TWI385389B - A conveyor for correcting the position of the electronic components - Google Patents

Description

Conveyor capable of correcting the position of electronic components

The invention provides a conveying device capable of correcting the position of the electronic component on the pick-and-place device and enabling the pin of the electronic component to accurately perform the test operation on the probe of the testing machine to improve the testing quality.

Nowadays, the finished electronic components must undergo multiple processing processes, taking IC as an example. The subsequent assembly operations include multiple processes such as wafer cutting, die bonding, wire bonding, and sealing. In order to ensure the quality of IC products, the manufacturer A test sorting machine is configured in the terminal process for testing the IC to eliminate defective products; the current test sorting machine includes a feeding device, a receiving device, a conveying device and a testing machine, and the feeding device is used to accommodate The IC is measured, the receiving device is used to accommodate the completed IC, the testing machine is used to test the IC, and the conveying device transfers the IC to be tested/tested between the feeding device, the receiving device and the testing machine; Referring to Figures 1 and 2, the test machine 10 of the test sorter is provided with a plurality of test stands 11 with probes. The transport device 20 is provided with a feed stage 211 and a receiving load in front of the test machine 10. The first carrier mechanism 21 of the stage 212 is provided with a second carrier mechanism 22 having a feeding stage 221 and a receiving stage 222 behind the testing machine 10, and a moving material is disposed above the testing machine 10. The mechanism 23 is provided with a first driving structure 231 on one side of the testing machine 10 The first frame 232 is fixed to the bottom of the frame 232 to fix the load between the first carrier mechanism 21 and the testing machine 10 to be tested/completed. On the other side of the testing machine 10, the second driving structure 234 is disposed on the other side of the testing machine 10 for driving a frame 235 for YZ axial displacement, and the bottom surface of the frame 235 is fixed with a second The pick-and-placer 236 is configured to transfer the IC to be tested/tested between the second carrier mechanism 22 and the testing machine 10, and the first driving structure 231 of the loading mechanism 23 is taken as an example. The first driving structure is taken as an example. The 231 series drive carrier 232 and the first pick-and-place 233 are axially displaced by YZ, and the IC to be tested is taken out on the feeding stage 211 of the first carrier mechanism 21, and transferred to the test socket 11 of the testing machine 10. The test operation is performed by contacting the pins of the IC with the probes in the test socket 11. After the test is completed, the first driving structure 231 drives the first pick-and-placer 233 to be taken out in the test seat 11. The IC is transferred to the receiving stage 212 of the first carrier mechanism 21, so that the receiving stage 212 carries out the tested IC; however, since the IC is increasingly precise and lightweight, the pins are The spacing is also relatively narrow, so that the accuracy of the alignment of the pins of the IC and the probe of the test stand 11 is relatively high, but the first and second driving structures 231, 234 of the material transfer mechanism 23 have accumulated components. The error causes the first pick-and-placer 233 and the second pick-and-placer 236 to insert the IC to be tested into the test stand 11, which is easy to accumulate errors, and the pins of the IC are accurately positioned on the test stand 11 The probe is so inaccurate that the test is inaccurate, resulting in a lack of quality of the test.

A first object of the present invention is to provide a transport device capable of correcting the position of an electronic component, the transport device being mounted on a machine having a test machine, comprising a carrier mechanism and a material transfer mechanism, wherein the transport device is additionally loaded A visual mechanism having an image capturing device is disposed between the sending mechanism and the testing machine, and the material moving mechanism is provided with an adjusting structure below the driving structure, wherein the adjusting structure is provided with a rotating driving source and an XY axial driving source for respectively The laminated frame is driven for angular rotation and XY axial displacement, and a pick-and-place device is arranged on the bottom frame, and the loading mechanism drives the structure to drive the pick-and-place device to take out the electronic component to be tested at the carrying mechanism. And transferring to the image capturing device of the vision mechanism to take an image, and then adjusting the structure to drive the pick and place device for angular rotation and XY axial displacement, thereby compensating for correcting the position of the electronic component; thereby, the pins of the electronic component can be made Accurately pair the probes in the test machine to accurately perform the test work, and achieve the practical benefits of improving the test quality.

