JP2003035725A - Electrically connecting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow a card substrate to be commonly used even when the type of an IC chip region to be checked is different. SOLUTION: An electrically connecting apparatus comprises a connecting substrate having a plurality of first bump electrode on one face and a plurality of second bump electrodes on the other face. The connecting substrate is disposed between the card substrate having a plurality of tester lands on one face and a plurality of first lands on the other face and a contact assembly having a plurality of second lands on one side and a plurality of probe elements individually electrically connected to the second lands on the other side in such a manner that the first lands are brought into contact with the first bump electrodes and the second lands are brought into contact with the second bump electrodes. The first and second bump electrodes respectively have drill shapes protruding toward the first and second lands.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for inspecting semiconductor devices.

[0002]

2. Description of the Related Art In general, a plurality of semiconductor devices (in the present invention, simply referred to as "IC chip regions") are formed in a matrix on a semiconductor wafer. Each IC chip region has a rectangular shape and has a plurality of electrode pads or electrodes within the rectangle.

This type of inspected object is subjected to an energization test (inspection) as to whether the IC chip area operates according to the specifications. Such an energization test is often performed before separating the wafer from the IC chip area, and a probe card having a plurality of probe elements whose contacts are pressed against the electrodes of the device under test is used as an electrical connection device. Done using.

As one of the probe cards of this type, a plurality of strip-shaped wires extending in parallel are formed on one surface of a sheet-like member such as an electrically insulating film, and a part of each wire is used as a probe element. Some use a probe sheet.

The probe elements are divided into one or more probe element groups according to the arrangement of electrodes in the IC chip area. The probe sheet is directly or indirectly attached to a wiring board having a plurality of tester lands connected to a signal channel or a power supply channel of a tester by using an appropriate member.

The probe element has a protruding electrode formed on the wiring therein as a contactor which is pressed against the electrode in the IC chip area, and when the contactor is pressed against the electrode in the IC chip area, it is elastic in an arc shape. Deform. The contactor is formed so as to be located in an area corresponding to the electrode arrangement of the IC chip area for each probe element group.

However, even if the arrangement pattern of the electrodes in the IC chip area is the same, the type of signals assigned to the electrodes in the IC chip area differs depending on the design contents of the IC chip area. On the other hand, the signal channel of the tester is often fixed.

For this reason, when conducting a current test on the IC chip area, it is necessary to prepare a probe card provided with a wiring board having a wiring pattern corresponding to the type of the IC chip area to be inspected.

In manufacturing the probe card, the wiring board cannot be standardized, and the wiring pattern of the wiring board on which the probe sheet is assembled must be designed for each type of IC chip area to be inspected to manufacture the wiring board. I have to. In particular, the wiring pattern of the wiring board becomes more complicated as the number of contacts and the number of tester lands increase, and such a complicated wiring pattern must be formed on a large wiring board. Therefore, if a wiring board is manufactured for each type of IC chip area to be inspected, it takes a lot of time and cost to manufacture a probe card.

Such a problem is caused by using a needle type probe card in which a needle-shaped probe element formed of a thin metal wire is arranged on a card substrate or a blade-type probe card in which a blade-shaped probe element is arranged in a block. The same also occurs in the electrical connection device.

[0011]

SUMMARY OF THE INVENTION It is an object of the present invention to enable common use of card substrates even if the types of IC chip areas to be inspected are different.

[0012]

An electrical connection device according to the present invention is provided with a plurality of tester lands on one surface, and a plurality of first lands electrically connected to the tester lands on the other surface. A card substrate having a plurality of second lands on one side, and a plurality of probe elements electrically connected to the second lands individually on the other side, and a card assembly; A connection substrate disposed between a substrate and the contact assembly, the one surface having a plurality of first protruding electrodes that are in contact with the first lands, and the first protruding electrodes are electrically connected to each other. Connection substrate having a plurality of second projecting electrodes electrically connected to each other and electrically contacting the second land on the other surface. The first and second projecting electrodes have a pyramidal shape protruding toward the first and second lands, respectively.

