KR101178760B1 - Component transporting method, component transporting apparatus, and component mounting apparatus - Google Patents

Abstract

[Problem] Highly maintain positioning accuracy of a head or the like for pulling out a bare chip.
[Solution] After the bare chip supported on the wafer stage 20 movable only in the Y-axis direction is image-recognized by the moving camera 50, it is subjected to projection by the protrusion head 30 movable only in the X-axis direction. The bare chips are held and conveyed by the wafer heads 42a and 42b. A process of imaging the mark formed on the wafer stage 20 by the mobile camera 50 before this operation, a process of determining the reference coordinate in the X-axis direction when the mobile camera 50 is moved based on the imaging result, The process of imaging the mark formed in the protrusion head 30 by the mobile camera 50, the reference coordinate of the Y-axis direction when moving the mobile camera 50, and the reference coordinate at the time of moving the protrusion head 30 are shown. The process of determining based on the imaging result, and the process of determining the reference coordinate at the time of moving the wafer stage 20 based on the above imaging results are performed.

Description

Component conveying method, component conveying apparatus and component mounting apparatus {COMPONENT TRANSPORTING METHOD, COMPONENT TRANSPORTING APPARATUS, AND COMPONENT MOUNTING APPARATUS}

The present invention relates to a component conveying method, a component conveying apparatus, and a component mounting apparatus including the component conveying apparatus for taking out and conveying a bare chip from a wafer.

Background Art Conventionally, a so-called bare chip mounting device capable of mounting a bare chip from a wafer which has been diced and fixed on a wafer stage, conveys it onto a substrate, and immediately mounts it is known. In addition, a hybrid component mounting apparatus is also known in which components of both bare chips and package components can be mounted on a substrate.

These component mounting apparatuses are provided with the projection device (dolescent head) which makes the bare chip | tip which draws out object out from under a wafer, and the component extraction head for attracting and conveying a bare chip | tip, The said protrusion device As a result, the bare chips are stone-shaped, whereby the bare chips adhering to the wafer sheet are adsorbed by the component drawing head while being separated from the wafer sheet and taken out from the wafer. Therefore, in order to continuously withdraw the bare chip from the wafer with good accuracy, the positioning accuracy of the component drawing head and the like can be secured by periodically correcting the movement error over time due to heat shrinkage or the like of the drive system of the component drawing head. It is necessary. In this regard, for example, Patent Literature 1 includes a camera that moves integrally with a component drawing head, and images two marks formed on a wafer stage that supports a wafer with the camera, and the wafer stage and component drawing is used. The component mounting apparatus which detects the relative positional relationship of a head and a movement error, and performs the correction process of a control system is described.

Japanese Patent Laid-Open No. 2005-277271

According to the conventional apparatus of the said patent document 1, the positioning precision of the component extraction head with respect to a wafer stage (wafer) can be ensured favorably. However, since the projection device also plays an important role in the extraction of the bare chip from the wafer, it is important to secure the positioning accuracy of the projection device relative to the wafer stage (wafer), but this point is not mentioned in Patent Document 1 above. In recent years, the provision of a movable wafer stage has also been considered in view of layout and work efficiency. In this case, since the component extraction head, the projection device, and the wafer stage are individually moved, positioning accuracy of each other is secured. It becomes important. In addition, when the component extraction head, the projection device, and the wafer stage are moved in this manner, a camera is mounted on each of the component extraction heads and the like according to the apparatus of Patent Literature 1, and the common marks are image-recognized by these cameras. It is considered to grasp the positional relationship of. However, it is not economical to mount a camera on each of a plurality of movable elements, such as a component extraction head.

In view of such circumstances, the present invention relates to a component conveying apparatus for extracting and conveying a bare chip from a wafer, and a component mounting apparatus including the same. It aims at achieving these positioning with good precision with a simple structure.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention is a wafer support member which keeps a diced wafer horizontally at a predetermined | prescribed working position, and is movable only in the Y-axis direction parallel to the surface of this wafer, This wafer Recognition of parts that are integrally movable in the Y-axis direction at an upper position of the support member, and are individually movable in the X-axis direction parallel to the surface of the wafer as a direction orthogonal to the Y-axis direction. Bare chips are removed from the wafer using a component mounting apparatus having a camera and a component extraction head and a component protrusion head which is installed to be movable only in the X-axis direction at a position below the wafer support member in the working position. A method of drawing out and conveying to a predetermined position, wherein a bare chip is drawn out of the wafer and conveyed to a predetermined position. The reference coordinate setting which determines a reference | standard position on an XY coordinate plane at the time of moving a said wafer support member, a part protrusion head, and a part recognition camera in this part conveyance process before this part conveyance process, and this component conveyance process, The component conveyance process includes moving the wafer support member in the Y-axis direction so that the bare chip to be drawn out is disposed on a path along which the head for turning the component is moved on an axis parallel to the X-axis direction. And a part imaging step of imaging the bare chip by moving the part recognition camera to the position above the bare chip to be taken out on the axis line, and the part imaging step so that the bare chip to be taken out can be projected. Moving the part protrusion head and the part drawing head, respectively, based on the imaging result A part drawing step of turning the bare chip with the part head for turning, and a part withdrawal conveying step of holding the bare chip formed with the head of the part turning with the head for taking out the part and transporting it to a predetermined position. The reference coordinate setting step includes: a first mark imaging step of imaging the mark formed on the wafer support member by the component recognition camera, and the reference coordinate in the X-axis direction when the component recognition camera is moved; The camera coordinate (X-axis) setting process determined based on the imaging result of the mark imaging process, the 2nd mark imaging process which image | photographs the mark formed in the said head for image projection with the said component recognition camera, and the said wafer support member to be moved Support member coordinates to determine reference coordinates at the time of time based on the imaging result of said 1st, 2nd mark imaging process A camera coordinate (Y-axis) setting step of determining a reference coordinate in the Y-axis direction when moving the part recognition camera, based on the imaging result of the second mark imaging step, and moving the part protrusion head. And a projection head coordinate setting step of determining the reference coordinate at the time of making it based on the imaging result of the said 2nd mark imaging process.

In this method, each mark formed in the wafer support member and the head for component projection is imaged by a part recognition camera, and the respective reference coordinates of the part recognition camera, the wafer support member and the head for component projection are determined based on the imaging result. That is, by imaging and recognizing the mark of the wafer support member by the component recognition camera (first mark imaging process), the relative positional relationship between the component recognition camera and the wafer support member can be grasped, and the component recognition camera can By imaging and recognizing the mark (second mark imaging step), it is possible to grasp the relative positional relationship between the component recognition camera and the head of the component protrusion. In addition, it is possible to grasp the relative positional relationship between the wafer support member and the head of the part protrusion from these imaging results (first and second mark imaging processes). Therefore, according to the method of imaging each mark formed in the wafer support member and the part protrusion head by a component recognition camera as mentioned above, and determining the reference position of the said component recognition camera based on the imaging result, a bare chip | tip In a simple and rational configuration using a common component recognition camera for image recognition, the respective reference coordinates of the component recognition camera, the wafer support member, and the part protrusion head can be determined in relation to each other. By moving a part recognition camera, a wafer support member, and a part protrusion head based on this, mutual positioning accuracy, such as the said part recognition camera, can be maintained highly.

