JP6573481B2 - Grip ring, adapter and die positioning device - Google Patents

Description

  The technology disclosed in the present specification relates to a grip ring for gripping a wafer sheet on which a plurality of dies are arranged. Specifically, the present invention relates to a technique for specifying the position of a die arranged on a wafer sheet held by a grip ring.

  Patent Document 1 discloses a grip ring for fixing an adhesive sheet having a plurality of chips attached thereto. The grip ring fixes the stretched adhesive sheet. Thereby, the some chip | tip currently affixed on the adhesive sheet is arrange | positioned in the state mutually spaced apart, and the circumference | surroundings are surrounded by the grip ring. In this grip ring, a recess is provided at one location on the outer periphery of the grip ring. The grip ring and the ring jig plate are positioned by fitting the recess to the positioning pin.

JP 2010-34435 A

  By the way, each of the plurality of chips on the adhesive sheet fixed to the grip ring is sucked by a pip-up device or the like, and the sucked chips are mounted on the substrate. In order to pick up a chip from the adhesive sheet, the position of the chip on the adhesive sheet must be specified. For this purpose, the position of each tip relative to the grip ring must be specified. However, in the grip ring of Patent Document 1, positioning with the ring jig plate is considered, but it is not considered until the position of the tip (relative position with respect to the grip ring) is specified. That is, in the grip ring of Patent Document 1, since a recess is provided on the outer periphery thereof, it is conceivable to specify the position of the chip using this recess. However, in the grip ring of Patent Document 1, the recess is provided only at one place in the circumferential direction. For this reason, when it is desired to specify the position of the chip at a position away from the recess, the chip and the recess cannot be simultaneously imaged by the camera, and the position of the chip relative to the recess cannot be specified. That is, in the grip ring of Patent Document 1, the position of the chip in the vicinity of the recess can be specified, but the position of the chip in a position away from the recess cannot be specified.

  The grip ring disclosed in this specification grips a wafer sheet on which a plurality of dies are arranged. The grip ring includes a ring portion that is disposed so as to surround a plurality of dies when the wafer sheet is gripped. On the surface of the ring portion, a plurality of first position identification information is attached at predetermined intervals in the circumferential direction, and each of the plurality of first position identification information is another first position identification. The position in the circumferential direction to which the first identification information is attached can be identified from the identification information.

  In the above-described grip ring, a plurality of pieces of first identification information are attached at predetermined intervals in the circumferential direction on the surface of the ring portion. Each of the plurality of first identification information can be identified from the other first identification information. For this reason, the position of the circumferential direction of the ring part to which the 1st identification information is attached | subjected can be specified using each of several 1st identification information attached | subjected to the surface of the ring part. As a result, the position of a plurality of dies surrounded by the ring portion (that is, a die located in the vicinity of each first identification information) can be specified using each of the plurality of first identification information. Therefore, it is possible to specify the positions of many dies as compared with the technique of Patent Document 1.

  The present specification also discloses an adapter that is detachably attached to a grip ring body that grips a wafer sheet. The grip ring main body to which the adapter is attached includes a grip part for gripping a wafer sheet on which a plurality of dies are arranged, and a frame positioned so as to surround the plurality of dies on the wafer sheet when the gripper holds the wafer sheet. And have. The adapter is detachably attached to the frame of the grip ring body. On the surface of the adapter, a plurality of first position identification information is attached at intervals to at least predetermined positions in the circumferential direction. Each of the plurality of first position identification information can be identified from other first position identification information, and the circumferential position to which the first identification information is attached can be specified from the identification information. When an adapter is arranged inside the frame while the wafer sheet is held by the holding unit, a plurality of dies of the wafer sheet are arranged inside the adapter. Also with this adapter, by attaching the adapter to the grip ring main body, the position of the die located in the vicinity of each first identification information can be specified using the first identification information attached to the surface of the adapter. .