The combination of the lands of the first and second protruding electrodes connected to each other is determined by the type of IC chip area to be inspected. Therefore, the connection conversion board has a combination of the first and second protruding electrodes according to the IC chip area to be inspected. The probe element is pressed against the electrode in the IC chip area and the tester land is connected to the tester. As a result, the electrodes in the IC chip area are
It is connected to a predetermined signal channel of the tester via the probe element, the second land, the second protruding electrode, the first protruding electrode, the first land, the tester land and the like.

When the type of the IC chip area to be inspected is changed, the connection conversion board up to that time has a new connection conversion board having a combination of the first and second protruding electrodes corresponding to the new IC chip area. Is converted to. This allows
The first new combination according to the new IC chip area
Since the first and second bump electrodes are connected to the first and second lands, respectively, the electrodes of the new IC chip area are predetermined probe elements, second lands, second bump electrodes, and first bumps. It is connected to a predetermined signal channel of the tester via an electrode, a first land, a tester land, and the like.

As described above, according to the probe card of the present invention, at least the card substrate can be commonly used for different types of IC chip areas, and it is not necessary to form a complicated wiring pattern on the card substrate. Further, since the first and second protruding electrodes have a pyramidal shape protruding toward the first and second lands, respectively, the first and second protruding electrodes and the first and second lands are separated from each other. Make sure contact.

The contactor assembly includes a wiring board having the second land on one side, and a probe unit assembled on the other surface of the wiring board and having a probe sheet. The probe sheet may include a plurality of probe elements individually connected to the second lands.

In a preferred embodiment, the contact assembly includes a wiring board having the second land on one side and a plurality of first electrically connected to the second land individually. And a support plate having a plurality of second connection portions electrically connected to the first connection portion on the other surface, and the other surface of the support plate. A grid-shaped frame having a plurality of openings in each of two directions intersecting each other, and a probe sheet arranged on the other surface of the frame, wherein a plurality of the probe elements are provided in the opening. Including a probe sheet provided for each, the probe sheet is arranged on the support plate so that the probe element is located at a position corresponding to the opening, each probe element, respectively, to the electrode of the device under test. contact It has a contact which, also is electrically connected to the second land.

The probe sheet further comprises, for each opening, a first slit extending in one of two directions intersecting with each other and a plurality of second slits spaced apart from each other and extending to the other. The probe element may be formed in a cantilever shape by the first and second slits.

The contactor assembly further includes a plurality of rubber plates respectively arranged in the corresponding openings corresponding to the openings, and a plurality of elongated members extending to the one side, each of which is the one side. A long member that is disposed in the frame so as to cross the openings of the corresponding row corresponding to the rows of the plurality of openings adjacent to each other, and includes a long member that abuts the rubber plate from the opposite side of the probe sheet, The length member has a groove that extends in the longitudinal direction of the length member and opens toward the elastic body, and the probe sheet may be in contact with the rubber plate. By doing so, when the contact is pressed by the electrode in the IC chip area, the probe element itself is elastically deformed due to overdrive, and the rubber plate acts as a reaction force body of the probe element. As a result, even if there is some variation in the height position of the contact, the variation is absorbed by the elastic deformation of the probe element itself and the elastic deformation of the rubber plate, so that the contact and the electrode in the IC chip region are electrically connected. Contact securely. Further, when the contact is pressed against the electrode in the IC chip area, the elongated member prevents the rubber plate from being largely deformed. This allows the contactor and the I
The electrodes in the C chip area are electrically and surely contacted.

