CN115050677A - Wafer transmission device and method - Google Patents
Wafer transmission device and method Download PDFInfo
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- CN115050677A CN115050677A CN202210699074.3A CN202210699074A CN115050677A CN 115050677 A CN115050677 A CN 115050677A CN 202210699074 A CN202210699074 A CN 202210699074A CN 115050677 A CN115050677 A CN 115050677A
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 225
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 225
- 239000010703 silicon Substances 0.000 claims abstract description 225
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 172
- 238000001514 detection method Methods 0.000 description 15
- 239000013589 supplement Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000001502 supplementing effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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Abstract
The invention discloses a wafer transmission device, comprising: the silicon box upper module comprises a silicon box transmission assembly and a silicon box edge searching assembly, the silicon box transmission assembly is used for transmitting the silicon box into or out of the silicon box edge searching assembly, and the silicon box edge searching assembly is used for rotating the silicon box to a set direction; the wafer upper module comprises a wafer transmission assembly and a wafer edge searching assembly, wherein the wafer transmission assembly is used for transmitting a wafer to the wafer edge searching assembly, and the wafer edge searching assembly is used for rotating the wafer to a set orientation; and the first carrying assembly is used for placing the wafer with the set orientation in the silicon box with the set orientation. The wafer transmission device and the wafer transmission method provided by the invention can automatically realize the transmission and edge searching of the silicon box and the transmission and edge searching of the wafer, can realize the automation of the wafer transmission, can place the wafer according to the preset angle, improve the wafer transmission efficiency, and are provided with FUUs to prevent the wafer from being polluted in the transmission process.
Description
Technical Field
The invention relates to the field of wafer transmission, in particular to a wafer transmission device and a wafer transmission method.
Background
At present, in the process of Metal Organic Chemical Vapor Deposition (MOCVD) in the semiconductor industry, wafer transmission is realized by manually carrying a silicon box and manually loading and unloading wafers; after the MOCVD work is finished on a single silicon box, an operator needs to take out the wafers one by one, then the silicon boxes are replaced with new silicon boxes, and the wafers are placed into the silicon boxes one by one according to the requirements of angle sequence and the like, so that the whole wafer transmission procedure is high in labor intensity, slow in time and low in efficiency.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the invention aims to provide a wafer transmission device and a wafer transmission method, which can automatically realize the transmission and edge searching of a silicon box and the transmission and edge searching of a wafer, can realize the automation of wafer transmission, can place the wafer according to a preset angle, and improve the wafer transmission efficiency.
In order to achieve the purpose, the following technical scheme is adopted in the application: a wafer transfer apparatus comprising:
the silicon box upper module comprises a silicon box transmission assembly and a silicon box edge searching assembly, the silicon box transmission assembly is used for transmitting the silicon box into or out of the silicon box edge searching assembly, and the silicon box edge searching assembly is used for rotating the silicon box to a set direction;
the wafer upper module comprises a wafer transmission assembly and a wafer edge searching assembly, wherein the wafer transmission assembly is used for transmitting a wafer to the wafer edge searching assembly, and the wafer edge searching assembly is used for rotating the wafer to a set orientation;
and the first carrying assembly is used for placing the wafer with the set orientation in the silicon box with the set orientation.
Furthermore, the wafer edge searching assembly comprises a wafer rotating tray, a wafer detecting piece and a wafer control center, wherein the wafer rotating tray and the wafer detecting piece are connected to the wafer control center at the same time, the wafer detecting piece is used for carrying out position identification on wafers on the wafer rotating tray and transmitting the wafers to the control center, and the control center controls the wafer rotating tray to drive the wafers to rotate to a set orientation.
Further, the wafer detection piece comprises a wafer position sensor.
Further, the wafer detection piece comprises a first vision system, the first vision system comprises a first camera located above the wafer rotating tray, and the first camera is connected to the wafer control center.
Furthermore, the first vision system further comprises a first annular light supplement lamp, and the first annular light supplement lamp surrounds the outer side of the first camera.
Furthermore, the silicon box upper modules are two symmetrically arranged.
Further, the silicon wafer edge searching assembly comprises a silicon box rotating tray, a silicon box detecting piece and a silicon box control center, wherein the silicon box rotating tray and the silicon box detecting piece are simultaneously connected to the silicon box control center, the silicon box rotating tray comprises M silicon box placing positions, the silicon box detecting piece is used for carrying out position identification on the silicon box rotating tray and transmitting the silicon box to the silicon box control center, and the silicon box control center controls the silicon box rotating tray to drive the silicon box to rotate to a set orientation; m is an integer greater than 0.
