JPH05308086A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To provide a semiconductor manufacturing device which can pick up all chips of a wafer without being limited by outer shape of the wafer within a needed minimum amount of time. CONSTITUTION:A reference mark 52 of a wafer ring and an image data 53 of all chips of a wafer are obtained by a reading means in a chip distribution measuring device before picking up the chips and then the coordinates of positions of all chips and the reference mark are digitalized by a data creation means based on the image data for creating the position data S6 showing the distribution state of all chips and outputting it to a die-bonding device 58. In the die-bonding device, a control part compensates Sl the position of the wafer ring so that the recognition position of the reference mark by an image recognition part matches the reference mark position data of the position data and then controls a pick-up unit based on the position data S15. Therefore, the trace for the wafer of a suction collet of the pick-up unit becomes a needed minimum length which is positioned in sequence only on the upper part of each chip to be picked up.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus used in a semiconductor element manufacturing process, particularly in a die bonding process for picking up each chip to be die bonded from a wafer.

[0002]

2. Description of the Related Art As a method of picking up a chip from a wafer in a conventional semiconductor manufacturing apparatus of this type,
(A) The suction collet operates the XY table on which the wafer (W) is placed so that the wafer (W) shows a locus as shown in FIG. 7, and is determined to be non-defective in the chip test process and defective. A means for selecting a chip not marked by image recognition and picking it up with a suction collet, and (b) as shown in FIG. 8, three points (P1) on the outer shape of the wafer (W) set in the die bonding apparatus. , (P
2), (P3) is instructed by the operator, and a range in which a chip (not shown) on the wafer (W) should be picked up is equivalent to a circle passing through three points (P1) to (P3), that is, the same figure. The means for designating the inside of the circle centered on the + mark position is generally adopted.

[0003]

However, in the above-mentioned means (a), when the lack of the chip (C) is identified in the wafer (W), it is immediately erroneously determined to be the end portion of the wafer (W). In order to prevent the operation direction of the XY table on which the wafer (W) is placed from being changed,
The operation direction of the XY table is changed when it is determined that a predetermined number, for example, three chips (C) do not exist continuously. Therefore, the XY table must be moved until it is identified that there are no chips (C) to be picked up at the end of the wafer (W) but three chips (C) are not actually present. In addition, the locus (L) of the suction collet with respect to the wafer (W) becomes longer than necessary, and a considerable loss time is included in the production time. On the other hand, the means (b) is inefficient because the operator has to give complicated three-point instructions, and has a drawback that it cannot be applied to the wafer (W) whose outer shape is not a perfect circle.

Therefore, it is a technical object of the present invention to provide a semiconductor manufacturing apparatus capable of pitching up all the chips of the wafer in a necessary minimum time without being restricted by the outer shape of the wafer. It is a thing.

[0005]

According to the present invention, as a technical means for achieving the above object, a semiconductor manufacturing apparatus is constructed as follows. That is, it comprises a chip distribution measuring device for measuring the distribution of all the chips on the wafer, and a die bonding device for picking up and die-bonding the chips based on the data from the chip distribution measuring device. Reading means for reading as an image an area including a reference mark written on a sheet that is attached to form a wafer ring and all chips on the wafer, and XY having a specific point as an origin based on image data from the reading means. Data forming means for creating position data in which the coordinates of each position of all chips and the reference mark in the coordinate system are converted into numerical data and sending the position data to the die bond device. Image recognition for recognizing the position of the reference mark on the set wafer ring And a control unit that controls the operation of the pickup unit based on the position data after driving and controlling the pickup unit so that the recognition position of the reference mark by the image recognition unit matches the reference mark position data in the position data. It is characterized by having.

[0006]

[Operation] In the process before the chip pickup process,
The reading means of the chip distribution measuring device reads an area including the reference mark of the wafer ring and all the chips on the wafer as image data, and the data creating means numerically calculates the coordinates of each position of all the chips and the reference mark based on the image data. Then, position data of the distribution state of all chips on the wafer is created and output to the die bonder. In the die bonder, first, the image recognition section recognizes the position of the reference mark of the wafer ring set in the pickup unit and outputs the image data to the control section.
The control unit calculates a deviation between the recognition position of the reference mark based on the image data and the reference mark position data among the position data sent from the chip distribution measuring device, and the deviation is zero, that is, the two coincide. The table of the pickup unit is controlled to operate. After that, the control unit
The operation of the pickup unit is controlled based on the chip at the position corresponding to each chip position data in the position data. Therefore, the trajectory of the suction collet for picking up the chip in the pickup unit with respect to the wafer is
The minimum length required is sequentially arranged only on the top of each chip to be picked up, and the production time loss time can be eliminated as much as possible.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described in detail below with reference to the drawings. First, the wafer ring (A) used in the present invention will be described with reference to FIG. The wafer ring (A) is formed by attaching a blue sheet (B) slightly larger than the wafer (W) to the back surface of the wafer (W) for the purpose of preventing the dicing chips (C) from scattering. However, a wafer identifier (D) consisting of a barcode unique to each wafer (W) is attached to this Boolean sheet (B), and a reference mark (M) is attached at a predetermined position.

