JP6673794B2 - Thermocompression bonding equipment - Google Patents

Description

  The present invention relates to a thermocompression bonding apparatus, and more particularly to a thermocompression bonding apparatus for bonding a chip to a substrate using thermocompression.

  Generally, a process for attaching a semiconductor chip to a circuit board must be performed very precisely, and the substrate is provided with a plurality of mounting areas to which the semiconductor chip is fixed. Meanwhile, the electrical connection between the mounting area of the semiconductor chip and the circuit board must be performed accurately, and the semiconductor chip must be mounted at an accurate position (pattern) in the mounting area in order to reduce the failure rate.

  The above-described semiconductor chip mounting process can be referred to as a bonding process. The semiconductor chip is mounted on the circuit board after the inspection of the overall position of the circuit board and the position (mounting area) of the semiconductor chip fixing portion of the circuit board is completed due to the specialty of the process requiring precision work.

  The thermocompression bonding apparatus is an apparatus that separates an individual semiconductor chip from a wafer and bonds the chip to a substrate to be bonded in a state where the semiconductor chip is picked up by a bonding picker such that the lower surface (bump forming surface) of the chip faces downward.

  The method of bonding the chip includes a method of applying a flux to the bumps to attach the bumps to the connection terminals of the substrate, and a method of applying a flux to the substrate to attach the connection terminals to the substrate. At this time, the semiconductor chip is press-bonded while being heated, and such a method is called a thermo-compression method.

  However, in such a thermocompression bonding method, the bonding means rises along the side surface of the chip due to the pressure of the bonding picker pressing the chip, and the gas generated while adhering to the lower surface of the bonding picker or heating the bonding means. This may cause a problem that the bonding picker is contaminated.

  On the other hand, since precision is important in the conventional thermocompression bonding apparatus, when the bonding picker is moved by the gantry, precision cannot be ensured due to generation of vibration by X-axis and Y-axis moving. When one bonding picker is working while another is not working, it is not possible to verify the accuracy, so the thermocompression bonding equipment uses only one bonding picker per wafer for thermocompression bonding Was being carried out. Therefore, in the existing thermocompression bonding apparatus, the production amount (UPH) had to be reduced.

  On the other hand, Korean Patent Application Publication No. 10-2000-0035067 discloses a thermocompression bonding apparatus for inverting a semiconductor chip and bonding directly to a substrate.

Korean Published Patent Publication No. 10-2000-0035067 (2000.06.26. Published)

  Accordingly, an object of the present invention is to provide a thermocompression bonding apparatus having improved precision and UPH to solve the above-mentioned problems.

  More specifically, while reducing the number of X-axis movements of the bonding picker moved in a gantry type, simultaneously inspecting the suction head and the substrate on which the semiconductor chip is mounted Inspection of errors due to thermal deformation of the slit vision at any time during work As a result, by ensuring and verifying the precision, a plurality of bonding pickers can perform thermocompression bonding work on one wafer, thereby providing a thermocompression bonding apparatus capable of improving UPH. .

  Further, according to one embodiment of the present invention, it is possible to provide a thermocompression bonding apparatus which can prevent the bonding picker from being contaminated during the thermocompression bonding method.

  According to an aspect of the present invention, in a thermocompression bonding apparatus for thermocompression bonding an individual unit semiconductor chip to a mounting position of a substrate, a material supply unit for supplying a material cut to the individual unit semiconductor chip; A flip-over picker for picking up the semiconductor chip from a unit and inverting the semiconductor chip; a unit picker for receiving an individual semiconductor chip from the flip-over picker and lowering the chip on a sheet block on which the chip is loaded; a semiconductor on the sheet block A suction head formed with a suction hole for sucking and supporting the chip, and a film provided at a lower end for sucking the semiconductor chip through a film; a film providing means for providing a film at a lower end of the suction head; A pair with the suction hole formed in the suction head A punching unit including a holding block for supporting a lower surface of the film and forming a pin receiving hole therein through which a punching pin is formed to form a hole in the film at a position where the hole is formed; A thermocompression bonding apparatus including a heating table on which a substrate for thermocompression bonding of a semiconductor chip is placed.

  A punching pin installed on the base to pierce the film; a holding block for supporting a lower surface of the film and forming a pin receiving hole through the punching pin; A first elastic member interposed between the holding blocks, wherein the holding blocks are provided to be movable up and down, and when the holding blocks move downward, the punching pins pierce the film. It can be.

  The punching unit further includes a second elastic member interposed between the punching pin and the fixing member, wherein the second elastic member is configured to reduce a pressure applied to the punching pin when the punching pin pierces the film. It can be provided to change shape at high pressure.

  The material supply unit and the heating table are arranged in a multi-layered form having a partially overlapping space, and the flip-over picker can move up and down while the semiconductor chip on the material supply unit is sucked and inverted. The semiconductor chip on the sheet block is picked up by the suction head and bonded to the substrate after the unit picker loads the semiconductor chip on the sheet block.

  Although the punching unit guides the vertical movement of the holding block, the punching unit further includes a guide member formed with an engaging step covering an upper part of a flange protruding from an outer peripheral surface of the holding block to prevent the holding block from being detached. It can be characterized.

  The punching unit further includes a fixing member fixed below the base to support the punching pin, wherein the punching pin is provided to penetrate the base from below and protrude to an upper portion of the base, A flange portion protruding from an outer peripheral surface of the pin may be supported on a lower surface of the base.

  An apple picking vision for inspecting a bump, a foreign substance or a crack state located on the lower surface of the semiconductor chip picked up by the unit picker, and the apple picking vision interposed between a mounting position of the substrate and the semiconductor chip adsorbed by the bonding picker. The apparatus may further include a slit vision for inspecting a mounting position of the substrate and an alignment state of the semiconductor chip.

  It has a gantry structure so that the bonding picker can be moved to any position on the X-axis and Y-axis planes, and is provided on both sides symmetrically in the X-axis direction around the heating table, and the chip carrier is The number of suction heads may be provided corresponding to the number of suction heads.

字状に構成されて上面にはフィデューシャルマークが形成された上部グラスが配置され、下面にはフィデューシャルマークが形成された下部グラスが配置されるものの、前記上部グラスの中心部と前記下部グラスの中心部が互いに一致した状態で同軸に配置されることを特徴とすることができる。 The hoop unit further includes a hoop unit for calibrating a deviation between a chip vision provided above the slit vision and a board vision provided below the slit vision.

The upper glass having a fiducial mark is arranged on the upper surface, and the lower glass having the fiducial mark is arranged on the lower surface. The central part of the lower glass may be coaxially arranged in a state where the central parts are aligned with each other.

  The slit vision is a coaxial vision movably provided, and sets a position obtained as a result of inspection of the upper glass and the lower glass of the hoop unit as a reference position, and sets the position on the substrate placed on the heating table. Before the semiconductor chip sucked by the suction head is bonded by thermocompression bonding, the amount of movement of the suction head may be corrected by comparing position values obtained by inspection with the slit vision.

  The slit vision inspects the alignment state of the semiconductor chip between the semiconductor chip sucked by the suction head and the substrate to which the semiconductor chip is bonded, and then moves to a hoop unit to move the chip vision of the slit vision and the substrate vision. Inspect the error value, and if there is a deviation, inspect the alignment state of the next semiconductor chip and the substrate to which the semiconductor chip is bonded to reflect the error value when compensating the amount of movement of the suction head. It can be a feature.

  During the punching of the film sucked by the suction head by the punching unit, the bonding state of the semiconductor chip after the thermocompression bonding is completed may be inspected by the slit vision.

  The sheet block 162 and the punching unit may be provided on a chip carrier in the Y-axis direction, and the chip carrier may be movable in the Y-axis direction by a carrier robot.

  After the thermocompression bonding, the apparatus further includes a film separating device for separating the film attached to the suction head, and the film separating device is connected to the film separating roller for extruding the film and the film separating roller to be vertically movable. The apparatus may be provided with a roller transfer device provided.

  A punching unit of a punching unit can punch a film at a correct position of a suction hole formed in the suction head that is sucking the film, so that a relative position between the suction head and the punching unit is matched. A fiducial may be formed on a lower surface of the chip carrier.

