CN110491809B - High-precision multifunctional chip loader and use method thereof - Google Patents

High-precision multifunctional chip loader and use method thereof Download PDF

Info

Publication number
CN110491809B
CN110491809B CN201910816381.3A CN201910816381A CN110491809B CN 110491809 B CN110491809 B CN 110491809B CN 201910816381 A CN201910816381 A CN 201910816381A CN 110491809 B CN110491809 B CN 110491809B
Authority
CN
China
Prior art keywords
plate
rail
assembly
track
sliding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910816381.3A
Other languages
Chinese (zh)
Other versions
CN110491809A (en
Inventor
吴超
蒋星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ennaji Intelligent Equipment Wuxi Co ltd
Original Assignee
Energy Intelligent Technology Wuxi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Energy Intelligent Technology Wuxi Co Ltd filed Critical Energy Intelligent Technology Wuxi Co Ltd
Priority to CN201910816381.3A priority Critical patent/CN110491809B/en
Publication of CN110491809A publication Critical patent/CN110491809A/en
Application granted granted Critical
Publication of CN110491809B publication Critical patent/CN110491809B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automatic Assembly (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model provides a multi-functional chip mounter of high accuracy and method of use thereof, includes the shell, controlling means is installed to the inside bottom position of shell, multi-functional chip pick-and-place device is installed to controlling means's top, multi-functional duplex position bonding tool mechanism is installed in the cooperation of multi-functional chip pick-and-place device's top, multi-functional duplex position bonding tool mechanism installs in the inside top position of shell. The invention has compact and reasonable structure and convenient operation, can conveniently and automatically complete chip loading work of chips by the mutual matching action among the mechanisms of the functional chip pick-and-place device, the multifunctional double-station welding head mechanism, the control device and the like, can mount 8 chips at most, has UPH of about 1.5 times of the prior art, integrates functions as much as possible on the basis, and has small equipment volume and small occupied area.

Description

High-precision multifunctional chip loader and use method thereof
Technical Field
The invention relates to the technical field of chip loading equipment, in particular to a high-precision multifunctional chip loading machine and a use method thereof.
Background
In the prior art, under the conditions that the die bonder can achieve the accuracy of +/-7 microns and can attach up to 6 chips, the speed is often not high enough, and UPH (throughput per hour) is approximately between 400 and 500. The accuracy of the chip mounter with UPH reaching 1500 can only reach +/-10 microns, and the chip mounter can only mount a single chip. The chip mounter with the accuracy, the speed and the number of chips capable of being mounted can meet the requirements of the chip on the production environment (hundred-grade workshop and extremely high decoration cost), and the chip manufacturer needs small enough equipment occupation area because the chip mounter has poor integrated level of functions, so that the size of the chip mounter can reach 2.2m long by 1.8m wide by 2.3m high. In addition, at present, a plurality of chips are available, because the structure is complex, the vision is difficult to identify, the mounting precision of the existing mounting machine can only reach +/-10 microns, but the requirement is +/-7 microns, so that the chips are amplified by adopting a microscope only, then the chips are manually pulled to +/-7 microns by using tweezers, the requirement on operators is very high, the speed is very slow, and the working efficiency is greatly reduced.
Disclosure of Invention
Aiming at the defects in the prior art, the application provides the high-precision multifunctional chip loading machine and the use method thereof, so that chip loading work of chips can be completed with high precision, the working efficiency is high, and the occupied area is small.
The technical scheme adopted by the application is as follows:
the utility model provides a multi-functional chip mounter of high accuracy, includes the shell, controlling means is installed to the inside bottom position of shell, multi-functional chip pick-up placer is installed to controlling means's top, multi-functional duplex position bonding tool mechanism is installed in the cooperation of multi-functional chip pick-up placer's top, multi-functional duplex position bonding tool mechanism installs in the inside top position of shell.
As a further improvement of the above technical scheme:
the structure of the multifunctional double-station welding head mechanism is as follows: the welding head comprises a welding head top plate, wherein two opposite edges of the bottom surface of the welding head top plate are provided with welding head side plates, a linear motion assembly is arranged on the bottom surface of the welding head top plate between the two welding head side plates, and two welding head mechanisms are arranged below the linear motion assembly in parallel; the structure of the single welding head mechanism is as follows: the welding head comprises a welding head installation base assembly fixedly arranged on a linear motion assembly, a Z-axis driving assembly is arranged on the welding head installation base assembly, a first supporting plate is arranged on the Z-axis driving assembly, and the first supporting plate is driven by a Z-axis driving motor to move up and down; the glue dipping component is arranged at one end of the first supporting plate, the suction nozzle component is arranged at the other end of the first supporting plate, and the camera component is further arranged on the first supporting plate beside the suction nozzle component.
The structure of the glue dipping component is as follows: the device comprises a second support plate fixedly arranged with a first support plate, wherein a cylinder is fixedly arranged on the second support plate along the vertical direction, a first guide rail is arranged on the second support plate beside the cylinder, the first guide rail is parallel to the movement direction of the cylinder, and a first slide block sliding along the first guide rail is arranged on the first guide rail; the output end of the air cylinder and the sliding block are commonly provided with a support plate III; a guide rail II is arranged on the support plate III in the vertical direction, a slide block II sliding along the guide rail II is arranged on the guide rail II, a needle seat is arranged on the slide block II, and a glue dipping needle head is arranged at the bottom of the needle seat; the three tops of the supporting plate are provided with a first mounting block, a guide shaft vertically penetrates through the first mounting block, the bottom end of the guide shaft extends into the top of the needle seat, and a compression spring is sleeved on the guide shaft between the first mounting block and the needle seat; the needle seat is characterized in that a mounting block II of an L-shaped structure is mounted on the three side edges of the supporting plate, a mounting block III of an L-shaped structure is mounted on the side edges of the needle seat, the mounting block II and the mounting block III are oppositely arranged to form a 'mouth' -shaped structure, a lower contact is mounted on the inner side surface of the mounting block II, an upper contact is mounted on the inner side surface of the mounting block III, and the upper contact is positioned above the lower contact and is in contact with each other; the lower part of the second side edge of the supporting plate is provided with a fourth installation block with an L-shaped structure, and the bottom of the fourth installation block is provided with a large screw; the large screw rod penetrates through the mounting block IV, and the large screw rod is located below the supporting plate III.
The structure of the Z-axis driving assembly is as follows: the welding head mounting base comprises a mounting block five and a mounting block six which are fixedly arranged with a welding head mounting base assembly and are arranged at an upper-lower interval, a screw rod is commonly arranged on the mounting block five and the mounting block six, and a supporting plate five is arranged on the screw rod between the mounting block five and the mounting block six in a matched manner; the upper end part of the screw rod extends out of the mounting block five, and the upper end head of the screw rod is provided with a belt wheel I; the output end of the Z-axis driving motor extends upwards out of the mounting block five, a belt pulley II is mounted at the end head of the output end of the Z-axis driving motor, and the belt pulley I is connected with the belt pulley II through a belt; a guide rail III is further arranged on the welding head installation base assembly beside the screw rod, the guide rail III is parallel to the screw rod, and a sliding block III sliding along the guide rail III is arranged on the guide rail III; five ends of the supporting plate are sleeved on the screw rod, and the other ends of the supporting plate are fixedly arranged with the sliding block III.
The suction nozzle assembly has the structure that: the device comprises a support plate six fixedly arranged with the support plate one, wherein a linear and rotary actuator is fixedly arranged on the six side surfaces of the support plate, a suction nozzle is arranged at the output end of the linear and rotary actuator, and the suction nozzle is connected with an external air source; a height sensor is also arranged on the side edge of the linear and rotary actuator beside the suction nozzle; the camera component has the structure that: the device comprises a support plate seven fixedly arranged with the support plate one, a zoom lens is fixedly arranged on the side face of the support plate seven, and a CCD camera is arranged at the top of the zoom lens.
The structure of the multifunctional chip pick-and-place device is as follows: the automatic feeding device comprises a working platform, wherein a rail conveying mechanism is arranged across the working platform, a tablet feeding mechanism and a tablet discharging mechanism are respectively arranged at two ends of the rail conveying mechanism positioned outside the working platform, and a first station and a second station are sequentially arranged on the working platform along the direction of the rail conveying mechanism; the working platform at the interval between the first station and the second station is provided with an identification device, and a quick-change mechanism is arranged above the identification device;
the first station is structured as follows: the device comprises a chip feeding mechanism fixedly arranged on a working platform, wherein a glue dipping disc assembly is arranged between the chip feeding mechanism and a track conveying mechanism; the structure of the station II is as follows: the wafer loading device comprises a wafer loading mechanism fixedly arranged on a working platform, wherein a wafer ejection mechanism is arranged on the working platform positioned at the bottom of the wafer loading mechanism; and a glue dipping disc assembly which is the same as the first station is arranged between the wafer feeding mechanism and the track conveying mechanism.