The groove may have a trapezoidal cross-sectional shape whose width increases toward the probe sheet side. By doing so, a portion of the rubber plate corresponding to the probe element extending in a cantilever shape and a portion corresponding to the other area portion (the portion following the base end portion of the probe element) excluding the probe element The boundary portion is sandwiched between the probe sheet and the support body, and is less likely to be elastically deformed. Therefore, when the contact portion is pressed against the electrode in the IC chip area, the cantilevered probe element is surely curved, and the contact element is pressed against the electrode in the IC chip area while the contact is pressed against the electrode in the IC chip area. The electrodes are surely displaced with respect to each other, and as a result, the rubbing action by the contacts is surely generated on the electrodes in the IC chip region.

The probe sheet may be divided into a plurality of probe regions separated from each other at a boundary portion of an opening region including one or more of the openings. By doing so, the thermal expansion of each probe region does not affect the adjacent probe region, and the contactor and IC associated with the temperature rise are increased.
The relative displacement between the chip area and the electrode is small.

In another preferred embodiment, the contactor assembly includes a wiring board having the second land on one surface thereof and a plurality of needle-shaped or blade-shaped probe elements. A probe element arranged on the side of the other surface, each of the probe elements having a contact for contacting an electrode of the device under test, and electrically connected to the second land. Has been done.

The connection conversion board is a plurality of first conductive portions that are individually electrically connected to the first projection electrodes, and the corresponding first projection electrodes extend from the corresponding first projection electrodes in the thickness direction of the connection conversion board. From the corresponding second projecting electrode that is electrically connected to the second projecting electrode to the first projecting electrode that extends to the second projecting electrode. A second conductive portion extending to the first conductive portion and a plurality of third conductive portions electrically connecting the first and second conductive portions.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 to 8, an electrical connection device 10 is used for conducting a current test on a plurality of semiconductor devices (IC chip regions) formed in a matrix on a semiconductor wafer. In the following description, it is assumed that all the IC chip regions have a rectangular shape and a plurality of electrodes are arranged in a line on each of two sides of the rectangle that face each other.

The electrical connection device 10 includes a disk-shaped card substrate 12, a contact assembly 14 mounted on the card substrate 12 at intervals in the vertical direction, and a card substrate 12.
And a ring-shaped connection conversion board 16 disposed between the contact assembly 14 and the contact assembly 14.

The card substrate 12 is a substrate such as a mother board formed of an electrically insulating material such as glass-filled epoxy, and has a plurality of tester lands 20 individually connected to the signal or power supply channels of the tester. The upper surface has multiple layers, and the lower surface has a plurality of first lands 22 individually connected to the tester lands 20.

The tester lands 20 are arranged in the peripheral area of the card substrate 12, and the first lands 22 are arranged coaxially with the tester lands 20 in an area inside the arrangement area of the tester lands 20. Each first land 22
Are electrically connected to the tester lands 20 in a one-to-one manner by wires 24, as shown in FIGS. 3 and 4.

Many tester lands 22 and the remaining one or more tester lands 22 are used for signals and power supplies, respectively, and are electrically connected to the corresponding signal and power supply channels of the tester.

In the contactor assembly 14, as shown in FIGS. 3 to 7, a probe unit 28 is attached to the lower surface of a disk-shaped wiring board 26. The wiring board 26 includes a plurality of second
The land 30 is provided on the upper surface, and the plurality of connecting portions 32 are provided on the lower surface. Each second land 30 is electrically connected to the connecting portion 32 by a wiring 34.

As shown in FIGS. 5 and 6, the probe unit 28 has a rectangular support plate 3 made of a metal material.
The upper surface of the lattice-shaped frame 38 is assembled to the substrate 6, and the probe sheet 40 is arranged on the lower surface of the frame 38. The support plate 36 has a plurality of connection portions 42 individually soldered to the connection portions 32 of the wiring board 26 on its upper surface.

In the frame 38, a plurality of long members are vertically and horizontally combined with a rectangular frame member to form a plurality of rectangular openings 44 in each of the X and Y directions intersecting with each other. In the frame 38, a plurality of rubber plates 46 respectively corresponding to the openings 44 are arranged in the corresponding openings 44, and a plurality of elongated members 48 extending in one of the X direction and the Y direction are arranged in the X direction. It is assembled with a space on the other side in the Y direction.

