JPH03231438A - Probe card and probe device using the same - Google Patents

Abstract

PURPOSE:To improve reliability of a probing by composing a probe card of a printed circuit board, providing a plurality of first contacts on its front surface and similarly a plurality of second contacts on its rear surface, holding the contacts with paired probes each having a stationary part and a bent part, and electrically connecting them. CONSTITUTION:A plurality of contacts 23, i.e., first contacts, are provided in parallel at one ends of one surface 22a of a printed circuit board 22 made of resin and a plurality of probes 24, i.e., first probes, are provided at the other side opposed to the contacts 23. Second contacts 27, second probes 28 are similarly provided on the other surface 22b. In this structure, probes 24, 28 are all respectively formed of stationary parts 24a, 28a, bent parts 24b, 28b, and contacts 24c, 28c. When a wafer chip is probed, the probes 24, 28 of a card 21 are brought into contact with the electrodes provided at a chip, and the propriety of the chip is selected.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a semiconductor wafer chip, a single packaged IC, or a plurality of ICs (hereinafter referred to as lead) connected by a lead frame before making the IC into a single unit. The present invention relates to a probe card and a probe device using the probe card for simultaneously testing the electrical characteristics of a plurality of semiconductor devices such as frame ICs.

(Prior Art) For example, in the manufacturing process of semiconductor devices such as ICs and LSIs, after forming a plurality of wafer chips on one semiconductor wafer through wafer processing, the electrical characteristics of the wafer chips are inspected using a probe card. (blobbing) is performed. This proping (process) is to select good products from defective products by performing a direct current test and a simple logic function test on the wafer chip (device to be tested) to be tested in the wafer state.

Conventionally, as a technique in this field, there has been one as shown in FIG. 2, for example. The configuration will be explained below using figures.

FIGS. 2(a) and 2(b) are configuration diagrams showing an example of the configuration of a conventional probe card, in which FIG. 2(a) is a plan view and FIG.
b) is a sectional view taken along line A-A in the same figure (a).

This probe card 1 has a substrate 2, and an opening 2a is provided approximately in the center of the substrate 2.

An annular mounting member 3 is fixed to the lower surface of the substrate 2 by fitting into the opening 2a. A plurality of probes (probe needles) 4 are radially attached to the mounting member 3, one end of which is fixed to the mounting member 3, and a narrow end of which extends downwardly toward the center of the opening 2a. .

The probes 4 are set so that the tips of all the probes 4 form a substantially constant inclination angle with respect to the surface of the substrate 2 so as to appropriately contact a predetermined electrode of the device to be inspected. Furthermore, each probe 4 is connected to a printed wiring (or wire), 5
It is electrically connected to a contact 6 for connecting a connector, and the contact 1-6 is connected to an inspection device main body (not shown).

A method of testing a semiconductor device using the probe card 1 configured as described above will be explained with reference to FIG.

FIG. 3 is a schematic configuration diagram showing a probing process using the probe card of FIG. 2, and shows a case where two wafer chips are simultaneously inspected using - probe cards.

A plurality of wafer chips 12 are formed on a semiconductor wafer 11, which is a device to be inspected, and each wafer chip 12 is provided with a plurality of electrodes 13, respectively. When inspecting each wafer chip 12 formed on this semiconductor wafer 11 using the probe card 1, the probe 4 is attached to the mounting member 3 in accordance with the position of each electrode 13 of each wafer chip 12.
Attach the probe 4 to a predetermined position and place the probe 4 at a predetermined
, so that they are electrically connected. In this state, if the electrical characteristics of the circuit formed in the wafer chip 12 are inspected, good products and defective products can be sorted out based on the test results.

Normally, one to several wafer chips 12 are simultaneously blown by the probe card 1 at a time.

(Problems to be Solved by the Invention) However, the probe card with the above configuration has the following problems.