In this method, the reference coordinate setting step includes placing the component protrusion head at a predetermined position, and fitting the fitting portions formed on the component extraction head and the component protrusion head, respectively, to each other in the fitting state. And a drawing head coordinate setting step of obtaining a current position in the X-axis direction and the Y-axis direction of the drawing head, and determining this position as a reference coordinate position of the part drawing head.

According to this method, the component drawing head and the component head are physically related by fitting with the component head, and then the reference coordinates are determined so that the positioning accuracy of the component head and the component drawing head is determined. Is further improved.

In the above part conveying method, a plurality of marks arranged on a circle having a known radius value are formed on the wafer support member as a circle centered on the center position thereof. In the first mark imaging process, the plurality of marks are provided. Two marks are taken by the component recognition camera to obtain the wafer support member center coordinates, and the camera coordinate (X axis) setting step, the camera coordinate (Y axis) setting step, the support member coordinate setting step, and the projection head coordinates. In the setting step, the reference coordinates are preferably set based on the center coordinates.

In this way, when the reference coordinates of the part recognition camera, the wafer support member, and the part protrusion head are determined based on the center of the wafer support member, the positioning accuracy of the part protrusion head or the part recognition camera can be determined within the wafer surface. Can be homogenized.

On the other hand, the component conveying apparatus of this invention is a component conveying apparatus which pulls out a bare chip from a diced wafer, and conveys it so that it may be movable only in the Y-axis direction parallel to a surface of a wafer, holding the said wafer horizontally. A wafer support member driving means for moving the wafer support member in the Y-axis direction within a region including a wafer support member for supporting, a predetermined working position for withdrawing bare chips from the wafer, and a region including the working position. A frame member movably supported only in the Y-axis direction at an upward position, frame drive means for moving the frame member in the Y-axis direction, and an X-axis direction parallel to the surface of the wafer as a direction orthogonal to the Y-axis direction Is supported by the frame member so as to be movable in the Is a part recognition camera, a camera driving means for moving the part recognition camera in the X-axis direction, a part extraction head supported by the frame member so as to enable movement in the X-axis direction, and withdrawing a bare chip from the wafer; A part extraction head driving means for moving a component drawing head in the X-axis direction, the bare chip supported on the wafer support member to be movable only in a direction parallel to the X-axis direction at a position below the working position; A head for a part protrusion for causing the protrusion from the lower side thereof, a head head driving means for moving the head of the part protrusion in the X-axis direction, and a predetermined part conveying step of pulling a bare chip from a wafer and conveying it to a predetermined position; and Prior to the component conveyance process, the wafer support member and component protrusions are used in the component conveyance process. A control means for controlling the respective drive means to execute a reference coordinate setting step of determining a reference position on the XY coordinate plane when the head and the part recognition camera are moved, and the control means includes the component conveyance step. Moves the wafer support member in the Y-axis direction, and arranges a bare chip to be drawn out on an axis line parallel to the X-axis direction on a path in which the head of the part protrusion moves, and the part recognition camera is placed on the axis line. The component stones on the basis of the imaging results of the component imaging process so that the bare chips to be pulled out can be projected to move to the position above the bare chip to be taken out as an image and to image the bare chips. Moving the commercial head and the component extraction head, respectively, to form the bare chip into the component protrusion. A part outgoing step of carrying out a part protrusion with a head and a part pull-out step of carrying the bare chip indented by the head of a part with a head for carrying out to a predetermined position by the head for taking out a part are carried out. First mark imaging process of imaging the mark formed in the wafer support member by the said component recognition camera, and the reference coordinate of the X-axis direction at the time of moving the said component recognition camera is determined based on the imaging result of the said 1st mark imaging process. The camera coordinate (X-axis) setting process, the 2nd mark image pick-up process of imaging the mark formed in the said head for component projections with the said component recognition camera, and the reference coordinate at the time of moving the said wafer support member, The said 1st, 1st The support member coordinate setting process determined based on the imaging result of the 2 mark imaging process, and the said component recognition camera The camera coordinate (Y-axis) setting step of determining the reference coordinate in the Y-axis direction at the time of moving based on the imaging result of the second mark imaging process, and the reference coordinate when moving the head for turning the component. It executes the projection head coordinate setting process determined based on the imaging result of the two-mark imaging process.

According to this component conveyance apparatus, the component conveyance method of Claim 1 mentioned above can be implemented, and conveyance of the bare chip based on the said component conveyance method can be automated.

Moreover, this component conveyance apparatus WHEREIN: The position detection means which can detect the position of the said component drawing head in the said X-axis direction and the Y-axis direction is further provided, The said head for protrusions and the said component taking-out The heads each have fitting portions which can be fitted to each other in the up and down direction, and the control means is adapted to fit the fitting portions in the reference coordinate setting step based on the detection position of the component extraction head by the position detecting means. A drawing head coordinate setting step of determining reference coordinates in the X-axis direction and the Y-axis direction of the component drawing head is further performed.

According to this component conveyance apparatus, the component conveyance method of Claim 2 mentioned above can be implemented, and conveyance of the bare chip based on the said component conveyance method can be automated.

Moreover, in the above-mentioned component conveying apparatus, the said wafer support member is equipped with the several mark arrange | positioned on the circle which has a known radius value as a circle centering on the center position, The said control means is a said, In one-mark imaging process, these marks are imaged with the said component recognition camera, the center coordinate of the said wafer support member is calculated | required, the said camera coordinate (X-axis) setting process, the said camera coordinate (Y-axis) setting process, and the said support In the member coordinate setting step and the projection head coordinate setting step, reference coordinates are set based on the center coordinates, respectively.

According to this component conveyance apparatus, the component conveyance method of Claim 3 mentioned above can be implemented, and conveyance of the bare chip based on the said component conveyance method can be automated.

On the other hand, the component mounting apparatus by this invention is a component mounting apparatus which pulls out a bare chip from a diced wafer, and mounts it on a board | substrate, Comprising: The component carrying apparatus mentioned above is provided in the said component taking-out head of this component carrying apparatus. The bare chip drawn out from the wafer is transferred and mounted on the substrate as it is.

Moreover, the component mounting apparatus which pulls out a bare chip from a diced wafer, and mounts it on a board | substrate, Receives the above-mentioned component conveying apparatus and the bare chip extracted from the said wafer by the said component extracting head of this component conveying apparatus. And a component mounting head for conveying and mounting the bare chip onto the substrate.

According to these component mounting apparatuses, mutual positioning accuracy of a part recognition camera, a wafer support member, and a part protrusion head can be maintained at a high level, thereby smoothly and accurately extracting a bare chip from the wafer, thereby maintaining a high accuracy on the substrate. Can be mounted on

EFFECTS OF THE INVENTION [

As described above, according to the present invention, each reference coordinate of the component recognition camera, the wafer support member, and the component head is related to each other in a simple and reasonable configuration using a common component recognition camera for image recognition of a bare chip. In this way, when the bare chip is taken out from the wafer, positioning of the part recognition camera, the wafer support member, and the part protrusion head can be performed with good accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the whole structure of the component mounting apparatus by this invention.
It is a principal part schematic diagram (perspective view) which shows the structure of a component mounting apparatus.
3 is a block diagram showing a control system of a component mounting apparatus.
4 is a control flowchart of a component mounting operation.
5 is an operation explanatory diagram of a component mounting operation.
6 is a control flowchart of a calibration operation.
7 is a control flowchart of a calibration operation.
8 is a plan view of the main portion of the wafer table.
9 is a sectional view of principal parts showing a head and a head for part protrusion.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described in detail, referring an accompanying drawing.