The chip feeding mechanism has the structure that: the fixture comprises a first small platform fixedly arranged on a working platform through supporting legs, wherein a fixture base is arranged on the first small platform, a plurality of lower air holes are formed in the fixture base, the lower air holes are connected with an external air source, and sealing gaskets are arranged on the fixture base corresponding to the lower air holes; the three side edges of the upper surface of the jig base are provided with barrier strips, and the jig base positioned on the inner side of the three side barrier strips is provided with a jig; a magnet is embedded on the jig base positioned on the inner side of the barrier strip; the structure of the jig is as follows: the jig comprises a jig bottom plate arranged on a jig base, wherein jig handles are arranged at the ends of the jig bottom plate, a plurality of acupuncture points for placing a chip material box are arranged on the jig bottom plate, and the acupuncture points correspond to the lower air holes one by one; an upper air hole communicated with the lower air hole is formed in the jig bottom plate corresponding to the acupuncture point, and a sealing ring is arranged on the jig bottom plate corresponding to the upper air hole; a plurality of limiting pins and buckling mechanisms are arranged on the jig bottom plate corresponding to the acupuncture points, the limiting pins are arranged at two adjacent edges of each acupuncture point, and the buckling mechanisms are arranged at opposite angles of the limiting pins; the structure of the buckle mechanism is as follows: the fixture comprises a clamping base fixedly arranged on a fixture bottom plate, wherein the clamping base is of an L-shaped structure, rotating shafts are arranged on two side walls penetrating through the clamping base, and clamping pieces of L-shaped structures are rotatably arranged on the rotating shafts inside the clamping base; screws are installed through the side walls of the clamping pieces, springs are sleeved on the screws, and the end parts of the springs are fixedly installed on the bottom plate of the jig.
The structure of the wafer feeding mechanism is as follows: the feeding device comprises a second small platform fixedly arranged on a working platform through supporting legs, wherein a feeding motor is arranged at the end part of the bottom surface of the second small platform through a motor substrate, a first feeding belt wheel is arranged at the end head of the second small platform, a mandrel is rotatably arranged on the motor substrate beside the first feeding belt wheel, the mandrel penetrates through the motor substrate, a second feeding belt wheel and a third feeding belt wheel are respectively arranged at the two ends of the mandrel, and the first feeding belt wheel is connected with the second feeding belt wheel through a small belt; a large bearing is arranged on a small platform II beside the motor substrate, a ring seat is arranged in the large bearing, the ring seat penetrates through the small platform II, a large belt wheel is fixedly arranged at the bottom of the ring seat, the large belt wheel is connected with a feeding belt wheel III through a large belt, and a tensioning wheel is arranged at the bottom of the small platform II outside the large belt; the top of the ring seat is provided with a clamping ring, the outer edge of the clamping ring extends outwards to form a step for installing the wafer ring, and the clamping ring beside the wafer ring is also provided with a baffle.
The structure of the crystal ejection mechanism is as follows: the device comprises a bottom supporting seat fixedly arranged on a working platform, wherein a groove is formed in the middle of the bottom supporting seat, first sliding rails are symmetrically arranged at two ends of the groove, a first sliding block is arranged on the first sliding rail, a first lead screw is further arranged at the groove, a first nut is sleeved on the first lead screw, a sliding plate is simultaneously arranged at the tops of the first nut and the first sliding block, a first motor is further fixed on the outer side of the bottom supporting seat, and the output end of the first motor is connected with the head of the first lead screw through a first belt transmission mechanism; the mounting direction of the sliding plate is vertical to the bottom supporting seat, a second sliding rail is fixed on the sliding plate, a second sliding block is mounted on the second sliding rail, a second screw rod parallel to the second sliding rail is arranged beside the second sliding rail, a second nut is mounted on the second screw rod, a thimble connecting seat is simultaneously fixed on the second sliding block and the second nut, and a thimble seat component is mounted on the thimble connecting seat; the outer side of the sliding plate is also fixed with a second motor, and the output end of the second motor is connected with a second screw rod through a second belt transmission mechanism.
The structure of the glue dipping disc assembly is as follows: the device comprises a rubber disc base which is fixedly arranged on the outer side wall of a rail conveying mechanism and is of an L-shaped structure, wherein a rubber disc motor is arranged at the bottom of the rubber disc base, the output end of the rubber disc motor upwards penetrates through the rubber disc base, and a rubber disc belt wheel I is arranged at the end part of the output end of the rubber disc motor; a rubber disc support plate is arranged on the outer side wall of the track conveying mechanism beside the rubber disc base, a rubber disc is arranged on the top surface of the rubber disc support plate, the rubber disc is rotationally connected with the rubber disc support plate through a rotating shaft in the middle, the rotating shaft penetrates out of the rubber disc support plate downwards, and a rubber disc belt wheel II is arranged at the lower end part of the rotating shaft; the first rubber plate belt wheel is connected with the second rubber plate belt wheel through a rubber plate belt; a rubber scraping knife is also arranged on the rubber tray support plate beside the rubber tray; one end of the scraping knife is connected with the rubber plate support plate through a small screw rod, and the other end of the scraping knife is suspended above the rubber plate.
The structure of the tablet feeding mechanism is the same as that of the tablet discharging mechanism, and the specific structure of the tablet feeding mechanism is as follows: including blowing base subassembly, fixed mounting has X to the motion subassembly on the blowing base subassembly, and still fixed mounting has Z to the motion subassembly on the blowing base subassembly of X to motion subassembly one side, install the magazine fork arm on the Z to the motion subassembly, the magazine direction subassembly is installed to the both sides face of Z to the motion subassembly, install the magazine subassembly in the magazine direction subassembly.
The structure of the material box guiding component is as follows: the device comprises four adjusting plates, wherein the four adjusting plates are enclosed into a quadrilateral structure through fasteners, guide plates are vertically arranged on each adjusting plate, a gear cylinder is arranged at the bottom of each guide plate, and a guide rod is arranged at the output end of each gear cylinder; the end part of one adjusting plate is locked with a connecting locking plate; the structure of the Z-direction motion component is as follows: the automatic feeding device comprises a frame plate, wherein a motor seat is fixed at the bottom of the frame plate, a large motor is installed on the motor seat, a synchronizing mechanism is installed on an output shaft of the large motor, a third screw rod is connected to an output end of the synchronizing mechanism, the third screw rod penetrates through the vertical direction of the whole frame plate, a connecting seat which moves up and down along the third screw rod is installed on the third screw rod, a nut matched with the third screw rod is arranged inside the connecting seat, and a material box fork rod is fixed on the outer side surface of the connecting seat; the structure of the pushing system is as follows: the device comprises a right angle plate, wherein a reinforcing plate is arranged on the inner side of the right angle plate, a rear plate is fixed on the outer side surface of the right angle plate, a small motor is fixed on the back of the rear plate, a synchronous wheel is arranged on an output shaft of the small motor, a synchronous belt is arranged between the two synchronous wheels, a pushing rod is arranged above the synchronous belt in a meshed mode through a connecting block, the pushing rod and the connecting block simultaneously walk along with the synchronous belt, a sliding block is further arranged on the inner side of the pushing rod, and the sliding block walks along a guide rail; the structure of the discharging base assembly is as follows: including the unloading bottom plate, the bottom of unloading bottom plate is supported fixedly through supporting angle bar, the blowing box is installed to unloading bottom plate upper surface one end, install X on the unloading bottom plate of blowing box inside to the motion subassembly, the concrete structure of X to the motion subassembly is: the automatic feeding device comprises a double-shaft air cylinder, wherein a piston rod is arranged at the output end of the double-shaft air cylinder, a locking block is arranged at the head part of the piston rod, and a pushing box fork with a U-shaped structure is fixed on the locking block; the upper surface of the discharging box is also provided with a discharging strip and a flange.
The track conveying mechanism has the structure that: the device adopts a sectional structure, which is respectively a front track assembly, a middle track assembly and a rear track assembly; the front track assembly and the rear track assembly are identical in structure and are symmetrically arranged at two ends of the middle track assembly, and the rear track assembly is internally provided with a track pushing assembly.
