JP2009044044A - Method and apparatus for mounting electronic-component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To pick up accurately a miniaturized chip. <P>SOLUTION: A method for mounting electronic-components used when so interlocking the chip present in a wafer-state with the thrusting-up of a needle 17a of an ejector 15 as to suck the chip by a sucking nozzle 8 of a move-mounting head 7 and as to move and mount the chip on a substrate has a step for so sucking by the sucking nozzle 8 a nozzle-position detecting jig 20 to whose top surface a nozzle mark 20a indicating the position of the sucking nozzle 8 is attached as to mount the jig 20 on a wafer-position, and has a step for imaging by a recognizing camera 24 moved by the interlocking with the ejector 15 such a head reference mark 22 provided in a position above the move-mounting head 7 which has the distance nearly equal to the distance between the move-mounting head 7 and the end of the needle 17a as to indicate the position of the move-mounting head 7, and further, has a step for imaging by the recognizing camera 24 after the evacuation of the move-mounting head 7 the nozzle mark 20a present on the nozzle-position detecting jig 20 and left in the wafer-position, and moreover, has a step for seeking the discrepancy between the head reference mark 22 and the nozzle mark 20a, and furthermore, has a step so controlling by considering the discrepancy the position of the ejector 15 that the center of the chip and the center of the sucking nozzle 8 and the center of the needle 17a consist with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method and apparatus for adsorbing a chip in a wafer state by a suction nozzle of a transfer head in conjunction with pushing up by an ejector needle, and transferring and mounting the chip on a substrate. The present invention relates to an electronic component mounting method and apparatus suitable for use in adsorbing from a semiconductor wafer and mounting it on a substrate.

  As described in Patent Document 1, an electronic component mounting apparatus is known in which a semiconductor chip is sucked from a semiconductor wafer and mounted on a substrate. As shown in FIGS. 1 (plan view) and FIG. 2 (side view), an electronic component mounting apparatus described in Patent Document 1 is provided with a transfer head 7 for taking out a semiconductor chip 14a as an electronic component from a semiconductor wafer 14. Moving mechanism (first X-axis table 6 + Y-axis tables 5A, 5B), moving mechanism for component recognition camera 11 (second X-axis table 10 + Y-axis tables 5A, 5B), and a large number of semiconductor chips 14a on semiconductor wafer 14 A drive mechanism (movable table 16 + pin elevating mechanism 17) for ejecting the semiconductor chip 14a from the wafer sheet 13 stuck in a state by a needle 17a to remove the semiconductor chip 14a is provided. Only the position of the semiconductor chip 14a on the wafer 14 is recognized, and the position of the chip obtained from the image data is determined in advance. Based on the coordinate data that is, the control unit is adapted to control the position of the mechanism driving unit. In the figure, 1 is a substrate transport unit, 1a is a transport path, 1b is a chuck mechanism, 2 is a substrate, 3 is a substrate supply unit, and 4 is a component mounting position on the substrate 2 and applies an electronic component bonding paste. A paste application unit, 8 is a suction nozzle, 9 is a substrate recognition camera, 12 is a wafer holding unit for holding a semiconductor chip 14a in a wafer state, and 18 is a wafer stock unit for holding a new semiconductor wafer 14 in standby. .

JP 2003-59955 A

  However, in recent years, the chip size has been reduced, and if the position shift between the center of the suction nozzle 8 and the center of the needle 17a of the ejector 15 is large, a suction error of the semiconductor chip 14a is likely to occur.

  In Patent Document 1, the stop position of the movable table 16 of the ejector 15 and the stop position of the XY movement axes (6, 5A, 5B) of the moving mechanism of the transfer head 7 are images obtained by imaging with the component recognition camera 11. From the data, the control unit controls the position of each drive mechanism unit, and controls the position to a predetermined coordinate position in a predetermined XY coordinate system, thereby positioning the ejector 15 and the transfer head 7. As a result, misalignment occurs due to errors in the coordinate system such as thermal expansion of components and component accuracy at the center of the needle and the center of the suction nozzle, which is an adverse effect for accurately picking up a minute chip. It was.

  The present invention has been made to solve the above-described conventional problems, and it is an object of the present invention to always accurately pick up even a minute electronic component such as a semiconductor chip.

