JP3757900B2 - Electronic component mounting method for electronic component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and electronic component mounting method for mounting an electronic component such as a semiconductor chip accommodated in a component accommodating portion on a substrate. To the law It is related.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device, a semiconductor chip is cut out from a wafer made up of a number of individual chips, and the cut-out individual semiconductor chips are peeled off from the wafer sheet and picked up. In this pick-up process, the position of each semiconductor is detected by recognizing each semiconductor chip with a camera arranged above the wafer sheet. When the semiconductor chip is taken out by the transfer head and mounted on the substrate, the position of the transfer head is adjusted based on the position detection result.
[0003]
By the way, the center of the outer shape of the semiconductor chip and the center of the active surface such as the circuit pattern do not always coincide with each other due to a position error at the time of dicing for cutting the semiconductor wafer into individual pieces, and there is a case where a positional deviation occurs. is there. Since the active surface is based on the active surface accuracy of the mounting position of the semiconductor chip on the substrate, the functional device center position is obtained by detecting the position of the active surface during the above-described semiconductor chip position recognition. It is desirable to align the suction nozzles of the transfer head for the purpose.
[0004]
However, during the pick-up operation in which the upper surface of the semiconductor element is vacuum-sucked by the suction nozzle and taken out, the semiconductor element is likely to be displaced with respect to the suction nozzle, and even if the suction nozzle is aligned with the detected center position of the element, In many cases, the semiconductor element is displaced after the pickup. After the pickup, the active surface of the semiconductor element is hidden by the suction nozzle, so that the element center position cannot be detected again. For this reason, in the conventional electronic component mounting apparatus, if the relative position between the outer shape of the electronic component such as a semiconductor element and the active surface such as the circuit pattern is misaligned, this misalignment directly improves the mounting position accuracy. It was a factor to decrease.
[0005]
[Problems to be solved by the invention]
The problem of this misalignment is that the semiconductor chip is imaged and recognized on the wafer sheet to obtain the relative position between the outer position of the semiconductor chip and the active surface position, and the semiconductor chip is taken out of the wafer sheet by the transfer head. It is possible to solve the problem by imaging / recognizing the image from below, detecting the outer position of the semiconductor chip again, and controlling the driving mechanism of the transfer head based on the outer position and the relative relationship obtained in advance.
[0006]
However, the above-described method requires not only a stable time until the vibration generated in the component supply unit stabilizes during the recognition operation on the wafer sheet in the component supply unit, but may hinder the realization of high-speed mounting.
[0007]
Therefore, the present invention solves the above-described problems and eliminates the waiting time for stabilization during recognition operation in the component supply unit, and realizes high-speed mounting and electronic component mounting apparatus and electronic component mounting method The law The purpose is to provide.
[0008]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is: Wafer sheet In Sticking An electronic component mounting apparatus for taking out an electronic component by a transfer head and mounting the electronic component on a substrate. Wafer sheet A component holding part to be held together, Wafer sheet In Sticking Component map data including electronic component array data, outline position data, and active surface position data In advance The storage unit for storing, the transfer head drive mechanism that moves the transfer head, and the transfer head that moves based on the array data Wafer sheet From Without recognizing A camera that captures an image of the electronic component that has been taken out and held on the active surface side by the transfer head, a recognition unit that detects the external position of the electronic component by recognizing the imaging result of the camera, and the storage unit And a control unit for controlling the transfer head driving mechanism based on the outer shape position data, the active surface position data, and the position detection result by the recognition unit stored in the electronic component.
