JP2011095028A - Probe sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a prove sheet which eliminates displacement of a probe terminal with respect to the tip section of an electronic circuit to be inspected and measured, to improve the positional accuracy and stability of the probe terminal and prevent the electronic circuit to be measured from being contaminated by impurities. <P>SOLUTION: The probe sheet includes a support substrate 12 that is made of a material, having the same thermal expansion coefficient as the base material 22 of an electronic circuit 20 to be measured; a rubber layer 14 (elastic layer) stacked on the supporting substrate 12; a resin layer 16, stacked on the rubber layer 14 (elastic layer) and faces the electronic circuit 20, at its use; and a plurality of probe terminals 18, that are provided on the resin layer 16 and are arranged corresponding to the positions of a plurality of terminal sections 20A formed in the electronic circuit 20 so that they are brought into electrical contact with the terminal sections 20A, respectively. The total thickness of a plurality of layers 24, including the rubber layer 14 (elastic layer) and the resin layer 16, is set at more than 20 μm and less than 1,400 μm, thereby making the thermal expansion coefficient of the plurality of layers 24 agree with that of the support substrate 12. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe sheet suitable for inspection and various measurements of fine electronic circuits formed on various wafers.

  As a probe used for inspection of electronic circuits and various measurements, a probe unit that is excellent in dimensional stability without deformation due to temperature, humidity, and secular change, a manufacturing method thereof, and an electric current inspection device have been proposed. It is described that the thickness of the elastic material provided in close contact with the substrate is 200 μm or less (see Patent Document 1). A probe head manufacturing method has been proposed (see Patent Document 2).

  Furthermore, a probe for inspection and measurement that can perform reliable contact between a terminal portion to be inspected and measured in an electronic circuit and a pad (terminal portion) provided at the tip of the probe is disclosed ( (See Patent Document 3).

JP 2007-205731 A JP-A-5-281259 JP 2003-207521 A

However, as in the conventional example described in Patent Document 1 described above, a product in which only an elastic material has a thickness of 200 μm has a disadvantage that the elastic deformation stroke in the thickness direction (vertical direction) of the elastic material is too small. There are cases.
When an elastic material such as silicon rubber comes into contact with the electronic circuit to be measured at the time of inspection / measurement of the electronic circuit to be measured, a free compound (for example, a sulfur compound) impregnated in the elastic material is measured. There is a problem that so-called impure contamination occurs on the circuit.
In addition, fine electronic circuits formed on various semiconductor wafers have been increasingly miniaturized, and the circuit width and the pitch of inspection / measurement terminal portions provided in the electronic circuits have become narrower year by year. Yes. Therefore, if the expansion amount of the wafer due to the temperature and humidity of the surrounding environment is different from the expansion amount of the probe, a positional shift occurs between the terminal portion of the electronic circuit and the probe terminal, and the probe terminal is connected to the terminal of the electronic circuit. It will not be possible to properly contact the part.

  The probe according to Patent Document 3 described above is made in consideration of the influence of such a change in use environment, but there is still room for improvement in that the probe terminal is directly provided on the elastic material. is there.

  In consideration of the above facts, the present invention eliminates the positional deviation of the probe terminal with respect to the terminal part of the electronic circuit to be inspected / measured, improves the positional accuracy and stability of the probe terminal, and further measures The purpose is to prevent impure contamination of electronic circuits.

  The invention of claim 1 includes a support substrate made of a material having the same thermal expansion coefficient as the base material of the electronic circuit to be measured that is an inspection / measurement object, an elastic layer laminated on the support substrate, and the elasticity A resin layer that is further laminated to the layer and that faces the electronic circuit under measurement in use, and a plurality of terminal portions that are provided in the resin layer and provided in the electronic circuit under measurement so as to be in electrical contact with each other. A plurality of probe terminals arranged corresponding to the positions of the terminal portions, and the total thickness of the plurality of layers stacked on the support substrate including the elastic layer and the resin layer is 20 μm or more and 1400 μm It is as follows.

  According to a second aspect of the present invention, in the probe sheet according to the first aspect, the elastic layer is a rubber layer.

  The invention according to claim 3 is the probe sheet according to claim 1 or 2, wherein the resin layer is a resin material having a smaller thermal expansion coefficient than the elastic layer.

  According to a fourth aspect of the present invention, in the probe sheet according to any one of the first to third aspects, the measured electronic circuit is an integrated circuit, a light emitting diode, a liquid crystal display, a printed wiring board, or a flexible board. .

