JP2016048797A - Mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device adaptable to high density mounting, narrow pitch mounting, in-cavity mounting, and the like.SOLUTION: In a mounting unit for mounting an electronic component on a circuit board while holding the electronic component, a mounting nozzle for mounting the electronic component is supported by a shaft extending in a direction perpendicular to the circuit board and capable of moving in that direction and rotating around that direction. The shaft is driven by a voice coil motor, and motion of the shaft in that direction is regulated by a solenoid coil. The shaft is supported by a spline and a bearing at a position closer to a lower end of the shaft than the voice coil motor, when viewed from the solenoid coil.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an apparatus and method for mounting an electronic component on a circuit board, so-called mounting of the electronic component. More specifically, the present invention relates to a mounting apparatus and a mounting method that are suitably used when an IC chip called a flip chip having bumps (convex electrodes) is mounted on a circuit board.

  In recent years, with the miniaturization of electronic devices, it is required to mount electronic components on a circuit board at a higher density. In order to meet these demands, the positional accuracy during mounting is increased, and at the same time, the interval between components (the pitch) is being promoted. Further, as a new form, an example in which an electronic component is mounted in a cavity provided in a multilayered substrate is increasing.

  In such an electronic component mounting process, conventionally, an image processing technique has been used as a method for improving the positional accuracy when mounting an electronic component on a circuit board. Japanese Patent Application Laid-Open No. H10-33095 or Japanese Patent Application Laid-Open No. H10-228561 discloses a mounting apparatus to which a configuration for image processing is added. Specifically, the mounting position of the electronic component is determined by performing image processing on an image obtained by imaging the circuit board with a camera in advance, and the electronic component placed at the supply position is also processed through similar processing. The arrangement is determined and the relative positional deviation is obtained by comparing with each other. The electronic component placed at the supply position is taken out by the take-out nozzle, placed once on the intermediate stage, held by the mount nozzle, and then mounted by the mount nozzle after taking into account the positional deviation previously obtained. Processing has been done.

JP 2004-103923 A JP 2005-294778 A

  When a chip such as an IC is mounted on a substrate, a mounting head that holds the chip brings the chip into contact with a predetermined position on the substrate, and ultrasonic vibration is applied to the chip via the mounting head. A connection is made. Along with the progress of the narrow pitch as described above, the mounting nozzle is also required not to interfere with the space around the chip mounting position. Therefore, the shape of the chip holding portion in the mounting nozzle is preferably matched to the shape of the chip and is smaller than the chip.

  Here, when joining a chip | tip and a board | substrate using an ultrasonic wave, bias etc. arise in the method of applying a load with respect to a chip | tip, and there exists a possibility of having a bad influence with respect to a joining state. In the technique disclosed in Patent Document 1 or 2, such a positional deviation is at an acceptable level in the current chip size or mounting situation. However, in order to further increase the pinching pitch and the like in the future, it is desired to improve the accuracy of mounting the chip by the mounting nozzle and the addition of a uniform pressing load in a highly accurate mounting direction.

  In order to solve the above-described problem, a mounting apparatus according to an embodiment of the present invention takes out an electronic component placed on a component supply table by using a take-out nozzle, and takes out the electronic from the take-out nozzle that holds the electronic component. The component is inverted and transferred to a mounting nozzle attached to the mounting unit, and the electronic component held by the mounting nozzle is compared with the mounting position of the electronic component on the circuit board extending on the XY plane on the substrate stage. An electronic component mounting apparatus in which a mounting position by a mounting nozzle is corrected, and the electronic component is mounted on the circuit board on a mounting table by the mounting nozzle, wherein the mounting unit has a Z axis perpendicular to the XY plane. A shaft that can freely move in the axial direction and rotate around the Z-axis; a voice coil motor that drives the shaft in the Z-axis direction; A solenoid for regulating the Z-axis movement of the serial shaft, and having a.

  In the mounting apparatus described above, the mounting unit includes a clamp attached to the lower end on the side close to the substrate stage in the Z-axis direction, and an ultrasonic horn that applies ultrasonic vibration to the mounting nozzle. The mounting nozzle is preferably held by the shaft via the ultrasonic horn and the clamp, and the shaft is supported by a spline and a bearing mounted near the clamp rather than the solenoid. .

In order to solve the above-mentioned problem, a mounting apparatus according to a further embodiment of the present invention is configured to take out an electronic component placed on a component supply table with a take-out nozzle and hold the electronic component. The electronic component is transferred to the mounting nozzle attached to the mounting unit in reverse, and the electronic component held by the mounting nozzle is compared with the mounting position of the electronic component on the circuit board extending on the XY plane on the substrate stage. The mounting position by the mounting nozzle is corrected by the mounting nozzle, the electronic component mounting apparatus for mounting the electronic component on the circuit board on the mounting table by the mounting nozzle, the mounting unit moving in the Y-axis direction A linear scale extending along the supporting guide rail;
Y-axis driving means for moving the mounting unit in the Y-axis direction based on position information of the mounting unit detected by the linear scale.

  In order to solve the above-mentioned problem, a mounting apparatus according to a further embodiment of the present invention is configured to take out an electronic component placed on a component supply table with a take-out nozzle and hold the electronic component. The electronic component is transferred to the mounting nozzle attached to the mounting unit in reverse, and the electronic component held by the mounting nozzle is compared with the mounting position of the electronic component on the circuit board extending on the XY plane on the substrate stage. The mounting position by the mounting nozzle is corrected by the mounting nozzle and the electronic component is mounted on the circuit board on the mounting table by the mounting nozzle. The mounting unit is perpendicular to the XY plane. A shaft freely movable in the Z-axis direction and rotatable about the Z-axis, and the mounting unit in the Z-axis direction. A clamp attached to the lower end on the side close to the shaft, a spline and bearing for supporting the shaft, an ultrasonic horn for applying ultrasonic vibration to the mounting nozzle, and a first adjustment fixed to the lower end of the shaft A plate, a second adjustment plate disposed on the lower surface of the first adjustment plate, and a fixing means disposed on the lower surface of the second adjustment plate and holding the mounting nozzle via the ultrasonic horn. The spherical receiver exposed on the lower surface side of the first adjustment plate is arranged as a fulcrum in one of the three triangular holes arranged on the first adjustment plate, and the two holes are The second adjustment plate is pushed downward with respect to the first adjustment plate with a push bolt arranged, and is arranged closer to the center than the three holes in the triangular arrangement of the first adjustment plate. The front through the through hole penetrating the first adjustment plate With the three fixing bolts accumulated in the screw holes embedded in the second adjustment plate, the second adjustment plate is pulled upward with respect to the first adjustment plate, and the first adjustment plate and the first adjustment plate The relative inclination with respect to the second adjusting plate is adjusted.