A second object of the present invention is to provide a conveying device capable of correcting the position of an electronic component. The adjusting structure of the loading mechanism controls the rotating driving source and the XY axial driving source to drive the pick and place device to automatically correct the electronic component according to the image data. The position is such that the pins of the electronic component are accurately positioned on the probe of the test machine test stand to perform the test operation, thereby achieving the practical benefit of improving the convenience of use.

In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing will be described in detail as follows: Please refer to Figures 3, 4, 5 and 6 for the configuration of the conveying device 30 of the present invention. The test machine 50 is provided with at least one test stand 51. The present embodiment is provided with a plurality of test stands 51 with probes. The transfer device 30 is before the test machine 50. At least one of the latter is provided with a carrying mechanism. In this embodiment, a first carrying mechanism 31 is provided in front of the testing machine 50. The first carrying mechanism 31 has a feeding stage 311 and a receiving stage 312. To carry the electronic components to be tested/completed, respectively, the transport device 30 is provided with a second carrying mechanism 32 behind the testing machine 50, and the second carrying mechanism 32 has a feeding stage 321 and a receiving stage. 322, for carrying the electronic component to be tested/tested, and a first visual mechanism 33 between the first carrier mechanism 31 and the testing machine 50, the first visual mechanism 33 is provided with a plurality of CCDs. The image capturing unit 331 is configured to take the electronic component to be tested and transmit the image capturing data to a central control unit (not shown). The central control unit controls the operation of the related mechanism, and the second carrier mechanism 34 and the testing machine 50 are provided with a second visual mechanism 34. The second visual mechanism 34 is provided with a plurality of CCD imagers 341 for use. In order to take the electronic component to be tested, the conveying device 30 is disposed above the testing machine 50 and is provided with a feeding mechanism 35 for the testing machine 50, the first and second carrying mechanisms 31, 32 and the first and second The electronic components to be tested/tested are transferred between the visual mechanisms 33 and 34. The loading mechanism 35 is provided with a first driving structure 351 on one side of the testing machine 50 for driving a carrier 352 for YZ. The first adjustment structure is disposed on the carrier 352, and the rotary drive source is a motor 353, and the motor 353 is used for the axial displacement. The rotating shaft is coupled to the first frame 354. The bottom surface of the first frame 354 is provided with a first sliding seat 355 in the Y-axis direction, and a laminated frame below the first working frame 354. The first frame 356 is provided with a first sliding rail 357 in the Y-axis and a second sliding rail 358 in the X-axis on the bottom surface. A sliding rail 357 is slidably coupled to the first sliding seat 355 of the first frame 354. The inside of the second frame 356 is provided with a Y-axis driving source and an X-axis driving source. The Y-axis driving source is provided. The first connecting frame 360 is mounted on the shaft end of the linear motor 359, and the other end of the first connecting frame 360 is fixed on the bottom surface of the first frame 354 to make a linear motor. The 359 can drive the second frame 356 to be displaced in the Y-axis direction, and is displaced along the first sliding seat 355 by the first sliding rail 357, and the X-axis driving source is a motor 361, and the rotating shaft of the motor 361 drives a pulley. The set 362 is provided with a second connecting frame 363 on the pulley set 362 for connecting a third frame 364 under the second frame 356. The top surface of the third frame 364 is provided with an X-axis. The second sliding seat 365 is slid on the second sliding rail 358 of the second frame 356 by the second sliding seat 365, so that the motor 361 can drive the third frame 364 to perform X-axis displacement, and the third A first floating head 366 is disposed on the bottom surface of the frame 364, and a first pick-and-placer 367 is disposed below the first floating head 366, so that the first pick-and-placer 367 can rotate angularly and the XY axis The displacement is used to transfer the IC to be tested/tested between the first carrier mechanism 31 and the testing machine 50, and the loading mechanism 35 is provided on the other side of the testing machine 50 with the second driving structure 368. The second frame is disposed below the frame 369, and the second adjustment structure is fixed on the frame 369. The rotary drive source is The motor 370 is coupled to the first frame 371 by a rotating shaft of the motor 370. The bottom surface of the first frame 371 is provided with a first sliding seat 372 in the Y-axis, and a laminating machine located below the first frame 371. The first frame 373 is provided with a Y-axis first slide rail 374 on the top surface of the second frame 373, and a X-axis second slide rail 375 on the bottom surface, and the second frame The inside of the 373 is provided with a Y-axis driving source and an X-axis driving source. The second frame 373 is slidably coupled to the first sliding seat 372 of the first frame 371 by the first sliding rail 374, and Y The axial drive source is a linear motor 376, and a first connecting frame 377 is mounted on the shaft end of the linear motor 376. The other end of the first connecting frame 377 is fixed on the bottom surface of the first frame 371. The linear motor 376 can drive the second frame 373 to be displaced in the Y-axis direction, and is displaced along the first sliding seat 372 by the first sliding rail 374, and the X-axis driving source is a motor 378, and the rotating shaft of the motor 378 is A pulley set 379 is provided, and a second connecting frame 380 is disposed on the pulley set 379 for connecting a third frame 381 located below the second frame 373. The top surface of the third frame 381 is provided. The second slide 382 of the X-axis is slidably disposed on the second slide rail 375 of the second frame 373 by the second slide 382, so that the motor 378 can drive the third frame 381 to perform X-axis displacement. A second floating head 383 is disposed on the bottom surface of the third frame 381, and a second pick-and-placer 384 is disposed below the second floating head 383, so that the second pick-and-placer 384 can be rotated angularly and the XY axis The displacement is used to transfer the IC to be tested/tested between the second carrier mechanism 32 and the testing machine 50.

