JP2009044044A - Method and apparatus for mounting electronic-component - Google Patents

Method and apparatus for mounting electronic-component Download PDF

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JP2009044044A
JP2009044044A JP2007209261A JP2007209261A JP2009044044A JP 2009044044 A JP2009044044 A JP 2009044044A JP 2007209261 A JP2007209261 A JP 2007209261A JP 2007209261 A JP2007209261 A JP 2007209261A JP 2009044044 A JP2009044044 A JP 2009044044A
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nozzle
needle
center
ejector
chip
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JP5059518B2 (en
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Hiroshi Ogawa
博 小川
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Juki Corp
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Juki Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To pick up accurately a miniaturized chip. <P>SOLUTION: A method for mounting electronic-components used when so interlocking the chip present in a wafer-state with the thrusting-up of a needle 17a of an ejector 15 as to suck the chip by a sucking nozzle 8 of a move-mounting head 7 and as to move and mount the chip on a substrate has a step for so sucking by the sucking nozzle 8 a nozzle-position detecting jig 20 to whose top surface a nozzle mark 20a indicating the position of the sucking nozzle 8 is attached as to mount the jig 20 on a wafer-position, and has a step for imaging by a recognizing camera 24 moved by the interlocking with the ejector 15 such a head reference mark 22 provided in a position above the move-mounting head 7 which has the distance nearly equal to the distance between the move-mounting head 7 and the end of the needle 17a as to indicate the position of the move-mounting head 7, and further, has a step for imaging by the recognizing camera 24 after the evacuation of the move-mounting head 7 the nozzle mark 20a present on the nozzle-position detecting jig 20 and left in the wafer-position, and moreover, has a step for seeking the discrepancy between the head reference mark 22 and the nozzle mark 20a, and furthermore, has a step so controlling by considering the discrepancy the position of the ejector 15 that the center of the chip and the center of the sucking nozzle 8 and the center of the needle 17a consist with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ウェハ状態のチップを、エジェクタのニードルによる突き上げと連動して、移載ヘッドの吸着ノズルにより吸着し、基板に移送搭載するための電子部品実装方法及び装置に係り、特に、半導体チップを半導体ウェハから吸着し、基板へ搭載する際に用いるのに好適な、電子部品実装方法及び装置に関する。   The present invention relates to an electronic component mounting method and apparatus for adsorbing a chip in a wafer state by a suction nozzle of a transfer head in conjunction with pushing up by an ejector needle, and transferring and mounting the chip on a substrate. The present invention relates to an electronic component mounting method and apparatus suitable for use in adsorbing from a semiconductor wafer and mounting it on a substrate.

特許文献1に記載されているように、半導体チップを半導体ウェハから吸着し、基板へ搭載する電子部品実装装置が知られている。特許文献1に記載の電子部品実装装置は、図1(平面図)及び図2(側面図)に示す如く、電子部品である半導体チップ14aを半導体ウェハ14から取り出すために、移載ヘッド7の移動機構(第1のX軸テーブル6+Y軸テーブル5A、5B)、部品認識カメラ11の移動機構(第2のX軸テーブル10+Y軸テーブル5A、5B)、半導体ウェハ14の半導体チップ14aが多数個片状態で貼着されたウェハシート13から、該当する半導体チップ14aをニードル17aにより突き上げて剥がすためのエジェクタ15の駆動機構(可動テーブル16+ピン昇降機構17)を備えており、部品認識カメラ11により半導体ウェハ14上の半導体チップ14aの位置だけを認識し、画像データから得られたチップの位置に対して、予め決められた座標データに基づき、制御部が各機構駆動部の位置制御を行なうようにされている。図において、1は基板搬送部、1aは搬送路、1bはチャック機構、2は基板、3は基板供給部、4は、基板2上の部品実装位置に、電子部品接着用のペーストを塗布するペースト塗布部、8は吸着ノズル、9は基板認識カメラ、12は、ウェハ状態の半導体チップ14aを保持するウェハ保持部、18は、待機中の新たな半導体ウェハ14を保持するウェハストック部である。   As described in Patent Document 1, an electronic component mounting apparatus is known in which a semiconductor chip is sucked from a semiconductor wafer and mounted on a substrate. As shown in FIGS. 1 (plan view) and FIG. 2 (side view), an electronic component mounting apparatus described in Patent Document 1 is provided with a transfer head 7 for taking out a semiconductor chip 14a as an electronic component from a semiconductor wafer 14. Moving mechanism (first X-axis table 6 + Y-axis tables 5A, 5B), moving mechanism for component recognition camera 11 (second X-axis table 10 + Y-axis tables 5A, 5B), and a large number of semiconductor chips 14a on semiconductor wafer 14 A drive mechanism (movable table 16 + pin elevating mechanism 17) for ejecting the semiconductor chip 14a from the wafer sheet 13 stuck in a state by a needle 17a to remove the semiconductor chip 14a is provided. Only the position of the semiconductor chip 14a on the wafer 14 is recognized, and the position of the chip obtained from the image data is determined in advance. Based on the coordinate data that is, the control unit is adapted to control the position of the mechanism driving unit. In the figure, 1 is a substrate transport unit, 1a is a transport path, 1b is a chuck mechanism, 2 is a substrate, 3 is a substrate supply unit, and 4 is a component mounting position on the substrate 2 and applies an electronic component bonding paste. A paste application unit, 8 is a suction nozzle, 9 is a substrate recognition camera, 12 is a wafer holding unit for holding a semiconductor chip 14a in a wafer state, and 18 is a wafer stock unit for holding a new semiconductor wafer 14 in standby. .