  In the mounting apparatus described above, it is preferable that the spline is a sliding bearing using compressed air as a lubricant. The mounting unit further includes a board mark recognition camera for recognizing a board mark provided on the circuit board, and the board mark recognition camera determines a mounting defect between the circuit board and the electronic component. It is preferable.

  In order to solve the above-mentioned problem, a mounting apparatus according to a further embodiment of the present invention is configured to take out an electronic component placed on a component supply table with a take-out nozzle and hold the electronic component. The electronic component is reversed and transferred to a mounting nozzle attached to the mounting unit, and mounting by the mounting nozzle is performed by comparing the electronic component held by the mounting nozzle and the mounting position of the electronic component on the circuit board on the substrate stage. An electronic component mounting apparatus that corrects a position and mounts the electronic component on the circuit board on a mounting table by the mounting nozzle, and recognizes whether the electronic component is held on the substrate stage. An electronic component recognition camera for obtaining information to be attached is attached.

  In the mounting apparatus described above, it is preferable that the information obtained by the electronic component recognition camera is the presence or absence of bumps on the electronic component. Or it is preferable that the information which the said camera for electronic component recognition acquires is the adhesion presence or absence of the foreign material of the said mounting nozzle. In the mounting apparatus described above, the mounting unit includes a circuit board mark recognition camera for recognizing a mark provided on the circuit board, and the electronic component recognition camera and the circuit board mark recognition camera. Each of the position calibration members is imaged, the obtained video is image-processed, each relative positional relationship is recognized, and a position calibration operation is performed. The calibration operation is performed at every first predetermined interval, and after the predetermined operation time has elapsed after the start of operation, the position calibration operation may be performed at every second predetermined interval longer than the first predetermined interval. preferable.

  A mounting apparatus according to a further embodiment of the present invention takes out an electronic component placed on a component supply table with a take-out nozzle, and takes the electronic component from the take-out nozzle holding the electronic component into a mounting unit. The mounting position by the mounting nozzle is corrected by comparing the mounting position of the electronic component held on the mounting nozzle and the mounting position of the electronic component on the circuit board on the substrate stage. An electronic component mounting apparatus that mounts the electronic component on the circuit board on a mounting table according to the substrate stage, wherein the substrate stage includes a lower plate made of an aluminum heat block and a surface that supports the circuit substrate. And an upper plate made of stainless steel.

  A mounting apparatus according to a further embodiment of the present invention takes out an electronic component placed on a component supply table with a take-out nozzle, and takes the electronic component from the take-out nozzle holding the electronic component into a mounting unit. The mounting position by the mounting nozzle is corrected by comparing the mounting position of the electronic component held on the mounting nozzle and the mounting position of the electronic component on the circuit board on the substrate stage. The electronic component mounting apparatus for mounting the electronic component on the circuit board on the mounting table, wherein the take-in unit including the take-out nozzle is covered with a box-shaped cover, and the box-shaped cover is Has an exhaust joint and mounts dust and air in the internal space of the box-type cover via a pipe connected to the exhaust joint Characterized by discharging the location of the external.

  Alternatively, the mounting apparatus according to a further embodiment of the present invention takes out an electronic component placed on a component supply table with a take-out nozzle, and takes the electronic component from the take-out nozzle holding the electronic component into a mounting unit. The mounting position by the mounting nozzle is determined by comparing the mounting position of the electronic component on the circuit board extending in the XY plane on the substrate stage and the electronic component held on the mounting nozzle by reverse transfer. An electronic component mounting apparatus that is corrected and mounts the electronic component on the circuit board on the mounting table by the mounting nozzle, wherein the component supply table is a pressure-sensitive adhesive tape having a plurality of diced wafers attached thereto An annular wafer ring for fixing the wafer ring and a lower side with respect to the Z-axis direction perpendicular to the XY plane with respect to the wafer ring. An annular expand ring disposed inside the annular ring, and disposed below the wafer ring in the Z-axis direction and inside the annular ring, the adhesive tape can be pushed up in the Z-axis direction. A push-up needle, a table lowering means for lowering the component supply table and the wafer ring relative to the expanding ring in the Z-axis direction, and a needle drive means for driving the push-up needle in the Z direction. The table lowering means is driven by a servo motor, and the needle moving means is driven by a servo motor and a cam mechanism.

  In the mounting apparatus described above, the take-in unit including the take-out nozzle includes a supply component recognition camera that images the wafer attached to the adhesive tape, and a tension distribution on the adhesive tape. And a rotational drive motor for obtaining and correcting the amount of positional deviation in the rotational direction around the Z axis of the wafer. Furthermore, in the above-described mounting apparatus, it is more preferable that the supply component recognition camera performs defective wafer detection.

  The present invention has been made in view of the above situation, and provides a chip mounting apparatus and mounting method capable of holding a chip with high positional accuracy without causing positional displacement with respect to a mounting nozzle. It is intended to provide.

