CN102053178A - Detection piece - Google Patents
Detection piece Download PDFInfo
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- CN102053178A CN102053178A CN2010105148223A CN201010514822A CN102053178A CN 102053178 A CN102053178 A CN 102053178A CN 2010105148223 A CN2010105148223 A CN 2010105148223A CN 201010514822 A CN201010514822 A CN 201010514822A CN 102053178 A CN102053178 A CN 102053178A
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- terminal
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Abstract
The invention provides a detection piece, which eliminates the dislocation of the detection terminal with respect to the terminal of an electronic circuit to be tested being as an inspection and detection object; improves the position precision and stability of the detection terminal; prevents pollution to the electronic circuit to be tested. The detection piece comprises a supporting substrate made from materials having the same thermal expansion coefficient as the base material of the electronic circuit to be tested, a rubber layer, i.e. an elastic layer which stacks on the supporting substrate, a resin layer which further stacks on the rubber layer or the elastic layer and is opposite to the electronic circuit to be tested when in use, and a plurality of detection terminals which are arranged on the resin layer in a manner of electrically contacting with the plurality of terminal parts disposed on the electronic circuit to be tested, and are opposite to the terminal part. The total thickness of the multiple layers comprising the rubber layer and the resin layer is in the range of 20-1400 micron, thereby the multiple layers are equal to the supporting substrate in thermal expansion coefficient.
Description
Technical field
The present invention relates to be suitable for being formed on the inspection of the fine electronic circuit on various wafers etc., the foil detector of various mensuration.
Background technology
As the detector that in the inspection of electronic circuit, various mensuration, uses, proposition has not can be owing to the probe unit of temperature, humidity, aging excellent size stability of being out of shape and manufacture method thereof, energising testing fixture, records to form technology (with reference to patent documentation 1) below the 200 μ m with connecting airtight the thickness that is arranged on the resilient material on the supporting substrates.In addition, propose to have the manufacture method (with reference to patent documentation 2) of detecting head.
And then, disclose inspection that the portion of terminal and the pad (portion of terminal) of the front end that is arranged on detector of the conduct inspection that makes in the electronic circuit, determination object can contact reliably, measure with detector (with reference to patent documentation 3).
Patent documentation 1: TOHKEMY 2007-205731 communique
Patent documentation 2: Japanese kokai publication hei 5-281259 communique
Patent documentation 3: TOHKEMY 2003-207521 communique
Yet as the existing example that above-mentioned patent documentation 1 is put down in writing, the thickness that only makes resilient material is that the elastic deformation stroke of thickness direction (above-below direction) of this resilient material of goods of 200 μ m is very few, has inappropriate situation.
In addition, in the inspection of carrying out determined electronic circuit, when measuring, when for example the such resilient material of silicon rubber contacts with this determined electronic circuit, can produce the free compound that is immersed in this resilient material (for example sulfide etc.) and be attached to determined electronic circuit, so-called impure pollution problems.
In addition, the fine electronic circuit miniaturization all the more that on various wafers that semiconductor is used etc., forms, circuit width and be arranged on inspection on this electronic circuit, the spacing of measuring the portion of terminal of usefulness narrows down year by year.Therefore, the swell increment of the wafer that causes when the temperature or the humidity of surrounding enviroment and the swell increment of detector are not simultaneously, can misplace with surveying to produce between the terminal in the portion of terminal of electronic circuit, thereby this detection terminal is correctly contacted with the portion of terminal of electronic circuit.
In the detector of above-mentioned patent documentation 3,, be set directly on the resilient material and also have room for improvement on this point will surveying terminal though consider the influence of the variation of this kind environment for use.
Summary of the invention
The present invention considers the above-mentioned fact, its purpose is, eliminate and survey the dislocation of terminal, and improve positional precision, the stability of this detection terminal, and prevent impure pollution determined electronic circuit with respect to the portion of terminal of the determined electronic circuit of conduct inspection, determination object.
