JP2001033486A - Probe unit and probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To permit simultaneous inspection of a plurality of chips around the crossing part of border lines, by arranging probe regions and a group of probe elements with high densities. SOLUTION: In a film-like probe unit 12, a plurality of distributing wires 26 are formed in a sheet-like member. This probe unit has a plurality of probe regions 30 provided with a plurality of groups of probe elements. The groups of probe elements comprise a plurality of probe elements 34 comprising portions of distributing wires respectively. The tip parts of the probe elements are arranged at least in a line for every group of probe elements, and each distributing wire stretches to the inside of a corresponding probe region from the tip part of a corresponding probe element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a film-shaped probe unit having a plurality of probe elements and a probe card.

[0002]

2. Description of the Related Art Generally, a semiconductor wafer includes a plurality of semiconductor devices, that is, IC chips (in the present invention,
Simply referred to as "chips". ) Are formed in a matrix. Each chip has a rectangular shape, and has a plurality of electrode pads or electrodes at edges corresponding to each side of the square. The chips that form each row and each column of the matrix are aligned in a single column.

[0003] A chip of this kind is subjected to a conduction test to determine whether or not the circuit operates according to specifications. Such an energization test is often performed before the wafer is separated from the wafer, and is performed using a probe card having a plurality of probes whose needle tips are pressed by electrodes. In inspecting chips one by one in this kind of energization test, one chip is required.
It takes a long time to inspect all the chips on one wafer.

In view of the above, various probe cards for inspecting a plurality of chips on one wafer at a time have been proposed. When using a probe card of this type, chips on one wafer are divided into a plurality of chips every other or every two or a plurality of groups consisting of a plurality of chips continuous in a row or a column in a row, Inspection is performed for each group, whereby the number of inspections for one wafer is reduced, and the time required for inspection of all chips is reduced.

However, the above-mentioned conventional probe card is
Since the groups that can be inspected at the same time are every other or a plurality of chips or chips that are continuous in a row, four chips adjacent to each other via a virtual boundary line that crosses in a cross shape (that is, the intersection of the boundary lines). (The four chips located around) cannot be inspected at the same time. Therefore, the number of energization tests (inspections) per wafer is large,
Inspection time per wafer is long.

[0006] As one of the film-like probe units using a part of a plurality of wirings formed on a sheet-like member as a probe element, a protruding electrode is provided on each wiring, and the wiring is formed by a U-shaped or U-shaped cut. (See Japanese Patent Application Laid-Open No. 6-123746).

[0007]

However, in the conventional film-like probe unit, the wiring extends from the tip of the probe element to one side, and the wiring extends from the tip of the probe element to the other side. Only a second group of probe elements that extend. In such a probe unit, since the probe element group and the probe region cannot be arranged at a high density, the energization test of the four chips around the intersection of the boundary cannot be performed simultaneously.

Therefore, in the film-like probe unit and the probe card using the same, the probe elements and the probe regions are arranged at a high density, and a plurality of chips around the intersection of the boundary lines can be inspected simultaneously. It is important to

[0009]

A film-like probe unit according to the present invention has a plurality of wires formed on a sheet-like member. The probe unit has a plurality of probe regions including a plurality of probe element groups, and the probe element group includes a plurality of probe elements each including a part of the wiring. The tips of the probe elements are arranged in at least one row for each probe element group, and each wiring extends from the tip of the corresponding probe element to the inside of the corresponding probe area.

Since the tips of the probe elements are arranged in at least one line, each probe area corresponds to a chip, and each probe element group is pressed with the tips of the probe elements against the electrodes of the corresponding chip. Further, since each wiring of each probe region extends from the tip of the probe element to the inside of the corresponding probe region, there is no possibility that wiring portions of adjacent probe regions interfere with each other.

Therefore, according to the present invention, it is possible to arrange a plurality of probe elements and probe regions at a high density, and simultaneously inspect a plurality of chips around the intersection of the virtual boundary line.

[0012] The distal ends of the probe elements are arranged in at least one line along a virtual straight line, and the probe unit further includes a virtual rectangular diagonal line having an edge in the arrangement direction of the distal ends of the probe elements. May be provided at least at the center of the probe area.

Each probe element may be formed in a U-shape or a U-shape by cutting. Further, the probe element may have a protruding electrode provided on the wiring at a tip portion.

