JPH03163364A - Device testing apparatus - Google Patents

Abstract

PURPOSE:To avoid the deviation of the contact position with a contact surface and to make it possible to perform highly reliable tests in a short time by providing a constitution wherein each tip part of a plurality of probes is directed toward the contact surface of a device under test substantially vertically. CONSTITUTION:A probe card 27 has a probe holder 26 for holding a plurality of probes 29 and a board 27a for fixing the holder. The holder 26 is constituted of a fixing plate 26a for fixing the probe 29, a supporting plate 26b for preventing the deflection in the lateral direction and a stopper plate 26c for preventing the downward deviation. Thus, the longitudinal probe 29 can be held approximately vertically with respect to a contact surface (each pad 3b of each IC chip 3a). The probe 29 is constituted of, e.g. a tip part 29a made of BeCu, a cylindrical case 29b made of stainless steel on which gold is plated, a post part 29c and a spring 31 which imparts specified contact pressure when the tip part 29a comes to contact with the pad 3b. In this way, all the probes 29 are vertically directed to the pads 3b and brought into contact with the specified contact pressure.

Description

[Detailed description of the invention] stomach. Industrial applications The present invention relates to an element testing device.

B. Prior art In general, I C (Integrated (:irc)
Before separating the wafer by the scribing process in the assembly process of the wafer, a wafer inspection process is performed to detect defective products by electrically testing each IC chip formed on the wafer. This usually mainly consists of a device called a prober, which has a probe card equipped with a number of probes (styles for making electrical contact with each pad of each IC chip), and a high-speed device called an IC tester. The test system consists of automatic measurement equipment and That is, an IC tester sends a predetermined signal to each pad (input pad) of the IC chip through the probe, and the result is measured by the IC tester through a probe that is in contact with the output pad, thereby determining whether each IC chip is good or defective. It is sorted by. This selection is performed by marking defective products with magnetic ink or the like.

An example of the above-mentioned prober will be explained with reference to FIGS. 21 and 25. However, in Fig. 21, XX l − in Fig. 25
FIG. 25 is a schematic sectional view of the main part taken along line XX I, and a top view of the entire prober.

The prober 1 includes a supply cassette 2 for supplying the wafer 3 to be tested, a storage cassette 14 for storing the wafer 3 to be tested, a realignment stage 5 for mechanically aligning the wafer 3 in advance, and a wafer 3. Bernoulli chucks 7 and 12 for sucking up wafers and moving them to predetermined positions, and suction for sucking wafers 3 carried by the Bernoulli chucks 7 at predetermined positions and moving them to a blobbing (test operation) area 9. It mainly consists of a chuck 47 (see FIG. 21) having a stage (not shown), and a probe card 17 having a large number of blow needles 19 attached to the head stage 10 and used for predetermined probing.

In the figure, reference numeral 4 is a belt for moving the wafer 3, 6 is a loading side, 8 is a displacement sensor for measuring the shape of the wafer, 11 is an unloading side, and 15 is an accurate probe operation. 16 is an optical unit of a fine alignment device for performing fine alignment of the wafer 3 (alignment that accurately aligns the chips 3a on the wafer 3 with reference to the X and Y axes); Arrows A1 to A7 each indicate the direction in which the wafer 3 moves.

During probe operation, as shown in FIG. 21, the chuck 47 is configured to operate in multiple directions in the X and Y directions (horizontal direction) and in two directions (vertical direction), and the microscope is inserted through the opening 18 of the probe card 17. 15, make fine adjustments in the horizontal direction while raising the chuck 47, and electrically apply each probe 19 to each pad (not shown in FIG. 21') of the IC chip 3a with a predetermined pressing force. bring into contact.

Next, the problems of the above-mentioned prober 1 are explained in FIGS. 21 to 24.
This will be explained in the figure.