First form relates to foil detector, and it has: by have with as the supporting substrates of checking, the material of thermal expansivity that the matrix material of the determined electronic circuit of determination object is identical constitutes; Be layered in the elastic layer on this supporting substrates; Further be layered on the described elastic layer, in use with the opposed resin bed of described determined electronic circuit; Be arranged on this resin bed, with the mode that electrically contacts with a plurality of portion of terminal that are provided with on the described determined electronic circuit respectively a plurality of detection terminals with the corresponding configuration in the position of this portion of terminal, comprising described elastic layer and described resin bed is more than the 20 μ m and below the 1400 μ m at interior a plurality of layers the total thickness that is layered on the described supporting substrates.
Second form is based on the foil detector of first form, and wherein, described elastic layer is a rubber layer.
The 3rd form is based on the foil detector of first form or second form, and wherein, described resin bed is the thermal expansivity resin material littler than described elastic layer.
The 4th form is based on the foil detector of first form or second form, and wherein, described determined electronic circuit is integrated circuit, light emitting diode, LCD, printed circuit board or flexible base, board.
In the foil detector of first form, because stacked elastic layer on supporting substrates, further stacked resin bed on this elastic layer, terminal is surveyed in configuration on this resin bed, and comprising elastic layer and resin bed is more than the 20 μ m and below the 1400 μ m at interior a plurality of layers the total thickness that is layered on the supporting substrates, therefore can make these a plurality of layers follow following of supporting substrates and comprise temperature or humidity stretching in interior environmental change.That is, can make and comprise elastic layer and to dispose the resin bed of surveying terminal consistent with the thermal expansivity of supporting substrates at a plurality of layers interior thermal expansivity.
And, because supporting substrates is made of the material that has with as the identical thermal expansivity of the matrix material of determined electronic circuit of inspection, determination object, so the variable quantity of the spacing of the detection terminal in the variable quantity of the spacing of the portion of terminal of the determined electronic circuit that causes of environmental change and the foil detector is consistent.That is, the detection terminal can not produce the dislocation with respect to the portion of terminal of determined electronic circuit.In addition, be configured in when using and on the opposed resin bed of determined electronic circuit owing to will survey terminal, so can improve positional precision, the stability of this detection terminal, and can prevent impure pollution determined electronic circuit.
In the foil detector of second form,,, also can make and survey the portion of terminal that terminal is followed this determined electronic circuit even therefore there is warpage or concavo-convex in the face of determined electronic circuit because elastic layer is a rubber layer.Therefore, the detection terminal is intactly contacted with respect to the portion of terminal of determined electronic circuit.
In the foil detector of the 3rd form, because resin bed is the thermal expansivity resin material littler than elastic layer, therefore even in the inspection of determined electronic circuit, this resin bed contacts with this determined electronic circuit when measuring, the impure pollution of generation in the time of also can not producing elastic body and contact.From this viewpoint, preferably the material as resin bed uses the thermal expansivity for example polyimide littler than elastic layer, and carries the detection terminal on this polyimide.
In addition, in the foil detector of the 3rd form,, the portion of terminal of the such determined electronic circuit of the detection terminal and the fine circuits substrate of high density and thin space is intactly contacted because resin bed is difficult to be subjected to the influence of surrounding enviroment such as temperature or humidity.
Foil detector as the 4th form, can carry out inspection, the mensuration of integrated circuit, light emitting diode, LCD, printed circuit board or flexible base, board, can check, keep high reliability in temperature variation when measuring and the heat-resisting moisture resistance inspection etc.Different with the method for when each zone is scanned, checking, measure whole zone like that in the past, can once carry out the whole integrated circuit, light emitting diode, LCD, printed circuit board or the flexible base, board that for example on semiconductor wafer, make inspection, measure operation, thereby can shorten the activity duration significantly.And determined electronic circuit can differentiate time waste product when being integrated circuit before cutting out each integrated circuit from semiconductor wafer, therefore can save the cost with inferior waste product chipization.Therefore, can shorten inspection, mensuration activity duration significantly.
The invention effect
As described above such, foil detector according to first form, can access to eliminate and survey the dislocation of terminal with respect to the portion of terminal of the determined electronic circuit of conduct inspection, determination object, and can improve the positional precision or the stability of this detection terminal, and can prevent excellent results the impure pollution of determined electronic circuit.