特開2003−59955号公報JP 2003-59955 A

しかしながら、近年チップサイズの小型化が進み、吸着ノズル8の中心とエジェクタ15のニードル17aの中心との位置ずれが大きいと、半導体チップ14aの吸着ミスが発生し易くなっている。   However, in recent years, the chip size has been reduced, and if the position shift between the center of the suction nozzle 8 and the center of the needle 17a of the ejector 15 is large, a suction error of the semiconductor chip 14a is likely to occur.

特許文献1では、エジェクタ15の可動テーブル16の停止位置や、移載ヘッド7の移動機構のXY移動軸(6、5A、5B)の停止位置は、部品認識カメラ11の撮像により得られた画像データから、制御部がそれぞれの駆動機構部の位置制御を行ない、予め決められたX−Y座標系の所定の座標位置に位置制御することで、エジェクタ15や移載ヘッド7の位置決めを行なっており、結果的に、ニードル中心と吸着ノズル中心とにおいて、構成部品の熱膨張や部品精度等の座標系の誤差分による位置ずれが発生し、微小なチップを正確にピックアップするための弊害となっていた。   In Patent Document 1, the stop position of the movable table 16 of the ejector 15 and the stop position of the XY movement axes (6, 5A, 5B) of the moving mechanism of the transfer head 7 are images obtained by imaging with the component recognition camera 11. From the data, the control unit controls the position of each drive mechanism unit, and controls the position to a predetermined coordinate position in a predetermined XY coordinate system, thereby positioning the ejector 15 and the transfer head 7. As a result, misalignment occurs due to errors in the coordinate system such as thermal expansion of components and component accuracy at the center of the needle and the center of the suction nozzle, which is an adverse effect for accurately picking up a minute chip. It was.

本発明は、前記従来の問題点を解決するべくなされたもので、半導体チップのような微小な電子部品であっても、常に正確にピックアップできるようにすることを課題とする。   The present invention has been made to solve the above-described conventional problems, and it is an object of the present invention to always accurately pick up even a minute electronic component such as a semiconductor chip.

本発明は、ウェハ状態のチップを、エジェクタのニードルによる突き上げと連動して、移載ヘッドの吸着ノズルにより吸着し、基板に移送搭載するための電子部品実装方法において、吸着ノズルの位置を示すノズルマークが上面に付されたノズル位置検出治具を、吸着ノズルで吸着して、ウェハ位置に載置する手順と、移載ヘッド上の前記ニードル先端迄の距離と略同じ距離の位置に設けられた、移載ヘッドの位置を示すヘッド基準マークを、エジェクタと連動して移動する認識カメラにより撮像する手順と、移載ヘッドを退避して、ウェハ位置に残された前記ノズル位置検出治具上のノズルマークを、前記認識カメラにより撮像する手順と、前記ヘッド基準マークとノズルマークのずれを求める手順と、該ずれを考慮して、チップの中心とノズル中心とニードル中心が一致するように、エジェクタの位置を制御することにより、チップを取り出す手順と、を含むことにより、前記課題を解決したものである。   The present invention relates to an electronic component mounting method for sucking a chip in a wafer state by a suction nozzle of a transfer head in conjunction with pushing up by a needle of an ejector and transferring and mounting the chip on a substrate. The nozzle position detection jig with the mark attached on the top surface is provided at a position that is approximately the same distance as the distance to the needle tip on the transfer head, by sucking it with the suction nozzle and placing it on the wafer position. Further, a procedure for imaging a head reference mark indicating the position of the transfer head by a recognition camera that moves in conjunction with the ejector, and the nozzle position detection jig left on the wafer position by retracting the transfer head The nozzle mark is taken by the recognition camera, the procedure for obtaining the deviation between the head reference mark and the nozzle mark, the center of the chip in consideration of the deviation As nozzle center and the needle centers are identical, by controlling the position of the ejector, by including a step of taking out the chip, and is obtained by solving the above problems.

