JP2001228169A - Electrical connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the relative positional deviation between a contact part and a chip electrode due to temperature rise. SOLUTION: The electrical connector includes a grid having a plurality of apertures in X direction and in Y direction crossing each other and a probe sheet having a plurality of probe elements provided with contact parts and arranged in the respective apertures of the grid. The probe sheet is arranged on one side face of the grid so that the contact parts are positioned in the parts corresponding to the apertures, and in the boundary part between the adjacent aperture areas including one or more apertures, the probe sheet is divided into a plurality of probe areas separated from each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection device used for testing semiconductor devices, and more particularly to an electrical connection device using a probe sheet.

[0002]

2. Description of the Related Art A semiconductor device such as an integrated circuit (IC) is subjected to a conduction test (inspection) to determine whether or not the circuit operates according to specifications. Such an energization test is often performed before the semiconductor wafer is separated into IC chips, and a probe card provided with a plurality of probes (or probe elements) whose tips (contacts) are pressed against the electrodes of the chip. This is performed using an electrical connection device such as

One type of this type of electrical connection device uses a probe sheet having a plurality of probe elements formed on an electrically insulating film and a wiring board having an opening at the center. Each probe element has a contact that is pressed against the electrode of the chip. The probe sheet is mounted on one surface of the wiring board such that a contact portion of the probe element faces an opening of the wiring board.

[0004]

However, in the conventional electric connection device, the probe sheet greatly expands and contracts due to a change in the ambient temperature or the temperature of the wafer. As a result, the relative positional relationship between the contact portions and the electrode between the contact portion and the chip are increased. Relative position greatly deviates, and there are contact portions that do not contact the electrodes of the chip. In particular, when a wafer is tested in a heating chamber as in a burn-in test, or when a large number of chips are tested at the same time, the temperature of the probe sheet rises so quickly that the test cannot be performed in a short time.

[0005] Therefore, in an electrical connection device used for an energization test of an IC chip, it is desired to reduce a relative displacement between a contact portion and an electrode of the chip due to a rise in temperature.

[0006]

An electrical connection device according to the present invention comprises a grid having a plurality of openings in X and Y directions intersecting each other, and a plurality of probe elements having a contact portion for each opening of the grid. And a probe sheet provided. The probe sheet is disposed on one surface of the lattice so that the contact portion is located at a position corresponding to the opening, and is separated from each other at a boundary between adjacent opening regions including one or more openings. Divided into multiple probe regions.

At the time of conducting a current test of a chip on a semiconductor wafer,
Each probe element has its contact portion pressed against the electrode of the chip, and is energized in that state. When a heating test such as a burn-in test or a simultaneous energization test for a plurality of chips is performed, the probe sheet expands due to an ambient temperature or a rise in the temperature of the semiconductor wafer and the probe element itself.

However, in the electrical connection device, since the probe sheet is divided into a plurality of probe regions separated at locations corresponding to the boundaries of the opening regions, the thermal expansion of each probe region is caused by the adjacent probe region. Does not affect Further, since the contact portion of the probe element is located at a position corresponding to the opening of the lattice, the relative positional relationship of the probe element, particularly the contact portion, and furthermore, the positional relationship of the contact portion with the electrode of the chip is large due to the thermal expansion of the probe region. There is no risk of being affected. As a result, the relative displacement between the contact portion and the electrode of the chip due to the temperature rise is reduced.

Each contact portion includes a protruding electrode protruding on the side opposite to the grid, and the protruding electrode may have a conical shape such as a conical shape or a pyramid shape. By doing so, when the protruding electrode is pressed against the chip electrode, the sharp tip of the protruding electrode pierces the chip electrode or scrapes off the oxide film around the electrode, so that the protruding electrode and the chip electrode are separated. It is securely connected electrically.

[0010] The electrical connection device may further include an elastic body such as rubber disposed in the opening, and the probe sheet may be further mounted on the elastic body. By doing so, when the contact portion is pressed against the tip electrode, the elastic body acts as a reaction force body of the probe element, so that the variation in the height position of the contact portion is absorbed, and the contact portion and the tip electrode Makes reliable electrical contact.