That is, in the example described above, when performing the probe operation, the operation must be performed while being monitored through the opening 18 of the probe card 17 using the microscope 15.
As shown in FIG. 1, the probe needle 19 provided on the probe card 17 must be placed at a predetermined angle (in a diagonal direction) with respect to the IC chip 3a (that is, the probe needle 19 provided on the probe card 17 must be placed at a predetermined angle (in a diagonal direction).
The layout must allow for monitoring of probe operation. ). Therefore, the tip 19 is usually
As shown in FIG. 22A, the blow needle 19, whose part a is bent almost into a dogleg shape and becomes slightly thinner toward the tip, is inevitably bent when coming into contact with the pad 3b, as shown in FIG. 22A. A force is applied in the direction of arrow F (horizontal direction), and due to friction with the butt 3b, the tip 19a is scraped as shown in Figure 22.

Therefore, the length and diameter of the tip 19a of the blow needle 19 fluctuate, which tends to cause misalignment and damage. As a result, in the subsequent guising process, water (moisture) is likely to enter the damaged portion of the insulating film, causing a serious problem of damaging internal circuit elements. Furthermore, although tungsten is normally used for the probe 19, tungsten is a material that is relatively weak against friction, and it is impossible to prevent the tip portion 19a from being reduced.

Here, as shown in FIG.
The angle with respect to the contact surface of the tip 19a of is to ==I
It is expressed as ll1・cosθ. However, t0 in the figure
The horizontal position (original position) t1 with respect to the contact surface before the tip portion 19a is reduced is the horizontal position with respect to the contact surface when the length of the tip portion 19a is reduced by l.

That is, as the above equation shows, as l7 becomes larger, the interval between t0 and t7 becomes larger, and the positional deviation becomes larger. Further, since the tip portion 19a of the blow needle 19 is shaped so as to become somewhat thinner toward the tip, the diameter φ increases as l, becomes larger.

1. FIG. 24 is a schematic plan view for explaining that using the prober 1 in the above-described example, it is not possible to bring the probe needles 19 into contact with the pads 3b of a large number of IC chips 3a at the same time.

C. OBJECTS OF THE INVENTION It is an object of the present invention to
It is an object of the present invention to provide an element testing device that can perform highly reliable testing by eliminating misalignment of a chip with respect to a pad surface.

two. The principle of the invention, that is, the present invention has a plurality of contacts that are electrically contacted via respective tips at predetermined locations of an element to be tested,
The element is configured to be tested by applying a signal to the plurality of contacts after the contact, wherein at least each of the tips of all of the plurality of contacts is substantially against the contact surface of the element. This relates to a device testing device that is oriented so that it is oriented perpendicular to the surface of the device.

Note that the above-mentioned "substantially perpendicular" ideally means 90', but also includes an error range of, for example, 90'±5''.

Ho. Example Examples of the present invention will be described below.

1 to 11 show a first embodiment of the present invention.

The overall system of the wafer testing apparatus according to this example is almost the same as the above-mentioned example, so the explanation will be omitted, but the notable difference is that the probe card 17 in the above-mentioned prober 1 is replaced with the pad 3b of the rc chip 3a. It uses a probe card with a plurality of probes all oriented perpendicular to the plane.

That is, to explain the probe card 27 according to this example, as shown in FIGS. 1 and 2, it mainly includes a holder 26 for fixing and holding two plurality of vertically oriented probes, and this holder. 26 is fixed and a board 27a on which predetermined printed wiring has been applied, and the power supply Vcc and ground side Vss connected to the IC tester 3o side, which will be described later, during testing, and the corresponding probes 29 are connected to each other. Relays for on/off (RL1 to RL1
6) and a relay board 23 to which predetermined printed wiring is attached. However, in this example, 16 chips (IC chips 3a formed on the wafer 3)
Since the probe 29 is configured to be able to measure 16 pads at the same time, for example, if the number of pads per I chip is 2L, the total number of probes 29 is 336, and the relays are also connected to the power supply side V cc per chip. A total of 32 relays are required for the combination of the ground side V ss and the ground side V ss, but for convenience of explanation, in Figures 1 to 3, the ground side V ss relays RLI to R
Only L16 is shown, and the relay on the power supply side Von is omitted from the illustration (the relay on the power supply side 2) can be constructed in the same way by using the same relays RL1 to RL16 on the ground side Vss. ).