In the probe card 1, the number of wafer chips 12 that can be inspected at a time is limited to about one to several pieces due to the arrangement structure of the probes 4. Therefore, in order to inspect all the wafer chips 12 on the entire semiconductor wafer 11, it is necessary to repeat blobbing for one to several wafer chips 12 at a time many times, which takes time. There was a problem with it getting old. This problem occurs not only when blowing the semiconductor wafer 11, but also when blowing semiconductor devices such as single ICs and lead frame ICs. This has been a big problem in the current situation where it is required to reduce the (process) cost of blobbing in order to promote reduction in the manufacturing cost of semiconductor devices.

The present invention provides a probe card and a probe device using the same, which solves the problem of the prior art in that probing takes time because the number of semiconductor devices that can be tested at one time is small. .

(Means for Solving the Problem) In the first invention, in order to solve the problem of songwriting, a probe card is configured with a printed wiring board, a first probe, and a second probe as shown below. It is something.

That is, the printed wiring board has a plurality of first contacts arranged at one end of one surface and a plurality of second contacts arranged at one end of the other surface.

The first probe includes a first fixing part disposed on the other end side of the one surface facing each of the first contacts in the front and connected to each of the first contacts; a first bent portion extending to the first bent portion and expanding outward with respect to the one surface;
l! It is constructed with a first contact portion that protrudes from the two ends.

The second probe includes a second fixing part arranged on the other end side of the other surface facing each of the second contacts and connected to each of the second contacts; a second bent portion extending to the other surface and expanding outward with respect to the other surface; and a second contact portion extending to the second bent portion and protruding from the other end of the other surface. This is what I did.

In a second invention, in the first invention, the printed wiring board is provided with a slit for connecting the printed wiring board parallel to the first and second probes.

A third aspect of the present invention includes a connecting member having an approximately cross-shaped cross section and having mounting grooves for connecting a probe card at each tip of the cross-shaped cross section, and a connecting member that is sharply fitted into each of the mounting grooves of the connecting member. A probe device is constructed using the probe card of the first invention.

(Function) According to the first invention, since the probe pad is configured as described above, the first and second fixing parts facilitate fixing the first and second probes on the printed wiring board. , first and second
The bent portions position the first and second contact portions at the N poles (or terminals, etc.) of the device to be inspected, and act so that the first and second probes have spring properties. The surface of the printed wiring board is arranged perpendicular to the surface of the device to be measured, increasing the number of probes that can be arranged per unit area of the surface of the device to be measured. By arranging the first and second contacts to face the first and second probes, the electrical connection between the first and second contacts and the first and second probes is the shortest possible. Move as done at a distance.

According to the second aspect of the invention, the slits provided in the printed wiring board function so that the probe cards, which are formed at positions where the respective slits can be combined with each other, are removably connected to each other.

According to the third invention, since the probe device is configured as described above, the connecting member moves so that the probe card of the first invention is detachably connected vertically, horizontally, and crosswise.

Therefore, the above problem can be solved.

(Example) FIGS. 1(a) and 1(b) are schematic configuration diagrams of a probe card showing an example of the first invention. It is a sectional view taken along the line BB in the same figure (a).

This probe card 21 has a printed wiring board 22 made of resin or the like. At one end of one surface 22a of the printed wiring board 22, a plurality of contacts 23, which are first contacts, are provided in parallel with each other. This contact 23 is formed, for example, by a printing technique using copper (Cu) or the like. A plurality of probes 24, which are first probes, are provided on the other end side facing each contact 23 on the surface 22a. This probe 24 consists of a fixed part 24a which is a first fixed part, a bent part 24b which is a first bent part, and a contact part 24c which is a first contact part. It is electrically connected to the contact 23 by. The bent portion 24b extends outward with respect to the surface 22a, and the mounting member 26
It is attached to the printed wiring board 22 by.

