CN112934725A - Automatic chip appearance detection equipment and control method thereof - Google Patents
Automatic chip appearance detection equipment and control method thereof Download PDFInfo
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- CN112934725A CN112934725A CN202110201780.6A CN202110201780A CN112934725A CN 112934725 A CN112934725 A CN 112934725A CN 202110201780 A CN202110201780 A CN 202110201780A CN 112934725 A CN112934725 A CN 112934725A
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- 238000001514 detection method Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 204
- 239000000463 material Substances 0.000 claims abstract description 189
- 235000012431 wafers Nutrition 0.000 claims abstract description 146
- 230000000007 visual effect Effects 0.000 claims abstract description 43
- 230000008569 process Effects 0.000 claims abstract description 12
- 230000033001 locomotion Effects 0.000 claims description 36
- 238000012360 testing method Methods 0.000 claims description 35
- 230000001360 synchronised effect Effects 0.000 claims description 25
- 238000007689 inspection Methods 0.000 claims description 17
- 230000000712 assembly Effects 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 14
- 238000001179 sorption measurement Methods 0.000 claims description 13
- 230000035939 shock Effects 0.000 claims description 9
- 238000011179 visual inspection Methods 0.000 claims description 9
- 239000005304 optical glass Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 230000007547 defect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 230000002194 synthesizing effect Effects 0.000 claims description 3
- 238000013461 design Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000002360 explosive Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/3412—Sorting according to other particular properties according to a code applied to the object which indicates a property of the object, e.g. quality class, contents or incorrect indication
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
Abstract
The invention provides a chip appearance automatic detection device and a control method thereof, wherein the chip appearance automatic detection device comprises: the automatic feeding mechanism is arranged on the rack, the material taking mechanism is arranged on one side of the automatic feeding mechanism, the carrying mechanism is arranged above the material taking mechanism, and the visual detection mechanism is arranged on one side of the material taking mechanism and one side of the carrying mechanism; the automatic feeding mechanism is arranged on the rack, the carrying mechanism carries the wafers at the feeding positions to the visual detection mechanism for visual detection, the carrying module and the material taking module are used for placing the wafers in the material frame again after the detection is finished, and the automatic feeding mechanism simultaneously carries the next wafer to the feeding position for the next detection process. The invention can effectively improve the working efficiency and the automation degree and effectively reduce the cost.
Description
Technical Field
The present invention relates to an automatic inspection apparatus, and more particularly, to an automatic inspection apparatus for chip appearance, and a control method applied to the automatic inspection apparatus for chip appearance.
Background
The starting of the domestic semiconductor industry is late, the appearance detection of wafer chip products generally adopts a manual detection mode, a large amount of manpower and working hours are consumed, and secondary pollution and damage are easily caused in the detection; wafer detection equipment in the market generally adopts a mechanical arm feeding mode, a single line detection mode and a static photographing detection mode, so that the manufacturing cost is high, the working efficiency is low, the photographing interval is long, the photographing positioning precision error is large, and the actual production and test requirements cannot be met; therefore, how to quickly and efficiently realize the visual test and reasonably control the cost in the automatic detection process of the chip appearance is an urgent problem to be solved.
Disclosure of Invention
The invention aims to solve the technical problem of high automation degree and working efficiency and low cost of the automatic detection equipment for the chip appearance, and further provides a control method applied to the automatic detection equipment for the chip appearance on the basis.
To this end, the present invention provides an apparatus for automatically detecting a chip appearance, comprising: the automatic feeding device comprises a rack, an automatic feeding mechanism, a material taking mechanism, a carrying mechanism and a visual detection mechanism, wherein the automatic feeding mechanism is arranged on the rack, the material taking mechanism is arranged on one side of the automatic feeding mechanism, the carrying mechanism is arranged above the material taking mechanism, and the visual detection mechanism is arranged on one side of the material taking mechanism and one side of the carrying mechanism; the automatic feeding mechanism conveys wafers on each layer in the material frame to a feeding position of the material taking mechanism; the material taking mechanism takes the wafer out of the material frame, identifies the wafer and places the wafer at the material loading position of the carrying mechanism; the carrying mechanism carries the wafers at the feeding position to the visual detection mechanism for visual detection, the carrying module and the material taking module are used for placing the wafers in the material frame again after the detection is finished, and meanwhile, the automatic feeding mechanism moves upwards to carry the next wafer to the feeding position for the next detection process.
The invention has the further improvement that two groups of material taking mechanisms respectively corresponding to the automatic feeding mechanisms are arranged on the rack, and electric carrying assemblies corresponding to the material taking mechanisms are respectively arranged on two sides of the carrying mechanism; the two groups of automatic feeding mechanisms and the material taking mechanisms respectively work in a coordinated mode, and when one group of automatic feeding mechanisms and the other group of automatic taking mechanisms are short of materials, the other group of automatic feeding mechanisms and the material taking mechanisms are started to work; and two groups of electric carrying components of the carrying mechanism work simultaneously, one group of electric carrying components are used for carrying the wafer to a testing position of the visual detection mechanism from a loading position, and the other group of electric carrying components are used for carrying the wafer after detection to a discharging position from the testing position so as to be placed in the material frame.