The rear track assembly has the structure that: the automatic feeding device comprises a rear rail mounting base, wherein a rear rail front side plate is mounted at the rear end of the upper surface of the rear rail mounting base, a rear rail rear side plate is mounted at intervals parallel to the rear rail front side plate, a rear rail transmission motor is mounted at the front end position of the upper surface of the rear rail mounting base through a transmission motor mounting block, a rear rail transmission shaft is mounted at the output end of the rear rail transmission motor through a speed reducer, the rear rail transmission shaft simultaneously passes through the rear rail rear side plate and the rear rail front side plate, a plurality of small rollers are mounted on the inner sides of the rear rail rear side plate and the rear rail front side plate, a conveying belt is wound on the small rollers, a material sheet is mounted on the conveying belt at intervals in a matched mode, pinch roller fixing blocks are also locked on the top surfaces of the rear rail rear side plate and the rear rail front side plate, a pinch roller connecting block is mounted on the pinch roller fixing block through a pinch roller shaft, and pinch roller connecting blocks are mounted on the pinch roller fixing blocks; the front end position of the upper surface of the rear track mounting base is also provided with a rear track turntable, the rear end connected with the rear track turntable is provided with a large nut, the large nut is sleeved on a rear track screw shaft, and the rear track screw shaft passes through a rear track rear side plate and is fixed with a rear track fixing block; the rear rail mounting base is symmetrically provided with rear rail sliding rails, rear rail sliding blocks sliding along the rear rail sliding rails are mounted on the rear rail sliding rails, and the rear rail sliding blocks are locked with rear rail rear side plates through rear rail connecting blocks; the track pushing assembly has the structure that: the automatic feeding device comprises a base plate fixed through a heightening block, wherein standing blocks are symmetrically arranged at two ends of the upper surface of the base plate, an upper fixing plate is arranged at the top of each of the two standing blocks, a sliding rail is fixed on the upper surface of each upper fixing plate, the sliding blocks are arranged on the sliding rails in a matched mode, a cuboid sliding plate is fixed on each sliding block, a pushing arm mounting plate is fixed at one end of the top of each sliding plate, a pushing arm is arranged at the head of each pushing arm mounting plate, and one end of each pushing arm is connected with each pushing arm mounting plate through a tension spring; the bottom of the base plate is also fixed with a driving motor, the output end of the driving motor passes through the base plate and is provided with a driving belt through rollers, the driving belt is provided with an L-shaped plate and a tooth-shaped plate in a relatively engaged manner, and the top of the L-shaped plate is locked with the sliding plate; the structure of the middle track component is as follows: the device comprises middle rail supporting seats which are arranged at intervals, wherein a middle rail workbench is fixed on the upper surface of the middle rail supporting seats, a middle rail front side plate is arranged at the rear end position of the upper surface of the middle rail workbench, a middle rail rear side plate is arranged at intervals parallel to the middle rail front side plate, and a rail jacking component is arranged between the middle rail front side plate and the middle rail rear side plate; the middle rail workbench is fixedly provided with a middle rail transmission motor, the middle rail transmission motor is provided with a middle rail transmission shaft through a speed reducer, the middle rail transmission shaft simultaneously passes through a middle rail rear side plate and a middle rail front side plate, the inner sides of the middle rail rear side plate and the middle rail front side plate are provided with a plurality of small rollers, the small rollers are wound with conveyor belts, and the spaced conveyor belts are matched with the conveyed material sheets, and the material sheets are pressed on the two side plates through pressing strips; the middle rail workbench is also provided with a middle rail turntable, the rear end of the middle rail turntable connected with the middle rail turntable is provided with a large nut, the large nut is sleeved on a middle rail screw shaft, and the middle rail screw shaft penetrates through a middle rail rear side plate and is fixed with a middle rail fixing block; the middle rail workbench is symmetrically provided with middle rail sliding rails, the middle rail sliding rails are provided with middle rail sliding blocks sliding along the middle rail sliding rails, and the middle rail sliding blocks are locked with the middle rail rear side plates through middle rail connecting blocks; the track liftout subassembly's structure is: including the support that the interval symmetry set up, the inboard top of two supports is fixed with the liftout cylinder, the fixed liftout board of output of liftout cylinder, the outside of one of them support is fixed with cylinder mounting sheet and sensor mount pad, be fixed with on the cylinder mounting sheet and keep off the material cylinder, be fixed with photoelectric sensor on the sensor mount pad.
The application method of the high-precision multifunctional chip mounter comprises the following operation steps:
step one: starting a power supply;
step two: manually placing the magazine assembly filled with the non-patch material sheets into a magazine guide assembly of a material sheet feeding mechanism; placing the empty magazine assembly into a magazine guide assembly of a blanking mechanism;
step three: manually placing the chip material boxes on a jig bottom plate of the jig, limiting the single chip material boxes relative to the jig bottom plate through limiting pins and a clamping mechanism, placing the jig on a jig base of a first station through a jig handle, and limiting the jig through a stop bar on the jig base;
if the incoming material is a wafer in the wafer ring form, feeding is performed through a station II: manually placing the wafer ring on a clamping ring of the station II, and limiting the wafer ring by the edge of the clamping ring and a baffle;
step four: clicking a start button on the display screen through a mouse;
step five: the pushing system pushes the single material sheets from the material box assembly to the track conveying mechanism; the track conveying mechanism conveys the material sheet to the first station or the second station, and when the material sheet reaches the corresponding working position, the track ejection assembly ejects the material sheet;
step six: the welding head mechanism starts to work, and the camera assembly moves to the chip to be attached of the material sheet on the track conveying mechanism under the drive of the linear movement assembly to take a picture, so that the coordinates of the position of the chip to be attached or the wafer are confirmed;
Step seven: under the drive of the linear motion assembly, the glue dipping assembly moves to the position right above the glue dipping disc assembly, the air cylinder works, and the glue dipping needle head and the needle head seat move downwards along the first guide rail along with the third support plate, so that the glue dipping needle head stretches into the glue disc to dip glue, and the air cylinder acts reversely to drive the glue dipping needle head to move upwards;
step eight: under the drive of the linear motion assembly, the glue dipping assembly moves to the position right above the material sheet on the track conveying mechanism, so that the glue dipping needle is positioned at the position of the material sheet to be pasted with the chip or the wafer, and the work of the air cylinder in the seventh step is repeated, so that the glue dipping needle is contacted with the material sheet, and glue is applied to the appointed position of the material sheet; the glue dipping needle head is retracted under the action of the air cylinder;
step nine: under the drive of the linear motion assembly, the camera assembly moves to the position one or the position two, so that a CCD camera in the camera assembly is positioned right above a chip or a wafer, the chip is amplified and shot through the CCD camera and a zoom lens, and the coordinates of the chip or the wafer are calculated and confirmed through an internal algorithm;
step ten: under the drive of the linear motion assembly, the suction nozzle assembly moves to the position above the position one or the position two, so that the suction nozzle is positioned above the chip or the wafer in the step nine, and the suction nozzle sucks the chip or the wafer under the action of an external air source;
Step eleven: under the drive of the linear motion component, the suction nozzle component moves to the track conveying mechanism, so that the suction nozzle is positioned right above a chip or wafer to be pasted on the material sheet, an external air source is disconnected, the suction nozzle puts down the chip or wafer, and the suction nozzle applies proper force to the chip or wafer under the action of the linear and rotary actuator, so that the chip or wafer is firmly pasted on the material sheet; thus completing the pasting action of the single chip or the wafer;
step twelve: repeating the steps six to eleven, after the chips or wafers on the material sheets are covered, retracting the track ejection assembly, and continuously conveying the finished material sheets to the blanking position by the track conveying mechanism, and pushing the finished material sheets into the blanking mechanism by the track pushing assembly.
The beneficial effects of the invention are as follows:
the invention has compact and reasonable structure and convenient operation, can conveniently and automatically complete chip loading work of chips by the mutual matching action among the mechanisms of the functional chip pick-and-place device, the multifunctional double-station welding head mechanism, the control device and the like, can mount 8 chips at most, has UPH of about 1.5 times of the prior art, integrates functions as much as possible on the basis, and has small equipment volume and small occupied area.
The invention strengthens the recognition capability of machine vision, uses an industrial camera with higher resolution, optimizes a vision algorithm, ensures that the recognition precision of an irregular chip is within 1 micron, and controls the glue dipping amount so as to achieve the mounting precision.
The invention adopts double-station technology, effectively solves the problem of multi-chip compatibility, uses a 1.6.6 zoom lens, can electrically adjust the magnification, can receive analog signals and adjust the corresponding magnification according to the signals, and can realize the identification of chips within the diameter range from minimum 0.1mm to maximum 7 mm.
