JP2003332364A - Apparatus and method for mounting electronic component and apparatus for mapping the electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component which can realize high-speed mounting, and to provide an apparatus for mapping the component. <P>SOLUTION: The method for mounting the electronic component mounts a chip 5 adhered to a wafer sheet 4 on a board, by taking out the component using a transfer head. The method comprises the steps of previously detecting and storing positional deviations Δx, Δy of the chip 5 from a profile position and an active position in a state with the chip being adhered to the sheet 4; detecting the profile position of the chip 5, by recognizing the chip 5 held at the active surface by a transfer head at a mounting operation time; and controlling a transfer head drive mechanism, based on the profile position detecting result and the stored deviations Δx, Δy, and thereby positioning the active surface of the chip 5 held by the head to the board and mounting the chip 5 on the board. Thus, the recognition operation at a pick-up time in a component supply unit can be omitted, and high-speed mounting can be realized by removing the waiting time at the recognition time. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, an electronic component mounting method, and an electronic component mapping apparatus for mounting an electronic component such as a semiconductor chip in a component accommodating portion on a substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a semiconductor chip is cut out from a wafer composed of a large number of individual chips, and the cut individual semiconductor chips are peeled off from a wafer sheet and picked up. In this pick-up process, the position of each semiconductor is detected by recognizing each semiconductor chip by the camera arranged above the wafer sheet. Then, when the semiconductor chip is taken out by the transfer head and mounted on the substrate, the position of the transfer head is adjusted based on the position detection result.

By the way, the center of the outer shape of the semiconductor chip and the center of the active surface such as a circuit pattern do not always coincide with each other due to factors such as a position error at the time of dicing for cutting the semiconductor wafer into pieces, and a position shift occurs. There is a case. Since the mounting surface accuracy of the semiconductor chip on the substrate is based on the active surface, when recognizing the position of the semiconductor chip described above, the position of the active surface is detected to obtain the functional element center position. It is desirable to align the suction nozzle of the transfer head aiming at this.

However, during pickup operation in which the suction nozzle picks up the upper surface of the semiconductor element by vacuum suction, the semiconductor element is likely to be displaced with respect to the suction nozzle, and the suction nozzle is aligned aiming at the detected element center position. However, the semiconductor element is often in a position shift state after the pickup. After the pickup, since the active surface of the semiconductor element is hidden by the suction nozzle, the center position of the element cannot be detected again. Therefore, in the conventional electronic component mounting apparatus, when the relative position between the outer shape of the electronic component such as a semiconductor element and the active surface such as the circuit pattern is misaligned, this misalignment directly affects the mounting position accuracy. It was a factor that caused the decrease.

[0005]

The problem of this positional deviation is that the semiconductor chip is imaged and recognized on the wafer sheet to determine the relative position between the outer shape position of the semiconductor chip and the active surface position, and the transfer head is used. The semiconductor chip taken out from the wafer sheet is imaged and recognized from below to detect the external position of the semiconductor chip again, and the drive mechanism of the transfer head is controlled based on this external position and the previously determined relative relationship. Can be solved by.

However, in the above-mentioned method, a stable time is required until the vibration generated in the component supply unit at the time of the recognition operation on the wafer sheet in the component supply unit becomes stable, which may hinder the realization of high-speed mounting. .

Therefore, the present invention solves the above-mentioned problems and eliminates the waiting time for stabilizing the recognition operation in the component supply unit, and realizes high-speed mounting, and an electronic component mounting method and an electronic component mounting method. Another object of the present invention is to provide a mapping device for electronic components.

[0008]

An electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus for picking up an electronic component accommodated in a component accommodating portion by a transfer head and mounting it on a substrate. A component holding unit that holds the component together with the component housing unit, a storage unit that stores component map data including array data of the electronic components in the state housed in the component housing unit, outer shape position data, and active surface position data,
The transfer head driving mechanism that moves the transfer head, and the electronic component that is taken out of the component housing and held by the transfer head on the active surface side by the transfer head that moves based on the array data are on the back surface side. A camera that takes images from
A recognition unit that detects the outer shape position of the electronic component by recognizing the imaging result of the camera, and outer shape position data of the electronic component stored in the storage unit, active surface position data, and a position detection result by the recognition unit. And a control unit for controlling the transfer head drive mechanism based on the above.