The invention has the further improvement that the visual detection mechanism comprises a supporting platform, an XY axis motion module, a motor assembly, a vacuum adsorption platform, a visual module and a Z axis motion module, wherein the XY axis motion module is arranged on the supporting platform, the vacuum adsorption platform is arranged on the XY axis motion module through the motor assembly, and the visual module is arranged above the vacuum adsorption platform through the Z axis motion module; the vacuum adsorption platform comprises a backlight source, a vacuum sucker and a support piece, wherein the backlight source is arranged above the motor assembly; the vacuum chuck is arranged on the backlight source and arranged between the backlight source and the supporting piece.
In a further improvement of the present invention, the visual inspection mechanism comprises the support member is an optical glass; the vacuum chuck is provided with a double-path narrow groove and a chuck air inlet, the double-path narrow groove is a circular groove arranged on the vacuum chuck, and the chuck air inlet is symmetrically arranged on the outer side of the vacuum chuck.
A further improvement of the invention is that the support platform comprises a shock absorbing member and a rigid support platform, the shock absorbing member being disposed below the rigid support platform.
The automatic feeding mechanism comprises a material frame, a material frame placing frame, a lead screw module installing frame and an ultrasonic sensor, wherein the material frame is connected with the lead screw module through the material frame placing frame; the ultrasonic sensor is arranged at the bottom of the material frame placing frame and corresponds to the position of the material frame.
The invention has the further improvement that the material taking mechanism comprises an X-axis motor synchronous belt module, a wafer track, a Y-axis motor synchronous belt module, a clamping jaw assembly, a code scanner assembly and a photoelectric sensor; the wafer track is arranged on the X-axis motor synchronous belt module and arranged on two sides of the Y-axis motor synchronous belt module; the clamping jaw assembly is arranged on the Y-axis motor synchronous belt module, and the code scanner assembly is arranged on one side, close to the wafer, of the clamping jaw assembly; the photoelectric sensor is arranged on the inner wall of the wafer track and below the Y-axis motor synchronous belt module.
The carrying mechanism comprises a portal frame, an X-axis module, an electric carrying module and a movable material taking module, wherein the X-axis module is arranged on the portal frame, the electric carrying module is arranged on the left side and the right side of the X-axis module, and the movable material taking module is connected to the X-axis module in a sliding mode through the electric carrying module.
The invention also provides a control method of the automatic chip appearance detection equipment, which is applied to the automatic chip appearance detection equipment and comprises the following steps:
step S1, scanning the code through the material taking mechanism to obtain the wafer ID;
step S2, the wafer is placed on a supporting platform of the visual inspection mechanism through the carrying mechanism;
step S3, the wafer is absorbed and fixed on the supporting platform through the vacuum function of the visual detection mechanism;
step S4, adjusting the wafer to the photographing position through the XY axis movement module and the motor component of the visual detection mechanism;
step S5, turning on a backlight source of the visual detection mechanism, taking a picture through a visual module of the visual detection mechanism, and adjusting the position of the wafer in real time until a complete area image is obtained;
step S6, determining whether the wafer has defects by image processing detection and synthesizing a complete image
Step S7, storing wafer detection data;
and step S8, closing the vacuum function of the visual detection mechanism, moving the wafer to a blanking position through the carrying mechanism, realizing blanking and transmitting the wafer into the material frame.
The invention has the further improvement that the two groups of automatic feeding mechanisms, the material taking mechanisms and the electric carrying assembly work in a coordinated mode, and the process comprises the following steps:
step A1, initializing, and moving the clamping jaw assemblies of the two groups of material taking mechanisms to a safe height respectively;
step A2, the material taking mechanism starts to feed materials, and the automatic feeding mechanism transfers the wafers from the material frame to the material level;
step A3, moving the first group of electric carrying components to the loading position to grab the first wafer and move to the testing position, and simultaneously moving the second group of electric carrying components to the unloading position to wait;
step S4, the first wafer starts to be detected;
step A5, the material taking mechanism pulls the second wafer, and the first group of electric carrying components return to the loading position to move the second wafer to a test waiting position;
step A6, after the first wafer is tested, the second group of electric carrying assemblies take the first wafer away and place the first wafer to a blanking position, and the first wafer is placed back to the material frame through the material taking mechanism; simultaneously, the first group of electric carrying assemblies move the second wafer from the test waiting position to the test position and place the second wafer on the supporting platform of the visual detection mechanism;
and step A7, the second wafer starts to be detected, the material taking mechanism pulls the third wafer, the first group of electric carrying assemblies returns to the loading position to move the third wafer to the test waiting position, and the next detection process is realized in a circulating mode.
Compared with the prior art, the invention has the beneficial effects that: through the two groups of automatic feeding mechanisms and the matched material taking mechanism and carrying mechanism thereof, the appearance automatic detection without shutdown is realized, the material changing time interval of the product in visual detection is greatly shortened, the integral working efficiency is effectively improved, complicated components such as a mechanical arm or a mechanical arm are not needed, the automation degree of the equipment is improved, the cost is effectively reduced, and the later maintenance is convenient; on the basis, the precision and controllability of the visual test of the device are effectively improved through the optimized design of mechanisms such as a visual detection mechanism and the like.