According to the foil detector of second form, can access to make and survey the excellent results that terminal intactly contacts with respect to the portion of terminal of determined electronic circuit.
Foil detector according to the 3rd form, because resin bed is difficult to be subjected to the influence of surrounding enviroment such as temperature, humidity, therefore can access the excellent results that the portion of terminal of surveying the such determined electronic circuit of terminal and the fine circuits substrate of high density and thin space is intactly contacted.
Foil detector according to the 4th form, inspection, the mensuration that to carry out integrated circuit, light emitting diode, LCD, printed circuit board or flexible base, board can be accessed, and the excellent results of high reliability can be kept in temperature variation when inspection, mensuration and the heat-resisting moisture resistance inspection etc.
Description of drawings
Fig. 1 be illustrate the foil detector that constitutes rectangle and as check, the stereographic map of the determined electronic circuit of determination object.
Fig. 2 is the stereographic map that the variation of foil detector is shown.
Fig. 3 illustrates the stereographic map that constitutes circular foil detector.
Fig. 4 illustrates the temperature of test in the example and the line chart of the relation of thermal expansion amount.
Fig. 5 is illustrated in silicon rubber is set on the supporting substrates of aluminum changes line chart with the relation of length growth rate as the humidity of the example of rubber layer.
Fig. 6 is illustrated in polyimide is set on the supporting substrates of aluminum changes line chart with the relation of length growth rate as the humidity of the example of resin bed.
Symbol description:
10 foil detectors
12 supporting substrates
14 rubber layers (elastic layer)
16 resin beds
18 survey terminal
The 20A portion of terminal
20 determined electronic circuits
22 matrix materials
More than 24 layer
30 integrated circuit (determined electronic circuit)
The 30A portion of terminal
32 semiconductor wafers (matrix material)
Embodiment
Below, based on the description of drawings embodiments of the present invention.In Fig. 1, the foil detector 10 of present embodiment has rubber layer 14, resin bed 16, a plurality of detection terminal 18 of an example of supporting substrates 12, elastic layer.
Supporting substrates 12 for example forms rectangle, and by have with as check, the material of thermal expansivity that the matrix material of the determined electronic circuit 20 of determination object 22 is identical constitutes.Therefore, if matrix material 22 is silit (SiO
2) wafer, then the material of supporting substrates 12 is also for silit or have the material of the coefficient of thermal expansion identical with silit.
The material of supporting substrates 12 is not limited thereto, and is corresponding with the matrix material 22 of determined electronic circuit 20, also can use glass, pottery, synthetic resin or metal.For example, when determined electronic circuit 20 is light emitting diode (LED), use for example sapphire (single crystals aluminium oxide: Al as its matrix material 22
2O
3) or have the material of the thermal expansivity identical with siderite.And, when determined electronic circuit 20 is LCD (LCD), use as the glass of its matrix material 22 or have with glassy phase with the material of thermal expansivity.In addition, when determined electronic circuit 20 is printed base plate, uses as for example expoxy glass of its matrix material 22 or have the material of the thermal expansivity identical with expoxy glass.And when determined electronic circuit 20 is flexible base, board, uses as for example polyimide of its matrix material 22 or have the material of the thermal expansivity identical with polyimide.
In addition, determined electronic circuit 20 is not limited to integrated circuit, light emitting diode, LCD, printed circuit board, flexible base, board.And, as the matrix material 22 of printed circuit board, except that epoxy glass, can also use paper phenol, epoxy paper, compound glass, teflon (Teflon (registered trademark)), aluminium oxide various materials such as (oxides of aluminium).
In addition, the viewpoint of becoming separated in flight from the heat that makes foil detector 10 is effectively preferably used the high material of temperature conductivity as the material of supporting substrates 12.
The thickness setting of supporting substrates 12 is for enough bigger than the total thickness t that is layered in a plurality of layers (rubber layer 14, resin bed 16) on this supporting substrates 12.