The probe sheet 40 integrally includes a film 50 formed of an electrically insulating resin such as polyimide, and a plurality of wirings 52 (see FIG. 6) formed in a strip shape from a conductive metal material. Have the same level. The probe sheet 40 is divided into a plurality of rectangular probe regions 56, which are separated from each other, for example, by slits 54 formed at locations corresponding to boundaries between adjacent openings 44 of the frame 38. The slit 54 is formed in the film 50.

Each probe region 56 has two wiring groups each including a plurality of wirings 52 spaced apart from each other and extending in the same direction. The wires 52 of both wire groups have one ends facing each other at intervals in the longitudinal direction thereof, and extend from the one ends in directions opposite to each other. One end of each wiring 52 is located on a virtual straight line.

Each wiring 52 has a contact 58 protruding downward.
At one end. Each contact 58 has a tip corresponding to an electrode in the IC chip area and is pressed by the corresponding electrode. In the illustrated example, each contact 58 has a pyramidal tip, but it may have a cone, a hemisphere, a mere protrusion, a ring, or any other shape.

One end of each wiring 52 forms a probe element 60 together with the portion of the film 50 and the contact 58 in the vicinity thereof. Each probe region 56 includes a plurality of probe elements 60 and is adhered to the underside of the frame 38 at the portion of the film 50.

Each probe element 60 is separated from the adjacent probe element 60 by a slit 62 extending between both wiring groups and a slit 64 extending between one ends of the adjacent wirings 52, and extends like a cantilever. There is. Slits 62,6
4 is formed on the film 50.

The probe element 60 is integrated with the rest of the film 50 and the wiring 52 at the base end portion thereof, so that the slits 62 and 64 can independently bend the probe element 60. The probe element 60, in particular the contact 58,
It is arranged at a position corresponding to the opening 44. Each probe element 60 is individually associated with the connecting portion 42.

Each wire 68 rising from the probe sheet 40 is formed of a conductive material by a wire bonding technique or the like. The wires 68 are individually associated with the wirings 52 and thus with the probe elements 60, and from the other end of the corresponding wirings 52, the frame 38, the rubber plate 46,
It penetrates through the support plate 36 and the connecting portion 42 and extends upward.

In the probe sheet 40 as described above, for example, an electrically insulating film is first formed by applying an electrically insulating synthetic resin to a base, and then the wiring 52 and the contact 58 are formed by etching using a photoresist. It can be manufactured by forming a recessed portion in an electrically insulating film and forming the wiring 52 and the contact 58 by plating such as electroforming. However, the probe sheet 40 may be formed of a plurality of sheet pieces separated from each other.

Each rubber plate 34 is formed of rubber such as silicone rubber into a plate shape, is accommodated in the opening 44 of the frame 38, and has a plurality of slits 66 following the slits 62 and 64 of the probe sheet 40. have.
For each rubber plate 46, the probe sheet 40 is attached to the frame 38, the wire 68 is formed, the long member 48 is assembled to the frame 38, and then uncured rubber is injected into the opening 44 to cure the rubber. Thus, it can be formed.

Slits 54, 6 of the probe sheet 40
2 and 64 can be formed together with the slit 66 of the rubber plate 46 by an appropriate technique such as laser processing after the probe sheet 40 is mounted on the frame 38 and the rubber plate 46 is arranged on the frame 38.

Each elongate member 48 is assembled to the frame 38 so as to correspond to a row of a plurality of openings 44 aligned in the longitudinal direction of the slit 62, and to cross the openings 44 of the corresponding row, and a rubber plate. It is in contact with the upper surface of 46. Each elongate member 48 also has a groove 69 extending in the longitudinal direction thereof and opening to the rubber plate side. The groove 69 is
It has a trapezoidal cross-sectional shape whose width dimension increases toward the probe sheet 40 side.