  The present invention relates to an electronic component mounting method for sucking a chip in a wafer state by a suction nozzle of a transfer head in conjunction with pushing up by a needle of an ejector and transferring and mounting the chip on a substrate. The nozzle position detection jig with the mark attached on the top surface is provided at a position that is approximately the same distance as the distance to the needle tip on the transfer head, by sucking it with the suction nozzle and placing it on the wafer position. Further, a procedure for imaging a head reference mark indicating the position of the transfer head by a recognition camera that moves in conjunction with the ejector, and the nozzle position detection jig left on the wafer position by retracting the transfer head The nozzle mark is taken by the recognition camera, the procedure for obtaining the deviation between the head reference mark and the nozzle mark, the center of the chip in consideration of the deviation As nozzle center and the needle centers are identical, by controlling the position of the ejector, by including a step of taking out the chip, and is obtained by solving the above problems.

  In addition, in an electronic component mounting apparatus for picking up a wafer-state chip by a pick-up nozzle of a transfer head in conjunction with a push-up by an ejector needle and transferring and mounting it on a substrate, a nozzle mark indicating the position of the pick-up nozzle is provided. The nozzle position detection jig attached to the upper surface, the head reference mark indicating the position of the transfer head provided at a position substantially the same as the distance to the needle tip on the transfer head, and the ejector And a means for controlling the position of the ejector so that the center of the tip, the center of the nozzle and the center of the needle coincide with each other in consideration of the deviation between the head reference mark and the nozzle mark recognized by the recognition camera. The above-mentioned problem is similarly solved.

  According to the present invention, the same recognition camera recognizes the center of the needle, the center of the chip to be picked up, and the center of the nozzle that sucks the chip, and controls the position of each so that each time the chip is picked up, Since the center of the needle and the center of the chip to be picked up and the center of the nozzle that adsorbs the chip can always coincide with each other accurately, even a small chip can always be picked up accurately.

  In particular, since the head reference mark indicating the position of the transfer head is attached at a position where the distance from the recognition camera at the top of the transfer head is substantially the same as the tip of the ejector needle, the needle and the head reference having different heights are attached. The mark can be recognized with high accuracy by a fixed-focus lens and camera.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  In the embodiment of the electronic component mounting apparatus according to the present invention, as shown in FIG. 3, the wafer state chip (not shown) is moved by the suction nozzle 8 of the transfer head 7 in conjunction with the push-up by the needle 17 a of the ejector 15. In an electronic component mounting apparatus for sucking and mounting on a substrate (not shown), a nozzle position detection jig 20 having a nozzle mark 20a indicating the position of the suction nozzle 8 on the upper surface, and a transfer head 7 A head reference mark 22 indicating the position of the transfer head 7 provided at a position substantially the same as the distance to the tip of the needle and a recognition camera 24 that moves horizontally in conjunction with the ejector 15 are provided. . In the figure, reference numeral 26 denotes a mirror for bending the optical axis of the recognition camera 24 by 90 ° toward the ejector 15, and reference numeral 28 denotes an optical axis bent by the mirror 26 in a direction parallel to the upper surface of the transfer head 7. It is a mirror for bending.

  The nozzle position detection jig 20 may be a hard plate made of, for example, metal or ceramic and provided with a durable nozzle mark 20a that does not deform.

  An example of the visual field 30 of the recognition camera 24 is shown in FIG. The center of the needle 17a and the recognition camera 24 are attached with their positional relations restricted so that they always move in synchronization. Therefore, the needle mark 17b always exists at the approximate center of the visual field 30 of the recognition camera 24.

  The operation will be described below with reference to FIG.

  First, in the state as shown in FIG. 6 where the transfer head 7 is retracted, the position (also referred to as the needle position) of the needle mark 17b at the center in the visual field 30 of the recognition camera 24 is acquired (step 100). In the figure, 25 is the optical axis of the recognition camera 24.

  Next, the nozzle position detection jig 20 is sucked by the suction nozzle 8 (step 110), and as shown in FIG. 3, the transfer head 7 is moved into the field of view of the recognition camera 24 (step 120). 7, the position of the head reference mark (also referred to as a head mark) 22 is acquired (step 130).

  Next, the transfer head 7 is retracted (step 140), and the accurate position of the nozzle tip is obtained by the nozzle mark 20a of the nozzle position detecting jig 20 left on the wafer holding unit 12 as shown in FIG. Step 150). FIG. 9 shows a concept of acquiring correction values for the head position and the suction nozzle tip by using the head mark 22 and the nozzle mark 20a.