Further, the silicon box detection piece comprises a second vision system, the second vision system comprises a second camera positioned above the silicon box rotating tray, and the second camera is connected to the silicon box control center; the second camera is located in a second camera support and is movable along the second camera support.
Further, the silicon box detection piece also comprises a cleaner for cleaning the silicon box, wherein the cleaner comprises a suction head connected to a vacuum pipeline.
A method of wafer transfer, comprising the steps of:
s1: the wafer transmission component transmits the wafer to the wafer edge searching component, and the wafer edge searching component rotates the wafer to a set orientation;
s2: the silicon box transmission assembly transmits the silicon box into the silicon box edge searching assembly, and the silicon box edge searching assembly rotates the silicon box to a set orientation;
s3: the first carrying assembly places the wafer with the set orientation in the silicon box with the set orientation;
s4: and the silicon box transmission assembly transmits the silicon box with the wafer placed in the silicon box edge searching assembly out of the silicon box edge searching assembly.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: the silicon box transmission assembly is used for transmitting the silicon box into or out of the silicon box edge searching assembly, and the silicon box edge searching assembly is used for rotating the silicon box to a set direction; the wafer is transmitted to the wafer edge searching component by the wafer transmission component, and the wafer edge searching component rotates the wafer to a set orientation; then the wafer with the set orientation is placed in a silicon box with the set orientation through a first carrying assembly; this application can be applicable to wafer transmission after MOCVD accomplishes, can pass through wafer upper module and silicon box upper module with wafer after MOCVD and transmit to next process, can realize automatically that silicon box transmits and seeks limit and wafer transmission and seeks the limit, can realize that wafer transmission is automatic, and can carry out the wafer according to predetermineeing the angle and place, has improved wafer transmission efficiency to the configuration FUU prevents that the wafer from polluting in transmission course.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
In the drawings:
FIG. 1 is a schematic structural diagram of a wafer transfer device according to the present application;
FIG. 2 is a schematic diagram of a wafer level module;
FIG. 3 is a schematic structural diagram of a top module of a silicon cassette;
reference numerals: 1. a frame; 2. a material rack; 3. a wafer transfer assembly; 4. a wafer edge finding component; 41. a first camera; 42. a first annular fill light; 43. an ID identifier; 44. rotating the tray by the wafer; 5. a first handling assembly; 6. a silicon box edge finding component; 61. a second camera; 62. a second annular fill light; 63. a strip light source; 64. a silicon box; 65. a silicon box rotating tray; 8. a silicon box transmission component; 9. and a buffer area.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", and the like are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate that the referred mechanism or element must have a specific direction, and thus, are not to be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are merely for convenience in describing the present technical solution and are not to be construed as indicating or implying any relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Referring to fig. 1-3, a wafer transfer apparatus provided in the present application includes:
the silicon box upper module comprises a silicon box transmission assembly 8 and a silicon box edge searching assembly 6, wherein the silicon box transmission assembly 8 is used for transmitting the silicon box 64 into or out of the silicon box edge searching assembly 6, and the silicon box edge searching assembly 6 is used for rotating the silicon box 64 to a set orientation;
the wafer upper module comprises a wafer transmission component 3 and a wafer edge searching component 4, wherein the wafer transmission component 3 is used for transmitting a wafer to the wafer edge searching component 4, and the wafer edge searching component 4 is used for rotating the wafer to a set orientation;
a first handling assembly 5 for placing the oriented wafer in the oriented silicon box 64.
In the application, the setting of the orientation for the wafer refers to that a notch or an identification mark in the wafer is oriented to a fixed direction, and the specific fixed direction can be determined according to actual requirements or subsequent processes; orienting the silicon box 64 in this application refers to orienting the identification marks in the silicon box 64 in a fixed direction, which may be determined by actual requirements or subsequent processes. In the process of placing the silicon box 64, in order to ensure the smooth proceeding of the subsequent process, the notch or other identification marks in the wafer are required to be aligned to the specific position of the silicon box 64, therefore, the identification marks are also correspondingly arranged on the silicon box 64, for the convenience of placing the wafer, before the wafer is placed, the notch or the identification marks of the wafer face towards the fixed direction, and then the identification marks of the silicon box 64 face towards the fixed direction, so that the placement of the specific angle or the specific position of the wafer can be realized only by the transmission placement of the fixed action.
