KR100848937B1 - In-line auto fpc bonding m/c - Google Patents

Abstract

An in-line automatic FOG(Film ON Glass) bonding apparatus is provided to supply the FPC(Flexible Printed Circuit) automatically through an FPC supply member and to perform the bond process of plural FPCs. A loading member loads an LCD(Liquid Crystal Display) panel. A body member(2) comprises an ACF(Anisotropic Conductive Film) bonding member for attaching an anisotropic conductive film to the loaded gloss automatically. A preliminary bonding member(5) loads and aligns the FPC on the glass previously by a rotary manner. A main bonding member(7) loads the FPC film on the glass transferred from the preliminary bonding member finally. An FPC supply member supplies the aligned FPCs to the body member sequentially. An unloading member(9) discharges the glass to the outside by a conveyor manner. A transfer(13) comprises the first transfer(17) for transferring the glass of the loading member to the ACF bonding member. The second transfer(19) transfers the glass to the preliminary bonding member. The third transfer transfers the glass to the main bonding member. The fourth transfer(23) transfers the glass to the unloading member. A control member(11) controls the loading member, body member and unloading member.

Description

IN-LINE AUTO FPC BONDING M / C}

1 is a perspective view showing the structure of an IN LINE automatic FOG bonding apparatus according to a preferred embodiment of the present invention.

2 is a plan view of FIG.

3 is a front view of FIG.

4 is a perspective view showing the ACF bonding portion shown in FIG.

FIG. 5 is a perspective view showing the head of the ACF bonding portion shown in FIG. 4. FIG.

6 is a side view of FIG.

FIG. 7 is a diagram schematically showing a process of cutting an ACF tape by the cutter of the ACF bonding portion shown in FIG.

8 is a perspective view showing a preliminary bonding portion of the FPC shown in FIG.

FIG. 9 is a perspective view showing a head portion of the FPC preliminary bonding portion shown in FIG. 8. FIG.

10 is a front view of FIG.

Figure 11 is a side view of Figure 9;

FIG. 12 is a perspective view illustrating an FPC supply unit supplying an FPC to the preliminary bonding unit illustrated in FIG. 8.

Figure 13 is a side view of Figure 12;

14 is a plan view of FIG.

FIG. 15 is a side view illustrating a process of supplying an FPC from an FPC supply unit to the preliminary bonding unit illustrated in FIG. 8.

FIG. 16 is a plan view schematically illustrating a relationship between the pressurizing head picking up the FPC and the vision unit provided in the rotary of the preliminary bonding unit shown in FIG. 8.

17 is a perspective view showing the mail bonding part shown in FIG.

18 is a side view of FIG.

19 is a front view of FIG. 17;

20 is a plan view of FIG.

The present invention relates to an in-line automatic FOG bonding apparatus, and more particularly, to improve the structure, and to provide an FPC supply unit to automate the supply of the FPC, inline automatic bonding can be performed more efficiently FOG bonding apparatus.

In general, in the FOG bonding process, the FOG (Film on Glass) method attaches an anisotropic conductive film (hereinafter referred to as an ACF) to an electrode of a glass, places an FPC on the ACF, and presses at an appropriate pressure to form a pattern and an LCD electrode. It is a way of contact and conduction.

In this case, the ACF contains conductive particles, and when a predetermined pressure and heat are applied, the insulating film is broken to allow electricity to be applied through the conductive particles.

The FOG bonding method includes an ACF bonding process, a preliminary bonding process of an FPC film and glass, and a main bonding process.

However, the conventional FOG bonding method has the following problems.

First, since ACF work and FOG bonding work are performed in separate devices and each process of loading, bonding, and unloading is performed manually, bonding work may take a long time and work efficiency may decrease.

Second, in case of the preliminary bonding head, there are one or more bonding heads, and the alignment mark recognition cameras of the FPC film and the glass are separate from each other, or each pattern is recognized by one camera. It takes a lot of time, so the tact time is long and productivity is lowered.

Third, in the case of the conventional FOG, it is possible to use only the FOG equipment and it is not compatible with other equipment such as COG equipment.

Fourth, as the number of preliminary bonding heads increases for high speed time, the size of the equipment increases and space utilization decreases.

Fifth, it is difficult to correct the deviation of the thickness of the POL film, so that the alignment degree is lowered and the panel is easily broken.

Sixth, by inspecting the presence or absence of ACF attachment using the sensor during ACF attachment inspection, it is impossible to check the attachment degree and alignment degree, and thus it is impossible to block the occurrence of defects.

Seventh, there is no alignment camera in the main bonding, which can prevent glass breakage, misalignment and underpressure.

Ninth, the transfer method of the Teflon tape of the main bonding part is a left-right feeding method, which consumes a lot of consumption and takes a long time to replace the tape when the tape is exhausted.

Tenth, since the operation of the preliminary bonding head is a cylinder type, fine adjustment is difficult and the alignment accuracy is lowered.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide an FOG bonding apparatus capable of bonding FPC on glass more efficiently and accurately by automating the FOG bonding process with an FPC supply unit. have.

Another object of the present invention is to provide a FOG bonding apparatus capable of producing ultra-high speed 3.5 seconds by reducing the bonding time.

Still another object of the present invention is to provide a FOG bonding apparatus capable of bonding FPCs of various shapes by allowing a plurality of FPC bondings.