Further, the contact portion 24G protrudes from the other end of the mounting member 26 and the printed wiring board 22, and its direction is substantially parallel to the fixed portion 24a. On the other surface 22b of the printed wiring board 22, a contact 27, which is a second contact, is provided in a position corresponding to the back side of the contact 23 in the same manner as the contact 23. A plurality of probes 28, which are second probes, are provided on the other end side facing each contact 27 on the surface 22b. This probe 28, like the probe 24, consists of a fixed part 28a which is a second fixed part, a bent part 28b which is a second bent part, and a contact part 28C which is a second contact part. .

The fixed portion 28a is electrically connected to the contact 27 by a wire 25b, and the bent portion 28b is attached to the printed wiring board 22 by a mounting member 26. As shown in FIG. 1(b), the probes 24 and 28 have a symmetrical structure with respect to the printed wiring board 22. As shown in FIG.

A case where the electrical characteristics of a semiconductor device are tested using the probe card 21 configured as described above will be described with reference to FIGS. 4 and 5.

FIGS. 4(a) and 4(b) are block diagrams showing the blowing process using the probe card of FIG.
1 is a configuration diagram in the case where the device to be inspected is a field frame IC of a semiconductor wafer. In the figure, common elements with those in FIG. 1 are given the same reference numerals. FIG. 5 is a schematic configuration diagram of an inspection device (prober, handler device, etc.).

For example, when blowing a plurality of wafer chips 32 formed on a semiconductor wafer 3 which is a device to be inspected, a probe card 21 is connected to an electrode 33 provided on each wafer chip 32.
This is done by bringing the probes 24 and 28 into contact with each other. For this purpose, an inspection device 34 as shown in FIG. 5 is used.

The inspection device 34 includes an inspection drive section 35 and a device to be inspected storage section 3.
6, and an inspection control section 37.

The inspection drive section 35 has a stage 35a, and a probe device 38 is set above the stage 35a. This probe device 38 includes the probe card 21
A plurality of probe cards 38a, 38b, 3 having the same structure as
8c and 38d, and the contact portion 24C of each probe 24.28.
, 28C are arranged at the positions of the respective electrodes 33 and fixed with a support frame or the like. The probe device 38 is connected to the inspection control section 37 via contacts 23 and 27 with a connector or the like. In addition, the device to be inspected storage section 36 has a cassette t-36a for storing the device to be inspected.
Although not shown, the inspection control section 37 includes a computer for controlling the inspection, a keyboard for inputting control commands, and a display for displaying the inspection results and the like.

Using this inspection device 34, for example, the semiconductor wafer 31 is blown in the following manner.

First, according to a command from the inspection control section 37, the semiconductor wafer 31 stored in the device under test storage section 36 is moved to the stage 35.
It is transported onto a. Next, the stage 35a is controlled to move three-dimensionally under the control of the inspection control unit 37, and the contact portions 24C of the electrodes 33 of the wafer chip 32 on the semiconductor wafer 31 and the probes 24, 28 of the probe device 38 ,28C
The positioning is done and the two are brought into contact. Thereafter, under the control of the inspection control unit 37, various inspections are performed to examine the electrical characteristics of the electrical circuits within the wafer chip 32.
For example, defective products among the wafer chips 32 are marked with a marker or the like (not shown).
Good products and defective products are sorted.

As shown in FIG. 4(b), the lead frame C39 is also blown using the inspection device 34 in the same manner as the semiconductor wafer 31.

The lead frame IC 39, which is the device to be inspected, has a plurality of ICs 41 supported by a lead frame 40,
Each of the ICs 41 is provided with a lead terminal 42. When probing the lead frame IC 39, the probe device 38 is configured such that the contact portions 24C, 28C of the probes 24, 28 are arranged at positions corresponding to the lead terminals 42 of the ICs 41. Thereafter, similar to the case of the semiconductor wafer 31, blobbing is performed to select good and defective ICs 41.

This embodiment has the following advantages.