It is a figure which simplifies and shows the principal part structure in the mounting apparatus which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the mounting apparatus which concerns on one Embodiment of this invention. It is a figure which shows typically the structure of the substrate table unit 10 used in one Embodiment of this invention. It is a figure which shows typically the structure of the components supply table 20 used in one Embodiment of this invention. FIG. 5 is a diagram schematically showing a configuration for pushing up a chip wafer in the component supply table 20 shown in FIG. 4. It is a figure which shows typically the box-shaped cover 39a used in one Embodiment of this invention and added to the taking-in part unit 39. FIG. It is a figure which shows the outline of the structure in the axial cross section of the mounting unit 57 used in one Embodiment of this invention. It is a figure which shows schematic structure of the inclination adjustment mechanism 600 used in one Embodiment of this invention. It is an embodiment of the present invention, and is a diagram showing an outline of a device configuration when a flat plate shaped ultrasonic horn 69 is used. It is a figure which shows the structure of the mounting nozzle 51 at the time of using the ultrasonic horn 69 shown in FIG. It is a figure which shows the chip | tip mounting method which concerns on one Embodiment of this invention with a flowchart.

[Example]
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration of a main part of a mounting apparatus according to the present invention, and FIG. 2 shows a simplified schematic configuration of the apparatus. As shown in FIG. 2, this apparatus includes a substrate table unit 10 that supports a circuit board and the like, a component supply table 20 that supports electronic components, a component take-in unit 30 that supports a take-out nozzle, and a mounting unit 50 that supports a mounting nozzle. It consists of.

  The substrate table unit 10 includes a substrate stage 11 that actually supports the substrate by vacuum suction or the like, an X-axis drive motor 13 that drives the substrate stage 11 in the X direction indicated by an arrow in the figure, and a Y that drives the substrate stage 11 in the Y direction. It has a component recognition camera 17 for recognizing the orientation of an electronic component (chip) held by a shaft drive motor 15 and a mounting nozzle described later. The component recognition camera 17 is fixed to the substrate stage 11 and always has a certain positional relationship with the substrate stage 11. Here, it is recognized from the image obtained by the component recognition camera 17 whether or not foreign matter is attached to a mounting nozzle described later. If foreign matter is attached and it is determined that it needs to be removed, the mounted nozzle is cleaned. Furthermore, it is recognized from the image obtained by the component recognition camera 17 whether or not bumps are properly present on the surface of the chip. The operation of a chip with no bump is controlled so that it is not mounted on the substrate. In this embodiment, the component recognition camera 17 is fixed to the substrate stage 11 and moves together with the substrate stage 11. However, it is also possible to provide a driving means for independently moving the component recognition camera 17 so that the substrate stage 11 and the component recognition camera 17 move separately.

  Here, when the electronic component is actually mounted on the substrate, the substrate may be heated in order to perform suitable mounting. In this case, if the substrate heating is not appropriate and the temperature distribution in the substrate is not appropriate, there may be a case where a minute deformation of the substrate or a partial non-uniformity of the degree of bonding occurs. In the present embodiment, in consideration of such a situation, a heating mechanism is arranged on the substrate stage 11 so that the mounting process can be performed while heating the substrate evenly. A specific structure will be described with reference to FIG. 3 schematically showing a cross-sectional structure of the substrate stage 11. The substrate stage 11 includes a stainless upper plate (substrate support plate) 11a that supports the substrate in direct contact with the substrate, and an aluminum lower plate (heat block) in which the upper plate 11a is fixed on the upper surface and a heating element is incorporated therein. ) 11b is vertically combined. The lower plate 11b made of aluminum has a shape wider than that of the upper plate made of stainless steel in a plan view. The upper plate 11a improves the corrosion resistance and wear resistance of the substrate stage 11, and the lower plate 11b uses the lower plate 11b. A uniform temperature distribution is realized at the same time.

  The component supply table 20 includes a table 21 on which components are placed, a drive motor (not shown) that drives the table 21 in the XY direction, a rotation drive motor 23 that rotates the table 21 on the XY plane, and a table 21. It has a table lift drive mechanism (not shown) that moves up and down in the Z-axis direction. Here, the part mounting table 21 will be described in detail. 4 and 5 schematically show an axial cross-section of the table 21 and associated structures. An annular (ring) shape table 21 supports a wafer ring 202 to which an adhesive tape 201b to which a wafer 201a diced into a chip size of a required size is bonded after a semiconductor element or the like is formed is fixed. The wafer ring 202 fixes the adhesive tape 201b. Below the adhesive tape 201b and the wafer ring 202 (downward in the Z-axis direction), an annular expand ring 203 and a push-up needle 204 are similarly arranged inside the annular shape.

  By lowering the wafer ring 202 together with the table 21 along the arrow A (Z-axis direction) by a table elevating drive device (not shown), the expanding ring 203 relatively pushes up the adhesive tape 201b through the opening 21a of the table 21. Then, tension is generated to stretch the adhesive tape 201b in the region where the wafer 201a is adhered. In the present invention, the operation of lowering the wafer ring 202 toward the expand ring 203 is driven by a table lift driving device (not shown), that is, a servo motor that is a table lowering means. Thereby, the stretch amount of the adhesive tape 201b of the wafer ring 202 can be easily adjusted with high accuracy.

  Next, regarding the table 21, a mechanism for suitably taking out the wafer 201a from the adhesive tape 201b when the wafer ring 202 is lowered will be described in detail. The schematic structure of the mechanism and the mechanism associated therewith is shown in FIGS. 4 and 5 described above. As shown in the figure, the wafer chip 201 a adhered to the adhesive tape 201 b is pushed up from below by the push-up needle 204 through the opening of the table 21, that is, upward in the Z-axis direction. By this push-up operation, the wafer 201a can be easily taken out from the adhesive tape 201b. The push-up needle 204 has a cam follower 201a at its lower end, and the cam follower 204a is displaced in the vertical direction while the elliptical cam 205 that is rotationally driven by the servo motor contacts the cam follower 204a. The position is controlled with accuracy. The cam 205 and the cam follower 204a constitute a cam mechanism in the present invention, and further constitute a needle moving means including a servo motor.