According to the invention, two different operation stations are arranged on the same working platform in parallel, so that the device is suitable for simultaneous installation of different chips; and be provided with recognition device and quick change mechanism between two stations, quick change mechanism has realized the automatic change of outside manipulator suction nozzle, and recognition device is the correction that outside manipulator was used for the benchmark after changing the suction nozzle, promotes chip mounting equipment automation, when promoting the holistic mounting accuracy of mounting equipment of promotion.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is an exploded view of the present invention (wherein the horn portion of the multi-functional dual-station horn mechanism has a housing).
Fig. 3 is a schematic structural view of a multifunctional dual-station welding head mechanism of the present invention.
Fig. 4 is a schematic view of the structure of a single horn mechanism of the present invention.
Fig. 5 is an exploded view of another view of a single horn mechanism of this invention.
FIG. 6 is a schematic diagram of a dipping assembly according to the present invention.
FIG. 7 is an exploded view of the dipping glue assembly of the present invention.
FIG. 8 is a schematic view of the structure of the Z-axis driving assembly of the present invention.
Fig. 9 is a schematic view of the structure of the horn mounting base assembly of the present invention.
Fig. 10 is a schematic structural view of a linear motion assembly according to the present invention.
Fig. 11 is a schematic structural diagram of a multifunctional chip pick-and-place device according to the present invention.
Fig. 12 is a schematic view of the structure of the first station of the present invention.
Fig. 13 is an exploded view of station one of the present invention (with the work platform omitted).
Fig. 14 is a schematic structural view of a second station of the present invention.
Fig. 15 is an exploded view of station two of the present invention.
Fig. 16 is an exploded view of the chip loading mechanism of the present invention.
Fig. 17 is a schematic structural view of the fastening mechanism of the present invention.
Fig. 18 is a schematic structural view of a wafer loading mechanism according to the present invention.
Fig. 19 is an exploded view of the wafer loading mechanism of the present invention.
FIG. 20 is a schematic diagram of a top-die mechanism according to the present invention.
FIG. 21 is an exploded view of the top-wafer mechanism of the present invention.
FIG. 22 is a schematic view of a dip pan assembly according to the present invention.
Fig. 23 is a schematic structural view of the quick-change mechanism of the present invention.
Fig. 24 is a schematic structural view of the identification device of the present invention.
Fig. 25 is a schematic view of the installation of the track transport mechanism of the present invention.
Fig. 26 is a schematic structural view of the rail transport mechanism of the present invention.
Fig. 27 is a schematic view of an alternative view of the track transport mechanism of the present invention.
Fig. 28 is a schematic view of the rear track assembly of the present invention.
Fig. 29 is a schematic structural view of a track pushing assembly of the present invention.
FIG. 30 is a schematic view of a middle rail assembly of the present invention.
Fig. 31 is a schematic view of a middle rail assembly (with the rail ejector assembly omitted) according to the present invention.
FIG. 32 is a schematic view of a track ejector assembly of the present invention.
Fig. 33 is an exploded view of the rail ejector assembly of the present invention.
Fig. 34 is a schematic structural view of a web feeding mechanism of the present invention.
Fig. 35 is a schematic view of a sheet feeding mechanism according to another view angle of the present invention.
FIG. 36 is an exploded view of the web feeding mechanism of the present invention.
Fig. 37 is a schematic structural view of the cartridge guide mechanism of the present invention.
Fig. 38 is a schematic view (partial explosion) of the Z-motion assembly of the present invention.
Fig. 39 is a schematic view of the structure of the X-direction moving assembly of the present invention.
Fig. 40 is a schematic structural view of the pushing system of the present invention.
Fig. 41 is a schematic structural view of the discharge base assembly of the present invention.
Wherein: 1. a working platform; 2. a tablet feeding mechanism; 3. a blanking mechanism; 4. a glue dipping disc assembly; 5. chip feeding mechanism; 6. presetting a platform; 7. an identification device; 8. a quick change mechanism; 9. a wafer loading mechanism; 10. a crystal ejection mechanism; 11. an ion blower; 12. a track conveying mechanism;
13. an alarm lamp; 14. a housing; 15. a display screen; 16. a multifunctional chip pick-and-place device; 17. multifunctional double-station welding head mechanism; 18. a control device; 19. a material sheet; 20. track liftout subassembly;
1204. a rear track assembly; 1205. a middle rail assembly; 1206. a front rail assembly; 1208. the track pushing assembly;
201. a cartridge assembly; 202. a cartridge guide assembly; 203. a pushing system; 204. a discharging base assembly; 205. a Z-direction motion assembly; 206. an X-direction motion assembly; 207. a guide plate; 208. an adjusting plate; 209. a gear cylinder; 210. connecting a lock plate; 211. a frame plate; 212. a third lead screw; 213. a connecting seat; 214. a cartridge fork lever; 215. a large motor; 216. a synchronizing mechanism; 217. a motor base; 218. pushing the material box fork; 219. a locking block; 220. a piston rod; 221. a biaxial cylinder; 222. a right angle plate; 223. a reinforcing plate; 224. a small motor; 225. a pushing rod; 226. a synchronous belt; 227. a connecting block; 228. a synchronizing wheel; 229. a blanking bottom plate; 230. discharging strips; 231. a flange; 232. a discharging box; 233. supporting angle iron; 234. a rear plate;
401. A pinch roller; 402. a pinch roller connecting block; 403. a pinch roller fixing block; 404. a lifting block; 405. a rear rail front side plate; 406. a rear rail rear side plate; 407. a transmission belt; 408. a rear rail fixing block; 409. a rear rail screw shaft; 410. a rear track carousel; 411. a rear rail mounting base; 412. a rear rail drive motor; 413. a transmission motor mounting block; 414. a rear track drive shaft; 415. a rear track connection block; 416. a rear track slider; 417. a rear track rail;
501. pressing strips; 502. a middle rail front side plate; 503. a middle track fixing block; 504. a middle rail screw shaft; 505. a middle track turntable; 506. a middle rail support seat; 507. a middle rail workbench; 508. a middle rail slide rail; 509. a middle track slide block; 510. a middle track connecting block; 511. a middle rail rear side plate; 512. a middle rail transmission motor; 513. a middle track transmission shaft;
2002. a liftout cylinder; 2003. a liftout plate; 2004. a second bracket; 2005. a material blocking cylinder; 2006. a cylinder mounting piece; 2007. a photoelectric sensor; 2008. a sensor mount;
801. a vertical block; 802. an upper fixing plate; 803. a pushing arm; 804. a pushing arm mounting plate; 805. a tension spring; 806. a slip rail; 807. a slide plate; 808. a transmission belt; 809. an L-shaped plate; 810. a tooth-shaped plate; 811. a base plate; 812. and driving the motor.
41. A rubber disc base; 42. a first rubber plate belt wheel; 43. a rubber disc motor; 44. a rubber disc belt; 45. a second rubber plate belt wheel; 46. a rubber plate support plate; 47. a rubber plate; 48. a doctor blade; 49. a small screw;
51. a small platform I; 52. a jig base; 53. a lower air hole; 54. a sealing gasket; 55. a barrier strip; 56. a magnet; 57. a jig; 571. a jig bottom plate; 572. a jig handle; 573. a seal ring; 574. an upper air hole; 575. a buckle mechanism; 5751. a buckle base; 5752. a rotating shaft; 5753. a screw; 5754. a clip; 5755. a spring; 58. a chip magazine; 59. a limiting pin;
701. a slipway module; 702. a second CCD camera; 703. a second zoom lens; 704. a clamp; 705. a light source support plate; 706. a light source; 707. a first bracket; 708. a negative base; 709. a negative film; 710. a Z-direction sliding table; 711. steering barrel; 712. a support base;
81. a suction nozzle base; 83. a plate reed; 84. measuring a height reference surface; 85. a pressure sensor;
901. a small platform II; 902. a motor substrate; 903. a feeding motor; 904. a first feeding belt wheel; 905. a small belt; 906. a feeding belt wheel II; 907. a mandrel; 908. a feeding belt wheel III; 909. a tensioning wheel; 910. a large belt; 911. a large belt wheel; 912. a large bearing; 913. a ring seat; 914. a clasp; 915. a baffle;
1001. A top hub assembly; 1002. a thimble connecting seat; 1003. a second slider; 1004. a second nut; 1005. a second lead screw; 1006. a second motor; 1007. a second belt drive mechanism; 1008. a first motor; 1009. a first nut; 1010. a first slide rail; 1011. a bottom support base; 1012. a first slider; 1013. a slip plate; 1014. a second slide rail; 1015. a first belt drive mechanism; 1016. a first lead screw;
1701. a welding head top plate; 1702. a welding head side plate; 1703. a linear motion assembly; 1704. a welding head mechanism;
1731. a linear motion motor I; 1732. an auxiliary moving guide rail; 1733. a linear motion motor II;
1741. a welding head mounting base assembly; 1742. a Z-axis drive assembly; 1743. a first supporting plate; 1744. a suction nozzle assembly; 1745. a camera assembly; 1746. dipping the glue assembly;
17411. a welding head bottom plate; 17412. a welding head connecting plate; 17413. a support plate IV; 17414. reinforcing ribs;
174201, mounting block five; 174202, guide rail three; 174203, slider three; 174204, screw rod; 174205, a fifth support plate; 174206, mounting block six; 174207, pulley one; 174208, a belt; 174209, pulley two; 174210, a Z-axis driving motor;
17441. A sixth support plate; 17442. a linear plus rotary actuator; 17443. a suction nozzle;
17451. a first CCD camera; 17452. a support plate seven; 17453. a first zoom lens;
174601, air cylinder; 174602, support plate three; 174603, guide rail one; 174604, first slide block; 174605, guide rail two; 174606, second slide block; 174607, a needle mount; 174608, mounting block one; 174609, guide shaft; 174610, mounting block four; 174611, large screws; 174612, mounting block two; 174613, mounting block three; 174614, dipping glue needle; 174615, a second support plate; 174616, compression springs.
