JP4455940B2 - Electrical connection device - Google Patents

Description

The present invention relates to an electrical connection device such as a probe card for electrically connecting an integrated circuit as an object to be inspected and an electrical circuit of the inspection device.
〔Definition of terms〕

  In the present invention, the thickness direction of the substrate is referred to as the vertical direction, the probe tip side (semiconductor wafer side) with respect to the substrate is referred to as the downward direction, and two directions of rectangular coordinates parallel to each substrate are the X direction and This is called the Y direction.

  However, in the actual use of the electrical connection device, the thickness direction of the substrate may be oblique or lateral, or the vertical direction may be reversed.

  An integrated circuit such as a semiconductor device is subjected to an energization test (inspection) as to whether or not its internal circuit operates according to the specifications. Such an energization test is performed using an electrical connection device such as a probe card in which a plurality of probes whose needle tips are pressed against the electrodes of the integrated circuit are arranged on the lower surface of the insulating substrate.

  As one of the electrical connection devices of this type, an upper plate is disposed below the support plate, a lower plate is disposed below the upper plate, and an intermediate plate is disposed between the upper plate and the lower plate. There is a vertical type device in which a plurality of needle type probes are vertically penetrated through a lower plate and an upper plate, and a lower end (needle tip) of each probe is pressed against an electrode of an object to be inspected (Patent Document 1).

JP 2002-365310 A

  In the above prior art, a plurality of through holes are formed in the support plate, the upper end of each probe is brought into contact with one end of the wiring inserted into the through hole of the support plate, and the other end of the wiring is used as a wiring board. Soldered to a connecting land on a simple board.

  Since the vertical electrical connection device is easier to assemble the probe than a conventional general device in which a needle-type probe bent in an L shape is assembled to a substrate in a cantilever shape, Since it is inexpensive and can increase the arrangement density of the probe, and hence the tip of the needle, it is suitable for a current-carrying test of a high-density integrated circuit having a large number of electrodes, particularly a so-called uncut integrated circuit not cut from a semiconductor wafer. is there.

  However, in the above-described conventional vertical electrical connection device, since the wiring connecting the probe and the connection land passes above the substrate, the upper surface of the substrate and the space above the substrate cannot be used effectively.

  An object of the present invention is to effectively use the upper surface of the substrate and the space above it.

An electrical connection device according to the present invention includes a substrate having a plurality of connection lands on a lower surface, and a support body positioned at the center of the substrate, and extends in parallel with the substrate and penetrates in the thickness direction. A support having a plate portion having a first through hole, and a support portion located above the plate portion to form an inner space in cooperation with the plate portion, and disposed below the plate portion; A probe assembly comprising a plurality of probes extending vertically and having a plurality of second through holes into which the probes are inserted, and a plurality of probes connecting the probes and the connection lands. A plurality of wirings, one end of which is inserted into the first through hole from above.
The support portion has a communication space that allows the inner space to communicate with an outer space around the inner space, and the wiring is passed through the communication space. The support portion includes a frame member surrounding the inner space, and the communication space includes a hole formed in the frame member.

  The plurality of wirings pass through the communication space of the support body from the first through hole, reach the outer space around the support body, and are further connected to connection lands disposed on the lower surface of the substrate. For this reason, the upper surface of a board | substrate and its upper space can be utilized effectively.

  A plurality of the internal spaces may be formed in the support portion. In this way, even if the number of probes is large, the wiring can be divided into a plurality of groups and can be passed through the communication space for each group. For this reason, the apparatus is simplified, and manufacture and maintenance management of the apparatus are facilitated.

  The probe assembly further includes a first plate-like member disposed below the plate portion in parallel with the plate portion, and the plurality of second through holes connect the first plate-like member. A first plate-like member formed so as to penetrate in the thickness direction thereof, and a second plate-like shape spaced apart from the first plate-like member and parallel to the first plate-like member And a second plate-like member having a third through-hole penetrating in the thickness direction thereof, and each probe is inserted into the second penetration and the third penetration You may penetrate the hole.

  The probe assembly further includes a third plate member spaced downward from the second plate member and parallel to the second plate member and penetrating in a thickness direction thereof. And a third plate member having four through holes, and each probe may further pass through the fourth through hole.

  The probe assembly further includes a frame-like spacer disposed between the first and second plate-like members, and one end and the other end of each probe are the first and second plates. They may be shifted from each other in a plane parallel to the shaped member.

  The board includes a wiring board, and the wiring board has a plurality of connection lands disposed on a lower surface thereof, a plurality of connection portions disposed on an upper surface of the wiring board to be connected to a tester, and the connection. You may provide the several wiring which electrically connects a land and the said connection part.