A probe card according to the present invention is a film-like probe unit having a plurality of wirings formed on a sheet-like member, the probe unit including a plurality of probe regions, and the probe unit being one of the sheet-like members. It includes a plate-like base directly or indirectly attached to a surface, and an elongated elastic body disposed on the base. The probe region includes a plurality of probe element groups each including a plurality of probe elements formed in a U shape or a U shape including a part of the wiring by cutting. The probe elements have their tips arranged in at least one line in the same direction for each probe element group. The base is formed at a location corresponding to the tip of the probe element and has a recess extending in the arrangement direction of the tip and opening toward the probe element. The elastic body is disposed in the recess with the tip of the probe element protruding from the sheet-like member to the side opposite to the base.

In the above-described probe card, each probe element is deformed by a resilient member so as to protrude from the sheet-like member to the side opposite to the base, and the tip of each probe element is connected to the tip of the chip. While being in contact with the electrode, it is pressed relatively to the chip. For this reason,
Compared with a conventional probe card using a film-shaped probe unit, when the tip of the probe element and the electrode of the chip are pressed relatively, the probe element can be deformed by an amount corresponding to the amount of deformation of the probe element.

Therefore, the tip of the probe element can be brought into contact with the electrode of the chip with a sufficient pressing force, and as a result, good electrical contact is obtained between the tip of the probe element and the electrode of the chip. be able to.

[0017] The sheet-like member may be mounted on the base at an appropriate place other than the probe element. Further, the probe unit may include a plurality of probe regions in a matrix, and the wiring of each probe element group may extend from the tip of the corresponding probe element to the inside of the corresponding probe region.

[0018] The tip of the probe element is arranged in at least one line along a virtual straight line, and the probe unit is a frame having a plurality of openings individually corresponding to the probe area in a matrix. The probe unit is disposed on one surface of the base via a frame having a recess, and the probe unit further includes a slit extending in a diagonal direction of a virtual rectangle having an edge in the arrangement direction of the distal end of the probe element. The probe region may be provided at least at a central portion, and each probe region may be disposed on the base in a state where a divided region divided by the slit is pressed into an opening of the frame. With this configuration, since the probe element protrudes with respect to the divided region, one or more components such as a capacitor can be arranged in a depressed space inside the probe region.

A plurality of first conductive members respectively corresponding to the probe elements and electrically connected to wirings of the corresponding probe elements; and And a plurality of second conductive members individually corresponding to the probe region.
Further, the base may include a connection board on which the frame and the probe unit are arranged on one side, and a wiring board on which the connection board is arranged on one side.

In a preferred embodiment, each probe area is a rectangular area, the probe unit has a plurality of probe areas arranged in a matrix, and the tip of the probe element of each probe element group has at least one of the rectangular areas. It is arranged along the side. With this configuration, it is possible to simultaneously inspect a plurality of rectangular chips formed of a rectangular chip in a matrix and having a plurality of electrodes on each of a plurality of sides.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 to 10, a probe card 10 is used for a conduction test of a plurality of semiconductor devices, that is, chips formed in a matrix on a semiconductor wafer. In the following description, it is assumed that all chips have a rectangular shape and a plurality of electrodes are arranged in a line on each side of the rectangle.

The probe card 10 includes a rectangular film-shaped probe unit 12, a disc-shaped first substrate 14,
Rectangular second substrate 1 arranged on the lower surface of first substrate 14
6, a lattice-shaped frame 18 mounted on the lower surface of the second substrate 16, a plurality of elongated elastic bodies 20 arranged on the frame 18, the second substrate 16 and the frame 18 are attached to the first substrate 14. A plurality of inverted L-shaped holders 22 assembled
And a plurality of cables 24.

The probe unit 12 includes a plurality of wires 26
Is formed on a sheet-like member (film-like substrate) 28 made of an electrically insulating resin. The probe unit 12 has a plurality of probe regions 30 corresponding to chips to be inspected in a matrix.

The probe region 30 is defined by a virtual boundary line corresponding to the boundary line of the chip on the semiconductor wafer. The probe region 30 has the same rectangular shape as the corresponding chip, and has a plurality of probe element groups 32 corresponding to the electrode groups of the chip on each side of the rectangle. In the illustrated example, four probe element groups 32 respectively corresponding to the rectangular sides are provided.