The probe unit 28 is manufactured by partially manufacturing the probe unit 28 as described above, and then connecting the wires 68 to the support plate 3.
By assembling each wire 68 to the connection portion 42 by soldering through the hole formed in the pre-formed portion 6 and then soldering the connection portion 42 to the land 32 of the wiring board 26, the assembly can be performed.

The connection conversion board 16 is shown in FIG. 4, FIG. 7 and FIG.
As shown in FIG. 3, the plurality of first projecting electrodes 70 that are in contact with the first lands 22 are provided on the upper surface, are electrically connected to the first projecting electrodes, and are electrically connected to the second lands. A plurality of second protruding electrodes 72 that are in contact with each other on the lower surface, and the first and second protruding electrodes 70 and 72 are provided.
Are electrically connected to each other by a plurality of wirings 74.

The connection board 16 is formed of a synthetic resin having an electric insulating property in the form of a plate-shaped or sheet-shaped ring wiring board as a whole. First and second protruding electrodes 70
And 72 have a cone shape such as a cone shape or a pyramid shape. The connection board 16 makes the connection relationship between the tester land 20 and the contacts 58 correspond to the arrangement of the electrodes of the object to be inspected. The tester land 20 and the contact 5 extend in the circumferential direction and the radial direction according to the type of the object to be inspected.
8 is connected.

As shown in FIG. 1, the card board 12, the contact assembly 14, and the connection conversion board 16 are combined with each other.
By passing the plurality of positioning pins 76 protruding downward from the through holes 78 and 80 of the connection conversion board 16 and the wiring board 26, the first land 22 and the first protruding electrode 70 are formed.
Are contacted with each other, and the second land 30 and the second protruding electrode 72 are positioned in contact with each other.

In the above-mentioned state, the card board 12, the contact assembly 14, and the connection conversion board 16 have the plurality of screw members 82 inserted into the through holes 84 of the wiring board 26 and further screwed into the screw holes 86 of the card board 12. As a result, they are assembled together. As a result, the first land 22 and the first protruding electrode 70 are pressed against each other, and the second land 30 and the second protruding electrode 72 are pressed against each other.
They contact easily and reliably.

During the inspection of the object to be inspected, the tester land 20 is connected to the tester, and the contact 58 is pressed against the electrode in the IC chip area. At this time, since the tip portion of the probe element 60 projects downward from other portions of the probe region 56, each contact 58 surely contacts the electrode in the IC chip region.

The elongated member 48 prevents the rubber plate 46 from being largely deformed when the contact 58 is pressed against the electrode of the object to be inspected. As a result, the contactor 58 and the electrode of the device under test are surely brought into electrical contact with each other.

The signal electrodes of the object to be inspected include signal contacts 58, wires 52, wires 68, connecting portions 42, wires 34,
The second protruding electrode 72, the wiring 74, the first protruding electrode 70,
It is connected to a predetermined signal channel of the tester via the second land 22, the wiring 24 and the tester land 20.
The power supply electrode of the device under test is also connected to a predetermined power supply channel of the tester through the same path as the signal electrode.

When the type of the inspected object to be inspected is changed, the connection conversion board 16 up to that time has a new combination of the first and second projecting electrodes 70 and 72 corresponding to the new inspected object. The connection conversion board 16 is converted. As a result, the first combination of new combinations according to the new inspection object
Since the second and second bump electrodes 70 and 72 are connected to the first and second lands 22 and 30, respectively, the electrodes of the new device under test are the predetermined probe element, the second land, and the second protrusion. It is connected to a predetermined channel of the tester via the electrode, the first land, the first protruding electrode, the tester land, and the like.

According to the electrical connection device 10, the large card board 12 can be used in common for different types of inspected objects, and a complicated wiring pattern can be used for the large card board 12.
Need not be formed.