  The component take-in unit 30 includes a take-out nozzle 33 that is rotatably supported by a rotary shaft 31 that is turned upside down, and a take-out nozzle raising / lowering motor 35 that drives the rotary shaft 31 and the take-out nozzle 33 up and down. These are integrated as a capturing unit 39 and supported by a capturing unit base 37 so as to be driven in the X-axis direction by a drive motor (not shown). Here, the intake unit 39 having various configurations is covered with a box-shaped cover (not shown), and an exhaust joint (not shown) is attached to one surface of the box-shaped cover. FIG. 6 shows a state in which the capturing unit 39 is covered with a box-shaped cover 39a for this aspect. FIG. 6 schematically shows the state covered with the box-shaped cover 39a. In this embodiment, the atmosphere inside the box-shaped cover 39a is sucked from the exhaust joint 39b and discharged to the outside of the mounting apparatus via a pipe (not shown) connected to the exhaust joint 39b. Providing this exhaust mechanism prevents the dust generated in the intake unit 39 from diffusing into the mounting apparatus.

  Further, the component take-in unit 30 further includes a supply component recognition camera 41 and a pre-alignment camera 43, which are connected to the take-in unit base 37 independently of the take-in unit 39 including the take-out nozzle 33 and the like. Fixed and supported. Here, the supply component recognition camera 41 captures an image of the wafer 201a diced into a chip shape attached to the adhesive tape 201b of the wafer ring 202. The obtained image is image-processed to determine the amount of positional deviation in the θ direction (rotation direction about the Z axis) of the wafer caused by the tension distribution when the adhesive tape 201b is attached to the wafer ring 202, and a rotational drive motor 23, the table 21 is rotated based on the amount of positional deviation, and the position of the wafer in the θ direction is set as the reference position.

  Further, it is determined from the image obtained by the supply component recognition camera 41 whether or not bumps are properly present on the surface of each wafer 201a, and determined as defective products such as missing bumps. The operation of the take-out nozzle 33 is controlled so that the taken wafer 201a is not taken out. Further, from the image obtained by the supply component recognition camera 41, a defect mark manually attached to a chip determined to be defective by the inspection and test in the previous process is recognized. The operation of the take-out nozzle 33 is controlled so that the wafer 201a with the defect mark is not taken out. That is, the supply component recognition camera 41 also functions as an electronic component recognition camera that obtains information for determining whether or not to hold the wafer 201a, which is an electronic component in the present invention.

  The pre-alignment camera 43 images the chip held by the take-out nozzle 33. The video thus obtained is subjected to image processing, and the amount of deviation from the reference position or reference posture when the chip is held is obtained. The deviation is obtained as the X direction, the Y direction, and the angle θ. These misregistration amounts are calculated by a control device (not shown), and the control device constitutes a misregistration amount detecting means together with the pre-alignment camera 43. Further, the control device serves as a determination means for determining whether or not the chip can be used by detecting the suitability of the bumps on the chip, the presence or absence of defective marks, etc. from the image obtained by the supply component recognition camera 41 described above. It also has a function.

  The mounting unit 50 includes, for example, a mounting nozzle 51 having a function of mounting electronic components on a circuit board using ultrasonic waves, and θ for rotationally driving the mounting nozzle 51 around an axis perpendicular to the XY plane. A rotation motor 53 and a mounting nozzle lifting / lowering motor 55 that lifts and lowers the mounting nozzle 51 and the θ rotation motor 53 are provided. Further, in this specification, a configuration that is a part of the mounting unit 50 and that imparts ultrasonic vibration to the mounting nozzle 51 and an accompanying configuration are defined as a mounting unit 57.

  Here, the mounting unit 57 will be described in detail with reference to FIG. The mounting unit 57 includes an ultrasonic oscillator 67 and an ultrasonic horn 69 fixed to the ultrasonic oscillator 67. The mounting nozzle 51 is inserted and fixed in a hole 69 a formed in a vibration antinode (maximum amplitude portion) of the ultrasonic horn 69. The hole 69 a functions as a mounting nozzle fastening hole in the ultrasonic horn 69. Ultrasonic vibration is applied to an electronic component (not shown) adsorbed on the tip of the mounting nozzle 51 through an ultrasonic horn 69, and the electrodes of the electronic component and the substrate are joined by the ultrasonic vibration energy. In the ultrasonic horn 69, a vibration node (minimum vibration portion) is mechanically held by a clamp 501, and the clamp 501 is mechanically fastened to a shaft 503 having an axis in the Z direction. At this time, the shaft fastening hole 501a of the clamp 501 and the nozzle fastening hole 69a of the ultrasonic horn 69 exist on the same axis, and the rotation θ of the shaft 503 and the rotation θ of the mounting nozzle 51 coincide.

  The shaft 503 is divided into a first shaft portion 503a having a polygonal cross section supported by the spline 505 in the Z direction and a second shaft portion 503b having a circular cross section supported by the slide rotary bush 507 in the θ direction. Is done. An outer cylinder of the spline 505 is supported by a bearing 509. Therefore, the shaft 503 can freely move in the Z-axis direction and rotate around the Z-axis. The spline 505 and the bearing 509 are located in the vicinity of the clamp 501 at the lower end in the Z-axis direction of the shaft 503. More specifically, the spline 505 and the bearing 509 are disposed closer to the clamp 501 than the voice coil motor 511 when viewed from the solenoid 513. By satisfy | filling the said arrangement | positioning, the mounting nozzle 51 can be hold | maintained with high rigidity. The movement of the shaft 503 in the Z direction is given by a voice coil motor 511, and this voice coil motor 511 gives a pressing force to the electronic component at the tip of the nozzle 51. Accordingly, the shaft 503 is driven in the Z-axis direction by the voice coil motor 511. Further, the bearing case 515 connected to the solenoid 513 installed above the Z axis of the shaft 503 is brought into contact with the block 517, thereby preventing the shaft 503 from freely moving in the Z direction. That is, the movement of the shaft 503 in the Z-axis direction is restricted by the solenoid 513.