Detailed Description
The following describes specific embodiments of the present invention with reference to the drawings.
As shown in fig. 1 and 2, the high-precision multifunctional chip mounter of the embodiment comprises a housing 14, a control device 18 is installed at the bottom position inside the housing 14, a multifunctional chip pick-and-place device 16 is installed above the control device 18, a multifunctional double-station welding head mechanism 17 is installed above the multifunctional chip pick-and-place device 16 in a matched manner, and the multifunctional double-station welding head mechanism 17 is installed at the top position inside the housing 14.
The warning light 13 is still installed at the top of shell 14, and display screen 15 is installed to one side of shell 14, and the both sides face of shell 14 all is provided with the opening, and loading sheet feed mechanism 2 is installed to the opening part of one end, and unloading mechanism 3 is installed to the opening part of the other end, the front and back terminal surface of shell 14 all is provided with openable and the door that closes, all is provided with the glass window on every door, conveniently observes inside behavior to work such as maintenance installation to equipment.
As shown in fig. 3, 4, 5, 6, 7 and 8, the structure of the multifunctional double-station horn mechanism 17 is: the welding head comprises a welding head top plate 1701, wherein two opposite edges of the bottom surface of the welding head top plate 1701 are provided with welding head side plates 1702, a linear motion assembly 1703 is arranged on the bottom surface of the welding head top plate 1701 positioned between the two welding head side plates 1702, and two welding head mechanisms 1704 are arranged below the linear motion assembly 1703 in parallel; the structure of the single horn mechanism 1704 is: the welding head mounting base assembly 1741 fixedly arranged on the linear motion assembly 1703 is included, a Z-axis driving assembly 1742 is arranged on the welding head mounting base assembly 1741, a first support plate 1743 is arranged on the Z-axis driving assembly 1742, and the first support plate 1743 is driven by a Z-axis driving motor 174210 to move up and down; one end of the first support plate 1743 is provided with a glue dipping component 1746, the other end of the first support plate 1743 is provided with a suction nozzle component 1744, and a camera component 1745 is also arranged on the first support plate 1743 beside the suction nozzle component 1744.
The dipping glue assembly 1746 has the structure that: the device comprises a second support plate 174615 fixedly arranged on a first support plate 1743, an air cylinder 174601 is fixedly arranged on a second support plate 174615 along the vertical direction, a first guide rail 174603 is arranged on a second support plate 174615 positioned beside the air cylinder 174601, the first guide rail 174603 is parallel to the movement direction of the air cylinder 174601, and a first slide block 174604 sliding along the first guide rail 174603 is arranged on the first guide rail; the output end of the air cylinder 174601 and the first slide block 174604 are jointly provided with a third support plate 174602; a second guide rail 174605 is arranged on the third support plate 174602 along the vertical direction, a second slide block 174606 sliding along the second guide rail 174605 is arranged on the second slide block 174606, a needle seat 174607 is arranged on the second slide block 174606, and a glue dipping needle 174614 is arranged at the bottom of the needle seat 174607; the top of the third support plate 174602 is provided with a first installation block 174608, a guide shaft 174609 vertically penetrating through the first installation block 174608 is provided with a bottom end of the guide shaft 174609 extending into the top of the needle seat 174607, and a compression spring 174616 is sleeved on the guide shaft 174609 between the first installation block 174608 and the needle seat 174607; the side of the third support plate 174602 is provided with a second installation block 174612 with an L-shaped structure, the side of the needle seat 174607 is provided with a third installation block 174613 with an L-shaped structure, the second installation block 174612 and the third installation block 174613 are oppositely arranged to form a 'mouth' -shaped structure, the inner side surface of the second installation block 174612 is provided with a lower contact, the inner side surface of the third installation block 174613 is provided with an upper contact, and the upper contacts are positioned above the lower contacts and are in contact with each other; the lower part of the side edge of the second support plate 174615 is provided with a fourth installation block 174610 with an L-shaped structure, and the bottom of the fourth installation block 174610 is provided with a large screw 174611; the large screw 174611 extends through the mounting block four 174610 and the large screw 174611 is located below the support plate three 174602.
The structure of the Z-axis drive assembly 1742 is: the welding head comprises a mounting block five 174201 and a mounting block six 174206 which are fixedly arranged on a welding head mounting base assembly 1741 and are arranged at an upper and lower interval, a screw rod 174204 is commonly arranged on the mounting block five 174201 and the mounting block six 174206, and a supporting plate five 174205 is arranged on a screw rod 174204 positioned between the mounting block five 174201 and the mounting block six 174206 in a matched manner; the upper end part of the screw rod 174204 extends out of the mounting block five 174201, and the upper end head of the screw rod 174204 is provided with a belt wheel one 174207; the bottom of the installation block five 174201 is provided with a Z-axis driving motor 174210, the output end of the Z-axis driving motor 174210 extends upwards out of the installation block five 174201, the end head of the output end of the Z-axis driving motor 174210 is provided with a belt wheel two 174209, and a belt wheel one 174207 is connected with a belt wheel two 174209 through a belt 174208; the welding head mounting base assembly 1741 beside the screw rod 174204 is also provided with a guide rail III 174202, the guide rail III 174202 is parallel to the screw rod 174204, and the guide rail III 174202 is provided with a slider III 174203 sliding along the guide rail III; one end of a fifth support plate 174205 is sleeved on the screw rod 174204, and the other end of the fifth support plate 174205 is fixedly arranged with a third slider 174203.
The suction nozzle assembly 1744 is structured as follows: the device comprises a support plate six 17441 fixedly arranged with a support plate I1743, a linear and rotary actuator 17442 is fixedly arranged on the side surface of the support plate six 17441, a suction nozzle 17443 is arranged at the output end of the linear and rotary actuator 17442, and the suction nozzle 17443 is connected with an external air source; a height sensor is also mounted on the side of the linear-and-rotary actuator 17442 beside the suction nozzle 17443; the structure of the camera assembly 1745 is: comprises a support plate seven 17452 fixedly arranged with a support plate one 1743, a first zoom lens 17453 is fixedly arranged on the side surface of the support plate seven 17452, and a first CCD camera 17451 is arranged on the top of the first zoom lens 17453.
As shown in fig. 9, the horn mounting base assembly 1741 is structured as follows: comprises a welding head bottom plate 17411 fixedly arranged with the linear motion assembly 1703, a welding head connecting plate 17412 is fixedly arranged on the bottom surface of the welding head bottom plate 17411, and a support plate four 17413 with an L-shaped structure is fixedly arranged at the lower part of the side edge of the welding head connecting plate 17412; the welding head connecting plate 17412 is fixedly arranged on the inner side surface of a supporting plate IV 17413, and the outer side surface of the supporting plate IV 17413 is fixedly arranged on the Z-axis driving assembly 1742; reinforcing ribs 17414 are also arranged between the two side walls of the four 17413 support plates.