  The fiducial is a hole or a mark formed at a lower portion of the seat block. When the seat block and the suction head move by a predetermined distance and are positioned at an upper portion of the apple-vision, the apple-locking is performed. The vision detects the center position of the fiducial and the center position of the suction head, respectively, and obtains these offset values.Then, the position value of the punching unit separated from the seat block by the design dimension is the distance reflecting the offset value. The center position of the suction head and the center position of the punching unit may be matched by moving the sheet block in the Y-axis direction.

  When the suction head performs thermocompression bonding on the same row of the substrate provided in a plurality of rows and columns, the suction head moves only in the X-axis direction and intersects with the X-axis direction of the suction head. The chip carrier is moved in the Y-axis direction at a point where the film unit is moved to a lower portion of the suction head to pierce a film sucked by the suction head while the suction head is fixed. After perforating the film adsorbed on the head, the film may be moved between sheet blocks on which semiconductor chips are stacked.

  In the thermocompression bonding apparatus according to an embodiment of the present invention, the bonding means formed by melting the bumps by the pressure of the bonding picker pressing the chip with a film interposed between the bonding picker and the chip is formed on the side of the chip. Up or along with the gas generated during the thermocompression bonding method.

  In addition, by forming a suction hole in the film, the chip can be suctioned across the film.

  Further, the suction block for sucking the chips supports the upper surface of the film, so that it is possible to prevent the film from being stretched in the process of piercing.

  Also, since the holding block of the punching unit supports the perforated hole around the lower surface of the film, it is possible to prevent burrs generated during the perforation process from being turned over. Therefore, when the suction head sucks the chips, the chips can be arranged horizontally.

  In addition, when the suction head is misaligned, the punching pin is moved downward so that the suction head or the punching pin can be prevented from being damaged.

  In addition, the bonding area and the chip supply area can be configured in a two-layer structure to improve the space efficiency.

  Also, by providing two suction heads in the process of processing one wafer, the production amount can be doubled as compared with the case where only one suction head is used. By further strengthening the material, it is possible to attenuate shaking and vibration during driving.

  Although a head robot is provided by applying a gantry structure to transfer the suction head, while the suction head moves in the X-axis direction and sequentially bonds the semiconductor chips to one row in the X-axis direction, the carrier robot is used. The chip carrier can be moved in the Y-axis direction. That is, since the suction head can work on the same row without moving in the Y-axis direction when handling the semiconductor chip, the vibration of the suction head can be minimized.

It is a top view of the thermocompression bonding device concerning one example of the present invention. It is a side view of the thermocompression bonding device concerning one example of the present invention. FIG. 3 is a plan view of a chip carrier according to one embodiment of the present invention. FIG. 4 is a plan view of a chip carrier according to another embodiment of FIG. 3. 1 is a side view illustrating a bonding picker according to an embodiment of the present invention. FIG. 4 is an enlarged side sectional view showing a state before a suction head punches a film on a punching unit. FIG. 7 is an enlarged view of a region A in FIG. 6. FIG. 4 is an enlarged view of a region A showing a state after a suction head pierces a film on a punching unit. FIG. 4 is an enlarged view showing a shape of a burr when a punching pin is lowered. FIG. 11 is a side sectional view showing a state after a suction head pierces a film on a punching unit according to another embodiment of the present invention. It is a B area enlarged view of FIG. FIG. 5 is an enlarged view of a region B showing a state in which the suction head is misaligned. 1 is a view illustrating a film separating device according to an embodiment of the present invention. 6 is a view illustrating a film separating apparatus according to another embodiment of the present invention. FIG. 2 is an exploded perspective view showing a hoop unit according to one embodiment of the present invention. FIG. 4 is an enlarged view showing a state where a hoop unit inspects a slit vision. 4 is a diagram illustrating a state where a second chip carrier is waiting to receive a transmission of a semiconductor chip from a unit picker while a first bonding picker works on a first chip carrier. The second chip carrier receives the transmission of the semiconductor chip from the unit picker, moves to the work area of the second bonding picker, and the first chip carrier is waiting to receive the transmission of a new semiconductor chip from the unit picker. It is a drawing. 5 is a view showing a state in which a suction head is positioned above a punching unit for punching a film. 5 is a view showing a state in which the suction head is positioned above a sheet block after punching a film. 5 is a diagram illustrating a state where an apple-cking vision detects a center position of a suction head. FIG. 4 is a diagram showing a state in which Applecking Vision detects a fiducial hole formed in a seat block. 9 is a diagram illustrating a state in which the center positions of the punching unit and the film head are corrected by reflecting the offset value of the punching unit. 5 is a diagram illustrating a state in which an apple-cking vision inspects a semiconductor chip adsorbed on a unit picker. 3 is a drawing showing a state in which foreign matter has adhered to a ball surface of a semiconductor chip and cracks have been formed.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below are provided to sufficiently convey the ideas of the present invention to those who have ordinary knowledge in the technical field to which the present invention belongs. The invention is not limited to the embodiments presented, but can be embodied in other forms. In the drawings, parts that are not related to the description may be omitted for clarity of the present invention, and the size of components may be exaggerated for clarity.

  In the thermo-compression bonding process, each chip is sucked by a wafer cut into a plurality of semiconductor chips using a sawing machine, and the chips are mounted on a bonding position (or a mounting area) of a substrate where each chip is located. Is a step of mounting each. In the thermo-compression bonding apparatus 100 according to an embodiment of the present invention, the bumps are thermo-compressed to the connection terminals of the substrate by heat applied from at least one of the suction head 141 and the heating table 154, and the chip is mounted on the substrate.

  1 and 2, a thermocompression bonding apparatus 100 according to an embodiment of the present invention will be described. FIG. 1 is a plan view of a thermocompression bonding apparatus 100 according to one embodiment of the present invention, and FIG. 2 is a side view of the thermocompression bonding apparatus 100 according to one embodiment of the present invention.

  In the thermocompression bonding process, a chip cut from a wafer is attracted by a flip-over picker 120, and the flip-over picker 120 is turned upside down by 180 degrees so that the upper and lower surfaces of the chip are turned upside down. Transmitting the chip adsorbed to the flip-over picker 120 to the unit picker 130, inspecting the lower surface of the chip picked up by the unit picker 130, and lowering the chip onto the sheet block 162. Moving the bonding picker 140 to the punching unit 170 to punch and punch the film 148; moving the bonding picker 140 to the sheet block 162 to attract chips; Moving the chip 140 to the bonding position, checking the alignment between the chip adsorbed by the bonding picker 140 and the connection terminal of the substrate, and pressing the bonding picker 140 to thermocompression-bond the chip to the connection terminal. And bonding.

  To this end, a thermocompression bonding apparatus 100 according to an embodiment of the present invention includes a wafer supply unit 110 that supplies a wafer cut into individual units of chips, and a flip-over picker that picks up chips from the wafer supply unit 110. 120, a unit picker 130 for picking up chips from the flip-over picker 120, a sheet block 162 on which the unit picker 130 lowers chips, and a punching unit 170 for punching a film 148 provided below the suction head 141. An apple vision 155 for inspecting the lower surface of the chip picked up by the unit picker 130 (the bump surface to which the bump is attached), and bonding the chip picked up by the suction head 141 to the substrate. A slit vision 151 for checking the alignment of the position can include heating table 154 for supporting a substrate.

  In addition, the thermocompression bonding apparatus 100 according to an embodiment of the present invention may include a two-layer structure provided with a lower layer and an upper layer. The lower layer may be provided with a wafer supply unit 110 and a flip-over picker 120, and the upper table 150 may be provided with a unit picker 130, an apple vision 155, a suction head 141, a slit vision 151, a heating table 154, and the like. Can be

  Further, a part of the upper layer table 150 is opened so that chips can be transferred from the flip-over picker 120 installed in the lower layer to the unit picker 130 installed in the upper layer.