Still another object of the present invention is to provide a FOG bonding apparatus that can shorten the bonding time by applying a camera system that can simultaneously recognize the alignment mark of the LCD panel and the FPC in the preliminary bonding apparatus.

Still another object of the present invention is to provide an FOG bonding apparatus which can inspect alignment degree, attachment length, attachment state, and inspection by inspecting the attachment state of the ACF film by the camera during ACF operation.

Still another object of the present invention is to provide an FOG bonding apparatus which can minimize alignment errors that may occur during FPC transfer and reduce the texting time by applying two 180 degree rotation head methods during preliminary bonding.

It is still another object of the present invention to provide a FOG bonding apparatus that can shorten the preliminary bonding time by dividing the Z-axis driving method of the preliminary bonding head in a first and second manner by a submotor and a cylinder.

Another object of the present invention is to automatically adjust the height of the stage according to the thickness deviation of the POL by measuring the thickness of the POL by a contact displacement sensor, the level of the alignment stage (ALIGN STAGE) and the back up stage (BACK UP STAGE) This prevents the glass damage that may occur if it does not match, automatically adjusts the height of the alignment stage to handle glass of various thicknesses, FOG that can work with glass of the minimum thickness and shorten the setup time It is to provide a bonding device.

Still another object of the present invention is to apply the supply method of the Teflon tape back and forth in the main bonding, by applying the cartridge method can reduce the consumption of Teflon tape, FOG bonding device that can shorten the replacement time of the Teflon tape To provide.

Still another object of the present invention is to provide a FOG bonding apparatus capable of preventing and correcting an error in the alignment of glass that may occur during transportation by including a camera in the main bonding portion.

It is still another object of the present invention to provide a FOG bonding apparatus capable of fine control and coping with various models of glass by improving an FPC or glass aligning stage to a structure capable of movement in the X, Y, Z, and θ directions. It is.

Still another object of the present invention is to provide a FOG bonding apparatus capable of varying the width as needed by applying a cylinder to the loading unit transfer device in a manner of mounting the cylinder.

In order to realize the object of the present invention, the present invention includes a loading unit for loading the LCD panel; A main body portion which attaches an anisotropic conductive film on the glass supplied from the loading portion, performs preliminary bonding by aligning the supplied FPC on the glass, and performs main bonding; An FPC supply unit sequentially supplying the FPC to the main body in an aligned state; An unloading part which discharges the glass to the outside by a conveyor method; A transfer unit disposed between the loading unit, the main body unit, and the unloading unit to transfer glass; And a control unit for controlling the loading unit, the main body unit, and the unloading unit.

Hereinafter, a structure of a semiconductor bonding apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3, the semiconductor bonding apparatus includes an LCD panel L (hereinafter, referred to as a loader 1 for loading glass G) and a glass G supplied from the loading unit 1. The anisotropic conductive film is affixed on the C), the fed FPC (C) is aligned on the glass G, preliminary bonding is performed, and the main body part 2 which performs main bonding, and the glass G Unloading unit (9) for discharging to the outside by a conveyor method, the control unit 11 for controlling the loading unit 1, the main body 2, the unloading unit 9, and the loading unit (1) It is comprised between the main body part 2 and the unloading part 9, and the transfer 13 which can convey FPC (C) or glass G.

In the FOG bonding apparatus having such a structure, the loading part 1 includes a centering stage 15 that is slidably mounted on a rail and arranges and arranges the glass G on an upper surface thereof.

Therefore, the glass G conveyed from the previous process is loaded in a state where it is placed on the centering stage 15.

At this time, since the vacuum hole is formed in the centering stage 15, the bottom surface of the glass G is sucked by the suction force generated by the vacuum apparatus (not shown). At this time, the glass G is aligned by moving in an oblique direction by a pin (not shown) for alignment.

In this way, the loaded glass G is transferred to the main body 2 by the transfer 13.

The main body 2 has an ACF bonding portion 3 for automatically attaching an anisotropic conductive film onto the glass G loaded by the loading unit 1, and an FPC on the glass G to which the ACF is attached. (C; Fig. 10) to pre-mount the FPC (C) to the pre-bonding portion (Pre Bonding Portion) 5 to be mounted in advance by the rotary method and the glass (G) supplied from the pre-bonding portion (5) It consists of a main bonding portion (Main Bonding Portion) (7).

In addition, the transfer 13 reserves the glass G from the first transfer 17 and the ACF bonding part 3 which transfer the glass G of the loading part 1 to the ACF bonding part 3. 2nd transfer 19 conveyed to the bonding part 5, the 3rd transfer 21 which conveys glass G from the preliminary bonding part 5 to the main bonding part 7, and the main bonding part 7 ), A fourth transfer 23 for transferring the glass G to the unloading part 9.

Accordingly, the first to fourth transfers 13 are provided with a vacuum device and pick up the glass G by a vacuum suction method, and transfer the glass G for each section.

The ACF bonding portion 3 is shown in more detail in FIGS. 4 to 7. That is, the ACF bonding part 3 includes a frame 25, a pair of heads 27 provided on one side of the frame 25 and capable of vertically reciprocating movement, and a pair of heads 27. A plurality of reels 29 provided at adjacent side positions of the ACF for winding, and a moving part 31 for transferring the glass G to the pair of heads 27; And a cutter 33 provided at the lower portion of the head 27 to cut the ACF, and an ACF inspection unit K1 for attaching the ACF to the glass G and inspecting the attachment position.