In addition, variation as shown in Figure 2 is such, also is formed with circuit 26 not only on resin bed 16, and on rubber layer 14 (elastic layer), and under the situation that is laminated with this rubber layer 14, each circuit 26 becomes electric conducting state by via hole (not shown).And also be electrically connected with circuit 26 on being formed on rubber layer 14 by via hole 28 at the circuit 26 that forms on the resin bed 16.In this embodiment, rubber layer 14 is outstanding from supporting substrates 12, is provided with outside terminal 34 on this teat.Each outside terminal 34 is surveyed terminal 18 wiring by above-mentioned circuit 26, via hole 28 with each.Therefore, each is surveyed terminal 18 and works aspect acquired signal.The stacked number of a plurality of layers 24 depends on the number of surveying terminal 18, if this number of surveying terminal 18 is many, the stacked number of then a plurality of layers 24 also increases.
In Fig. 1, Fig. 2, comprising rubber layer 14 and resin bed 16 is more than the 20 μ m below the 1400 μ m in the interior total thickness t that is layered in a plurality of layers 24 on the supporting substrates 12.At this, it is because if be lower than 20 μ m, then be difficult to guarantee the insulativity between supporting substrates 12 and the detection terminal 18 that the thickness of a plurality of layer 24 following is limited to 20 μ m.And the thickness of a plurality of layer 24 on to be limited to 1400 μ m be because if surpass 1400 μ m, then the stroke of a plurality of layers 24 of causing of temperature in the atmosphere or humidity is no longer followed the stroke of supporting substrates 12.
In addition, more preferably 1000 μ m of the upper limit of the thickness of a plurality of layer 24.As long as can guarantee the insulativity between supporting substrates 12 and the detection terminal 18, the thickness of a plurality of layers 24 also can be less than 20 μ m.And a plurality of layer in the present embodiment 24 be rubber layer 14 and resin bed 16 this is two-layer, but be not limited thereto, also can be for more than 3 layers.In this case, resin bed 16 forms and leaves supporting substrates 12 layer farthest.
(effect)
Present embodiment constitutes as described above, below its effect of explanation.In the foil detector 10 of the present embodiment in Fig. 1, on supporting substrates 12, be laminated with rubber layer 14, on this rubber layer 14, further be laminated with resin bed 16, on this resin bed 16, dispose and survey terminal 18, and comprising rubber layer 14 and resin bed 16 is more than the 20 μ m below the 1400 μ m in the interior total thickness t that is layered in a plurality of layers 24 on the supporting substrates 12, therefore, can make these a plurality of layers 24 follow following of supporting substrates 12 and comprise temperature or humidity stretching in interior environmental change.
In addition,, can make these a plurality of layers 24 have flexibility,, also can make and survey the portion of terminal that terminal is followed this determined electronic circuit even there is warpage or concavo-convex in the face of determined electronic circuit by in a plurality of layers 24, comprising rubber layer 14.
Especially in the present embodiment, owing to survey on the resin bed 16 that terminal 18 is arranged on polyimide for example, therefore even in the inspection of determined electronic circuit 20, when measuring under this resin bed 16 and the situation that this determined electronic circuit 20 contacts, do not have the impure pollution of generation when elastic body contacts yet.And, therefore be difficult to be subjected to the influence of surrounding enviroment such as temperature or humidity because resin bed 16 uses the thermal expansivity material littler than rubber layer 14.Thus, can make the portion of terminal 20A butt respectively of respectively surveying terminal 18 and corresponding determined electronic circuit 20.In other words, can not miss the portion of terminal 20A that is positioned at desired region, can make them and survey intactly butt of terminal 18.Even the such parts of fine circuits substrate that determined electronic circuit 20 is high density and thin space also can make detection terminal 18 intactly contact with its portion of terminal 20A.
As an example, considering to make the material of the matrix material 22 of determined electronic circuit 20 is silit, and the material that makes supporting substrates 12 is the silit identical with this matrix material 22, and the material that makes the resin bed 16 in the foil detector 10 is the situation of polyimide.The thermal expansivity of polyimide is 50 * 10
-6/ ℃, be the thermal expansivity (5 * 10 of silit
-6/ ℃) 10 times.Therefore, polyimide has with respect to temperature in the atmosphere or the responsive and flexible characteristic of humidity ratio silicon carbide reactor, but by as described above the total thickness t of a plurality of layers 24 suitably being set, the flexible of polyimide can be suppressed, thereby flexible the flexible of silit of following of this polyimide can be made.In other words, comprise rubber layer 14 with consistent at the thermal expansivity of interior a plurality of layers 24 with the coefficient of thermal expansion of supporting substrates 12 as the resin bed 16 of polyimide.