FIG. 1 is a block diagram of an electric system according to an embodiment of the present invention, in which all chips (C) on a wafer (W) are shown.
Distribution measuring device (1) for measuring the distribution of the chips, and a die bonding device (2) for picking up the chip (C) based on the position data (18) from the chip distribution measuring device (1) and die bonding it to a frame or the like. It is composed of and. The chip distribution measuring apparatus (1) includes a uniaxial table (14) on which the wafer ring (A) is set as shown in FIG. 3A, and a wafer set on the uniaxial table (14). A wafer identifier reading unit (12) for reading the wafer identifier (D) of the ring (A), and FIG.
A camera (13) for reading an image of a reading area (E) including the reference mark (M) and all chips (C) on the wafer (W) as shown in FIG.
Position data (18) in which the coordinates of each position of all the chips (C) and the reference mark (M) in the XY coordinate system whose origin is a specific point based on the image data (16) from 3) are converted into numerical data. And a data creation control unit (11) for creating and sending the data to the die bond apparatus (2).

On the other hand, the die-bonding device (2) controls the entire device based on the position data (18) from the chip distribution measuring device (1), and a pickup unit (24) to be described later. A wafer identifier reading unit (22) that reads the wafer identifier (D) of the wafer ring (A) set on the Y table (242) and outputs the identifier data (29) to the control unit (21); And a pickup unit (29) for picking up each chip (C) of W) for die bonding. Further, the pickup unit (29) is XY
Wafer ring (A) set on the table (242)
An image recognition unit (2) that recognizes the position of the reference mark (M) by capturing an image of the reference mark (M) by the camera (231).
3) and a pickup unit (24), and the pickup unit (24) further includes the XY table (242) and the suction collet drive unit (2).
41) and.

Next, the operation of the above embodiment will be described in detail with reference to the flowchart of FIG. First, as shown in FIG. 3A, the wafer ring (A) is moved to the uniaxial table (1
4) Set on (step S1), the wafer identifier (D) of this wafer ring (A) is read in the wafer identifier reading unit (1).
2) is read (step S2), the wafer identifier reading unit (12) outputs the identifier data (15) to the data creation control unit (11).

Next, the camera (13) captures an image of the first end portion (the right side portion in FIG. 2) of the reading area (E) shown in FIG. It outputs to (11) (step S3). The data creation control unit (11) temporarily stores the input image data, outputs the movement data (17), and moves the uniaxial table (14) by a certain distance in the arrow direction shown in FIG. After (Step S4), it is determined whether or not the reading in the reading area (E) is completed (Step S5). By jumping to step S3 and repeating the flow to step S5 until it is determined that the reading is completed, the camera (13) sequentially moves all the chips ( C) and the reference mark (M) are imaged, and the image data (16) is taken into the data creation control unit (11).

Then, the data creation control unit (11) numerically determines the coordinates of the center of gravity of the image data of all the chips (C), that is, the center position based on the XY coordinate system with the center of the wafer ring (A) as the origin. The data is converted into data (step S6), and similarly, the coordinates of the barycentric position of the reference mark (M) are converted into numerical data (step S7). The data of the positions of all chips (C), the positions of the reference marks (M) and the identifier data, which have been converted into numerical data, are transmitted to the die bonding apparatus (2) as position data (18) (step S8).

In the die bonding apparatus (2), the control unit (21) receives and temporarily stores the position data (18) from the chip distribution measuring apparatus (1) (step S9). Then, in the chip distribution measuring device (1), the chip (C)
Of the wafer ring (A) sent to the die bonder (2) after the measurement of the distribution state of
42), the wafer identifier (D) of the set wafer ring (A) is read by the wafer identifier reading unit (22) (step S1).
1) The read identifier data (25) is collated with the identifier data among the position data (18) temporarily stored in the control unit (21), and the position data (18) with which the identifier data match is obtained. A selection is made (step S12).
That is, the position data (18) corresponding to the wafer ring (A) set in the XY table (242) is selected and set.