Drawings
FIG. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic illustration of an explosive structure according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of a visual inspection mechanism according to an embodiment of the present invention;
FIG. 4 is an exploded view of a visual inspection mechanism according to an embodiment of the present invention;
FIG. 5 is an exploded view of a vacuum adsorption platform according to an embodiment of the present invention;
FIG. 6 is a schematic perspective view of an automatic feeding mechanism according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of an explosive structure with a material frame removed by the automatic feeding mechanism according to an embodiment of the present invention;
FIG. 8 is a schematic side view of an automatic feeding mechanism according to an embodiment of the present invention;
fig. 9 is a schematic top view of a material frame placing rack of an automatic feeding mechanism according to an embodiment of the present invention.
FIG. 10 is a schematic perspective view of a take-off mechanism according to one embodiment of the invention;
fig. 11 is an exploded view of a take off mechanism according to an embodiment of the present invention;
FIG. 12 is a schematic perspective view of a handling mechanism according to an embodiment of the present invention;
fig. 13 is an exploded view of a handling mechanism according to an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
As shown in fig. 1 and 2, the present example provides an automatic chip appearance inspection apparatus, including: the automatic feeding device comprises a rack 1, an automatic feeding mechanism 2, a material taking mechanism 3, a carrying mechanism 4 and a visual detection mechanism 5, wherein the automatic feeding mechanism 2 is arranged on the rack 1, the material taking mechanism 3 is arranged on one side of the automatic feeding mechanism 2, the carrying mechanism 4 is arranged above the material taking mechanism 3, and the visual detection mechanism 5 is arranged on one side of the material taking mechanism 3 and one side of the carrying mechanism 4; two groups of automatic feeding mechanisms 2 are arranged on the rack 1, and the automatic feeding mechanisms 2 convey wafers on each layer in the material frame to the feeding position of the material taking mechanism 3; the material taking mechanism 3 takes out the wafer from the material frame, identifies the wafer and places the wafer at the material loading position of the carrying mechanism 4; the carrying mechanism 4 carries the wafers at the loading position to the visual detection mechanism 5 for visual detection, the carrying module and the material taking module are used for placing the wafers in the material frame again after the detection is finished, and meanwhile, the automatic loading mechanism 2 moves upwards to carry the next wafer to the loading position for the next detection process.
As shown in fig. 1 and 2, two groups of material taking mechanisms 3 corresponding to the automatic feeding mechanism 2 are arranged on the rack 1, and electric carrying assemblies corresponding to the material taking mechanisms 3 are arranged on two sides of the carrying mechanism 4; the two groups of automatic feeding mechanisms 2 and the material taking mechanisms 3 respectively work in a cooperative mode, and when one group of automatic feeding mechanisms is short of materials, the other group of automatic feeding mechanisms is started to work; and two groups of electric carrying components of the carrying mechanism 4 work simultaneously, one group of electric carrying components is used for carrying the wafers from the loading position to the testing position of the visual detection mechanism 5, and the other group of electric carrying components is used for carrying the wafers after detection from the testing position to the unloading position so as to be placed in the material frame. The motorized carrier assembly of this example includes a motorized module 43 and a mobile reclaiming module 44.
In order to facilitate understanding of the detailed structure of the present embodiment and the advantages thereof, the present embodiment will be described and explained in detail below with respect to the automatic feeding mechanism 2, the material taking mechanism 3, the carrying mechanism 4, and the visual inspection mechanism 5.
As shown in fig. 3 to 5, the vision testing mechanism 5 of the present example includes: the device comprises a supporting platform 51, an XY-axis motion module, a motor component 52, a vacuum adsorption platform 53, a vision module 54 and a Z-axis motion module 55, wherein the XY-axis motion module is arranged on the supporting platform 51, the vacuum adsorption platform 53 is arranged on the XY-axis motion module through the motor component 52, and the vision module 54 is arranged above the vacuum adsorption platform 53 through the Z-axis motion module 55.
The support platform 51 of this example includes a shock absorbing member 511 and a rigid support platform 512, wherein the shock absorbing member 511 is disposed below the rigid support platform 512. The shock absorbing member 511 is preferably an air-float shock absorber for absorbing shock generated during the movement of the apparatus; the rigid supporting platform 512 is preferably a marble platform, which has the advantages of high precision and high rigidity, and can reduce the influence of the surrounding environment on the test result.
The XY-axis motion module in this example comprises an X-axis linear module 56, a Y-axis linear module 57 and a first drag chain 58, the X-axis linear module 56 is arranged on the support platform 51 through the Y-axis linear module 57, the motor assembly 52 in this example preferably adopts a DD motor (direct drive motor), the X-axis linear module 56, the Y-axis linear module 57 and the DD motor of the motor assembly 52 jointly realize high-precision adjustment of the position of the vacuum adsorption platform 53 in the horizontal direction, and the repeated positioning precision can reach 2 micrometers; the first drag chain 58 is arranged on one side of the Y-axis linear module 57, and expansion is facilitated through the first drag chain 58.
As shown in fig. 3 to 5, the vacuum suction platform 53 of the present embodiment includes an air pipe rotary joint 531, a motor connecting seat 532, a backlight source 533, a vacuum chuck 534 and a support 535, and the motor assembly 52 is connected to the vacuum chuck 534 through the air pipe rotary joint 531 and the motor connecting seat 532; the backlight 533 is disposed above the motor assembly 52, and more specifically, disposed on the motor connecting seat 532; the vacuum chuck 534 is disposed on the backlight 533 and between the backlight 533 and the support 535. The air pipe rotary joint 531 is used for realizing rotary switching of the air pipe; the motor connecting seat 532 is also called a mounting seat, and is used for mounting the backlight 533 and connecting to the motor assembly 52; the backlight 533 is used for polishing the back of the product when the camera shoots; the vacuum chuck 534 is a hollow vacuum chuck, and the vacuum chuck 534 is used for adsorbing products such as a wafer 6 and the like by using vacuum negative pressure so as to realize positioning; the support 535 is preferably optical glass for supporting a product, so that the flatness of the product during testing is ensured, and in addition, because the vacuum chuck 534 is hollow, the vacuum chuck 534 is additionally provided with optical glass for supporting the product, the vertical shaking of the product during testing can be reduced, and the testing precision is improved; the product is preferably a wafer 6, but may be other products requiring testing.