In the probe sheet according to claim 1, an elastic layer is laminated on a support substrate, a resin layer is further laminated on the elastic layer, probe terminals are arranged on the resin layer, and the elastic layer and the resin layer The total thickness of the plurality of layers stacked on the support substrate is 20 μm or more and 1400 μm or less, so that the plurality of layers can follow the expansion and contraction of the support substrate due to environmental changes including temperature and humidity. it can. That is, the thermal expansion coefficients of a plurality of layers including the elastic layer and the resin layer on which the probe terminals are arranged can be matched with the thermal expansion coefficient of the support substrate.

  And since the support substrate is made of a material having the same thermal expansion coefficient as the base material of the electronic circuit to be measured that is an inspection / measurement object, the amount of change in the pitch of the terminal portion of the electronic circuit to be measured due to environmental changes, The amount of change in the pitch of the probe terminals on the probe sheet matches. That is, the probe terminal is not displaced from the terminal portion of the electronic circuit to be measured. Furthermore, since the probe terminal is disposed in the resin layer facing the electronic circuit to be measured at the time of use, the positional accuracy and stability of the probe terminal can be improved and impure contamination to the electronic circuit to be measured is prevented. be able to.

  In the probe sheet according to claim 2, since the elastic layer is a rubber layer, the probe terminal can be made to follow the terminal portion of the electronic circuit to be measured even if the surface of the electronic circuit to be measured is warped or uneven. it can. For this reason, the probe terminal can be brought into perfect contact with the terminal portion of the electronic circuit to be measured.

  In the probe sheet according to claim 3, since the resin layer is a resin material having a smaller coefficient of thermal expansion than the elastic layer, the resin layer is in contact with the measured electronic circuit during inspection / measurement of the measured electronic circuit. However, there is no impure contamination that occurs when an elastic body comes into contact. From this viewpoint, it is preferable to use, for example, polyimide having a smaller thermal expansion coefficient than that of the elastic layer as the material of the resin layer, and mount the probe terminal on the polyimide.

  Further, in the probe sheet according to claim 3, since the resin layer is hardly affected by the surrounding environment such as temperature and humidity, the probe sheet is connected to the terminal portion of the electronic circuit to be measured such as a fine circuit board having a high density and a narrow pitch. The terminal can be brought into perfect contact.

  The probe sheet according to claim 4 can inspect and measure an integrated circuit, a light emitting diode, a liquid crystal display, a printed wiring board, or a flexible substrate, and is high in temperature change and heat and humidity resistance inspection during the inspection and measurement. Reliability can be maintained. Unlike conventional methods of inspecting and measuring all blocks while scanning one block at a time, for example, inspection of all integrated circuits, light emitting diodes, liquid crystal displays, printed wiring boards, or flexible boards created on a semiconductor wafer・ Measurement work can be performed at once, and work time can be dramatically reduced. Further, when the electronic circuit to be measured is an integrated circuit, defective products can be identified before each integrated circuit is cut out from the semiconductor wafer, so that the cost of chipping the defective products can be saved. Therefore, the inspection / measurement work time can be dramatically shortened.

  As described above, according to the probe sheet according to claim 1 of the present invention, the positional displacement of the probe terminal with respect to the terminal portion of the electronic circuit to be measured which is an inspection / measurement object is eliminated. In addition to improving the accuracy and stability, it is possible to obtain an excellent effect that impure contamination of the electronic circuit to be measured can be prevented.

  According to the probe sheet of the second aspect, it is possible to obtain an excellent effect that the probe terminal can be brought into perfect contact with the terminal portion of the electronic circuit to be measured.

  According to the probe sheet according to claim 3, since the resin layer is hardly affected by the surrounding environment such as temperature and humidity, the terminal portion of the electronic circuit to be measured such as a fine circuit substrate having a high density and a narrow pitch is provided. An excellent effect that the probe terminal can be brought into perfect contact is obtained.

  According to the probe sheet according to claim 4, it is possible to inspect and measure an integrated circuit, a light emitting diode, a liquid crystal display, a printed wiring board or a flexible substrate, temperature change at the time of inspection and measurement, heat resistance and humidity resistance inspection, etc. In this case, an excellent effect that high reliability can be maintained is obtained.