As shown in fig. 10, the linear motion assembly 1703 has a structure that: the welding head comprises a first linear motion motor 1731 fixedly arranged in the middle of the bottom surface of a welding head top plate 1701, and the installation direction of the first linear motion motor 1731 is perpendicular to a welding head side plate 1702; the bottom surface of the welding head top plate 1701 positioned at two sides of the linear motion motor 1731 is provided with auxiliary motion guide rails 1732; the auxiliary motion guide rails 1732 are parallel to the first linear motion motor 1731, two parallel second linear motion motors 1733 are mounted on the two auxiliary motion guide rails 1732 and the first linear motion motor 1731 together, and a welding head mechanism 1704 is mounted on each second linear motion motor 1733;
the working principle of the multifunctional double-station welding head mechanism 17 provided by the invention is as follows:
The first linear motion motor 1731 works to drive the welding head mechanism 1704 to perform X-direction linear motion along the auxiliary motion guide rail 1732; the second linear motion motor 1733 works to drive the welding head mechanism 1704 on the second linear motion motor to perform Y-direction linear motion; the Z-axis driving motor 174210 in the Z-axis driving assembly 1742 works, the belt wheel two 174209 and the belt 174208 drive the belt wheel one 174207 to rotate, the screw rod 174204 rotates, and the five support plates 174205 matched with the screw rod 174204 move up and down along the guide rail three 174202, so that the glue dipping assembly 1746, the camera assembly 1745 and the suction nozzle assembly 1744 move linearly in the Z direction.
When the chip mounting requirements of different heights on the PCB substrate are met, the height of the position to be mounted is measured through the height measuring sensor, the Z-axis driving motor 174210 works, the height of the camera assembly 1745 is adjusted according to the height measuring signal of the height measuring sensor, the height of the first CCD camera 17451 corresponds to the mounting position and reaches the optimal recognition height, and therefore accurate chip mounting of each height is achieved.
The two groups of welding head mechanisms 1704 can work simultaneously, and the same chip or different chips can be attached or installed; the single set of horn mechanisms 1704 under program control enables continuous application or mounting of a single chip or multiple chips. The chip bonding method has the advantages of high bonding efficiency, good precision, wide application range and reliable chip bonding.
As shown in fig. 11, 12, 13, 14, and 15, the multi-functional chip pick-and-place device 16 has a structure in which: the device comprises a working platform 1, a rail conveying mechanism 12 is arranged across the working platform 1, a tablet feeding mechanism 2 and a tablet discharging mechanism 3 are respectively arranged at two ends of the rail conveying mechanism 12 positioned outside the working platform 1, and a first station and a second station are sequentially arranged on the working platform 1 along the direction of the rail conveying mechanism 12; the working platform 1 positioned at the interval between the first station and the second station is provided with a recognition device 7, and a quick-change mechanism 8 is arranged above the recognition device 7;
the structure of the station I is as follows: the device comprises a chip feeding mechanism 5 fixedly arranged on a working platform 1, wherein a glue dipping disc assembly 4 is arranged between the chip feeding mechanism 5 and a track conveying mechanism 12;
the structure of the station II is as follows: the wafer loading device comprises a wafer loading mechanism 9 fixedly arranged on a working platform 1, wherein a wafer ejection mechanism 10 is arranged on the working platform 1 positioned at the bottom of the wafer loading mechanism 9; the glue dipping disc assembly 4 which is the same as the first station is arranged between the wafer feeding mechanism 9 and the track conveying mechanism 12. And the first station and the second station are respectively provided with an ion fan 11 and a preset platform 6.
As shown in fig. 16, the chip feeding mechanism 5 has the following structure: the device comprises a first small platform 51 fixedly arranged on a working platform 1 through supporting legs, wherein a jig base 52 is arranged on the first small platform 51, a plurality of lower air holes 53 are formed in the jig base 52, the lower air holes 53 are connected with an external air source, and sealing gaskets 54 are arranged on the jig base 52 corresponding to the lower air holes 53; the three side edges of the upper surface of the jig base 52 are provided with baffle strips 55, and a jig 57 is arranged on the jig base 52 positioned on the inner side of the three side baffle strips 55; a magnet 56 is embedded on the jig base 52 positioned on the inner side of the barrier strip 55;
The structure of the jig 57 is: the jig comprises a jig bottom plate 571 arranged on a jig base 52, wherein jig handles 572 are arranged at the ends of the jig bottom plate 571, a plurality of acupuncture points for placing the chip material boxes 58 are arranged on the jig bottom plate 571, and the acupuncture points correspond to the lower air holes 53 one by one; an upper air hole 574 communicated with the lower air hole 53 is formed in the jig bottom plate 571 corresponding to the acupuncture point, and a sealing ring 573 is arranged on the jig bottom plate 571 corresponding to the upper air hole 574; a plurality of limiting pins 59 and a buckling mechanism 575 are arranged on the jig bottom plate 571 corresponding to the acupuncture points, the limiting pins 59 are arranged at two adjacent edges of each acupuncture point, and the buckling mechanisms 575 are arranged at opposite angles of the limiting pins 59;
as shown in fig. 17, the structure of the latch mechanism 575 is: the fixture comprises a clamping base 5751 fixedly arranged on a fixture bottom plate 571, wherein the clamping base 5751 is of an L-shaped structure, rotating shafts 5752 are arranged penetrating through two side walls of the clamping base 5751, and clamping pieces 5754 of L-shaped structures are rotatably arranged on the rotating shafts 5752 positioned in the clamping base 5751; screws 5753 are installed through the side walls of the clamping pieces 5754, springs 5755 are sleeved on the screws 5753, and the ends of the springs 5755 are fixedly arranged on the jig bottom plate 571.
As shown in fig. 18 and 19, the wafer loading mechanism 9 has the following structure: the feeding device comprises a second small platform 901 fixedly arranged on a working platform 1 through supporting legs, wherein a feeding motor 903 is arranged at the end part of the bottom surface of the second small platform 901 through a motor substrate 902, a first feeding belt pulley 904 is arranged at the end of the second small platform 901, a mandrel 907 is rotatably arranged on the motor substrate 902 beside the first feeding belt pulley 904, the mandrel 907 penetrates through the motor substrate 902, a second feeding belt pulley 906 and a third feeding belt pulley 908 are respectively arranged at the two ends of the mandrel 907, and the first feeding belt pulley 904 is connected with the second feeding belt pulley 906 through a small belt 905; a large bearing 912 is arranged on the second small platform 901 beside the motor substrate 902, a ring seat 913 is arranged in the large bearing 912, the ring seat 913 penetrates through the second small platform 901, a large belt wheel 911 is fixedly arranged at the bottom of the ring seat 913, the large belt wheel 911 is connected with the third feeding belt wheel 908 through a large belt 910, and a tensioning wheel 909 is arranged at the bottom of the second small platform 901 outside the large belt 910; the top of the ring seat 913 is provided with a clamping ring 914, the outer edge of the clamping ring 914 extends outwards to form a step for installing the wafer ring, and the clamping ring 914 beside the wafer ring is also provided with a baffle 915.
As shown in fig. 20 and 21, the top crystal mechanism 10 has the following structure: the device comprises a bottom supporting seat 1011 fixedly arranged on a working platform 1, wherein a groove is formed in the middle of the bottom supporting seat 1011, first sliding rails 1010 are symmetrically arranged at two ends of the groove, a first sliding block 1012 is arranged on the first sliding rail 1010, a first lead screw 1016 is further arranged at the groove, a first nut 1009 is sleeved on the first lead screw 1016, a sliding plate 1013 is simultaneously arranged at the tops of the first nut 1009 and the first sliding block 1012, a first motor 1008 is further fixed at the outer side of the bottom supporting seat 1011, and the output end of the first motor 1008 is connected with the head of the first lead screw 1016 through a first belt transmission mechanism 1015; the installation direction of the sliding plate 1013 is perpendicular to the bottom supporting seat 1011, a second sliding rail 1014 is fixed on the sliding plate 1013, a second sliding block 1003 is installed on the second sliding rail 1014, a second screw rod 1005 parallel to the second sliding rail 1014 is arranged beside the second sliding rail 1014, a second nut 1004 is installed on the second screw rod 1005, a thimble connecting seat 1002 is simultaneously fixed on the second sliding block 1003 and the second nut 1004, and a thimble seat component 1001 is installed on the thimble connecting seat 1002; the outer side of the sliding plate 1013 is also fixed with a second motor 1006, and an output end of the second motor 1006 is connected with a second screw 1005 through a second belt transmission mechanism 1007.
