JP2001124799A - Probe sheet, method for manufacturing it, and probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the electrical insulating film scratching-off function of a probe sheet and the mechanical strengths of the probe elements of the sheet. SOLUTION: A probe sheet has a plurality of wiring formed on a resin-made sheet-like member and contains one or more probe areas each of which is provided with a plurality of cantilever-like probe elements. The probe elements are successively formed from the sheet-like member and the remaining areas of the wiring at the rear end section of the probe sheet so that lump electrodes may be arranged in at least one row. The lump electrodes have drill-like shapes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe sheet that uses a part of a plurality of wirings formed on a sheet member as a probe element, a probe card using the probe sheet,
And a method for manufacturing a probe sheet.

[0002]

2. Description of the Related Art Generally, a semiconductor wafer includes a plurality of semiconductor devices, that is, IC chips (in the present invention,
Simply referred to as "chips". ) Are formed in a matrix. Each chip has a rectangular shape, and has a plurality of electrode pads or electrodes at each of a plurality of edges corresponding to each side of the square. The chips forming each row and each column of the matrix are linearly aligned.

[0003] A chip of this kind is subjected to a conduction test to determine whether or not the circuit operates according to specifications. Such an energization test is often performed before the wafer is separated from the wafer, and a needle type (or a film type) having a plurality of probes (or probe elements) whose needle tips are pressed against electrodes is used. This is performed using a probe card as a connection device. In this type of conduction test, if chips are inspected one by one, it takes a long time to inspect all the chips on one wafer.

In view of the above, various probe cards for inspecting a plurality of chips on one wafer at a time have been proposed. When using a probe card of this type, chips on one wafer are divided into a plurality of chips every other or every two or a plurality of groups consisting of a plurality of chips continuous in a row or a column in a row, Inspection is performed for each group, whereby the number of inspections for one wafer is reduced, and the time required for inspection of all chips is reduced.

[0005] However, in the conventional probe card, since the groups that can be inspected at the same time are every other chip or every other chip or chips that are continuous in a row, four adjacent groups are formed through a virtual boundary line that crosses in a cross shape. One chip (ie, four chips located around the intersection of the boundaries)
Cannot be inspected at the same time.

[0006] In the needle type probe card, since a needle setting operation for correctly arranging a large number of probes (needle) on a wiring board is complicated, a part of a plurality of wirings formed on a sheet member is replaced with a probe element. It is more expensive than a film-type probe card using a film-shaped probe unit (probe sheet) as a part of the above.

On the other hand, the conventional film-type probe card uses a hemispherical protruding electrode as a contact portion of the probe element, so that the oxidation formed on the electrode portion of the chip is smaller than that of the needle-type probe card. The function of scraping an electrically insulating film such as a film is low, so that a good electrical connection between the protruding electrode and the electrode of the chip cannot be obtained.

[0008]

In view of the above, a film-type probe card using a protruding electrode having a conical or frustum shape has been proposed. However, since this probe card uses a probe sheet using the semiconductor substrate itself such as silicon as a base member of the probe element, the mechanical strength of the entire probe element is low due to the mechanical brittleness of the semiconductor substrate, and the probe card is short-lived. It is.

Therefore, in the probe sheet,
It is important to enhance the function of scraping the electrically insulating film and the mechanical strength of the probe element.

[0010]

In the probe sheet according to the present invention, a plurality of wirings are formed on a sheet-like member made of resin, and a part of the wiring and a region of the sheet-like member near the wiring are formed. One or more probe regions including a plurality of probe elements each including a protruding electrode provided on the wiring. The probe element is formed in a cantilever shape following the sheet-shaped member and the remaining area of the wiring at the rear end so that the protruding electrodes are located in at least one row. The protruding electrode has a conical shape and is formed at the tip of a corresponding probe element.

A resin sheet member is significantly stronger than a semiconductor substrate such as silicon, and therefore, the mechanical strength of a probe element using such a resin sheet as a base member is high.