And, because the material of supporting substrates 12 is that silit is identical with the material of the matrix material 22 of determined electronic circuit 20, so the variable quantity of the spacing of the detection terminal 18 in the variable quantity of the spacing of the portion of terminal 20A of the determined electronic circuit 20 that causes of environmental change and the foil detector is consistent.Therefore, detection terminal 18 can not produce the dislocation with respect to the portion of terminal 20A of determined electronic circuit 20.
In addition, because will survey terminal 18 is configured in resin bed 16 but not rubber layer 14, stacked by bonding with the rubber layer 14 that forms by the such elastic body of for example silicon rubber, therefore can improve the positional precision or the stability of this detection terminal 18, simultaneously, the elasticity of rubber layer 14 informs surveys terminal 18, can give good effect to this detection terminal 18 of for example above-below direction mobile.Specifically, suitably carry out elastic deformation by rubber layer 14 and detection terminal 18 is intactly contacted with the portion of terminal 20A of determined electronic circuit 20.
In addition,, the heat of foil detector 10 is become separated in flight effectively, thereby the inspection high-temperature atmosphere under, the response in measuring are good if the material of supporting substrates 12 uses the high material of temperature conductivity, shorten aspect inspection, the minute favourable.
In addition, as the application examples of foil detector 10, checking that a plurality of layer 24 multiform become the structure of fo multi-layer electronic circuit substrate with in the detector etc.Yet the thickness of the electronic circuit board of each layer is generally more than the 50 μ m, and under the situation of the fo multi-layer electronic circuit substrate more than 4 layers, the total of thickness can surpass 200 μ m.Therefore,, then be difficult to form the structure of the fo multi-layer electronic circuit substrate of this kind more than 4 layers if the thickness that makes resilient material of employing in above-mentioned patent documentation 1 is the structure below the 200 μ m, impracticable.
Even change the material of resin bed 16 (circuit substrate resin), as long as this material coefficient of thermal expansion coefficient is at rubber layer below 14, the total thickness t of a plurality of layers 24 is below the 1400 μ m, therefore this a plurality of layer 24 supporting substrates 12 (polymkeric substance, metal, pottery etc.) that is subordinated to its maintenance so even can provide the also high inspection detector of precision under a kind of environment of the variation fierceness in temperature etc.
(another embodiment)
In example shown in Figure 3, the inspection that foil detector 10 carried out, a plurality of integrated circuit 30 (determined electronic circuit 20) of determination object for for example on the semiconductor wafer 32 (matrix material 22) of silicon system, making.Foil detector 10 forms for example circular corresponding to the semiconductor wafer 32 of circular.A plurality of layers 24 for example sandwich the rubber layer 14 of one deck and constitute between two-layer resin bed 16.The integrated circuit 30 opposed sides with on the semiconductor wafer 32 in the two-layer resin bed 16 are used for example polyimide.As mentioned above, the total thickness t of these a plurality of layers 24 is below the above 1400 μ m of 20 μ m.
The portion of terminal 30A that partly lead in the integrated circuit 30 on body wafer 32 inspection that is provided with, measures usefulness is atomic thin, and sum relates to 2～40,000 places.The resin bed 16 of foil detector 10 is provided with the corresponding detection terminal 18 with each portion of terminal 30A.By using electroforming, can easily fine a plurality of detection terminals 18 like this be made on resin bed 16.In the present embodiment, each is surveyed terminal 18 and is electrically connected with outside terminal (not shown) on being arranged on supporting substrates 12, rubber layer 14 or resin bed 16 via being arranged on circuit (not shown) on resin bed 16, the rubber layer 14 or via hole (not shown).
By this foil detector 10 is overturn along the arrow A direction, and make respectively survey terminal 18 respectively with corresponding portion of terminal 30A butt, thereby can once carry out whole integrated circuit 30 of making on the semiconductor wafer 32 inspection, measure operation, can shorten the activity duration significantly.And, therefore can save cost with inferior waste product chipization owing to can before cutting out each integrated circuit 30, differentiate time waste product from semiconductor wafer 32.