Here, the reference numeral 21 in the figure is a coaxial cable (75Ω), which is directly soldered to the later-described boss portion 29c of each blower 29, and furthermore, predetermined wiring is provided on the board 27a, and from the board 27a, As shown in FIGS. 5 and 8, which will be described later, it is connected to a tester 3o by predetermined wiring. In addition, numeral 22 is a cable holding plate;
24 is a fixing base for fixing the relay board 23 on the board 27a, and 25 is a fixing base for fixing the relay board 23 on the board 27a.
The opening for attaching to a, C is ■. 5 and 8). In addition, in this example, as shown in FIGS. 1 to 3, the probe card 27
The predetermined wiring on the board 27a of ■. side and V s
This is done separately on the s side.

As shown in Figs. ．． 26b and three stopper plates to prevent the probe 29 from shifting downward, which allows the probe 2 to be very thin and vertically long.
9 can be held respectively. The probe 29 is made of BeCu, for example, and consists of a 21 dollar part (tip part) 29a (two cylindrical parts with different diameters, and the part with the smaller diameter on the contact side has a rounded tip. ,Also,
The end of the larger diameter portion on the opposite side is shaped like a triangular pyramid. ), for example, a cylindrical case 29b made of stainless steel with gold plating applied to the entire surface, and a post part 29C made of, for example, BeCu (consisting of two cylindrical parts with different diameters, each with its opposite ends). ) and a 21-dollar part 29a housed in a case 29b.
Each spring 31 is made of, for example, SWP, which is commonly called piano wire, and is shaped so as to obtain a predetermined contact pressure when it comes into contact with the pad 3b of the IC chip 3a.

In this example, as shown in FIGS. 5 and 6, pads 3b are provided on the two shorter sides of each rectangular chip 3a, and a total of 2 rows and 8 columns on the wafer 3 are provided. A plurality of probes 29 are attached to the probe holder 26 of the probe card 27 so as to simultaneously contact each pad 3b of 16 chips (CHIP1 to CHIP16) (contact so that they are all oriented perpendicular to the surface of the pads 3b).
2 is a schematic block diagram showing the connection relationship between the lobe 29 and the tester 30. FIG. Also, Figure 9 shows the relay RLI for Vss.
Connection circuit diagram of RL8 (or RL9 to RL16), 1st
0 is a diagram showing a connection wiring pattern on the relay board 23 (that is, a diagram for displaying the connection circuit diagram shown in FIG. 9 as a wiring pattern on the relay board 23),
FIG. 11 is an external view of the switching relays RL1 to RL16 on the Vss side used in this example (in this example, the coil voltage is 5V, the movable contact type is manufactured by Sanko Kogyo Co., Ltd.)
S-105N is used. ). Here, in this example, the explanation of the switching relays RL21 to RL36 on the Voo side is omitted, but they are arranged in the same way as the relay circuits for switching on the Vss side shown in FIGS. 9 to 11 described above. This makes it easy to connect the switching relay circuit on the Voo side (
(See Figures 5 and 8) can be realized. However, VDD
In the side relay circuit, G in the circuit diagram shown in Fig.
The ND line becomes a VDD line to which a predetermined voltage is applied from the tester 30.

During the test, as in the above example, as shown in FIG.
As shown in the figure, each pad 3 on a predetermined IC chip 3a
b, and are brought into contact with the pads 3b, respectively, while maintaining a predetermined contact pressure by the spring 31.