[0009]
The electronic component mounting method according to claim 2 comprises: Wafer sheet In Sticking An electronic component mounting method for taking out an electronic component that has been taken out by a transfer head and mounting it on a substrate, Wafer sheet In Sticking The step of storing in advance the arrangement data, outer shape position data, and active surface position data of the electronic components in the performed state, and the transfer head that moves based on the arrangement data Wafer sheet From Without recognizing An imaging step of taking an image of the electronic component taken out and held on the active surface side by the transfer head from the back side with a camera, a recognition step of detecting the external position of the electronic component by recognizing the imaging result of this imaging step, By controlling the transfer head drive mechanism that drives the transfer head based on the external position data, the active surface position data, and the position detection result of the recognition process stored in the storage unit, A mounting step of mounting the active surface of the electronic component held by the head on the substrate after aligning the active surface with the substrate.
[0011]
According to the present invention, Adhering to wafer sheet The electronic component array data, outer shape position data, and active surface position data are prepared and stored in advance, and when the electronic component is mounted, the stored position data and the electronic in the state held by the transfer head are stored. Based on the position detection result obtained by recognizing the component, the transfer head driving mechanism for driving the transfer head is controlled to align the active surface of the electronic component held by the transfer head with the substrate. By mounting on the board above, high-speed mounting can be realized by eliminating the waiting time for stability during the recognition operation in the component supply unit.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. 4 is a cross-sectional view of a unit transfer head of a component mounting apparatus, FIG. 4 is a block diagram showing a configuration of an electronic component mapping apparatus according to an embodiment of the present invention, and FIG. 5 is an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 6 and FIG. 7 are process explanatory diagrams of an electronic component mounting method according to an embodiment of the present invention.
[0013]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a component supply unit 2 is disposed on a base 1. The component supply unit 2 includes a holding table 3, and the holding table 3 is a component to which a plurality of semiconductor chips 5 (hereinafter simply abbreviated as “chip 5”), which are electronic components, are attached (accommodated) in a single piece. A wafer sheet 4 serving as a container is held. The wafer sheet 4 is provided with a bar code label 4a for individual identification and a recognition mark 4b for position recognition. The holding table 3 is a wafer holding unit as a component holding unit that holds the chip 5 together with the wafer sheet 4.
[0014]
Here, an example in which the component accommodating portion is a wafer sheet has been described, but the component accommodating portion may be, for example, a tray or a gel pack. However, it is desirable that the component housing portion is a wafer sheet because a large number of electronic components can be housed (attached) in the component housing portion.
[0015]
As shown in FIG. 2, an ejector mechanism 6 is disposed below the holding table 3. The ejector mechanism 6 includes a movable table 6a, and a pin lifting mechanism 7 that lifts and lowers an ejector pin for pushing up a semiconductor chip is attached to the movable table 6a. By driving the movable table 6 a, the pin elevating mechanism 7 moves in the XY direction below the wafer sheet 4.
[0016]
On the side of the component supply unit 2, a substrate carry-in conveyor 8A, a substrate sorting unit 9, a substrate positioning unit 10, a substrate take-out unit 12, and a substrate carry-out conveyor 8B are arranged in series in the X direction. The substrate carry-in conveyor 8A receives the substrate 11 on which the chip 5 is mounted from the upstream side and carries it in. The substrate sorting unit 9 has a configuration in which the transfer conveyor 9a is arranged to be slidable in the Y direction by a slide mechanism 9b, and the substrate 11 received from the substrate carry-in conveyor 8A is mounted in two ways as described below. Selectively distribute to stages.
[0017]
The substrate positioning unit 10 includes two mounting stages 10A and 10B, and positions the substrate 11 distributed by the substrate distribution unit 9 at the mounting position. Similarly to the substrate sorting unit 9, the substrate take-out unit 12 has a configuration in which the conveyor 12a is slidable in the Y direction by the slide mechanism 12b, and the substrate 11 mounted from the two mounting stages 10A and 10B is mounted. This is selectively received and transferred to the substrate carry-out conveyor 8B. The board carry-out conveyor 8B carries the delivered mounted board 11 to the downstream side.