The resin sheet-like member and the wiring have a certain degree of rigidity and flexibility, and the probe element having such a member as a base member, combined with its cantilever needle shape, has an overdrive characteristic. As a result, the protruding electrode is displaced with respect to the electrode of the chip so as to reliably apply a rubbing action to the electrode of the chip.

[0013] When the conical protruding electrode is pressed by the electrode of the chip, the conical protruding electrode is easily inserted into the electrode of the chip as compared with the hemispherical protruding electrode. For this reason, the conical protruding electrode reliably applies a rubbing action to the electrode surface of the chip due to the elastic deformation of the probe element due to overdrive.

As described above, a cantilevered probe element using a resin sheet-like member as a base member and a conical protruding electrode has a high mechanical strength as a whole, and furthermore has a chip electrode surface. Of the electrically insulating film is surely scraped off.

[0015] The probe unit may further include a plurality of connecting portions that penetrate at least the sheet-like member in a thickness direction and are electrically connected to the wiring. Such a connecting portion is used as a means for electrically connecting a conductive portion of the base described later to the wiring.

The probe element has a cantilever shape by a notch having a tip portion forming a tip edge thereof and an extension extending rearward from the tip portion between probes adjacent in the arrangement direction of the protruding electrodes. It may be formed.

The extension may have a tapered or stepped bottom in a region extending from a rear end to at least a central portion, the tapered or stepped portion being gradually separated from the wiring toward a portion closer to the tip. Instead of this, the portion of the wiring of the probe element is brought into contact with one surface of the sheet-like member, and the area of the sheet-like member of the probe element is located on the surface opposite to the wiring. It may be a step-shaped or tapered cross-sectional shape that approaches the wiring toward the tip. In any case, since there is no possibility that the probe element is suddenly deformed at the rear end portion during overdrive, generation of cracks formed at the rear end portion of the probe element due to repeated elastic deformation of the probe element is suppressed, and long life is reduced. become.

[0018] The probe element may be deformed in such a manner that a part on the tip end side thereof protrudes from the remaining area of the sheet-like member. In this case, when the probe element is elastically deformed by the overdrive, there is no possibility that the remaining portion of the sheet-shaped member contacts the chip.

The probe region includes a plurality of probe element groups each including a plurality of the probe elements,
In each probe element group, the protruding electrodes may be located at positions corresponding to sides of a virtual square. By doing so, it is possible to conduct a conduction test of a chip having a plurality of electrodes on each side of a square.

[0020] The probe regions may be formed in a matrix. By doing so, it is possible to simultaneously conduct the conduction test of a plurality of chips located around a virtual line crossing in a cross shape.

The wiring of each probe element group may extend from the tip of the corresponding probe element to the inside of the corresponding probe area. By doing so, there is no possibility that the wires in the adjacent probe areas will interfere with each other.

A probe card according to the present invention includes: a plate-like base having a plurality of conductive portions; and a probe sheet as described above, which is disposed on one surface of the base. The wiring of the sheet is individually electrically connected to the conductive portion of the substrate. According to such a probe card, the same operation and effect as those of the probe sheet that has been shown can be obtained.

The base includes a first substrate having a plurality of tester lands, and a second substrate disposed on one surface side of the first substrate, and the probe sheet is provided on the second substrate. And the second substrate may have a plurality of first conductive portions that electrically connect the wiring of the probe sheet and the tester lands of the first substrate. By doing so, the positioning operation of the probe sheet with respect to the base becomes easier as compared with the case where the probe sheet is directly arranged on the large first substrate.

[0024] The probe card may further include one or more film-like connection substrates having a second conductive portion for electrically connecting the first conductive portion and the tester land. In that case, the second substrate with respect to the first substrate
This facilitates the substrate alignment operation.

The base is further formed of one or more elastic members extending in the direction in which the protruding electrodes of the probe element are arranged, and a portion of the probe element on the tip side protruding from the remaining area of the sheet-like member. And an elastic body disposed on the second substrate. If you do that,
The projecting electrode is reliably projected from the remaining area of the sheet-like member. Also. Since the elastic body is elastically deformed when the overdrive acts on the probe element, the pressure (needle pressure) between the protruding electrode and the tip electrode increases.