Further, the portion of the rubber plate 46 corresponding to the probe element 60 extending in a cantilever shape and the probe element 6 are provided.
The boundary part with other area except 0 is the probe sheet 4
It is sandwiched between 0 and the long member 48, and is less likely to be elastically deformed. As a result, when the contactor 58 is pressed against the electrode of the object to be inspected, the cantilevered probe element 60 is surely curved, and the contactor 58 is pressed against the electrode of the object to be inspected. Displaces securely with respect to body electrodes, resulting in contact 5
The rubbing action is surely caused by the electrodes of the object to be inspected by 8.

Further, the rubber plate 4 received in the groove 69
Since there is a space between a part of 6 and the bottom surface of the groove 69,
The contactor 58 is more reliably displaced with respect to the electrode of the inspection object,
As a result, the rubbing action of the contact 58 on the electrode of the device under test is more reliably generated.

In the illustrated example, a relatively small number of probe areas 56 and probe elements 60 are shown, but this is for ease of understanding and therefore in practice the IC chip area to be tested at one time. In addition to having the number of probe regions 56 according to the number, the number of probe elements 60 corresponding to the number of electrodes provided in the IC chip region is provided.

In the example shown, the probe element 60 is also
Are arranged linearly so that the contacts 58 are arranged in a line along a virtual straight line for each probe element group. When the IC chip area to be inspected has a plurality of electrodes in a zigzag pattern on each side of the rectangle or in a plurality of rows, the probe element 60 includes a straight line so that the contacts 58 are arranged in a zigzag pattern or a plurality of rows for each probe element group. Arranged in a shape.

In the above embodiment, the probe sheet 4
Since 0 is used, compared with the case where a needle type probe element and a blade type probe element are used,
Needle stand work is not required, and it is easy to manufacture and inexpensive.
However, the present invention can also be applied to an apparatus using a needle type probe element or a blade type probe element.

Referring to FIG. 9, the electrical connection device 90.
Differs from the above-described electrical connection device 10 in that a contactor assembly 92 that uses a needle-type (or blade-type) probe element is used.

The contactor assembly 92 includes a wiring board 94 having a second land (not shown) on its upper surface, and a plurality of needle-shaped (or blade-shaped) probe elements 96. The probe elements are attached to the lower surface of the wiring board 92 in two rows by the needle presser 98. Each probe element 96 has its tip (needle tip) as a contact portion that comes into contact with the electrode of the IC chip, and is electrically connected to the second land.

The electrical connecting device 90 also has the same effects as those of the electrical connecting device 10.

The present invention is not limited to the above embodiment. For example, the present invention is applied not only to the electrical connection device for simultaneously inspecting a plurality of IC chip regions, but also to the electrical connection device for inspecting each IC chip region and each cut IC chip. can do. Therefore, the present invention can be variously modified without departing from the spirit thereof.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of an electrical connection device according to the present invention.

FIG. 2 is a perspective view showing a cross section of a part of the electrical connection device shown in FIG.

3 is a cross-sectional view of the electrical connecting device shown in FIG.

4 is an enlarged cross-sectional view of a part of a card board, a wiring board, and a connection conversion board used in the electrical connection device shown in FIG.

5 is an enlarged sectional view showing a part of a contactor assembly used in the electrical connecting device shown in FIG.

FIG. 6 is an enlarged bottom view showing a part of the probe sheet used in the electrical connection device shown in FIG. 1.

FIG. 7 is an enlarged plan view showing a connection conversion board used in the electrical connection device shown in FIG. 1.

8 is a sectional view showing a part of the connection conversion board shown in FIG. 7 in an enlarged manner.

FIG. 9 is an exploded perspective view showing another embodiment of the electrical connection device according to the present invention.