[0018]
At both ends of the upper surface of the base 1, a first Y-axis table 14A and a second Y-axis table 14B are arranged in a direction orthogonal to the substrate transport direction (X direction). A first X-axis table 15A and a second X-axis table 15B are installed on the first Y-axis table 14A and the second Y-axis table 14B. The first X-axis table 15 </ b> A is equipped with a multiple-type transfer head 16 having a plurality of unit transfer heads to be described later, and a substrate recognition camera 17 is transferred adjacent to the transfer head 16. The head 16 is disposed so as to be movable integrally.
[0019]
By driving the first Y-axis table 14A and the first X-axis table 15A, the transfer head 16 and the substrate recognition camera 17 move integrally. The first Y-axis table 14 </ b> A and the first X-axis table 15 </ b> A constitute a transfer head drive mechanism 42 that moves the transfer head 16. The transfer head drive mechanism 42 is controlled by the control unit 40. An electropneumatic regulator 19 that controls the pressure of the air pressure supplied to the unit transfer head, which will be described later, is disposed above the transfer head 16. The electropneumatic regulator 19 adjusts the pressure of the air pressure supplied from the air pressure supply unit as described later by being controlled by the control unit 40.
[0020]
Further, the component recognition camera 18 and the barcode reading head 44 are mounted on the second X-axis table 15B, and the image data of the component recognition camera 18 is read by the barcode reading head 44 into the first recognition unit 41. The data is sent to the barcode reading data processing unit 45, respectively.
[0021]
By driving the second Y-axis table 14B and the second X-axis table 15B, the component recognition camera 18 and the barcode reading head 44 move horizontally in the XY direction. By imaging the recognition mark formation position of the wafer sheet 4 by the component recognition camera 18 located above the component supply unit 2, the recognition mark 4b for wafer position recognition is imaged. The position of the wafer sheet 4 on the holding table 3 is detected by performing recognition processing on the image data obtained by the imaging by the first recognition unit 41, and the position detection result is transmitted to the control unit 40. Note that the recognition mark 4b is not always necessary, and may be omitted as long as the position of the wafer sheet 4 on the holding table 3 can be secured within a certain accuracy by means such as mechanical abutment.
[0022]
Further, by positioning the barcode reading head 44 above the barcode application position, information on the barcode label 4a applied to the wafer sheet 4 is read. The read information is processed by the barcode read data processing unit 45, whereby the individual identification of the wafer sheet is performed. The identification result is transmitted to the control unit 40.
[0023]
A storage unit 46 and a communication unit 47 are connected to the control unit 40. The storage unit 46 stores component map data including the arrangement data of the chips 5, the outer shape position data, and the active surface position data in a state of being attached to the wafer sheet 4. The component map data is created by a mapping device (described later) connected online via the communication unit 47 and stored in the storage unit 46.
[0024]
Next, the structure of the unit transfer head 20 attached to the transfer head 16 will be described with reference to FIG. In FIG. 3, a plurality of unit transfer heads 20 are arranged in parallel on a horizontal common base portion 16a. Here, only two adjacent unit transfer heads 20 are shown. A shaft holding portion 22 is fixed to the lower surface of the base portion 16a, and a slide bearing 25 is attached to the shaft holding portion 22.
[0025]
A nut member 24 is coupled to an elevating shaft 26 that is slidably fitted to the slide bearing 25 in the vertical direction. The nut member 24 is screwed with a feed screw 23 that is rotationally driven by a motor 21 that is disposed perpendicular to the upper surface of the base portion 16a. By driving the motor 21 to rotate, the elevating shaft 26 moves up and down.
[0026]
A nozzle holding portion 30 is coupled to the lower end portion of the elevating shaft 26 via a connecting block 27. A slide bearing 31 is mounted on the nozzle holder 30, and a nozzle shaft 32 is slidably fitted to the slide bearing 31. A diaphragm valve 29 mounted on the upper portion of the nozzle holding portion 30 is in contact with the upper surface of the head portion 32 a of the nozzle shaft 32.