Then, a predetermined signal is sent from the tester 30 to each probe 29.
A predetermined test such as a DC test is performed by supplying the sample to each pad 3b through the probe 29 and detecting the result on the tester 30 side through a probe 29 brought into contact with an output pad or the like. At this time, for example, the chip 3a that was tested for one of the test items and was found to be defective.
For this reason, the Voo pad and Vss pad of that chip must be separated from the tester 30 side (otherwise, other normal chip
The predetermined voltage is no longer sufficiently supplied to the knob 3a from the tester 30 side, making it impossible to perform tests for other test items. ), as described above, the defective chip 3 of each relay RL1 to RL36 connected between the Vl pad and Vss pad of each chip 3a and the tester 30 side.
relay connected to a (e.g. CHIPI shown in Figure 5)
If it is found to be defective, relays RLI and RL21) are turned off by control on the tester 30 side. That is, by applying a voltage of, for example, 5V to the coil of the relay from the tester 30 side, the relay switch is turned off, and only the V00 and Vss bads of the defective chip 3a are detected by the tester 30.
Disconnect from the 0 side.

And actually, for example, 2 on a 6-inch wafer 3.
86 IC chips 3a (for example, IM dynamic R
AM) test procedure is explained in Figure 7. First,
A predetermined test is performed by repeating the above-mentioned operations for all chips 3a in the area (3) from the start position in the direction indicated by the arrow W1 (toward the orientation flat surface). At this time, as mentioned above,
The probe card 27 of the prober 1 according to this example is provided with a probe 29 that can simultaneously contact each pad 3b of a total of 16 chips arranged in 2 rows and 8 columns. Of course, the probe 29 does not come into contact with the areas where the probe 29 does not touch, and therefore only the chip 3a that the probe 29 touches is tested (the same applies to other areas as well).

Next, after performing each test on all the chips 3a in the region (■), all the chips 3a in the region (■) are Perform the same test as above. After performing each test on all the chips 3a in the region (■), similarly, arrow W
3. The test of the wafer 3 is completed by performing each test on all the chips 3a in each area of ■, ■, ■ in each direction indicated by W4 and W5.

Although not shown in the tree example, a CCD camera or the like is installed at a predetermined location on the chuck 47 in FIG. By having a predetermined monitoring means configured to be able to externally monitor the state of contact using the above-mentioned CCD camera, the wafer 3 (IC chip 3a) is
Fine adjustment of the position can be easily performed.

In addition, the IC chip 3a actually formed on the wafer 3
Among them, there is a chip 3a that is originally a good product because its performance is good, but cannot be treated as a good product as a product (for example, the back side of the wafer 3 is usually gold plated, but the outer periphery is not coated with gold). (There will inevitably be areas where this is not done.) These chips 3a are determined in advance as untested chips (INK CHIP) and are not tested (in this example, as shown in FIG. 7, there are a total of 316 IC chips 3a formed on the wafer 3). Among them, there are 30 INK-CHIPs (not shown), which are not shown in the above example for convenience of explanation (the same applies to the following examples).

As explained above, according to this example, the tips 29a of the plurality of probes 29 are all oriented perpendicularly to the contact surface of the pad 3b of the IC chip 3a. The tip portion 19a of the probe 19 does not contact the contact surface of the pad 3b obliquely (at a predetermined angle). Therefore, probe 2
When the probe 9 comes into contact with the pad 3b of the IC chip 3a, the displacement due to the lateral force described above does not occur (that is, as shown in FIG. 4B, the tip 29a of the probe 29 Since it is oriented perpendicularly to the contact surface of the panod 3b and is in contact with it, it does not receive any lateral force.), its positioning becomes easy, and a highly reliable test can be performed.

In addition, in the wooden example, as mentioned above, since BeCu is used for the tip 29a of the probe 29, the contact resistance of the material is small, and therefore there is little negative effect on friction on the contact surface, and the probe 29 is made of BeCu as described above. There is no need to worry about wear of the tip 29a due to friction or the like. Furthermore, in this example, as described above, the spring 3J formed separately from the tip 29a of the probe 29 is configured to maintain a predetermined contact pressure against the surface of the blade 3b. By appropriate design, the above contact pressure can be easily set appropriately.