Next, the image recognition section (23) of the pickup section (29) picks up the reference mark (M) of the wafer ring (A) with its own camera (21), recognizes its position, and recognizes its image data. (26) is output to the control unit (21). The image data (2
The recognized position of the reference mark (M) according to 6) is compared with the reference mark position data of the selected position data (18) (step S13). If the recognized reference mark (M) is present at the position shown in FIG. 4 (a) and there is a deviation from the reference mark position data, the XY table (242) is shown in FIG. 4 (b). As described above, it is possible to move in the X direction and the Y direction, and to rotate about the θ axis. The control unit (21) causes a deviation between the recognition position of the reference mark (M) and the reference mark position data. The position data (28) that becomes zero is the XY table (2
42) and thereby the XY table (2
42) is rotationally controlled so that the reference mark (M) is displaced from the position indicated by the one-dot chain line to the position corresponding to the reference mark position data indicated by the solid line, as shown in FIG.
Is corrected so as to match the position data (18) (step S14). By correcting the position of the reference mark (M), each chip (C) in the wafer (W) of the wafer ring (A) set with the coordinates of each chip position data which is converted into numerical data of the position data (18). Since the coordinate position of is exactly the same, after that, the control unit (21)
The position data (28) from the XY table (24
2) The movement is controlled so that the suction collets are sequentially positioned directly above each chip (C) to be picked up, and
The suction collet drive unit (241) operates the suction collet according to the pickup data (27) from the control unit (21) to pick up the chip (C) (step S1).
5). In this way, the image data of the distribution state of all chips (C) to be picked up for each wafer (W) is converted into numerical data, and the chips (C) are picked up based on the position data (18) obtained thereby, As shown in FIG. 6, the trajectory (l) of the suction collet with respect to the wafer (W)
Is a required minimum length which is sequentially positioned only on the upper part of each chip (C) to be picked up, and the loss time of the production time can be eliminated as much as possible and there is no difference in the outer shape of the wafer (W). It becomes irrelevant.

[0015]

As described above, according to the semiconductor manufacturing apparatus of the present invention, in the chip distribution measuring apparatus, all the chips (C) to be picked up on the wafer and the respective positions of the reference marks in the predetermined XY coordinate system. Position data in which the coordinates are converted into numerical data is created in advance, this position data is sent to the die bonder, and in the die bonder, the position where the reference mark recognition position of the set wafer ring matches the reference mark position data in the position data. After the correction, the operation of the pickup unit is controlled based on the position data to pick up the chip.
The locus of the suction collet with respect to the wafer becomes the minimum length that is sequentially positioned only on the upper part of the chip to be picked up, and the loss time of the production time can be eliminated as much as possible. Moreover, since the difference in the outer shape of the wafer is completely irrelevant, general-purpose pickup processing can be performed, and the operator does not need to specify the pickup range on the wafer, so that the die bonding process can be fully automated. There is.

[Brief description of drawings]

FIG. 1 is a block diagram of an embodiment of the present invention.

FIG. 2 is a flowchart of the same.

3 (a) and 3 (b) are a perspective view of a part of the chip distribution measuring apparatus and an explanatory view of a reading area, respectively.

4 (a), (b), and (c) are explanatory views of the position correction of the wafer ring of the die bonding apparatus in the same as above.

FIG. 5 is an explanatory diagram of a wafer ring set in the apparatus.

FIG. 6 is an explanatory view showing a locus for picking up a chip.

FIG. 7 is an explanatory diagram showing a trajectory of a suction collet with respect to a wafer in a conventional apparatus.

FIG. 8 is an explanatory diagram of a method of designating a range for picking up a chip of a wafer in another conventional apparatus.

[Explanation of symbols]

 1 Chip Distribution Measuring Device 2 Die Bonding Device 11 Data Creation Control Section (Data Creation Section) 13 Camera (Reading Section) 16 Image Data 18 Position Data 21 Control Section 23 Image Recognition Section 24 Pickup Unit 242 XY Table A Wafer Ring W Wafer C Chip B Blue sheet M Reference mark E Reading area

Claims (1)

[Claims] 1. A chip distribution measuring device for measuring the distribution of all chips on a wafer, and a die bonding device for picking up and die-bonding chips based on the data from the chip distribution measuring device. , A reading unit for reading an area including a reference mark written on a sheet on which a wafer is attached to form a wafer ring and all chips on the wafer as an image, and a specific point is set as an origin based on image data from the reading unit A pickup unit for the die bond device, which comprises a data creating means for creating position data in which the coordinates of each position of the entire chip and the reference mark in the XY coordinate system are converted into numerical data and sent to the die bond device. Image for recognizing the position of the reference mark of the wafer ring set on the table of An image recognition unit and a control that controls the operation of the pickup unit based on the position data after driving and controlling the pickup unit so that the recognition position of the reference mark by the image recognition unit matches the reference mark position data in the position data. And a semiconductor manufacturing apparatus.