As shown in fig. 22, the dip pan assembly 4 has the following structure: the device comprises a rubber disc base 41 fixedly arranged on the outer side wall of the track conveying mechanism 12 and in an L-shaped structure, wherein a rubber disc motor 43 is arranged at the bottom of the rubber disc base 41, the output end of the rubber disc motor 43 upwards penetrates through the rubber disc base 41, and a rubber disc belt wheel I42 is arranged at the end part of the output end of the rubber disc motor 43; a rubber disc support plate 46 is arranged on the outer side wall of the track conveying mechanism 12 beside the rubber disc base 41, a rubber disc 47 is arranged on the top surface of the rubber disc support plate 46, the rubber disc 47 is rotationally connected with the rubber disc support plate 46 through a rotating shaft in the middle, the rotating shaft penetrates out of the rubber disc support plate 46 downwards, and a rubber disc belt wheel II 45 is arranged at the lower end part of the rotating shaft; the first rubber disc belt wheel 42 is connected with the second rubber disc belt wheel 45 through a rubber disc belt 44; a scraping cutter 48 is also arranged on the rubber disc support plate 46 beside the rubber disc 47; one end of a scraping knife 48 is connected with the rubber disc support plate 46 through a small screw 49, and the other end of the scraping knife 48 is suspended above the rubber disc 47.
As shown in fig. 23, the quick-change mechanism 8 has a structure in which: the suction nozzle comprises a suction nozzle base 81, wherein a plurality of grooves with triangular sections are symmetrically formed at two opposite edges of the upper surface of the suction nozzle base 81, a suction nozzle 17443 is hung in each groove, and plate reeds 83 are arranged on the suction nozzle bases 81 corresponding to two adjacent suction nozzles 17443; a height measurement reference surface 84 and a pressure sensor 85 are also provided on the nozzle base 81 beside the recess.
As shown in fig. 24, the identification device 7 has a structure in which: the device comprises a sliding table module 701 fixedly arranged on a working platform 1, wherein a clamp 704 is arranged at the top of the sliding table module 701, and a second zoom lens 703 is clamped in the clamp 704; one end of the clamp 704 is provided with a second CCD camera 702, and the other end of the clamp 704 is provided with a steering lens barrel 711; the top of the clamp 704 is fixedly provided with a light source support plate 705, the end part of the light source support plate 705 is provided with a light source 706, and the light source 706 is positioned right above the steering lens cone 711; a support base 712 is fixedly arranged on the working platform 1 beside the sliding table module 701, a Z-direction sliding table 710 is arranged on the upper portion of the support base 712, a first bracket 707 is arranged on the side edge of the Z-direction sliding table 710, a negative film base 708 is arranged on the top of the first bracket 707, a negative film 709 is arranged on the negative film base 708, and the negative film 709 is positioned right above the light source 706.
As shown in fig. 34, 35 and 36, the structure of the tablet feeding mechanism 2 and the tablet discharging mechanism 3 are the same, and the specific structure of the tablet feeding mechanism 2 is: the automatic feeding device comprises a feeding base assembly 204, wherein an X-direction moving assembly 206 is fixedly arranged on the feeding base assembly 204, a Z-direction moving assembly 205 is fixedly arranged on the feeding base assembly 204 beside the X-direction moving assembly 206, a material box fork rod 214 is arranged on the Z-direction moving assembly 205, material box guide assemblies 202 are arranged on two side surfaces of the Z-direction moving assembly 205, and material box assemblies 201 are arranged in the material box guide assemblies 202.
As shown in fig. 37, the cartridge guide assembly 202 has the structure: the gear adjusting device comprises four adjusting plates 208, wherein the four adjusting plates 208 are enclosed into a quadrilateral structure through fasteners, guide plates 207 are vertically arranged on each adjusting plate 208, gear air cylinders 209 are arranged at the bottoms of the two guide plates 207, and guide rods are arranged at the output ends of the gear air cylinders 209; the end of one of the adjustment plates 208 is locked with a connection lock plate 210;
as shown in fig. 38, the Z-direction movement assembly 205 has the following structure: the device comprises a frame plate 211, wherein a motor seat 217 is fixed at the bottom of the frame plate 211, a large motor 215 is installed on the motor seat 217, a synchronizing mechanism 216 is installed on an output shaft of the large motor 215, a third screw rod 212 is connected to an output end of the synchronizing mechanism 216, the third screw rod 212 penetrates through the vertical direction of the whole frame plate 211, a connecting seat 213 which moves up and down along the third screw rod 212 is installed on the third screw rod 212, a nut matched with the third screw rod 212 is arranged in the connecting seat 213, and a material box fork rod 214 is fixed on the outer side surface of the connecting seat 213;
as shown in fig. 40, the pushing system 203 has the following structure: the device comprises a right-angle plate 222, wherein a reinforcing plate 223 is arranged on the inner side of the right-angle plate 222, a rear plate 234 is fixed on the outer side surface of the right-angle plate 222, a small motor 224 is fixed on the back of the rear plate 234, a synchronizing wheel 228 is arranged on an output shaft of the small motor 224, a synchronous belt 226 is arranged between the two synchronizing wheels 228, a pushing rod 225 is arranged above the synchronous belt 226 through the engagement of a connecting block 227, the pushing rod 225 and the connecting block 227 simultaneously walk along with the synchronous belt 226, a sliding block is also arranged on the inner side of the pushing rod 225, and the sliding block walks along a guide rail;
As shown in fig. 41, the structure of the discharging base assembly 204 is: including unloading bottom plate 229, the bottom of unloading bottom plate 229 is supported fixedly through supporting angle bar 233, and blowing box 232 is installed to unloading bottom plate 229 upper surface one end, installs X on the unloading bottom plate 229 of blowing box 232 inside and to motion subassembly 206, as shown in FIG. 39, and the specific structure of X to motion subassembly 206 is: the automatic feeding device comprises a double-shaft air cylinder 221, wherein a piston rod 220 is arranged at the output end of the double-shaft air cylinder 221, a locking block 219 is arranged at the head part of the piston rod 220, and a pushing box fork 218 with a U-shaped structure is fixed on the locking block 219; the upper surface of the discharge box 232 is also provided with a discharge bar 230 and a flange 231.
As shown in fig. 25, 26 and 27, the track conveying mechanism 12 has a structure in which: a segmented construction is employed, a front track assembly 1206, a middle track assembly 1205, and a rear track assembly 1204, respectively; the front track assembly 1206 and the rear track assembly 1204 are identical in structure and symmetrically disposed at both ends of the middle track assembly 1205, and a track pushing assembly 1208 is disposed within the rear track assembly 1204.