What should be noted in this example is that, as shown in FIGS. 5 and 6 above, a total of 16 chips (CHIP1 to CHIP 1 to
The rc chip 3a of CHIP16) can be tested at the same time. That is, the conventional obliquely protruding probe 19 (
When considering testing 16 IC chips 3a at the same time as in this example, as shown in FIG. In the conventional probe 19,
As shown in FIG. 21, the layout is constrained in the horizontal direction. ), it is impossible for the probe 19 to contact each adjacent pad 3b between adjacent chips 3a (for example, CHIP1 and CHI P9), but in this example, as described above, pad 3
Since it has a plurality of probes 29 that are all oriented perpendicularly to the contact surface of b, there is almost no need to worry about lateral layout constraints as in the past, and the layout is free. The degree will increase. As a result, the probe 29 can be brought into contact with all the pads 3b of the 16 chips (CHIP1 to CHIP16), making it possible to test a large number of chips, such as 16 chips, in the same way as in this example. In addition, in the conventional probe 19, the length of the probe 19 varies depending on the position of the pad 3b on the chip 3a, and therefore the contact force to the pad 3b varies and there is a possibility that a predetermined voltage may not be supplied. Blope 2≦ can apply a constant contact force to each pad 3b regardless of the position of the pad 3b.

In fact, if the test was conducted one chip at a time, it would take about 2.19 hours to complete the test of all (for example, 286 chips) IC chips 3a on one wafer 3. However, in this example, 16 chips can be tested at the same time as described above, so the time required can be significantly shortened to about 12.9 minutes. This is a breakthrough that would be completely unthinkable with conventional test equipment.

FIGS. 12 to 14 show other examples of the present invention, and since the basic structure and operation thereof are almost the same as the above-mentioned first example, the explanation will be omitted. The difference is that
A total of 8 chips (CHIP
I to CHI P8) are configured to be tested simultaneously.

That is, as shown in FIGS. 13 and 14, a plurality of probes 29 similar to the above example are connected to CH I P 1 to CH
Each pad 3b (V
The contact surfaces of the pads (pads located on the ss side and VDD side) are all oriented perpendicularly to the contact surfaces of the pads 3b, respectively, so that they simultaneously contact the contact surfaces of the pads 3b.

Therefore, in this example as well, the probe 29
This example has the advantage that there is no need to worry about misalignment when contacting the contact surface of the pad 3b on the IC chip 3a.
P1 to CH I P8) can be tested simultaneously, so all (P1 to CH I P8) on one wafer 3 can be tested simultaneously.
As with the above example, it is noteworthy that the test of the IC chip 3a (for example, 286 chips) can be completed in a very short time of about 20.8 minutes.

FIG. 15 and FIG. 16 show other examples of the present invention, and the basic configuration is almost the same as the example shown in FIGS. The difference is that, as shown in the figure, by using a flexible substrate 38 with a predetermined wiring pattern 38a made of copper or the like, it is not necessary to route wiring such as coaxial cables on the board 37a of the probe card 37. First, attach the probe 29 to a predetermined probe holder 36 in advance, insert it into the opening 35 of the board 37a of the probe card 37 and fix it to the board 37a, and then directly attach the probe 29 onto the flexible board 38. It can be easily attached through the provided through hole 38b.

Therefore, as described above, the predetermined wiring pattern 38
Since a flexible substrate 38 is used,
Since there is no need to route wiring on the board 37a of the probe card 37 for connecting the probe 29 and the tester 30 side, the probe card 37 can be manufactured easily and is convenient for mounting. Further, by changing the flexible substrate 38, the wiring pattern can be easily changed as appropriate, and the connection relationship between the probe 29 and the tester 30 side can be set as appropriate. Furthermore, since a flexible material like the flexible substrate 38 is used, multiple wiring becomes possible, which leads to an improvement in packaging density.