In the ACF bonding part having such a structure, the pair of heads 27 are mounted on the frame 25 to enable vertical reciprocation. That is, by being connected to the drive part of a piston system, it moves up and down suitably as needed.

And, the plurality of reels 29 are provided with a plurality to be wound around the ACF film to maintain a constant tension.

The lower end of the head 27 is provided with a heating wire for generating heat. Therefore, when the ACF film is cut by the cutter 33 and positioned on the upper surface of the glass G, the ACF film is attached to the glass G by the heat and pressure of the head.

The cutter 33 is provided under the head 27 to cut the ACF. That is, as shown in Fig. 7, the cutter 33 has a structure that can be moved up and down, so that the cutter 33 contacts the bottom surface of the stopper 37 and forms cutting cuts on the ACF surface located therebetween. do.

Again, referring to FIGS. 4 to 7, the moving part 31 allows the ACF to be attached by placing the glass G on the loading stand 42 and moving in the head direction.

The moving part 31 includes an X-axis feeder 39 that is movable in the X-axis direction, a Y-axis feeder 41 that is movable in the Y-axis direction, a Z-axis feeder 40 that is movable in the Z-axis direction, It consists of a θ conveyance part 38 rotatable in the θ axis direction and a mounting table 42 mounted on an upper surface of the Y axis conveying part 41 and fixing the glass G to the upper surface by a vacuum suction method.

The X-axis, Y-axis, Z-axis, and θ-axis feeder 39, 41, 40, 38 are respectively connected to the servo motor can be moved properly when driving the servo motor.

In addition, the first transfer 13 moves the glass G picked up by the vacuum suction method to the upper surface of the loading rack.

Therefore, when the servo motors are driven, the X, Y, Z, and θ-axis feed units 39, 41, 40, and 38 move properly so that the glass G seated on the loading stand is moved in the head direction. Departure.

In addition, the ACF inspection unit K1 is disposed on the side of the head 27 to inspect the attachment state of the ACF by a camera. The camera may be connected to the control unit 11 to photograph the ACF attached to the glass G and transmit image information to the control unit and the monitor so that the inspection operator can automatically determine the alignment degree, the attachment length, and the attachment state of the ACF. Make sure

In addition, the ACF bonding unit 3 is provided with a collection box to collect and process the remaining ACF protective film generated during the ACF bonding process. At this time, the collection box is possible in a variety of ways, but preferably by applying a vacuum eject method to treat the ACF film.

As shown in Figs. 4 to 7, when the ACF is attached onto the glass G by the ACF bonding portion 3 described above, first, the ACF wound on the pair of rolls 29 is an intermediate roll ( It is arranged across between the cutter 33 and the stopper 37 via r).

In this state, the cutter 33 is raised to press the ACF to the bottom surface of the stopper 37 to form cutting scratches on the bottom surface of the ACF. In this case, since the ACF has a structure attached to the protective film (not shown) so as to be detachable, a cut scratch is formed only on the surface of the ACF, and the cut film is not formed on the protective film.

In this state, the placing table 42 of the moving part 31 moves in the Y-axis direction and moves to the lower end of the pair of heads 27 so that the glass G is positioned below the heads 27. . At this time, the cutter 33 and the stopper 37 also move together in the Z-axis direction.

Therefore, the glass G seated on the loading stand 42 is located under the head 27. In this state, the head 27 descends, so that the lower end presses only the ACF on the protective film. A predetermined position (G), that is, the electrode portion is pressed.

In this case, since the ACF is already formed by the cutter 33, the ACF may be easily separated and attached to the glass G.

Then, the lower ends of the pair of heads 27 adhere to the glass G by transferring heat and pressure of a predetermined temperature to the ACF.

As described above, after the attachment of the ACF to the glass G is completed, the glass G is picked up by the second transfer 19 and transferred to the preliminary bonding part 5 so that the FPC C is primarily bonded. do.

As shown in FIG. 1 and FIGS. 8 to 11, the preliminary bonding unit 5 applies a DD motor-driven rotary index method.

In more detail, the preliminary bonding unit 5 includes a frame 45, a DD motor-driven rotary 46 rotatably provided in the frame 45, and the rotary 46. Pressure heads 47 and 56 attached to the heads, an alignment stage 50 for transferring and aligning the glass G to the bonding position, and an FPC C supplied to the preliminary bonding position. And a vision unit 51 for recognizing the alignment mark of the glass G.

In addition, one side of the preliminary bonding unit 5 is provided with an FPC supply unit 10 for sequentially supplying the FPC (C) to the pressure head (47, 56).

In the preliminary bonding portion having such a structure, the frame 45 supports the horizontal plate 52 provided with the rotary 46 and both ends of the horizontal plate 52, and the alignment stage 50 is disposed therebetween. It consists of a pair of legs 53 provided to be movable.

In addition, the horizontal plate 52 is provided with a rotary 46 that rotates by a predetermined angle, preferably by 180 degrees, thereby preliminary bonding by supplying the FPC (C) on the glass.

The rotary 46 is composed of a stepping motor 54 provided on the upper portion of the horizontal plate 52, and a disk 55 that is connected to the stepping motor 54 and rotatable.