  Furthermore, the present specification discloses a die position specifying device for specifying the position of a die on a wafer sheet held by a grip ring. The die position specifying device includes a grip ring that holds a wafer sheet on which a plurality of dies are arranged, and a camera that images the grip ring and the die. The grip ring includes a ring portion that is disposed so as to surround a plurality of dies when the wafer sheet is gripped. On the surface of the ring portion, a plurality of pieces of first position identification information are attached at predetermined positions in the circumferential direction. Each of the plurality of first position identification information can be identified from other first position identification information, and the circumferential position to which the first identification information is attached can be specified from the identification information. According to such a configuration, from the relative position information of the die identified from the image and the first identification information and the circumferential position of the first identification information identified from the first identification information, The location of the multiple dies that are surrounded can be identified.

It is a side view which represents the structure of a component mounting machine typically. It is a top view of the wafer frame of 1st Example. It is the image by the camera of 1st Example. It is a block diagram showing the structure of the control system of a component mounting machine. It is a figure which shows the flowchart of a teaching process. It is a top view of the wafer frame of 2nd Example. It is sectional drawing of broken line VII-VII of FIG. It is the image by the camera of 2nd Example. It is a top view of the wafer frame of 3rd Example. It is a figure which shows the flowchart of the teaching process of 3rd Example. It is the image by the camera of 3rd Example. It is the image by the camera of 3rd Example.

  The main features of the embodiments described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Absent.

(Feature 1) The plurality of pieces of first position identification information may be arranged at equal intervals in the circumferential direction. According to such a configuration, it is possible to specify the position of the other first identification information by specifying the circumferential position of one first identification information among the plurality of first identification information.

(Feature 2) The camera of the die position specifying device includes at least one of at least one die of the plurality of dies and first identification information attached to a surface of the ring portion in an image captured by the camera. It may be possible to image one at a time. According to such a configuration, it is possible to shorten the time required to specify the position of the die located in the same image as the first identification information.

(Characteristic 3) The die position specifying device specifies a position of a die selected from an image captured by a camera when one die is selected from a plurality of dies arranged on a wafer sheet. An apparatus may be provided. The image captured by the camera includes the selected die and at least one first identification information. The circumferential position of the first identification information can be specified by the first identification information itself. For this reason, the arithmetic unit can specify the position of the selected die using the first identification information in the image.

(First embodiment)
Hereinafter, the component mounter 10 according to the first embodiment will be described. As shown in FIG. 1, the component mounter 10 controls the module 20, the wafer supply device 40 disposed in the front part of the module 20 (the negative direction side of the Y axis in the drawing), the module 20 and the wafer supply device 40. The control device 120 is configured. The component mounter 10 is an example of a “die position specifying device”.

  The module 20 includes a camera 22, a transfer head 24, a moving device 28 that moves the camera 22 and the transfer head 24, a substrate conveyor 30, and an operation panel 32.

  The moving device 28 moves the camera 22 and the transfer head 24 between the wafer supply pallet 100 and the circuit board 2. The moving device 28 is an XY robot that moves the moving base 28a in the X direction and the Y direction. The moving device 28 includes a guide rail that guides the moving base 28a, a moving mechanism that moves the moving base 28a along the guide rail, a motor that drives the moving mechanism, and the like. The moving device 28 is disposed above the circuit board 2. A camera 22 and a transfer head 24 are attached to the moving base 28a. The camera 22 and the transfer head 24 are moved from above the wafer supply pallet 100 to above the circuit board 2 by the moving device 28.

  The transfer head 24 includes a suction nozzle 26 that sucks the die 108. The suction nozzle 26 can be attached to and detached from the transfer head 24. The suction nozzle 26 is attached to the transfer head 24 so as to be movable in the Z direction (vertical direction in the drawing). The suction nozzle 26 is configured to move up and down by an actuator (not shown) accommodated in the transfer head 24 and to suck the die 108. In order to mount the die 108 arranged on the wafer frame 102 on the circuit board 2, first, the suction nozzle 26 is moved downward until the suction surface (lower surface) of the suction nozzle 26 contacts the die 108. Next, the die 108 is sucked to the suction nozzle 26 and the suction nozzle 26 is moved upward. Next, the transfer head 24 is positioned with respect to the circuit board 2 by the moving device 28. Subsequently, the die 108 is mounted on the circuit board 2 by lowering the suction nozzle 26 toward the circuit board 2.