Each probe element group 32 includes a plurality of probe elements 34. The probe element 34 is a sheet-like member 2
A notch 36 formed in 8 has a U-shape including the tip of the wiring 26, and a protruding electrode 38 formed in the wiring 26 is provided at the tip which acts as an electrode land. The material of the protruding electrode 38 can be a metal material, such as nickel, which is harder than the electrode material of the chip to be inspected.

Each wiring 26 has a corresponding probe element 34
From the tip of the probe region 30 to the inside of the corresponding probe region 30. The probe element 34 has a finger-like shape integrated at its proximal end with the remaining wiring 26 and sheet-like member 28 and is independently bendable.

The probe elements 34 are arranged such that the tips (particularly, the protruding electrodes 38) are arranged in a line along a virtual straight line for each probe element group 32. When the chip to be inspected has a plurality of electrodes in a zigzag manner on each side of the rectangle or in a plurality of rows, the probe elements 34 (in particular, the protruding electrodes 38) are arranged in a zigzag manner or in a plurality of rows for each probe element group 32. It is arranged so that it becomes.

The probe unit 12 also includes a slit 40 extending in the direction of a virtual rectangular diagonal whose side is the arrangement direction of the tip of the probe element 34, and a plurality of conductive members individually connected to the wiring 26. 42 at the center of each probe region 30. Each conductive member 42 is a conductive through hole that penetrates the corresponding wiring 26 and sheet member 28 in the thickness direction.

In the probe unit 12, for example, first, the wiring 26 is formed on a sheet-like member 28 having electrical insulation and elasticity such as a polyimide resin, and then the conductive member 42 is formed on each wiring 26 and the sheet-like member 28. Then, a protruding electrode 38 is formed in each wiring 26, a conductive member 42 is formed in each through hole, a cut 36 is formed to form a probe element 34, and then a sheet-like member is formed. It can be manufactured by forming a slit 40 in 28.

The first substrate 14 has, at the center, a rectangular opening 44 penetrating the first substrate 14 in the thickness direction, a plurality of connection portions 46 around the opening 44, and a plurality of tester lands. 48 is a wiring board having an outer peripheral portion 48 on its upper surface.

In the example shown, each connecting portion 46 is open to the upper surface to which a connector 50 attached to one end of the cable 24 is connected, and a plurality of receptacles into which plugs of the connector 50 are fitted are provided. Have.

The cable 24 is a flat cable in which a plurality of wires are formed in parallel on an electrically insulating film-like base material, and is provided for each probe element group 32. Each wiring of the cable 24 is electrically connected to a plug of the connector 50.

The tester lands 48 and the receptacles of the connection portions 46 are electrically connected in a one-to-one manner by wires (wiring patterns) (not shown) formed on the first substrate 14. The substrate 14 can be manufactured by a known printed wiring technique using an electrically insulating material.

The second substrate 16 is made of an electrically insulating material such as polyimide or ceramic and has the same planar shape and size as the probe unit. Second substrate 16
Has a plurality of conductive members 52, conductive members 54, and X-shaped wires 56 at locations corresponding to the respective probe regions 30.

Each conductive member 52 penetrates through the second substrate 16 in the thickness direction, and corresponds to each probe element 34 and is used as a signal line. The conductive member 56 penetrates the second substrate 16 in the thickness direction,
Also, it is electrically connected to the intersection of the wires 56 and used as a ground line. The wiring 56 is formed on the lower surface by printing technology wiring.

The frame 18 has a plurality of rectangular openings 58 corresponding to the probe area 30 in a matrix, and a plurality of recesses 60 in each of the long members forming the lattice. . Each recess 60 is a slot that extends in the longitudinal direction of the long member in the illustrated example, but may be a groove that opens downward.

The elastic body 20 has an oval cross section made of an elastic material such as silicone rubber, and is disposed in a recess 60 of the frame 18 with a part thereof protruding downward.

The first and second substrates 14 and 16 and the frame 18 function as a base on which the probe unit 12 is mounted. The probe unit 12 may have one or more capacitors 62 for each probe area.

The probe card 10 can be assembled, for example, as follows.

First, the frame 18 and the second substrate 16 are assembled using an adhesive, a screw member or the like, and the elastic body 20 is mounted on the frame 18.