(A> In the conventional probe card 1, the probe 4 was arranged so that the printed wiring board 2 was placed parallel to the surface of the device to be inspected to perform probing.The probe card of this embodiment 21. 38a to 38d are surfaces 22a of the printed wiring board 22.

22b to the semiconductor wafer 31 or lead frame IC3
The probes 24 and 28 were arranged perpendicularly to the surface of the sample 9 to perform blobbing. Therefore, for example, all the wafer chips 32 in the semiconductor wafer 31 or all the ICs 41 in the lead frame IC 39 can be simultaneously blown. As a result, in the manufacturing process of a semiconductor device, the time and number of steps required for the blowing process can be reduced, and manufacturing costs can be reduced.

(B) The probe 1 card 21.38a to 38d is connected to the fixed part 248.28a of the probe 24.28 and each contact 23.
．． 27 was connected with wires 25a and 25b.

Therefore, by changing the connection of the wires 25a, 25b, the wiring between the contact 23.27 and the probe 24.28 can be easily changed.

(C) Since the probes 24 and 28 are provided with the bent portions 24b and 28b, the contact portions 24C and 28C can be placed at the positions of the electrodes 33 or the lead terminals 42. Roughly, since the probes 24 and 28 have spring properties due to the bent portions 24b and 28b,
Contact portions 24G, 28c and electrode 33 or lead terminal 42
A good contact condition can be obtained. Therefore, the contact portion 24
Poor contact between C and 28c is prevented, and the reliability of blobbing D) is improved.

(D) Each probe 24, 28 and each contact 23, 27 are arranged at opposing positions, so that the electrical connection between the probe 24 and the contact 23 and between the probe 28 and the contact 27 is the shortest distance. That's fine.

As a result, the probe cards 21.38a to 38d have improved electrical characteristics such as impedance characteristics, conductance characteristics, and inductance characteristics.

(E>Blow 7 The carts 21.38a to 38d have a structure in which the printed wiring board 22 is placed perpendicularly to the surface of the semiconductor wafer 31 or the lead frame 1c39 to perform blowing, so it is different from the conventional probe card 1. In addition, the contact portion 2 of the probe 24 and 28 can be significantly downsized.
4G, 28C directions and printed wiring board 22 surface 22a
, 22b are parallel to each other, the contact portions 24c and 28c are connected to the electrode 33 or the lead terminal 42 by blowing.
Even if the probes 24 and 28 are pressurized by contact with the probes 24 and 28, the printed wiring board 22 will not be deformed such as warping. Therefore, if deformation such as warpage occurs (the contact portion 2
4G, 28G and the electrode 33 or lead terminal 42 are removed from being in contact with each other, and a good contact state is obtained.

FIGS. 6(a) and 6(b) are configuration diagrams of a probe card showing an embodiment of the second invention, and FIG. 6(a) shows the configuration when a sulin] is provided at the upper end of a printed wiring board. FIG. 3B is a configuration diagram in the case where a slit is provided at the lower end of the printed wiring board.

The probe card 51 has a printed wiring board 52. On both sides of the printed wiring board 52, contacts 53 and probes 54 connected to the contacts 53 are arranged symmetrically with respect to the printed wiring board 52, almost similarly to the probe card 21 in FIG. . At this point, probe 5
4 is directly fixed to the contact 53 by soldering or the like, and is electrically connected to the contact 53.

Furthermore, a slit 55 for connecting the printed wiring board is provided at the upper end of the printed wiring board 52.

The probe card 61 has a printed wiring board 62, similar to the probe card 51, and has contacts 63 and contacts 6 on both sides of the printed wiring board 62.
A probe 64 connected to 3 is disposed 82. here,
The probe 64 is directly fixed to the contact 63 by soldering or the like, and is electrically connected to the contact 63.

Further, the height of the contact portion of the probe 64 is different from the height of the contact portion of the probe 54. Furthermore, a slit 65 for connecting the printed wiring board is provided at the lower end of the printed wiring board 62.