  The wafer supply unit 110 includes a wafer table 111 on which a wafer is mounted. The wafer table 111 moves in the X-axis direction along a first direction rail 112 and moves in the Y-axis direction along a second direction rail 113. Can be. The wafer table 111 is moved in the X-axis and Y-axis directions so that the chip to be picked up is located at a place where the flip-over picker 120 can pick up the chip.

  The flip-over picker 120 can pick up a chip from a wafer and transfer it to the unit picker 130. The flip-over picker 120 includes a flip overhead 121 that rotates 180 degrees in the vertical direction and flips the chip upside down. The flip overhead 121 can move in the Z-axis direction along the third direction rail 122.

  At this time, when the wafer is supplied by the wafer supply unit 110 such that the bump formed on the thermocompression bonding surface faces upward, the chip is picked up by the flip-over picker 120, and then the chip is turned upside down by rotation so that the bump is inverted. The bonding surface on which is formed faces downward, and the suction surface sucked by the suction head 141 faces upward.

  The suction process of the flip-over picker 120 will be described in detail. Individual chips can be separated from the wafer by hitting the eject 114 located below the wafer, and the flip-over picker 120 can pick up the chips by a method such as suction. Further, the eject 114 and the flip-over picker 120 are synchronously controlled in the Z direction, so that the chips can be separated from the wafer. That is, as the eject 114 is raised, the flip-over picker 120 is also raised to perform the chip separation operation. Meanwhile, the method of picking up the flip-over picker 120 may include not only suction but also adhesion, and may be performed by a gripping method.

  The unit picker 130 receives the chip from the flip-over picker 120, and the apple vision 155 can inspect the bonding surface of the chip picked up by the unit picker 130.

  The unit picker 130 can move in the X-axis direction along the first direction rail 131, and can move in the Z-axis direction along the third direction rail 132. Meanwhile, the pickup method of the unit picker 130 may include not only suction but also adhesion, and may be performed by a gripping method.

  The AppleViking 155 can inspect the alignment of bumps formed on the lower surface of the chip, the adhesion of bumps, or the contamination of bumps. Such an inspection may be enabled by imaging with a camera, and may be positioned below the transfer path of the unit picker 130 so as to be imageable in an up-looking direction.

  Next, the chip carrier 160 will be described with reference to FIG. FIG. 3 is a plan view of a chip carrier 160 according to one embodiment of the present invention.

  Referring to FIG. 3, the chip carrier 160 may include a sheet block 162 on which a chip that has been inspected by the Apple vision 155 is mounted, and a punching unit 170 for punching a film 148 provided to the bonding picker 140. The chip carrier 160 can be moved in the Y-axis direction by the carrier robot 161 and can be provided to be movable in the X-axis direction by a cylinder.

  In addition, the chip carrier 160 can be detachably provided. Therefore, when the sheet block 162 is contaminated or the punching unit 170 fails, the interruption of the process can be minimized by replacing the chip carrier 160.

  Chip bumps can be mounted on the seat block 162 so that the bumps face downward. Then, a suction hole 163 for sucking the chip may be formed in the sheet block 162.

  The punching unit 170 can punch the film 148 and transmit the vacuum pressure of the bonding picker 140 to the chip. The punching unit 170 will be described later in detail.

  FIG. 4 is a plan view of a chip carrier 160-1 according to another embodiment of FIG.

  Referring to FIG. 4, the chip carrier 160-1 may be arranged such that the sheet block 162 and the punching unit 170 are aligned in the Y-axis direction or a direction perpendicular to the direction in which the bonding picker 140 moves. In the embodiment shown in FIG. 3, since the sheet block 162 and the punching unit 170 are not arranged on the same axis, after the suction head 141 punches the film 148, the chip carrier 160 or the bonding picker 140 The chip mounted on the seat block 162 is moved in the axial direction to be picked up, but at this time, there is a problem that the moving in the X-axis direction may cause vibration to be applied to the entire equipment.

  Therefore, by arranging the sheet block 162 and the punching unit 170 on the same Y-axis on the chip carrier 160-1 as shown in FIG. 4, the bonding picker 140 moves between the chip carrier 160-1 and the punching unit 170. In this case, it may be sufficient to move in the Y-axis direction without moving in the X-axis direction. With such a configuration, the X-axis moving of the bonding picker moved by the gantry can be minimized and the vibration in the equipment can be reduced. Therefore, it is more preferable to use the chip carrier 160-1 of FIG.

  Referring again to FIGS. 1 and 2, the chip carriers 160 may be provided as a pair on the upper table 150. Accordingly, since one unit picker 130 can sequentially drop chips on the two chip carriers 160, the process time can be reduced. Also, a pair of the bonding picker 140 and the slit vision 151 may be provided on the upper layer table 150 in a number corresponding to the number of the chip carriers 160. Therefore, while the unit picker 130 transfers the chip from the flip-over picker 120, the two bonding pickers 140 perform the process of continuously bonding the chip to the substrate, so that the process can be continuously performed without interruption. it can.

  The process performed by the operation of the unit picker 130 will be described in detail. The unit picker 130 picks up, from the flip-over picker 120, a chip rotated such that the bumps face downward while moving in the Z-axis direction. Then, the unit picker 130 moves in the X-axis direction and moves to the imaging area of the apple vision 155.

  When it is determined that the imaging result of the apple vision 155 is good, the chip is put down on the sheet block 162 of the chip carrier 160. At this time, the carrier robot 161 moves in the Y-axis direction so that the sheet block 162 of the chip carrier 160 is located below the unit picker 130.

  Alternatively, the chip picker 160 does not move, and the unit picker 130 moves in the Y-axis direction to load chips on the sheet block 162 of the chip carrier 160. In this case, the unit picker 130 can be guided in the Y-axis direction by a second direction rail (not shown).

  FIG. 5 is a side view showing the bonding picker 140.

  Referring to FIG. 5, the bonding picker 140 may include a suction head 141 that suctions an upper surface of a chip placed on a sheet block 162.

  The suction head 141 can be provided so as to move to an arbitrary position in the space of the XYZ coordinate system. For example, the head body 144 connected to the suction head 141 may move in the Z-axis direction along the third direction rail 147 installed on the head robot 145. The head body 144 can move in the X-axis direction along the first direction rail installed on the head robot 145. The head robot 145 can move in the Y-axis direction along the second direction rail 146 installed on the upper table 150.

  The suction head 141 can be provided so as to move up and down in the Z-axis direction. To this end, it may include a motor 142 for transmitting power and a power transmission member 143 for transmitting the rotational force of the motor 142 in a linear reciprocating motion. For example, the power transmission member 143 may include a worm and a worm gear or a rack and a pinion gear.

  Further, the suction head 141 may be provided so as to rotate around the Z axis relative to the head main body 144. Therefore, even when the chip is sucked in a distorted state, the position of the bump of the chip and the position of the connection terminal of the substrate can be matched by rotating the suction head 141.

  Also, the bonding picker 140 may be provided to apply heat and pressure to the chip. The heat generated from the heat generating portion provided on the bonding picker 140 is transmitted to the bumps of the chip. Then, the suction head 141 descends to apply pressure to the chip. Specifically, when the chip is moved to a mounting position on the substrate and heat and pressure are applied to the chip, the bumps are deformed and the chip and the substrate can be bonded. Such a process is called thermocompression bonding.

  The slit vision 151 is located between the suction head 141 and the substrate, and can determine whether the bumps of the chip picked up by the suction head 141 and the connection terminals of the substrate are in good alignment. If an error occurs in the alignment information of the slit vision 151, the suction head 141 can be moved or rotated to eliminate the error.

  Further, the slit vision 151 can be provided so as to move to an arbitrary position on the XY plane. For example, the slit vision 151 may move in the X-axis direction along a first direction rail 152 installed on the upper table 150 and move in the Y-axis direction along a second direction rail 153.

  The process performed by the operation of the bonding picker 140 will be described in detail. The bonding picker 140 moves to a position where the punching unit 170 is located, punches the film 148, moves to the sheet block 162, and the suction head 141 sandwiches the film 148. After sucking the suction surface of the chip, it moves to the mounting position. Then, the slit vision 151 is positioned between the substrate and the suction head 141 to inspect the alignment of the chips. If the chip is out of the XY plane, the suction head 141 is moved to eliminate the error. If the chip placement direction is out of the Z-axis, the suction head 141 is rotated to remove the error. To eliminate.