[Explanation of symbols]

10,90 Electrical connection device 12 card board 14,92 Contact assembly 16 Connection conversion board 20 Testerland 22,30 First and second lands 24 Card board wiring 26,94 wiring board 28 probe units 32, 42 connection 34 Wiring of wiring board 36 Support plate 38 frames 40 probe sheet 44 openings 46 rubber plate 48 Long member 50 Probe sheet film 52 Probe sheet wiring 54, 62, 64 Slits in probe sheet 56 probe area 58 Contact 60,96 probe element 66 Rubber plate slit 68 Long member groove 70,72 First and second protruding electrodes 74 Connection conversion board wiring 98 Needle presser

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Claims (9)

[Claims] 1. A plurality of first testers provided on one surface with a plurality of tester lands and electrically connected to the tester lands.
Contact having a plurality of second lands on one side and a plurality of probe elements individually electrically connected to the second lands on the other side. A subassembly, a connection board disposed between the card board and the contact assembly, and having a plurality of first protruding electrodes in contact with the first land on one surface, A connection board having a plurality of second projecting electrodes electrically connected to the first projecting electrodes and electrically contacting the second lands on the other surface thereof; The two protruding electrodes each have a conical shape protruding toward the first and second lands,
Electrical connection device. 2. The contact assembly includes a wiring board having the second land on one side, and a probe unit assembled on the other surface of the wiring board and having a probe sheet. The electrical connection device according to claim 2, wherein the probe sheet includes a plurality of the probe elements individually connected to the second lands. 3. The contact assembly includes a wiring board having the second land on one side and a plurality of first connecting portions electrically connected to the second land, respectively. And a grid disposed on the other surface of the support plate, the support plate being provided on the other surface of the support plate, the support plate having a plurality of second connection portions electrically connected to the first connection portion on the other surface. -Shaped frame having a plurality of openings in each of two directions intersecting each other, and a probe sheet arranged on the other surface of the frame, the probe sheet having a plurality of the probe elements for each of the openings The probe sheet is disposed on the support plate so that the probe element is located at a position corresponding to the opening, and each probe element has a contactor that is in contact with an electrode of a device under test. And also before It is electrically connected to the second land, the electrical connecting apparatus according to claim 1. 4. The probe sheet further includes, for each opening, a first slit extending in one of two directions intersecting each other and a plurality of second slits spaced apart from each other and extending to the other. The electrical connection device according to claim 3, wherein each probe element is formed in a cantilever shape by the first and second slits. 5. The contactor assembly further comprises a plurality of rubber plates arranged in the openings corresponding to the openings, and a plurality of elongated members extending to the one side. Corresponding to the row of the plurality of openings adjacent to the one is arranged in the frame so as to cross the openings of the corresponding row, including a long member abutting the rubber plate from the opposite side of the probe sheet, 5. Each elongated member has a groove extending in the longitudinal direction of the elongated member and opening to the elastic body side, and the probe sheet is in contact with the rubber plate. Electrical connection device. 6. The electrical connection device according to claim 5, wherein the groove has a trapezoidal cross-sectional shape in which a width dimension increases toward the probe sheet side. 7. The probe sheet is divided into a plurality of probe regions separated from each other at a boundary portion of an opening region including one or more of the openings.
The electrical connection device according to claim 1. 8. The contact assembly includes a wiring board having the second land on one surface thereof, and a plurality of needle-like or blade-like probe elements on the other surface side of the wiring board. And a probe element disposed in the second land, each of the probe elements having a contact for contacting an electrode of the device under test, and electrically connected to the second land. Item 2. The electrical connection device according to Item 1. 9. The connection conversion board is a plurality of first conductive parts that are electrically connected to the first projection electrodes, and the thickness of the connection conversion board from the corresponding first projection electrodes. A first conductive portion extending in the depth direction and a plurality of first conductive portions individually electrically connected to the second protruding electrode, and corresponding second protruding electrodes to the thickness of the connection conversion substrate. 9. The second conductive part extending in the depth direction, and the plurality of third conductive parts electrically connecting the first and second conductive parts, according to any one of claims 1 to 8. Electrical connection device.