BRIEF DESCRIPTION OF THE DRAWINGS The whole structure of the component mounting apparatus (part mounting apparatus to which the component conveyance apparatus by this invention is applied) by this invention is shown schematically in plan view. In addition, in order to clarify a directional relationship, the XYZ rectangular coordinate axis is shown in the figure. The X axis direction is a direction parallel to the horizontal plane, the Y axis direction is a direction orthogonal to the X axis direction on the horizontal plane, and the Z axis direction is a direction orthogonal to the X axis and the Y axis, respectively.

The component mounting apparatus shown in this figure can take out bare chips from the diced wafer W and mount (mount) them on the substrate, and also mount package components and the like supplied by the component supply apparatus on the substrate. So-called composite component mounting device.

This component mounting apparatus is a conveyor for carrying in and carrying out printed wiring board P (henceforth board | substrate P) to base 1 and predetermined mounting work position, as shown to the same figure. A pair (2), first and second component supply parts (4, 5), component mounting mechanisms for mounting components on the substrate (P), a wafer accommodating portion (10) in which the diced wafer (W) is accommodated, A wafer support device 12 which pulls out and supports the wafer W from the wafer storage portion 10, and a chip takeout device 14 which pulls out bare chips from the wafer W and passes them to the component mounting mechanism. do. In addition, in this example, the wafer support apparatus 12 and the chip | tip take-out apparatus 14 correspond to the component conveyance apparatus of this invention.

The conveyor pair 2 includes a conveyor body for conveying the substrate P, and a positioning mechanism other than the drawing for lifting and positioning the substrate P on the conveyor body, and the substrate is directed from the right side to the left side of the figure. (P) is conveyed to the X-axis direction in a substantially horizontal attitude | position, and positioning board | substrate P is fixed to a predetermined mounting work position. In this example, the position (position of the board | substrate P in a figure) separated by predetermined space | interval in the X-axis direction on the conveyance path | route by the conveyor pair 2 becomes a mounting work position, respectively. In addition, in the following description, the position of the conveyance direction upstream of the board | substrate P among these mounting operation positions is called a 1st working position and a position of a downstream side suitably as a 2nd working position.

The 1st, 2nd component supply parts 4 and 5 are provided in the position opposite to each other with the said conveyor pair 2 interposed. Specifically, the first component supply part 4 of the component supply parts 4 and 5 is located on the front side (front side of the apparatus: lower side in the drawing) with respect to the conveyor pair 2, and the second component supply part 5 is It is installed in the rear side.

As shown in the same figure, the 1st component supply part 4 is divided | segmented in the X-axis direction, and the wafer accommodating part 10 is arrange | positioned between them. The first component supply unit 4 supplies chip components such as transistors, resistors, condensers, and the like. The first component supply unit 4 is supplied with a component supply device such as a tape feeder 4a, for example, a conveyor pair 2. It is arranged in parallel along. The tape feeder 4a includes a reel in which a tape which houses and holds chip components such as the transistor at predetermined intervals is wound, a holding member for holding the reel, and a component supply position at the feeder tip at the feeder end while taking out the tape from the reel. And a component delivery mechanism for discharging the components, and the following components are continuously introduced into the component supply position as the components are picked up at the component supply position by the latter component mounting heads of the mounting head units 6A and 6B. It is configured to. In addition, the first component supply part 4 may have a tray in which a large package component such as a semiconductor package is stacked in place of the tape feeder 4a. In this case, the component mounting head is directly mounted on the tray by the component mounting head. The package part is picked up.

The second component supply part 5 supplies a bare chip. In this second component supply part 5, the diced wafer W is disposed in the state supported by the wafer support device 12, and the bare chip is taken out by the chip taking-out device 14 from the wafer W. .

The component mounting mechanism mounts the components supplied by the component supply parts 4 and 5 on the substrate P, and is capable of moving in the horizontal direction (XY direction) in the upper position of the conveyor pair 2, respectively. Two mounting head units 6A and 6B (referred to as the first mounting head unit 6A and the second mounting head unit 6B), and driving means for driving them separately.

Of these mounting head units 6A and 6B, the first mounting head unit 6A is movable only within this region using the upstream region mainly including the first working position among the base 1 as the movable region. Done. On the other hand, the 2nd mounting head unit 6B is movable only in this area | region, making the area | region downstream of the upper side of the base 1 mainly containing a 2nd working position as a movable area. Each mounting head unit 6A, 6B has two component mounting heads (not shown) arranged in the X-axis direction, respectively, and the components supplied by the tape feeder 4a are used for these component mounting heads. By the chip taking-out device 14, the bare chip drawn out from the wafer W is sucked by these component mounting heads, and mounted on the substrate P. . As a result, each of the mounting head units 6A and 6B mounts components such as transistors and capacitors and bare chips on the substrate P. As shown in FIG.

Although not shown in detail about each drive means of the mounting head unit 6A, 6B, the said drive means support member 7 which supports the mounting head unit 6A, 6B movably in the X-axis direction, respectively. A combination of a fixed rail for movably supporting the support member 7 in the Y-axis direction, and a motor and a ball screw shaft for moving the mounting head units 6A and 6B in the X-axis direction with respect to the support member 7. And a moving mechanism composed of a combination of a motor and a ball screw shaft for moving the supporting member 7 in the Y-axis direction along the fixed rail.

Moreover, the fixed cameras 66A and 66B for component recognition are arrange | positioned in the movable area of each mounting head unit 6A, 6B on the base 1. As shown in FIG. These fixed cameras 66A and 66B are cameras provided with imaging elements, such as CCD and CMOS, for example, and the components adsorbed by the said component mounting head of each mounting head unit 6A and 6B from the lower side. It picks up and outputs the image signal to the late control apparatus 70. FIG.

The wafer support apparatus 12 draws the wafer W stored in the wafer storage portion 10 into the second component supply portion 5 to support the extraction of the bare chip by the chip extraction apparatus 14. will be.

The wafer support apparatus 12 is a wafer stage 20 (corresponding to the wafer support member of the present invention) for supporting the wafer W, and a pair for supporting this on the base 1 so as to be movable in the Y-axis direction. Fixed rail 22 and drive means (corresponding to the wafer support member drive means of the present invention) for moving the wafer stage 20 along the fixed rail 22. This drive means comprises a ball screw shaft 24 extending in parallel with the fixed rail 22 and screwed into the nut portion of the wafer stage 20, and a stage drive motor 26 for rotationally driving it. do. In this configuration, when the stage drive motor 26 is operated, the wafer stage 20 passes through the lower position of the substrate P supported by the conveyor pair 2 so that the wafer stage 20 has a predetermined component of the second component supply part 5. It moves between a drawing operation position and the wafer receiving position (position shown by the dashed-dotted line in the figure) near the said wafer accommodating part 10. As shown in FIG.

Here, the wafer housing portion 10 accommodates a plurality of diced wafers (W). The wafer accommodating portion 10 includes a rack for accommodating (see FIG. 2) the substantially annular holder Wh in which the wafer W is held in multiple stages up and down, and driving means for elevating and driving the rack. As the rack moves up and down, the desired wafer W is disposed at a predetermined entrance height position that can enter and exit the wafer stage 20. On the other hand, the wafer stage 20 is provided with an access mechanism of the wafer W. As shown in FIG. The entrance mechanism is configured to move the wafer W (holder Wh) in the rack disposed at the entrance height position from the wafer storage portion 10 to the wafer stage (with the wafer stage 20 disposed at the wafer receiving position). It is possible to draw out onto 20) and to accommodate (return) the wafer W on the wafer stage 20 in the rack. Each wafer W accommodated in the wafer accommodating part 10 adheres to the wafer sheet so that the bare chips face up, that is, the circuit formation surface (mounting surface to the substrate P) is upward. It is held by the holder Wh through this wafer sheet.