It is a perspective view which shows the probe sheet comprised in the rectangle, and the to-be-measured electronic circuit which is a test and measurement object. It is a perspective view which shows the modification of a probe sheet. It is a perspective view which shows the probe sheet comprised circularly. It is a diagram which shows the relationship between the temperature and thermal expansion amount in a test example. It is a diagram which shows the relationship between a humidity change and elongation in the example which provided silicon rubber as a rubber layer in the support substrate made from aluminum. It is a diagram which shows the relationship between a humidity change and elongation in the example which provided the polyimide as a resin layer in the support substrate made from aluminum.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In FIG. 1, the probe sheet 10 according to the present embodiment includes a support substrate 12, a rubber layer 14 as an example of an elastic layer, a resin layer 16, and a plurality of probe terminals 18.

The support substrate 12 is formed of, for example, a rectangle and is made of a material having the same thermal expansion coefficient as that of the base material 22 of the electronic circuit 20 to be measured which is an inspection / measurement target. Therefore, if the base material 22 is a silicon carbide (SiO ₂ ) wafer, the material of the support substrate 12 also has silicon carbide or the same thermal expansion coefficient.

The material of the support substrate 12 is not limited to these, and glass, ceramics, synthetic resin, or metal can also be used corresponding to the base material 22 of the electronic circuit 20 to be measured. For example, when the measured electronic circuit 20 is a light emitting diode (LED), the base material 22 such as sapphire (single crystal alumina: Al ₂ O ₃ ) or a material having the same thermal expansion coefficient is used. It is done. When the electronic circuit 20 to be measured is a liquid crystal display (LCD), glass as the base material 22 or a material having the same thermal expansion coefficient is used. Further, when the electronic circuit 20 to be measured is a printed circuit board, the base material 22 such as glass epoxy or a material having the same thermal expansion coefficient is used. Further, when the electronic circuit 20 to be measured is a flexible substrate, for example, polyimide which is the base material 22 or a material having the same thermal expansion coefficient is used.

  The electronic circuit to be measured 20 is not limited to an integrated circuit, a light emitting diode, a liquid crystal display, a printed wiring board, or a flexible board. In addition to glass epoxy, various materials such as paper phenol, paper epoxy, glass composite, polytetrafluoroethylene (Teflon (registered trademark)), and aluminum oxide (alumina) are used as the base material 22 of the printed wiring board. Can do.

  In addition, it is preferable to use a material having a high thermal conductivity as the material of the support substrate 12 from the viewpoint of efficiently releasing the heat of the probe sheet 10.

  The thickness of the support substrate 12 is set sufficiently larger than the total thickness t of a plurality of layers (rubber layer 14 and resin layer 16) laminated on the support substrate 12.

  The rubber layer 14 is laminated on the support substrate 12 and bonded to the lower surface of the support substrate 12 by using, for example, adhesion. As a material for the rubber layer 14, any synthetic rubber such as silicon rubber, urethane rubber, or fluoro rubber, or an elastomer resin can be used. The rubber layer 14 is bonded to the support substrate 12 by an adhesive, for example.

  The resin layer 16 is further laminated on the rubber layer 14, and is generally a thin layer facing the electronic circuit 20 to be measured when in use, and preferably has a thickness of 15 μm or less. The resin layer 16 is made of a resin material having a smaller thermal expansion coefficient than that of the rubber layer 14, for example, engineering plastic such as polyimide. The resin layer 16 is bonded to the rubber layer 14 using, for example, an adhesive.

  The probe terminals 18 are provided on the resin layer 16 and are arranged corresponding to the positions of the terminal portions 20A so as to be in electrical contact with the plurality of terminal portions 20A provided on the electronic circuit 20 to be measured. The plurality of terminal portions 20A are arranged at a predetermined pitch on the electronic circuit 20 to be measured, and the probe terminals 18 are arranged on the resin layer 16 at the same pitch as the pitch of the terminal portions 20A. A protrusion is formed on the side opposite to the support substrate 12 in the thickness direction. The probe terminal 18 is formed on the resin layer 16 by, for example, electroforming. The resin layer 16 is provided with a circuit 26 that is electrically connected to each probe terminal 18. The circuit 26 is wired by a circuit called a via hole 28 that penetrates the resin layer 16 in the thickness direction, and the via hole 38 that penetrates the rubber layer 14 and the support substrate 12 in the thickness direction, for example, the upper surface of the support substrate 12. Are wired to the external terminals 34 provided in the. The external terminal 34 is electrically connected to a measuring instrument (not shown).