In the method of manufacturing a probe sheet according to the present invention, a plate-like member having a silicon dioxide film on both surfaces of a silicon substrate is prepared, a photosensitive agent is applied to both silicon films, and one or more portions of one of the photosensitive agents are applied. Exposure for the protruding electrode is performed, and both photosensitive agents are developed to form holes in the exposed portions of the one photosensitive agent, and one silicon film is etched to correspond to the holes in the one silicon film. Forming a second hole, removing both photosensitive agents, performing anisotropic etching on the silicon substrate using the remaining silicon films as a mask to form a conical recess in the silicon substrate, A second photosensitive agent is applied to one of the silicon films, and one or more portions of the second photosensitive agent are exposed for wiring, and the second photosensitive agent is developed to form a second photosensitive agent. Forming a hole area in the exposed area,
The protruding electrode and the wiring are formed on the one silicon film by plating using the second photosensitive agent as a mask, and an electrically insulating resin layer is formed on the protruding electrode and the wiring and the remaining second photosensitive agent. And removing the second photosensitive agent and the plate-like member from the protruding electrodes, the wiring, and the resin layer.

According to the above manufacturing method, it is possible to easily and inexpensively manufacture a probe sheet using a resin-made sheet-like member as a base member and a cantilever needle-like probe element using a conical projection electrode. Can be.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 to 6, a probe card 10 includes a plurality of semiconductor devices (ie, chips) formed in a matrix on a semiconductor wafer.
It is used for a current test. In the following description, it is assumed that all chips have a rectangular shape, and that each side of the rectangle has an electrode group including a plurality of electrodes arranged in a row.

The probe card 10 includes a quadrangular probe sheet 12, a disc-shaped first substrate 14, and a rectangular second substrate 16 disposed below the first substrate 14.
It includes a film-shaped connection substrate 18 for connecting the first and second substrates 14 and 16, and a plurality of inverted L-shaped holders 20 for assembling the second substrate 16 to the first substrate 14.
In the embodiment shown, the first and second substrates 14 and 16 serve as bases.

In the probe sheet 12, a plurality of wirings 22 are formed on a sheet-like member (film-like member) 24 made of an electrically insulating resin such as polyimide. Part. The protruding electrode 26 is pressed relatively to the electrode of the chip, and functions as a contact portion that contacts the electrode. The protruding electrode 26
In the illustrated example, the shape is a quadrangular pyramid, but the shape may be a polygonal pyramid such as a hexagonal pyramid, an octagonal pyramid, or a conical shape.

In the illustrated embodiment, the probe sheet 12
Has four rectangular probe regions (rectangular regions) 28 formed by four rows of projecting electrode groups, respectively, in a matrix. Each probe region 28 individually corresponds to a chip to be inspected, and is defined by a virtual boundary 30 corresponding to the boundary of the chip on the semiconductor wafer. The probe region 28 has the same rectangular shape as the corresponding chip.

Each of the protruding electrodes 26 and the area of the wiring 22 on the side where the protruding electrodes 26 are formed are cooperated with the area of the sheet-like member 24 in the vicinity thereof to form a probe element corresponding to the electrode of the chip. 32 are formed. Probe element 3
2 and the protruding electrodes 26 are positioned so that the protruding electrodes 26 are arranged in accordance with the electrode arrangement of the chip.

In the illustrated example, since each chip has an electrode group consisting of a plurality of electrodes arranged in a row on each side of the rectangle, the probe element 32 and the protruding electrode 26 are
6 are positioned so as to be arranged in a row for each protruding electrode group (probe element group).

However, when the chip to be inspected has a plurality of electrodes in a zigzag manner or in a plurality of rows on each side of the rectangle, the probe elements 32 and the protruding electrodes 26 are arranged such that the protruding electrodes 26 are provided for each protruding electrode group (for each ) Are positioned so as to be substantially linear, such as a zigzag or a plurality of rows.