[0027]
The air chamber 29 a of the diaphragm valve 29 communicates with the joint 28 through an inner hole 27 a provided in the connection block 27, and the joint 28 is connected to the air pressure supply unit 37 through the electropneumatic regulator 19. . By supplying air pressure into the air chamber 29a by the air pressure supply unit 37, the diaphragm valve 29 applies a downward load corresponding to the air pressure supplied to the head 32a.
[0028]
At this time, between the lower surface of the head 32 a and the upper surface of the slide bearing 31 in a state where the lower end portion of the nozzle shaft 32 is in contact with the upper surface of the chip 5 as in the right unit transfer head 20 shown in FIG. The downward load generated by the diaphragm valve 29 is transmitted as it is to the nozzle shaft 32 and the chip 5 is pressed against the substrate 11 by lowering the nozzle holding portion 30 so that a slight gap C is generated.
[0029]
The lower portion of the nozzle shaft 32 is a suction nozzle 32b, and a suction hole 32c is formed inside the suction nozzle 32b. The suction hole 32c is connected to a vacuum pump 35 through a joint 33 and a vacuum valve 34. By lowering the suction nozzle 32b on the tip 5 and vacuuming from the suction hole 32c by the vacuum pump 35, The suction nozzle 32b holds the chip 5 by suction. The vacuum valve 34 switches between vacuum suction and suction release by the suction nozzle 32b by connecting and disconnecting a vacuum suction circuit.
[0030]
In the above configuration, the motor 21, the feed screw 23, and the nut member 24 are elevating means for elevating and lowering the nozzle holding portion 30 that holds the nozzle shaft 32 provided with the suction nozzle 32b. The diaphragm valve 29 provided in the nozzle holding unit 30 applies a downward load due to air pressure to the suction nozzle 32b, so that the chip 5 is attached to the substrate 11 via the suction nozzle 32b when the chip 5 is mounted. It is a pressing means to press.
[0031]
Then, air pressure is supplied to each pressing means of the plurality of unit transfer heads 20 by a common air pressure supply unit 37. Here, the chip 5 is mounted on the substrate 11 by controlling the pressure of the air pressure supplied from the air pressure supply unit 37 to each unit transfer head 20 by the electropneumatic regulator 19 controlled by the control unit 40. The mounting load can be changed.
[0032]
Then, air pressure is supplied to each pressing means of the plurality of unit transfer heads 20 by a common air pressure supply unit 37. Here, the mounting load when the chip 5 is mounted on the substrate 11 is changed by controlling the pressure of the pneumatic pressure supplied from the pneumatic pressure supply unit 37 to each unit transfer head 20 by the electropneumatic regulator 19. Be able to.
[0033]
Next, an electronic component mapping apparatus and component map data will be described with reference to FIGS. This mapping apparatus creates position data required when electronic components are mounted in advance by another apparatus for the wafer sheet 4 used in the component supply unit 2 of the electronic component mounting apparatus described above.
[0034]
In FIG. 4, the wafer holding unit 51 includes a holding table 53 that is horizontally moved by an XY table 52, and the holding table 53 holds a wafer sheet 4 to be processed for map creation. Above the wafer holder 51, a camera 54 and a barcode reading head 56, which are imaging means, are disposed.
[0035]
The camera 54 images the chip 5 attached to the wafer sheet 4, and the barcode reading head 56 reads the individual identification barcode applied to the wafer sheet 4. These imaging operations and reading operations are performed by controlling the operation of the XY table 52 by the mechanism control unit 58 and moving the wafer sheet 4 relative to the camera 54 and the barcode reading head 56.
[0036]
The image recognition unit 55 detects the arrangement, outer shape position, and active surface position of the chip 5 in a state of being attached to the wafer sheet 4 by performing recognition processing on image data obtained by imaging. The image recognition unit 55 serves as a recognition unit that obtains the array data, the outer shape position data, and the active surface position data of the chip 5 by recognizing the imaging result of the camera 54.