  When the alignment of the chips is completed, the slit vision 151 moves to a position where it is not interfered by the lowering of the suction head 141, and the suction head 141 moves down in the Z-axis direction to mount the chip on the substrate. At this time, a thermocompression bonding method can be used to bond the chips. That is, the bumps are melted by applying heat and simultaneously applying pressure to the chip, and the chip is bonded to the substrate. Even after the bonding is completed, a PBI (Post Bonding Inspection) test that can test the semiconductor chip that has been bonded to the substrate using the slit vision 151 can be performed. Since the slit vision 151 is completely unaffected by the bonding picker 140, the gantry structure, and the structure of the chip carrier 160, even if the PBI is 100% inspected while the suction head 141 performs the punching operation, it does not affect the UPH at all. I do not receive.

  Meanwhile, the heating table 154 can support the substrate. The heating table 154 can apply heat to the substrate. The substrate can maintain a certain temperature range by heat generated from the heating table 154.

  Symbols not described are a first correction mark 156, a second correction mark (not shown), a temperature sensor 158, and a load cell 159.

  In the thermocompression bonding apparatus 100, an error may occur in the alignment of the positions of the suction head 141 and the slit vision 151 as the bonding process is repeated. In particular, the high heat generated during the thermocompression bonding and the pressure applied to the suction head 141 can accelerate the occurrence of such errors. Therefore, it is important to initialize the suction head 141 and the slit vision 151 to a preset position in order to accurately bond the chip to the mounting position of the substrate.

  In order to correct an error between the suction head 141 and the slit vision 151 generated during the bonding process and align the suction head 141 and the slit vision 151 in the initial state, the suction head 141 performs initialization based on information of the first correction mark 156, and the slit vision 151 The initialization can proceed based on the information of the second correction mark (not shown). Further, it can be used to set the suction head 141 and the slit vision 151 when performing conversion or replacement using the first correction mark 156 and the second correction mark (not shown).

  Then, the temperature sensor 158 can measure the temperature transmitted to the suction head 141. This is because if the temperature of the suction head 141 is higher or lower than the reference temperature, the accuracy or quality of bonding may be reduced.

  The load cell 159 can measure the pressure applied by the suction head 141. This is because if the pressure at which the suction head 141 applies a chip is higher or lower than the reference, the accuracy or quality of bonding may be reduced.

  On the other hand, in the process of bonding the chip to the substrate by the thermocompression bonding method, the bonding means formed by melting the bumps by the pressure of the bonding picker 140 pressing the chip rises along the side of the chip and the like. There is a possibility that a problem may occur that the bonding picker 140 is contaminated by a gas that is attached to the lower surface of the 140 or generated during heating of the bonding unit.

  To this end, the thermo-compression bonding apparatus 100 according to one embodiment of the present invention may have a film 148 interposed between the suction head 141 and the chip. At this time, in order for the vacuum pressure of the suction head 141 to be applied to the chip, the film 148 must be perforated to form a hole. Accordingly, the thermocompression bonding apparatus 100 according to an embodiment of the present invention may further include a punching unit 170 for perforating the film 148.

  The film 148 is provided in a state provided by being wound around an unwind roller 194, and is guided through a pair of guide rollers 193 provided on both sides of the suction head 141, and is taken up by a take-up reel 195 opposite to the unwind roller 194. It can be stored wound around.

  At least one of the unwind roller 194, the take-up reel 195, the guide roller 193, and the film reel 149 may be a driving roller operated by the film driving roller 196 to transfer the film 148.

  Next, a punching unit 170 according to an embodiment of the present invention will be described with reference to FIGS.

  FIG. 6 is a side sectional view showing a state before the suction head 141 pierces the film 148 on the punching unit 170 according to one embodiment of the present invention, and FIG. 7 is an enlarged view of the area A in FIG. It is. FIG. 8 is an enlarged view of the area A showing the state after the suction head 141 pierces the film 148 on the punching unit 170.

  A suction block 174 for sucking chips may be provided on the bottom surface of the suction hole 174a. The suction block 174 may have a suction hole 174a for applying a vacuum pressure to the chip. The suction block 174 is provided so as to be detachable from the suction head 141, and is easily replaced.

  The film 148 may be provided to surround the bottom surface of the suction block 174. A pair of film reels 149 are provided on both sides of the film 148, and the film 148 can be moved in one direction. Therefore, when the film 148 is damaged during the bonding process, the damaged film 148 can be moved sideways so that a new film 148 surrounds the bottom surface of the suction block 174.

  The punching unit 170 according to an embodiment of the present invention may include a punching pin 171 installed on the chip carrier 160 to pierce the film 148, and a holding block 172 supporting the bottom surface of the film 148 while the film 148 is pierced. it can. On the other hand, the drawing shows that the base on which the punching pins 171 are installed is formed integrally with the chip carrier 160. However, the base may be provided separately from the chip carrier 160.

  A plurality of punching pins 171 can be provided. Then, the punching pin 171 may be installed at a position corresponding to the position of the suction hole 174a of the suction block 174. Further, the tip of the punching pin 171 may be provided in a shape that is accommodated in the suction hole 174a during the punching process but does not interfere with the suction hole 174a. For example, the tip of the punching pin 171 may have a conical shape in which the diameter decreases as going upward.

  Also, the punch pin 171 can be separably coupled to the chip carrier 160. As an example, although the punching pin 171 is inserted upward from below the chip carrier 160, the punching pin 171 may be provided such that the flange portion 171 a projecting below the punching pin 171 is locked to the bottom surface of the chip carrier 160. In addition, the fixing member 175 is coupled to the bottom surface of the chip carrier 160 to fix the punching pin 171. The fixing member 175 is provided so as to be detachable from the chip carrier 160, and can be connected by, for example, a fixing bolt 175a.

  The holding block 172 may support the bottom surface of the film 148. In particular, it may be provided to support a pressurized area pressurized by the suction block 174. Further, a pin receiving hole 172a through which the punching pin 171 penetrates may be formed in the holding block 172. That is, the punching pin 171 perforates the film 148 through the pin receiving hole 172a inside the holding block 172.

  The holding block 172 may be provided to move up and down. In the initial position, the upper surface of the holding block 172 may be provided at a position higher than or the same as the tip of the punching pin 171. When the holding block 172 is lowered by the pressing of the bonding picker 140, the punching pins 171 are relatively raised, and the film 148 can be perforated.

  Further, the holding block 172 may be supported by the first elastic member 176. The first elastic member 176 may be provided between the holding block 172 and the chip carrier 160. The first elastic member 176 exerts a force to push the holding block 172 upward when no external force is applied to the holding block 172. When the bonding picker 140 presses the holding block 172, the shape of the first elastic member 176 is deformed to allow the holding block 172 to move downward. For example, the first elastic member 176 may be a coil spring, and a lower end of the first elastic member 176 may be accommodated in the first elastic member accommodating groove 176 a recessed on the upper surface of the chip carrier 160.

  In addition, a guide member 173 for guiding the holding block 172 to move up and down may be installed on the chip carrier 160. In addition, the guide member 173 may form a locking step 173a provided to cover an upper portion of the flange portion 172b protruding from the outer diameter of the holding member. Therefore, the holding block 172 does not separate the guide member 173.

  In addition, the guide member 173 can be detachably coupled to the chip carrier 160. As an example, the guide member 173 may be connected by a fixing bolt 173b penetrating the chip carrier 160.

  The pin receiving hole 172a may be provided so as not to interfere with the punching pin 171 that rises during the drilling process. As an example, the pin receiving hole 172a has a shape corresponding to the shape of the end of the punching pin 171 and may be provided such that the inner diameter of the pin receiving hole 172a is larger than the outer diameter of the punching pin 171.