Using the probe cards 51 and 61 configured as described above, for example, a semiconductor wafer or a fixed frame IC can be used.
Blobbing, etc., is performed as follows.

FIG. 7 is a block diagram of a blobbing process using the probe card of FIG. 6. In the figure, elements common to those in FIG. 6 are given the same reference numerals.

[Same structure as probe cards 51 and 61 respectively] Everyone's probe cards 51a to 51c and probe card 61
A probe device 65 is configured using a to 61c. This probe device 65 includes probe cards 51a to 5.
1c each slit 55 and probe cards 618 to 61
By combining each slit 65 of c with each other, the probe 1 cart 51a to 51C and the probe card 6
1a to 61c are connected to each other. The probe device 65 is fixed, for example, to the outside of each of the probe cards 51a to 51c and each of the probe cards 618 to 61c, or by a support frame (not shown) or the like. Here, since the height of the contact portion of the probe 54 and the height of the contact portion of the probe 64 are different, contact between the probe 54 and the probe 64 does not occur.

This probe 7 device 65 is attached to the inspection device 34 shown in FIG. 5, for example, in place of the probe device 38, and
The semiconductor wafer 66 is blown as shown in the figure. This probing is applied to each electrode 68 of a plurality of wafer chips 67 formed on a semiconductor wafer 66 using a probe 54.
By bringing 64 into contact with each other, the process is carried out in substantially the same manner as in the first embodiment of the invention.

This embodiment has almost the same advantages as the embodiment of the first invention (
A), (C) to (E), and further has the following advantages (a> Each probe card 51a to 51G and each probe card 61a to 61c has a slit 55.65. By providing this, each probe card 51a to 51c and 61a to 61c can be connected detachably.
As with the wafer chip 67, even if the electrodes 68 are on all four sides, the blobbing can be performed.

(b) Each probe card 51a to 51c and 61a to
61C are removably connected by slits 55.65. Therefore, for example, in the probe device 65, if any of the probe cards 51a to 51C and 61a to 61G fails, only the failed probe card can be replaced, making maintenance easy.

(C) Probe 54°64 to printed wiring board 52.62
Attachment was performed directly via contacts 53 and 63 by soldering or the like. Therefore, there is no need for a mounting member for attaching the probe 54.64 to the printed wiring board 52.62, and the contact 53.63 and the probe 54.6 are
Since the wires 25a and 25b are directly electrically connected to the wires 4 and 4, there is no need for the wires 25a and 25b as shown in FIG. 1. 1 is a configuration diagram of a probe device showing an embodiment of the present invention; FIG. . Further, FIG. 9 is a block diagram showing a probing step using the probe device of FIG. 8, and FIG. 10 is a partial perspective view of region A in FIG. 9. In the figure, elements common to those in FIG. 7 are given the same reference numerals.

The plow 7 device 91 includes a plurality of probe cards 71, a plurality of probe cards 81, and a plurality of connection members 85.

The probe 7 card 71 has a printed wiring board 72, and on both sides of the printed wiring board 72, contacts 73 and probes 74 connected to the contacts 73 are provided, similar to the two probe cards shown in FIG. It is provided symmetrically with respect to the printed wiring board 72.

The probe card 81 has a printed wiring board 82, and on both sides of the printed wiring board 82, contacts 83 are connected to the contacts 83, almost like the probe card 71, and the height of the contact portion is the same as that of the probe tip. The probe 84, which is higher than the height of the contact portion 74, is symmetrically provided with respect to the printed wiring board 82.

The connecting member 85 has a substantially cross-shaped cross section, and a mounting groove 86 for connecting a probe card is provided at each tip of the cross-shaped cross section.

The probe device 91 is configured by connecting the probe card 71 and the probe card 81 vertically, horizontally, and crosswise by a connecting member 85. Incidentally, since the heights of the contact portions of the probes 74 and 84 are different, the probes 74 and 84 do not come into contact with each other. Further, for example, the outside of the probe device 91 is fixed by a support frame (not shown) or the like.