  The camera 22 is attached to the moving base 28a. The camera 22 images the die 108 before being sucked by the suction nozzle 26 from above. The image 22b captured by the camera 22 is transmitted to the management device 150 (shown in FIG. 4) via the control device 120.

  The substrate conveyor 30 is a device that carries the circuit board 2 into the module 20, positions it on the module 20, and carries it out of the module 20. The board conveyor 30 is constituted by, for example, a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the circuit board 2 from below, and a driving device (not shown) that drives the belt conveyor. Can do. The operation panel 32 is an input device that receives an instruction from the worker and a display device that displays various types of information to the worker.

  The wafer supply device 40 is disposed in front of the module 20 (on the negative direction side of the Y axis in the drawing). The wafer supply device 40 includes a replenishment unit 50 and a wafer supply unit 60. The replenishing unit 50 includes a magazine 52 and an elevating mechanism 58. The magazine 52 includes a plurality of pallet accommodating portions 54 that accommodate the wafer supply pallet 100. The plurality of pallet accommodating portions 54 are stacked in the height direction (the Z direction in the drawing). The replenishment unit 50 supplies the wafer supply pallet 100 stored in the pallet storage unit 54 to the wafer supply unit 60.

  The elevating mechanism 58 can elevate the magazine 52 disposed on the upper surface of the elevating mechanism 58 up and down and stop the magazine 52 at an arbitrary height. As the elevating mechanism 58, a mechanism equipped in a known wafer supply apparatus 40 can be used. For example, the elevating mechanism 58 includes a ball screw and a motor that rotates the ball screw. When the pallet accommodating portion 54 is positioned at a preset take-out position by the elevating mechanism 58, the wafer supply pallet 100 can be unloaded from the pallet accommodating portion 54 to the wafer supply portion 60 through the carry-out port 56.

  The wafer supply unit 60 includes a wafer frame support unit 62. The wafer frame support 62 is disposed below the movement base 28a. The wafer supply pallet 100 accommodated in the pallet accommodating part 54 is transported to the wafer frame support part 62. The wafer supply pallet 100 is transported from the pallet housing part 54 to the wafer frame support part 62 by a robot 64 (shown in FIG. 4).

  The wafer supply pallet 100 accommodated in the pallet accommodating portion 54 will be described with reference to FIG. The wafer supply pallet 100 includes a wafer frame 102, a wafer sheet 104, a wafer 106, and an annular grip ring 110. A wafer sheet 104 is disposed on the upper surface of the wafer frame 102. The upper surface of the wafer sheet 104 has adhesiveness, and the wafer 106 is stuck on the upper surface. The wafer 106 is diced and divided into a plurality of dies 108.

  The grip ring 110 has a grip portion 112 that grips the wafer sheet 104 and an annular ring portion 114 that surrounds the wafer 106 disposed on the upper surface of the wafer sheet 104. The grip portion 112 of the grip ring 110 grips the wafer sheet 104 that is stretched in the horizontal direction. For this reason, the plurality of diced dies 108 are arranged on the upper surface of the wafer sheet 104 in a state where they are spaced apart from each other by a width wider than the dicing width. The mechanism for holding the wafer sheet 104 of the holding unit 112 can have the same configuration as the conventional one.

  On the upper surface of the ring portion 114, a plurality of pieces of first identification information 116 are attached at predetermined intervals in the circumferential direction of the ring portion 114 at intervals. The plurality of first identification information 116 are arranged at equal intervals in the circumferential direction of the ring portion 114. Each of the plurality of first identification information 116 is configured to be identifiable from the other first identification information 116. For example, in this embodiment, a plurality of alphabets (A to Z in FIG. 2) and a plurality of numbers (1 to 10 in FIG. 2) are attached as a plurality of first identification information 116. Thereby, the operator can specify the circumferential position of the ring portion 114 to which each of the plurality of first identification information 116 is attached. The number of the 1st identification information 116 attached | subjected to the upper surface of the ring part 114 can be set arbitrarily. The grip ring 110 and the wafer frame 102 are positioned in a preset positional relationship. Therefore, the positions of the plurality of first identification information 116 with respect to the wafer frame 102 are also set in advance.

