JP7102305B2 - Manufacturing method of die bonding equipment and semiconductor equipment - Google Patents

Description

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonder in which a push-up jig can be replaced.

A part of the manufacturing process of a semiconductor device includes a process of mounting a semiconductor chip (hereinafter, simply referred to as a die) on a wiring board, a lead frame, etc. (hereinafter, simply referred to as a substrate) and assembling a package. Partly, there is a step of dividing a die from a semiconductor wafer (hereinafter, simply referred to as a wafer) (dying step) and a bonding step of mounting the divided die on a substrate. The semiconductor manufacturing device used in the bonding process is a die bonding device such as a die bonder.

Among the bonding steps, there is a peeling step of peeling the die divided from the wafer. In the peeling step, these dies are peeled one by one from the dicing tape held in the wafer holder, and the peeled dies are picked up by a suction jig called a collet and conveyed onto the substrate.

In the die bonder, a push-up unit is installed under the dicing tape (back surface), and the push-up unit rises to push up the die on the dicing tape and peel the die from the dicing tape. A push-up jig is attached to the tip of the push-up unit that pushes up the die. The push-up jig is equipped with an inner block that pushes up the center of the die, four peeling starting point forming pins provided at the four corners of the inner block, and the like.

Japanese Unexamined Patent Publication No. 2013-172122

In the peeling process, it is necessary to check and adjust the pick-up property of the die and the collet mounting state (collet mounting position, height, fanning (tilt), wear of the collet suction surface, etc.), but these are manually performed. Will be done.
An object of the present disclosure is to provide a die bonding apparatus capable of easily confirming the pick-up property and the collet state.
Other challenges and novel features will become apparent from the description and accompanying drawings herein.

The following is a brief overview of the representative ones of the present disclosure.
That is, the die bonding apparatus includes a push-up unit that pushes up the die from below and peels it off from the dicing tape, and a die bonding unit that attracts the peeled die and bonds it onto the substrate. The push-up unit includes a push-up jig and a housing to which the push-up jig is attached. Instead of the push-up jig, a measuring jig can be attached to and removed from the housing. The push-up jig has a block for pushing up the dicing tape in the dome. The measuring jig is housed in the dome.

According to the die bonding device, it is possible to easily confirm the pick-up property and the collet mounting state.

It is a conceptual diagram explaining the replacement of the push-up jig and the measurement jig of the embodiment. It is a conceptual top view explaining the replacement of the push-up jig and the measuring jig of FIG. It is a figure explaining the measuring jig 80A of FIG. It is a figure explaining the measuring jig 80B of FIG. It is a figure explaining the measuring jig 80C of FIG. It is a top view which shows the outline of the die bonder which concerns on Example. 6 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 6. It is a figure which shows the external perspective view of the wafer table of FIG. It is a schematic cross-sectional view which shows the main part of the wafer table of FIG. It is a top view which shows the state which removed the wafer holder from the wafer table of FIG. It is a perspective view of the push-up jig of FIG. 11 is a cross-sectional view of FIG. 11C. It is a perspective view of the housing of FIG. It is sectional drawing which shows the state which the adapter of FIG. 11 and the housing of FIG. 13 are united. It is a perspective view which shows the state which the push-up jig of FIG. 11 and the housing of FIG. 13 are united. It is a perspective view of the exchange arm of FIG. It is sectional drawing of the dome part of the push-up jig of FIG. It is a flowchart which shows the manufacturing method of the semiconductor device using the die bonder of FIG.

The pick-up property of the die is confirmed by any of the following, but there are the following problems.
(1) A push-up jig-like measuring instrument with a built-in load cell is attached, and the wafer peeling load is measured. After the measurement, replace it with a normal push-up jig. Since this is manual, it takes a long time to adjust.
(2) Measure the peeling force of the wafer before it is placed on the device with a dial gauge or the like in advance. There is no guarantee that the setting result will be optimal.
(3) Parameters such as pickup conditions are determined by trial and error based on the experience of the operator. It is difficult to continue production when the pick-up property changes due to changes in wafer characteristics.