Thus, the wafer support apparatus 12 arrange | positions the said wafer W in the component extraction operation position of the 2nd component supply part 5, letting the wafer W in and out with respect to the wafer accommodating part 10. As shown in FIG.

Moreover, as shown in FIG. 8, the opening part 20a which penetrates the up-down direction (Z-axis direction) is formed in the center part in the wafer stage 20, and a pair of positioning is formed around this opening 20a. The pins 21a and 21b are installed upright. On the other hand, the holder Wh is formed with a notch portion that can be fitted to these positioning pins 21a and 21b, and the holder Wh has the access mechanism so that the notch portion is fitted to the positioning pins 21a and 21b. The wafer stage 20 is positioned with respect to the wafer stage 20 by being drawn in by the wafer stage 20. Each positioning pin 21a, 21b is provided on a common circumference centering on the center position of the wafer stage 20, that is, the center position of the opening portion 20a, and the wafer W has its center at the wafer. The wafer stage 20 is positioned through the holder Wh and the positioning pins 21a and 21b to coincide with the center position of the stage 20.

As shown in FIG. 1 and FIG. 2, the chip extracting device 14 includes a chip protrusion 14A and a chip conveying device 14B.

This chip protrusion 14A is arranged in the second component supply part 5. The chip protrusions 14A are formed while causing the bare chips to be pulled out from the lower side of the wafers W on the wafer stage 20 arranged at the component take-out working position from the lower side thereof, thereby causing the bare chips to peel off from the wafer sheet. .

This chip protrusion 14A includes a protrusion head 30 having a pair of protrusion pins 32a and 32b (preferably referred to as a first protrusion pin 32a and a second protrusion pin 32b). Corresponds to the component protrusion head of the present invention), a fixed rail 34 for movably supporting it on the base 1 in the X-axis direction, and a protrusion head 30 moving along the fixed rail 34. Drive means (corresponding to the protrusion head drive means of the present invention). This drive means extends in parallel with the fixed rail 34 and is a ball screw shaft other than the drawing which is screwed into the protrusion head 30, and a protrusion head drive motor 36 for rotationally driving it (shown in FIG. 3). And the projection head 30 is moved to an arbitrary position in the X-axis direction with respect to the wafer W supported on the wafer stage 20 by the operation of the projection head drive motor 36.

Each of the protrusion pins 32a and 32b of the protrusion head 30 extends in the vertical direction, and is individually lifted and driven by an actuator (air cylinder or the like) other than the drawing. That is, in the protrusion head 30, the protrusion pins 32a and 32b are driven upward while the protrusion pins 32a and 32b are disposed inside the opening 20a of the wafer stage 20. Stone.

The chip conveying device 14B sucks bare chips protruded by the chip protrusions 14A and exchanges them with the mounting head units 6A and 6B.

The chip conveying apparatus 14B is provided with a chip taking out head unit 40 and a component recognition mobile camera 50 (corresponding to a component recognition camera of the present invention), and these are positioned above the second component supply part 5. Drive means for moving in the horizontal direction (XY direction). This drive means has the following structures.

That is, a pair of expensive fixed rails 52 and these rails 52 which are arranged at a predetermined interval in the X-axis direction and extend parallel to each other in the Y-axis direction at an upper position of the second component supply part 5. Frame member 46, which is movably supported on the X-axis direction, is disposed at a position proximate each fixed rail 52, and extends in the Y-axis direction, and is connected to the nut portion of the frame member 46. A pair of ball screw shafts 54 each screwed in and a pair of frame drive motors 56 for rotationally driving these ball screw shafts 54 are provided. The frame member 46 is provided with a first rail (not shown) fixed to the front side and extending in the X-axis direction, and a second rail (not shown) fixed to the rear side and extending in the X-axis direction, The chip taking-out head unit 40 is supported on the first rail, and the mobile camera 50 is supported on the second rail so as to be movable. A ball screw shaft (not shown) extending in the X-axis direction to the frame member 46 and screwed into the chip extracting head unit 40, and a head unit driving motor 60 for rotationally driving the ball screw shaft. ), A ball screw shaft (not shown) extending in the X-axis direction and screwed into the mobile camera 50, and a camera driving motor 62 for rotationally driving the ball screw shaft. That is, this drive means moves the chip taking-out head unit 40 and the moving camera 50 integrally with the frame member 46 in the Y-axis direction by the operation of the respective frame drive motors 56. Further, by operating the head unit driving motor 60, the chip extracting head unit 40 is moved in the X-axis direction at the position of the front side of the frame member 46, and the camera driving motor 62 is moved. The mobile camera 50 is moved in the X-axis direction at the position on the rear side of the frame member 46 by the operation of. Thereby, the chip taking-out head unit 40 and the mobile camera 50 are movable in the horizontal direction (X-Y direction) in the upper position of the 2nd component supply part 5. In this example, the ball screw shaft 54 and the frame drive motor 56 and the like correspond to the frame drive means of the present invention, and the camera drive motor 62 and the ball screw shaft other than the drawings drive the camera of the present invention. It corresponds to a means, and the head unit drive motor 60, the ball screw shaft etc. which are not shown correspond to the component drawing head drive means of this invention.

The movable area in the XY direction of the chip taking-out head unit 40 and the same movable area of the mounting head units 6A and 6B overlap in part, and as a result, the chip taking-out head unit ( It is possible to exchange bare chips from the 40 to each of the mounting head units 6A and 6B. Further, the chip taking out head unit 40, the mobile camera 50, and the driving means thereof are located below the mounting head units 6A, 6B and their driving means, and thus the chip taking out head unit The movable areas such as 40 and the movable areas of the mounting head units 6A and 6B partially overlap as described above, but the chip taking-out head unit 40 and the mounting head units 6A and 6B interfere with each other. There is nothing to do.

The chip extracting head unit 40 is referred to as a pair of wafer heads 42a and 42b (first wafer head 42a and second wafer head 42b); Corresponds to the component drawing head of the present invention.

These wafer heads 42a and 42b are drum heads. That is, each of the wafer heads 42a and 42b is supported by the frame portion of the chip taking-out head unit 40 so that the wafer heads 42a and 42b can be rotated about an axis parallel to the X-axis direction and can be moved up and down in the vertical direction. A head main body and a pair of nozzles 44 for component adsorption provided on the outer peripheral surface are provided.

Each nozzle 44 of the first wafer head 42a is provided so that the nozzle 44 on the other side faces directly above when the nozzle 44 on the one side is directly opposite, that is, the upper and lower positions thereof. The first wafer head 42a is rotationally driven by the wafer head drive motor 64 to alternately switch the positions of the nozzles 44 according to the rotation. Moreover, the whole 1st wafer head 42a containing the nozzle 44 is lifted by the drive of the drive motor other than a figure. The second wafer head 42b has the same configuration. Moreover, the space | interval (X-axis space | interval) of the nozzles 44 of these wafer heads 42a and 42b is the same space | interval as the space | interval of the said component mounting head mounted in each mounting head unit 6A, 6B. It is. As a result, the bare chips can be simultaneously exchanged with each of the component mounting heads of the first mounting head unit 6A (or the second mounting head unit 6B) from each of the wafer heads 42a and 42b. It is.