As shown in fig. 3, the vacuum chuck 534 of this embodiment is provided with a two-way narrow groove 5341 and a chuck air inlet 5342, the two-way narrow groove 5341 is a circular groove provided on the vacuum chuck 534, so that the deformation of the product under vacuum pressure is effectively reduced under the condition of ensuring the suction force; the sucking disc air inlets 5342 are symmetrically arranged at the outer side of the vacuum sucking disc 534, and the number of the sucking disc air inlets 5342 is preferably four, so that the flow rate of the vacuum sucking disc 534 is increased, and the reaction speed is improved.
As shown in fig. 4, the vision module 54 in this embodiment includes a camera protection cover 541, an industrial camera 542 and a camera mounting plate 543, the industrial camera 542 is disposed on the Z-axis motion module 55 through the camera mounting plate 543, the industrial camera 542 is disposed between the camera protection cover 541 and the camera mounting plate 543, so as to facilitate protection of the industrial camera 542, and the industrial camera 542 preferably includes a camera body 5421, a lens 5422 and a light source 5423, as shown in fig. 4, so as to provide a basis for vision inspection.
As shown in fig. 3 to 5, the Z-axis motion module 55 of this embodiment can adjust the height of the industrial camera 542 in the vision module 54, and is convenient for installation and fixation, so as to improve the stability and the service life of the product.
As shown in fig. 6 to 9, the present embodiment realizes the structural description by one set of the automatic feeding mechanism 2, and in fact, the present embodiment preferably adopts two sets of automatic feeding mechanisms 2 working together; the automatic feeding mechanism 2 comprises a material frame 21, a material frame placing frame 22, a screw rod module 23 and a screw rod module mounting frame 24, wherein the material frame 21 is connected with the screw rod module 23 through the material frame placing frame 22, the screw rod module 23 is mounted on the screw rod module mounting frame 24, one end of the material frame placing frame 22 is provided with a laser sensor 29, the laser sensor 29 is vertically arranged at the edge of the material frame placing frame 22 close to a material placing position, the material placing position refers to a position for placing a material, such as a position for placing a wafer 6, in the embodiment, whether the material (such as the wafer 6) is placed in place is sensed through the laser sensor 29, if a certain wafer 6 is not placed in place, the wafer can shield light emitted by the laser sensor 29, and then the sensor is triggered to alarm, so that the in-place information of the material (such as the wafer 6) assists automatic control, promote its intelligent design degree and reliable performance, need not to adopt the arm material loading, the cost obviously reduces, and work efficiency is high, and motion mode and simple structure are effective, and later maintenance cost is also lower.
Still further, this example preferably includes an ultrasonic sensor 210, the ultrasonic sensor 210 is disposed at the bottom of the material frame placing rack 22, corresponds to the position of the material frame 21, and is used for sensing whether the material frame 21 is placed in place, when the material frame 21 is placed on the material frame placing rack 22, the ultrasonic sensor 210 is in an activated state, and the computer determines that the material is loaded, so as to provide a proximity switch control basis for the intelligent control of the material loading.
In this embodiment, the material frame 21 is provided with at least two lateral limiting blocks 211 at equal intervals in the vertical direction, and the lateral limiting blocks 211 are symmetrically arranged on the inner wall of the material frame 21.
The material frame 21 in this embodiment is preferably a material frame for arranging the wafer 6, the material frame 21 is provided with at least two lateral limiting blocks 211 at equal intervals in the vertical direction, the lateral limiting blocks 211 are symmetrically arranged on the inner wall of the material frame 21, so that the wafers are arranged in the material frame 21 at equal intervals, as shown in fig. 1; the material frame placing frame 22 is used for fixing and placing the material frame 21, and the screw rod module 23 and the screw rod module mounting frame 24 are used for realizing the vertical movement of the material frame placing frame 22, so as to drive the movement of the wafer 6 in the material frame 21 to realize automatic feeding.
Two symmetrically-arranged baffles 212 are arranged on two sides of the material frame 21, the lateral limiting blocks 211 are symmetrically arranged on the inner wall of the baffles 212, and an upper material frame cover 213 is arranged at the upper end of the baffles 212, so that the material frame structure is simpler, more convenient and more effective, and is convenient to match with other components of the automatic chip appearance detector.
As shown in fig. 6 and 7, in this embodiment, two sides of the material frame placing rack 22 are provided with fixing flanges 221, and the fixing flanges 221 are arranged at the outer side of the bottom of the baffle 212, so as to facilitate the blocking and limiting function of the baffle 212 and increase the structural performance of the material frame 21; in order to meet the requirements of different sizes, a flange adjusting part (not shown in the figure) is further effectively arranged on the material frame placing frame 22, the flange adjusting part is a structural part for adjusting the fixed flange 221, and the fixed flange 221 is arranged on the material frame placing frame 22 through the flange adjusting part, so that the size of the material frame 21 can be adjusted by adjusting the position of the fixed flange 221. For example, the retaining-edge adjusting member preferably includes a sliding slot and a locking member, the fixing retaining edge 221 is fixed in the sliding slot by the locking member, and the fixing retaining edge 221 is locked at different positions, so as to meet different size requirements.