In addition, the collet mounting state is confirmed and adjusted as follows, but there are the following problems.
Stop production, place a pressure-sensitive paper on the dome, attach a special jig tool to the collet, and press it against the pressure-sensitive paper from above to check and adjust the mounting condition. After adjustment, replace it with a normal collet. The operating status of the device cannot be confirmed. Since the adjustment work is performed manually, the adjustment result varies depending on the operator.

Hereinafter, embodiments and examples will be described with reference to the drawings. However, in the following description, the same components may be designated by the same reference numerals and repeated description may be omitted. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is just an example, and the interpretation of the present invention is used. It is not limited.

In the semiconductor manufacturing apparatus of the embodiment, the measuring device is incorporated in a dome having the same shape as the normal pushing jig to form the measuring jig, and the normal pushing jig and the measuring jig are automatically replaced. The semiconductor manufacturing apparatus of the embodiment will be described with reference to FIGS. 1 to 5.

FIG. 1 is a conceptual diagram illustrating replacement of the push-up jig and the measuring jig according to the embodiment. FIG. 2 is a conceptual top view for explaining the replacement of the push-up jig and the measuring jig of FIG.
The push-up jig 80 is attached to the housing 131 at the tip of the push-up unit 13, and the push-up unit 13 rises to push up the die on the dicing tape to separate the die from the dicing tape. It is a lifting jig. Inside the push-up jig 80, a block or the like for pushing up the center of the die is provided.

The measuring jig 80A is attached to the housing 131 at the tip of the push-up unit 13 and is used for checking the pick-up property. A load cell or the like is provided inside the measuring jig 80A.

The measuring jig 80B is attached to the housing 131 at the tip of the push-up unit 13 and is used for checking the pick-up property and mounting the collet. An imaging device such as a camera is provided inside the measuring jig 80B.

The measuring jig 80C is attached to the housing 131 at the tip of the push-up unit 13 and is used for confirming the fanning of the collet. A displacement meter or the like is provided inside the measuring jig 80C.

As shown in FIG. 2, the push-up jig 80 and the measuring jigs 80A to 80C are held by the jig stocker 95, the jig stocker 95 rotates, and a replacement arm (not shown) is the push-up jig 80 or the measuring jig. Grasp 80A to 80C, move between the jig stocker 95 and the push-up unit 13, and automatically replace them.

Next, the structure and operation of the measuring jig will be described with reference to FIGS. 3 to 5. 3A and 3B are views for explaining the measuring jig 80A of FIG. 1, FIG. 3A is a cross-sectional view of a dome portion of the measuring jig 80A, and FIG. 3B is a cross-sectional view at the time of measurement. 4A and 4B are views for explaining the measuring jig 80B of FIG. 1, FIG. 4A is a cross-sectional view of a dome portion of the measuring jig 80B, and FIG. 4 (C) is a cross-sectional view at the time of measurement by the measuring jig 80B, and FIG. 4 (D) is a cross-sectional view at the time of imaging the suction surface of the collet. 5A and 5B are views for explaining the measuring jig 80C of FIG. 1, FIG. 5A is a cross-sectional view of a dome portion of the measuring jig 80C, and FIG. It is a cross-sectional view.

The outer shape and size of the dome 81A of the measuring jig 80A are the same as the dome of the pushing jig 80, or are large enough to be handled and mounted by the replacement arm. The size of the dome 81B of the measuring jig 80B is the same as the dome of the pushing jig 80, or the size can be handled and mounted by the replacement arm, and the outer shape of the dome 81B is the dome of the pushing jig 80 except for the upper surface. It can be handled and attached in the same way as the above or with a replacement arm. The size of the dome 81C of the measuring jig 80C is the same as the dome of the push-up jig 80, or the size can be handled and mounted by the replacement arm, and the outer shape of the dome 81C is the same as the dome of the push-up jig 80. It can be handled with a replacement arm.