Next, as shown in FIGS. 4 and 5, the probe unit 12 is arranged on the lower surface of the frame such that the tip of each probe element group 32 comes into contact with the elastic body 20. The probe unit 12 is bonded or crimped to the outer frame portion of the frame 18 at the outer edge.

Next, as shown in FIG. 5, a triangular divided region of each probe region 30 divided by the slit 36 is pushed into the opening 58 of the frame 18,
The divided area is mounted on the lower surface of the second substrate 16.
Thus, a block 64 in which the probe unit 12, the second substrate 16 and the frame 18 are assembled is formed.

In block 64, many of the conductive members 42 of the probe unit 12 are electrically connected to the conductive members 52 of the second substrate 16, and the remaining conductive members 4
2 is electrically connected to the conductive member 54 of the second substrate 16. The distal end of the probe element 34 is protruded below the other area of the probe area 30 by the elastic body 20.

As a result, an X-shaped gap is formed between adjacent divided regions, and the wiring 56 of the second substrate 16 is exposed from the gap. A space that opens downward is formed below the block 64 for each probe area 30.

The second substrate 16 and each of the divided regions are formed, for example, by attaching solder to a conductive member 42 forming a through hole and bonding the solder to the first conductor layer 52. I can do it. However, the second substrate 16 and each of the divided regions can be fixed by disposing an anisotropic conductive sheet having conductivity only in the thickness direction between the two and pressing the two under heat and pressure. In any case, each conductive member 42 and the first conductive member 52 are electrically reliably connected.

Next, as shown in FIG. 8, a plurality of capacitors 62 are arranged in each space of the assembly. Capacitor 6
2 is connected to the conductive member 54 of the second substrate 16 in common, and is connected to an appropriate conductive member 46 of the probe region 30.
Alternatively, they are individually electrically connected to the wiring 26.

Next, the block 64 is assembled on the lower side of the first substrate 14 by the holder 22. Block 64
The holder 22 and the holder 22 are assembled by an appropriate means such as an adhesive or a plurality of screw members. The holder 22 is assembled to the second substrate 14 with a plurality of screw members.

After the cable 24 is assembled as described above, its wiring is connected to the conductive members 52 and 54 of the second substrate 16.
It is mounted on the upper side of the second substrate 16 at an end opposite to the connector 50 so as to be electrically connected to the connector 50. However, the cable 24 may be attached to the second substrate 16 before assembling into the block 64 or after assembling into the block 64. After that, the connector 50 is connected to the connection portion 46 of the first substrate 14.

When inspecting a chip on a semiconductor wafer, the protruding electrodes 38 are pressed against the electrodes of the chip. At this time, since the tip of the probe element 34 protrudes below other regions of the probe region 30, the protruding electrodes 38 reliably contact the electrodes of the chip.

When the protruding electrode 38 is pressed against the electrode of the chip, the probe element 32 is slightly curved in an arc shape so as to compress the elastic body 20 due to overdrive. This ensures that the protruding electrodes 38 come into contact with the electrodes of the chip.

When the probe element 32 bends in an arc, the protruding electrodes 38 slide with respect to the electrodes of the tip. This allows
The protruding electrode 38 rubs the electrode of the chip and scrapes the oxide film on the surface of the electrode. For this reason, the protruding electrode 38 comes into contact with the electrode of the chip more reliably.

The probe card 10 can obtain good electrical contact between the protruding electrode 38 and the electrode of the chip for the above-described reason.

In the probe unit 12 and the probe card 10, the wires 26 of the probe area 32 extend from the tip of the probe element 32 to the inside of the corresponding probe area 30, so that the wires 26 of the adjacent probe areas 30 interfere with each other. There is no danger that the probe element group 32
In addition, by disposing the probe regions 30 at high density, a plurality of chips around the intersection of the virtual boundaries can be inspected simultaneously.

In the probe unit 12 and the probe card 10, the space to be opened downward has a probe area 30.
Since it is formed every time, an appropriate element such as a capacitor can be accommodated in the space.

In the probe unit 12 and the probe card 10, since a gap is formed between the triangular divided areas of each probe area 30, a ground line is formed on the substrate 16 and the ground line is formed. It can be exposed from the gap.

In the illustrated example, a relatively small number of probe regions and probe elements are shown, but this is for ease of understanding, and therefore, in practice, it depends on the number of chips to be tested at one time. It has a number of probe regions and a number of probe elements corresponding to the number of electrodes provided on the chip.