This probe device 91 is attached to the inspection device 34 shown in FIG. 5, for example, in place of the probe device 38, and
As shown in the figure, almost the same as the embodiment of the first invention,
Blobbing of the semiconductor wafer 66 is performed.

This embodiment has the same advantages as the embodiment of the first invention (A>
, (C) to (E), and substantially the same advantages (a) to (C) as the embodiment of the second invention. Roughly speaking, in this embodiment, the probe card 71° 81 is connected to the connecting member 85.
Since this was carried out using the above, there is an advantage that assembly and maintenance are easier than in the embodiment of the second invention.

It should be noted that the present invention is not limited to the illustrated embodiment, and various modifications are possible. Examples of the modifications include the following.

(I) Probe cards 21.38a to 38d, 51.
61, and the probe device 91, each probe 24°28.5
The shape, mounting position, etc. of 4.64.74.84 can be modified. For example, each probe 24°28.54.64. t
4.84, as can be seen from FIG. 1(b), its shape is symmetrical with respect to the mounting surface, but it is not necessarily limited to this shape. In addition, each probe 24
．． 28° 54.64, 74.84 fixing parts 24a, 2
8a, etc., bends 8524b, 28b, etc., and contact portion 24G
, 28C, etc., were each almost linear, but this
For example, each bending portion 24b, 28b, etc. and each contact portion 24C,
28C or the like may be used in an arcuate configuration. In addition, each probe 24, 28.54° 64.74.84 and each contact 23, 27° 53.63, 73.83 are connected to each printed wiring board 22.52.62.72.82, respectively.
are placed in opposite positions on both sides of the
This can be changed depending on the arrangement of the electrodes 33, 68, lead terminals 42, etc., and the arrangement interval and number of arrangements can also be changed as appropriate depending on the application.

(II) The probe device 91 includes a probe card 71°8
The number of connected pieces of 1 can be set according to the purpose. This also applies to the probe device 38.65.

(III) Probe Cart 2], the probes 24 and 28 are attached to the printed wiring board 22 by the attachment member 26, but this may be done by other methods. For example, the probes 24, 28 may be attached directly to the contacts 23, 27 by soldering or the like. In this case, wire 25a.

25b is no longer necessary. Further, the probe cards 51, 6L and the probe device 91 each have probes 54.6 and 6L.
4.74.84 for each contact 53.63, 73.83
It may be fixed directly by soldering, etc., or it may be attached using a mounting member (pull structure).Roughly speaking, each probe 54.64° and 74.84 may be reinforced with a mounting member. Good too.

(IV) The probe cards 51 and 61 constitute a probe device @65 by being connected to each other, but the method of use thereof is not necessarily limited.

For example, depending on the purpose, it may be used alone or may be configured in the same manner as the probe device 38.

(V) The mounting member 26 can be mounted by changing its position, shape, etc. For example, the probe 24.28 may be attached to the printed wiring board 22 by a mounting member at the fixed portion 248.28a.
and in a third embodiment of the invention, a probe card 21.3
8a to 38c, 51.degree. 61 and the probe device 91 are applied to the probing of the semiconductor wafer 31.66 or the lead frame IC39. It is applicable to blowing semiconductor devices such as single ICs.

(Effects of the Invention) As described above in detail, according to the first invention, the first and second probes are provided with the first and second fixing parts, so that the first and second probes are provided with the first and second fixing parts. It becomes easier to fix the probe to the printed wiring board, and it becomes easier to establish electrical connections between the first and second probes and the first and second contacts. Since the first and second bent portions are provided, alignment of the first and second probes and the electrodes of the device to be inspected is facilitated, and the first and second bent portions act as springs. Also, the reliability of the contact between the second contact portion and the electrode of the device to be tested is improved.