The electrical connection device may further include a plurality of supports disposed on the other surface side of the grid, the support extending to the other at an interval in one of the X direction and the Y direction, and It may include a plurality of supports that contact the elastic body, and a base plate to which the supports are attached.

[0012] The lattice may be formed of a material having a coefficient of thermal expansion smaller than that of a semiconductor wafer.
In this case, since the thermal expansion of the lattice is small, the relative displacement between the contact portion and the electrode of the chip becomes smaller.

[0013] The support may protrude from the grid on a side opposite to the probe sheet.

[0014] The electrical connection device may further comprise a wire electrically connected to the probe element, the wire extending through the grid. In this case, a test signal or power can be transferred between the contact portion of the probe element and the electric circuit via the wire.

[0015] The electrical connection device may further include at least one film-shaped connection board having a plurality of wirings connected to the wires. In this case, the transfer of a test signal or power between the contact portion of the probe element and the electric circuit can be performed via the wiring of the connection board. The wire may further extend through the base plate.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 to 8, an electrical connection device 10 is used in the illustrated example as a device for simultaneously testing a plurality of uncut chips on a semiconductor wafer.

The electrical connection device 10 includes a grid 12, a probe sheet 14 mounted on one surface (a lower surface in the illustrated example) of the grid 12, a plurality of wires 16 extending upward from the probe sheet 12, A plurality of rubber plate-shaped elastic members 18 arranged on the lattice 12, a plurality of long supports 20 arranged on the other surface side of the lattice 12, a base plate 22 on which the supports 20 are assembled, And a plurality of connection substrates 24 in the form of a film.

The grid 12 is formed by vertically and horizontally assembling a plurality of plate members 26 made of a suitable material such as a metal into a rectangular frame 28, and a plurality of rectangular members corresponding to the shape of a chip to be inspected. X crossing each other through openings 30
It has in each of the direction and the Y direction.

The probe sheet 14 has a film 32 made of an electrically insulating resin such as polyimide and a plurality of strips 34 made of a conductive metal material integrally and in a plane. The probe sheet 14 is divided into a plurality of rectangular probe regions 38 separated from each other by slits 36 formed at locations corresponding to boundaries (plate members 26 in the illustrated example) of adjacent openings 30 of the lattice 12. ing. The slit 36 is formed in the portion of the film 32.

Each probe region 38 has two wiring groups each including a plurality of wirings 34 extending in the same direction at an interval from each other. The wirings 34 of both wiring groups have one ends facing each other at an interval in their longitudinal direction, and extend from the one end in opposite directions. One end of the wiring 34 of each wiring group is located on a virtual straight line.

The wiring 34 of each wiring group has a protruding electrode 40 projecting downward at one end. The protruding electrode 40 is used as a contact portion whose tip is pressed by the electrode of the chip. Each protruding electrode 40 has a pyramid-shaped tip in the illustrated example, but may have a tip having another shape such as a conical shape, a hemispherical shape, a simple projection, or the like.

One end of each wiring 34 is connected to a probe element 42 together with a portion of the film 32 and the protruding electrode 40 in the vicinity thereof.
Is formed. Each probe area 38 includes a plurality of probe elements 42 and a grid 1
2 (the plate member 26 and the frame 28).

Each probe element 42 is independent of an adjacent probe element 42 by a slit 44 extending between both wiring groups and a slit 46 extending between one ends of adjacent wirings 34. The slit 46 is formed in the portion of the film 32. Probe element 42, especially bump electrode 40
Are located at locations corresponding to the openings 30.

Each wire 16 is formed from a conductive material by a wire bonding technique or the like. Wire 16
Correspond to the wiring 34 and thus the probe element 42, and the other end of the corresponding wiring 34
The elastic body 18, the base plate 22, and the connection board 24 are penetrated and extend upward.