Each probe element 32 cantileverly extends from the remaining area of both the wiring 22 and the sheet-like member 24 by a cut 34 formed in the sheet-like member 24 near one end of the wiring 22. Also, the adjacent probe element 32
Is independent from The notch 34 is U in the illustrated example.
Although the shape is a letter, other shapes such as a V-shape and a U-shape may be used.

As shown in FIGS. 5 and 6, each notch 34 has a distal end forming the distal end edge of the probe element 32,
An extension extends rearward from the tip portion between probe elements 32 adjacent to each other in the arrangement direction of the protruding electrodes 26.

The leading end of the notch 34 is
4 penetrates. Each extension of the notch 34 has a probe element 3 in the area extending from its rear end to at least the central part.
2 has a tapered (or stepped) bottom 36 that is gradually separated from the wiring 22 as it is closer to the distal end.

The extension of the cut 34 may be a common extension or a separate extension between the probe elements 32 adjacent to each other in the arrangement direction of the protruding electrodes 26. In each case, each probe element 32 is integrated at its rear end with the remaining portion of the wiring 22 and the remaining portion of the sheet-like member 24, and can be independently bent by the cutout 34.

Each wiring 22 extends from the front end of the probe element 32 to the inside of the probe region 28, and has an annular connection land 38 at the rear end. Probe sheet 1
2 also has a plurality of conductive connecting portions 40 individually connected to the connecting land portions 38 of the wiring 22. Each connection part 4
Reference numeral 0 denotes a conductive through hole that penetrates through the land portion 38 of the corresponding wiring 22 and the sheet member 24 in the thickness direction.

The probe sheet 12 can be manufactured by using a general etching technique, an anisotropic etching technique for a crystalline silicon substrate, a plating technique, an electroforming technique, a laser processing technique, or the like. The material of the protruding electrode 26 may be the same as or different from that of the wiring 22. The protruding electrode 26 may be made of a metal material, such as nickel, which is harder than the electrode material of the chip to be inspected.

Each probe element 32 is shown in FIGS.
As shown in (C), a part of the leading end side protrudes from the remaining area of the sheet-like member 24. Such a deformation is, for example, after the probe sheet 12 is manufactured as described above, the probe element 32 is heated to an appropriate temperature while being elastically deformed as described above, and then cooled while being elastically deformed. Can be given by so-called annealing.

The first substrate 14 has a rectangular opening 42 (see FIG. 2) which penetrates the first substrate 14 in the thickness direction at the center, and has a plurality of tester lands 44 on the upper surface of the outer peripheral portion. The wiring board has a plurality of wirings (wiring patterns) (not shown) individually connected to the tester lands 44 in a region inside the tester lands 44. The first substrate 14 can be manufactured using a known printed wiring technique, an etching technique, a plating technique, or the like using an electrically insulating material.

The second substrate 16 is made of an electrically insulating material such as polyimide or ceramic, and has four probe regions 2.
8 are formed to have substantially the same planar shape and size as the planar shape and size formed by. The second substrate 16
A plurality of connecting portions 46 connected one-to-one to the connecting portions 40 of the probe sheet are provided at locations corresponding to the probe regions 28.

Each connecting portion 46 penetrates through the second substrate 16 in the thickness direction, and is used as a signal or ground line corresponding to the probe element 32 individually. Each connection 46 can be a conductive via. The second substrate 16 is assembled with the plurality of holders 20 below the first substrate 14.

The probe sheet 12 is formed so that the protruding electrodes 26 face downward and the arrangement direction of the protruding electrodes 26 is the extending direction of the edge of the probe region 28 for each protruding electrode group. It is mounted on the lower surface of the substrate 16 by pressure bonding or bonding.

In a state where the probe sheet 12 is assembled on the second substrate 16 as described above, a part of the tip side of each probe element 32 is projected from the remaining area of the sheet member 24 and each of the wirings 22 is formed. Is the corresponding bump electrode 26
To the inside of the corresponding probe region 28.