  2, the circuit 26 may be formed not only on the resin layer 16 but also on the rubber layer 14 (elastic layer), and when the rubber layer 14 is laminated, Each circuit 26 is electrically connected by a via hole (not shown). The circuit 26 formed in the resin layer 16 is also electrically connected to the circuit 26 formed in the rubber layer 14 via the via hole 28. In this example, the rubber layer 14 protrudes from the support substrate 12, and an external terminal 34 is provided on the protruding portion. Each external terminal 34 is wired to each probe terminal 18 by the circuit 26 and via hole 28 described above. Accordingly, each probe terminal 18 serves to collect a signal. The number of stacked layers 24 depends on the number of probe terminals 18. When the number of probe terminals 18 is large, the number of stacked layers 24 is also increased.

  1 and 2, the total thickness t of the plurality of layers 24 stacked on the support substrate 12 including the rubber layer 14 and the resin layer 16 is not less than 20 μm and not more than 1400 μm. Here, the reason why the lower limit of the thickness of the plurality of layers 24 is set to 20 μm is that if it is less than this, it is difficult to ensure insulation between the support substrate 12 and the probe terminals 18. Further, the upper limit of the thickness of the plurality of layers 24 is set to 1400 μm because if the thickness exceeds this, the amount of expansion / contraction of the plurality of layers 24 due to the temperature and humidity in the atmosphere does not follow the amount of expansion / contraction of the support substrate 12. is there.

  The upper limit of the thickness of the plurality of layers 24 is more preferably 1000 μm. Further, the thickness of the plurality of layers 24 may be less than 20 μm as long as insulation between the support substrate 12 and the probe terminal 18 can be ensured. Further, the plurality of layers 24 in the present embodiment are two layers of the rubber layer 14 and the resin layer 16, but are not limited thereto, and may be three or more layers. In this case, the resin layer 16 is formed as a layer farthest from the support substrate 12.

(Function)
This embodiment is configured as described above, and the operation thereof will be described below. In FIG. 1, in the probe sheet 10 according to the present embodiment, a rubber layer 14 is laminated on a support substrate 12, a resin layer 16 is further laminated on the rubber layer 14, and probe terminals 18 are arranged on the resin layer 16. In addition, since the total thickness t of the plurality of layers 24 laminated on the support substrate 12 including the rubber layer 14 and the resin layer 16 is 20 μm or more and 1400 μm or less, the support substrate is associated with environmental changes including temperature and humidity. The plurality of layers 24 can be made to follow 12 expansion and contraction.

  Further, by including the rubber layer 14 in the plurality of layers 24, the plurality of layers 24 can be made flexible, and even if the surface of the electronic circuit to be measured is warped or uneven, A probe terminal can be made to follow a terminal part.

  In particular, in this embodiment, since the probe terminal 18 is provided on the resin layer 16 made of, for example, polyimide, even when the resin layer 16 comes into contact with the measured electronic circuit 20 during inspection / measurement of the measured electronic circuit 20. There is no impure contamination that occurs when the elastic body comes into contact. Further, since the resin layer 16 is made of a material having a smaller thermal expansion coefficient than that of the rubber layer 14, it is hardly affected by the surrounding environment such as temperature and humidity. Accordingly, each probe terminal 18 can be brought into contact with the corresponding terminal portion 20A of the electronic circuit 20 to be measured. In other words, the terminal portion 20A located in the desired block can be brought into perfect contact with the probe terminal 18 without missing. Even if the electronic circuit to be measured 20 is a high-density, narrow-pitch fine circuit board, the probe terminal 18 can be brought into perfect contact with the terminal portion 20A.

As an example, the base material 22 of the electronic circuit 20 to be measured is made of silicon carbide, the support substrate 12 is made of the same silicon carbide as the base material 22, and the resin layer 16 of the probe sheet 10 is made of polyimide. think of. The thermal expansion coefficient of polyimide is 50 × 10 ⁻⁶ / ° C., which is 10 times the thermal expansion coefficient of silicon carbide (5 × 10 ⁻⁶ / ° C.). Therefore, polyimide has a characteristic that it reacts and expands and contracts more sensitively to temperature and humidity in the atmosphere than silicon carbide, but the total thickness t of the plurality of layers 24 is appropriately set as described above. By setting, the expansion and contraction of the polyimide can be suppressed and the expansion and contraction of the polyimide can follow the expansion and contraction of the silicon carbide. In other words, the thermal expansion coefficients of the plurality of layers 24 including the rubber layer 14 and the resin layer 16 that is polyimide coincide with the thermal expansion coefficient of the support substrate 12.