又、ウェハ状態のチップを、エジェクタのニードルによる突き上げと連動して、移載ヘッドの吸着ノズルにより吸着し、基板に移送搭載するための電子部品実装装置において、吸着ノズルの位置を示すノズルマークが上面に付されたノズル位置検出治具と、移載ヘッド上の前記ニードル先端迄の距離と略同じ距離の位置に設けられた、移載ヘッドの位置を示すヘッド基準マークと、エジェクタと連動して移動する認識カメラとを備え、該認識カメラにより認識したヘッド基準マークとノズルマークのずれを考慮して、チップの中心とノズル中心とニードル中心が一致するように、エジェクタの位置を制御する手段とを備えることにより、同じく前記課題を解決したものである。   In addition, in an electronic component mounting apparatus for picking up a wafer-state chip by a pick-up nozzle of a transfer head in conjunction with a push-up by an ejector needle and transferring and mounting it on a substrate, a nozzle mark indicating the position of the pick-up nozzle is provided. The nozzle position detection jig attached to the upper surface, the head reference mark indicating the position of the transfer head provided at a position substantially the same as the distance to the needle tip on the transfer head, and the ejector And a means for controlling the position of the ejector so that the center of the tip, the center of the nozzle and the center of the needle coincide with each other in consideration of the deviation between the head reference mark and the nozzle mark recognized by the recognition camera. The above-mentioned problem is similarly solved.

本発明によれば、同じ認識カメラで、ニードルの中心と、ピックアップされるチップの中心と、チップを吸着するノズルの中心を認識し、それぞれを位置制御することで、チップのピックアップ時には、毎回、ニードルの中心とピックアップされるチップの中心とチップを吸着するノズルの中心を常に正確に一致させることができるので、微小なチップでも、常に正確にピックアップすることが可能となる。   According to the present invention, the same recognition camera recognizes the center of the needle, the center of the chip to be picked up, and the center of the nozzle that sucks the chip, and controls the position of each so that each time the chip is picked up, Since the center of the needle and the center of the chip to be picked up and the center of the nozzle that adsorbs the chip can always coincide with each other accurately, even a small chip can always be picked up accurately.

特に、移載ヘッド上部の認識カメラからの距離が、エジェクタのニードルの先端と略同じになる位置に、移載ヘッドの位置を示すヘッド基準マークを取り付けたので、高さの異なるニードルとヘッド基準マークを、固定焦点のレンズとカメラで高精度に認識することができる。   In particular, since the head reference mark indicating the position of the transfer head is attached at a position where the distance from the recognition camera at the top of the transfer head is substantially the same as the tip of the ejector needle, the needle and the head reference having different heights are attached. The mark can be recognized with high accuracy by a fixed-focus lens and camera.