Each of the film-like connection boards 18 is formed by connecting a plurality of wirings 50 to an electrically insulating resin film 5 such as polyimide.
2 on one side. One end of each wiring 50 is electrically connected to the connection portion 46 of the second substrate 16 in one-to-one manner by a solder 54 (see FIG. 4), and the same type of solder (not shown) is used at the other end. The first substrate 14
(Not shown) in a one-to-one manner. These solders penetrate the wiring 50 and the film 52 in the thickness direction.

When inspecting a chip on a semiconductor wafer, the protruding electrodes 26 are pressed against the electrodes of the chip. At this time, since the distal end portion of the probe element 32, in particular, each of the protruding electrodes 26 protrudes below other regions of the probe region 28, each of the protruding electrodes 26 reliably contacts the electrode of the chip.

When the protruding electrode 26 is pressed against the electrode of the chip, the probe element 32 slightly curves so as to compress the elastic body 26 by overdrive, and the protruding electrode 26 slides against the electrode of the chip. Thereby, the projection electrode 26
Rubs the electrode of the chip and scrapes the oxide film on the surface of the electrode. For this reason, the protruding electrode 26 electrically contacts the electrode of the chip.

Probe card 10 and probe sheet 1
According to 2, the following operational effects are obtained.

Since the resin sheet member 24 is significantly stronger than a semiconductor substrate such as silicon, the mechanical strength of the probe element 32 using such a resin sheet member 24 as the base member of the probe sheet 12 is improved. The strength is higher than that of the semiconductor substrate.

Since the sheet-like member 24 having a certain degree of rigidity and flexibility is used as the base member, the probe element 32 is reliably elastically deformed by overdrive, in combination with the fact that the probe element 32 has a cantilever needle shape. The protruding electrode 26 is displaced with respect to the electrode of the chip to reliably apply a rubbing action to the electrode of the chip.

Since the protruding electrode 26 has a sharp conical shape, when it is pressed by the electrode of the chip, the protruding electrode 26 is more easily inserted into the electrode of the chip than a hemispherical protruding electrode. Therefore, the protruding electrode 26 reliably applies a rubbing action to the electrode surface of the chip due to the elastic deformation of the probe element 32 due to overdrive.

In the region where the extension of the cut 34 extends from the rear end to at least the center, the wiring 2
Tapered (or stepped) bottom 3 gradually deviating from 2
6, the probe element 3 during overdrive
There is no possibility that 2 will be bent sharply at the rear end. Therefore, generation of cracks formed at the rear end of the probe element 32 due to repetition of the elastic deformation of the probe element 32 is suppressed, and the life is extended.

Since a part of the tip end of the probe element 32 protrudes from the remaining area of the sheet-like member 24, when the probe element 32 is elastically deformed by overdrive, the protruding electrode 26 is securely connected to the electrode of the chip. However, there is no possibility that the remaining portion of the sheet-like member 24 contacts the chip.

The probe region 28 includes a plurality of probe element groups each including a plurality of probe elements 32,
Since each probe element group positions the protruding electrodes 26 at positions corresponding to the sides of the virtual rectangle, it is possible to perform a conduction test of a chip having a plurality of electrodes on each side of the rectangle.

Since the probe regions 28 are formed in a matrix, a plurality of chips located around a virtual boundary line intersecting in a cross shape can be simultaneously subjected to a conduction test.

The wiring 22 of each probe element group is connected to the corresponding probe region 28 from the tip of the corresponding probe element 32.
, The wiring of the adjacent probe regions 28 does not interfere with each other, and the probe elements 32 and the probe regions 28 are arranged at a high density, and a virtual boundary line 30 is formed.
A plurality of chips around the intersection can be inspected simultaneously.

The probe sheet 12 is placed on a second substrate 16 smaller than the first substrate 14, and the second substrate 16 is
Since the probe sheet 12 is disposed on the large first substrate 14, the first
And probe sheet 1 for second substrates 14 and 16
2 facilitates the alignment work.

Since the wiring of the first substrate 14 and the connecting portion 46 of the second substrate 16 are electrically connected by the wiring of the connection substrate 18, the second substrate 14 is connected to the first substrate 14.
Alignment work becomes easier.