As shown in fig. 7, the material frame fixing block 5 is further included in the present example, and the baffle 212 is disposed on the material frame placing frame 22 through the material frame fixing block 5, so as to facilitate the installation and the disassembly of the material frame 21, and realize the detachable installation, so that the material frame is more flexible and controllable.
As shown in fig. 9, the material frame placing frame 22 of this embodiment is further provided with front and rear limiting blocks 222, and the front and rear limiting blocks 222 are symmetrically arranged between the baffles 212 at two sides, so as to achieve the front and rear limiting function of the material frame 21.
As shown in fig. 7, the present embodiment further preferably includes a slider connecting frame 26 and a second drag chain 27, the lead screw module 23 is connected to the lead screw module mounting frame 24 through the slider connecting frame 26, and the lead screw module 23 is slidably connected to the slider connecting frame 26; the second drag chain 27 is respectively connected with the screw rod module 23 and the slider connecting frame 26, so as to provide power for the up-and-down movement of the material frame 21, and ensure the stability and reliability of the movement.
Corresponding to the automatic feeding mechanism 2, the number of the material taking mechanisms 3 in this embodiment is also preferably two, and the following description and explanation are given by the structure of one of the two groups; as shown in fig. 10 and 11, the material taking mechanism 3 in this embodiment includes an X-axis motor timing belt module 31, a wafer rail 32, a Y-axis motor timing belt module 33, a clamping jaw assembly 34, a code scanner assembly 35, and a first photoelectric sensor 36; the wafer track 32 is arranged on the X-axis motor synchronous belt module 31 and arranged on two sides of the Y-axis motor synchronous belt module 33; the clamping jaw assembly 34 is arranged on the Y-axis motor synchronous belt module 33, and the code scanner assembly 35 is arranged on one side of the clamping jaw assembly 34 close to the wafer 6; the first photoelectric sensor 36 is arranged on the inner wall of the wafer track 32 and below the Y-axis motor synchronous belt module 33; in this embodiment, the first photoelectric sensor 36 senses whether the wafer 6 exists in the loading position and the unloading position, so as to further improve the intelligent design degree of the wafer on the basis of reasonable control cost, and provide a basis for automatic loading and unloading on the basis of automatic material taking.
The X-axis motor synchronous belt module 31 is a synchronous module for realizing X-axis motion, the wafer rail 32 is a rail assembly for realizing sliding motion of the wafer 6, the Y-axis motor synchronous belt module 33 is a synchronous module for realizing Y-axis motion, the clamping jaw assembly 34 is preferably a pneumatic assembly for realizing grabbing of the wafer 6, and the bar code scanner assembly 35 is a bar code scanner module for realizing two-dimensional code; this example wafer track 32 set up in on the X axle motor hold-in range module 31, and set up in Y axle motor hold-in range module 33's both sides, and clamping jaw subassembly 34 set up in on the Y axle motor hold-in range module 33, bar code scanner subassembly 35 set up in clamping jaw subassembly 34 is close to one side of wafer 6, and then can take out the material loading position from the material frame with wafer 6 through improving back overall structure, and pass through scanner scanning wafer 6's two-dimensional code is in order to acquire product information, can also be after wafer 6 accomplishes the test with it from the unloading position send back the material frame in, and then for automatic getting the material provides fine basis, and with low costs, the later maintenance of being convenient for.
The wafer track 32 comprises a track body 321 and a track support 322, the track body 321 is arranged on two sides of the Y-axis motor synchronous belt module 33, and the track body 321 is arranged on the X-axis motor synchronous belt module 31 in a sliding mode through the track support 322, so that track transmission of a grabbed wafer 6 is facilitated.
The wafer track 32 comprises a track body 321 and a track support 322, the track body 321 is arranged on two sides of the Y-axis motor synchronous belt module 33, and the track body 321 is arranged on the X-axis motor synchronous belt module 31 in a sliding mode through the track support 322, so that track transmission of a grabbed wafer 6 is facilitated.
As shown in fig. 10, in this embodiment, a protruding rib 323 is further disposed on a side of the track body 321 away from the Y-axis motor synchronous belt module 33, and the protruding rib 323 is higher than the rib of the track body 321, so that the wafer 6 is blocked and limited while the wafer 6 is transported by the track, and the reliability of the automatic material taking mechanism is improved; in addition, the rail body 321 is preferably a trapezoidal rail with a narrow upper part and a wide lower part, so that the rail body is convenient to match with the raised rib 323, the limitation of the wafer 6 is ensured, the friction force in the motion process can be reasonably controlled through the special design, and the transmission, the feeding and the discharging are convenient to realize.