An electronic component mounting method according to a second aspect of the present invention is an electronic component mounting method for picking up an electronic component housed in a component housing portion by a transfer head and mounting it on a substrate, in a state of being housed in the component housing portion. In advance, storing the array data, outer shape position data, and active surface position data of the electronic components, and holding the active surface side by the transfer head that is taken out from the component housing by the transfer head that moves based on the array data. An imaging step of imaging the formed electronic component from the back side by a camera, a recognition step of detecting an outer shape position of the electronic component by recognizing an imaging result of the imaging step, and a step of recognizing the electronic component stored in the storage unit. A transfer head driving mechanism that drives the transfer head based on the outer shape position data, the active surface position data, and the position detection result of the recognition process. By Gosuru, and a mounting step of mounting a substrate to the active surface of the electronic component held by the transfer head on which are aligned on the substrate.

According to a third aspect of the present invention, there is provided an electronic component mapping apparatus for mapping electronic components for creating component map data including array data, outer shape position data and active surface position data of electronic components in a state of being accommodated in a component accommodating portion. A device, which is a component holding unit that holds the component storage unit,
Image pickup means for picking up an image of the electronic component housed in the component housing portion held by the component holding portion, and recognition processing of the image pickup result by the image pickup means, whereby array data, outer shape position data, and active surface position of the electronic component are obtained. A recognition means for obtaining data and a map data creation processing means for creating the part map data based on the recognition result by the recognition means are provided.

According to the present invention, the arrangement data, the outer shape position data, and the active surface position data of the electronic components in the state of being accommodated in the component accommodating portion are prepared and stored in advance,
During mounting of electronic parts, the transfer head drive mechanism that drives the transfer head is controlled based on the stored position data and the position detection result obtained by recognizing the electronic parts in the state of being held by the transfer head. Then, by mounting the active surface of the electronic component held by the transfer head on the substrate after aligning the active surface with the substrate, the waiting time for stabilizing the recognition operation in the component supply unit is eliminated, High-speed mounting can be realized.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic diagram of an embodiment of the present invention. Sectional view of the unit transfer head of the component mounting apparatus, FIG.
FIG. 5 is a block diagram showing a configuration of an electronic component mapping device according to an embodiment of the present invention, FIG. 5 is an explanatory diagram of component map data in an electronic component mounting device according to an embodiment of the present invention,
6 and 7 are process explanatory diagrams of the electronic component mounting method according to the embodiment of the present invention.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a component supply unit 2 is arranged on a base 1. The component supply unit 2 includes a holding table 3, and the holding table 3 is a component to which a large number of semiconductor chips 5 (hereinafter simply referred to as “chips 5”) that are electronic components are attached (accommodated). It holds the wafer sheet 4 as a housing portion. The wafer sheet 4 is provided with a bar code label 4a for individual identification and a recognition mark 4b for position recognition. The holding table 3 serves as a wafer holding unit as a component holding unit that holds the chip 5 together with the wafer sheet 4.

Although an example in which the component housing portion is a wafer sheet is described here, the component housing portion may be, for example, a tray or a gel pack. However, it is desirable that the component housing portion is a wafer sheet because a large number of electronic components can be housed (attached) in the component housing portion.

As shown in FIG. 2, an ejector mechanism 6 is arranged below the holding table 3. The ejector mechanism 6 is provided with a movable table 6a.
A pin elevating mechanism 7 for elevating the ejector pin for pushing up the semiconductor chip is attached to a. By driving the movable table 6a, the pin lifting mechanism 7 moves in the XY directions below the wafer sheet 4.

A board carry-in conveyor 8A, a board distributing section 9, a board positioning section 10, a board take-out section 12 and a board carry-out conveyor 8B are arranged in series in the X direction beside the component supply section 2. The board carry-in conveyor 8A receives the board 11 on which the chip 5 is mounted from the upstream side and carries it in. The board allocating section 9 has a structure in which the transfer conveyor 9a is slidable in the Y direction by a slide mechanism 9b, and the board 11 received from the board carry-in conveyor 8A is mounted on two board positioning sections to be described below. Selectively distribute to the stage.