Next, a method of manufacturing the probe sheet 12 having the conical protruding electrodes 26 will be described below with reference to FIGS.

First, as shown in FIG. 7A, a plate member 64 having a silicon dioxide film 62 on both surfaces of a crystalline silicon substrate 60 is prepared.

Next, as shown in FIG. 7B, a photosensitive agent 66 is applied to both silicon films 62,
Exposure for the protruding electrodes is performed at a plurality of locations of
Is developed. As a result, a hole 68 is formed at the exposed portion of one photosensitive agent 62.

Next, as shown in FIG. 7C, one silicon film 62 is etched. Thereby, a second hole 70 corresponding to the hole 68 is formed in the one silicon film 62.

Next, as shown in FIG. 7D, both photosensitive agents 66 are removed, and both silicon films 62 are exposed.

Next, as shown in FIG. 7E, anisotropic etching is performed on the silicon substrate 60 using the remaining silicon films 62 as a mask. Thereby, the second hole 7
A conical recess 72 corresponding to 0 is formed in the silicon substrate 60.

Next, as shown in FIG. 8A, a second photosensitive agent 74 is applied to one of the silicon films 62, and a plurality of portions of the second photosensitive agent 74 are exposed for the wiring 22. The second photosensitive agent 74 is developed. As a result, a hole area 76 for the wiring 22 is formed at the exposed portion of the second photosensitive agent 74.

Next, as shown in FIG. 8B, a conductive material such as nickel is plated on one silicon film 62 using the second photosensitive agent 74 as a mask. This allows
The wiring 22 and the protruding electrode 26 are formed.

Next, as shown in FIG. 8C, the electrically insulating resin layer 78 as the sheet member 24 is
It is formed on the protruding electrode 26 and the remaining second photosensitive agent 74.

Next, as shown in FIG. 8D, the second photosensitive agent 74 and the plate-like member 64 are
And is removed from the resin layer 78. Thereby, a plurality of probe elements 32 are formed.

Next, as shown in FIGS. 6A and 6B, the cuts 34 are formed by laser processing into the sheet-like members 24.
Formed. Thereby, each probe element 32 can be elastically deformed independently.

Next, as shown in FIG. 6C, each probe element 32 is deformed so that a part on the tip side protrudes from the remaining area of the sheet-like member 24.

The probe sheet 1 manufactured as described above
2 is mounted on the lower surface of the second substrate 16 as described above. According to the above-described manufacturing method, the probe sheet 12 in which the resin sheet member 24 is used as the base member and the cantilever probe element 32 using the conical projection electrode 26 is easily and inexpensively manufactured. be able to.

Instead of forming the extension of each cut 34 into a shape having a tapered (or stepped) bottom 36 as shown in FIG. 6, a sheet-like member of the probe element 32 as shown in FIG. The region 24 may have a step-shaped (or tapered) cross-sectional shape in which the portion on the surface opposite to the wiring 22 is closer to the wiring 22 as it approaches the tip. Even in this case, since there is no possibility that the probe element 32 bends sharply at the rear end portion during overdrive, generation of cracks formed at the rear end portion of the probe element due to repeated elastic deformation of the probe element 32 is suppressed. It will be a long life.

Further, as shown in FIG. 10A, the rear end of the extension of each cut 34 may extend toward the adjacent probe element 32 (in the arrangement direction of the protruding electrodes 26) in the same probe element group. Then, the rear end of the extension of each cut 34 is shown in FIG.
As shown in FIG. 10 (B), the probe may be displaced toward the adjacent probe element 32 in the same probe element group over a predetermined length range.
As shown in (C), the rear end portion may be displaced such that it is closer to the adjacent probe element 32 in the same probe element group. In any case, since the rear end of the probe element 32 is reinforced, the generation of cracks formed at the rear end of the probe element due to repeated elastic deformation of the probe element 32 is suppressed, and the life is extended.