The shape of the probe element and the protruding electrode may be other appropriate shapes other than those described above.
The arrangement of No. 4 may be another arrangement other than the above.

The probe element 70 shown in FIGS.
Uses a rectangular parallelepiped protruding electrode 72. Since such a protruding electrode 72 is inclined as shown in FIG. 13 in a state where the probe card is assembled, when the protruding electrode 72 is pressed by the electrode of the chip and the probe element 70 is bent, the protruding electrode 72 is sharpened. The oxide film on the electrode surface of the chip is reliably removed at the edge. The probe element 74 shown in FIG. 14 has a U-shaped shape with an arcuate tip.

The present invention is applicable not only to the case of simultaneously inspecting a plurality of chips having a plurality of electrodes at each edge of a rectangle, but also to a plurality of chips having a plurality of electrodes at each edge of the rectangle and a plurality of electrodes within the rectangle. The present invention can also be applied to a case where one or more chips in one or a plurality of rows are inspected simultaneously.

FIG. 15 shows an embodiment of a probe region 76 used for testing a chip having a plurality of electrodes arranged in a line at the center of a rectangle. The probe area 76 has a plurality of probe elements 78 in a line in a rectangle. Each probe element 78
It is formed in a U-shape by a notch 36, and has a protruding electrode 38 at the tip.

The probe elements 78 at both ends in the arrangement direction and the adjacent probe elements 78 are used for power supply, and therefore, their tips are provided on the opposite side of the other probe elements 78. Therefore, the wiring 26 of the power supply probe element 78 and the wiring 26 of the other probe elements 78 extend to opposite sides.

The probe unit 12 is connected to the second substrate 16
And may be directly mounted on the first substrate 14 without using the frame 18, may be directly mounted on the second substrate 16 without using the frame 18, and furthermore, using the second substrate 16 Frame 18 and the first substrate 14
It may be directly attached to.

FIG. 16 shows that the probe unit 12
An embodiment in which the substrate 14 is directly mounted on a substrate 14 is shown. First substrate 1
4 has a long recess 80 opening downward at a location corresponding to each side of the rectangular probe region 30. First substrate 14
Does not have the opening 44 shown in FIG. 4, but has a plurality of conductive members 82 penetrating the first substrate 14 in the thickness direction at locations corresponding to the opening 44.

The conductive members 82 correspond to the probe elements 34 respectively, and are formed at locations where the conductive members 82 can contact the wirings 26 extending from the corresponding probe elements 34. The elastic body 20 has a recess 8 with a part thereof protruding downward.
0.

The probe unit 12 includes the probe element 3
The wiring 26 extending from 4 is mounted on the lower surface of the first substrate 14 so as to contact the corresponding conductive member 82.
When the probe unit 12 is mounted on the first substrate 14, the tip of each probe element 34 protrudes below other regions of the probe unit 12.

The present invention is not limited to the above embodiment. For example, the present invention is applicable not only to a probe unit and a probe card used for an energization test of an integrated circuit, but also to a probe unit and a probe card used for an energization test of another flat object to be inspected such as a liquid crystal substrate having a plurality of chips. Can be applied. Further, instead of using a cable, a wiring pattern may be provided on the first substrate, and the wiring pattern may be used instead of the cable. The present invention can be variously modified without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a probe card shown in FIG. 1;

FIG. 2 is a front view of the probe card shown in FIG. 1;

FIG. 3 is a sectional view taken along line 3-3 in FIG. 1;

FIG. 4 is an exploded perspective view of the probe card shown in FIG.

FIG. 5 is an exploded perspective view for explaining a method of assembling the probe unit, the second substrate, and the frame.

FIG. 6 is a perspective view showing a block in which a probe unit, a second substrate, and a frame are assembled.

FIG. 7 is a diagram showing one embodiment of a probe region.

FIG. 8 is a sectional view of a part of the block shown in FIG. 6;

FIG. 9 shows a first embodiment of the probe element.

10 is a sectional view taken along line 10-10 in FIG. 9;

FIG. 11 shows a second embodiment of the probe element.

FIG. 12 is a perspective view of the tip of the probe element shown in FIG. 11;

13 is a sectional view taken along line 13-13 in FIG.

FIG. 14 shows a third embodiment of the probe element.