[0037]
Individual reading of the wafer sheet 4 is performed by processing the reading data of the barcode reading head 56 by the barcode reading data processing unit 57. That is, the barcode reading head 56 and the barcode reading data processing unit 57 serve as identification means for individually identifying the wafer sheet 4 held by the wafer holding unit 51.
[0038]
These array data, outer shape position data, active surface position data, and individual identification results are sent to the mapping control unit 59. Then, the mapping control unit 59 associates the array data, the outer shape position data, and the active surface position data with the individual identification result, so that the array state of the chips 5 on the individual wafer sheet 4, the outer position of each chip 5, Creates part map data including the active surface position in each chip 5. That is, the mapping control unit 59 is map data creation processing means for creating part map data based on the individual identification result by the identification means and the recognition result by the recognition means. The created part map data is stored in the storage device 60.
[0039]
The storage device 60 stores processing programs for map data creation processing, various programs such as created part map data, and data. The display monitor 61 displays an operation screen at the time of data input and an image captured by the camera 54. The key input unit 62 is a keyboard or a pointing device on the display screen, and performs input during operation and teaching. The communication unit 63 transmits the created component map data to the communication unit of the electronic component mounting apparatus via online means. Note that when transmitting the component map data, it is not always necessary to use an online means, and a means of manual input to the electronic component mounting apparatus may be used via a storage medium.
[0040]
Next, the component map data will be described with reference to FIG. FIG. 5A shows the arrangement and position of the chips 5 attached to the wafer sheet 4. A large number of chips 5 are attached to the wafer sheet 4 in a lattice arrangement. However, the positions of the chips 5 on the wafer sheet 4 are not always accurately arranged regularly. That is, the chip 5 is entirely displaced with respect to the position reference of the wafer sheet 4 (here, the recognition mark 4b), or the chip at a specific part is locally irregular due to partial elongation deformation of the wafer sheet 4. There may be a case where a positional deviation has occurred. For this reason, when the chip 5 is taken out, data (array data) for confirming the presence of the chip 5 in the wafer sheet 4 is required.
[0041]
In the present embodiment, the wafer sheet 4 is imaged by the camera 54, and the chip 5 is detected on the image obtained by the imaging, so that array data indicating the presence / absence of the chip 5 and the existing position information is obtained. Yes. As for the chip 5 whose existence has been confirmed, external position data indicating the position of the external center C1 (i) of each chip 5 (i) on the wafer sheet 4 (here, the position coordinates (xi) for one recognition mark 4b. , Yi)).
[0042]
Further, active surface position data is obtained for each chip 5. That is, as shown in FIG. 5B, the active surface center C2 of the chip 5 is detected on the image, and based on the detection result, the positional deviation amount (Δx, Δy) between the outer shape center C1 and the active surface center C2 is detected. Desired. This positional deviation amount (Δx, Δy) is caused by an alignment error or the like in the dicing of the semiconductor wafer.
[0043]
Then, these array data, outer shape position data, and active position data are linked to the individual identification result of the wafer sheet 4 indicated by the barcode label 4a, thereby creating component map data. Therefore, when the wafer sheet 4 is supplied to the electronic component mounting apparatus, the component map data is attached, so that it is not necessary to newly perform position recognition for chip position detection after being mounted on the component supply unit 2. . As long as the correspondence between the wafer sheet 4 and the component map data is known, identification means such as the bar code reading head 56 is not necessarily required. However, the provision of the identification means is preferable because the correspondence between the two becomes clear.
[0044]
That is, when the component is taken out by the transfer head 16, the component map data for the wafer sheet 4 is read from the storage unit 46. Based on the component map data, the transfer head 16 is aligned with the chip 5 to be taken out, and the chip 5 is picked up by the unit transfer head 20. At the time of this pickup, the movable table 6a of the ejector mechanism 6 is driven to similarly align the pin elevating mechanism 7 with the chip 5, and the pin elevating mechanism 7 raises the ejector pin to push the chip 5 from below. Thereby, the chip 5 is peeled from the wafer sheet 4.