The silicon box transmission assembly 8 is used for transmitting the silicon box 64 into or out of the silicon box edge searching assembly 6, and the silicon box edge searching assembly 6 is used for rotating the silicon box 64 to a set orientation; the wafer is transmitted to the wafer edge searching component 4 by the wafer transmission component 3, and the wafer edge searching component 4 rotates the wafer to the set orientation; then, the first carrying assembly 5 places the wafer with the set orientation in the silicon box 64 with the set orientation; this application can be applicable to wafer transmission after MOCVD accomplishes, can pass through wafer host module and silicon box host module with wafer after MOCVD and transmit to next process, can realize automatically that silicon box 64 transmits and seeks the limit and wafer transmission and seeks the limit, can realize that wafer transmission is automatic, and can carry out the wafer according to predetermineeing the angle and place, has improved wafer transmission efficiency.
As shown in fig. 1, the wafer upper module and the silicon cassette upper module are both installed in a rack 1.
The wafer edge finding assembly 4 in the present application includes a wafer rotating tray 44 and a wafer detecting element, wherein the wafer detecting element is used for identifying the position of the wafer on the wafer rotating tray 44 and controlling the wafer rotating tray 44 to drive the wafer to rotate to a set orientation.
As shown in fig. 2, the wafer rotating tray 44 is a circular tray, on which a wafer placing position is disposed, and the wafer rotating tray 44 can rotate, so that a notch or other identification mark in the wafer can face a set direction. In the application, the wafer rotating tray 44 and the wafer detection piece are both connected to the wafer control center, and the wafer control center controls the wafer rotating tray 44 to rotate according to the detection structure of the wafer detection piece, so that the notch or other identification marks in the wafer face to a specific direction.
As a specific example, the wafer transfer assembly 3 may be a robot arm for picking and placing wafers from the stacks 2 into the wafer rotating tray 44.
As a specific embodiment, the wafer detection component in the present application includes a wafer position sensor, where the wafer position sensor senses a notch or an identification mark in a wafer and transmits the position of the notch or the identification mark to the wafer control center, and the wafer control center controls the wafer rotating tray to rotate to drive the notch or the identification mark in the wafer to rotate to a specific position.
As another specific example, as shown in fig. 2, the wafer inspection device of the present application includes a first vision system including a first camera 41 located above a wafer rotation tray 44, wherein the first camera 41 is connected to a wafer control center. The first camera 41 is configured to take a picture of the wafer rotating tray 44 and transmit the picture to the wafer control center, and the wafer control center identifies the position of the wafer gap or the identification mark according to the picture and controls the rotating direction and the rotating angle of the wafer rotating tray 44 according to the position information, so that the wafer faces to a specific position.
In order to ensure that the shooting effect of the first camera 41 is clear, the first vision system further includes a first annular light supplement lamp 42, and the first annular light supplement lamp 42 is disposed around the outer side of the first camera 41 and used for supplementing light to the field of view of the first camera 41 during shooting.
In order to record the placement position of the wafer or clarify the information parameters of the wafer, the present application may further provide an ID identifier 43 above the wafer rotating tray 44 for identifying the wafer, for example, the information parameters of the wafer may be obtained by scanning a two-dimensional code on the wafer.
The silicon wafer edge searching assembly comprises a silicon box rotating tray 65, a silicon box detection piece and a silicon box control center, wherein the silicon box rotating tray 65 and the silicon box detection piece are connected to the silicon box control center at the same time, the silicon box rotating tray 65 comprises M silicon box placing positions, the silicon box detection piece is used for carrying out position recognition on a silicon box 64 on the silicon box rotating tray 65 and transmitting the silicon box 64 to the silicon box control center, and the silicon box control center controls the silicon box rotating tray 65 to drive the silicon box 64 to rotate to a set orientation; m is an integer greater than 0.
In order to improve the efficiency of placing of wafer, the last module of silicon box is two that the symmetry set up in this application. Because the quantity of silicon box 64 is a plurality of in the rotatory tray 65 of silicon box, all need carry out position adjustment before placing the wafer to every silicon box 64, when silicon box 64 on one of them silicon box rotatory tray 65 carries out position adjustment, first transport subassembly 5 can place the wafer in the silicon box 64 of adjusting the position on another silicon box rotatory tray 65, the last module of two silicon boxes uses of mutually supporting, can improve the efficiency of placing of wafer.
As shown in fig. 3, the silicon cassette rotating tray 65 in the present application is a circular tray, on which a plurality of silicon cassette placing positions are disposed, and the silicon cassette rotating tray 65 can rotate, so that the identification mark in the silicon cassette 64 can face a set direction. Rotatory tray 65 of silicon box and silicon box detection piece all are connected to silicon box control center in this application, and silicon box control center rotates according to the rotatory tray 65 of detection structure control silicon box that silicon box detected the piece, and then makes the identification mark orientation specific direction in the silicon box 64.