The disc 55 is connected to the stepping motor 54, so that when the stepping motor 54 is driven, it is possible to rotate 360 degrees by dividing a predetermined angle, preferably 180 degrees, and, if necessary, 90 degrees.

In addition, the pair of pressure heads 47 and 56 are mounted on the edge of the disc 55 to move up and down to pick up the FPC C or to supply it onto the glass.

That is, the pair of pressure heads 47 and 56 are composed of the first and second pressure heads 47 and 56, and each of the pressure heads 47 and 56 when the disc 55 rotates at an angle of 180 degrees. Rotates along the rotational trajectory of the disk 55 to sequentially reach the FPC C at the pick-up position P1 (Fig. 16) and the preliminary bonding position P2 (Fig. 16).

The pair of pressurizing heads 47 and 56 are connected to the servo motor 57 and a cylinder (not shown), and thus the structure is capable of raising and lowering along the Z-axis direction.

Accordingly, the pair of pressure heads 47 and 56 drive the submotor 57 primarily when picking up the FPC C supplied from the FPC supply unit 10 or when pre-bonding the picked-up FPC C. By the pressure head 47 is raised and lowered, it is possible to bond by a cylinder (not shown) in the second or to operate the first and second driving order in accordance with the product type.

As described above, two heads 47 and 56 are configured so that the heads 47 and 56 pick up the FPC C and move to the preliminary bonding position P2 (Fig. 16). It can be minimized.

And by installing the displacement sensor in the vision unit 51 can measure the thickness deviation of the POL attached to the glass (G) to automatically adjust the height of the alignment stage 50 according to the difference in the POL thickness.

As such, the pressurizing heads 47 and 56 prebond the FPC C supplied by the FPC supply unit 10 onto the glass G.

12 to 16, the FPC supply unit 10 is provided at the rear of the preliminary bonding unit 5 (FIG. 1) to supply the FPC (C).

The FPC supply unit 10 is a tray supply unit 58 for sequentially transferring a plurality of FPC trays (not shown) transferred by the cassette lifts (L1, L2), and the FPC (C) from the tray supply unit 58 FPC holder 59 for picking up and transporting one by one, and FPC alignment portion 61 for moving the FPC (C) transferred by the FPC holder 59 to the pickup position of the pressure head 56.

In the FPC supply unit having such a structure, the tray supply unit 58 picks up the FPC (C) from the first and second cassette lifts L1 and L2 for raising and lowering the FPC tray (not shown) and the raised FPC tray. It consists of a pair of lift holder 60 to be separated.

The first and second cassette lifts L1 and L2 are transported to the first and second lift holders 60 by mounting and raising the FPC C on the upper surface thereof. At this time, although the first and second cassette lifts L1 and L2 are configured as a pair, it is also possible to transfer the FPC tray by a single cassette lift.

The first and second lift holders 60 pick up the FPC sequentially or simultaneously.

In this case, the first and second lift holders 60 may be connected to a vacuum apparatus (not shown) to separate the FPC C from the tray by vacuum pressure.

In this way, the first and second lift holders 60 picking up the FPC C move in the direction of the FPC holder 59 along the Y axis. Then, the first and second lift holders 60 lower the FPC on the upper surface of the seating stage 64.

The FPC placed on the seating stage 64 may be picked up by the FPC holder 59.

The FPC holder 59 is movable in the X-axis direction by being movable in the transfer frame 62. That is, the FPC holder 59 is provided to be movable by the rail method or the LM method in the transfer frame 62, so that the FPC holder 59 can move along the X axis direction if necessary. The FPC holder 59 can be picked up by vacuum pressure by being connected to a vacuum apparatus (not shown).

Accordingly, the FPC holder 59 picks up the FPC C and reaches the position of the FPC alignment portion 61.

The FPC alignment unit 61 is placed in the correct position by aligning the FPC (C). The FPC alignment unit 61 is a vision camera for visualizing the appearance of the FPC (C) to center the FPC (C) and the FPC alignment stage 63 for aligning the transferred FPC (C) to the correct position. And 72.

The FPC alignment stage 63 is connected to an X, Y, Z control shaft driven by a servo motor and is movable to an appropriate position.

That is, when the FPC (C) is seated on the FPC alignment stage 63, the X-axis adjustment shaft 68 is driven to move the FPC alignment stage 63 a certain distance in the X-axis direction to the vision camera 72 Proceed.

In this state, the FPC centering vision camera 72 visions the alignment mark M1 of the FPC C, and sets the vision to be horizontal to each other. In this case, the vision camera 72 has a structure similar to that of the vision unit described later.

Then, by properly operating the X, Y, Z axis adjustment axis of the FPC alignment stage 63, the alignment stage 63 is moved to the registered coordinates to automatically center the FPC (C).

Therefore, it is possible to prevent the FPC (C) from being damaged due to mechanical external force during the alignment of the FPC (C), and accurate FPC alignment is possible to prevent the occurrence of defective FPC as well as the time required for the FPC (C) alignment. This can be minimized, resulting in significantly shorter Tact Times and higher productivity.

As described above, after the centering process for the FPC C is completed, the FPC C is transferred to the preliminary bonding portion 5 by the conveyor 66.

That is, as shown in Figs. 8, 15, and 16, when the FPC C reaches the first position P1, that is, the pick up position, the first head 56 is lowered to raise the FPC C. Pick up by suction method.