  The inertial mass of the shaft 503 cannot be held by the voice coil motor 511 described above. For this reason, when the entire mounting unit 57 is moved in the Z-axis direction, the shaft 503 moves in the mounting unit 57 due to inertia. In the present invention, in order to prevent this, the shaft 503 is held in a predetermined arrangement by the force of the solenoid 513. The θ direction operation of the shaft 503 is conducted to the outer cylinder of the spline 505 via the flange by the θ rotation motor 53 incorporating the speed reducer, and is transmitted to the first shaft portion 503a via the spline 505. In the present invention, as the spline 505, a rolling bearing or a sliding bearing (air slide) using compressed air as a lubricant can be used. By using an air slide that does not deteriorate over time, such as a load such as friction or a mechanical bearing, a stable sliding state can be obtained for a long period of time, and a high stopping system can be maintained.

  In the present invention, a tilt adjusting mechanism 600 that adjusts the tilt of the horn mounting surface can also be provided on the clamp 501 at the lower end in the Z-axis direction of the shaft 503. FIG. 8 schematically shows the tilt adjustment mechanism 600. 8B shows a first adjustment plate 601, which will be described later, FIG. 8C shows a second adjustment plate 602, and FIG. 8D shows a heat insulation plate 603 as viewed from the arrangement direction of the shaft 503. 8A is a plan view, and FIG. 8A shows a state in which these structures are incorporated as seen from a cross section taken along line 8 (a) -8 (a) in FIGS. 8B and 8C. . In the tilt adjusting mechanism 600, the tilt between the triangular first adjusting plate 601 fixed to the lower end of the shaft 503 and the second adjusting plate 602 disposed on the lower surface thereof is adjusted by the spherical receiver 606. The shapes of these adjusting plates are merely examples, and various shapes can be used by taking into consideration the arrangement with other configurations such as a disk shape.

  More specifically, the spherical support 606 is disposed in a hole corresponding to one corner of three holes (two are screw holes described later) of the first adjustment plate 601 and this is adjusted in the first adjustment. It is exposed on the lower surface side of the plate 601. Furthermore, when each adjustment plate is mounted, the exposed portion is used as a fulcrum and the first adjustment plate 601 is pressed against the first adjustment plate 601 with push bolts 604 arranged in two through screw holes provided at the remaining two corners of the triangle. The second adjustment plate 602 is pushed downward. At that time, three fixing bolts 605 positioned at the top of the triangular shape having the top in the same direction as the triangular shape arranged inside the triangular shape are further arranged at corresponding positions of the second adjustment plate 602. Screwed into the threaded hole. A through hole is provided at a position where the fixing bolt 605 is disposed in the first adjustment plate 601. By lifting the second adjustment plate 602 upward with respect to the first adjustment plate 601 by these fixing bolts 605, the relative inclination between the first adjustment plate 601 and the second adjustment plate 602 is adjusted. Fix it. A heat insulating plate 603 is disposed on the lower surface of the second adjusting plate 602, and the upper portion of the ultrasonic horn 69 is fixed to the second adjusting plate 602 by a fixing means (not shown) via the heat insulating plate 603.

  These are integrated as a mounting unit 57 and supported by a mounting portion base 59 so as to be driven in the Y-axis direction by a driving motor (not shown). The mounting unit 57 has a substrate mark recognition camera 61 fixed and supported independently of the mounting nozzle 51, the θ rotation motor 53, and the nozzle lifting / lowering motor 55. Here, in the present embodiment, the ultrasonic horn 69 has a conical shape, and the mounting nozzle 51 is illustrated in the vicinity of the top of the conical shape. However, depending on the chip shape or size, for example, the ultrasonic horn 69 may have a plate-like structure as illustrated in FIG. The case where such a structure is arranged in the present invention will be described below with reference to FIG.

  FIG. 9 schematically shows the main configuration when the mounting unit 57 using the plate-shaped ultrasonic horn 69 is viewed from the side. The mounting unit 57 in this embodiment includes a voice coil motor 511, a shaft 503, an ultrasonic oscillator 67, and an ultrasonic horn 69, as in the mounting unit shown in FIG. The mounting unit 57 is supported by a mounting portion base 59 which is a drive that can be driven in the X, Y, and Z axis directions. In this embodiment, the mounting nozzle 51 is disposed on the shaft 503. The mounting nozzle 51 holds the chip 2 held by the take-out nozzle 33 and transports it to the mounting substrate. The transport state is shown in FIG. The mounting unit 57 that has moved onto the mounting substrate starts to descend, and the chip 2 is easily mounted on the substrate as shown in FIG.

  Here, the mounting nozzle 51 in this embodiment will be described. FIG. 10 (a) is an enlarged view of the mounting nozzle 51 surrounded by a dotted line in FIG. 9 (b), and FIG. 10 (b) shows the mounting nozzle 51 from the direction of the arrow 10 (b) in FIG. 10 (a). The state which looked at the mounting nozzle 51 is shown. In this embodiment, the mounting nozzle 51 has a male screw shape in which a through hole 51a is formed in the axial direction, and the outer diameter of the head portion is a hexagonal shape. The through hole 51a is used as a suction hole when the chip 2 is sucked and held. The mounting nozzle 51 is mounted on the mounting unit by screwing the mounting nozzle 51 into the screw hole of the ultrasonic horn 69 in which a female screw is engraved.

  During the screwing operation, the screw is fixed in the direction shown by the two-dot chain line in FIG. There is a case. Usually, the ultrasonic vibrator 67 and the ultrasonic horn 69 are designed so that a vibration suitable for mounting can be applied to the chip 2 by being arranged along the XY axial direction. Therefore, when fixed in the arrangement shown by the two-dot chain line in this way, there is a possibility that appropriate vibration is not applied to the chip 2. In the present invention, the mounting nozzle 51 is fixed in an appropriate direction by sandwiching a plurality of washers 71 having different thicknesses when the mounting nozzle 51 is screwed, and further adjusting the thickness by replacing them. It is said.