Referring to Figures 3, 4 and 7, the feeding stage 311 of the first carrying mechanism 31 carries the electronic component 61 to be tested to the front of the first visual mechanism 33, and the first moving mechanism 35 is first. The driving structure 351 drives the first adjusting structure and the first pick-and-placer 367 to be axially displaced to the upper side of the feeding stage 311. Since the first pick-and-place 367 is assembled under the first floating head 366, the feeding is performed. When the electronic component 61 to be tested is taken out from the stage 311, the first floating head 366 can be used as a floating buffer to prevent the electronic component 61 to be tested from being damaged, and then the electronic component 61 to be tested is transferred to the visual mechanism 33. Above, and controlling the positioning of the first floating head 366, the vision mechanism 33 takes an image of the electronic component 61 to be measured by the image taking device 331 and conveys the image data to the central control unit, and the central control unit takes the image The data control related mechanism is actuated; please refer to the figures 3, 8, and 9, the first driving structure 351 drives the first pick-and-placer 367 and the electronic component 61 to be tested for Y-axis displacement to the testing machine 50, Each pin of the electronic component 61 is accurately positioned on the probe of the test stand 51, and the first adjustment structure is The motor 353 drives the first frame 354 and the related components below it to rotate synchronously, so that the first pick-and-placer 367 drives the electronic component 61 to be tested for angle compensation correction, and the shaft end of the linear motor 359 is coupled. The first link frame 360 is positioned such that the linear motor 359 can drive the second frame 356 to perform Y-axis displacement, and the first slide rail 357 is assisted to be displaced along the first sliding seat 355 of the first frame 354. The frame 356 and the related components below it are synchronously displaced in the Y-axis, so that the first pick-and-placer 367 drives the electronic component 61 to be tested to compensate for the Y-axis displacement. Thereafter, the motor 361 is driven by the pulley set 362. The two connecting frames 363 drive the third frame 364 and the first floating head 366 and the first pick-and-place 367 under the X-axis displacement, so that the first pick-and-placer 367 drives the electronic component 61 to be tested as the X-axis. The compensation of the position is corrected. Therefore, the first pick-and-placer 367 can perform angle rotation and XY axial displacement, so that the electronic component 61 to be tested automatically compensates the correction position, so that the pins accurately contact the test socket 51. The probe can accurately perform the test operation. At this time, the feeder The second driving structure 368 drives the second pick-and-place device 384 to take out the next electronic component 62 to be tested on the feeding stage 321 of the second carrying mechanism 32, and transfers it to the second visual mechanism 34. The second visual mechanism 34 takes the image pickup device 341 to image the electronic component 62 to be tested on the second pick-and-place 384; please refer to FIGS. 6 and 10, after the test operation, the first drive of the transfer mechanism 35 The structure 351 takes out the measured electronic component 61 in the test socket 51 of the testing machine 50 by the first pick-and-placer 367, and transfers it to the receiving carrier 312 of the first carrier mechanism 31 to make the receiving stage. 312 carries out the measured electronic component 61, and the second driving structure 368 drives the second adjusting structure, the second pick-and-placer 384 and the electronic component 62 to be tested to be displaced to the test socket 51 of the testing machine 50, the second The adjustment structure also drives the first frame 371 and the related components below it to rotate synchronously, so that the second pick-and-placer 384 drives the electronic component 62 to be tested for angle compensation correction, and drives the second machine with the linear motor 376. The frame 373 and related components below thereof are axially displaced, so that the second pick-and-placer 384 drives the electronic component to be tested. The component 62 is compensated for the Y-axis position, and the motor 378 drives the third frame 381 and the second floating head 383 and the second pick-up 384 below the X-axis via the pulley set 379 and the second connecting frame 380. The displacement causes the second pick-and-placer 384 to drive the electronic component 62 to be tested to compensate for the X-axis position. Therefore, the second pick-and-placer 384 can perform angular rotation and XY axial displacement to make the test The electronic component 62 automatically compensates the calibration position so that the pins are accurately positioned on the probes of the test socket 51, and the electronic component 62 to be tested is placed in the test socket 51, so that the test operation can be accurately performed.