Then, when the FPC C is picked up by the first head 56, the original plate 55 rotates at an angle of 180 degrees so that the FPC C reaches the preliminary bonding position, that is, the second position P2. At this time, the vision unit 51 is disposed at the second position P2 to simultaneously recognize the alignment marks M1 and M2 of the FPC C and the glass G.

Such a vision unit 51 is disposed at the first position P1 and is disposed at the first camera 70 and the second position P2 that recognize images of the alignment marks M1 having a cross shape of the FPC C. FIG. And a second camera 71 arranged to recognize images of the alignment marks M2 of the cross shape of the glass G, respectively, and the first and second cameras 70 and 71 are provided in the control unit 11 (Fig. 1). ), Preferably by connecting to a personal computer (PC) to process the image information.

8, the first and second cameras 70 and 71 are integrally connected to each other and have the same structure.

In addition, the first and second cameras 70 and 71 are supported by the support shaft 69. At this time, the support shaft 69 is connected to the stepping motor to move in the X, Y, and Z directions. It is possible.

Accordingly, the first and second cameras 70 and 71 can be properly moved to accurately recognize the alignment marks M1 and M2 of the FPC C and the glass G.

The first camera 70 recognizes the alignment mark M1 of the FPC C as described above.

Such an aligning mark M1 may be obtained by the camera to obtain image information edited in two colors, black and white. The image information on the alignment mark M1 of the FPC C is transmitted to the personal computer.

The second camera 71 image-recognizes the aligning mark M2 of the glass G transferred to the preliminary bonding position P2 by the alignment stage 50.

The video information of the alignment mark M2 of the glass G recognized by the second camera 71 is transmitted to the personal computer.

Therefore, the image information transmitted from the first and second cameras 70 and 71 is processed by the personal computer to control the alignment stage 50 so that the FPC C can be pre-bonded to the correct position on the glass G. To help.

In more detail, the personal computer includes a built-in alignment of alignment marks M1 and M2 of the FPC C and the glass G transmitted by the first camera 70 and the second camera 71. Processing by the mark editing program makes it possible to recognize a more accurate position.

That is, the alignment mark editing program adjusts the resolution by editing the image in two colors, black and white, when the mark outline is not clear.

Therefore, the recognition rate of the aligning mark M1 can be improved by automatically removing unnecessary images around the aligning mark M1 of the FPC (C).

Then, in the case of the aligning mark M2 of the glass G, the aligning process is performed automatically by a program based on a distance away from the original mark by a predetermined distance.

As described above, the personal computer properly moves the alignment stage 50 by the processed image information so that the FPC C can be pre-bonded to the correct position on the LCD.

8 and 15, the alignment stage 50 may include an X-axis feeder 75 that may move in the X-axis direction, a Y-axis feeder 76 that may move in the Y-axis direction, and a Z-axis direction. Z-axis feeder 77 movable in the direction, θ-feeding portion 78 movable in the θ-axis direction, and the mounting table 73 is provided on the X-axis feeder 75, the glass (G) is seated do.

In the alignment stage having such a structure, the X-axis, Y-axis, Z-axis, and θ-axis feed units 75, 76, 77, and 78 move properly when the power is applied, thereby accurately positioning the loading stand 73. Can be moved to a location.

At this time, the loading stand 73 may be transported at least one glass (G) at the same time by having at least one, preferably four seating table. Of course, the number of glasses placed on the loading stand 73 may be changed according to the production capacity and the size of the product.

As described above, when the alignment stage 50 on which the glass G is seated reaches the home position by the control signal of the controller, the pressurizing head 47 is in the state of picking up the FPC C at the second position P2. ) Is lowered and preliminary bonding is performed by placing the FPC (C) on the glass (G).

In more detail, the heating device of the pressurizing head 47 heats the bonding tip Tip to generate heat of a predetermined temperature, thereby thermally compressing the FPC C. At this time, the temperature of the heat is preferably about 60 degrees, the pressing time is 0.1-60 seconds.

Through this process, the FPC C may be preliminarily bonded onto the glass G.

In this preliminary bonding, the FPC C may be automatically aligned at the correct position of the glass G, which is an FPC (C) due to the interaction between the vision unit 51 and the alignment stage 50. Can be done by aligning

As such, the glass G pre-bonded with the FPC C may be transferred to the main bonding part 7 by the third transfer 21 of the transfer 13, and the bonding operation may be performed secondarily.

In more detail, as shown in FIGS. 17 to 20, the main bonding unit 7 is provided on the frame 80 and one side of the frame 80 to bond the FPC (C). A bonding head 81 and a transfer member 87 for moving the pre-bonded glass G to the bonding position or discharging the glass G bonded with the FPC C from the bonding position; It is provided in front of the frame 80 includes a film supply unit 83 for supplying a buffer film.

In the main bonding portion having such a structure, the bonding heads 81 are provided in plural, preferably two in two, four are provided. The four bonding heads 81 perform the lifting operation in order to perform the bonding operation.

That is, the driving motors 88 are provided on the bonding heads 81, respectively, and when the driving motors 88 are driven, the bonding heads 81 may move up and down.

In addition, a bonding tip for generating a constant heat is provided below the bonding head 81. Therefore, by placing the FPC (C) on the glass (G) and heating the bonding tip 89, it is possible to minimize the instantaneous heat loss by the glass (G) to proceed with the bonding operation.