  Further, in the present invention, the image obtained by the substrate mark recognition camera 61 that images the reference mark or mounting position pattern provided on the substrate is subjected to image processing, and the substrate determined to be defective by the inspection and test in the previous process. A defective mark manually attached to the upper mounting position is recognized. The operation of the mounting nozzle 51 is controlled so that the chip is not mounted at the mounting position with the defect mark. Also, the distance between two reference positions provided on the substrate is calculated from the image obtained by the substrate mark recognition camera 61, and if the distance value is outside the preset allowable range, the substrate is abnormal. Therefore, the mounting operation is stopped. Further, the substrate mark recognition camera 61 images the substrate after the chip is mounted by the mounting nozzle 51. Image processing is performed on the obtained image, and the amount of deviation between the mounting reference position and the actual mounting position and the inclination of the chip posture relative to the board are recognized by comparing the chip outer shape with the mounting position pattern of the board. .

  The board mark recognizing camera 61 and the component recognizing camera 17 described above respectively image a member for position calibration, process the obtained image, recognize the relative positional relationship between the two cameras, and calibrate the position. Is performed at regular intervals. Here, at the initial stage of starting the operation of the mounting apparatus, it is necessary to frequently perform the position calibration operation of the two cameras because the constituent members of the apparatus are heated and deformed with the operation of the apparatus. However, after that, when the operating time elapses and the temperature rise of the constituent members of the apparatus is saturated, the deformation is also saturated, so that it is possible to reduce the frequency of the position calibration operation accompanied by the suspension of the mounting operation. In the present invention, the calibration operation is performed at the first predetermined interval at the start of the operation of the mounting apparatus by the control device described above, and after the predetermined time has elapsed after the start of the operation, the second longer than the first predetermined interval. Control for performing a calibration operation at a predetermined interval is performed to improve the processing capability of the mounting operation. The first predetermined interval is, for example, a time required for one or two mounting operations, and the second predetermined interval corresponds to a time at which the actual process is not spoiled, for example, 10 to 20 times.

  The driving of each component in the X-axis direction and the Y-axis direction described above is performed by a combination of a ball screw shaft and a guide rail directly connected to each driving motor. Here, since the drive stroke is long in the Y-axis direction, there is a risk of misalignment such as pitching and yawing, and this misalignment may become a problem when high positional accuracy is required in the future. is there. Therefore, in the mounting apparatus according to the present invention, the linear scale 222 is extended along the guide rail of the drive mechanism that drives the mounting unit 57 in the Y-axis direction, and the position information of the mounting unit 57 detected by the linear scale 222 is obtained. The operation of the drive motor 221 that rotates the ball screw shaft is controlled based on the above. The linear scale 222 is disposed along a guide rail that supports movement of the mounting unit 57 in the Y-axis direction. The drive motor 221 functions as a Y-axis drive unit that actually moves the mounting unit 57 based on position information in the Y-axis direction of the mounting unit 57 detected by the linear scale 222.

  Thus, when performing the mounting operation, the mounting unit 57 can be repeatedly stopped at the same position in the Y-axis direction with high positioning accuracy. Further, in the present invention, the mounting unit 57 is always mounted on the Y-axis during mounting. The mounting operation is performed at the same position above. As a result, coupled with the improvement of the stopping accuracy of the mounting unit 57, it is possible to suppress the influence of the positional deviation due to the distortion of the ball screw shaft, and it is possible to perform a mounting operation with high positional accuracy. In this embodiment, the take-out nozzle moves in the X-axis direction and the mounting nozzle moves in the Y-axis direction. However, the take-out nozzle moves in the Y-axis direction and the mount nozzle moves in the X-axis direction. good.

  Next, the electronic component mounting process will be described with reference to FIG. 1 and FIG. 11 which is a flowchart showing a procedure for actually mounting the electronic component. When the electronic component mounting process is started, first, in step 1, the position of the electronic component such as a chip to be mounted placed on the substrate stage 11 is confirmed by the supply component recognition camera 41. At that time, a chip for which a bump or the like is determined to be inappropriate or a chip having a recognition mark as having a quality problem is determined from an image obtained from the supply component recognition camera 41 and is removed from an object to be taken out. Excluded. In subsequent step 2, the substrate stage 11 is driven in each of the XY directions, and the placement of the mounted chip on the XY plane is corrected so as to coincide with the take-out position by the take-out nozzle 33. Thereafter, in step 3, the take-out nozzle 33 is lowered to suck and hold the mounted chip.

  The take-out nozzle 33 holding the chip is turned upside down by rotating around the rotation shaft 31 in Step 4 and turns the chip upward. Further, in step 5, the take-out nozzle 33 is driven in the X-axis direction to the lower side of the pre-alignment camera 43, and the chip is imaged at this position. Based on this imaging result, in step 6, the amount of deviation in each of the X, Y, and θ directions with respect to a predetermined reference posture of the chip is obtained. After detecting the displacement amount, the take-out nozzle 33 that holds the chip and is turned upside down reaches Step 7 positioned below the mounting nozzle 51 that stands by at the chip receiving position.

  In subsequent step 9, the mounting nozzle 51 descends, comes into contact with the chip, sucks the chip by vacuum suction, etc., and then the vacuum suction of the chip by the take-out nozzle 33 is released, and the chip is transferred to the mounting nozzle 51. Ends. Before the mounting nozzle 51 comes into contact with the chip, the arrangement (posture) of the mounting nozzle with respect to the chip is corrected in advance in step 8 according to the amount of deviation obtained in step 5. Specifically, the X axis direction deviation ΔX is corrected by driving the take-out nozzle 33 in the X axis direction, and the Y axis direction deviation ΔY correction and the chip rotation deviation Δθ correction are performed in the Y axis direction of the mounting nozzle 51. And θ direction driving, respectively. Thereby, the mounting nozzle 51 can always hold the chip in a predetermined posture.

  After the transfer of the chip to the mounting nozzle 51 is completed, in step 10, the mounting nozzle 51 is driven in the Y-axis direction toward the circuit board. At the time of the driving, the posture of the chip is confirmed by the component recognition camera 17 in step 11. In addition, while the processing up to this point is performed, the circuit board imaging camera 61 detects the chip mounting position based on the imaging result of the circuit board. In step 11, the positional relationship between the chip mounting position and the chip holding attitude is obtained along with the confirmation of the chip holding attitude, and the positional deviation of the chip holding state with respect to the substrate mounting position is obtained again.