As shown in FIG. 11, one or more long elastic members 80 are provided on the lower surface of the second substrate 16 so that the elastic members 80 extend in the direction in which the protruding electrodes 26 of the probe element 32 are arranged.
A part of the probe element 32 on the tip side may be protruded from the remaining area of the sheet-like member 24 by disposing a part of the probe element 32 in a state of protruding downward. By doing so, the projection electrode 26
Is reliably projected from the remaining area of the sheet-like member 24.
Also. When the overdrive acts on the probe element 32, the elastic body 80 is elastically deformed.
The relative pressure (needle pressure) acting between the electrode and the tip electrode increases.

As shown in FIG. 12, an anisotropic conductive sheet 82 having conductivity only in the thickness direction is
And the second substrate 16. The anisotropic conductive sheet 82 is heat-pressed to the lower surface of the second substrate 16, and the probe sheet 12 is heat-pressed to the lower surface of the anisotropic conductive sheet 82 in the remaining portion of the sheet member 24. For this reason, each probe element 32 is maintained by the anisotropic conductive sheet 82 in a state in which a part on the tip side protrudes from the remaining area of the sheet-like member 24.

The first substrate 14 and each film-like connection substrate 1
8, the second substrate 16 and each film-like connection substrate 18
Alternatively, an anisotropic conductive sheet having conductivity only in the thickness direction may be disposed between the two, and the two may be joined by heat compression.

Although the above embodiment relates to a probe sheet and a probe card for a chip having a plurality of electrodes on each side of a rectangle, the present invention relates to not only a probe sheet and a probe card for such a chip but also a plurality of electrodes. Can be applied to a probe sheet and a probe card for other chips, such as a chip having on each of a pair of opposed sides of a rectangle, a chip having only a plurality of electrodes in a line, and the like.

In the above embodiment, a relatively small number of probe regions and probe elements are shown, but this is for ease of understanding, and therefore, actually depends on the number of chips to be tested at one time. It has a number of probe regions and a number of probe elements corresponding to the number of electrodes provided on the chip. Further, the probe sheet 12 may be directly mounted on the first substrate 14 without using the second substrate 16 and the connection substrate 18. The incision is made between the adjacent probe elements of one of the probe element groups 32 of the adjacent probe element group 32 via the boundary line 30 of the adjacent probe region 28 and adjacent to the other probe element group across the boundary line 30. It may be a linear cut extending between the mating probe elements.

The present invention is not limited to the above embodiment, but can be variously modified without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is a bottom view showing one embodiment of a probe card according to the present invention.

FIG. 2 is a front view of a part of the probe card shown in FIG. 1;

FIG. 3 is a sectional view showing one embodiment of a combined state of a probe sheet, a second substrate, and a connection substrate.

FIG. 4 is an enlarged sectional view of a part of FIG.

FIG. 5 is a perspective view showing one embodiment of a probe element.

6 shows the probe element of FIG. 5, wherein (A)
Is a plan view before deformation, (B) is a cross-sectional view taken along line 6B-6B in (A), and (C) is a cross-sectional view after deformation.

FIG. 7 is a diagram for explaining a method of manufacturing a probe sheet.

FIG. 8 is a view for explaining a manufacturing process following FIG. 7;

FIG. 9 shows another embodiment of the probe element,
(A) is a plan view before deformation, (B) is 9B-9B of (A).
Sectional view obtained along the line, (C) is a sectional view after deformation.

FIG. 10 is a view showing another embodiment of the cut.

FIG. 11 is a sectional view showing another combination state of the probe sheet, the second substrate, and the connection substrate.