The film supply unit 83 includes a pair of support frames 90 and a winding reel 92 provided between the pair of support frames 90 to wind a buffer film.

Then, the buffer film wound on the cartridge-type winding reel 92 is installed on the bottom surface of the bonding head 81 and inserted across the front to rear direction.

Accordingly, the bonding head 81 is lowered to attach the buffer film to the bonding portion, thereby improving the ball cracking of the ACF and preventing foreign substances and scratches.

The conveying member 87 includes an X-axis conveying part 94 that is movable in the X-axis direction, a Y-axis conveying part 95 that is movable in the Y-axis direction, and a Z-axis conveying part 96 that is movable in the Z-axis direction. And a θ transfer part 97 that is movable in the θ axis direction, and a seating stand 98 provided on the X axis transfer part 94 on which glass G is seated.

In the conveying member having such a structure, the X-axis, Y-axis, Z-axis, and θ-axis conveying portions 94, 95, 96, and 97 are moved properly to move the seating table 98 when power is applied. Can be moved to

As such, when the transfer member 87 on which the glass G is seated reaches the bonding position by the control signal of the control unit 11, the bonding head 81 descends and the FPC C is placed on the glass G. Bond.

The glass alignment camera 85 may be disposed on the upper front surface of the bonding head 81 to recognize the position of the alignment mark of the glass. As described above, the image information recognized by the camera 85 is processed by the controller 11, and the controller 11 controls the transfer member 87 so that the glass G reaches the correct bonding position.

On the other hand, the glass (G), the bonding operation is completed as described above, when the transfer member 87 is backed to reach a predetermined position is picked up by the fourth transfer 23 of the transfer 13, the unloading portion ( It can be discharged to the outside through 9).

Hereinafter, an operation process of a semiconductor bonding apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3, when bonding the FPC C to the glass G using the semiconductor bonding apparatus proposed by the present invention, the glass G is first bonded using the loading unit 1. Transfer to the inside of the

That is, the glass G transferred from the whole process is seated on the centering stage 15 of the loading part 1.

Then, the transferred glass G is picked up in a vacuum manner by the first transfer 17 of the transfer 13, and the transfer 13 is composed of two jigs, and the interval of each jig is adjusted by a cylinder during operation. By being variable, it is conveyed to the ACF bonding part 3 of the main body part 2.

The process of the ACF bonding unit 3 will be described in more detail. As shown in FIGS. 4 to 7, the moving unit 31 capable of moving in the X, Y, Z and θ axis directions is a vacuum suction chamber. The glass G is seated on the upper surface of the loading table 42 by the formula.

The moving part 31 on which the glass G is seated is positioned at the lower end of the head 27 by moving in the Y-axis direction.

In this state, after the glass G is aligned in position, the plurality of reels 29 are rotated so that the ACF wound on the reels 29 is unwound to a predetermined length and passes through the plurality of intermediate reels r to pass the glass ( It is placed on top of G) and then cut by a cutter 33 to a predetermined length and then conveyed.

And the lower end of the head 27 pressurizes an ACF by the head 27 of the ACF bonding part 3 descend | falling. Preferably, the electrode of the glass G is pressed.

In addition, the head 27 is attached to the glass (G) by transferring a constant temperature heat to the ACF.

After attaching the ACF on the glass G, the cutter 33 cuts the ACF tape. In addition, the separator 35 separates the ACF from the protective film portion (not shown) so that the ACF is attached to the glass G.

Then, after the process is completed, the length and adhesion of the ACF is inspected by vision and the foreign matter is inspected by the sensor.

As described above, after the ACF attaching process is completed, the glass G is transferred to the preliminary bonding part 5 by the second transfer 19 of the transfer 13 in the state of being seated on the loading rack 42 and the FPC (C). ) Is primarily prebonded.

In detail, the glass G to which the ACF is pressed is seated on the align stage 50 of the preliminary bonding portion 5 and moved in the Y-axis direction to reach the preliminary bonding position P2.

At this time, the pressurizing heads 47 and 56 provided in the rotary 46 are formed of the first head 56 and the second head 47, and the chip C supplied from the FPC supply unit 10 is placed in a first position. After picking up at P1, it is positioned at the preliminary bonding position P2.

That is, as shown in Figs. 8, 15 and 16, the rotary 46 rotates at an angle, preferably 180 degrees, to reach the first position P1 along the circular trajectory.

At this time, the FPC C is supplied to the first position P1 through the FPC supply unit 10. When the FPC (C) described above is supplied to the pressure head 47 by the FPC supply unit 10 as follows.

That is, the first and second cassette lifts L1 and L2 rest on the FPC C on the upper surface thereof and ascend. The pair of lift holders 60 pick up the FPC C sequentially or simultaneously.

The first and second lift holders 60 picking up the FPC C move in the direction of the FPC holder 59 along the Y axis. Then, the first and second lift holders 60 lower the FPC C on the upper surface of the seating stage 64.

The FPC C placed on the seating stage 64 may be picked up by the FPC holder 59.

The FPC holder 59 picks up the FPC C and reaches the position of the FPC alignment portion 61 so that the FPC C is placed at the correct position.

That is, when the FPC (C) is seated on the alignment stage 63, the X-axis adjusting axis advances to move to a certain distance in the X-axis direction to the vision camera 72.

In this state, the FPC centering vision camera 72 visions the alignment mark M1 of the FPC C, and sets the vision to be horizontal to each other.