  The control device 120 is configured by a computer including a CPU, a ROM, and a RAM. As shown in FIG. 4, the control device 120 includes the module 20 (specifically, the transfer head 24, the moving device 28, the camera 22, the operation panel 32) and the wafer supply device 40 (specifically, the lifting mechanism 58. And the robot 64) are communicably connected. The control device 120 controls each part (24, 28, 22, 32, etc.) of the module 20 to mount the die 108 on the circuit board 2 (mounting process). In addition, the control device 120 controls each unit (58, 64, etc.) of the wafer supply device 40 to transfer the predetermined wafer frame 102 from the pallet housing portion 54 to the wafer frame support portion 62 (transfer processing).

In addition, the storage device 130 and the management device 150 are connected to the control device 120 so as to communicate with each other. The storage device 130 includes a program for controlling the operation of the component mounting machine 10, position information p _{1 to} p ₃₆ of each of the plurality of first identification information 116, and the first die 108 to be attracted among the plurality of dies 108. First identification information 116 (hereinafter referred to as first suction information) corresponding to (hereinafter referred to as first suction die 108a) and position information q of the first suction die 108a taught by an operator described later are stored. To do. The first suction information is information about the first identification information 116 having the shortest distance from the first suction die 108a among the plurality of first identification information 116. For example, in the case of FIG. 3, the first suction information is “J” closest to the first suction die 108a. The storage device 130 stores first suction information for each type of wafer supply pallet 100 (that is, for each type of component). The first suction information is set by an operator when the wafer supply pallet 100 is set in the magazine 52. Even when the types of wafer supply pallets 100 are the same, if the production lots are different, first suction information is newly set, and a teaching process for teaching the position of the first suction die 108a is performed. The control device 120 controls each unit (20, 40) of the component mounter 10 based on a program stored in the storage device 130. In addition, the control device 120 transmits the image 22b acquired by the camera 22 to the management device 150.

  The management device 150 includes a control device 160. The control device 160 is configured by a computer including a CPU, a ROM, and a RAM. The control device 160 includes a display unit (not shown) that displays the image 22b transmitted from the control device 120. The control device 160 transmits various information input by the worker to the control device 120. The various information is, for example, position information q of the first suction die 108a.

  The component mounting machine 10 mounts the plurality of dies 108 on the wafer frame 102 arranged on the wafer frame support unit 62 on the circuit board 2 by operating each unit (20, 40) by the control device 120. It is configured. In the first embodiment, the position of the first suction die 108a is configured such that an operator teaches. For the second and subsequent dies 108, the mounting process is executed based on the program stored in the storage device 130.

  Next, teaching processing for specifying the position information q of the first suction die 108a by teaching will be described with reference to FIGS. A case where “J” in the plurality of first identification information 116 is designated as the first suction information will be described. More specifically, a case will be described as an example where the die 108a in the vicinity of the position where “J” is assigned as the first identification information 116 is designated as the “first suction die”. The teaching process is executed when the manufacturing rod of the wafer supply pallet 100 supplied to the wafer supply apparatus 40 is changed by an operator. The teaching process is started when an operator inputs a teaching process start signal to the control device 120 via the operation panel 32. Note that the teaching process start signal may be input via the management device 150.