The board positioning unit 10 includes two mounting stages 10A and 10B, and positions the board 11 distributed by the board distributing unit 9 at the mounting position. The board take-out section 12 has a structure in which a transfer conveyor 12a is slidable in the Y direction by a slide mechanism 12b, similarly to the board sorting section 9, and the mounted board 11 can be mounted from two mounting stages 10A and 10B. It is selectively received and delivered to the substrate unloading conveyor 8B. The board unloading conveyer 8B carries out the mounted board 11 that has been mounted to the downstream side.

A first Y-axis table 14A and a second Y-axis table 14B are arranged at both ends of the upper surface of the base 1 in a direction orthogonal to the substrate transport direction (X direction). In the first Y-axis table 14A and the second Y-axis table 14B,
First X-axis table 15A, second X-axis table 15B
Has been erected. On the first X-axis table 15A, a multiple-type transfer head 16 including a plurality of unit transfer heads described later is mounted, and a substrate recognition camera 17 is transferred adjacent to the transfer head 16. It is arranged so as to be movable integrally with the head 16.

The transfer head 16 is driven by driving the first Y-axis table 14A and the first X-axis table 15A.
And the board recognition camera 17 moves integrally. The first Y-axis table 14A and the first X-axis table 15A are
A transfer head drive mechanism 42 that moves the transfer head 16 is configured. The transfer head drive mechanism 42 is controlled by the controller 40. Above the transfer head 16, an electropneumatic regulator 19 for controlling the pressure of pneumatic pressure supplied to the unit transfer head, which will be described later, is arranged. Electro-pneumatic regulator 1
9 is adjusted by the control unit 40 to adjust the pressure of the pneumatic pressure supplied from the pneumatic pressure supply unit as described later.

A component recognition camera 18 and a bar code reading head 44 are mounted on the second X-axis table 15B, and the image data of the component recognition camera 18 is stored in the first recognition section 41 in the bar code reading head. The read data of 44 are sent to the barcode read data processing unit 45, respectively.

By driving the second Y-axis table 14B and the second X-axis table 15B, the component recognition camera 18 and the bar code reading head 44 move horizontally in the XY directions. The recognition mark 4b for wafer position recognition is imaged by imaging the recognition mark formation position of the wafer sheet 4 by the component recognition camera 18 located above the component supply unit 2. The position of the wafer sheet 4 on the holding table 3 is detected by recognizing the image data obtained by this imaging by the first recognizing unit 41, and the position detection result is transmitted to the control unit 40. The recognition mark 4b is not always necessary and may be omitted as long as the position of the wafer sheet 4 on the holding table 3 can be secured within a certain accuracy by means such as mechanical butting.

By positioning the bar code reading head 44 above the bar code applying position, the information of the bar code label 4a applied to the wafer sheet 4 can be read. Then, the read information is processed by the bar code read data processing unit 45, whereby the individual identification of the wafer sheet is performed. The identification result is the control unit 40.
Be transmitted to.

A storage unit 46 and a communication unit 47 are connected to the control unit 40. The storage unit 46 is the wafer sheet 4
The component map data including the array data of the chips 5, the outer shape position data, and the active surface position data in the state of being adhered to is stored. The component map data is a mapping device (described later) that is connected online via the communication unit 47.
And is stored in the storage unit 46.

Next, the structure of the unit transfer head 20 mounted on the transfer head 16 will be described with reference to FIG.
In FIG. 3, a plurality of unit transfer heads 20 are arranged in parallel on a horizontal common base portion 16a. Here, only two adjacent unit transfer heads 20 are shown. A shaft holding portion 22 is fixed to the lower surface of the base portion 16a, and a slide bearing 25 is attached to the shaft holding portion 22.

A nut member 24 is connected to an elevating shaft 26 which is slidably fitted in a slide bearing 25 in the vertical direction. A feed screw 23, which is rotationally driven by a motor 21 arranged perpendicularly to the upper surface of the base portion 16a, is screwed into the nut member 24. By rotating the motor 21, the elevating shaft 26 moves up and down.

At the lower end of the lifting shaft 26, the connecting block 2
The nozzle holding unit 30 is connected via 7. A slide bearing 31 is attached to the nozzle holding portion 30,
A nozzle shaft 32 is slidably fitted in the slide bearing 31. On the upper surface of the head 32a of the nozzle shaft 32,
Diaphragm valve 2 mounted on the top of the nozzle holder 30
9 is in contact.