Then, by properly operating the X, Y, Z axis adjustment axis of the alignment stage 63, the alignment stage 63 is moved to the registered coordinates to automatically center the FPC (C).

As described above, after the centering process for the FPC C is completed, the FPC C is transferred to the preliminary bonding portion 5 by the conveyor 66.

As such, when the FPC C reaches the preliminary bonding portion 5, the preliminary bonding operation is performed by being picked up by the first head 56.

That is, as shown in Figs. 8, 9, 15, and 16, after the first head 56 picks up the FPC C at the first position P1, the rotary 46 is 180 degrees. By rotating, the second position P2 is reached.

The alignment mark M1 of the chip C is recognized by the first camera 70 at the second position P2. In this case, an aligning mark M1 is provided for FPC alignment, and the aligning mark M1 may be obtained by the camera to obtain image information edited in two colors, black and white. Then, the video information on the alignment mark of the FPC (C) is transmitted to the personal computer.

In addition, at this time, the mounting base 73 has reached the preliminary bonding position P2 by the alignment stage 50.

Therefore, the second camera 71 recognizes the aligning mark M2 of the glass G seated on the mounting base 73 and transmits the image information to the controller.

In this way, the image information transmitted from the first and second cameras 70 and 71 is processed by the personal computer to control the alignment stage 50 so that the FPC C is positioned at the correct position on the upper surface of the glass G. To allow preliminary bonding.

At this time, the personal computer is configured to align the alignment marks M1 and M2 of the FPC C and the glass G transmitted by the first and second cameras 70 and 71 by the built-in alignment mark editing program. By doing so, we can recognize the location more accurately.

That is, the alignment mark editing program adjusts the resolution by editing the image in two colors, black and white, when the mark outline is not clear.

Therefore, the recognition rate of the aligning mark M1 can be improved by automatically removing unnecessary images around the aligning mark M1 of the FPC (C).

In the case of the aligning mark M2 of the glass G, the aligning mark M2 is automatically aligned by arithmetic processing based on a distance away from the original mark by a predetermined distance.

As described above, the personal computer properly moves the alignment stage 50 by the processed image information so that the FPC C can reach the correct position on the glass G.

In this way, when the alignment stage 50 on which the glass G is seated reaches the correct position by the control signal of the personal computer, the first head 56 in the state of picking up the FPC C is lowered. Preliminary bonding is performed by placing the FPC (C) on the glass (G).

In more detail, the heating device of the first head 56 heats the bonding tip to generate heat of a predetermined temperature, thereby thermally compressing the FPC C. At this time, the temperature of the heat is preferably about 60 degrees, the pressing time is 0.1-60 seconds.

Through this process, the FPC C may be preliminarily bonded onto the glass G.

The glass G to which the FPC C is pre-bonded is transferred to the main bonding part 7 by the third transfer 21 of the transfer 13 to perform main bonding.

That is, as shown in FIGS. 17 to 20, the glass G picked up by the third transfer 21 is mounted on the mounting table 98 of the transfer member 87 of the bonding head 81. Conveyed to the bottom.

Then, the four bonding heads 81 perform the lifting operation in order to perform the bonding operation.

At this time, the lower portion of the bonding head 81 is provided with a bonding tip 89 for generating a constant heat. Therefore, the bonding operation can be performed by placing the FPC C on the glass G and heating the bonding tip 89.

The buffer film wound around the film supply unit 83 provided at the front of the bonding head 81 is supplied to the bonding portion.

In this case, the buffer film may be bonded by winding in the rear direction from the front of the bonding head 81.

As such, by adhering the buffer film to the bonding portion of the glass G, it is possible to improve the cracking of the ACF and to prevent foreign substances and scratches.

On the other hand, the glass (G), the bonding operation is completed as described above, when the conveying member 87 is retracted to reach a predetermined position, is picked up by the fourth transfer 23 (Fig. 1) of the transfer 13 is provided on the exit side It may be discharged to the outside through the unloading unit (9).

As described above, the FOG bonding apparatus according to the preferred embodiment of the present invention has the following advantages.

First, it is possible to produce ultra-fast production of 3.5 seconds by shortening the FOG bonding time by automating the FPC bonding process with the FPC supply unit.

Second, by applying the X, Y, Z, θ axis of each stage, it is possible to bond a plurality of FPC by a plurality of FPC bonding.

Third, the bonding time can be shortened by applying a camera that can simultaneously recognize the alignment marks of the LCD panel and the FPC during preliminary bonding.

Fourth, the preliminary bonding time can be shortened by finely approaching the gap between the panel and the FPC by applying the Z axis of the head.

Fifth, by checking the attachment state of the ACF film by the camera during the ACF operation, the alignment degree, the attachment length, and the attachment state can be inspected.

Sixth, by measuring the thickness deviation of the POL by the contact displacement sensor, the height of the alignment stage is adjusted according to the thickness deviation of the POL film to shorten the setup time, improve the alignment accuracy, minimize the glass damage, and Correspondence is possible.

Seventh, it is possible to reduce the consumption of the Teflon tape, and to reduce the replacement cycle and replacement time of the Teflon tape by applying the cartridge of the Teflon tape supplying method back and forth during the main bonding.

Eighth, by providing a camera in the main bonding portion, it is possible to improve the accuracy by correcting the alignment error that may occur during the transfer.