As shown in fig. 10, the scanner assembly 35 of this example includes a scanner 351 and a scanner mount, and the scanner 351 is fixedly disposed on the jaw mounting plate by the scanner mount; the code scanner mounting piece comprises a vertical column 352 and a connecting block 352, the connecting block 352 is preferably a right-angle connecting piece, the code scanner 351 is mounted on the vertical column 352 through a rotating shaft, the lower end of the vertical column 352 is fixedly connected with the clamping jaw mounting plate through the connecting block 352, namely, the code scanner 351 is detachably arranged, and in this way, the required code scanner can be conveniently arranged according to the requirement adaptability of products, and later maintenance and upgrading are facilitated.
As shown in fig. 11, the X-axis motor timing belt module 31 of this embodiment includes an X-axis motor timing belt 311 and an X-axis track platform 312, wherein the X-axis motor timing belt 311 is disposed on the X-axis track platform 312 and drives the X-axis of the wafer track 32 to move; y axle motor hold-in range module 33 includes Y axle motor hold-in range 331 and Y axle track platform 332, Y axle motor hold-in range 331 set up in on the Y axle track platform 332, and drive the Y axle motion of clamping jaw subassembly 34.
In this embodiment, electric carrying assemblies corresponding to the material taking mechanism 3 are preferably disposed on two sides of the carrying mechanism 4, and each electric carrying assembly preferably includes an electric module 43 and a movable material taking module 44; as shown in fig. 12 and 13, the conveying mechanism 4 in this embodiment includes a gantry 41, an X-axis module 42, an electric module 43, and a movable material-taking module 44, wherein the X-axis module 42 is disposed on the gantry 41, the electric module 43 is disposed on the left and right sides of the X-axis module 42, and the movable material-taking module 44 is slidably connected to the X-axis module 42 through the electric module 43.
The gantry 41 is a supporting member, and the X-axis module 42 is a module for realizing X-axis movement; the electric module 43 is used for connecting the X-axis module 42 and realizing Z-axis electric motion; the movable material taking module 44 is used for realizing movable material taking and carrying; this example electronic module 43 set up in the left and right sides of X axle module 42, it passes through to remove gets material module 44 electronic module 43 sliding connection to X axle module 42, promptly remove get material module 44 set up in the left and right sides of X axle module 42 is through two sets of remove and get material module 44, be convenient for snatch and carry vision test position with products such as wafer 6 from the material loading position, can also accomplish at the test and carry material unloading position with products such as wafer 6 from test position, and then realize the collaborative work of material loading, transport and unloading, degree of automation is high and with low costs, and production efficiency is high, the later maintenance of being convenient for.
In this embodiment, a bottom plate 412 is disposed at the bottom of the gantry 41, the bottom plate 412 is a planar plate having a cross-sectional area larger than that of the gantry 41, and a reinforcing rib 411 is disposed between the bottom plate 412 and the gantry 41, so as to increase the stability of the structure.
As shown in fig. 12 and 13, the X-axis module 42 in this embodiment includes an X-axis module mounting plate 421 and an X-axis left and right lead screw module 422, the X-axis left and right lead screw module 422 includes a left lead screw module and a right lead screw module, the X-axis left and right lead screw module 422 is disposed on two sides of the X-axis module mounting plate 421, and the movable material taking module 44 is slidably connected to the X-axis left and right lead screw module 422 through the electric module 43, so as to provide a foundation for cooperative work of loading, transporting and unloading through the left and right lead screws.
As shown in fig. 12, a limiting block 423 is preferably further disposed on the present embodiment, and the limiting block 423 is disposed on one side of the X-axis module mounting plate 421, which is close to the X-axis left and right lead screw modules 422, so as to facilitate the limiting and guiding functions of the electric module 43, and provide stable and reliable performance of the mechanism.
As shown in fig. 1, the present embodiment further preferably includes an electromagnetic valve module 45, where the electromagnetic valve module 45 is disposed on the gantry 41 near the X-axis module 42, so as to facilitate electromagnetic valve control and improve the automation degree thereof.
As shown in fig. 13, the electric module 43 in this embodiment includes a Z-axis module mounting plate 431, a Z-axis lead screw module 432, and a cylinder mounting frame 433, where the cylinder mounting frame 433 is connected to the Z-axis module mounting plate 431 through the Z-axis lead screw module 432, and the Z-axis module mounting plate 431 is slidably connected to the X-axis module 42, so as to be conveniently slidably connected to the X-axis module 42, and also facilitate the control of the movement of the Z-axis lead screw.
Preferably, as shown in fig. 12, this example further preferably includes a sliding block 434, and the Z-axis module mounting plate 431 is slidably connected to the X-axis module 42 through the sliding block 434, so as to further enhance the controllability and flexibility of the sliding connection.
The movable material taking module 44 in this embodiment includes a moving module 441 and a pneumatic material taking clamping jaw 442, and the pneumatic material taking clamping jaw 442 is disposed below the moving module 441 and near one side of the X-axis module 42, so as to facilitate control of a pneumatic cylinder on the clamping jaw, and facilitate loading, carrying and unloading; the moving module 441 can also be called a material taking shaft in this example, and the third drag chain 445 and other structural members are designed to move up and down, and the third drag chain 445 is not an essential component and belongs to a preferable driving movement structural member.
More preferably, the mobile pick-up module 44 of the present embodiment further includes a second photoelectric sensor 443, and the second photoelectric sensor 443 is disposed on one side of the pneumatic pick-up gripper 442. In this embodiment, the second photoelectric sensor 443 senses whether a product is captured, so as to further improve the intelligent design degree of the product on the basis of reasonably controlling the cost.