The air chamber 29a of the diaphragm valve 29 is connected to the joint 2 through an inner hole 27a provided in the connecting block 27.
8 and the joint 28 is an electropneumatic regulator 19
Is connected to the air pressure supply unit 37 via. By supplying air pressure into the air chamber 29a by the air pressure supply unit 37, the diaphragm valve 29 exerts a downward load on the head portion 32a according to the air pressure supplied.

At this time, when the lower end of the nozzle shaft 32 is in contact with the upper surface of the tip 5 as in the right unit transfer head 20 shown in FIG. 3, the lower surface of the head portion 32a and the upper surface of the slide bearing 31 are arranged. The downward load generated by the diaphragm valve 29 is transmitted to the nozzle shaft 32 as it is, and the chip 5 is pressed against the substrate 11 by lowering the nozzle holding portion 30 so that a slight gap C is generated between the nozzle 5 and the substrate 11. .

Below the nozzle shaft 32 is a suction nozzle 32b, and inside the suction nozzle 32b is a suction hole 32c.
Are formed. The suction hole 32c is connected to a vacuum pump 35 via a joint 33 and a vacuum valve 34, and the lower end of the suction nozzle 32b is brought into contact with the chip 5 and the vacuum pump 35 sucks vacuum from the suction hole 32c. The suction nozzle 32b holds the chip 5 by suction. The vacuum valve 34 switches between vacuum suction and suction release by the suction nozzle 32b by connecting and disconnecting the vacuum suction circuit.

In the above structure, the motor 21, the feed screw 23 and the nut member 24 serve as an elevating means for elevating and lowering the nozzle holding portion 30 holding the nozzle shaft 32 provided with the suction nozzle 32b. Further, the diaphragm valve 29 provided in the nozzle holding unit 30 applies a downward load due to air pressure to the suction nozzle 32b, so that the chip 5 is attached to the substrate 11 via the suction nozzle 32b when the chip 5 is mounted. It is a pressing means for pressing.

The air pressure is supplied to the pressing means of the plurality of unit transfer heads 20 by the common air pressure supply section 37. Here, the chip 5 is mounted on the substrate 11 by controlling the pressure of the pneumatic pressure supplied from the pneumatic pressure supply unit 37 to each unit transfer head 20 by the electropneumatic regulator 19 controlled by the control unit 40. It is possible to change the mounting load when doing.

A common pneumatic pressure supply unit 37 supplies pneumatic pressure to each pressing means of the plurality of unit transfer heads 20. Here, by controlling the pressure of the pneumatic pressure supplied from the pneumatic pressure supply unit 37 to each unit transfer head 20 by the electropneumatic regulator 19, the chip 5 is transferred to the substrate 11.
It is possible to change the mounting load when mounting to.

Next, referring to FIGS. 4 and 5, the electronic component mapping device and component map data will be described. This mapping apparatus is intended for the wafer sheet 4 used in the component supply unit 2 of the electronic component mounting apparatus described above, and prepares the position data required when the electronic components are mounted by another device in advance.

In FIG. 4, the wafer holding section 51 is provided with a holding table 53 which is horizontally moved by an XY table 52, and the holding table 53 holds the wafer sheet 4 which is the object of map creation processing. A camera 54 and a bar code reading head 56, which are image pickup means, are arranged above the wafer holder 51.

The camera 54 images the chip 5 attached to the wafer sheet 4, and the bar code reading head 56 reads the bar code for individual identification applied to the wafer sheet 4. The imaging operation and the reading operation are performed by controlling the operation of the XY table 52 by the mechanism control unit 58 and moving the wafer sheet 4 relative to the camera 54 and the bar code reading head 56.

The image recognizing section 55 recognizes the arrangement of the chips 5 in the state of being attached to the wafer sheet 4, the outer shape position, and the active surface position by recognizing the image data obtained by the image pickup. The image recognition unit 55 is the camera 5
By recognizing the imaging result by the chip 4, the chip 5
Is a recognition means for obtaining array data, outer shape position data, and active surface position data.