First, in step S12, when the control device 120 receives a teaching process start signal, the control device 120 operates the movement base 28a based on the first suction information (“J”) stored in the storage device 130. To adjust the imaging region 22a of the camera 22 (step S14). Specifically, the control device 120 determines the position of the camera 22 so that the first suction information (“J”) and the die 108 in the vicinity of the first suction information (“J”) are included in the imaging region 22a. Is adjusted (see FIG. 2). Next, in step S16, the control device 120 operates the camera 22 and acquires the image 22b. 3 is captured by the camera 22, and the image 22b captured by the camera 22 is input to the control device 120. Next, in step S <b> 18, the control device 120 transmits the image 22 b to the management device 150. The management device 150 displays the image 22b received from the control device 120 on the display unit of the management device 150 (FIG. 3). Thereby, the worker can check the image 22b captured by the camera 22. The operator can confirm that the imaging region 22a of the camera 22 is an appropriate region based on the first identification information 116 included in the image 22b displayed on the display unit. Next, the worker selects the first suction die 108a from among a plurality of dies 108 on the image 22b with a pointing device or the like. When the first suction die 108a is selected, the management device 150 specifies the position of the selected first suction die 108a in the image 22b. Next, the management device 150 transmits position information r ₁ (coordinate values (r _1x , r _1y ) in the image) indicating the position of the first suction die 108a on the image 22b to the control device 120.

Then, in step S20, the control unit 120 receives the position information _{r 1} on the image 22b of the first adsorption die 108a transmitted from the management device 150. Then, in step S22, the control unit 120 calculates the relative position information _{r 3} of the first adsorption die 108a to the first adsorption information ( "J"). Specifically, the control device 120 performs image recognition processing, whereby position information r ₂ (coordinate values (r _2x , r _2y ) in the image) of the first suction information (“J”) on the image 22b. It is comprised so that can be specified. For this reason, the control device 120 performs relative processing based on the position information r ₁ (coordinate values (r _1x , r _1y ) in the image) and position information r ₂ (coordinate values (r _2x , r _2y ) in the image). The position information r ₃ ((r _1x −r _2x , r _1y −r _2y )) is calculated. Next, in step S24, the control device 120 calculates the position information q of the first suction die 108a. Specifically, the control unit 120 based on the position information _{p 10} and the relative position information _{r 3} of the first adsorption information stored in the storage device 130 ( "J"), position information of the first adsorption die 108a q is calculated. That is, the control device 120 specifies the position on the wafer supply pallet 100 where the first suction die 108a is located. Thereby, the teaching process of the position information q of the first suction die 108a is completed. The calculated position information q is stored in the storage device 130.

  Next, a process for mounting the die 108 of the wafer supply pallet 100 supplied from the wafer supply apparatus 40 on the circuit board 2 will be described. The plurality of dies 108 of the wafer supply pallet 100 are mounted on the circuit board 2 in order from the first suction die 108a. That is, the control device 120 operates the elevating mechanism 58 so that the height of the pallet accommodating portion 54 in which the predetermined wafer supply pallet 100 is accommodated matches the height of the carry-out port 56. Next, the control device 120 operates the robot 64 to convey the wafer supply pallet 100 accommodated in the pallet accommodating portion 54 to a predetermined position (die supply position) of the wafer frame support portion 62. Before the suction nozzle 26 sucks the die 108, the moving base 24a is disposed in the front part of the component mounting machine 10. For this reason, the wafer supply pallet 100 transported by the robot 64 is positioned below the camera 22 and the transfer head 24.

  Next, the control device 120 adjusts the position of the suction nozzle 26 by operating the movement base 28a based on the position information q of the first suction die 108a specified by the above teaching process. As a result, the suction nozzle 26 is positioned above the first suction die 108a. Next, the control device 120 operates the suction nozzle 26 to suck the first suction die 108a. Next, the control device 120 operates the moving base 28 a, positions the suction nozzle 26 with respect to the circuit board 2, and mounts the first suction die 108 a on the circuit board 2. When the first suction die 108 a is mounted on the circuit board 2, the second die 108 to be mounted is mounted on the circuit board 2. That is, since the position of the first suction die 108a is specified, the position of the second die 108 adjacent to the first suction die 108a can also be specified. For this reason, the control device 120 sucks the die 108 sucked second and mounts it on the circuit board 2. Thereafter, the plurality of dies 108 of the wafer supply pallet 100 are mounted on the circuit board 2 in order.