  On the other hand, as the punching pin 171 pierces the film 148, burrs are formed upward around the perforation holes of the film 148. If there is no holding block 172 that supports the lower surface of the film 148, or if the size of the pin receiving hole 172a is much larger than the outer diameter of the punching pin 171, the burr is punched out while the punching pin 171 descends. It can come down along the pin 171 and face down. When the burrs of the film 148 face downward as described above, the chips may not be closely attached to the film 148 and may not be arranged horizontally even when a vacuum pressure is applied to the suction head 141. This can cause an error in the process of bonding the chip to the substrate.

  However, referring to FIG. 9, in the punching unit 170 according to the embodiment of the present invention, it can be seen that the burr of the film 148 protrudes above the perforation hole of the film 148. FIG. 9 is an enlarged view showing the shape of the burr when the punching pin 171 is lowered.

  The inner diameter of the pin receiving hole 172a formed on the upper surface of the holding block 172 is set to be smaller than the outer diameter of the punching pin 171 located on the same plane as the upper surface of the holding block 172 when the punching pin 171 rises highest. obtain.

  Further, the inner diameter of the pin receiving hole 172a formed on the upper surface of the holding block 172 may be the same as or smaller than the inner diameter of the suction hole 174a formed on the lower surface of the suction block 174. The maximum size of the area where burrs are formed cannot exceed the inner diameter of the suction hole 174a. Therefore, when the inner diameter of the pin receiving hole 172a is smaller than or the same as that of the pin receiving hole 172, it is possible to prevent the burr of the film 148 from entering the pin receiving hole 172a along the punching pin 171 when the punching pin 171 is lowered. it can.

  Next, a punching unit 170-1 according to another embodiment of the present invention will be described with reference to FIGS.

  FIG. 10 is a side sectional view showing a state after the suction head 141 pierces the film 148 on the punching unit 170-1 according to another embodiment of the present invention, and FIG. 11 is an enlarged view of a region B in FIG. It is.

  The punching unit 170-1 according to another embodiment of the present invention may be provided such that the punching pin 171 moves up and down. At this time, the punching pin 171 is provided so as to go down only at a certain pressure or higher, and the punching pin 171 cannot go down while the punching pin 171 pierces the film 148.

  Further, the punching pin 171 can be supported by the second elastic member 177. The second elastic member 177 may be provided between the punching pin 171 and the fixing member 175. The second elastic member 177 exerts a force for pushing up the punching pin 171 when a pressure equal to or greater than a predetermined level is not applied to the punching pin 171. When a pressure equal to or larger than a predetermined value is applied, the shape of the second elastic member 177 is deformed, and the punching pin 171 is allowed to move downward. As an example, the second elastic member 177 may be a coil spring, an upper end of the second elastic member 177 is supported by a flange portion 171 a provided below the punching pin 171, and a lower end of the second elastic member 177 is fixed to the fixing member 175. Can be supported.

  FIG. 12 is an enlarged view of a region B showing a state where the suction head 141 is misaligned.

  Referring to FIG. 12, the punching pin 171 is provided so as to go down when the suction head 141 is misaligned, thereby preventing the suction head 141 or the punching pin 171 from being damaged.

  For this reason, the elastic coefficient of the second elastic member 177 may be selected such that the elastic deformation does not occur when the film 148 presses the punching pin 171 during the perforation process, but the elastic deformation starts at a pressure higher than the pressure.

  That is, since the second elastic member 177 is not deformed in the range of the magnitude of the pressure applied to the punching pin 171 by the film 148 while the holding block 172 is lowered by the pressure of the suction head 141, the punching pin 171 is lowered. Instead, the film 148 can be perforated. However, when a pressure greater than this is applied, for example, when the misaligned suction head 141 presses the punching pin 171, the second elastic member 177 is deformed and the punching pin 171 moves downward.

  FIG. 4 illustrates that a punching unit 170 for punching a hole in the film 148 sucked by the suction head 141 can be arranged on one side of the sheet block 162 of the chip carrier 160. The chip carrier 160 is provided so as to be movable in the Y-axis direction by a carrier robot 161.

  FIG. 12 has described that the suction head 141 pierces the film 148 in a state where the positions of the pin receiving holes 172a formed in the punching unit 170 and the positions of the suction holes 174a are aligned in order to avoid misalignment. If the film 148 is pierced using the punching pin 171 in a state where the suction head 141 is displaced from the pin accommodating hole 172a of the punching unit 170, as shown in FIG. This is because the block 174 may be damaged.

  Therefore, in order for the punching unit 170 to pierce the accurate position of the film 148 sucked by the suction head 141, a calibration operation for matching the relative positions of the suction head 141 and the punching unit 170 is necessary.

  In the embodiment of the present invention, a vision camera for detecting the position of the suction head 141 and a vision camera for detecting the position of the punching unit 170 are not provided for calibration of the suction head 141 and the punching unit 170. The operation of correcting and matching the relative positions of the suction head 141 and the punching unit 170 by using the two apple visions 155 can be performed. However, in order to use one vision, a correction unit serving as a reference for detecting the position of the punching unit 170 is provided on the lower surface of the chip carrier 160. For example, the correction unit may include, as a fiducial, a hole or a correction mark formed at a lower portion of the seat block.

  For reference, the relative position correction and the matching operation are performed when the seat block and the suction head are moved by a predetermined distance and positioned above the apple-cking vision, and the apple-cking vision is moved to the center position of the fiducial. And the center position of the suction head are respectively detected to determine these offset values, and then the sheet block is moved in the Y-axis direction by a distance reflecting the offset value to the position value of the punching unit separated by a design dimension from the sheet block. To make the center position of the suction head coincide with the center position of the punching unit.

  Although not specifically shown as still another embodiment of the present invention, the punching unit 170 of the chip carrier 160 and the position of the sheet block 162 may be replaced with each other. That is, a punching unit may be provided on the inner side near the Applecking Vision, centering on the Applecking Vision, and a seat block may be provided on the side farther from the Applecking Vision. Even in such a case, the semiconductor chips stacked on the sheet block can be picked up after the semiconductor chips are stacked on the sheet block in the same order and the suction head performs the film punching. That is, when the chip carrier is moved in the Y-axis direction to the unit picker side, the unit picker lowers the semiconductor chip on the sheet block, and then the chip carrier is moved in the Y-axis direction and the punching unit is positioned below the suction head. After piercing the film, the chip carrier is transported again at a predetermined interval in the Y-axis direction, transported to a lower portion of the suction head to suck the semiconductor chips loaded on the sheet block, and then thermocompression bonding can be performed.

  However, the suction head of the present invention moves only in the X-axis direction while performing the bonding operation on the same row, and the chip carrier is responsible for the movement in the Y-axis direction. Movement can be reduced and has little effect on vibrations in the equipment.

  FIG. 13 is a view illustrating a film separating apparatus 190 according to an embodiment of the present invention.

  After the semiconductor chip is bonded by thermocompression bonding to the substrate through a series of steps in which the punching unit 170 punches the film 148, the same operation that has been performed for the operation of the next semiconductor chip is repeated. For this purpose, the punched film 148 has to be wound up and collected on a film reel 149, and a new film 148 has to wait under the suction head 141.

  However, there is a possibility that the film 148 is melted by the heat at the time of thermocompression and attached to the suction head 141. In order to solve such a problem, the bonding picker 140 according to the embodiment of the present invention can separate the film 148 attached to the suction head 141 by extruding the film 148 using the film separating device 190.

  The film separating device 190 may include a film separating roller 191 that extrudes the film 148, and a roller transfer device 192 that is connected to the film separating roller 191 and is provided to be vertically movable.

  Since the film separating roller 191 is provided in the form of a rotatable roller, damage to the film 148 during extrusion of the film 148 can be minimized. In addition, a roller transfer device 192 connected to the film separation roller 191 can move the film separation roller 191 in the up-down direction, and can be, for example, a cylinder.

  The film separating device 190 may be located on one side of the suction head 141 and may be provided between any one of the film reels 149 located on both sides of the suction head 141 and the suction head 141.

  FIG. 14 is a view showing a film separating apparatus 190-1 according to another embodiment of the present invention.

  Referring to FIG. 14, the film separating devices 190-1 may be located on both sides of the suction head 141, and may be provided between the film reels 149 and the suction heads 141 located on both sides of the suction head 141.