  The electrical connection device may further include a plate-shaped reinforcing member disposed on the upper side of the substrate. By doing so, not only the substrate is reinforced, but also the wiring is not exposed on the other surface (upper surface) of the substrate, so that the substrate can be reinforced more strongly using a large reinforcing member.

  The substrate may further include a hole in the center, and the support may be disposed in the hole and supported by the reinforcing member. By doing so, the thickness dimension (height dimension) of the entire apparatus can be reduced.

  Referring to FIGS. 1 to 6, an electrical connection device 10 uses a plurality of (eight in the example shown in FIG. 1) integrated circuit regions on a semiconductor wafer 12 as test objects, and these test objects. Is used as a probe card for simultaneously inspecting Each object to be inspected has a rectangular shape, and each side has a plurality of electrodes spaced in the direction of the rectangular side.

  The electrical connection device 10 includes a disk-like wiring board 20, a plate-like reinforcing member 22 assembled on the upper surface of the wiring board 20, a support body 24 positioned at the center of the wiring board 20, and a support body 16. And a plurality of wirings 28 extending from the probe assembly 26 to the wiring board 20.

  The wiring board 20 is manufactured using an electrically insulating material such as glass-filled epoxy or ceramic. The wiring board 20 has a hole (that is, an opening) 30 penetrating the central region in the thickness direction in the center, and includes a plurality of connection portions 32 such as tester lands electrically connected to the tester. A plurality of connection lands 34 are provided on the outer lower surface of two opposite sides of the hole 30.

  The hole 30 has a rectangular shape that is slightly larger than the arrangement area of the integrated circuits to be inspected at the same time. The connection part 32 and the connection land 34 are electrically connected in a one-to-one relationship by a wiring 36.

  The reinforcing plate 22 is made of a ceramic or metal in the form of a disk having a smaller diameter than the wiring substrate 20 and is attached on the wiring substrate 20 by a plurality of screw members (not shown).

  The support 24 has a shape of a rectangular parallelepiped box opened upward by a flat plate portion 40 and a rectangular frame-shaped support portion 42, and is made of an electrically insulating material. For this reason, the plate part 40 and the support part 42 form an internal space 44.

  The support 24 is received in the hole 30 in a state in which the plate portion 40 slightly protrudes downward from the wiring board 20, and the support portion 42 has an appropriate lower surface of the reinforcing plate 22 such as a plurality of screw members. It is attached by means.

  The plate part 40 has a plurality of through holes 46 penetrating in the thickness direction. The through holes 46 are divided into a plurality of (eight in the illustrated example) hole groups each including a plurality of through holes 46.

  The plurality of through holes 46 correspond to the inspected objects to be inspected simultaneously on the semiconductor wafer 12 for each hole group, and are arranged in substantially the same shape as the arrangement shape of the electrodes of the corresponding inspected objects.

  The support portion 42 is formed as a frame member by combining a plurality of plate-like members into a rectangular shape, and a plurality of communication spaces 48 that connect the inner space 44 to the outer space around it are formed on a pair of opposite sides of the rectangle. It has in each of the corresponding places. In the illustrated example, each communication space 48 is a hole having a rectangular cross-sectional shape, and each hole penetrates a corresponding plate-like member of the support portion 42 in the thickness direction.

  As shown in FIG. 5, each wiring 28 uses a cable in which a conductive core wire 50 is protected by an electric insulating layer 52 covering the periphery thereof. Although not shown, the cable has an electrical shield layer disposed around the electrical insulation layer.

  At one end portion of each wiring 28, the core wire 50 exposed by peeling the electrical insulating layer 52 is inserted into the through hole 46, and the exposed end portion of the core wire 50 is attached to the plate portion 40 of the support 24 by the adhesive 54. Are combined. One end surface of each core wire 50 is maintained substantially at the height position of the lower surface of the plate portion 40.

  Each wiring 28 extends from the internal space 44 of the support 24 through the communication space 48 to the external space around the support 24 and below the wiring board 20. The other end portion of each wiring 28 is electrically connected to the connection land 34 by a conductive adhesive such as solder at the exposed end portion of the core wire 50 after the electric insulating layer 52 is peeled off.

  The probe assembly 26 is formed in a rectangular parallelepiped having a rectangular planar shape slightly smaller than the plate portion 40 of the support 24, and is attached to the lower side of the plate portion 40.

  As shown in FIG. 5, the probe assembly 26 includes three plate-like members 60, 62, and 64 each having a rectangular planar shape having substantially the same size, and a plurality of screws so that they are parallel to each other. The plate members 60, 62, and 64 are assembled to the plate portion 40 of the support member 24 so that the plate members 60, 62, and 64 are parallel to the wiring board 20.