As described above, a plurality of pieces of first identification information 116 are attached to the upper surface of the ring portion 114 of the grip ring 110 of the first embodiment. Each of the plurality of first identification information 116 can be identified from the other first identification information 116. For this reason, the control apparatus 120 can adjust the imaging region 22a of the camera 22 based on the 1st adsorption | suction information memorize | stored in the memory | storage device 130 (for example, FIG. 3). The operator can confirm that the imaging region 22a is an appropriate region based on the first identification information 116 on the image 22b displayed on the display unit of the management device 150. Further, the operator selects the first adsorption die 108a on the image 22b displayed on the display unit, whereby, the control unit 120, the position information _{r 1} on the image 22b of the first adsorption die 108a is transmitted Is done. Thus, the control unit 120, based on the relative position information _{r 3} of the first adsorption die 108a to the first adsorption information ( "J") position information _{p 10} and the first adsorption information ( "J"), first The position information q of the suction die 108a can be specified.

(Second embodiment)
Differences from the first embodiment will be described with reference to FIGS. In the following description, components common to the embodiments are denoted by the same reference numerals and description thereof is omitted. In FIG. 6, the inner periphery and the outer periphery of the grip ring 210 are indicated by two-dot chain lines in order to give priority to easy understanding. In the second embodiment, the wafer supply pallet 200 accommodated in the pallet accommodating portion 54 is different from the wafer supply pallet 100 of the first embodiment.

  The wafer supply pallet 200 includes a wafer frame 102, a wafer sheet 104, a wafer 106, an annular grip ring 210, and an annular adapter 220. The grip ring 210 includes a grip portion 212 that grips the wafer sheet 104 and an annular frame 214 that surrounds the wafer 106. The grip portion 212 of the grip ring 210 grips the wafer sheet 104 that is stretched in the horizontal direction. For this reason, the plurality of diced dies 108 are arranged on the upper surface of the wafer sheet 104 in a state of being spaced from each other.

  The adapter 220 is detachably attached to the grip ring 210 and covers the upper surface and outer periphery of the frame 214. The inner diameter D1 of the adapter 220 is smaller than the inner diameter D2 of the grip ring 210. A plurality of pieces of first identification information 224 are attached to the upper surface of the adapter 220 at least in a region between the inner diameter D1 and the inner diameter D2 of the adapter 220 (hereinafter referred to as a first identification information adding region 222). The plurality of first identification information 224 are arranged at equal intervals in the circumferential direction of the adapter 220. As shown in FIG. 6, the plurality of first identification information 224 are arranged on the same circumference of the adapter 220, but are not limited to such a form, and are alternately shifted in the radial direction. May be. More first identification information can be attached to the first identification information adding region 222 by disposing them in the radial direction. Each of the plurality of first identification information 224 is configured to be distinguishable from the other first identification information 224. For example, in the second embodiment, a plurality of alphabets and a plurality of numbers are attached as a plurality of first identification information 224. Thereby, the position of the circumference direction of adapter 220 to which each of a plurality of 1st discernment information 224 is given can be specified. The number of the 1st identification information 224 attached | subjected to the upper surface of the adapter 220 can be set arbitrarily.

  The storage device 130 stores first suction information. The first suction information is information on the first identification information 224 having the shortest distance from the first suction die 108a among the plurality of first identification information 224. For example, in the case of FIG. 8, the first suction information is “j”.

Also in the second embodiment, the position of the first suction die 108a is configured so that the operator teaches. In order to shorten the time required for teaching processing, it is preferable to image the first identification information 224 and the first suction die 108a at the same time. However, when the wafer 106 and the grip ring 210 are separated from each other, the first suction die 108a and the first identification information 224 cannot be simultaneously stored in the imaging region 22a of the camera 22. That is, the distance from the first suction die 108a to the grip ring 210 is longer than the size of the imaging region 22a. Therefore, in this embodiment, the adapter 220 is attached to the grip ring 210. When the adapter 220 of the grip ring 210 is attached, the distance between the first suction die 108a and the first identification information 224 on the adapter 220 can be reduced. As a result, the first suction die 108a and the first identification information 224 can be simultaneously stored in the image 22b (for example, FIG. 8). With this configuration, the operator becomes the position information r ₁ of the first adsorption die 108a, to be sent to the controller 120. Thereby, the control device 120 can calculate the position information q of the first suction die 108a, and can specify the position of the first suction die 108a.