Accordingly, the adjusting structure of the conveying device of the present invention enables the pin of the electronic component on the pick and place to accurately perform the test operation on the probe located in the test stand to improve the test quality, which is practical and progressive. The design, but did not see the same product and publications open, thus allowing the invention patent application requirements, 提出 apply in accordance with the law.

[Literature]

10. . . Test machine

11. . . Test stand

20. . . Conveyor

twenty one. . . First carrier

211. . . Feeding platform

212. . . Receiving platform

twenty two. . . Second carrier

221. . . Feeding platform

222. . . Receiving platform

twenty three. . . Transfer mechanism

231. . . First drive structure

232. . . Shelf

233. . . First pick and place

234. . . Second drive structure

235. . . Shelf

236. . . Second pick and place

[this invention]

30. . . Conveyor

31. . . First carrier

311. . . Feeding platform

312. . . Receiving platform

32. . . Second carrier

321. . . Feeding platform

322. . . Receiving stage

33. . . First visual institution

331. . . Imager

34. . . Second visual mechanism

341. . . Imager

35. . . Transfer mechanism

351. . . First drive structure

352. . . Shelf

353. . . motor

354. . . First rack

355. . . First slide

356. . . Second rack

357. . . First rail

358. . . Second slide

359. . . Linear motor

360. . . First link

361. . . motor

362. . . Pulley set

363. . . Second link

364. . . Third rack

365. . . Second slide

366. . . First floating head

367. . . First pick and place

368. . . Second drive structure

369. . . Shelf

370. . . motor

371. . . First rack

372. . . First slide

373. . . Second rack

374. . . First rail

375. . . Second slide

376. . . Linear motor

377. . . First link

378. . . motor

379. . . Pulley set

380. . . Second link

381. . . Third rack

382. . . Second slide

383. . . Second floating head

384. . . Second pick and place

40. . . Machine

50. . . Test machine

51. . . Test stand

61, 62. . . Electronic component

Figure 1: Configuration diagram of the conventional conveyor and test machine.

Figure 2: Schematic diagram of the conventional material transfer mechanism.

Figure 3: Configuration diagram of the conveying device and the testing machine of the present invention.

Figure 4: Schematic diagram of the material transfer mechanism of the present invention.

Figure 5: Front view of the first and second adjustment structures of the present invention.

Figure 6: Side view of the first and second adjustment structures of the present invention.

Figure 7: Schematic diagram of the use of the delivery device of the present invention (I).

Figure 8: Schematic diagram of the use of the delivery device of the present invention (2).

Figure 9: Schematic diagram of the use of the delivery device of the present invention (3).

Figure 10: Schematic diagram of the use of the delivery device of the present invention (4).