[0045]
At this time, a plurality of chips 5 are picked up by a plurality of unit transfer heads of the transfer head 16, whereby a plurality of transfer heads 16 reciprocate between the substrate 11 and the component supply unit 2 in one mounting turn. The chip 5 can be taken out and transferred and mounted on the substrate 11 of the substrate positioning unit 10.
[0046]
A line camera 13 is disposed between the substrate positioning unit 10 and the component supply unit 2, and the transfer head 16 holding the chip taken out from the component supply unit 2 moves in the X direction above the line camera 13. By performing the scanning operation, the chip 5 held on the active surface side by the transfer head 16 is imaged from the back side. The line camera 13 is a second camera that images the chip 5 held on the active surface side by the transfer head 16 from the back surface side. The image data of the line camera 13 is sent to the second recognizing unit 43, and the second recognizing unit 43 recognizes the imaged data to detect the outer positions of these chips 5, and the position detection result is Is transmitted to the control unit 40.
[0047]
When the transfer head 16 that has moved above the substrate 11 performs a mounting operation to move the chip 5 up and down with respect to the substrate 11, the result of detection of the outer position by the second recognition unit 43 and the storage The mounting position is corrected based on the outer shape position data and the active surface position data of the chip 5 stored in the unit 46.
[0048]
The control unit 40 controls the first X-axis table, the first Y-axis table, the ejector mechanism 6 and the substrate positioning unit 10, and the position detection result of the chip 5 by the first recognition unit 41 and the second recognition unit 43. Based on the above, the control unit 40 controls the transfer head drive mechanism 42, the ejector mechanism 6, and the substrate positioning unit 10, thereby aligning the chip 5 in the electronic component mounting operation as will be described later.
[0049]
This electronic component mounting apparatus is configured as described above, and an electronic component mounting method will be described below. In this electronic component mounting method, the wafer sheet 4 that has been subjected to the process of storing component map data in advance by the above-described mapping apparatus is the target. In FIG. 6A, the wafer sheet 4 held on the holding table 3 of the component supply unit 2 is imaged with the recognition mark 4b by the upper component recognition camera 18 to detect the position, and the barcode reading head 44 detects the position. The barcode 4a is read to identify the individual. Based on the individual identification result, the component map data of the wafer sheet 4 is read from the storage unit 46. As a result, the array data, outer shape position data, and active position data of the chips 5 on the wafer sheet 4 are read.
[0050]
Next, the control unit 40 controls the transfer head drive mechanism 42 and the ejector mechanism 6 based on the array position data and the active surface position data of the chip 5, so that each unit transfer head 20 of the transfer head 16 has a suction. The chip 5 is sucked and taken out by the nozzle 32b. At this time, as shown in FIG. 6B, the control unit 40 performs control so that the nozzle center of the transfer head 16 is aligned with the active surface center C <b> 2 of the chip 5.
[0051]
If the upper surface of the chip 5 is sucked by the suction nozzle 32b, the suction nozzle 32b is raised to peel the chip 5 from the wafer sheet 4 as shown in FIG. In this take-out operation, the chip 5 is likely to be displaced with respect to the suction nozzle 32b, and the active surface center C2 and the nozzle center of the suction nozzle 32b do not necessarily coincide with the state after the suction nozzle 32b is raised.
[0052]
Next, the transfer head 16 holding the chip 5 by the suction nozzle 32 b moves above the substrate positioning unit 10. In this movement path, as shown in FIG. 7A, the chip 5 held by the suction nozzle 32b is imaged from the back side by the line camera 13 (imaging process). The external position of the chip 5 is detected by performing recognition processing on the imaging result by the second recognition unit 43 (recognition step).