The mobile camera 50 is, for example, a camera including an imaging device such as a CCD or a CMOS, and picks up a bare chip to be extracted prior to withdrawing the bare chip from the wafer W and displays the image signal in a later control device. The output is 70. In addition, the mobile camera 50 also performs imaging of a mark or the like on the wafer stage 20 during the calibration process described later.

3 shows a control system of this component mounting apparatus in a block diagram. As shown in the figure, the component mounting apparatus is provided with a control device 70 (corresponding to the control means of the present invention) composed of a CPU, various memories, an HDD, and the like. Each of the motors 26, 36, 56, 60, 62, 64, the mobile camera 50, the fixed cameras 66A, 66B, and the like are electrically connected to the control device 70. Negative operation is collectively controlled by the control device 70. In addition, an input device other than the drawing is electrically connected to the control device 70, and various information by the operator is input based on the operation of the input device. The control device 70 also receives input signals from position detection means such as encoders other than the drawings included in the motors 26, 36, 56, 60, 62, and 64.

This control device 70 is a function element of the shaft control unit 73 for controlling the driving of the respective motors 26, 36, 56, 60, 62, 64 and the respective cameras 50, 66A, 66B. Image processing unit 74 for performing predetermined processing on image signals, I / O processing unit 75 for controlling input of signals from sensors other than the drawings, output of various control signals, and the like, and communication for controlling communication with external devices. Control unit 76, a storage unit 72 for storing various programs such as a mounted program, and various data, and a main operation unit which controls various of these units 72 to 76 and executes various arithmetic processing. It includes (71).

The control device 70 controls the wafer support device 12, the chip taking out device 14, the mounting head units 6A, 6B, and the like, that is, the respective motors 26, 36, 56, 60, 62, 64, etc. are controlled based on a predetermined program to allow the wafer W to enter and exit the wafer storage portion 10, to pull bare chips from the wafer W, and to the mounting head units 6A and 6B. In addition to performing a series of operations (part mounting operations) such as mounting of components, the standard at the time of operation of the wafer stage 20, the projection head 30, the wafer heads 42a and 42b, etc. A calibration operation is performed to correct the reference coordinates.

Hereinafter, the control of the component mounting operation by the control device 70 and the control of the calibration operation will be described. First, the control of the component mounting operation will be described.

FIG. 4 is a flowchart showing control of the component mounting operation by the control device 70, and FIG. 5 is a time series diagram of the component mounting apparatus showing the movement of each part of the component mounting operation according to the flowchart.

When the mounting operation is started, the control device 70 controls the wafer support device 12 to take out the wafer W from the wafer storage portion 10 and arrange it in the second component supply portion 5 (step S1). . Specifically, by driving the stage driving motor 26, the wafer stage 20 is moved to the wafer receiving position, and the wafer W (holder Wh) is moved from the wafer storage portion 10 by the entrance mechanism. After withdrawing onto the stage 20, the wafer stage 20 is moved to the second component supply part 5. Thereby, the wafer W is arrange | positioned at the component extraction work position of the 2nd component supply part 5. At this time, the control device 70 moves the wafer stage 20 so that the bare chips which are to be pulled out among the bare chips in the wafer W are positioned on the moving paths of the protrusion pins 32a and 32b of the protrusion head 30. Move it.

When the wafer W is placed at the component take-out work position, the control device 70 controls the chip transfer device 14B to move the mobile camera 50 to the upper position of the wafer W. FIG. Specifically, by driving the frame drive motor 56, the frame member 46 is moved in the Y-axis direction, and the camera drive motor 62 is driven to move the mobile camera 50 in the Y-axis direction, respectively. The mobile camera 50 is disposed above the bare chip to be the target (adsorption target). The bare chip is imaged by the mobile camera 50, and the position of the bare chip is obtained based on the image data (step S2); 5 (a)]. In this case, the control device 70 picks up a plurality of bare chips with the mobile camera 50 at once or continuously as necessary.

Subsequently, the controller 70 controls the chip taking out device 14 (the chip protrusion 14A and the chip conveying device 14B) and the wafer support device 12 based on the imaging result by the mobile camera 50. Then, the protrusion head 30, the chip taking out head unit 40, and the bare chip to be taken out are positioned to each other (step S3). Specifically, the protrusion head drive motor 36 is driven to move the protrusion head 30 in the X axis direction, and the stage drive motor 26 is driven to move the wafer stage 20 in the Y axis direction. . As a result, the protrusion pins 32a and 32b of the protrusion head 30 are moved to the lower position of the bare chip to be taken out. In addition, by driving the frame drive motor 56, the frame member 46 is moved in the Y-axis direction, and the head unit drive motor 60 is driven to drive the chip extraction head unit 40 in the X-axis direction, respectively. The wafer heads 42a and 42b are thus moved to a position above the bare chip.

Then, the control device 70 drives (raises) the protrusion pins 32a and 32b to raise the bare chip from its lower side and lower the wafer heads 42a and 42b, thereby the bare chip. Is sucked by the nozzle 44 (step S4); Figure 5 (b)]. Thereby, withdrawal of the bare chip from the wafer W is performed.

Subsequently, the control device 70 moves the chip taking out head unit 40 to a predetermined part sending / receiving position by controlling the chip conveying device 14B, and controls the part mounting mechanism to mount the head unit 6A. (Or 6B) is moved to the part transfer position (step S5); 5 (c)]. Thereby, the chip taking-out head unit 40 and the mounting head unit 6A (or 6B) are arranged up and down at the parts exchange position. In addition, the parts exchange position is determined in the movable area of each mounting head unit 6A, 6B, respectively, and the example of FIG. 5 (c) exchanges bare chips with the first mounting head unit 6A. Indicates.

When the chip taking out head unit 40 and the mounting head unit 6A, 6B are disposed at the parts exchange position, the control device 70 rotates the wafer heads 42a and 42b, and accordingly, each nozzle 44 ), The bare chip adsorbed on the back side is inverted (inverted to face down), and then the bare chip is adsorbed by each component mounting head of the mounting head units 6A and 6B (step ( S6)]. As a result, the bare chip is exchanged from the chip taking out head unit 40 to the mounting head units 6A and 6B.

Subsequently, the control device 70 moves the mounting head units 6A and 6B onto the fixed camera 66A, and picks up the bare chip adsorbed to each component mounting head with the fixed camera 66A. In addition, based on the image data, the adsorption deviation of the bare chip with respect to each component mounting head is calculated (step S7); 5 (d)]. And the control apparatus 70 mounts a bare chip on the said board | substrate P by moving mounting head unit 6A, 6B on the board | substrate P, and lowering a component mounting head in a predetermined mounting position. (Steps S8, S9); 5 (e)].

In addition, in this example, the said steps S1 and S2 correspond to the component imaging process of this invention, the step S3 corresponds to the component protrusion process of this invention, and the steps S4 and S5 take out the component of this invention. It corresponds to a conveyance process and the said steps S1-S5 correspond to the component conveyance process of this invention.