  Since the material of the support substrate 12 is the same as silicon carbide that is the material of the base material 22 of the electronic circuit 20 to be measured, the amount of change in the pitch of the terminal portion 20A of the electronic circuit 20 to be measured due to environmental changes, and the probe The amount of change in the pitch of the probe terminals 18 on the sheet matches. For this reason, the position shift of the probe terminal 18 with respect to the terminal part 20A of the electronic circuit 20 to be measured does not occur.

  Further, since the probe terminal 18 is disposed on the resin layer 16 rather than the rubber layer 14 and is laminated by bonding with the rubber layer 14 made of an elastic material such as silicon rubber, the positional accuracy and stability of the probe terminal 18 are increased. At the same time, the elasticity of the rubber layer 14 is reflected on the probe terminal 18, and for example, a good effect can be given to the movement of the probe terminal 18 in the vertical direction. Specifically, when the rubber layer 14 is elastically deformed as appropriate, the probe terminal 18 can be brought into perfect contact with the terminal portion 20A of the electronic circuit 20 to be measured.

  If a material having a high thermal conductivity is used as the material of the support substrate 12, the heat of the probe sheet 10 can be efficiently released, and the response in inspection / measurement in a high-temperature atmosphere becomes good, and the inspection / measurement time is increased. This is more advantageous in terms of shortening.

  As an application example of the probe sheet 10, in a probe for inspection or the like, the plurality of layers 24 are often configured as a multilayer electronic circuit board. However, the thickness of the electronic circuit board per layer is generally 50 μm or more, and in the case of a multilayer electronic circuit board having four or more layers, the total thickness exceeds 200 μm. Therefore, in the structure in which the thickness of the elastic material in the above-mentioned Patent Document 1 is 200 μm or less, it is difficult to form such a multilayer electronic circuit board having four or more layers, which is not practical.

  Even if the material of the resin layer 16 (circuit board resin) is changed, if the thermal expansion coefficient of the material is not more than the rubber layer 14 and the total thickness t of the plurality of layers 24 is not more than 1400 μm, the plurality of layers 24 Since it depends on the support substrate 12 (polymer, metal, ceramic, etc.) that holds it, it is possible to provide an inspection probe with high accuracy even in an environment where the temperature or the like changes drastically.

(Other embodiments)
In the example shown in FIG. 3, the inspection / measurement object by the probe sheet 10 is a large number of integrated circuits 30 (electronic circuit to be measured 20) created on, for example, a silicon semiconductor wafer 32 (base material 22). Yes. The probe sheet 10 is, for example, substantially circular corresponding to the substantially circular semiconductor wafer 32. The plurality of layers 24 are configured, for example, by sandwiching one rubber layer 14 between two resin layers 16. For example, polyimide is used on the side of the two resin layers 16 facing the integrated circuit 30 on the semiconductor wafer 32. As described above, the total thickness t of the plurality of layers 24 is not less than 20 μm and not more than 1400 μm.

  The inspection / measurement terminal portions 30A provided in the integrated circuit 30 on the semiconductor wafer 32 are extremely fine, and the total number ranges from 2 to 40,000. Probe terminals 18 corresponding to the respective terminal portions 30A are provided on the resin layer 16 of the probe sheet 10. By using electroforming, it is possible to easily create such a fine and numerous probe terminals 18 on the resin layer 16. Also in this embodiment, each probe terminal 18 is connected to the support substrate 12, the rubber layer 14, or the resin layer via a circuit (not shown) or a via hole (not shown) provided in the resin layer 16 or the rubber layer 14. 16 is electrically connected to an external terminal (not shown).

  The probe sheet 10 is reversed in the direction of arrow A, and each probe terminal 18 is brought into contact with the corresponding terminal portion 30A, thereby inspecting and measuring all the integrated circuits 30 formed on the semiconductor wafer 32. Can be performed at a time, and the working time can be drastically reduced. In addition, since the defective product can be identified before each integrated circuit 30 is cut out from the semiconductor wafer 32, the cost of making the defective product into chips can be saved.