As shown in FIG. 3A, one block 84A that pushes up the dicing tape 16 upward is incorporated in the central portion of the dome 81A. The block 84A is connected to the base block 86A via a load cell 85A, and moves up and down in conjunction with a push-up shaft 88A that moves up and down by a drive mechanism (not shown). A compression coil spring 87A is provided between the base block 86A and the base portion 89A. The wiring required for the load cell 85A is arranged along or inside the base block 86A and the shaft 88A, and the receiver or wiring provided in the main body of the push-up unit 13 by wireless transmission or wired connection by the transmitter in the adapter described later. Is connected with.

As shown in FIG. 3B, the measuring jig 80A is raised, the upper surface thereof is brought into contact with the back surface of the dicing tape 16, the rising of the measuring jig 80A is stopped, and then the push-up shaft 88A is driven upward. The block 84A is pushed up and the force for peeling the die D from the dicing tape 16 is measured as the compressive force of the load cell 85A.

As shown in FIG. 4A, a camera (imaging device) 85B having a lens and an image sensor is incorporated in the center of the dome 81B, and the upper surface of the dome 81B is opened equal to the width of the camera 85B. ing. The wiring required for the camera 85B extends to an adapter described later, and is connected to a receiver or wiring provided in the main body of the push-up unit 13 by wireless transmission or a wired connection by a transmitter in the adapter.

As shown in FIG. 4B, the push-up jig 80 is raised so that the upper surface thereof is brought into contact with the back surface of the dicing tape 16, the rise of the push-up jig 80 is stopped, and then the push-up shaft 88 is moved upward. Drive and push up the block 84. After lowering the block 84, the push-up jig 80 is replaced with the measuring jig 80B. A camera 85B is attached to the measuring jig 80B, and as shown in FIG. 4C, the die peeling state peeled by the push-up jig 80 is imaged from the lower surface through the dicing tape 16.

Further, as shown in FIG. 4D, the measuring jig 80B directly images the die suction surface of the collet 22 from below. This makes it possible to check the mounting state of the collet after replacement, and to check the wear of the collet during use and the adhesion of foreign matter.

As shown in FIG. 5A, the measuring jig 80C is arranged so that a plurality of probes 84C protrude from the dome surface, and the upper surface of the dome 81B has an opening at the position of the probe 84C. The probe 84C itself has a springback mechanism. A displacement meter 85C exists at the base of the probe 84C, and the pushing amount of the probe 84C can be measured. The wiring required for the displacement meter 85C extends to an adapter described later, and is connected to a receiver or wiring provided in the main body of the push-up unit 13 by wireless transmission or wired connection by a transmitter in the adapter.

As shown in FIG. 5B, by pressing the collet 22 against the measuring jig 80C from above, the fanning state of the collet 22 with respect to the dome 81C is measured from the difference in the pushing amount of the probe 84C.

According to the embodiment, by installing a measuring jig incorporating a measuring instrument in the apparatus, it is possible to automatically measure without stopping production for a long time. In addition, it is possible to easily adjust the fanning and set the pickup conditions before the start of production, and shorten the time. In addition, it is possible to reduce the impact on production by measuring and recalibrating the changes in wafer characteristics during production and the deviation of collet fanning in-line during production. In addition, if the conditions of the push-up jig, collet, and wafer change, problems such as pick-up mistakes and cracks will occur, but since the inspection can be performed in advance (automatically), it is possible to prevent the problems.

FIG. 6 is a top view showing an outline of the die bonder according to the embodiment. FIG. 7 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG.

The die bonder 10 is roughly divided into a die supply unit 1 for supplying a die D for mounting a product area (hereinafter, referred to as a package area P) which is one or a plurality of final packages on a printed circuit board S, and a pickup unit 2. It has an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a substrate supply unit 6K, a substrate carry-out unit 6H, and a control unit 7 that monitors and controls the operation of each unit. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is arranged on the front side of the die bonder 10, and the bonding unit 4 is arranged on the back side.