  In the production process, as shown in FIG. 10, the position of the semiconductor chip 14a arranged on the semiconductor wafer 14 is acquired by the recognition camera 24, and the center position 14b of the semiconductor chip 14a is determined (step 170).

  Next, the needle 17a is moved to the center position 14b of the semiconductor chip 14a. At this time, the recognition camera 24 also moves in synchronization.

  Next, as shown in FIG. 11, the transfer head 7 is moved within the field of view 30 of the recognition camera 24 after the movement, the head mark 22 is recognized (step 190), and the suction nozzle 8 is placed on the chip center 14 b by the head mark 22. 12, the needle 17a is pushed up at the same time that the semiconductor chip 14a is taken out as shown in FIG. 12 (step 200).

  Thus, within the visual field 30 of the recognition camera 24, the needle center and the tip center 14b are aligned by the movement of the ejector 15, and the tip center 14b and the suction nozzle center are aligned by the movement of the transfer head 7, thereby The center of the tip and the center of the nozzle are aligned on the same axis, so that even a small chip can be accurately picked up.

  In the present embodiment, as shown in FIG. 5, the needle position of the ejector is determined based on data acquired in advance. However, needle position data can be acquired by adding Step 100 after Step 220. It may be performed every time after the chip is taken out during production. In this case, highly accurate needle position correction can be performed.

  In this embodiment, since the mirror 26 is provided, the recognition camera 24 can be placed sideways, and the height can be reduced. The mirror 26 can be omitted and the camera can be placed vertically upward.

  In the above embodiment, the present invention is applied when picking up a semiconductor chip from a semiconductor wafer. However, the application target of the present invention is not limited to this.

The top view which shows the structure of the electronic component mounting apparatus described in patent document 1 Same side view The side view which shows the principal part structure of embodiment of this invention The figure which similarly shows an example of a camera view Flow chart showing processing procedure in the embodiment Side view showing the needle position data acquisition state of the embodiment Side view showing the same head reference mark recognition status Side view showing nozzle mark recognition status The figure which similarly shows the example of the relationship between a head reference mark and a nozzle mark Side view showing the same chip position detection state Side view showing the same head reference mark recognition status Side view showing the same state of chip removal

Explanation of symbols

DESCRIPTION OF SYMBOLS 7 ... Transfer head 8 ... Adsorption nozzle 12 ... Wafer holding part 14 ... Semiconductor wafer 14a ... Semiconductor chip 15 ... Ejector 17 ... Pin raising / lowering mechanism 17a ... Needle 17b ... Needle mark 20 ... Nozzle position detection jig 20a ... Nozzle mark 22 ... Head reference mark 24 ... Recognition camera 26, 28 ... Mirror 30 ... Camera field of view

Claims (2)

In the electronic component mounting method for picking up the wafer-state chip by the suction nozzle of the transfer head in conjunction with the push-up by the ejector needle, and transferring and mounting it on the substrate,
A procedure for adsorbing a nozzle position detection jig with a nozzle mark indicating the position of the adsorption nozzle on the upper surface by adsorbing with the adsorption nozzle and placing it on the wafer position;
A procedure for imaging a head reference mark indicating the position of the transfer head, which is provided at a position substantially the same as the distance to the needle tip on the transfer head, by a recognition camera that moves in conjunction with the ejector;
Retreating the transfer head and imaging the nozzle mark on the nozzle position detection jig left at the wafer position with the recognition camera;
A procedure for obtaining a deviation between the head reference mark and the nozzle mark;
In consideration of the deviation, a procedure for taking out the tip by controlling the position of the ejector so that the center of the tip, the center of the nozzle and the center of the needle coincide with each other;
An electronic component mounting method comprising: In an electronic component mounting apparatus for picking up a chip in a wafer state in conjunction with push-up by an ejector needle, sucking it by a suction nozzle of a transfer head, and transferring and mounting it on a substrate.
A nozzle position detection jig in which a nozzle mark indicating the position of the suction nozzle is attached to the upper surface;
A head reference mark indicating the position of the transfer head provided at a position substantially the same as the distance to the needle tip on the transfer head;
With a recognition camera that moves in conjunction with the ejector,
Means for controlling the position of the ejector so that the center of the tip, the center of the nozzle and the center of the needle coincide with each other in consideration of the deviation between the head reference mark and the nozzle mark recognized by the recognition camera;
An electronic component mounting apparatus comprising:

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