FIG. 15 is a bottom view showing another embodiment of the probe area.

FIG. 16 is a sectional view showing a part of another embodiment of the probe card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Probe card 12 Probe unit 14, 16 1st and 2nd board 18 Frame 20 Elastic body 22 Holder 24 Cable 26 Probe unit wiring 28 Probe unit sheet member 30, 70 Probe region 32 Probe element group 34, 70, 74, 78 Probe element 36 Cut of probe unit 38, 72 Protruding electrode 40 Slit of probe unit 42 Conductive member of first substrate 44 Opening of first substrate 46 Connection portion of first substrate 48 Tester land 52, 54 Conductive member of second substrate 56 Wiring of second substrate 58 Opening of frame 60 Depression of frame 62 Capacitor 64 Block 80 Depression of first substrate 82 Conductive member of first substrate

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Isao Tanabe, Inventor 2-6-8 Kichijoji Honcho, Musashino City, Tokyo Inside Japan Micronics Co., Ltd. (72) Inventor Kazuo Shirai 2-6-8, Kichijoji Honmachi, Musashino City, Tokyo No. F term in Japan Micronics Co., Ltd. (reference) 2G011 AA17 AB08 AC14 AE03 AF07 2G014 AA13 AB51 AB59 AC06 AC10 4M106 AA02 BA01 CA01 DD01 DD10 DD16

Claims (10)

[Claims] 1. A film-like probe unit in which a plurality of wires are formed on a sheet-like member, wherein a plurality of probe regions each including a plurality of probe element groups each including a plurality of probe elements including a part of the wires are provided. A probe unit, wherein the probe elements have tip portions arranged in at least one row for each probe element group, and each wiring extends from the tip portion of the corresponding probe element to the inside of the corresponding probe region. 2. The probe elements are arranged in at least one line along a virtual straight line, and the probe unit further includes a virtual diagonal line having a side in the arrangement direction of the probe elements. Having a slit extending in the direction of at least a central portion of the probe area,
The probe unit according to claim 1. 3. The probe unit according to claim 1, wherein each probe element is formed in a U-shape or a U-shape by cutting. 4. The probe unit according to claim 1, wherein the probe element has a protruding electrode provided on the wiring at a distal end. 5. A film-like probe unit having a plurality of wirings formed on a sheet-like member and having a plurality of probe regions, wherein the probe unit is directly or indirectly provided on one surface of the sheet-like member. A probe-shaped region including a plate-shaped base and a long and thin elastic body arranged on the base, wherein the probe region is formed in a U-shape or a U-shape including a part of the wiring by cutting. A plurality of probe element groups each including a probe element, wherein the probe elements have their tips arranged in at least one line in the same direction for each probe element group, and the base corresponds to the tip of the probe element. A concave portion formed at a position where the elastic member extends in the arrangement direction of the distal end portion and is open to the probe element side. Wherein the tip of the probe element from said sheet-like member in a state of protruding on the side opposite to the base is disposed in the recess, the probe card. 6. The probe card according to claim 5, wherein the probe unit is mounted on the base at an appropriate position other than the portion of the probe element. 7. The probe unit according to claim 5, wherein a plurality of probe regions are provided in a matrix form, and wiring of each probe element group extends from a tip end of the corresponding probe element to the inside of the corresponding probe region. Or the probe card of 6. 8. The probe elements are arranged in at least one line along a virtual straight line, and the probe unit has a frame having a plurality of openings corresponding to the probe regions in a matrix. The probe unit is further disposed on one surface of the base via the frame having the recess, and the probe unit further includes a virtual rectangular diagonal line having an edge in the arrangement direction of the distal end of the probe element. Has a slit extending in the direction at least at the center of the probe area, each probe area is arranged on the base in a state where the divided area divided by the slit is pressed into the opening of the frame, The probe card according to claim 7. 9. A plurality of first conductive members respectively corresponding to the probe elements and electrically connected to wiring of the corresponding probe elements, and the base is disposed at a position corresponding to the slit. The probe card according to any one of claims 5 to 8, further comprising a plurality of second conductive members individually corresponding to the probe region. 10. The base according to claim 5, wherein the base includes a connection board on which the frame and the probe unit are arranged on one side, and a wiring board on which the connection board is arranged on one side. 10. The probe card according to any one of 9.