Ninth, the width of the width can be adjusted by applying the loading unit transfer device in a cylindrical manner, it is possible to adjust the width as needed.

Tenth, by applying the inversion function when supplying FPC, it is possible to work regardless of the feeding direction of FPC.

Eleventh, it is possible to change production from FOG to COG and COG to FOG by replacing only the FPC supply unit.

Twelfth, the COG equipment is a device that can be configured with other equipment and an IN LINE system, and can be configured as a high-speed module production line by configuring a LOADER, CLEANER, FOG bonding machine, and AOI inspector in a continuous process.

The present invention can be variously changed by those skilled in the art without departing from the gist of the present invention claimed in the claims, and is not limited to the specific preferred embodiments described above. .

Claims (14)

A loading unit for loading an LCD panel; An ACF bonding unit for automatically attaching an anisotropic conductive film onto the glass loaded by the loading unit, a preliminary bonding unit for pre-mounting and aligning the FPC on the glass to which the ACF is attached by a rotary method; A main body portion including a main bonding portion for finally mounting the FPC film on the glass transferred from the bonding portion; An FPC supply unit sequentially supplying the FPC to the main body in an aligned state; An unloading part which discharges the glass to the outside by a conveyor method; A first transfer for transferring the glass of the loading unit to the ACF bonding unit, a second transfer for transferring the glass from the ACF bonding unit to the preliminary bonding unit, and a third transfer for transferring the glass from the preliminary bonding unit to the main bonding unit And a fourth transfer transfer glass from the main bonding portion to the unloading portion. And And a controller to control the loading unit, the main body unit, and the unloading unit. delete The method of claim 1, wherein the ACF bonding portion is provided at a frame, a pair of heads provided on one side of the frame and capable of vertically reciprocating movement, and adjacent side positions of the pair of heads for bonding operation. A plurality of reels winding the required ACF, a moving part for transferring glass to the pair of heads, a cutter provided at the lower end of the head to cut the ACF to a predetermined length, and an ACF attached thereto. ACF exactly after A semiconductor bonding device comprising an ACF checker for checking whether it is attached. The alignment stage of claim 1, wherein the preliminary bonding unit comprises a frame, a rotary rotatably provided in the frame, a pressure head attached to the rotary unit, and an alignment stage for transferring the glass to a bonding position. (Align Stage), and the vision bonding unit for recognizing the pattern and position of the glass and FPC supplied to the bonding position of the pressure head, the semiconductor bonding device for pre-bonding the FPC on the glass by rotating the rotary by a constant 180 degrees . 5. The rotary machine of claim 4, wherein the rotary unit is provided with a DD motor provided on an upper part of the horizontal plate, a disk connected to the DD motor and rotatable, and the disk is movable up and down to bond the FPC to the ACF of the glass surface. A semiconductor bonding apparatus comprising a pressurized head. The display apparatus of claim 4, wherein the vision unit is disposed under the pressurizing head and is connected to the first camera to recognize the alignment mark of the FPC, and the alignment mark of the glass is respectively recognized. And a second camera, wherein the first and second cameras transmit image information to the controller. The method according to claim 6, wherein the control unit recognizes the position of the FPC and the glass by the image information transmitted from the first and second cameras, and processes the image information of the aligning mark by a program to process the ITO pattern of the glass. A semiconductor bonding device with a program for aligning an FPC pattern that can increase the matching ratio of alignment marks with the bump surface of the FPC. 5. The alignment stage of claim 4, wherein the alignment stage comprises: an X-axis feeder movable in the X-axis direction, a Y-axis feeder movable in the Y-axis direction, a Z-axis feeder movable in the Z-axis direction, and a θ-axis direction. And a seating plate provided on the X-axis conveying unit and movable on the X-axis conveying unit to seat the glass. The FPC supply unit according to claim 1, wherein the FPC supply unit sequentially transfers a plurality of FPC trays transferred by a cassette lift, an FPC holder for transferring FPCs one by one from the tray supply unit, and an FPC transferred by the FPC holder. A semiconductor bonding apparatus comprising an FPC alignment portion for transferring to a pickup position and aligning the FPC. The semiconductor bonding apparatus of claim 9, wherein the FPC alignment unit comprises an FPC alignment stage for aligning the transferred FPC to a correct position, and a vision camera for visualizing an appearance of the FPC to center the FPC. The bonding method of claim 1, wherein the main bonding unit is configured to bond the frame, a vertically reciprocating movement to one side of the frame, a variable pitch bonding head, and a lower end of the bonding head to transfer heat to the glass on which the chip is bonded. A tip, a film supply unit provided at an adjacent position of the bonding head to wind a buffer film, a camera provided at an upper portion of the bonding head to recognize a position of glass, and to transmit image information to the control unit; A semiconductor bonding apparatus comprising a transfer member for transferring the glass to the lower portion of the. 12. The method of claim 11, wherein the conveying member is an X-axis feeder that can move in the X-axis direction, a Y-axis feeder that can move in the Y-axis direction, a Z-axis feeder that can move in the Z-axis direction, and in the θ-axis direction And a seating plate provided on the X-axis conveying unit and movable on the X-axis conveying unit. 12. The semiconductor bonding apparatus of claim 11, wherein the film supply unit comprises a pair of support frames and a winding reel provided between the pair of support frames to wind the buffer film. delete

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