As shown in fig. 12, silica gel grabbing fingers 444 are symmetrically arranged below the pneumatic material taking clamping jaw 442 in this embodiment, the silica gel grabbing fingers 444 refer to downward symmetrical silica gel protrusions for assisting in achieving a grabbing function, and the symmetrically arranged silica gel grabbing fingers 444 in fig. 1 facilitate grabbing the wafer 6 when the wafer is closed, and meanwhile, the characteristics of the silica gel grabbing fingers 444 are utilized to achieve a protection effect on the wafer 6, so that the grabbing stability and the anti-slip performance are ensured.
The present embodiment further provides a method for controlling an automatic chip appearance inspection apparatus, which is applied to the automatic chip appearance inspection apparatus described above, and includes the following steps:
step S1, scanning a code through the material taking mechanism 3 to obtain a wafer ID;
step S2, placing the wafer on the supporting platform 51 of the vision inspection mechanism 5 by the carrying mechanism 4;
step S3, fixing the wafer on the supporting platform 51 by suction through the vacuum function of the visual inspection mechanism 5;
step S4, adjusting the wafer to the photographing position by the XY axis motion module and the motor assembly 52 of the vision inspection mechanism 5;
step S5, turning on the backlight 533 of the vision inspection mechanism 5, taking a picture through the vision module 54, and adjusting the wafer position in real time until a complete area image is obtained;
step S6, determining whether the wafer has defects by image processing detection and synthesizing a complete image
Step S7, storing wafer detection data;
and step S8, closing the vacuum function of the visual detection mechanism 5, moving the wafer to a blanking position through the carrying mechanism 4, realizing blanking and transmitting the wafer into the material frame.
The two groups of automatic feeding mechanisms 2, the material taking mechanisms 3 and the electric carrying assembly work in a coordinated mode, non-stop production and processing are convenient to achieve, production efficiency is improved, and the process comprises the following steps:
step A1, initializing, and moving the clamping jaw assemblies of the two groups of material taking mechanisms 3 to a safe height respectively;
step A2, the material taking mechanism 3 starts to feed materials, and the automatic feeding mechanism 2 transfers the wafers from the material frame to the material level;
step A3, moving the first group of electric carrying components to the loading position to grab the first wafer and move to the testing position, and simultaneously moving the second group of electric carrying components to the unloading position to wait;
step S4, the first wafer starts to be detected;
step A5, the material taking mechanism 3 pulls the second wafer, and the first group of electric carrying components return to the loading position to move the second wafer to the test waiting position;
step A6, after the first wafer is tested, the second group of electric carrying components take the first wafer away and place the first wafer to a blanking position, and the first wafer is placed back to the material frame through the material taking mechanism 3; simultaneously, the first group of electric carrying assemblies moves the second wafer from the test waiting position to the test position and places the second wafer on the supporting platform 51 of the visual inspection mechanism 5;
and step A7, detecting the second wafer, pulling the third wafer by the material taking mechanism 3, returning the first group of electric carrying components to the loading position, moving the third wafer to the test waiting position, and circularly realizing the next detection process.
In summary, in the present embodiment, through the two sets of automatic feeding mechanisms 2 and the matched material taking mechanisms 3 and the conveying mechanisms 4, the appearance automatic detection without shutdown is realized, and through the control of the cooperative work of the automatic feeding mechanisms, the material changing time interval of the product in the visual detection can be greatly shortened, the overall working efficiency is effectively improved, and no complex components such as a manipulator or a mechanical arm are needed, so that the automation degree of the equipment is improved, and the cost is effectively reduced; on the basis, the precision and controllability of the visual test are effectively improved through the optimized design of the visual detection mechanism 5 and other mechanisms.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. An automatic chip appearance detection device, comprising: the automatic feeding device comprises a rack, an automatic feeding mechanism, a material taking mechanism, a carrying mechanism and a visual detection mechanism, wherein the automatic feeding mechanism is arranged on the rack, the material taking mechanism is arranged on one side of the automatic feeding mechanism, the carrying mechanism is arranged above the material taking mechanism, and the visual detection mechanism is arranged on one side of the material taking mechanism and one side of the carrying mechanism; the automatic feeding mechanism conveys wafers on each layer in the material frame to a feeding position of the material taking mechanism; the material taking mechanism takes the wafer out of the material frame, identifies the wafer and places the wafer at the material loading position of the carrying mechanism; the carrying mechanism carries the wafers at the feeding position to the visual detection mechanism for visual detection, the carrying module and the material taking module are used for placing the wafers in the material frame again after the detection is finished, and meanwhile, the automatic feeding mechanism moves upwards to carry the next wafer to the feeding position for the next detection process.
2. The automatic chip appearance detection equipment according to claim 1, wherein two groups of material taking mechanisms corresponding to the automatic feeding mechanisms are arranged on the rack, and electric carrying assemblies corresponding to the material taking mechanisms are arranged on two sides of the carrying mechanism; the two groups of automatic feeding mechanisms and the material taking mechanisms respectively work in a coordinated mode, and when one group of automatic feeding mechanisms and the other group of automatic taking mechanisms are short of materials, the other group of automatic feeding mechanisms and the material taking mechanisms are started to work; and two groups of electric carrying components of the carrying mechanism work simultaneously, one group of electric carrying components are used for carrying the wafer to a testing position of the visual detection mechanism from a loading position, and the other group of electric carrying components are used for carrying the wafer after detection to a discharging position from the testing position so as to be placed in the material frame.