In addition, in the foil detector 10 of circular, example as shown in Figure 2 is such, also can make rubber layer 14 or resin bed 16 outstanding to radial outside from the complete cycle of supporting substrates 12, and the terminal (not shown) that is equivalent to outside terminal 34 is set on this teat.And the flat shape of foil detector 10 is not limited to circular, also can be polygon etc.And the structure of a plurality of layer 24 is not limited to above-mentioned structure, can be for two-layer, and also can be for more than 4 layers.
(test example 1)
Fig. 4 is the total thickness t that makes a plurality of layers 24 of parts (foil detector) that a plurality of layers 24 that form with respect to the swell increment of temperature variation and the silicon rubber by the stacked example as rubber layer 14 on this aluminium last layer layer ground with as the polyimide of an example of resin bed 16 as the aluminium of an example of the material of supporting substrates 12 of actual measurement the are shown line chart with respect to the result of the elongation separately of temperature variation when changing.The slope of each line is equivalent to thermal expansivity.Among Fig. 4 in order to compare the result who also shows aluminium monomer, rubber monomer and polyimide monomer.From this figure as can be known, the slope of the line of the line of rubber monomer and polyimide monomer and aluminium monomer differs greatly.
On the other hand, with silicon rubber and polyimide from level to level the total thickness t of a plurality of layers 24 of stratum poststack be 1400 μ m when following, the slope of line is consistent with the slope of aluminium monomer.Yet when the total thickness t of a plurality of layers 24 surpasses 1400 μ m (2050 μ m), the slope of line is different with the slope of the line of supporting substrates 12.That is, surface as a result, as long as the total thickness t of the layer of silicon rubber and polyimide is in proper range, its thermal expansivity just becomes consistent with the thermal expansivity as the aluminium of supporting substrates 12.
Fig. 5 is illustrated in humidity that silicon rubber is used as the test portion of rubber layer 14 is set on the supporting substrates 12 of aluminum changes line chart with the relation of length growth rate.Specifically, when the temperature around illustrating is 25 ℃, be increased under 95% the situation from 60% in humidity, which kind of degree is the distance of the point to point on the silicon rubber (spacing) increased and decreased from 100mm.According to this figure as can be known, when the thickness of silicon rubber is 2000 μ m, follow the variation of above-mentioned humidity, spacing changes to 100.0094mm (increasing by 9.4 μ m), with respect to this, when the thickness of silicon rubber was 800 μ m and 1400 μ m, spacing all changed to 99.9997 μ m (reducing by 0.3 μ m), as long as the thickness of silicon rubber is 1400 μ m, the just influence that not changed by humidity.
In addition, Fig. 6 is illustrated in polyimide is set on the supporting substrates 12 of aluminum changes line chart with the relation of length growth rate as the humidity in the test portion of resin bed 16.Specifically, illustrate in the same manner with Fig. 5, when temperature around is 25 ℃, be increased under 95% the situation from 60% in humidity, which kind of degree is the distance of the point to point on the polyimide (spacing) increased and decreased from 100mm.
According to this figure, when the thickness of polyimide is 2000 μ m, follow the variation of above-mentioned humidity, spacing changes to 100.0059mm (increasing by 5.9 μ m), with respect to this, when the thickness of polyimide was 1400 μ m, spacing changed to 100.0002 μ m (increasing by 0.2 μ m), as long as the thickness of polyimide is below the 1400 μ m, the just influence that not changed by humidity.
Claims (4)
1. foil detector has:
By have with as the supporting substrates of checking, the material of thermal expansivity that the matrix material of the determined electronic circuit of determination object is identical constitutes;
Be layered in the elastic layer on this supporting substrates;
Further be layered on the described elastic layer, in use with the opposed resin bed of described determined electronic circuit;
Be arranged on this resin bed, with the mode that electrically contacts with a plurality of portion of terminal that on described determined electronic circuit, are provided with respectively a plurality of detection terminals with the corresponding configuration in the position of this portion of terminal,
Comprising described elastic layer and described resin bed is more than the 20 μ m and below the 1400 μ m at interior a plurality of layers the total thickness that is layered on the described supporting substrates.