(Third embodiment)
Differences from the first embodiment will be described with reference to FIGS. In the following description, components common to the embodiments are denoted by the same reference numerals and description thereof is omitted. In the third embodiment, the wafer supply pallet 300 accommodated in the pallet accommodating portion 54 is different from the wafer supply pallet 100 of the first embodiment. Specifically, the size of the wafer 306 of the third embodiment is smaller than the size of the wafer 106 of the first embodiment. For this reason, the wafer 306 and the grip ring 110 are separated from each other, and the die 108 and the first identification information 116 cannot be imaged simultaneously using the camera 22.

  The teaching process of the third embodiment will be described. A case where “J” in the plurality of first identification information 116 is designated as the first suction information will be described. More specifically, a case will be described as an example where the die 108a in the vicinity of the position where “J” is assigned as the first identification information 116 is designated as the “first suction die”. The teaching process is started when an operator inputs a teaching process start signal to the control device 120 via the operation panel 32.

First, in step S112, when receiving the teaching process start signal, the control device 120 operates the movement base 28a based on the first suction information (“J”) stored in the storage device 130, and the camera 22 The imaging area 22a is adjusted (step S114). Specifically, the control device 120 adjusts the position of the camera 22 so that the first suction information (“J”) is included in the imaging region 22a (see FIG. 11). Next, in step S116, the control device 120 operates the camera 22 and acquires the image 22b. As a result, the image 22b shown in FIG. 11 is captured by the camera 22, and the image 22b captured by the camera 22 is input to the control device 120. Next, in step S118, the control device 120 specifies the position information r ₂ (coordinate values (r _2x , r _2y ) in the image) of the first suction information (“J”) on the image 22b, and the storage device 130. To remember. Next, in step S120, the control device 120 operates the moving base 28a, adjusts the imaging region 22a of the camera 22, and images a plurality of dies 108 arranged in the vicinity of the first suction information (“J”). To do. The first suction die 108a is disposed in the vicinity of the first suction information ("J"). For this reason, the camera 22 can image the first suction die 108a by imaging the plurality of dies 108 arranged in the vicinity of the first suction information (“J”) (see FIG. 12). At this time, the control device 120 stores the movement distance d of the camera 22 (coordinate conversion values (d _1x , d _1y ) of the movement distance) in the storage device 130 in step S120. Next, in step S122, the control device 120 operates the camera 22 and acquires the image 22b. Next, in step S <b> 124, the control device 120 transmits the image 22 b to the management device 150. The management device 150 displays the image 22b received from the control device 120 on the display unit of the management device 150 (FIG. 12). Thereby, the worker can check the image 22b captured by the camera 22. The operator selects the first suction die 108a from a plurality of dies 108 on the image 22b with a pointing device or the like. When the first suction die 108a is selected, the management device 150 specifies the position of the selected first suction die 108a in the image 22b. Next, the management device 150 transmits position information r ₁ (coordinate values (r _1x , r _1y ) in the image) indicating the position of the first suction die 108a on the image 22b to the control device 120.