By processing the read data of the bar code reading head 56 by the bar code read data processing unit 57, the individual identification of the wafer sheet 4 is performed. That is, the barcode reading head 56 and the barcode reading data processing unit 57 serve as identification means for individually identifying the wafer sheet 4 held by the wafer holding unit 51.

The array data, outer shape position data, active surface position data, and individual identification result are sent to the mapping controller 59. Then, the mapping controller 59
By associating the array data, the outer shape position data, and the active surface position data with the individual identification result, the arrangement state of the chips 5 on the individual wafer sheet 4, the outer shape position of each chip 5, and further, the active surface of each chip 5. Create parts map data including positions. That is, the mapping control unit 59 serves as map data creation processing means for creating part map data based on the individual identification result by the identification means and the recognition result by the recognition means. The created component map data is stored in the storage device 60.

The storage device 60 stores a processing program for map data creation processing and various programs and data such as created part map data. The display monitor 61 displays an operation screen at the time of data input and an image captured by the camera 54. The key input unit 62 is a keyboard or a pointing device on a display screen, and is used for input during operation or teaching. The communication unit 63 transmits the created component map data to the communication unit of the electronic component mounting apparatus via online means. It should be noted that the transmission of the component map data does not necessarily need to be performed via an online means, but may be performed via a storage medium or manually inputting into the electronic component mounting apparatus.

Next, the component map data will be described with reference to FIG. FIG. 5A shows the arrangement and position of the chips 5 attached to the wafer sheet 4. Although a large number of chips 5 are attached to the wafer sheet 4 in a lattice arrangement, the positions of the chips 5 on the wafer sheet 4 are not always accurately and regularly arranged. That is,
The chip 5 is entirely displaced with respect to the position reference (here, the recognition mark 4b) of the wafer sheet 4, or the chip at a specific portion is locally displaced due to partial extension deformation of the wafer sheet 4. May occur. Therefore, when the chips 5 are taken out, data (array data) for confirming the existence of the chips 5 on the wafer sheet 4 is required.

In the present embodiment, the wafer 54 is imaged by the camera 54, and the chip 5 is detected on the image obtained by the imaging to obtain the array data indicating the presence / absence of the chip 5 and the existence position information. I am trying. For the chips 5 whose existence has been confirmed, outer shape position data indicating the position of the outer shape center C1 (i) of each chip 5 (i) on the wafer sheet 4 (here, position coordinates (xi) with respect to one recognition mark 4b). , Yi)) is required.

Further, active surface position data is obtained for each chip 5. That is, as shown in FIG. 5B, the active surface center C2 of the chip 5 is detected on the image, and based on this detection result, the positional deviation amount (Δx, Δy) between the outer shape center C1 and the active surface center C2 is calculated. Desired. The positional deviation amount (Δx, Δy) is caused by a positioning error in dicing the semiconductor wafer.

Then, the arrangement data, the outer shape position data, and the active position data are linked with the individual identification result of the wafer sheet 4 shown on the bar code label 4a, so that the component map data is created. Therefore,
Since the component map data is attached when the wafer sheet 4 is supplied to the electronic component mounting apparatus, it is not necessary to newly perform the position recognition for the chip position detection after mounting the component on the component supply unit 2. Note that the identification means such as the bar code reading head 56 is not necessarily required as long as the correspondence relationship between the wafer sheet 4 and the component map data is known, but it is preferable to provide the identification means because the correspondence relationship between the two becomes clear.

That is, when the transfer head 16 takes out a component, the component map data for the wafer sheet 4 is read from the storage section 46. Then, the transfer head 16 is aligned with the chip 5 to be taken out based on this component map data, and the chip 5 is picked up by the unit transfer head 20. At the time of this pickup,
The movable table 6a of the ejector mechanism 6 is driven to align the pin elevating mechanism 7 with the tip 5 in the same manner, and the ejector pin is raised by the pin elevating mechanism 7 to raise the tip 5
Push up from below. As a result, the chip 5 is separated from the wafer sheet 4.

At this time, by picking up the plurality of chips 5 by the plurality of unit transfer heads of the transfer head 16, the transfer head 16 makes one reciprocation between the substrate 11 and the component supply section 2 in one mounting turn. , Multiple chips 5
Can be taken out and transferred to and mounted on the substrate 11 of the substrate positioning unit 10.