以下図面を参照して、本発明の実施形態を詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

本発明に係る電子部品実装装置の実施形態は、図3に示す如く、ウェハ状態のチップ(図示省略)を、エジェクタ15のニードル17aによる突き上げと連動して、移載ヘッド7の吸着ノズル8により吸着し、基板(図示省略)に移送搭載するための電子部品実装装置において、吸着ノズル8の位置を示すノズルマーク20aが上面に付されたノズル位置検出治具20と、移載ヘッド7上の前記ニードル先端迄の距離と略同じ距離の位置に設けられた、移載ヘッド7の位置を示すヘッド基準マーク22と、エジェクタ15と連動して水平移動する認識カメラ24とを備えたものである。図において、26は、認識カメラ24の光軸をエジェクタ15に向けて90°曲げるためのミラー、28は、該ミラー26で曲げられた光軸を、移載ヘッド7の上面と平行な方向に曲げるためのミラーである。   In the embodiment of the electronic component mounting apparatus according to the present invention, as shown in FIG. 3, the wafer state chip (not shown) is moved by the suction nozzle 8 of the transfer head 7 in conjunction with the push-up by the needle 17 a of the ejector 15. In an electronic component mounting apparatus for sucking and mounting on a substrate (not shown), a nozzle position detection jig 20 having a nozzle mark 20a indicating the position of the suction nozzle 8 on the upper surface, and a transfer head 7 A head reference mark 22 indicating the position of the transfer head 7 provided at a position substantially the same as the distance to the tip of the needle and a recognition camera 24 that moves horizontally in conjunction with the ejector 15 are provided. . In the figure, reference numeral 26 denotes a mirror for bending the optical axis of the recognition camera 24 by 90 ° toward the ejector 15, and reference numeral 28 denotes an optical axis bent by the mirror 26 in a direction parallel to the upper surface of the transfer head 7. It is a mirror for bending.

前記ノズル位置検出治具20は、例えば金属やセラミック等の硬い板に、変形しない耐久性のあるノズルマーク20aを付したものとすることができる。   The nozzle position detection jig 20 may be a hard plate made of, for example, metal or ceramic and provided with a durable nozzle mark 20a that does not deform.

前記認識カメラ24の視野30の一例を図4に示す。ニードル17aの中心と認識カメラ24とは、常に同期して移動するように互いの位置関係が拘束されて取付けられている。そのため、常に認識カメラ24の視野30の略中心にニードルマーク17bが存在する。   An example of the visual field 30 of the recognition camera 24 is shown in FIG. The center of the needle 17a and the recognition camera 24 are attached with their positional relations restricted so that they always move in synchronization. Therefore, the needle mark 17b always exists at the approximate center of the visual field 30 of the recognition camera 24.

以下図5を参照して作用を説明する。   The operation will be described below with reference to FIG.

先ず、移載ヘッド7が退避した図6に示すような状態で、認識カメラ24の視野30内の中心にあるニードルマーク17bの位置(ニードル位置とも称する)を取得する(ステップ100)。図において、25は認識カメラ24の光軸である。   First, in the state as shown in FIG. 6 where the transfer head 7 is retracted, the position (also referred to as the needle position) of the needle mark 17b at the center in the visual field 30 of the recognition camera 24 is acquired (step 100). In the figure, 25 is the optical axis of the recognition camera 24.

次いで、ノズル位置検出治具20を吸着ノズル8で吸着し(ステップ110)、図3に示したように、移載ヘッド7を、認識カメラ24の視野内に移動して(ステップ120)、図7に示す如く、ヘッド基準マーク(ヘッドマークとも称する)22の位置を取得する(ステップ130)。   Next, the nozzle position detection jig 20 is sucked by the suction nozzle 8 (step 110), and as shown in FIG. 3, the transfer head 7 is moved into the field of view of the recognition camera 24 (step 120). 7, the position of the head reference mark (also referred to as a head mark) 22 is acquired (step 130).

次いで移載ヘッド7が退避し(ステップ140)、図8に示す如く、ウェハ保持部12上に残されたノズル位置検出治具20のノズルマーク20aにより、ノズル先端の正確な位置を取得する(ステップ150)。ヘッドマーク22とノズルマーク20aにより、ヘッド位置と吸着ノズル先端との補正値を取得する概念を図9に示す。   Next, the transfer head 7 is retracted (step 140), and the accurate position of the nozzle tip is obtained by the nozzle mark 20a of the nozzle position detecting jig 20 left on the wafer holding unit 12 as shown in FIG. Step 150). FIG. 9 shows a concept of acquiring correction values for the head position and the suction nozzle tip by using the head mark 22 and the nozzle mark 20a.

生産工程では、図10に示す如く、半導体ウェハ14上に並んでいる半導体チップ14aの位置を認識カメラ24で取得し、半導体チップ14aの中心位置14bを割り出す(ステップ170)。   In the production process, as shown in FIG. 10, the position of the semiconductor chip 14a arranged on the semiconductor wafer 14 is acquired by the recognition camera 24, and the center position 14b of the semiconductor chip 14a is determined (step 170).