However, in this example, for convenience of explanation, V of each IC chip 3a is
no pad and V. Although the relays for disconnecting the pads from the tester 30 side are not shown, they can be configured in the same manner as in the above example. Further, the reference numeral 39 in the figure is a reinforcing plate for holding the flexible substrate 38 on the board 37a, but it is not shown in FIG. 16.

FIG. 17 shows still another example of the present invention, in which the plurality of probes 29 in each of the above-described examples are entirely integrated into an IC.
Although the probe 49 is configured to be oriented perpendicularly to the contact surface of each pad 3b of the chip 3a, in this example, only each tip 49a of the probe 49 is oriented perpendicularly to the contact surface of the pad 3b. The other structure is similar to the conventional probe 19.

Therefore, in this example as well, as in the above-mentioned example, each tip 49a of the probe 49 is configured to be oriented perpendicularly to the contact surface of each pad 3b with respect to the IC chip 3a. This has the advantage that there is almost no need to worry about the positional deviation of the probe 49 when it comes into contact with the probe 49.
This can be easily realized by slightly changing the design of the tip portion 49a from the conventional one.

FIG. 18 shows an example in which the pads 3b are located on four sides of the IC chimp 3a. Although not shown, if the probe 29 in the above-mentioned example is used, the pads 3b can be arranged in the arrangement pattern shown in the figure. The IC chip 3a can also be easily configured so that multiple chips (for example, 16 chips as in the above example) can be tested at the same time.

FIGS. 19 and 20 show examples in which short circuits between adjacent probes 29 can be prevented by covering the post portion 29c of the probe 29 with an insulating cap 5o. That is, as shown in the figure, the cables 21 are soldered to the post portions 29c of each probe 29 in the same manner as in the above example, and the post portions 29c and the soldered cables 21 are covered with the caps 5o. Bost portions 2 of adjacent probes 29
The cap 5o provided on the cap 9c is bent left and right alternately.

Although the present invention has been illustrated above, the above-described examples can be further modified based on the technical idea of the present invention.

For example, in the above example, the tips of the plurality of probes were configured to be completely perpendicular to the contact surface of each pad 3b of the IC chip 3a. The angle may be slightly deviated from the vertical, or the angle may be slightly deviated from the vertical, as long as it is substantially perpendicular.

Further, the material, shape, structure, etc. of the probe may be changed in various ways. For example, as the means for maintaining the contact pressure of the probe 29 to the pad 3b surface, an appropriate elastic means other than the spring 31 may be used. You can.

In addition, other structures and portions can also be modified in various ways.

In addition, in the above example, an example was explained in which 16 chips and 8 chips were tested simultaneously, but the probe 2 mentioned above
By using measures such as 9, it becomes possible to test not only 24 chips or 32 chips but also one wafer at a time. Further, as in the example shown in FIG. 18, if a probe card having a probe 29 configured for simultaneous multi-chip measurement is used for an IC chip 3a having pads 3b on four sides, pads 3b on two sides can be used. The wafer can be tested with a high degree of freedom regardless of the layout of the pad 3b. Furthermore, for example, by configuring the chuck 47 that holds the wafer 3 to rotate itself, or by configuring the probe card itself that is equipped with a probe to be rotatable, it is possible to easily obtain appropriate information without having to replace the probe card etc. each time. Can perform wafer testing.

Further, in each of the above-mentioned examples, each probe is configured to contact each pad 3b of the IC chimp 3a at the same time. It is also possible to configure only the probe to selectively contact the pad.

In each of the above-mentioned examples, the present invention was applied to the test of an IC chip, but the present invention may of course be applied to the test of other elements.

fart. Effects of the Invention As described above, in the present invention, at least each tip portion (for example, the tip portions 29a, 49a mentioned above) of all the plurality of contacts (for example, the probes 29, 49 mentioned above) has an I.
Since it is configured to be oriented substantially perpendicularly to the contact surface of the pad of an element such as a C-chip, its tip comes into contact with the contact surface at an angle, unlike conventional probes. Never. Therefore, it is possible to provide a highly reliable device testing device that does not cause any displacement of the contact with respect to the contact surface.