The probe sheet 14 as described above, for example, first forms an electrically insulating film by applying an electrically insulating synthetic resin to a base, and then forms the electrical insulating film corresponding to the wirings 34 and the projecting electrodes 40 by etching using a photoresist. By forming the recesses in the electrically insulating film, and forming the wirings 34 and the protruding electrodes 40 by plating such as electroforming, it can be manufactured.

Each elastic body 18 is formed in a plate shape by rubber such as silicone rubber.
And the slit 4 of the probe sheet 14
It has a plurality of slits 48 following 4,46. Each elastic body 18 attaches the probe sheet 14 to the grid 12,
After the wire 16 is formed, it can be formed by injecting uncured rubber into the opening 38 and curing the rubber. Therefore, the probe region 38 and the elastic body 18 are bonded.

The slits 36, 4 of the probe sheet 12
4, 46 attach the probe sheet 14 to the grid 12,
After disposing the elastic body 18 on the lattice 12, the elastic body 18 and the slit 48 of the elastic body 18 may be formed by an appropriate technique such as laser processing.

The support 20 is formed of a metal square material, and is spaced apart in one of the X direction and the Y direction, preferably in the longitudinal direction of the wiring 34, and preferably, the arrangement of the probe elements 42. It extends in the direction (longitudinal direction of the slit 44) and is attached to the lattice 12 in a state of contacting the upper side of the elastic body 18. Each support 20 includes a grid 12
It protrudes upward. The support 20 can be assembled before the uncured rubber is cured.

The base plate 22 is formed of an electrically insulating material such as a synthetic resin or a non-conductive metal, and has the support body 20 attached to the lower surface thereof by a suitable means such as a plurality of screw members and an adhesive.

Each connection board 24 is a film-shaped wiring board in which a plurality of wires 50 are formed on one surface of an electrically insulating film 52 such as polyimide, and is attached to the base plate 22 at one end. The wiring 50 of each connection board 24 corresponds to the wire 16 in a one-to-one manner.
It is electrically connected to the corresponding wire 16 by a conductive adhesive such as solder. Each wiring 50 is connected to an electric circuit of the tester via an appropriate means such as a wiring board (not shown).

In the illustrated example, each connection board 24 is
The film 52 is attached to the base plate 22 with 0 being the upper side. Therefore, each wire 16
Penetrates through the film 52 and the wiring 50.

In the electrical connection device 10, the grid 12,
The probe sheet 14, the wires 16, and the elastic body 18 are supported by a support 20. Further, the grid 12, the probe sheet 14, the wire 16, the elastic body 18, and the support 20
It is used as a probe unit 54 (see FIG. 5) and is supported by the base plate 22.

At the time of a current test of a chip on a semiconductor wafer,
Each probe element 42 has its protruding electrode 40 pressed against the chip electrode, and is energized in that state. In an electrical connection device that performs a heating test such as a burn-in test or a simultaneous energization test of a plurality of chips, the probe sheet 14 expands due to an increase in the ambient temperature or the temperature of the semiconductor wafer and the probe element itself.

However, in the electrical connection device 10,
Since the probe sheet 14 is divided into a plurality of separated probe regions 38 at locations corresponding to the boundaries of the openings 30, the thermal expansion of each probe region 38 does not affect the adjacent probe region 38. Also, the probe element 4
2, especially the protruding electrode 40 is opposed to the opening 30 of the grid 12, so that the relative positional relationship between the probe element 42, especially the protruding electrode 40, and thus the positional relationship of the protruding electrode 40 with respect to the chip electrode is affected by the heat of the probe region 38. There is no possibility of being greatly affected by expansion. As a result, the relative displacement between the protruding electrode 40 and the chip electrode due to the temperature rise is reduced.

In the electrical connection device 10, the grid 12 and the support 20 are made of a material whose coefficient of thermal expansion is smaller than that of the semiconductor wafer, for example, 42 alloy. For this reason, thermal expansion and contraction of the grid 12 and the support body 20 due to the temperature change are small, and the relative displacement between the projecting electrode 40 and the electrode of the chip is small. The lattice 12 and the support 20 may be formed of another material such as novinite having a coefficient of thermal expansion.