First, the die supply unit 1 supplies the die D to be mounted in the package area P of the substrate S. The die supply unit 1 has a wafer table 12 for holding the wafer 11 and a push-up unit 13 indicated by a dotted line for pushing up the die D from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction, and each drive unit (not shown) that moves the collet 22 up / down, rotates, and moves in the X direction. , Have. The pickup head 21 has a collet 22 (see also FIG. 7) that attracts and holds the pushed-up die D to the tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has drive units (not shown) that move the collet 22 up / down, rotate, and move in the X direction.

The intermediate stage portion 3 includes an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it onto the package area P of the substrate S conveyed on the bonding stage BS, or the die already bonded onto the package area P of the substrate S. Bonding is done by stacking on top of it. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 7) that attracts and holds the die D to the tip like the pickup head 21, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and a substrate. It has a substrate recognition camera 44 that captures a position recognition mark (not shown) of the package area P of S and recognizes the bonding position.
With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the image data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and bases the board based on the image data of the board recognition camera 44. Bond the die D to S.

The transport unit 5 has a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 to which the substrate S moves. The substrate S moves in the X direction by driving a nut (not shown) of the substrate transport claw 51 provided in the transport lane 52 with a ball screw (not shown) provided along the transport lane 52.
With such a configuration, the substrate S moves from the substrate supply unit 6K to the bonding position along the transfer lane 52, and after bonding, moves to the substrate carry-out part 6H and passes the board S to the board carry-out part 6H.

The control unit 7 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the die bonder 10, and a central processing unit (CPU) for executing the program stored in the memory.

The die bonder 10 has a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, a stage recognition camera 32 that recognizes the posture of the die D mounted on the intermediate stage 31, and a mounting position on the bonding stage BS. It has a board recognition camera 44 for recognizing. It is the stage recognition camera 32 involved in the pickup by the bonding head 41 and the substrate recognition camera 44 involved in bonding to the mounting position by the bonding head 41 that must correct the posture deviation between the recognition cameras.

Next, the configuration of the wafer table 12 will be described with reference to FIGS. 8 and 9. FIG. 8 is a view showing an external perspective view of the wafer table of FIG. FIG. 9 is a schematic cross-sectional view showing a main part of the wafer table of FIG.

In FIGS. 8 and 9, the wafer table 12 horizontally positions the expanding ring 15 that holds the wafer ring 14 and the dicing tape 16 that is held by the wafer ring 14 and to which the plurality of dies D are adhered (in FIG. 8). (Shown) and a push-up unit 13 (shown in FIG. 9) arranged inside the support ring 17 for pushing up the die D upward.

Although details will be described later, the push-up unit 13 is composed of a push-up unit main body (not shown), a housing 131, and a push-up jig, and is moved in the vertical direction by a drive mechanism (not shown) and is horizontal. The wafer table 12 moves in the direction.

The wafer table 12 is mounted on the X base 19, and the wafer table 12 is moved in the X-axis direction by the X base 19. A Y base 20 is attached below the X base 19, and the Y base 20 moves the wafer table 12 together with the X base 19 in the Y axis direction.

The wafer table 12 lowers the expanding ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 is stretched to widen the interval between the dies D, and the push-up unit 13 pushes up the dicing D from below the die D to improve the pick-up property of the die D. ing.

A film-like adhesive material called a die attach film 18 is attached between the wafer 11 and the dicing tape 16. In the wafer having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

FIG. 10 is a top view showing a state in which the wafer holder is removed from the wafer table of FIG.
In FIG. 10, a push-up unit 13 is attached to the Y base 20. A replacement arm 94 is attached to the X base 19 in the vicinity of the push-up unit 13. The exchange arm 94 grips the push-up jig 80 and the like. A jig stocker 95 is attached to the Y base 20, and a push-up jig 80 and measurement jigs 80A, 80B, 80C of the embodiment are set in the jig stocker 95. FIG. 10 shows a state in which the replacement arm 94 grips the push-up jig 80 set in the jig stocker 95.

According to this embodiment, the jig stocker 95 rotates, and the required push-up jig 80 or the like is moved to a position where the replacement arm 94 can easily grasp it. The replacement arm 94 moves the target push-up jig 80 or the like to just above the push-up unit 13 by the X base 19.