352‧‧‧ Shelf

353‧‧‧Motor

354‧‧‧First rack

355‧‧‧First slide

356‧‧‧Second rack

357‧‧‧First slide rail

358‧‧‧Second slide

359‧‧‧Linear motor

360‧‧‧First Link

361‧‧ ‧motor

362‧‧‧ Pulley set

363‧‧‧Second link

364‧‧‧ third rack

365‧‧‧Second slide

366‧‧‧First floating head

367‧‧‧First pick and place

369‧‧‧ Shelf

370‧‧‧Motor

371‧‧‧First rack

372‧‧‧First slide

373‧‧‧Second rack

374‧‧‧First slide rail

375‧‧‧Second slide

376‧‧‧Linear motor

377‧‧‧First Link

378‧‧‧Motor

379‧‧‧ Pulley set

380‧‧‧Second link

381‧‧‧ third rack

382‧‧‧Second slide

383‧‧‧Second floating head

384‧‧‧Second pick and place

Claims (20)

A conveying device capable of correcting the position of an electronic component, the conveying device being mounted on a machine having a testing machine, comprising: a visual mechanism for taking an image electronic component; and a material transferring mechanism: a driving structure, an adjustment structure, and a pick-and-place device for driving the adjustment structure and the displacement of the pick-and-placer, and transferring the electronic component between the vision mechanism and the testing machine, the adjusting structure is provided with a rotating driving source for driving the first frame to rotate Actuated, a stacked frame is arranged under the first frame, and the X-axis driving source and the Y-axis driving source respectively drive the displacement of the lower pick-and-place device on the stacked frame, so that the pick-and-place is moved The device compensates for the position of the correcting electronic component. A device for correcting the position of an electronic component according to claim 1, wherein the visual mechanism is provided with an image pickup device, and the image pickup device is a CCD. The conveying device for calibrating the position of the electronic component according to the first aspect of the patent application, wherein the driving structure of the material moving mechanism is provided with a rotating driving source for assembling the adjusting structure, and the laminated machine of the adjusting structure The second frame is disposed under the first frame for receiving the Y-axis driving source and the X-axis driving source, and drives the second frame and the X-axis driving source by the Y-axis driving source. For the Y-axis displacement, a third frame with a pick-and-place device is arranged below the second frame, and the X-axis drive source drives the third frame and the pick-up device for X-axis displacement, so that the pick-and-place The device performs angular rotation and XY axial displacement to compensate for the position of the electronic components on the correcting pick and place device. The device for correcting the position of the electronic component according to claim 3, wherein the rotating driving source of the adjusting structure is a motor, and the first frame is coupled by a rotating shaft of the motor, and the Y-axis driving source system a linear motor and a first connecting frame at the end of the shaft of the linear motor, the other end of the connecting frame is fixed on the first frame, so that the linear motor can drive the second frame as the Y-axis The displacement of the X-axis drive source is a motor, and the rotation shaft of the motor is coupled to the second link frame on the third frame by the pulley set to drive the third frame for X-axis displacement, and the third A pick and place is mounted below the frame. The apparatus for correcting the position of the electronic component according to the third aspect of the patent application, wherein the first frame bottom surface of the adjusting structure is provided with a first sliding seat of the Y axis, and the top surface of the second frame is a first sliding rail disposed on the first sliding seat and a second sliding rail disposed on the bottom surface of the X-axis, wherein the top surface of the third frame is slidably disposed on the second sliding rail The second slide. The device for correcting the position of the electronic component according to the third aspect of the patent application, wherein the adjusting structure is provided with a floating head on the bottom surface of the third frame, and a pick-and-place device is disposed below the floating head . The conveying device capable of correcting the position of the electronic component according to the first aspect of the patent application, wherein the conveying device is provided with a first visual mechanism having an image capturing device in front of the testing machine, and is disposed behind the testing machine. a second visual mechanism with an imager. The device for correcting the position of the electronic component according to the seventh aspect of the patent application, wherein the image pickup device of the first and second vision mechanisms is a CCD. The device for correcting the position of the electronic component according to the seventh aspect of the patent application, wherein the feeding mechanism of the conveying device is provided with a first driving structure on one side of the testing machine for driving the first adjusting structure and The first pick-and-placer is axially displaced by the YZ, and the electronic component is transferred between the first visual mechanism and the testing machine, and the loading mechanism is provided with a second driving structure on the other side of the testing machine for driving the second adjusting structure. And the second pick-and-place device is used for YZ axial displacement, and the electronic components are transferred between the second vision mechanism and the testing machine. The apparatus for correcting the position of the electronic component according to claim 9 , wherein the first driving structure is provided with a bracket for assembling the first adjusting structure, and the first adjusting structure is disposed on the bracket a rotating driving source for driving the first