[0053]
Thereafter, the chip 5 is mounted on the substrate 11. That is, as shown in FIG. 7B, the suction nozzle 32b is lowered onto the substrate 11 on which the resin adhesive is previously applied at the mounting position, and the chip 5 is mounted on the resin adhesive on the substrate 11 (mounting process). In this mounting operation, based on the outer position detection result by the second recognizing unit 43 and the positional deviation amounts (Δx, Δy) between the outer center C1 and the active surface center C2 detected in FIG. 5B. That is, the accurate position of the active surface of the chip 5 held by the suction nozzle 32b is determined based on the outer shape position data and active surface position data of the chip 5 stored in the storage unit 46 and the position detection result of the recognition process. The control unit 40 calculates and controls the transfer head drive mechanism 42.
[0054]
Accordingly, even when the nozzle center of the suction nozzle 32b and the active surface center C2 of the chip 5 are displaced, as shown in FIG. 7C, the displacement between the nozzle center and the active surface position. After correcting the error, the chip 5 can be mounted by correctly aligning the center position of the active surface 5 a with the mounting position of the substrate 11.
[0055]
In the above embodiment, since the electronic component recognition operation on the wafer sheet 4 in the component supply unit 2 is not required, the mechanical vibration generated in the component supply unit 2 in the process of repeating the component extraction operation is static. It is possible to immediately execute the pick-up by the transfer head 16 without requiring a stable time until setting, and to shorten the operation tact time.
[0056]
【The invention's effect】
According to the present invention, arrangement data, outer shape position data, and active surface position data of an electronic component in a state of being attached to a wafer sheet are prepared and stored in advance, and the stored position data is stored when the electronic component is mounted. And a transfer head drive mechanism for driving the transfer head based on the position detection result obtained by recognizing the electronic component held by the transfer head, and the electrons held by the transfer head Since the active surface of the component is aligned with the substrate and then mounted on the substrate, high-speed mounting can be realized by eliminating the waiting time for stability during the recognition operation in the component supply unit.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 3 is a sectional view of a unit transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 4 is a block diagram showing a configuration of an electronic component mapping apparatus according to an embodiment of the present invention.
FIG. 5 is an explanatory diagram of component map data in the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 6 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 7 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
[Explanation of symbols]
2 Parts supply section
5 chips
10 Board positioning part
10A, 10B mounting stage
11 Substrate
13 line camera
16 Transfer head
18 Parts recognition camera
20 unit transfer head
40 Control unit
41 1st recognition part
42 Transfer head drive mechanism
43 Second recognition unit

Claims (2)

The bonded electronic components on the wafer seat an electronic component mounting apparatus for mounting a substrate is taken out by the transfer head, and a component holder for holding the electronic component with the wafer sheet, the state of being adhered to the wafer sheet A storage unit that preliminarily stores component map data including arrangement data of electronic parts, outer shape position data, and active surface position data, a transfer head drive mechanism that moves the transfer head, and movement based on the arrangement data A camera that picks up an electronic component taken from the wafer sheet without performing a recognition operation by the transfer head and holds the active surface side on the transfer head, and an electronic device by recognizing the imaging result of the camera. A recognition unit for detecting the external position of the component, and external position data and active surface position data of the electronic component stored in the storage unit; Finely the position detection by the recognition unit results and the electronic component mounting apparatus characterized by comprising a control unit for controlling the transfer head driving mechanism based on. The bonded electronic components on the wafer seat an electronic component mounting method for mounting a substrate is taken out by the transfer head, sequence data, contour position data and active surface position of the electronic component in a state of being adhered to the wafer sheet A step of storing data in advance, and an electronic component which is taken out from the wafer sheet without performing a recognition operation by the transfer head moving based on the array data and is held on the active surface side by the transfer head by the camera An imaging process for imaging, a recognition process for detecting an external position of the electronic component by recognizing an imaging result of the imaging process, external position data of the electronic component stored in the storage unit, active surface position data, and By controlling the transfer head drive mechanism that drives the transfer head based on the position detection result of the recognition process, Electronic component mounting method which comprises a mounting step of mounting a substrate to the active surface of the electronic component held by the head after having aligned on the substrate.

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