Then, in step S126, the control unit 120 receives the position information _{r 1} on the image 22b of the first adsorption die 108a transmitted from the management device 150. Then, in step S128, the control unit 120 calculates the relative position information _{r 3} of the first adsorption die 108a to the first adsorption information ( "J"). The control device 120 includes position information r ₁ (coordinate values (r _1x , r _1y ) in the image), position information r ₂ (coordinate values (r _2x , r _2y ) in the image) and a moving distance d (moving distance Based on the coordinate conversion values (d _1x , d _1y )), relative position information r ₃ ((r _1x −r _2x + d _1x , r _1y −r _2y + d _1y )) is calculated. Next, in step S130, the control device 120 calculates the position information q of the first suction die 108a. Specifically, the control unit 120 based on the position information _{p 10} and the relative position information _{r 3} of the first adsorption information stored in the storage device 130 ( "J"), position information of the first adsorption die 108a q is calculated. That is, the control device 120 specifies the position of the first supply die 108a on the wafer supply pallet 300. Thereby, the teaching process of the position information q of the first suction die 108a is completed. The calculated position information q is stored in the storage device 130.

  Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  In each of the embodiments described above, the module 20 includes the camera 22. However, the wafer supply apparatus 40 may include the camera 22.

  In addition, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

2: Circuit board 10: Component mounter 20: Module 22: Camera 22a: Imaging area 22b: Image 24: Transfer head 24a: Moving base 26: Suction nozzle 28: Moving device 28a: Moving base 30: Board conveyor 32: Operation Panel 40: Wafer supply device 50: Replenishment unit 52: Magazine 54: Pallet storage unit 56: Carriage outlet 58: Lifting mechanism 60: Wafer supply unit 62: Wafer frame support unit 64: Robot 100, 200, 300: Wafer supply pallet 102 : Wafer frame 104: Wafer sheet 106, 306: Wafer 108: Die 110, 210: Grip ring 112, 212: Grip part 114, 214: Ring part 116, 224: First identification information 120, 160: Control device 130: Storage Device 150: Management device 220: Adapter 222: With first identification information Area

Claims (6)

A grip ring for gripping a wafer sheet on which a wafer divided into a plurality of dies is arranged,
A ring portion arranged to surround the wafer divided into the plurality of dies when the wafer sheet is gripped;
Wherein the surface of the ring portion is spaced in a circular peripheral direction a predetermined position, so as to extend along the outer periphery of the wafer, it is denoted by the plurality of first position identification information,
Wherein each of the first position identification information is distinguishable from the other of the first position identification information, the first position identification information can be identified from a circle positioned circumferentially, it labeled the first location area identification The grip ring is configured such that the positions of the plurality of dies can be specified using each of the plurality of first position identification information .   The grip ring according to claim 1, wherein the plurality of first position identification information are arranged at equal intervals in the circumferential direction. A grip ring main body having a grip portion for gripping a wafer sheet in which a plurality of dies are arranged, and a frame positioned so as to surround the plurality of dies of the wafer sheet when the gripper holds the wafer sheet It is an adapter that can be detachably attached to the frame of
On the surface of the adapter, a plurality of first position identification information is attached at intervals to at least a predetermined position in the circumferential direction,
Each of the plurality of first position identification information can be identified from other first position identification information, and a circumferential position to which the first position identification information is attached can be identified from the first position identification information. And
When the adapter is disposed inside the frame in a state where the wafer sheet is gripped by the grip portion, a plurality of dies of the wafer sheet are configured to be disposed inside the adapter. adapter. A grip ring for holding a wafer sheet on which a wafer divided into a plurality of dies is arranged;
A grip ring and a camera for imaging the die;
The grip ring includes a ring portion arranged so as to surround the plurality of dies when the wafer sheet is gripped,
Wherein the surface of the ring portion is spaced in a circular peripheral direction a predetermined position, so as to extend along the outer periphery of the wafer, it is denoted by the plurality of first position identification information,
Wherein each of the first position identification information is distinguishable from the other of the first position identification information, the first position identification information can be identified from a circle positioned circumferentially, it labeled the first location area identification A die position specifying device that can specify the positions of the plurality of dies using each of the plurality of first position identification information . The camera, at least one die of the plurality of dies within the image captured by the camera, can simultaneously imaging at least one of the first position identification information attached to the surface of the ring portion and The die position specifying device according to claim 4, wherein   An arithmetic device is further provided that identifies a position of the selected die from an image captured by the camera when one die is selected from the plurality of dies arranged on the wafer sheet. The die position specifying device according to claim 4 or 5.

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