frame to rotate, the laminated frame is disposed under the first frame and provided with a second frame for receiving the Y-axis driving source and the X-axis driving source And driving the second frame and the X-axis driving source for the Y-axis displacement by the Y-axis driving source, and the third frame with the first pick-and-place device under the second frame, and the X-axis The X-axis displacement of the third frame and the first pick-and-place device is driven to the driving source, and the first pick-and-placer is angularly rotated and XY-axially displaced to compensate for correcting the position of the electronic component on the first pick-and-place device. The apparatus for correcting the position of the electronic component according to claim 10, wherein the rotary driving source of the first adjusting structure is a motor, and the first frame is connected by a rotating shaft of the motor, and the Y-axis driving source The utility model relates to a linear motor, and a first connecting frame is arranged at the end of the shaft of the linear motor, and the other end of the connecting frame is fixed on the first frame, so that the linear motor can drive the second frame to be Y. The axial displacement, and the X-axis driving source is a motor, and the rotating shaft of the motor is coupled to the second connecting frame on the third frame by the pulley set to drive the third frame to perform X-axis displacement. A first pick and place is mounted below the three frames. The apparatus for correcting the position of the electronic component according to claim 10, wherein the first frame of the first adjustment structure is provided with a first sliding seat of the Y-axis and a top of the second frame. The surface is provided with a first sliding rail which is slidably disposed on the first sliding seat, and a second sliding rail is disposed on the bottom surface of the X-axis, and the top surface of the third frame is slidably disposed on the second sliding surface The second slide on the rail. The apparatus for correcting the position of the electronic component according to claim 10, wherein the first adjustment structure is provided with a first floating head on the bottom surface of the third frame, and the bottom of the first floating head A first pick and place device is mounted. The device for correcting the position of the electronic component according to claim 9 , wherein the second driving structure is provided with a bracket for assembling the second adjusting structure, and the second adjusting structure is disposed on the bracket a rotating driving source for driving the first frame to rotate, the laminated frame is disposed under the first frame and provided with a second frame for receiving the Y-axis driving source and the X-axis driving source And driving the second frame and the X-axis driving source for the Y-axis displacement by the Y-axis driving source, and the third frame with the second pick-and-placer under the second frame, and the X-axis The third frame and the second pick-and-place device are driven to the X-axis displacement by the driving source, and the second pick-and-placer is angularly rotated and XY-axially displaced to compensate for the position of the electronic component on the second pick-and-placer. The device for correcting the position of the electronic component according to claim 14 , wherein the rotary driving source of the second adjusting structure is a motor, and the first frame is connected by a rotating shaft of the motor, and the Y-axis driving source is The utility model relates to a linear motor, and a first connecting frame is arranged at the end of the shaft of the linear motor, and the other end of the connecting frame is fixed on the first frame, so that the linear motor can drive the second frame to be Y. The axial displacement, and the X-axis driving source is a motor, and the rotating shaft of the motor is coupled to the second connecting frame on the third frame by the pulley set to drive the third frame to perform X-axis displacement. A second pick and place is mounted below the three frames. The apparatus for correcting the position of the electronic component according to claim 14 , wherein the first frame bottom surface of the second adjustment structure is provided with a first sliding seat of the Y axis, and the top of the second frame The surface is provided with a first sliding rail which is slidably disposed on the first sliding seat, and a second sliding rail is disposed on the bottom surface of the X-axis, and the top surface of the third frame is slidably disposed on the second sliding surface The second slide on the rail. The device for correcting the position of the electronic component according to claim 14 , wherein the second adjusting structure is provided with a second floating head on the bottom surface of the third frame, and below the second floating head A second pick and place device is mounted. The conveying device for correcting the position of the electronic component according to the first aspect of the patent application, further comprising the conveying device being provided on the side of the testing machine with a carrying mechanism, wherein the carrying mechanism has at least one loading platform for Carrying electronic components. The conveying device for calibrating the position of the electronic component according to claim 18, wherein the conveying device is provided with a first carrying mechanism before the testing machine and a second carrying device after the testing machine Send the agency. The apparatus for correcting the position of an electronic component according to claim 19, wherein the first carrier mechanism has a feeding stage and a receiving stage for respectively carrying the test/testing The electronic component, the second carrier mechanism has a feeding stage and a receiving stage for respectively carrying the electronic components to be tested/tested.