The housing 131 rises and coalesces with respect to the push-up jig 80 and the like that have already been removed and stopped directly above the push-up unit 13 that has only the housing 131 and the like. The details of the housing 131 will be described later.

11 is a perspective view of the push-up jig of FIG. 9, FIG. 11 (A) shows a portion of the dome of the push-up jig, and FIG. 11 (B) shows a portion of the adapter. 11 (C) is a perspective view of the dome of FIG. 11 (A) and the adapter of FIG. 11 (B) in a combined state. FIG. 12 is a cross-sectional view of FIG. 11 (C). In FIG. 12, an opening, a suction port, and the like are formed on the upper surface of the dome, and a push-up block and the like are arranged in the opening, but they are omitted. Further, in FIG. 12, a push-up block or the like is provided in the dome, but it is omitted.

In FIG. 11A, a push-up block or the like is housed inside the dome 81. The nut 93 is used when connecting the adapter 91 and the dome 81.

In FIG. 11B, three alignment pins 92 are attached to the adapter 91. The alignment pin 92 is used when transporting the push-up jig 80. As shown in FIG. 8, the alignment pin 92 determines the direction of the push-up block with respect to the direction of the die D arranged in an orderly manner. Therefore, when the replacement arm 94 grips the push-up jig 80, the push-up jig 92 is used. This is to prevent the direction of 80 from being out of order. The push-up shaft 88 is exposed on the upper part of the adapter 91.

In FIGS. 11C and 12, the adapter 91 is connected below the dome 81, and serves as a portion to be connected to the housing described later. The adapter 91 and the dome 81 are connected by a nut 93. The state in which the adapter 91 and the dome 81 are connected is the push-up jig 80. Such a push-up jig 80 or the like is set in the jig stocker 95 shown in FIG.

FIG. 13 is a perspective view of the housing of FIG. FIG. 14 is a cross-sectional view showing a state in which the adapter of FIG. 11 and the housing of FIG. 13 are combined. FIG. 15 is a perspective view showing a state in which the push-up jig of FIG. 11 and the housing of FIG. 13 are combined. In FIG. 14, the configuration inside the adapter 91 is omitted.

In FIG. 13, the housing 131 of the push-up unit 13 is attached to the push-up unit main body (not shown) and serves as a bowl-shaped receiver for inserting the adapter 91 described with reference to FIG. As shown in FIGS. 13 and 14, a ring material 131a provided with a ball-shaped protrusion 131c for locking the adapter 91 inside is further provided on the outer periphery of the housing 131. The ball-shaped protrusions 131c penetrate through the through holes 131b provided in the housing 131 and enter the recesses 91a provided on the outer periphery of the adapter 91. The ring material 131a is supported by a spring 131d, and its position can be flexibly changed until the ball-shaped protrusion 131c enters the through hole 131b of the housing 131 and the recess 91a of the adapter 91.

That is, according to this embodiment, as shown in FIG. 14, when the adapter 91 is inserted into the housing 131, the side wall of the adapter 91 pushes out the ball-shaped protrusion 131c of the ring material 131a. When the adapter 91 is further pushed in, the ball-shaped protrusion 131c enters the recess 91a of the adapter 91 and is locked.

Explaining the docking operation of the adapter 91 and the housing 131, since the vacuum port (not shown) in the dome 81 is blocked, the vacuum pressure rises, and the adapter 91 is sucked into the housing 131 and docked. On the other hand, when the adapter 91 is removed, the inside of the housing 131 is pressurized when the vacuum port is closed, so that the adapter 91 is ejected from the inside of the housing 131.

As described above, according to the present embodiment, the adapter 91 and the housing 131 can be securely locked to maintain the adhesiveness. As a result, as shown in FIG. 15, the dome 81 of the push-up jig 80 and the housing 131 are united via the adapter 91.

FIG. 16 is a perspective view of the replacement arm of FIG.
In FIG. 16, the replacement arm 94 is provided with a notch portion 94a at a position facing the alignment pin 92 attached to the push-up jig 80. The alignment pin 92 is provided for positioning so that the direction of the push-up jig 80 does not change when the replacement arm 94 is moved for gripping from the lateral direction.