A line camera 13 is provided between the board positioning unit 10 and the component supply unit 2, and the component supply unit 2 is provided.
The transfer head 16 holding the chip taken out from the device moves in the X direction above the line camera 13 and performs a scanning operation, so that the chip 5 whose active surface side is held by the transfer head 16 is imaged from the back side. It The line camera 13 is a second camera that captures an image of the chip 5 whose active surface side is held by the transfer head 16 from the back surface side. The image data of the line camera 13 is sent to the second recognition unit 43,
By recognizing the imaged data by the recognition unit 43, the outer shape positions of the chips 5 are detected, and the position detection result is transmitted to the control unit 40.

The transfer head 16 moved above the substrate 11.
However, when performing the mounting operation of mounting the chip 5 by moving up and down with respect to the substrate 11, the detection result of the outer shape position by the second recognition unit 43 and the outer shape position of the chip 5 stored in the storage unit 46. The mounting position is corrected based on the data and the active surface position data.

The control unit 40 controls the first X-axis table, the first Y-axis table, the ejector mechanism 6 and the substrate positioning unit 10, and controls the first recognition unit 41 and the second recognition unit 4.
Based on the position detection result of the chip 5 by the controller 3,
0 controls the transfer head drive mechanism 42, the ejector mechanism 6, and the board positioning unit 10, thereby aligning the chip 5 in the electronic component mounting operation, as described later.

This electronic component mounting apparatus is configured as described above, and the electronic component mounting method will be described below.
In this electronic component mounting method, the wafer sheet 4 that has been subjected to the process of storing the component map data in advance by the above-described mapping device is targeted. In FIG. 6A, the wafer mark 4 held on the holding table 3 of the component supply unit 2 is imaged by the component recognition camera 18 above the recognition mark 4 b and the position is detected, and the barcode reading head 44 is used. The bar code 4a is read and identified individually. Then, based on this individual identification result, the component map data of the wafer sheet 4 is read from the storage unit 46. As a result, the array data, outer shape position data, and active position data of the chips 5 on the wafer sheet 4 are read.

Then, the control unit 40 controls the transfer head drive mechanism 42 and the ejector mechanism 6 based on the array position data of the chips 5 and the active surface position data, whereby each unit transfer head 20 of the transfer head 16 is moved. The chip 5 is sucked and taken out by the suction nozzle 32b provided. At this time, as shown in FIG. 6B, the controller 40 controls so that the nozzle center of the transfer head 16 is aligned with the center C2 of the active surface of the chip 5.

Then, the chip 5 is sucked by the suction nozzle 32b.
After the upper surface of the wafer is sucked, as shown in FIG. 6C, the suction nozzle 32b is raised to move the chip 5 onto the wafer sheet 4.
Peel from. In this take-out operation, the chip 5
Is likely to be displaced with respect to the suction nozzle 32b,
In the state after raising the suction nozzle 32b, the center C2 of the active surface and the nozzle center of the suction nozzle 32b do not necessarily coincide.

Next, the chip 5 is sucked by the suction nozzle 32b.
The transfer head 16 holding the above moves to above the substrate positioning unit 10. In this movement path, as shown in FIG. 7A, the chip 5 held by the suction nozzle 32b is imaged from the back side by the line camera 13 (imaging step). The outer shape position of the chip 5 is detected by recognizing the image pickup result by the second recognizing unit 43 (recognizing step).

After that, the chip 5 is mounted on the substrate 11. That is, as shown in FIG. 7B, the suction nozzle 32 is attached to the substrate 11 to which the resin adhesive is applied in advance at the mounting position.
b is lowered and the chip 5 is mounted on the resin adhesive material of the substrate 11 (mounting step). In this mounting operation, based on the outer shape position detection result by the second recognition unit 43 and the positional deviation amount (Δx, Δy) between the outer shape center C1 and the active surface center C2 detected in FIG. 5B. , That is, storage unit 4
Based on the outer shape position data and active surface position data of the chip 5 stored in 6 and the position detection result of the recognition process, the control unit 40 determines the accurate position of the active surface of the chip 5 held by the suction nozzle 32b. The transfer head drive mechanism 42 is calculated and controlled.