  In the subsequent step 12, the substrate stage 11 is driven in the X and Y directions, and the positional deviation of the circuit board in the X axis and Y axis directions obtained in step 11 is corrected. Note that it is highly likely that the deviation correction in the θ direction is within the allowable range due to the correction in Step 8, but this may be performed again as necessary. Thereafter, in step 13, the mounting nozzle 51 is lowered with respect to the circuit board, and the process of pressing and attaching the chip to the circuit board is performed, and one mounting process is completed.

  In each drawing, each nozzle tip has a suction port used when performing vacuum suction. Since the mounting nozzle presses the chip 2 against a circuit board (not shown), it is desirable that the mounting nozzle has a shape substantially equal to and slightly smaller than the suction surface of the chip. In the conventional mounting apparatus, for the purpose of shortening the mounting tact time, a configuration is also used in which, when a chip is transferred from the take-out nozzle to the mounting nozzle, this transfer is performed once through an intermediate stage. Also in the present invention, the effect of wearing can be obtained by providing such an intermediate stage and detecting the posture of the chip on the stage.

  However, for this purpose, it is necessary to provide a driving function in the XY directions to the intermediate stage, which complicates the apparatus configuration. In addition, by interposing the intermediate stage, the number of times of chip transfer increases, and accordingly, there is a possibility that the amount of deviation of the position of the chip and the like is larger than that at the time of removal. Considering such an increase in the correction amount or correction parameter, and also the movement of the intermediate stage in the X and Y directions, if the positional relationship between the mounted nozzle and the tip is always kept constant, the effect of shortening the tact time can be obtained so much. There may be no case.

  In consideration of the above, in the present invention, a mounting apparatus having a simpler configuration is constructed without providing an intermediate stage. Therefore, the position correction when the mounting nozzle holds the chip and the position correction when the mounting nozzle mounts the chip on the substrate are performed by correcting the minimum number of axes. For this reason, it is possible to provide a highly convenient device that is highly reliable as a mounting device, is easy to adjust at the initial stage of operation, and the like.

  Furthermore, according to the present invention, there is no significant difference from the conventional mounting process except that the detection process of Δθ by the pre-alignment camera and the correction process of Δθ at the time of chip reception by the mounting nozzle are increased. Therefore, the same effect can be obtained for a mounting apparatus composed of various transport systems only by adding the detection and correction processes to the conventionally used apparatus. That is, even in the case where the present invention is carried out using a conventional device, it is possible to carry out sandwich pitch mounting, in-cavity mounting and the like without requiring a large cost.

  In addition, the present embodiment assumes a case where relatively small chips are mounted with high density, but the present invention is not limited to this. Specifically, for example, when mounting a relatively large electronic component, a mounting nozzle having an end face that is substantially the same as the electronic component and slightly smaller in shape is used, and the electronic component is surely held in a desired state. It is possible to hold it. Accordingly, it is possible to apply a uniform load to the entire end face of the electronic component for mounting, and it is possible to obtain a good bonding state between the chip and the substrate.

2: chip, 10: substrate table unit, 11: substrate stage, 11a: upper plate, 11b: lower plate, 13: X axis drive motor, 15: Y axis drive motor, 17: component recognition camera, 20: component supply table 21: Table, 21a: Opening, 23: Rotation drive motor, 30: Component take-in part, 31: Rotating shaft, 33: Extraction nozzle, 35: Motor for raising / lowering nozzle, 37: Take-up part base, 39: Take-in part Unit: 39a: Box-shaped cover, 39b: Exhaust joint, 41: Supply part recognition camera, 43: Pre-alignment camera, 50: Mounting part, 51: Mounting nozzle, 51a: Through-hole, 53: θ rotation motor, 55 : Motor for raising and lowering nozzle, 57: mounting unit, 59: mounting base, 61: camera for substrate mark recognition, 6 : Ultrasonic oscillator, 69: Ultrasonic horn, 69a: Nozzle fastening hole, 201a: Wafer, 201b: Adhesive tape, 202: Wafer ring, 203: Expanding ring, 204: Push-up needle, 204a: Cam follower, 205: Cam, 211: Motor for driving, 222: Linear scale, 501: Clamp, 503: Shaft, 503a: First shaft portion, 503b: Second shaft portion, 505: Spline, 511: Voice coil motor, 513: Solenoid 517: Block, 600: Inclination adjustment mechanism, 601: First adjustment plate, 602: Second adjustment plate, 603: Insulation plate, 604: Push bolt, 605: Fixing bolt, 606: Spherical support

Claims (13)