  A spacer 66 is disposed between the plate-like members 60 and 62. Similarly, a spacer (not shown) is disposed between the plate-like members 62 and 64. The plate-like members 60, 62, and 64 constitute a probe support that supports a probe 80 described later together with a spacer disposed between them.

  The thickness dimension of the plate member 60 is larger than the thickness dimension of the plate members 62 and 64. The interval between the plate members 60 and 62 is larger than the interval between the plate members 62 and 64.

  The plate-like members 60, 62, and 64 have a plurality of through holes 70, 72, and 74 that penetrate in the thickness direction, respectively. The through holes 70, 72 and 74 correspond to each other and individually to the through holes 46 of the support 24.

  Therefore, each of the through holes 70, 72, and 74 is divided into a plurality of hole groups individually corresponding to the hole groups of the through holes 46, and the arrangement shape of the electrodes of the corresponding test object 12 They are arranged in almost the same shape.

  The through hole 70 of the plate-like member 60 is aligned with the through hole 46 of the plate portion 40 and communicated with the through hole 46 in a plane parallel to the wiring board 20.

  On the other hand, the through holes 72 and 74 of the plate-like members 62 and 64 coincide with each other in a plane parallel to the wiring board 20, but the through-hole 46 of the plate portion 40 and the through-hole of the plate-like member 60. 70 is shifted in one direction.

  However, the through holes 46, 70, 72, 74 may be matched in a plane parallel to the wiring board 20.

  As shown in FIG. 5, each probe 80 is an elastically deformable needle having a circular cross-sectional shape having a diameter slightly smaller than the diameter of the through holes 70, 72, and 74 by a thin conductive metal wire such as a tungsten wire. Further, the through holes 70, 72 and 74 are passed through the through holes 70, 72 and 74 so as to be movable in the vertical direction.

  The upper end surface of each probe 80 is inserted into the through hole 70 from below so that the upper end portion of the probe 80 can move in the vertical direction, and is brought into contact with the lower end surface of the core wire 50 of the wiring 28 to be substantially a plate-like member. 60 is limited to the height position of the upper surface.

  As shown in FIGS. 5 and 6, each probe 80 includes a protruding portion 82 between the plate-like members 62 and 64 that cannot pass through the through holes 72 and 74. In the illustrated example, each protrusion 82 has a flat shape in which a predetermined portion of the probe 80 is crushed in the diameter direction.

  Of each probe 80, a portion below the projecting portion 82 is a needle tip portion projecting downward from the plate-like member 64. The needle tip portion has a smaller diameter dimension toward the tip (needle tip) side.

  In each probe 80, the through holes 72 and 74 are displaced in one direction with respect to the through holes 46 and 70 in a plane parallel to the wiring substrate 20, and the protrusion 82 is in contact with the plate-like member 64. Since it is pressed by the core wire 50, it is curved to the same side in the region between the plate-like members 60 and 62.

  The probe assembly 26 and the electrical connection device 10 can be assembled as follows, for example.

  First, the tip of the probe 80 is passed through the through hole 74 of the plate member 64, the portion above the protruding portion 82 of the probe 80 is passed through the through hole 72 of the plate member 62, and the upper end of the probe 80 is the plate. The plate-like members 60, 62 and 64 are overlapped and combined so as to pass through the through hole 70 of the like-like member 60.

  Next, the plate-like member 60 and the other plate-like members 62 and 64 are relatively displaced so that the through holes 72 and 74 are aligned in the vertical direction and the through hole 70 and the other through holes 72 and 74 are aligned. The plate-like members 60, 62 and 64 are maintained in a state where they are not. Thereby, since the through hole 70 is displaced in the horizontal direction with respect to the through holes 72 and 74, the probe 80 is elastically deformed in one direction between the plate-like members 60 and 62 and is reliably bent.

  In the assembled state as described above, each probe 80 has its upper end slightly protruded from the plate-like member 60. The probe assembly 26 is firmly coupled to the wiring board 20 via the reinforcing plate 22 by a plurality of screw members (not shown).

  When the probe assembly 26 is coupled to the wiring board 20 and the reinforcing plate 22, each probe 80 is pressed downward by the core wire 50 of the corresponding wiring 28. As a result, each probe 80 is pushed downward at its upper end, whereby the projecting portion 82 is pressed by the plate-like member 64 and elastically deformed in the region above the plate-like member 62 as shown by the one-dot chain line in FIG. To do.

  The positional relationship between the plate-like members 60.62 and 64 in the horizontal plane and the positional relationship between the probe assembly 26, the reinforcing plate 22 and the wiring board 20 in the horizontal plane are the plate-like members 60 and 62 of the probe assembly 26. , 64 are connected to each other by a screw member in a state of being positioned with respect to each other, and a plurality of positioning pins (not shown) inserted into the probe assembly 26 through the wiring board 20 and the reinforcing plate 22 Thus, a certain relationship is maintained.