  In the substantially circular probe sheet 10, as in the example shown in FIG. 2, the rubber layer 14 or the resin layer 16 is projected radially outward from the entire circumference of the support substrate 12, and an external terminal is connected to the projected portion. A terminal (not shown) corresponding to 34 may be provided. The planar shape of the probe sheet 10 is not limited to a substantially circular shape, and may be a polygon or the like. The configuration of the plurality of layers 24 is not limited to the above, and may be two layers or four or more layers.

(Test Example 1)
FIG. 4 shows the amount of expansion with respect to temperature change of aluminum as an example of the material of the support substrate 12, and silicon rubber as an example of the rubber layer 14 and polyimide as an example of the resin layer 16 stacked on the aluminum one by one. 6 is a diagram showing the results of actual measurement of the respective elongation amounts with respect to temperature changes when the total thickness t of the plurality of layers 24 is changed for the layer 24 (probe sheet). The slope of each line corresponds to the thermal expansion coefficient. For comparison, FIG. 4 also shows the results of aluminum alone, silicon rubber alone, and polyimide alone. As is clear from this figure, the lines of the silicon rubber alone and the polyimide alone are greatly different in inclination from those of the aluminum alone.

  On the other hand, when the total thickness t of the plurality of layers 24 in which silicon rubber and polyimide are laminated one by one is 1400 μm or less, the slope of the line matches the slope of the single aluminum. However, when the total thickness t of the plurality of layers 24 exceeds 1400 μm (2050 μm), the line inclination is different from the line inclination of the support substrate 12. That is, if the total thickness t of the silicon rubber and polyimide layers is within an appropriate range, the thermal expansion coefficient coincides with the thermal expansion coefficient of aluminum as the support substrate 12.

  FIG. 5 is a diagram showing the relationship between humidity change and elongation in a sample in which silicon rubber is provided as the rubber layer 14 on the aluminum support substrate 12. Specifically, it shows how much the distance (pitch) between two points on the silicon rubber has increased or decreased from 100 mm when the ambient temperature is 25 ° C. and the humidity increases from 60% to 95%. ing. According to this figure, when the thickness of the silicon rubber is 2000 μm, the pitch changes to 100.0094 mm (increased by 9.4 μm) with the change of the humidity, whereas the thickness of the silicon rubber. It can be seen that when the thickness is 800 μm and 1400 μm, the pitch only changes to 99.9997 μm (decreases by 0.3 μm), and if the thickness of the silicon rubber is 1400 μm, it is not affected by the humidity change.

FIG. 6 is a diagram showing the relationship between humidity change and elongation in a sample in which polyimide is provided as a resin layer 16 on a support substrate 12 made of aluminum. Specifically, as in FIG. 5, when the ambient temperature is 25 ° C. and the humidity is increased from 60% to 95%, the distance (pitch) between two points on the polyimide is from 100 mm. Indicates whether the number has increased or decreased.
According to this figure, when the thickness of the polyimide is 2000 μm, the pitch changes to 100.0059 mm (increase of 5.9 μm) with the change in humidity, whereas the polyimide thickness is 1400 μm. In this case, the pitch changes to 100.0002 μm (an increase of 0.2 μm), and if the thickness of the polyimide is 1400 μm or less, it is understood that it is not affected by the humidity change.

10 Probe sheet 12 Support substrate 14 Rubber layer (elastic layer)
16 resin layer 18 probe terminal 20A terminal portion 20 electronic circuit to be measured 22 base material 24 multiple layers 30 integrated circuit (electronic circuit to be measured)
30A terminal part 32 semiconductor wafer (base material)

Claims (4)

A support substrate made of a material having the same thermal expansion coefficient as the base material of the electronic circuit under test to be inspected and measured;
An elastic layer laminated on the support substrate;
Further laminated on the elastic layer, a resin layer facing the measured electronic circuit when in use,
A plurality of probe terminals provided on the resin layer and arranged corresponding to the positions of the terminal portions so as to be in electrical contact with the plurality of terminal portions provided in the electronic circuit to be measured, respectively. ,
A probe sheet, wherein a total thickness of a plurality of layers stacked on the support substrate including the elastic layer and the resin layer is 20 μm or more and 1400 μm or less.   The probe sheet according to claim 1, wherein the elastic layer is a rubber layer.   The probe sheet according to claim 1, wherein the resin layer is made of a resin material having a smaller thermal expansion coefficient than the elastic layer.   The probe sheet according to any one of claims 1 to 3, wherein the electronic circuit to be measured is an integrated circuit, a light emitting diode, a liquid crystal display, a printed wiring board, or a flexible board.

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