次いで、半導体チップ14aの中心位置14bにニードル17aを移動する。このとき、認識カメラ24も同期して移動する。   Next, the needle 17a is moved to the center position 14b of the semiconductor chip 14a. At this time, the recognition camera 24 also moves in synchronization.

次いで、図11に示す如く、移動後の認識カメラ24の視野30内に移載ヘッド7を移動し、ヘッドマーク22を認識し(ステップ190)、ヘッドマーク22により、チップ中心14bに吸着ノズル8の位置を合わせて、図12に示す如く、吸着ノズル8で吸着すると同時にニードル17aを突き上げて、半導体チップ14aを取り出す(ステップ200)。   Next, as shown in FIG. 11, the transfer head 7 is moved within the field of view 30 of the recognition camera 24 after the movement, the head mark 22 is recognized (step 190), and the suction nozzle 8 is placed on the chip center 14 b by the head mark 22. 12, the needle 17a is pushed up at the same time that the semiconductor chip 14a is taken out as shown in FIG. 12 (step 200).

このように、認識カメラ24の視野30内で、エジェクタ15の移動によりニードル中心とチップ中心14bとを合わせ、移載ヘッド7の移動によりチップ中心14bと吸着ノズル中心を合わせることにより、ニードル中心とチップ中心とノズル中心を同一軸線上に揃え、微小チップであっても、正確にピックアップ動作が行なえる。   Thus, within the visual field 30 of the recognition camera 24, the needle center and the tip center 14b are aligned by the movement of the ejector 15, and the tip center 14b and the suction nozzle center are aligned by the movement of the transfer head 7, thereby The center of the tip and the center of the nozzle are aligned on the same axis, so that even a small chip can be accurately picked up.

本実施形態においては、図5に示したように、事前に取得したデータによりエジェクタのニードル位置を決定していたが、ステップ100をステップ220の後にも追加することにより、ニードル位置データの取得を、生産中にチップ取出し後に毎回行なっても良い。この場合には、高精度のニードル位置補正を行なうことができる。   In the present embodiment, as shown in FIG. 5, the needle position of the ejector is determined based on data acquired in advance. However, needle position data can be acquired by adding Step 100 after Step 220. It may be performed every time after the chip is taken out during production. In this case, highly accurate needle position correction can be performed.

又、本実施形態においては、ミラー26を設けているので、認識カメラ24を横向けに置くことができ、高さを減らすことができる。なお、ミラー26を省略して、カメラを上方に縦向きに置くこともできる。   In this embodiment, since the mirror 26 is provided, the recognition camera 24 can be placed sideways, and the height can be reduced. The mirror 26 can be omitted and the camera can be placed vertically upward.

なお、前記実施形態においては、本発明が、半導体ウェハから半導体チップをピックアップする際に適用されていたが、本発明の適用対象はこれに限定されない。   In the above embodiment, the present invention is applied when picking up a semiconductor chip from a semiconductor wafer. However, the application target of the present invention is not limited to this.

特許文献1に記載された電子部品実装装置の構成を示す平面図The top view which shows the structure of the electronic component mounting apparatus described in patent document 1 同じく側面図Same side view 本発明の実施形態の要部構成を示す側面図The side view which shows the principal part structure of embodiment of this invention 同じくカメラ視野の一例を示す図The figure which similarly shows an example of a camera view 前記実施形態における処理手順を示す流れ図Flow chart showing processing procedure in the embodiment 前記実施形態のニードル位置データ取得状態を示す側面図Side view showing the needle position data acquisition state of the embodiment 同じくヘッド基準マーク認識状態を示す側面図Side view showing the same head reference mark recognition status 同じくノズルマーク認識状態を示す側面図Side view showing nozzle mark recognition status 同じくヘッド基準マークとノズルマークの関係の例を示す図The figure which similarly shows the example of the relationship between a head reference mark and a nozzle mark 同じくチップ位置検出状態を示す側面図Side view showing the same chip position detection state 同じくヘッド基準マーク認識状態を示す側面図Side view showing the same head reference mark recognition status 同じくチップ取出し状態を示す側面図Side view showing the same state of chip removal