As a result, even if the nozzle center of the suction nozzle 32b and the center C2 of the active surface of the chip 5 are displaced, as shown in FIG. It is possible to mount the chip 5 by correcting the position deviation error of (1) and then correctly aligning the center position of the active surface 5a with the mounting position of the substrate 11.

In the above-described embodiment, the component supply unit 2
Since the operation of recognizing the electronic component on the wafer sheet 4 is not required in the above, there is no need for a stable time until the mechanical vibration generated in the component supply unit 2 is settled in the process of repeating the component extraction operation, Pickup by the transfer head 16 can be immediately executed, and the operation takt time can be shortened.

[0056]

According to the present invention, array data, outer shape position data, and active surface position data of electronic components in a state of being adhered to a wafer sheet are prepared and stored in advance, and when the electronic components are mounted, The transfer head driving mechanism that drives the transfer head is controlled based on the stored position data and the position detection result obtained by recognizing the electronic component in the state of being held by the transfer head, and the transfer head is controlled. Since the active surface of the electronic component held on the substrate is aligned with the board before it is mounted on the board, the waiting time for stabilization during recognition operation in the component supply unit is eliminated and high-speed mounting is realized. be able to.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a sectional view of a unit transfer head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a block diagram showing a configuration of an electronic component mapping device according to an embodiment of the present invention.

FIG. 5 is an explanatory diagram of component map data in the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 6 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

FIG. 7 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

[Explanation of symbols]

2 parts supply department 5 chips 10 Board positioning part 10A, 10B mounting stage 11 board 13 line camera 16 Transfer head 18 Parts recognition camera 20 unit transfer head 40 control unit 41 First Recognition Unit 42 Transfer head drive mechanism 43 Second recognition unit

Continued front page    F-term (reference) 5E313 AA03 AA23 CC03 CC04 EE02                       EE03 EE24 EE33 FF24 FF28                       FF33 FG10                 5F031 CA02 CA13 FA05 FA09 GA23                       JA04 JA06 JA22 JA38 JA50                       KA06 MA35 MA40 PA30                 5F047 FA12 FA73 FA75 FA83

Claims (3)

[Claims] 1. An electronic component mounting apparatus for picking up an electronic component accommodated in a component accommodating portion by a transfer head and mounting the electronic component on a substrate, the component accommodating portion retaining the electronic component together with the component accommodating portion, and the component accommodating portion. A storage unit for storing component map data including array data of electronic components, outer shape position data, and active surface position data in a state of being accommodated in the unit;
The transfer head driving mechanism that moves the transfer head, and the electronic component that is taken out of the component housing and held by the transfer head on the active surface side by the transfer head that moves based on the array data are on the back surface side. A camera that takes images from
A recognition unit that detects the outer shape position of the electronic component by recognizing the imaging result of the camera, and outer shape position data of the electronic component stored in the storage unit, active surface position data, and a position detection result by the recognition unit. And a control unit that controls the transfer head drive mechanism based on the above. 2. An electronic component mounting method for picking up an electronic component accommodated in a component accommodating portion by a transfer head and mounting it on a board, wherein the arrangement data and the outer shape position of the electronic component in a state accommodated in the component accommodating portion. A step of pre-storing the data and the active surface position data, and the electronic part taken out of the component housing by the transfer head that moves based on the array data and held on the active surface side by the transfer head by the camera. From the image capturing step, a recognition step of detecting the outer shape position of the electronic component by recognizing the image pickup result of the image capturing step, the outer shape position data of the electronic component stored in the storage unit, the active surface position data, and By controlling the transfer head drive mechanism that drives the transfer head based on the position detection result of the recognition step, the transfer head is retained in the transfer head. Electronic component mounting method characterized by the active surface of the electronic component and a mounting step of mounting a substrate on which is aligned with the substrate. 3. A mapping device for electronic parts, which creates part map data including array data, outer shape position data and active surface position data of electronic parts in a state of being housed in the parts housing part, wherein the parts housing part is provided. A component holding unit for holding, an image pickup unit for picking up an image of an electronic component housed in the component holding unit held by the component holding unit, and recognition processing of an image pickup result by the image pickup unit, array data of the electronic component, An electronic component mapping device comprising: a recognition unit that obtains outer shape position data and active surface position data; and a map data creation processing unit that creates the component map data based on the recognition result by the recognition unit.