As a specific example, the silicon cassette transfer assembly 8 in the present application is a robot arm for picking up the silicon cassette 64 from the buffer 9 and transferring it to be placed in the silicon cassette rotating tray 65.
As a specific embodiment, the silicon box detection element in the present application includes a silicon box position sensor, and the silicon box position sensor senses a notch or an identification mark in the silicon box 64 and transmits the position of the notch or the identification mark to the silicon box control center, and the silicon box control center controls the silicon box rotating tray 65 to rotate to drive the identification mark in the silicon box 64 to rotate to a specific position.
As another specific example, the cassette testing part includes a second vision system including a second camera 61 positioned above the cassette rotating tray 65, the second camera 61 being connected to the cassette control center. The second camera 61 is configured to photograph the silicon cassette rotating tray 65 and transmit an image to the silicon cassette control center, which recognizes the position of the silicon cassette 64 recognition mark from the image and controls the rotation direction and the rotation angle of the silicon cassette rotating tray 65 so that the silicon cassette 64 faces a specific position.
Since the number of the silicon cassettes 64 in the silicon cassette rotating tray 65 is plural, and the view field of the second camera 61 can only shoot a part of the silicon cassettes 64, the second camera 61 is located in the second camera support and can move along the second camera support in the moving direction which can be front, back, left and right, and is used for adjusting the position of the second camera 61 so that the second camera can shoot images of the silicon cassettes 64 at different positions. Meanwhile, the silicon box rotating tray 65 can rotate in the present application, and the movement of the second camera 61 is combined with the rotation of the silicon box rotating tray 65, so that the shooting range of the second camera 61 can cover the whole surface of the silicon box rotating tray 65.
In order to ensure that the shooting effect of the second camera 61 is clear, the second vision system further includes a second annular light supplement lamp 62, and the second annular light supplement lamp 62 is arranged around the outer side of the second camera 61 and used for supplementing light to the visual field range of the second camera 61 during shooting. Since the field of view of the second camera 61 is smaller than the area of the silicon cassette rotating tray 65, the second annular fill light 62 may be located below the second camera 61 and above the silicon cassette rotating tray 65. Meanwhile, in order to ensure the light supplement effect, a bar-shaped light source 63 can be arranged on the side edge of the silicon box rotating tray 65 and used for supplementing light when the second camera 61 shoots.
The application also provides a wafer transmission method, which comprises the following steps:
s1: the wafer transmission component 3 transmits the wafer to the wafer edge searching component 4, and the wafer edge searching component 4 rotates the wafer to the set orientation; the method specifically comprises the following steps:
s11: the wafer transmission component 3 is a robot arm, and the wafer is grabbed from the material rack 2 and placed in the wafer rotating tray 44;
s12: the first annular light supplement lamp 52 is turned on to supplement light, the first camera 41 is used for photographing the wafer rotating tray 44 and transmitting the image to the wafer control center, and the wafer control center recognizes the position of the wafer gap or the recognition mark according to the image;
s13: the wafer control center controls the rotation direction and the rotation angle of the wafer rotating tray 44 according to the position information, so that the wafer faces to a specific position;
s2: the silicon box transmission assembly 8 transmits the silicon box 64 into the silicon box edge searching assembly 6, and the silicon box edge searching assembly 6 rotates the silicon box 64 to a set orientation; the method specifically comprises the following steps:
s21: the silicon box transmission assembly 8 is a robot arm, and is used for grabbing the silicon box 64 from the buffer area 9 and transmitting and placing the silicon box in the silicon box rotating tray 65;
s22: the suction head is aligned with the silicon box 64, and particle impurities on the silicon box 64 are cleaned through the vacuumizing action of the vacuum pipeline;
s23: the second annular light supplement lamp 62 and the bar-shaped light source 63 are turned on to supplement light, the second camera 61 takes pictures of the silicon box rotating tray 65 and transmits the pictures to the silicon box control center, the silicon box control center identifies the position of the identification mark of the silicon box 64 according to the pictures and transmits the position information to the silicon box control center,
s24: the cassette control center controls the rotation direction and rotation angle of the cassette rotation tray 65 based on the position information so that the cassette 64 is directed to a specific position;
s3: the first carrying component 5 places the wafer with the set orientation in the silicon box 64 with the set orientation; the first transfer module 5 may be a robot arm, and since the wafer orientation and the silicon cassette 64 orientation are fixed, the transfer operation of the first transfer module 5 is also fixed.