符号の説明Explanation of symbols

7…移載ヘッド
8…吸着ノズル
12…ウェハ保持部
14…半導体ウェハ
14a…半導体チップ
15…エジェクタ
17…ピン昇降機構
17a…ニードル
17b…ニードルマーク
20…ノズル位置検出治具
20a…ノズルマーク
22…ヘッド基準マーク
24…認識カメラ
26、28…ミラー
30…カメラ視野
DESCRIPTION OF SYMBOLS 7 ... Transfer head 8 ... Adsorption nozzle 12 ... Wafer holding part 14 ... Semiconductor wafer 14a ... Semiconductor chip 15 ... Ejector 17 ... Pin raising / lowering mechanism 17a ... Needle 17b ... Needle mark 20 ... Nozzle position detection jig 20a ... Nozzle mark 22 ... Head reference mark 24 ... Recognition camera 26, 28 ... Mirror 30 ... Camera field of view

Claims (2)

ウェハ状態のチップを、エジェクタのニードルによる突き上げと連動して、移載ヘッドの吸着ノズルにより吸着し、基板に移送搭載するための電子部品実装方法において、
吸着ノズルの位置を示すノズルマークが上面に付されたノズル位置検出治具を、吸着ノズルで吸着して、ウェハ位置に載置する手順と、
移載ヘッド上の前記ニードル先端迄の距離と略同じ距離の位置に設けられた、移載ヘッドの位置を示すヘッド基準マークを、エジェクタと連動して移動する認識カメラにより撮像する手順と、
移載ヘッドを退避して、ウェハ位置に残された前記ノズル位置検出治具上のノズルマークを、前記認識カメラにより撮像する手順と、
前記ヘッド基準マークとノズルマークのずれを求める手順と、
該ずれを考慮して、チップの中心とノズル中心とニードル中心が一致するように、エジェクタの位置を制御することにより、チップを取り出す手順と、
を含むことを特徴とする電子部品実装方法。
In the electronic component mounting method for picking up the wafer-state chip by the suction nozzle of the transfer head in conjunction with the push-up by the ejector needle, and transferring and mounting it on the substrate,
A procedure for adsorbing a nozzle position detection jig with a nozzle mark indicating the position of the adsorption nozzle on the upper surface by adsorbing with the adsorption nozzle and placing it on the wafer position;
A procedure for imaging a head reference mark indicating the position of the transfer head, which is provided at a position substantially the same as the distance to the needle tip on the transfer head, by a recognition camera that moves in conjunction with the ejector;
Retreating the transfer head and imaging the nozzle mark on the nozzle position detection jig left at the wafer position with the recognition camera;
A procedure for obtaining a deviation between the head reference mark and the nozzle mark;
In consideration of the deviation, a procedure for taking out the tip by controlling the position of the ejector so that the center of the tip, the center of the nozzle and the center of the needle coincide with each other;
An electronic component mounting method comprising:
ウェハ状態のチップを、エジェクタのニードルによる突き上げと連動して、移載ヘッドの吸着ノズルにより吸着し、基板に移送搭載するための電子部品実装装置において、
吸着ノズルの位置を示すノズルマークが上面に付されたノズル位置検出治具と、
移載ヘッド上の前記ニードル先端迄の距離と略同じ距離の位置に設けられた、移載ヘッドの位置を示すヘッド基準マークと、
エジェクタと連動して移動する認識カメラとを備え、
該認識カメラにより認識したヘッド基準マークとノズルマークのずれを考慮して、チップの中心とノズル中心とニードル中心が一致するように、エジェクタの位置を制御する手段と、
を備えたことを特徴とする電子部品実装装置。
In an electronic component mounting apparatus for picking up a chip in a wafer state in conjunction with push-up by an ejector needle, sucking it by a suction nozzle of a transfer head, and transferring and mounting it on a substrate.
A nozzle position detection jig in which a nozzle mark indicating the position of the suction nozzle is attached to the upper surface;
A head reference mark indicating the position of the transfer head provided at a position substantially the same as the distance to the needle tip on the transfer head;
With a recognition camera that moves in conjunction with the ejector,
Means for controlling the position of the ejector so that the center of the tip, the center of the nozzle and the center of the needle coincide with each other in consideration of the deviation between the head reference mark and the nozzle mark recognized by the recognition camera;
An electronic component mounting apparatus comprising:
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