FIG. 12 is a sectional view showing still another combination state of the probe sheet, the second substrate, and the connection substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Probe card 12 Probe sheet 14 1st substrate 16 2nd substrate 18 Connection board 20 Holder 22 Wiring of probe sheet 24 Sheet member of probe sheet 26 Protruding electrode 28 Probe area 30 Probe area boundary 32 Probe element 34 Cut 36 bottom

Claims (14)

[Claims] 1. A probe sheet in which a plurality of wirings are formed on a sheet member made of resin, comprising: a part of the wiring, a region of the sheet member in the vicinity thereof, and a protruding electrode provided on the wiring. A plurality of probe elements each including a plurality of probe elements, each of the probe elements having a rear end portion connected to the sheet-shaped member and the remaining area of the wiring so that the protruding electrodes are positioned in at least one row. A probe sheet, which is formed in a beam shape, wherein the protruding electrode has a conical shape, and is formed at a tip end of a corresponding probe element. 2. The probe sheet according to claim 1, further comprising a plurality of connection portions that penetrate at least the sheet-shaped member in a thickness direction and are electrically connected to the wiring. 3. The cantilever beam of the probe element is formed by a notch having a tip portion forming a tip edge thereof and an extension extending rearward from the tip portion between probes adjacent in the arrangement direction of the protruding electrodes. The probe sheet according to claim 1, wherein the probe sheet is formed in a shape. 4. The extension portion has a tapered or stepped bottom in a region extending from a rear end to at least a central portion, the tapered or stepped bottom being gradually separated from the wiring toward a portion closer to the tip end.
The probe sheet according to claim 3. 5. The wiring portion of the probe element is in contact with one surface of the sheet-like member, and the area of the sheet-like member of the probe element is a surface of the surface opposite to the wiring. The probe sheet according to any one of claims 1 to 4, wherein the portion has a stepped or tapered cross-sectional shape closer to the wiring toward the distal end side. 6. The probe sheet according to claim 1, wherein the probe element is deformed so that a part of a tip side thereof protrudes from a remaining region of the sheet-shaped member. . 7. The probe region includes a plurality of probe element groups each including a plurality of the probe elements, and each probe element group positions the protruding electrode at a position corresponding to a virtual square side. Claims 1 to 6
The probe sheet according to any one of the above. 8. The probe sheet according to claim 7, wherein the probe regions are formed in a matrix. 9. The probe sheet according to claim 7, wherein the wiring of each probe element group extends from the tip of the corresponding probe element to the inside of the corresponding probe region. 10. A probe sheet according to claim 1, comprising a plate-like base having a plurality of conductive portions, and a probe sheet disposed on one surface of the base. A probe card, wherein wires of the probe sheet are individually electrically connected to conductive portions of the substrate. 11. The base includes: a first substrate having a plurality of tester lands; and a second substrate disposed on one surface side of the first substrate. The probe according to claim 10, wherein the second substrate has a plurality of first conductive portions that electrically connect the wiring of the probe sheet and the tester lands of the first substrate. card. 12. The semiconductor device according to claim 1, further comprising a second conductive portion electrically connecting said first conductive portion and said tester land.
The probe card according to claim 11, comprising the film-like connection board. 13. The base further includes one or more elastic members extending in a direction in which the protruding electrodes of the probe element are arranged, and a part of a tip side of the probe element protruding from a remaining area of the sheet-shaped member. The probe card according to claim 11, further comprising: an elastic body disposed on the second substrate in a state where the elastic body is placed. 14. A plate-like member having a silicon dioxide film on both sides of a silicon substrate is prepared, a photosensitive agent is applied to both silicon films, and one or more portions of one of the photosensitive agents are exposed for a protruding electrode, Developing both photosensitizers to form holes in the exposed portions of the one photosensitizer, etching one silicon film to form second holes corresponding to the holes in the one silicon film; The photosensitive agent is removed, anisotropic etching is performed on the silicon substrate using the remaining silicon films as masks to form conical recesses in the silicon substrate, and a second photosensitive film is formed on the one silicon film. Applying an agent to perform exposure for wiring at one or more locations of the second photosensitive agent, and developing the second photosensitive agent to form a hole area at the exposed location of the second photosensitive agent; Using the second photosensitive agent as a mask, the protruding electrode and the Forming a line on the one silicon film by plating; forming an electrically insulating resin layer on the protruding electrode and the wiring and the remaining second photosensitive agent; A method for manufacturing a probe sheet, comprising removing the second photosensitive agent and the plate-like member.