S4: after the silicon cassettes 64 are placed with wafers in the cassette rotating tray 65, the cassette transferring assembly 8 transfers the silicon cassette 64 in the cassette edge finder assembly 6 from the cassette edge finder assembly 6 to the buffer 9 for storage.
The buffer 9 may be a carrier vehicle or a storage library for storing silicon cassettes in the prior art, and the like.
It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (10)
1. A wafer transfer apparatus, comprising:
the silicon box upper module comprises a silicon box transmission assembly and a silicon box edge searching assembly, wherein the silicon box transmission assembly is used for transmitting the silicon box into or out of the silicon box edge searching assembly, and the silicon box edge searching assembly is used for rotating the silicon box to a set orientation;
the wafer upper module comprises a wafer transmission assembly and a wafer edge searching assembly, wherein the wafer transmission assembly is used for transmitting a wafer to the wafer edge searching assembly, and the wafer edge searching assembly is used for rotating the wafer to a set orientation;
and the first carrying assembly is used for placing the wafer with the set orientation in the silicon box with the set orientation.
2. The wafer conveying device according to claim 1, wherein the wafer edge-finding assembly comprises a wafer rotating tray, a wafer detecting element and a wafer control center, the wafer rotating tray and the wafer detecting element are connected to the wafer control center at the same time, the wafer detecting element is used for identifying the position of the wafer on the wafer rotating tray and conveying the wafer to the control center, and the control center controls the wafer rotating tray to drive the wafer to rotate to a set orientation.
3. The wafer transfer device of claim 2, wherein the wafer detecting element comprises a wafer position sensor.
4. The wafer transfer device of claim 2, wherein the wafer inspection piece comprises a first vision system, the first vision system comprising a first camera positioned above the wafer rotation tray, the first camera connected to the wafer control center.
5. The wafer transfer device of claim 4, wherein the first vision system further comprises a first annular fill light, the first annular fill light disposed around an outer side of the first camera.
6. The wafer conveying apparatus as claimed in claim 1, wherein the silicon cassette upper module is two symmetrically disposed modules.
7. The wafer conveying device according to claim 1, wherein the wafer edge finding assembly comprises a silicon cassette rotating tray, a silicon cassette detecting element and a silicon cassette control center, the silicon cassette rotating tray and the silicon cassette detecting element are connected to the silicon cassette control center at the same time, the silicon cassette rotating tray comprises M silicon cassette placing positions, the silicon cassette detecting element is used for identifying the position of the silicon cassette on the silicon cassette rotating tray and conveying the silicon cassette to the silicon cassette control center, and the silicon cassette control center controls the silicon cassette rotating tray to drive the silicon cassette to rotate to a set orientation; m is an integer greater than 0.
8. The wafer transfer device of claim 7, wherein the cassette detector comprises a second vision system comprising a second camera positioned above the cassette spin tray, the second camera connected to a cassette control center; the second camera is located in a second camera support and is movable along the second camera support.
9. The wafer transfer device of claim 8, wherein the cassette testing part further comprises a cleaner for cleaning the cassette, the cleaner comprising a suction head connected to a vacuum line.
10. A method for transferring a wafer by using the wafer transfer device as claimed in any one of claims 1 to 9, comprising the steps of:
s1: the wafer transmission component transmits the wafer to the wafer edge searching component, and the wafer edge searching component rotates the wafer to a set orientation;
s2: the silicon box transmission assembly transmits the silicon box into the silicon box edge searching assembly, and the silicon box edge searching assembly rotates the silicon box to a set orientation;
s3: the first carrying assembly places the wafer with the set orientation in the silicon box with the set orientation;
s4: and the silicon box transmission assembly transmits the silicon box with the wafer placed in the silicon box edge searching assembly out of the silicon box edge searching assembly.
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| JP2016134525A (en) * | 2015-01-20 | 2016-07-25 | リンテック株式会社 | Transfer device and transfer method |
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| CN111834271A (en) * | 2020-09-15 | 2020-10-27 | 北京京仪自动化装备技术有限公司 | Wafer batch conveying mechanism |
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| CN114361086A (en) * | 2021-12-28 | 2022-04-15 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and wafer transmission system thereof |
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| KR20120002409A (en) * | 2010-06-30 | 2012-01-05 | 야마하하쓰도키 가부시키가이샤 | Component transporting method, component transporting apparatus, and component mounting apparatus |
| JP2016134525A (en) * | 2015-01-20 | 2016-07-25 | リンテック株式会社 | Transfer device and transfer method |
| CN106783705A (en) * | 2016-11-30 | 2017-05-31 | 上海华力微电子有限公司 | A kind of wafer transfer approach for optimizing defects of wafer edge |
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