It is preferable to support the alignment pin 92 with a spring (not shown) so that the alignment pin 92 can be reliably inserted into the notch portion 94a so that the alignment pin 92 returns to its original position in the notch portion 94a even if it falls down. ..

In addition, in order to enable replacement with the measuring jigs 80A, 80B, 80C instead of the push-up jig, at least the part where the adapter of the measuring jigs 80A, 80B, 80C is connected to the housing 131 and the replacement arm 94 are connected. The shape, structure, and size of the portion to be used are the same as those of the adapter 91. The shape, structure, and size of the entire adapter of the measuring jigs 80A, 80B, and 80C may be the same as those of the adapter 91. It is preferable that the shapes, structures, and sizes of the portions where the dome 81A, 81B, 81C of the measuring jigs 80A, 80B, 80C are connected to the adapters of the measuring jigs 80A, 80B, 80C are the same as those of the push-up jig 80.

Next, the structure of the push-up jig will be described with reference to FIG. FIG. 17 is a cross-sectional view of the dome portion of the push-up jig of FIG.

A plurality of suction ports 82 and a plurality of concentrically formed grooves 83 are provided in the peripheral portion of the upper surface of the dome 81 of the push-up jig 80. When the push-up jig 80 is raised to bring the upper surface of the suction port 82 and the groove 83 into contact with the back surface of the dicing tape 16, the pressure is reduced by a suction mechanism (not shown), and the back surface of the dicing tape 16 is a dome. It is designed to be in close contact with the upper surface of the 81.

At the center of the dome 81, three blocks 84 to 86 that push up the dicing tape 16 upward are incorporated. In the three blocks 84 to 86, an intermediate block 85 having a smaller size is arranged inside the outer block 84 having the largest size, and an inner block 86 having the smallest size is arranged inside the intermediate block 85 having a smaller size. ing.

A gap is provided between the peripheral portion of the upper surface of the dome 81 and the outer block 84, and between the three blocks 84 to 86. The inside of these gaps is depressurized by a suction mechanism (not shown), and when the back surface of the dicing tape 16 comes into contact with the upper surface of the dome 81, the dicing tape 16 is sucked downward and the upper surfaces of the blocks 84 to 86 are formed. Adhere to.

The three blocks 84 to 86 are the first compression coil spring 87a interposed between the outer block 84 and the intermediate block 85, and the first compression coil spring 87a interposed between the intermediate block 85 and the inner block 86. It is connected to the second compression coil spring 87b, which has a larger spring constant than the compression coil spring 87a, and the inner block 86, and moves up and down in conjunction with the push-up shaft 88 that moves up and down by a drive mechanism (not shown). There is.

When the transmitter is housed in the adapters of the measuring jigs 80A, 80B, 80C, for example, a battery-powered wireless microcomputer module (trade name: TWELITE-Twilight (Mono Wireless Co., Ltd.)) or the like is used. Further, when connecting the wiring of the measuring jigs 80A, 80B, 80C and the wiring of the housing 131, for example, it is performed via the push-up shaft 88.

Next, a method of manufacturing a semiconductor device using a die bonder according to an embodiment will be described with reference to FIG. FIG. 18 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG.

First, before the start of production, the pick-up condition is set by measuring the force of peeling the die from the dicing tape with the measuring jig 80A or measuring the peeling state of the die with the measuring jig 80B. Further, the collet is measured and adjusted by the measuring jig 80C.

Step S11: The wafer ring 14 holding the dicing tape 16 to which the dicing tape 16 divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The control unit 7 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14. Further, the substrate S is prepared and carried into the die bonder 10. The control unit 7 mounts the substrate S on the transport lane 52 by the substrate supply unit 6K.

Step S12: The control unit 7 picks up the die D from the dicing tape 16 held on the wafer ring 14.