  In this case, the pair of film separation devices 190-1 may be simultaneously drivable or relatively drivable. For example, if the film 148 is not well separated from the suction head 141 only by the operation of one of the film separating devices 190-1, the other film separating device 190-1 may be provided to operate.

  Next, a hoop unit 180 according to an embodiment of the present invention will be described with reference to FIGS.

  FIG. 15 is an exploded perspective view showing a hoop unit 180 according to an embodiment of the present invention, and FIG. 16 is an enlarged view showing how the hoop unit 180 inspects the slit vision 151.

  In the above, it is preferable that a slit vision 151 is provided between the suction head 141 and the substrate to determine whether the bumps of the semiconductor chip picked up by the suction head 141 and the connection terminals of the substrate are in good alignment. explained.

  The embodiment of the present invention may include a hoop unit 180 as a calibration unit for calibrating a deviation between a chip vision provided above the slit vision 151 and a substrate vision provided below.

  The hoop unit 180 may be installed on the upper table 150. The hoop unit 180 may include a glass holder 182 for correcting a shift of the slit vision 151 and a glass support 181 installed on the upper table 150 and supporting the glass holder 182.

  For example, the glass holder 182 may be installed on the glass support 181 using a plurality of bolts. In addition, the coupling hole 182b of the glass holder 182 through which the bolt passes may be provided in the form of a long hole extending in the vertical direction. Therefore, although the glass holder 182 is installed on the glass support 181, it can be installed so that the fine position can be adjusted vertically.

字状に設けられ、上部ホルダーと下部ホルダーの間の空間にスリットビジョン１５１が位置することができる。 The glass holder 182

The slit vision 151 may be located in a space between the upper holder and the lower holder.

  The glass holder 182 includes an upper glass 183 provided with a fiducial mark that can be imaged by a chip vision provided above the slit vision 151 and a glass that can be imaged by a substrate vision provided below the slit vision 151. A lower glass 184 provided with a dual mark may be included. The upper glass 183 may be used as a chip calibration jig having fiducial marks formed thereon, and the lower glass 184 may be used as a substrate calibration jig having fiducial marks formed thereon.

  In addition, the center of the upper glass 183 and the center of the lower glass 184 may be coaxially arranged so as to coincide with each other. The inclination of the slit vision 151 can be confirmed by detecting the fiducial marks on the upper glass 183 and the lower glass 184 by the slit vision 151, which can be inspected coaxially in all directions.

  The upper glass 183 may be installed on the upper holder of the glass holder 182 while being fixed to the upper glass holder 185. The lower glass 184 may be installed on the lower holder of the glass holder 182 while being fixed to the lower glass holder 186.

  In addition, the upper glass holder 185 may be installed on the upper holder along a guide rail 182a provided on the upper holder of the glass holder 182 so as to be able to adjust a fine position vertically. Similarly, the lower glass holder 186 can be installed on the lower holder along a guide rail 182a provided on the lower holder of the glass holder 182 so that the fine position can be adjusted in the vertical direction.

  Further, the hoop unit 180 includes an adjusting unit that can correct the positions of the upper glass 183 and the lower glass 184.

  For example, the hoop unit 180 may include a first adjustment block 187 so that the position of the glass holder 182 on the glass support 181 can be precisely adjusted. The first adjustment block 187 may be provided to be able to adjust the vertical fine position of the glass holder 182 while being fixed to the glass support 181.

  In addition, the hoop unit 180 may include a second adjustment block 188 so that the position where the upper glass holder 185 is installed in the upper holder of the glass holder 182 can be precisely adjusted. The second adjustment block 188 may be provided to be able to adjust the vertical fine position of the upper glass holder 185 while being fixed to the upper holder of the glass holder 182.

字状のグラスホルダー１８２の内部空間で動くように設けられ、スリットビジョン１５１の上部に設けられるチップビジョンはフィデューシャルマークが形成された上部グラス１８３を検査し、スリットビジョン１５１の下部に設けられる基板ビジョンはフィデューシャルマークが形成された下部グラス１８４を検査することによってスリットビジョン１５１のずれを検査することができる。 Referring to FIG. 16, the slit vision 151 is

The chip vision provided above the slit vision 151 is provided so as to move in the internal space of the letter-shaped glass holder 182, inspects the upper glass 183 on which the fiducial mark is formed, and is provided below the slit vision 151. The board vision can inspect the displacement of the slit vision 151 by inspecting the lower glass 184 on which the fiducial mark is formed.

  Also, the hoop unit 180 may be made of rigid steel or glass material having little thermal deformation, and the upper glass and the lower glass may be made of glass material having little thermal deformation.

  The slit vision 151 is a movable coaxial vision, and sets a position obtained through an inspection result of the upper glass 183 used as a chip calibration jig and the lower glass 184 used as a substrate calibration jig as a reference position. be able to.

  The slit vision 151 can check and compensate for an error between the chip vision and the substrate vision through the hoop unit 180 before the semiconductor chip is bonded to the substrate. In addition, the slit vision 151 may periodically inspect the fiducial marks of the upper glass 183 and the lower glass 184 in the area of the hoop unit 180 to inspect an error with respect to thermal deformation. Since the upper table 150 supporting the slit vision 151 may be deformed while receiving heat from the heater or the heating table 154, the hoop unit 180 may be used to periodically determine whether there is any deformation. Accuracy can be assured by confirming and compensating for it. Since such an error inspection of the slit vision 151 does not affect the driving of the suction head 141, it can be checked periodically and compensated at any time during the operation.

  More specifically, the slit vision inspects an alignment state of the semiconductor chip between the semiconductor chip sucked by the suction head and a substrate to which the semiconductor chip is bonded, and then moves to a hoop unit to move the slit vision. Inspect the error value between the chip vision and the board vision, and if there is a deviation, inspect the alignment state of the next semiconductor chip and the substrate to which the semiconductor chip is bonded and check the error when compensating the movement amount of the suction head. Value can be reflected. Each time one semiconductor chip is handled, the error value can be reflected each time and the precision can be ensured, and it does not overlap with or affect other components in the equipment, so slit vision can be performed at any time Does not lower the UPH in the equipment at all.

  Before the semiconductor chip sucked by the suction head 141 is bonded to the substrate placed on the heating table 154 by thermocompression bonding, the semiconductor chip is inspected by the slit vision 151, the obtained position values are compared, and the position of the suction head 141 is moved. The amount can also be corrected.

  FIG. 17 illustrates a state where the second chip carrier 160-2 is waiting to receive the transmission of the semiconductor chip from the unit picker 130 while the first bonding picker 140-1 works on the first chip carrier 160-1. FIG.

  FIG. 18 shows that the second chip carrier 160-2 receives the semiconductor chip from the unit picker 130 and moves to the work area of the second bonding picker 140-2, and the first chip carrier 160-1 receives the new semiconductor from the unit picker 130. It is a figure showing signs that it is waiting to receive transmission of a chip.

  Here, when the bonding picker receives the transmission of the semiconductor chip on the chip carrier, the bonding picker movably provided in the X-axis and Y-axis directions moves only in the X-axis direction, and the chip carrier moves in the Y-axis direction. Since it is possible to align the same row as the work area of the bonding picker, the bonding picker that can be moved by the gantry can minimize the Y-axis movement and reduce the generation of vibration.

  More specifically, while the bonding picker performs a thermocompression bonding operation on the same row as the X axis, the bonding picker moves only on the X axis without moving on the Y axis and is the same as the X axis row of the bonding picker. Then, the chip carrier is moved in the Y-axis direction in the row, so that the punched portion of the chip carrier is positioned below the suction head. Thereafter, when the film sucked by the suction head is pierced by the punching unit, the chip carrier moves in the Y-axis direction again so that the sheet block is positioned below the suction head. Therefore, the bonding picker can transmit the semiconductor chip after punching the film from the chip carrier without moving in the Y-axis direction. Then, only when the row of the substrate is changed, the bonding picker needs to be transported in the Y-axis direction only once at first, so that the Y-axis movement of the bonding picker can be minimized.