When the protruding electrode 40 is pressed against the chip electrode, the sharp tip of the protruding electrode 40 pierces the chip electrode or scrapes the oxide film around the electrode. Thus, the protruding electrode 40 and the electrode of the chip are electrically connected reliably.

When the protruding electrode 40 is pressed against the electrode of the chip, the probe element 42 itself is elastically deformed by overdrive, and the elastic body 18 acts as a reaction force body of the probe element 42. Thereby, even if there is some variation in the height position of the protruding electrode 40, the variation is absorbed by the elastic deformation of the probe element 42 itself and the elastic deformation of the elastic body 18. Are securely in electrical contact.

When the protruding electrode 40 is pressed against the electrode of the chip, the support 20 prevents the elastic body 18 from being significantly deformed. As a result, the protruding electrode 40 and the electrode of the chip make electrical contact with each other.

In the above embodiment, the probe sheet 14 in which the film 32 and the wiring 34 of the probe element 42 are flush with each other.
However, a probe sheet may be used in which a plurality of wires are formed on one surface of an electrically insulating film, and one end of the wires and the vicinity thereof are used as probe elements. Also,
Instead of using a probe sheet having a long probe element, a probe sheet having a probe element in which a circular or polygonal wiring and an electrically insulating film are flush with each other may be used.

In the above embodiment, the protruding electrodes 40 and the probe elements 42 are arranged in two rows in each probe area 42. However, the arrangement of the protruding electrodes and the probe elements is determined by the arrangement of the electrodes of the chip to be inspected.

The present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing one embodiment of an electrical connection device according to the present invention.

FIG. 2 is a bottom view of the electrical connection device shown in FIG.

FIG. 3 is an enlarged sectional view of a main part of the electrical connection device shown in FIG. 1;

FIG. 4 is an enlarged bottom view of a main part shown in FIG. 3;

FIG. 5 is a perspective view showing a part of a probe unit.

FIG. 6 is an exploded perspective view of the probe unit in a state where an elastic body is omitted.

FIG. 7 is an exploded perspective view showing an assembled state of the lattice and the support.

FIG. 8 is an enlarged perspective view of a probe element.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 electrical connection device 12 lattice 14 probe sheet 16 wire 18 elastic body 20 support 22 base plate 24 connection substrate 30 lattice recess 32 electrical insulating film 34 wiring 36, 44, 46 slit 38 probe area 40 protruding electrode 42 probe Element 54 Probe unit

Claims (8)

[Claims] 1. A probe sheet comprising: a grid having a plurality of openings in an X direction and a Y direction intersecting each other; and a probe sheet having a plurality of probe elements having a contact portion for each of the openings. Are arranged on one surface of the lattice so as to be located at positions corresponding to the openings, and are divided into a plurality of probe regions separated from each other at boundaries between adjacent opening regions including one or more of the openings. Electrical connection device. 2. The electrical connection device according to claim 1, wherein each contact portion includes a protruding electrode protruding on a side opposite to the grid. 3. The electrical connection device according to claim 1, further comprising an elastic body such as rubber disposed in the opening, wherein the probe sheet is further mounted on the elastic body. 4. A plurality of supports disposed on the other surface side of the grid, the support extending to the other at an interval in one of the X direction and the Y direction and contacting the elastic body. The electrical connection device according to any one of claims 1 to 3, further comprising a plurality of supports that are in contact with each other, and a base plate to which the supports are attached. 5. At least the lattice is formed from a material having a coefficient of thermal expansion smaller than that of a semiconductor wafer.
The electrical connection device according to claim 4. 6. The electrical connection device according to claim 4, wherein the support protrudes from the grid on a side opposite to the probe sheet. 7. The electrical connection device according to claim 1, further comprising a wire electrically connected to the probe element, the wire extending through the lattice. 8. The electrical connection device according to claim 8, further comprising one or more film-shaped connection boards having a plurality of wirings connected to the wires.