Step S13: The control unit 7 mounts the picked-up die D on the package area P of the substrate S or stacks the picked-up die D on the die already bonded. More specifically, the control unit 7 places the die D picked up from the dicing tape 16 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and packages the substrate S that has been conveyed. Bond to area P.

Step S14: The control unit 7 moves the board S to the board unloading unit 6H by the board transport claw 51, passes the board S to the board unloading unit 6H, and unloads the board S from the die bonder 10 (board unloading).

After repeating the above steps a predetermined number of times, or when an abnormality is detected, the force of peeling the die from the dicing tape is measured by the measuring jig 80A, or the peeling state of the die is measured by the measuring jig 80B. Set the conditions. Further, the mounting state of the collet is measured and adjusted by the measuring jig 80C.

The invention made by the present inventor has been specifically described above based on the embodiments and examples, but the present invention is not limited to the above embodiments and examples, and can be variously modified. Not to mention.

For example, in the embodiment, an example in which the jig stocker can store four jigs has been described, but the present invention is not limited to this, and for example, two or more and three or less may be used. It may be one or more. Further, although an example in which one push-up jig is stored in the jig stocker has been described, the present invention is not limited to this, and for example, two or more push-up jigs may be stored. In this case, the push-up jig corresponds to a different type.

Further, in the embodiment, a camera (imaging device) or a displacement meter having a lens and an image sensor is used as the measuring tool, and for example, a fingerprint sensor such as an optical fingerprint sensor or a capacitive fingerprint sensor is used for contact. It is also possible to detect even the fine irregularities of the portion and detect the collet mounting state and the shape of the collet (wear, foreign matter adhesion) with high accuracy. Further, a fingerprint sensor may be used for registering and confirming the type of collet when the collet is automatically replaced. Alternatively, a vacuum sensor may be built in to measure the die suction pressure of the collet.

Further, although the confirmation of the collet mounting state and the like has been described in the embodiment, the position, height, and angle of the collet may be automatically adjusted based on the measurement result.

Further, the wireless power supply method may be used for the power supply of the measuring jig and the sensor.

Further, a die bonder may be provided with a plurality of sets of a pickup unit, an alignment unit and a bonding unit, and a plurality of sets of a mounting unit and a transport lane. You may have one.

Further, in the examples, the example of using the die attach film has been described, but it is not necessary to provide the preform portion for applying the adhesive to the substrate and not use the die attach film.

Further, in the embodiment, a die bonder in which the die is picked up from the die supply unit by the pickup head and placed on the intermediate stage, and the die placed on the intermediate stage is bonded to the substrate by the bonding head has been described, but the present invention is limited to this. It is applicable to semiconductor manufacturing equipment that picks up dies from the die supply unit.
For example, it can be applied to a die bonder that does not have an intermediate stage and a pickup head and bonds a die of a die supply unit to a substrate with a bonding head.
Further, there is no intermediate stage, and it can be applied to a flip chip bonder that picks up a die from a die supply unit, rotates the die pickup head upward, delivers the die to the bonding head, and bonds the die to the substrate by the bonding head.
In addition, it does not have an intermediate stage and a bonding head, and can be applied to a die sorter in which a die picked up by a pickup head from a die supply unit is placed on a tray or the like.

10 ... Die bonder 1 ... Die supply unit 12 ... Wafer table 13 ... Push-up unit 131 ... Housing 14 ... Wafer ring 15 ... Expanding ring 16 ... Dicing tape 17 ...・ ・ Support ring 18 ・ ・ ・ Dia-attach film 19 ・ ・ ・ X base 20 ・ ・ ・ Y base 2 ・ ・ ・ Pickup part 21 ・ ・ ・ Pickup head 22 ・ ・ ・ Collet 3 ・ ・ ・ Intermediate stage part 31 ・ ・・ Intermediate stage 4 ・ ・ ・ Bonding unit 41 ・ ・ ・ Bonding head 42 ・ ・ ・ Collet 5 ・ ・ ・ Transfer unit 51 ・ ・ ・ Board transfer claw 7 ・ ・ ・ Control unit 80 ・ ・ ・ Push-up jigs 80A, 80B , 80C ... Measuring jig 81 ... Dome 88 ... Push-up shaft 91 ... Adapter 92 ... Alignment pin 94 ... Replacement arm 95 ... Jig stocker.
D ... Die S ... Board P ... Package area