2. foil detector according to claim 1, wherein,
Described elastic layer is a rubber layer.
3. foil detector according to claim 1 and 2, wherein,
Described resin bed is made of the thermal expansivity resin material littler than described elastic layer.
4. foil detector according to claim 1 and 2, wherein,
Described determined electronic circuit is integrated circuit, light emitting diode, LCD, printed circuit board or flexible base, board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-247534 | 2009-10-28 | ||
| JP2009247534A JP2011095028A (en) | 2009-10-28 | 2009-10-28 | Probe sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102053178A true CN102053178A (en) | 2011-05-11 |
| CN102053178B CN102053178B (en) | 2013-12-18 |
Family
ID=43957713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010514822 Expired - Fee Related CN102053178B (en) | 2009-10-28 | 2010-10-18 | Detection piece |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011095028A (en) |
| CN (1) | CN102053178B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104950484A (en) * | 2014-03-25 | 2015-09-30 | 夏普株式会社 | Substrate detection device and method |
| CN105204198A (en) * | 2015-10-15 | 2015-12-30 | 武汉华星光电技术有限公司 | Display panel and test system for display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0629867A1 (en) * | 1993-06-16 | 1994-12-21 | Nitto Denko Corporation | Probe structure |
| JPH0783953A (en) * | 1993-09-14 | 1995-03-31 | Matsushita Electric Ind Co Ltd | Probe for circuit board inspection, circuit board inspection system provided with it and manufacture of probe for circuit board inspection |
| CN1179006A (en) * | 1996-10-04 | 1998-04-15 | 三菱电机株式会社 | Probe card and tester using said card |
| CN1477691A (en) * | 2002-07-23 | 2004-02-25 | 富士通株式会社 | Method for testing probe board and semiconductor chip, capacitor and mfg. method thereof |
| CN1614426A (en) * | 2003-11-07 | 2005-05-11 | 日本电子材料株式会社 | Probe sheet and probe sheet unit using same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3677027B2 (en) * | 1994-02-21 | 2005-07-27 | 株式会社ルネサステクノロジ | Connected device |
| JP4306911B2 (en) * | 2000-02-21 | 2009-08-05 | 株式会社日本マイクロニクス | Electrical connection device |
| JP3938117B2 (en) * | 2002-08-09 | 2007-06-27 | Ｊｓｒ株式会社 | Anisotropic conductive connector, probe member, wafer inspection apparatus and wafer inspection method |
-
2009
- 2009-10-28 JP JP2009247534A patent/JP2011095028A/en active Pending
-
2010
- 2010-10-18 CN CN 201010514822 patent/CN102053178B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0629867A1 (en) * | 1993-06-16 | 1994-12-21 | Nitto Denko Corporation | Probe structure |
| JPH0783953A (en) * | 1993-09-14 | 1995-03-31 | Matsushita Electric Ind Co Ltd | Probe for circuit board inspection, circuit board inspection system provided with it and manufacture of probe for circuit board inspection |
| CN1179006A (en) * | 1996-10-04 | 1998-04-15 | 三菱电机株式会社 | Probe card and tester using said card |
| CN1477691A (en) * | 2002-07-23 | 2004-02-25 | 富士通株式会社 | Method for testing probe board and semiconductor chip, capacitor and mfg. method thereof |
| CN1614426A (en) * | 2003-11-07 | 2005-05-11 | 日本电子材料株式会社 | Probe sheet and probe sheet unit using same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104950484A (en) * | 2014-03-25 | 2015-09-30 | 夏普株式会社 | Substrate detection device and method |
| CN104950484B (en) * | 2014-03-25 | 2018-05-11 | 夏普株式会社 | Inspecting substrate detection device and substrate inspecting method |
| CN105204198A (en) * | 2015-10-15 | 2015-12-30 | 武汉华星光电技术有限公司 | Display panel and test system for display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011095028A (en) | 2011-05-12 |
| CN102053178B (en) | 2013-12-18 |
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