As mentioned above, although the control of the component mounting operation | movement by the control apparatus 70 was demonstrated, the control shown to this flowchart is a control example of the most basic component mounting operation. That is, in order to produce the board | substrate P more efficiently at the time of the actual production of the board | substrate P, the control apparatus 70 moves in and out of the wafer W by the wafer support apparatus 12, and the chip taking-out apparatus 14 is carried out. A part of a plurality of operations, such as a pull-out operation | movement of the bare chip | tip by the ()) and the mounting operation of each mounting head unit 6A, 6B, is performed in parallel.

In addition, as described above, the component mounting which pulls out the bare chip from the wafer W by the mutual operation of the wafer stage 20, the projection head 30, the chip taking-out head unit 40, and the mobile camera 50. In the apparatus, maintaining high positioning accuracy in these XY planes becomes important in accurately drawing the bare chip from the wafer W and transferring it to the component mounting head. In this component mounting apparatus, reference coordinates [below (1) to (4)] at the time of controlling the wafer stage 20 and the like in the control XY coordinate system are determined in advance, and the control device 70 uses the reference coordinates as the origin position. The wafer stage 20 or the like is controlled for driving. And the control apparatus 70 is made to perform the calibration operation (corresponding to the reference coordinate setting process of this invention) for correcting this reference coordinate at predetermined timing.

(1) reference coordinate Ya of the wafer stage 20

(2) the reference coordinate (Xb) of the protrusion head 30

(3) reference coordinates (Xc, Yc) of the mobile camera 50

(4) Reference Coordinates of the Chip Extraction Head Unit 40

    Reference coordinates (Xd, Yd, Rd) of the first wafer head 42a

    Reference coordinates (Xe, Ye, Re) of the second wafer head 42b

This calibration operation will be described below.

6 and 7 are flowcharts illustrating control of the calibration operation by the control device 70. This calibration operation is executed regularly (or irregularly) at a pre-programmed timing, for example, before the start of production on that day, but may be executed based on an instruction input operation by an operator.

When this operation control is started, the control apparatus 70 moves the movement camera 50 to the terminal position of the Y-axis direction in the movable area based on the reference coordinate (current coordinate system) currently stored (step ( S11)]. In this example, it moves to the distal position of the apparatus front side (conveyor pair 2 side).

Subsequently, the control device 70 moves the mobile camera to a position where the first mark M1 formed on the wafer stage 20 and the image center (field of view center) of the mobile camera 50 coincide with each other based on the current reference coordinates. 50 and the wafer stage 20 are moved, and the 1st mark M1 is imaged with the moving camera 50 (step S13, S15). At this time, the moving camera 50 moves only in the X-axis direction. In this example, the front end surface of one of the pair of positioning pins 21a and 21b provided on the wafer stage 20 is the first mark M1 (see FIG. 8).

The control device 70 calculates a shift between the image center of the mobile camera 50 and the first mark M1 based on this image data, and, if there is a shift, moves to the position where the shift is eliminated. The wafer stage 20 is moved, and the position coordinates (coordinate x1) of the X-axis direction of the mobile camera 50 at that time and the position coordinates (coordinate y1) of the Y-axis direction of the wafer stage 20 are stored. Steps S17 and S19]. At this time, the control apparatus 70 obtains each coordinate position based on the output from each position detection means of the stage drive motor 26 and the camera drive motor 62. In this example, when there is a deviation between the image center of the mobile camera 50 and the position of the first mark M1, the mobile camera 50 and the wafer stage 20 are actually moved, and the respective position detection means at that time. Although the said coordinate position is calculated | required based on the output from the process, you may of course calculate | require the said coordinate position based on the said image data.

Subsequently, the control apparatus 70 performs the same operation as step S13-step S19 with respect to the 2nd mark M2 formed on the wafer stage 20 based on the present reference | standard coordinate, and the movement at that time The position coordinates (coordinate x2) of the X-axis direction of the camera 50 and the position coordinates (coordinate y2) of the Y-axis direction of the wafer stage 20 are stored (steps S21 to S27). In this example, the front end surface of the pin on the side different from the first mark M1 among the positioning pins 21a and 21b on the wafer stage 20 is the second mark M2 (see FIG. 8).

When the coordinate data of each mark M1, M2 is acquired in this way, the control apparatus 70 based on the coordinate data acquired in step S19, S27, based on the following formula (1) and (2), these marks M1 , Coordinates (X, Y) of the center of the circle where M2 is located, that is, the center of the wafer stage 20 (step S29).

Here, r is a radius value of the circle where the marks M1, M2 (the positioning pins 21a, 21b) are located, and is a predetermined value in design.

When the coordinates of the center position of the wafer stage 20 are obtained, the control device 70 uses the X coordinates as new reference coordinates Xc in the X-axis direction of the moving camera 50 based on the coordinates X and Y. The Y coordinate is determined as the new reference coordinate Ya of the wafer stage 20 (step S31).

Subsequently, the control device 70 moves the mobile camera 50 in the X-axis direction, and arranges the mobile camera 50 at a position where the center of the image and the reference coordinate Xc determined in step S31 coincide. In addition, the wafer stage 20 is moved in the Y-axis direction, and the wafer stage 20 is disposed at a position where the center position coincides with the reference coordinate Ya determined in the step S31 (step S33). ].

Subsequently, the controller 70 moves the protrusion head 30 in the X-axis direction based on the current reference coordinates, and moves the protrusion head 30 to the center position of the first protrusion pin 32a and the wafer stage ( After arrange | positioning the center position of 20 in the X-axis direction, the image of the front end of the 1st protrusion pin 32a is imaged by the moving camera 50 (step S35, S37). Moreover, as shown in FIG. 9, the fitting concave part 33 in which the tip of the nozzle 44 of the chip taking-out head unit 40 can be fitted is formed in the front-end | tip of protrusion pin 32a, 32b, The mark M3 is formed in the nozzle center position of the inner bottom face, and this mark M3 is imaged in the process of step S37. That is, in this embodiment, the nozzle 44 and the fitting recessed part 33 correspond to the fitting part of this invention.

The controller 70 calculates the deviation of the image center of the moving camera 50 from the X-axis direction of the first projection pin 32a (mark M3) based on this image data, and if there is a deviation, the projection head While moving the 30 in the X-axis direction and disposing the protrusion head 30 at the position where the deviation is eliminated, the image center of the moving camera 50 and the Y-axis direction of the first protrusion pin 32a are similarly arranged. When the deviation is obtained, if there is a deviation, the mobile camera 50 is moved in the Y-axis direction and the mobile camera 50 is disposed at the position where the deviation is eliminated (step S39).

And the control apparatus 70 determines the position coordinate of the X-axis direction of the protrusion head 30 at this time as the reference coordinate Xb of the said protrusion head 30, and also the Y-axis direction of the mobile camera 50. The position coordinate of is determined as the reference coordinate Yc in the Y axis direction of the mobile camera 50 (step S41). In addition, the controller 70 moves the moving camera 50 in the deviation correction of the step 39 from the reference coordinate Ya of the wafer stage 20 determined in the processing of the step S31 (Y axis). The coordinate position obtained by subtracting the amount of movement in the direction) is obtained, and the reference position Ya of the wafer stage 20 is determined by correcting the reference coordinate Ya determined in the process of step S31 (step S43). ].

The control device 70 moves the chip taking-out head unit 40 based on the current reference coordinates, and the center of the first wafer head 42a is the first protrusion pin 32a of the protrusion head 30. After arranging the chip taking-out head unit 40 at a position coinciding with the center of the wafer, the nozzle 44 (downward nozzle 44) on one side of the first wafer head 42a is placed on the first protrusion pin 32a. ) Is fitted to the fitting recess 33 (steps S45, S47). In this case, for example, the operator finely adjusts the position of the chip taking-out head unit 40 by instructing the controller 70 so that the nozzle 44 is securely fitted to the fitting recess 33. Also good.