  On the other hand, in the present invention, each of the bonding picker and the chip carrier is composed of a plurality of pieces, and the bonding picker can be transported by a gantry structure that can be moved to an arbitrary position on the XY plane, and is symmetrical to each other in the X-axis direction. It is provided as follows. The chip carriers are configured to correspond to the number of bonding pickers. The first bonding picker, the second bonding picker, the first chip carrier, and the second chip carrier can be driven by the following operation.

  When the first chip carrier 160-1 transmits the semiconductor chip to the first bonding picker and the semiconductor chip is placed on the chip carrier, the suction head of the bonding picker punches a hole in the film by the first punching unit, and then the sheet block. The second chip carrier 160-2 receives a new semiconductor chip from the unit picker 130 while sucking the semiconductor chip placed on the second chip picker 130, and then transfers the semiconductor chip to the second bonding picker side. While moving the carrier 160-2 in the Y-axis direction, the completed first chip carrier 160-1 moves in the Y-axis direction and moves to receive the transmission of a new semiconductor chip from the unit picker 130. The operations are sequentially repeated with each other.

  On the other hand, when the film 148 sucked by the suction head 141 is pierced in a state where the positions of the punching unit 170 and the suction head 141 are aligned, the bonding picker 140 moves in one direction and is stacked on the sheet block 162. The semiconductor chip is picked up, moved to the heating table 154, and heat and pressure are applied to the semiconductor chip to bond the semiconductor chip to the substrate.

  In the above, in order to pierce the exact position of the film 148 sucked on the suction head 141 of the present invention by using one apple vision 155 in conjunction with FIGS. 11 and 12, the suction head 141 and the punching unit are used. Although it has been described that the calibration work for matching the relative positions of the 170 is necessary, this will be described in more detail with reference to FIGS.

  The apple-cking vision 155 is located on the Y-axis direction of the chip carrier 160. The chip carrier 160 can be moved in the Y-axis direction by the carrier robot 161 to move to a position where the apple vision 155 is located, and the apple vision 155 can check the fiducial information provided on the chip carrier 160. it can.

  It is important that a fiducial mark for detecting the position of the chip carrier 160 is formed on the lower surface of the chip carrier 160 so that the apple vision 155 can confirm the position of the chip carrier 160.

  To this end, the calibration unit including the fiducial may be provided in a form attached to the lower surface of the chip carrier 160, or may be provided in the form of a fiducial hole 164 formed in the lower surface of the seat block 162. Since the position value may be deviated during the process of attaching the calibration unit to the seat block 162, such a variable is removed by providing a fiducial hole 164 integrally formed with the seat block 162. It is more preferable to provide a fiducial hole 164 on the lower surface of the seat block 162.

  At this time, the fiducial hole 164 could be formed so as to penetrate the seat block 162 in the vertical direction.

  The apple-cking vision 155 inspects the fiducial hole 164 formed on the lower surface of the chip carrier 160, and can detect the position of the punching unit 170 based on information on the distance between the fiducial hole 164 and the punching unit 170.

  FIG. 19 is a view showing a state in which the suction head 141 is positioned on the punching unit 170 for perforating the film 148.

  The chip carrier 160 on which the punching unit 170 is provided is moved in the Y-axis direction by the carrier robot 161 to the area where the suction head 141 of the bonding picker 140 is located, and the bonding picker 140 is moved in the X-axis direction to move the chip carrier 160. Move to the area where the punching unit 170 is located.

  More specifically, a carrier robot 161 connected to and supporting the chip carrier 160 may be connected to the carrier transfer member 165, and the carrier transfer member 165 may be operated by the power of the carrier transfer motor 166.

  For example, the carrier transfer member 165 may be provided with a screw, and may be connected to the carrier transfer motor 166 by a belt or the like. In addition, the carrier robot 161 may be provided to include a nut member coupled to the carrier transfer member 165, and may be provided to linearly reciprocate according to the rotation of the carrier transfer member 165.

  That is, the driving force of the carrier transfer motor 166 is transmitted to the carrier transfer member 165 to rotate the carrier transfer member 165. When the carrier transfer member 165 rotates in one direction, the carrier robot 161 connected to the carrier transfer member 165 in one direction on the Y-axis. Moving. Conversely, when the carrier transfer member 165 rotates in the opposite direction, the carrier robot 161 can move in the opposite direction on the Y axis.

  Then, the carrier robot 161 can move along a carrier transfer rail 167 provided in the Y-axis direction.

  FIG. 20 is a view showing a state in which the suction head 141 is located above the sheet block 162 after perforating the film 148.

  The chip carrier 160 can move in the Y-axis direction and position the suction head 141 above the sheet block 162. At this time, the chip carrier 160 can move in the Y-axis direction by a distance between the sheet block 162 and the punching unit 170 stored in advance. Therefore, the suction head 141 and the sheet block 162 can be aligned without moving the bonding picker 140.

  21 to 23 are views showing a calibration method for the punching unit 170 to pierce the film 148 at the normal position of the suction head 141. The process of aligning the center positions of the suction head 141 and the punching unit 170 will be described with reference to the drawings.

  FIG. 21 is a diagram showing a state in which the apple-cking vision 155 detects the center position of the suction head 141.

  The bonding picker 140 can move in the Y-axis direction to position the suction head 141 above the apple vision 155. The apple vision 155 captures an image of the suction head 141, detects the center position of the suction head 141, and detects the position where the suction hole 174a of the suction head 141 is formed.

  FIG. 22 is a diagram showing a state in which the apple vision 155 detects a fiducial hole 164 formed in the seat block 162.

  The chip carrier 160 moves in the Y-axis direction to position the seat block 162 above the apple vision 155. At this time, the distance that the chip carrier 160 moves in the Y-axis direction may be stored in advance.

  Then, the apple vision 155 captures an image of the fiducial hole 164 formed below the seat block 162, and finds an offset distance (D1) between the center position of the suction head 141 and the center position of the fiducial hole 164. . At this time, the distance (D2) between the center position of the fiducial hole 164 formed in the chip carrier 160 and the center position of the punching unit 170 is a value previously stored as a design dimension.

  In other words, the position information of the punching unit 170 can be acquired by detecting the position of the fiducial hole 164 by the appleing vision 155.

  Further, the distance between the center position of the suction head 141 and the center position of the punching unit 170 can be determined from the above information. That is, the distance between the center position of the suction head 141 and the center position of the punching unit 170 is determined by the distance (D2) between the center position of the fiducial hole 164 and the center position of the punching unit 170. The distance reflects the offset distance (D1) between the position and the center position of the fiducial hole 164.

  Accordingly, the sheet block 162 is moved in the Y-axis direction by a distance between the center position of the suction head 141 and the center position of the punching unit 170, which is determined by reflecting the offset distance (D1), and the center position of the suction head 141 is The center positions of the units 170 can be matched.

  By setting such a position that the pin receiving hole 172a of the suction head 141 and the punching pin 171 of the punching unit 170 coincide with each other through the calibration process, the positions of the suction head 141 and the punching unit 170 can be aligned.

  FIG. 24 is a view showing a state in which the apple-cking vision 155 inspects the semiconductor chip (P) adsorbed on the unit picker 130. FIG. 25 shows a case where foreign matter (D) adheres to the ball surface of the semiconductor chip (P). , A diagram showing a state in which a crack (C) is formed.

  In the thermo-compression bonding apparatus 100 according to the embodiment of the present invention, when the flip-over picker 120 reverses the upper and lower surfaces of the semiconductor chip (P) cut in a ball-up state from the wafer, the unit picker 130 is turned upside down. The picked-up semiconductor chip (P) is picked up and moved to the position where the apple-cking vision 155 is located. After the apple-cking vision 155 inspects the ball surface (or bump surface) of the semiconductor chip (P), the sheet of the chip carrier 160 is The process of lowering the semiconductor chip (P) into the block 162 is performed.

  At this time, if the appleing vision 155 inspects the ball surface in advance and selects a defective semiconductor chip (P), the semiconductor chip (P) determined to be defective is rejected without proceeding to the bonding process. In other words, by inspecting the foreign matter of the semiconductor chip in advance with the Apple vision 155, it is possible to prevent the defective semiconductor chip from being bonded to the substrate.