3. The automatic chip appearance inspection device according to claim 1, wherein the vision inspection mechanism comprises a support platform, an XY-axis motion module, a motor assembly, a vacuum adsorption platform, a vision module and a Z-axis motion module, the XY-axis motion module is disposed on the support platform, the vacuum adsorption platform is disposed on the XY-axis motion module through the motor assembly, and the vision module is disposed above the vacuum adsorption platform through the Z-axis motion module; the vacuum adsorption platform comprises a backlight source, a vacuum sucker and a support piece, wherein the backlight source is arranged above the motor assembly; the vacuum chuck is arranged on the backlight source and arranged between the backlight source and the supporting piece.
4. The automatic chip appearance inspection apparatus according to claim 3, wherein the visual inspection mechanism includes the support member being an optical glass; the vacuum chuck is provided with a double-path narrow groove and a chuck air inlet, the double-path narrow groove is a circular groove arranged on the vacuum chuck, and the chuck air inlet is symmetrically arranged on the outer side of the vacuum chuck.
5. The automatic chip appearance inspection device according to claim 3, wherein the support platform comprises a shock absorbing member and a rigid support platform, the shock absorbing member being disposed below the rigid support platform.
6. The automatic chip appearance detection equipment according to any one of claims 1 to 5, wherein the automatic feeding mechanism comprises a material frame, a material frame placing rack, a screw rod module mounting rack and an ultrasonic sensor, the material frame is connected with the screw rod module through the material frame placing rack, the screw rod module is mounted on the screw rod module mounting rack, a laser sensor is arranged at one end of the material frame placing rack, and the laser sensor is vertically arranged at the edge of the material frame placing rack close to the material placing rack; the ultrasonic sensor is arranged at the bottom of the material frame placing frame and corresponds to the position of the material frame.
7. The automatic chip appearance detection equipment according to any one of claims 1 to 5, wherein the material taking mechanism comprises an X-axis motor synchronous belt module, a wafer track, a Y-axis motor synchronous belt module, a clamping jaw assembly, a code scanner assembly and a photoelectric sensor; the wafer track is arranged on the X-axis motor synchronous belt module and arranged on two sides of the Y-axis motor synchronous belt module; the clamping jaw assembly is arranged on the Y-axis motor synchronous belt module, and the code scanner assembly is arranged on one side, close to the wafer, of the clamping jaw assembly; the photoelectric sensor is arranged on the inner wall of the wafer track and below the Y-axis motor synchronous belt module.
8. The automatic chip appearance detection equipment according to any one of claims 1 to 5, wherein the conveying mechanism comprises a portal frame, an X-axis module, an electric conveying module and a movable material taking module, the X-axis module is arranged on the portal frame, the electric conveying module is arranged on the left side and the right side of the X-axis module, and the movable material taking module is connected to the X-axis module in a sliding mode through the electric conveying module.
9. A method for controlling an automatic chip appearance inspection apparatus, which is applied to the automatic chip appearance inspection apparatus according to any one of claims 1 to 8, and which comprises the steps of:
step S1, scanning the code through the material taking mechanism to obtain the wafer ID;
step S2, the wafer is placed on a supporting platform of the visual inspection mechanism through the carrying mechanism;
step S3, the wafer is absorbed and fixed on the supporting platform through the vacuum function of the visual detection mechanism;
step S4, adjusting the wafer to the photographing position through the XY axis movement module and the motor component of the visual detection mechanism;
step S5, turning on a backlight source of the visual detection mechanism, taking a picture through a visual module of the visual detection mechanism, and adjusting the position of the wafer in real time until a complete area image is obtained;
step S6, determining whether the wafer has defects by image processing detection and synthesizing a complete image
Step S7, storing wafer detection data;
and step S8, closing the vacuum function of the visual detection mechanism, moving the wafer to a blanking position through the carrying mechanism, realizing blanking and transmitting the wafer into the material frame.
10. The method for controlling the automatic chip appearance inspection apparatus according to claim 9, wherein two sets of the automatic feeding mechanism, the material taking mechanism and the electric carrying assembly work in cooperation, and the process comprises the following steps:
step A1, initializing, and moving the clamping jaw assemblies of the two groups of material taking mechanisms to a safe height respectively;
step A2, the material taking mechanism starts to feed materials, and the automatic feeding mechanism transfers the wafers from the material frame to the material level;
step A3, moving the first group of electric carrying components to the loading position to grab the first wafer and move to the testing position, and simultaneously moving the second group of electric carrying components to the unloading position to wait;
step S4, the first wafer starts to be detected;
step A5, the material taking mechanism pulls the second wafer, and the first group of electric carrying components return to the loading position to move the second wafer to a test waiting position;
step A6, after the first wafer is tested, the second group of electric carrying assemblies take the first wafer away and place the first wafer to a blanking position, and the first wafer is placed back to the material frame through the material taking mechanism; simultaneously, the first group of electric carrying assemblies move the second wafer from the test waiting position to the test position and place the second wafer on the supporting platform of the visual detection mechanism;
and step A7, the second wafer starts to be detected, the material taking mechanism pulls the third wafer, the first group of electric carrying assemblies returns to the loading position to move the third wafer to the test waiting position, and the next detection process is realized in a circulating mode.
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Application publication date: 20210611 |