Claims (15)

A push-up unit that pushes up the die from below and peels it off from the dicing tape,
A die bonding part that attracts the peeled die and bonds it onto the substrate,
With
The push-up unit is
With a push-up jig,
The housing to which the push-up jig is attached and
With
A measuring jig can be attached to and removed from the housing in place of the push-up jig.
The push-up jig has a block for pushing up the dicing tape in the dome.
The measuring jig is a die bonding device that stores measuring equipment in a dome. In the die bonding apparatus of claim 1,
The measuring device is a load cell or an image pickup device or a die bonding device that is a displacement meter. In the die bonding apparatus of claim 2,
The measuring jig in which the load cell is housed further has a block that pushes up the dicing tape, and a die bonding apparatus that measures the force of pushing up the block and peeling the die from the dicing tape as the compressive force of the load cell. .. In the die bonding apparatus of claim 2,
The measuring jig in which the image pickup device is housed is a die bonding device that images the peeled state of the die peeled off by the push-up jig through the dicing tape. In the die bonding apparatus of claim 2,
The measuring jig in which the displacement meter is housed further has a plurality of probes, and the displacement meter is a die bonding device that measures the pushing amount when the suction jig that sucks the die presses the probe. In the die bonding apparatus of claim 2,
The measuring jig is a die bonding apparatus having a transmitter and capable of wirelessly transmitting data measured by the measuring device. In the die bonding apparatus of claim 1,
The push-up jig further comprises an adapter that is connected to the dome and has a push-up shaft that moves the block up and down.
The push-up jig is a die bonding device connected to the housing by the adapter. In the die bonding apparatus of claim 1,
The measuring jig further comprises an adapter connected to the dome.
The measuring jig is a die bonding device connected to the housing by the adapter. In the die bonding apparatus of claim 1, further
A jig stocker for storing the push-up jig and the measuring jig, and
A replacement arm that grips the push-up jig and the measuring jig from the jig stocker, and
With
The replacement arm is a die bonding device that moves the push-up jig and the measuring jig to the upper part of the housing of the push-up unit and replaces them. In the die bonding apparatus of claim 9,
Further, a wafer table for moving the mounted wafer ring in the X direction and the Y direction is provided.
The exchange arm is a die bonding device that moves the push-up jig and the measuring jig to the upper part of the push-up unit by the wafer table. In the die bonding apparatus of claim 9,
The jig stocker is a rotating die bonding device. In the die bonding apparatus of claim 1, further
A pickup head that picks up the die attached to the dicing tape, and
An intermediate stage on which the die picked up by the pickup head is placed, and
A bonding head that bonds the die picked up from the intermediate stage onto a substrate or a die that has already been bonded.
A die bonding device equipped with. (A) The step of preparing the die bonding apparatus according to any one of claims 1 to 11.
(B) A step of carrying in the wafer ring holding the dicing tape and
(C) The process of preparing and carrying in the board and
(D) The process of picking up the die and
(E) A step of bonding the picked-up die onto the substrate or a die that has already been bonded.
A method for manufacturing a semiconductor device. In the method for manufacturing a semiconductor device according to claim 13,
In the step (d), the die attached to the dicing tape is picked up by the bonding head, and the die is picked up by the bonding head.
The step (e) is a method for manufacturing a semiconductor device that bonds a die picked up by the bonding head onto the substrate or a die that has already been bonded. In the method for manufacturing a semiconductor device according to claim 13,
The step (d) is
(D1) A step of picking up the die attached to the dicing tape with a pickup head, and
(D2) A step of placing the die picked up by the pickup head on the intermediate stage, and
Have,
The step (e) is
(E1) A step of picking up the die mounted on the intermediate stage with a bonding head, and
(E2) A step of placing the die picked up by the bonding head on the substrate, and
A method for manufacturing a semiconductor device having.

Images