Since the first contact and the second contact were arranged to face the first probe and the second probe, respectively, the first contact 1 to 1 and between the first probe and the second contact Electrical connection between the submerged and second probes can be made over the shortest distance. Therefore, deterioration of the electrical characteristics of the signals flowing between each contact and each probe is prevented, and the reliability of probing is improved.

The printed wiring board has first and second probes disposed on its surface, and the surface of the board is arranged perpendicularly to the surface of the device to be inspected so that the electrodes of the inspection device and the first and second probes are arranged. The structure was designed to make contact with the second probe.

Therefore, the probe card can be made smaller, and the printed wiring board will not be warped when pressure is applied to the first and second probes. Improves contact with In addition, the number of probes that can be placed per unit area of the surface of the device under test has increased significantly, and the number of devices under test that can be probed at a time has increased dramatically. If the probe device is constructed by fixing the probe card with a support frame, etc., it is possible to perform the blowing of semiconductor devices all at once.Therefore, the time and time required for the blowing process in the semiconductor device manufacturing process can be reduced. The number of steps can be reduced, and the manufacturing cost of the semiconductor device can be significantly reduced.

According to the second invention, almost the same effect as the first invention can be obtained, and since the probe card of the first invention is provided with a slit, the probe cards can be detachably connected to each other. Therefore, even when electrodes are arranged on all sides of the device to be tested, multiple probing operations can be performed simultaneously on the device to be tested, and maintenance of the probe card can be easily performed.

According to the third invention, almost the same effect as the first invention can be obtained, and since the probe device is configured using a connecting member, the probe card of the first invention can be used vertically, horizontally, and crosswise. Since the probe card can be detachably connected and any probe card can be attached and detached, maintenance of the probe device can be carried out efficiently.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are configuration diagrams of a probe card showing an embodiment of the first invention, and FIG. 2(a) is a block diagram of the probe card. (b) is a configuration diagram of a conventional probe card, and Figure 3 is a diagram of the configuration of a conventional probe card.
A block diagram of the probing process using the probe card shown in the figure, FIG. 4 (a>, (b) is a block diagram of the probing process using the probe card of FIG. 1, and FIG. 5 is a block diagram of the inspection device. FIG. 6(a). FIG. 6(b) is a block diagram of a probe card showing an embodiment of the second invention, FIG. 7 is a block diagram of a blobbing process using the probe card of FIG. 6, and FIG. (a). (b) and (C) are exploded configuration diagrams of a probe device showing an embodiment of the third invention; FIG. 9 is a configuration diagram of a blowing process using the probe device of FIG. 8; The drawing is a partial perspective view of Fig. 9. 22.52, 62, 72, 82...Printed wiring board, 23, 27, 53, 63.73.83...Contact, 24.28.54. 64.74.84... probe,
24a, 28a... fixed part, 24b, 28b... bent part, 24G, 28G... contact part.

Claims (1)

[Scope of Claims] 1. A printed wiring board having a plurality of first contacts arranged at one end of one surface and a plurality of second contacts arranged at one end of the other surface; a first fixing part disposed on the other end side of the one surface facing the first contact and connected to each of the first contacts; a first fixing part extending to the first fixing part and connected to the one surface; a first probe having a first bent portion that extends outwardly, and a first contact portion extending to the first bent portion and protruding from the other end of the one surface; a second fixing part arranged on the other end side of the other surface facing the second contact and connected to each of the second contacts; a second fixing part extending to the second fixing part and connected to the other surface; a second bent portion expanding outwardly; and
and a second probe having a second contact portion extending to the bent portion of the probe and protruding from the other end of the other surface. 2. The probe card according to claim 1, wherein the printed wiring board is provided with a slit for connecting the printed wiring board parallel to the first and second probes. 3. A connecting member having a substantially cross-shaped cross section and having mounting grooves for connecting a probe card at each tip of the cross-shaped connecting member, the connecting member being removably fitted into each of the mounting grooves of the connecting member, respectively. A probe device comprising: a probe card;