  During the energization test of the inspected object 12, the electrical connecting apparatus 10 is configured so that the lower end of each probe 80 is connected to the inspected object 12 with the lower end (needle tip) of the probe 80 being in contact with the electrode of the inspected object 12. Pressed by the electrode.

  When the lower end of the probe 80 is pressed against the electrode of the device under test 12, the probe 80 receives a predetermined overdrive as shown by a solid line in FIG. 5 and is elastic in the region between the plate-like members 60 and 62. Deform. Thereby, the probe 80 has its lower end moved slightly in the horizontal direction with respect to the electrode of the device under test 12 due to the needle tip portion passing through the through hole 74 with play. Thus, a rubbing action is given to the electrode.

  Excessive displacement of the probe 80 due to the overdrive is suppressed by the protrusion 82 coming into contact with the plate-like member 62. Further, the probe 80 is reliably deformed in the region between the plate-like members 60 and 62 by overdrive.

  Instead of using the communication space 48 as a hole, a communication space such as a notch formed in the support portion 42 from above may be used, or a support portion may be formed by a plurality of support columns to communicate the space between the support portions. It may be a space.

  The present invention may be used in a state where the probe assembly is on the upper side or the lower side of the device under test, or may be used in a state where the probe assembly is inclined.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

It is a bottom view which shows one Example of the electrical connection apparatus which concerns on this invention, Comprising: It is a figure which removes wiring and shows. FIG. 2 is a cross-sectional view taken along line 2-2 in FIG. It is an expanded sectional view near a support and a probe assembly. It is a perspective view which shows one Example of a support body. It is an expanded sectional view of a part of a probe assembly. It is a figure which shows one Example of a probe, Comprising: (A) is a side view, (B) is a front view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electrical connection apparatus 12 Test object 20 Wiring board 22 Reinforcement board 24 Support body 26 Probe assembly 28 Wiring 30 Hole 32 Connection part 34 Connection land 36 Wiring of wiring board 40 Board part 42 Support part 44 Internal space 46 Through hole 48 Communication space 50 Core wire 52 Electrical insulating layer 54 Adhesive 60, 62, 64 Plate member 70, 72, 74 Through hole 80 Probe 82 Projection

Claims (8)

A substrate having a plurality of connection lands on the lower surface;
A support located at the center of the substrate, having a plurality of first through holes extending in parallel with the substrate and penetrating in the thickness direction, and an inner space in cooperation with the plate A support comprising a support located above the plate to be formed;
A probe assembly disposed below the plate portion, the probe assembly including a plurality of probes extending in the vertical direction and having a plurality of second through holes into which the probes are inserted;
A plurality of wirings connecting the probe and the connection lands, one end of which is inserted into the first through hole from above, and a plurality of wirings;
The support portion has a communication space for communicating the inner space with the outer space around the inner space, and the wiring is passed through the communication space,
The electrical connection device, wherein the support portion includes a frame member surrounding the inner space, and the communication space includes a hole formed in the frame member.   The electrical connection device according to claim 1, wherein a plurality of communication spaces are formed in the support portion. The probe assembly further includes a first plate-like member disposed below the plate portion in parallel with the plate portion, and the plurality of second through holes connect the first plate-like member. A first plate-like member formed so as to penetrate in the thickness direction thereof;
A second plate-like member spaced downward from the first plate-like member and parallel to the first plate-like member, and having a third through-hole penetrating in the thickness direction of the second plate-like member. A plate-shaped member,
3. The electrical connection device according to claim 1, wherein each probe is inserted into the second penetration and penetrates the third penetration hole. 4. The probe assembly further includes a third plate member spaced downward from the second plate member and parallel to the second plate member and penetrating in a thickness direction thereof. A third plate-like member having four through holes,
The electrical connection device according to claim 3, wherein each probe further passes through the fourth through hole. The probe assembly further includes a frame-like spacer disposed between the first and second plate-like members,
5. The electrical connection according to claim 3, wherein one end and the other end of each probe are shifted from each other within a plane parallel to the first and second plate-like members. apparatus.   The board includes a wiring board, and the wiring board has a plurality of connection lands disposed on a lower surface thereof, a plurality of connection portions disposed on an upper surface of the wiring board to be connected to a tester, and the connection. The electrical connection device according to claim 1, further comprising a plurality of wirings that electrically connect the land and the connection portion.   Furthermore, the electrical connection apparatus of any one of Claim 1 to 6 containing the plate-shaped reinforcement member arrange | positioned above the said board | substrate.   The electrical connection device according to claim 7, wherein the substrate further includes a hole in the center, and the support is disposed in the hole and supported by the reinforcing member.

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