  Referring to FIG. 25, the apple vision 155 can inspect whether a crack (C) is present on a ball surface of a semiconductor chip (P) or a foreign matter (D) is attached.

100: thermocompression bonding apparatus 110: wafer supply unit 111: wafer table 112: first direction rail 113: second direction rail 114: eject 120: flipover picker 121: flip overhead 122: third direction rail 130: unit picker 131 : First direction rail 132: third direction rail 140: bonding picker 141: suction head 142: motor 143: power transmission member 144: head body 145: head robot 146: second direction rail 147: third direction rail 148: film 149: film reel 150: upper layer table 151: slit vision 152: first direction rail 153: second direction rail 154: heating table 155: apple cooking vision 156: first correction mark 1 8: temperature sensor 159: load cell 160: chip carrier 161: carrier robot 162: sheet block 163: suction hole 164: fiducial hole 165: carrier transfer member 166: carrier transfer motor 167: carrier transfer rail 170: punching unit 171: Punched pin 171a: Flange portion 172: Holding block 172a: Pin receiving hole 172b: Flange portion 173: Guide member 173a: Locking step 173b: Fixing bolt 174: Suction block 174a: Suction hole 175: Fixing member 175a: Fixing bolt 176: First elastic member 176a: First elastic member receiving groove 177: Second elastic member 180: Hoop unit 181: Glass support 182: Glass holder 183: Upper glass 184: Lower glass 85: Upper glass holder 186: Lower glass holder 187: First adjust block 188: Second adjust block 190: Film separation device 191: Film separation roller 192: Roller transfer device 193: Guide roller 194: Unwind roller 195: Winding Reel 196: Film drive roller

Claims (14)

In a thermocompression bonding apparatus for thermocompression bonding of individual unit semiconductor chips to a mounting position of a substrate,
A material supply unit for supplying the cut material to the individual unit semiconductor chips;
A flip-over picker for picking up the semiconductor chip from the material supply unit and inverting the semiconductor chip;
A unit picker that receives the individual semiconductor chips from the flip-over picker and lowers them on a sheet block on which the chips are stacked;
A suction head formed with a suction hole for sucking and supporting the semiconductor chip on the sheet block, and a film provided at a lower end for sucking the semiconductor chip through the film;
Film providing means for providing a film at the lower end of the suction head;
In order to form a hole in the film at a position facing a suction hole formed in the suction head, a holding block is formed to support a lower surface of the film and form a pin receiving hole through which a punching pin penetrates. A heating unit on which a substrate for thermocompression bonding of the semiconductor chip sucked to the suction head is placed;
The sheet block and the punching unit are provided on a chip carrier in a Y-axis direction,
The chip carrier can be moved in the Y-axis direction by a carrier robot,
The same position between the suction head and the punching unit so that the punching pin of the punching unit can pierce the film at the correct position of the suction hole formed in the suction head that sucks the film. A fiducial is formed on the underside of the chip carrier ,
The fiducial is a hole or mark formed at the bottom of the seat block,
When the sheet block and the suction head move by a predetermined distance and are positioned above the apple-vision, the apple-vision detects the center position of the fiducial and the center of the suction head, respectively. Find these offset values,
The sheet block is moved in the Y-axis direction by a distance reflecting the offset value to the position value of the punching unit separated by the design dimension from the sheet block so that the center position of the suction head matches the center position of the punching unit. A thermocompression bonding apparatus. The punching unit comprises:
base;
A punch pin installed on the base to pierce the film;
A holding block for supporting a lower surface of the film and forming a pin receiving hole through which the punching pin passes; and a first elastic member interposed between the base and the holding block,
The thermocompression bonding apparatus according to claim 1, wherein the holding block is provided to be movable up and down, and when the holding block moves downward, the punching pin pierces the film. The punching unit comprises:
A fixing member fixed below the base to support the punching pin; and a second elastic member interposed between the punching pin and the fixing member,
The thermocompression bonding apparatus according to claim 2, wherein the second elastic member is provided such that when the punching pin pierces the film, the shape changes with a pressure greater than a pressure applied to the punching pin.   The material supply unit and the heating table are arranged in a multi-layered form having a partially overlapping space, and the flip-over picker can move up and down while the semiconductor chip on the material supply unit is sucked and inverted. The semiconductor chip on the sheet block is picked up by a suction head and bonded to the substrate after the unit picker loads the semiconductor chip on a sheet block. 3. The thermocompression bonding apparatus according to claim 1.   Although the punching unit guides the vertical movement of the holding block, the punching unit further includes a guide member formed with an engaging step covering an upper part of a flange protruding from an outer peripheral surface of the holding block to prevent the holding block from being detached. The thermocompression bonding apparatus according to claim 1, wherein: The punching unit further includes a fixing member fixed below the base and supporting the punching pin,
The punching pin is provided so as to penetrate the base from below and protrude to an upper portion of the base, and a flange portion protruding from an outer peripheral surface of the punching pin is supported on a lower surface of the base, The thermocompression bonding apparatus according to claim 2. An apple-cking vision for inspecting a bump, a foreign substance or a crack state located on the lower surface of the semiconductor chip picked up by the unit picker,
3. The method according to claim 2, further comprising a slit vision interposed between the mounting position of the substrate and the semiconductor chip sucked by the suction head and inspecting an alignment state of the mounting position of the substrate and the semiconductor chip. The thermocompression bonding apparatus as described in the above. It has a gantry structure so that the suction head can be moved to any position on the X-axis and Y-axis planes, and is provided on both sides symmetrically in the X-axis direction around the heating table,
The bonding apparatus according to claim 1, wherein the chip carriers are provided corresponding to the number of the suction heads. Further including a hoop unit for calibrating the deviation between the chip vision provided above the slit vision and the board vision provided below the slit vision,
The hoop unit

The upper glass having a fiducial mark is arranged on the upper surface, and the lower glass having the fiducial mark is arranged on the lower surface. The thermocompression bonding apparatus according to claim 7, characterized in that the lower glasses are coaxially arranged with their central portions aligned with each other. The slit vision is a coaxial vision movably provided,
The position obtained by inspection of the upper glass and the lower glass of the hoop unit is set as a reference position, and before the semiconductor chip sucked by the suction head is bonded to the substrate placed on the heating table by thermocompression bonding. 10. The thermocompression bonding apparatus according to claim 9, wherein a position value obtained by inspecting with the slit vision is compared to compensate for a moving amount of the suction head.   The slit vision inspects the alignment state of the semiconductor chip between the semiconductor chip sucked by the suction head and the substrate to which the semiconductor chip is bonded, and then moves to a hoop unit to move the chip vision of the slit vision and the substrate vision. And inspecting the alignment value of the next semiconductor chip and the substrate to which the semiconductor chip is bonded, if there is a deviation, and reflecting the error value when compensating the amount of movement of the suction head. The thermocompression bonding apparatus according to claim 10, wherein   The thermocompression bonding according to claim 10, wherein the slit vision is used to inspect the bonding state of the semiconductor chip that has been thermocompression bonded while punching the film adsorbed on the suction head by the punching unit. apparatus. After the thermocompression bonding, the apparatus further includes a film separating device so that the film attached to the suction head can be separated.
The thermocompression bonding apparatus according to claim 1, wherein the film separating device comprises: a film separating roller for extruding a film; and a roller transfer device connected to the film separating roller to be vertically movable. When the suction head performs thermocompression bonding on the same row of a substrate provided in a plurality of rows and columns,
The suction head moves only in the X-axis direction,
Although the chip carrier is moved in the Y-axis direction at a point intersecting with the X-axis direction of the suction head,
The punching unit moves to a lower portion of the suction head to pierce the film sucked by the suction head in a state where the suction head is fixed, and after piercing the film sucked by the suction head, the semiconductor chip is removed. 2. The thermocompression bonding apparatus according to claim 1, wherein the chip carrier is moved in the Y-axis direction such that the stacked sheet blocks are positioned below the suction head. 3.

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