When the fitting of the nozzle 44 to the 1st protrusion pin 32a is completed, the control apparatus 70 will be the coordinate position of the nozzle 44 of the 1st wafer head 42a at that time, and the 1st wafer head ( The rotation angle position (rotation angle position around the axis parallel to the X-axis direction) of 42a is determined as the reference coordinates Xd, Yd, and Rd of the first wafer head 42a (step S49).

Subsequently, the control device 70 is provided with reference position relations of the reference coordinates Xd, Yd, and Rd of the first wafer head 42a and the first and second wafer heads 42a and 42b determined in step S49. Based on this, reference coordinates Xe and Ye in the X-axis and Y-axis directions of the second wafer head 42b are obtained (step S51). Moreover, the control apparatus 70 moves the chip taking-out head unit 40 on the fixed camera other than the figure provided on the base 1, and the nozzle 44 of each wafer head 42a, 42b is moved by this fixed camera. [Nozzle 44 located immediately below] is imaged from the lower side, respectively, and the reference coordinate Re of the rotation angle position of the second wafer head 42b is determined based on the image. Specifically, the rotation angle position of the 2nd wafer head 42b is calculated | required from the shift | offset | difference of the front end position of both nozzles 44, and the value is determined as reference coordinate Re.

In this way, all the reference coordinates of the wafer stage 20, the projection head 30, the mobile camera 50, and the chip taking-out head unit 40 (the first and second wafer heads 42a and 42b) are respectively obtained. Once determined, the control device 70 updates these reference coordinates as new reference coordinates in the storage unit 72 updateably, and ends the series of calibration operations. Accordingly, after the calibration operation, the wafer stage 20 or the like is controlled by the controller 70 based on the updated reference coordinates.

In this example, the steps S15 and S23 correspond to the first mark imaging step of the present invention, step S37 corresponds to the second mark imaging step of the present invention, and step S31 corresponds to the present invention. It corresponds to a camera coordinate (X-axis) setting process, step S41 is corresponded to the camera coordinate (Y-axis) setting process and protrusion head coordinate setting process of this invention, and step S31 and step S43 are this invention. It corresponds to the support member coordinate setting process of S, and steps S45-S49 correspond to the extraction head coordinate setting process.

As described above, the component mounting apparatus draws out the bare chip from the wafer W by the mutual operation of the wafer stage 20, the protrusion head 30, the chip taking-out head unit 40, and the mobile camera 50. Although it conveys to the exchange position of the mounting head unit 6A, 6B, each component, such as the said wafer stage 20, is drive-controlled according to the reference position (reference coordinate) on an XY plane, respectively, but this component mounting apparatus According to the above-described calibration operation, first, marks M1 and M2 of the wafer stage 20 arranged at the component extraction operation position of the second component supply part 5 are recognized by the mobile camera 50, and the wafer stage The coordinates of the center position of the 20 are determined, and the angles of the wafer stage 20, the mobile camera 50, the protrusion head 30, and the chip taking-out head unit 40 are determined based on the coordinates of the center position. By determining the reference coordinate Reference coordinates of components such as the wafer stage 20 are related to each other. Since the calibration operation is periodically (or irregularly) performed to update the reference coordinates of the wafer stage 20 and the like, positioning accuracy in the XY plane of each component such as the wafer stage 20 and the like. Can be maintained at a high level. Therefore, it is possible to continually and accurately perform the operation of accurately exchanging the desired bare chip from the wafer W and exchanging with the mounting head units 6A and 6B without excluding the effects of deterioration over time and thermal deformation of the drive system. Accordingly, there is an effect that can stably produce a high quality substrate (P).

In particular, in the above-described calibration operation (method), the positioning pin 21a on the wafer stage 20 is used by using the mobile camera 50 for image recognition of the bare chip at the time of withdrawing the bare chip from the wafer W. 21b) (marks M1, M2) and image pickup of the mark M3 formed on the protrusion pins 32a, 32b, and the wafer stage 20 and the protrusion head 30 as described above. Since the respective reference coordinates of the chip taking out head unit 40 and the mobile camera 50 are determined, there is no need to set a jig or the like at the part taking out position for the calibration operation, and thus the production of the substrate P. There is an advantage in that a calibration operation can be simply performed in between.

In addition, in this component mounting apparatus, as described above, each reference position of the wafer stage 20, the projection head 30, the chip taking-out head unit 40, and the mobile camera 50 is the center position of the wafer stage 20, That is, since the determination is made on the basis of the center position of the wafer W supported by the wafer stage 20, the accuracy of the protrusion of the bare chip by the protrusion head 30 and the extraction of the bare chip by the chip extraction head unit 40 are determined. Precision becomes more uniform in the wafer surface. Therefore, this component mounting apparatus has an advantage that the bare chip can be taken out from the wafer W accurately or reliably.

By the way, the component mounting apparatus of this invention demonstrated above is an illustration of the preferable embodiment of this invention, The concrete structure and the specific method and operation of the said calibration performed in this component mounting apparatus are the range which does not deviate from the summary of this invention. Can be changed as appropriate.

For example, in this embodiment, two marks M1 and M2 (positioning pins 21a and 21b) and predetermined values [radius (which are located on the same circumference centering on the center position of the wafer stage 20) are used. r)], but the center position of the wafer stage 20 is calculated by calculation (steps S11 to S31 in Fig. 6), but the three marks located on the circumference and the predetermined value (radius r The center position of the wafer stage 20 may be obtained based on the " Of course, the number and positions of the marks on the wafer stage 20 are not limited to this, and can be appropriately changed as long as the coordinates of the center position of the wafer stage 20 can be obtained.

Further, in the above embodiment, the chip taking out head unit 40 and the moving camera 50 can be individually moved in the X-axis direction with respect to the frame member 46, but the chip taking out head unit and the moving camera are integrated together. You may be able to move to. However, in terms of work efficiency, it is preferable that the chip extraction head unit 40 and the moving camera 50 can be individually moved in the X-axis direction as in the above-described embodiment.

In addition, the component mounting apparatus of the above embodiment draws the bare chip from the wafer W by the wafer heads 42a and 42b, and exchanges the bare chip with the mounting head units 6A and 6B to provide the mounting head unit ( Although 6A and 6B mount bare chips on the board | substrate P, even if it is comprised so that the wafer head 42a and 42b may be mounted on the board | substrate P as it is, the bare chips drawn out from the wafer W may be, of course. good.

