspection is completed.
An electronic component transport device, wherein each electronic component in a device under test is classified and stored according to position information and an inspection result of each electronic component obtained by a measuring unit.