An electronic component placed on the component supply table is taken out by a take-out nozzle, and the electronic component is reversed and transferred from the take-out nozzle holding the electronic component to a mounting nozzle attached to a mounting unit, and held by the mounting nozzle. The mounting position by the mounting nozzle is corrected by comparing the mounting position of the electronic component on the circuit board extending in the XY plane on the substrate stage and the electronic component on the mounting table by the mounting nozzle. An electronic component mounting apparatus mounted on the circuit board,
A linear scale extending along a guide rail that supports movement of the mounting unit in the Y-axis direction;
An electronic component mounting apparatus comprising: Y-axis driving means for moving the mounting unit in the Y-axis direction based on position information of the mounting unit detected by the linear scale. An electronic component placed on the component supply table is taken out by a take-out nozzle, and the electronic component is reversed and transferred from the take-out nozzle holding the electronic component to a mounting nozzle attached to a mounting unit, and held by the mounting nozzle. The mounting position by the mounting nozzle is corrected by comparing the mounting position of the electronic component on the circuit board extending in the XY plane on the substrate stage and the electronic component on the mounting table by the mounting nozzle. An electronic component mounting apparatus mounted on the circuit board,
The mounting unit includes a shaft that can freely move in the Z-axis direction perpendicular to the XY plane and rotate around the Z-axis,
Splines and bearings for supporting the shaft;
An ultrasonic horn for applying ultrasonic vibration to the mounting nozzle;
A first adjustment plate fixed to the lower end of the shaft;
A second adjustment plate disposed on the lower surface of the first adjustment plate;
A fixing means disposed on the lower surface of the second adjustment plate and holding the mounting nozzle via the ultrasonic horn,
A spherical bolt exposed on the lower surface side of the first adjustment plate is arranged as a fulcrum in one of the three triangular holes arranged on the first adjustment plate, and the push bolts arranged on the two holes And pushing the second adjustment plate downward with respect to the first adjustment plate,
A screw hole that is disposed closer to the center than the three holes in the triangular arrangement of the first adjustment plate and is embedded in the second adjustment plate through a through hole that penetrates the first adjustment plate With the three fixing bolts accumulated in the first adjustment plate, the second adjustment plate is pulled upward with respect to the first adjustment plate, and the relative inclination between the first adjustment plate and the second adjustment plate is increased. An electronic component mounting apparatus characterized by adjusting.   The electronic component mounting apparatus according to claim 1, wherein the spline is a sliding bearing using compressed air as a lubricant. The mounting unit further includes a board mark recognition camera for recognizing a board mark provided on the circuit board,
4. The electronic component mounting apparatus according to claim 1, wherein the board mark recognition camera determines a mounting failure between the circuit board and the electronic component. 5. An electronic component placed on the component supply table is taken out by a take-out nozzle, and the electronic component is reversed and transferred from the take-out nozzle holding the electronic component to a mounting nozzle attached to a mounting unit, and held by the mounting nozzle. The mounting position of the mounting nozzle is corrected by comparing the mounting position of the electronic component on the circuit board on the circuit board on the substrate stage, and the mounting nozzle corrects the mounting position of the electronic component with respect to the circuit board on the mounting table. A mounting device for electronic components to be mounted,
An electronic component mounting apparatus, wherein an electronic component recognition camera for obtaining information for recognizing whether or not to hold the electronic component is attached to the substrate stage.   6. The electronic component mounting apparatus according to claim 5, wherein the information obtained by the electronic component recognition camera is the presence or absence of a bump of the electronic component.   6. The electronic component mounting apparatus according to claim 5, wherein the information obtained by the electronic component recognition camera is the presence / absence of adhesion of foreign matter on the mounting nozzle. The mounting unit has a circuit board mark recognition camera for recognizing a mark provided on the circuit board,
The electronic component recognizing camera and the circuit board mark recognizing camera image each of the position calibration members, perform image processing on the obtained images, recognize each relative positional relationship, and perform a position calibration operation. Done
In the initial stage of operation of the mounting apparatus, the position calibration operation is performed at every first predetermined interval, and after a predetermined operation time has elapsed after the start of operation, the position calibration operation is performed more than the first predetermined interval. 5. The electronic component mounting apparatus according to claim 4, wherein the mounting is performed at long second predetermined intervals. An electronic component placed on the component supply table is taken out by a take-out nozzle, and the electronic component is reversed and transferred from the take-out nozzle holding the electronic component to a mounting nozzle attached to a mounting unit, and held by the mounting nozzle. The mounting position of the mounting nozzle is corrected by comparing the mounting position of the electronic component on the circuit board on the circuit board on the substrate stage, and the mounting nozzle corrects the mounting position of the electronic component with respect to the circuit board on the mounting table. A mounting device for electronic components to be mounted,
2. The electronic component mounting apparatus according to claim 1, wherein the substrate stage has a lower plate made of an aluminum heat block and a stainless upper plate constituting a surface supporting the circuit board. An electronic component placed on the component supply table is taken out by a take-out nozzle, and the electronic component is reversed and transferred from the take-out nozzle holding the electronic component to a mounting nozzle attached to a mounting unit, and held by the mounting nozzle. The mounting position of the mounting nozzle is corrected by comparing the mounting position of the electronic component on the circuit board on the circuit board on the substrate stage, and the mounting nozzle corrects the mounting position of the electronic component with respect to the circuit board on the mounting table. A mounting device for electronic components to be mounted,
The intake unit including the take-out nozzle is covered with a box-shaped cover, and the box-shaped cover has an exhaust joint, and an internal space of the box-type cover via a pipe connected to the exhaust joint. The electronic component mounting apparatus is characterized by discharging the dust and air to the outside of the mounting apparatus. An electronic component placed on the component supply table is taken out by a take-out nozzle, and the electronic component is reversed and transferred from the take-out nozzle holding the electronic component to a mounting nozzle attached to a mounting unit, and held by the mounting nozzle. The mounting position by the mounting nozzle is corrected by comparing the mounting position of the electronic component on the circuit board extending in the XY plane on the substrate stage and the electronic component on the mounting table by the mounting nozzle. An electronic component mounting apparatus mounted on the circuit board,
The component supply table includes an annular wafer ring for fixing an adhesive tape to which a plurality of diced wafers are attached;
An annular expand ring disposed below the wafer ring with respect to the Z-axis direction perpendicular to the XY plane and disposed inside the annular shape;
A push-up needle disposed below the wafer ring in the Z-axis direction and disposed inside the annular shape and capable of pushing up the adhesive tape upward in the Z-axis direction;
Table lowering means for lowering the component supply table and the wafer ring relative to the expand ring in the Z-axis direction;
Needle drive means for driving the push-up needle in the Z direction,
The table lowering means is driven by a servo motor,
The electronic component mounting apparatus, wherein the needle moving means is driven by a servo motor and a cam mechanism. The take-in unit including the take-out nozzle is a supply component recognition camera that images the wafer attached to the adhesive tape;
The electronic component according to claim 11, further comprising: a rotation driving motor that obtains and corrects a positional deviation amount in a rotation direction around the Z axis of the wafer caused by a tension distribution on the adhesive tape. Mounting equipment.   13. The electronic component mounting apparatus according to claim 12, wherein the supply component recognizing camera also performs defective product detection of the wafer.

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