[Brief explanation of the drawing]

1 to 20 show embodiments of the present invention, in which FIG. 1 is a perspective view of a probe card according to the present invention configured to be able to test 16 chips at the same time, and FIG. 1
Figure 3 is a cross-sectional view of the main parts of the probe card and its surrounding prober device taken along line 1 and 2 in Figure 1. Figure 4A is a partially cutaway perspective view of the internal structure of the probe and its probe. Figure 4B is a cross-sectional view of the main part showing the state before the probe contacts the pad of the IC chip, Figure 5 is a cross-sectional view of the main part showing the state after the probe contacts the pad of the IC chip, and Figure 5 is a cross-sectional view of the main part showing the state before the probe contacts the pad of the IC chip. A schematic plan view for explaining that each pad on 16 IC chips is connected to the tester side, and FIG. 6 shows that each probe is in contact with each pad on 16 IC chips. FIG. 7 is a schematic plan view for explaining the procedure for testing an actual wafer using a prober device, and FIG. 8 is a schematic plan view for explaining the connection relationship between each probe and the tester. Schematic block diagram, Figure 9 is a relay circuit diagram for a relay to disconnect the Vss pad from the tester side, Figure 10 is a mounting pattern diagram of the relay circuit, and Figure 11 is a Vss pad. Fig. 12 is a perspective view of a blow card showing another example of the present invention; Fig. 13 is a blow card taken along the xm-xm line in Fig. 12. FIG. 14 is a schematic plan view illustrating that each pad in the eight TC chinobu is connected to the tester side through each probe. FIG. 15 is a cross-sectional view of a main part showing a probe card and a surrounding prober device according to another example of the present invention, FIG. 16 is an exploded perspective view of the probe card according to the example of FIG. 15, and FIG. A cross-sectional view of the main part of a probe according to another example (however, for convenience of explanation, the diagonal lines representing the cross section of the probe are omitted). FIG. 18 is a schematic plan view showing an example of an IC chip having pads on four sides. Figure 19 is a perspective view showing a state in which caps are attached to the probes to prevent electrical shorts between adjacent probes, and Figure 20 is a schematic perspective view showing a state in which camps are attached to all probes. . 21 to 25 show a conventional example, and FIG. 21 is a sectional view of a main part showing a conventional blow card and a blow bar device around it (xxt-x in FIG. 2, which will be described later).
xt line sectional view), Figure 22A, and Figure 228 respectively show the IC of the conventional probe.
A cross-sectional view of the main part to explain the misalignment of the chip with respect to the pad surface (however, for convenience of explanation, the diagonal lines representing the cross section are omitted on the probe). Figure 24 is a perspective view of the main part of the probe to explain how the tip decreases; Figure 24 is to explain that it is impossible to contact each pad of 16 IC chimps simultaneously with a conventional probe. FIG. 25 is a schematic plan view of the prober device. In addition, in the symbols shown in the drawings, 1...Blowbar device 3...Wafer 3a...IC chip 3b... ...Pad 19, 29, 49...7" t:l -
7'19a, 29a, 49a...Tip portions 10, 20...Head stage 21.
......Coaxial cable 26, 36...Brobe holder 27, 3
7... Prope card 30...
. . . Tester 47 . . . Chuck RLI to RL 36 . . . Relay.

Claims (1)

[Claims] 1. A plurality of contacts are electrically contacted via respective tips at predetermined locations of the element to be tested, and the element is tested by supplying a signal to the plurality of contacts after the contact. an element testing device configured to be configured such that at least each of the tips of all of the plurality of contacts is oriented substantially perpendicularly to a contact surface of the element.