6A: 1st mounting head unit 6B: 2nd mounting head unit
10: wafer storage portion 12: wafer support device
14: chip taking out device 14A: chip turning device
14B: chip transfer device 20: wafer stage
30: stone head 32a: first stone pin
32b: 2nd protrusion pin 40: The head unit for chip extraction
42a: first wafer head 42b: second wafer head
44: nozzle 50: moving camera
W: Wafer Wh: Holder
M1: first mark M2: second mark
M3: Mark

Claims (8)

A wafer support member which holds the diced wafer horizontally at a predetermined working position and is movable only in the Y-axis direction parallel to the surface of the wafer; The part recognition camera provided integrally movable in the Y-axis direction at an upper position of the wafer support member, and installed to be movable in the X-axis direction parallel to the surface of the wafer as a direction orthogonal to the Y-axis direction. And a part extraction head; And a component transfer device having a component protrusion head which is installed to be movable only in the X-axis direction at a position below the wafer support member at the working position, and extracts a bare chip from the wafer and transfers the bare chip to a predetermined position. As a method:
XY coordinates when moving the wafer support member, the head of the part protrusion, and the part recognition camera in the part conveying step before the part conveying step and the part conveying step before the part conveying step, and the part chip taking out the bare chip from the wafer. A reference coordinate setting process of respectively determining a reference position on the plane;
In the component conveyance step, the wafer support member is moved in the Y-axis direction so that a bare chip to be taken out is placed on a path in which the head of the part protrusion is moved, and the component recognition camera is placed on the path. A component imaging step of moving the image to a position above a bare chip to image the bare chip;
A part protrusion step of moving the part head for projection based on the imaging result of the part imaging step so that the bare chip to be pulled out is moved, and causing the bare chip to be stepped by the part projection head; and
A part take-out and conveying step of holding a bare chip protruded by the part protrusion head and carrying it to a predetermined position by the part drawing head;
The reference coordinate setting step includes a first mark imaging step of imaging a mark formed on the wafer support member with the part recognition camera;
A camera coordinate (X-axis) setting step of determining a reference coordinate in the X-axis direction when the part recognition camera is moved based on an imaging result of the first mark imaging step,
A second mark imaging step of imaging the mark formed on the part protrusion head by the part recognition camera;
A supporting member coordinate setting step of determining a reference coordinate in the Y-axis direction when the wafer supporting member is moved based on the imaging results of the first and second mark imaging processes;
A camera coordinate (Y-axis) setting step of determining a reference coordinate in the Y-axis direction when the part recognition camera is moved based on an imaging result of the second mark imaging step, and
And a projection head coordinate setting step of determining a reference coordinate in the X-axis direction at the time of moving the component projection head based on the imaging result of the second mark imaging step. The method of claim 1,
In the reference coordinate setting step, the component protrusion head is disposed at a predetermined position, and the fitting portion formed in the component extraction head and the component protrusion head are fitted with each other, thereby allowing the component extraction head in the fitting state. And a drawing head coordinate setting step of obtaining a current position in the X-axis direction and the Y-axis direction and determining this position as a reference coordinate position of the part drawing head. The method according to claim 1 or 2,
A plurality of marks arranged on a circle having a predetermined radius value are formed on the wafer support member as a circle centered at the center position thereof, and in the first mark imaging process, the plurality of marks are formed by the part recognition camera. Imaging to obtain the center coordinates of the wafer support member, and in the camera coordinates (X-axis) setting step, the camera coordinates (Y-axis) setting step, the support member coordinates setting step, and the projection head coordinate setting step, based on the center coordinates The part conveyance method characterized by setting reference coordinates, respectively. In the component conveying apparatus which pulls out a bare chip from a diced wafer, and conveys it:
A wafer support member for holding the wafer horizontally and supporting the wafer so as to be movable only in the Y-axis direction parallel to the surface of the wafer;
Wafer support member driving means for moving the wafer support member in the Y-axis direction within an area including a predetermined working position for withdrawing a bare chip from the wafer;
A frame member movably supported only in the Y-axis direction at an upper position of an area including the working position,
Frame drive means for moving the frame member in the Y-axis direction,
A part recognition camera supported by the frame member so as to be movable in the X axis direction parallel to the surface of the wafer as a direction orthogonal to the Y axis direction, for imaging the bare chip from above;
Camera driving means for moving the part recognition camera in the X-axis direction,
A part drawing head supported by the frame member to draw the bare chip from the wafer so that movement in the X-axis direction is possible;
A component drawing head driving means for moving the component drawing head in the X-axis direction;
A part protrusion head for projecting a bare chip of the wafer held in the wafer support member so as to be movable only in a direction parallel to the X-axis direction at a downward position of the working position, from below;
A projection head driving means for moving the part projection head in the X-axis direction, and
XY at the time of moving the said wafer support member, a part protrusion head, and a part recognition camera in this part conveyance process before this part conveyance process, and the predetermined component conveyance process which takes out a bare chip from a wafer, and conveys it to a predetermined position. Control means for controlling said respective drive means to execute a reference coordinate setting process for respectively determining a reference position on a coordinate plane;
This control means,
In the component conveyance step, the wafer support member is moved in the Y-axis direction so that a bare chip to be taken out is placed on a path in which the head of the part protrusion is moved, and the part recognition camera is placed on the path. A component imaging step of moving the image to a position above a bare chip to image the bare chip;
A part protrusion step of moving the part protrusion head based on an imaging result of the part imaging step so that the bare chip becomes a protrusion so that the bare chip is protrusion by the part protrusion head;
Performing a part withdrawal conveyance step of holding a bare chip protruded by the part protruding head and conveying it to a predetermined position by holding the part extracting head;
A first mark imaging step of imaging the mark formed on the wafer support member with the component recognition camera in the reference coordinate setting step;
A camera coordinate (X-axis) setting step of determining a reference coordinate in the X-axis direction when the part recognition camera is moved based on an imaging result of the first mark imaging step,
A second mark imaging step of imaging the mark formed on the part protrusion head by the part recognition camera;
A supporting member coordinate setting step of determining a reference coordinate in the Y-axis direction when the wafer supporting member is moved based on the imaging results of the first and second mark imaging processes;
A camera coordinate (Y-axis) setting step of determining a reference coordinate in the Y-axis direction when the part recognition camera is moved based on an imaging result of the second mark imaging step, and
A component conveyance device comprising: a projection head coordinate setting step of determining a reference coordinate in the X-axis direction at the time of moving the component projection head based on an imaging result of the second mark imaging step. The method of claim 4, wherein
And a position detecting means capable of detecting the position of the component drawing head in the X-axis direction and the Y-axis direction, wherein the component protrusion head and the component drawing head can be fitted to each other in the vertical direction. Each of the fitting extracting heads, wherein the control means is arranged in accordance with the detection position of the component extracting head by the position detecting means in the state where the fitting portions are fitted in the reference coordinate setting step. And a drawing head coordinate setting step of determining reference coordinates in the X-axis direction and the Y-axis direction. The method according to claim 4 or 5,
The wafer support member has a plurality of marks arranged on a circle having a predetermined radius value as a circle centered at its center position;
In the first mark imaging step, the control means picks up the plurality of marks by the part recognition camera to obtain the center coordinates of the wafer support member, and the camera coordinate (X-axis) setting step and the camera coordinate (Y). Axis) setting step, the supporting member coordinate setting step and the projection head coordinate setting step respectively set the reference coordinates based on the center coordinates. A component mounting apparatus for extracting a bare chip from a diced wafer and mounting on a substrate:
The component conveying apparatus of Claim 4 or 5 is provided, The bare chip drawn out from the said wafer by the said component extracting head of this component conveying apparatus is conveyed and mounted on the said board | substrate as it is, The component characterized by the above-mentioned. Mounting device. A component mounting apparatus for extracting a bare chip from a diced wafer and mounting on a substrate:
The component mounting apparatus which receives the bare chip | tip pulled out from the said wafer by the component conveyance apparatus of Claim 4 or 5, and the said component extraction head of this component conveyance apparatus, and conveys and mounts the bare chip on the said board | substrate. A component mounting apparatus comprising a head for use.

Images