As shown in fig. 28, the rear track assembly 1204 is structured as follows: the device comprises a rear rail mounting base 411, a rear rail front side plate 405 is mounted at the rear end of the upper surface of the rear rail mounting base 411, a rear rail rear side plate 406 is mounted at intervals parallel to the rear rail front side plate 405, a rear rail transmission motor 412 is mounted at the front end position of the upper surface of the rear rail mounting base 411 through a transmission motor mounting block 413, a rear rail transmission shaft 414 is mounted at the output end of the rear rail transmission motor 412 through a speed reducer, the rear rail transmission shaft 414 simultaneously passes through the rear rail rear side plate 406 and the rear rail front side plate 405, a plurality of small rollers are mounted on the inner sides of the rear rail rear side plate 406 and the rear rail front side plate 405, a conveying belt 407 is wound on the small rollers, a material sheet 19 is mounted on the spaced conveying belt 407 in a matched mode, a pressing wheel fixing block 403 is also locked on the top surfaces of the rear rail rear side plate 406 and the rear rail front side plate 405, a pressing wheel 401 is mounted on the pressing wheel fixing block 403 through a shaft, a pressing wheel 401 is mounted on the pressing wheel connecting block 402, and the pressing wheel 401 presses the material sheet 19; the front end position of the upper surface of the rear rail mounting base 411 is also provided with a rear rail turntable 410, the rear end connected with the rear rail turntable 410 is provided with a large nut, the large nut is sleeved on a rear rail screw shaft 409, and the rear rail screw shaft 409 passes through a rear rail rear side plate 406 and is fixed with a rear rail fixing block 408; the rear rail mounting base 411 is symmetrically provided with rear rail sliding rails 417, the rear rail sliding rails 417 are provided with rear rail sliding blocks 416 sliding along the rear rail sliding rails, and the rear rail sliding blocks 416 are locked with the rear rail rear side plates 406 through rear rail connecting blocks 415;
As shown in fig. 29, the track pushing assembly 1208 has the following structure: the lifting device comprises a base plate 811 fixed through a lifting block 404, vertical blocks 801 are symmetrically arranged at two ends of the upper surface of the base plate 811, an upper fixing plate 802 is arranged at the top of each vertical block 801, a sliding rail 806 is fixed on the upper surface of the upper fixing plate 802, the sliding blocks are arranged on the sliding rails 806 in a matched mode, a cuboid sliding plate 807 is fixed on the sliding blocks, a pushing arm mounting plate 804 is fixed at one end of the top of the sliding plate 807, a pushing arm 803 is arranged at the head of the pushing arm mounting plate 804, and one end of the pushing arm 803 is connected with the pushing arm mounting plate 804 through a tension spring 805; a driving motor 812 is also fixed at the bottom of the base plate 811, the output end of the driving motor 812 passes through the base plate 811 and is provided with a driving belt 808 through rollers, an L-shaped plate 809 and a tooth-shaped plate 810 are oppositely arranged on the driving belt 808 in a meshed manner, and the top of the L-shaped plate 809 is locked with the sliding plate 807;
as shown in fig. 30 and 31, the middle rail assembly 1205 is configured as follows: the device comprises a middle rail supporting seat 506 arranged at intervals, a middle rail workbench 507 is fixed on the upper surface of the middle rail supporting seat 506, a middle rail front side plate 502 is arranged at the rear end position of the upper surface of the middle rail workbench 507, a middle rail rear side plate 511 is arranged in parallel with the middle rail front side plate 502 at intervals, and a rail jacking component 20 is arranged between the middle rail front side plate 502 and the middle rail rear side plate 511; a middle rail transmission motor 512 is fixed on the middle rail workbench 507, a middle rail transmission shaft 513 is arranged on the middle rail transmission motor 512 through a speed reducer, the middle rail transmission shaft 513 simultaneously passes through the middle rail rear side plate 511 and the middle rail front side plate 502, a plurality of small rollers are arranged on the inner sides of the middle rail rear side plate 511 and the middle rail front side plate 502, a conveyor belt is wound on the small rollers, the spaced conveyor belts are matched with the conveyed material sheets 19, and the material sheets 19 are pressed on the two side plates through pressing strips 501; the middle rail workbench 507 is also provided with a middle rail turntable 505, the rear end connected with the middle rail turntable 505 is provided with a large nut, the large nut is sleeved on a middle rail screw shaft 504, and the middle rail screw shaft 504 passes through a middle rail rear side plate 511 and is fixed with a middle rail fixing block 503; the middle rail workbench 507 is symmetrically provided with a middle rail slide rail 508, a middle rail slide block 509 sliding along the middle rail slide rail 508 is arranged on the middle rail slide rail 508, and the middle rail slide block 509 is locked with a middle rail rear side plate 511 through a middle rail connecting block 510;
As shown in fig. 32 and 33, the track ejector assembly 20 has the following structure: the device comprises second brackets 2004 which are symmetrically arranged at intervals, wherein a jacking cylinder 2002 is fixed at the top of the inner sides of the two second brackets 2004, a jacking plate 2003 is fixed at the output end of the jacking cylinder 2002, a cylinder mounting plate 2006 and a sensor mounting base 2008 are fixed at the outer side of one second bracket 2004, a material blocking cylinder 2005 is fixed on the cylinder mounting plate 2006, and a photoelectric sensor 2007 is fixed on the sensor mounting base 2008.
The principle of operation of the rail transport mechanism 12 is as follows:
in practice, a manual placement of a magazine filled with the webs 19 into the magazine guide assembly 202 is used.
Before placing the cartridge, the adjustable cartridge guide assembly 202 is adjusted according to the size of the cartridge, a track of an appropriate width is selected, when the cartridge is placed in place, the sheet 19 is pushed from the cartridge to the track by the pushing system 203, and the pushing system 203 returns to the initial position.
The web 19 is fed from the loading magazine to the track and then onwards along the track. Progressive progress is made from the front track assembly 1206, the middle track assembly 1205, to the rear track assembly 1204. In the front rail assembly 1206, the middle rail assembly 1205 and the rear rail assembly 1204, when reaching the corresponding working positions, the ejector mechanism ejects out to fix the material sheet 19, and when reaching the rear rail assembly 1204, the pushing device pushes the prepared material sheet 19 into the blanking box.
The Z-motion assembly 205 then brings the position of the next web 19 to the pushing level of the pushing system 203, repeating the above. The material sheet 19 in the cartridge is ready to be made. The X-motion assembly 206 will move the completed cartridge to the empty cartridge placement position.
By adopting the operation process, the loading and unloading work and the conveying work of the material sheet 19 can be conveniently completed, the operation is convenient, the working efficiency is high, and the working reliability is good.
The application method of the high-precision multifunctional chip mounter comprises the following operation steps:
step one: starting a power supply;
step two: manually placing the magazine assembly 201 filled with the non-patch material sheets 19 into the magazine guide assembly 202 of the sheet feeding mechanism 2; placing the empty cartridge assembly 201 into the cartridge guide assembly 202 of the blanking mechanism 3;
step three: manually placing the chip material boxes 58 on the jig bottom plate 571 of the jig 57, limiting the single chip material boxes 58 relative to the jig bottom plate 571 through the limiting pins 59 and the clamping mechanisms 575, placing the jig 57 on the jig base 52 of the first station through the jig handles 572, and limiting the jig 57 by the stop bars 55 on the jig base 52;
if the incoming material is a wafer in the wafer ring form, feeding is performed through a station II: manually placing the wafer ring on a clamping ring 914 of a second station, and limiting the wafer ring by the edge of the clamping ring 914 and a baffle 915;
Step four: clicking a start button on the display screen 15 by a mouse;
step five: the pushing system 203 pushes the individual webs 19 from the magazine assembly 201 to the track transport mechanism 12; the track conveying mechanism 12 conveys the material sheet 19 to the first station or the second station, and when the material sheet 19 reaches the corresponding working position, the track ejection assembly 20 ejects the material sheet 19;
step six: the welding head mechanism 1704 starts to work, and the camera assembly 1745 moves to the chip to be pasted on the material sheet 19 on the track conveying mechanism 12 under the drive of the linear movement assembly 1703 to take a picture, so as to confirm the coordinates of the position of the chip to be pasted or the wafer;
step seven: under the drive of the linear motion assembly 1703, the glue dipping assembly 1746 moves to the position right above the glue dipping disc assembly 4, the air cylinder 174601 works, the glue dipping needle 174614 and the needle seat 174607 move downwards along the first guide rail 174603 along with the third support plate 174602, so that the glue dipping needle 174614 stretches into the glue disc 47 to dip glue, and the air cylinder 174601 moves reversely to drive the glue dipping needle 174614 to move upwards;
step eight: under the drive of the linear motion assembly 1703, the glue dipping assembly 1746 moves to the position right above the material sheet 19 on the track conveying mechanism 12, so that the glue dipping needle 174614 is positioned on the material sheet 19 at the position where a chip or a wafer is to be pasted, and the operation of the air cylinder 174601 in the seventh step is repeated, so that the glue dipping needle 174614 contacts with the material sheet 19, and glue is applied to the appointed position of the material sheet 19; the glue dipping needle 174614 is retracted under the action of the air cylinder 174601;
Step nine: under the drive of the linear motion assembly 1703, the camera assembly 1745 moves to the position one or the position two, so that the first CCD camera 17451 in the camera assembly 1745 is positioned right above the chip or the wafer, the chip is amplified and shot through the first CCD camera 17451 and the first zoom lens 17453, and the coordinates of the chip or the wafer are calculated and confirmed through an internal algorithm;
step ten: under the drive of the linear motion assembly 1703, the suction nozzle assembly 1744 moves to the position one or the position two, so that the suction nozzle 17443 is positioned right above the chip or the wafer in the step nine, and the suction nozzle 17443 sucks the chip or the wafer under the action of an external air source;
step eleven: under the drive of the linear motion assembly 1703, the suction nozzle assembly 1744 moves to the track conveying mechanism 12, so that the suction nozzle 17443 is positioned right above a chip or wafer to be pasted on the material sheet 19, an external air source is disconnected, the suction nozzle 17443 puts down the chip or wafer, and the suction nozzle 17443 applies proper force to the chip or wafer under the action of the linear and rotary actuator 17442, so that the chip or wafer is firmly pasted on the material sheet 19; thus completing the pasting action of the single chip or the wafer;
step twelve: repeating the steps six to eleven, after the chips or wafers on the web 19 are covered, the track ejection assembly 20 is retracted, the track conveying mechanism 12 continues to convey the finished web 19 to the blanking position, and the track pushing assembly 1208 pushes the finished web 19 into the blanking mechanism 3.
In practical operation, the glue dipping and dispensing operations in the seventh and eighth steps can be omitted for stable and efficient mounting of chips or wafers without glue.
In actual operation, the mounting or the attaching of a single chip, two chips or three or more chips can be realized through double stations and double welding heads.
Three different examples are given below:
embodiment one: description will be given by taking a chip attached
The same suction nozzle 17443 and glue dipping needle 174614 are manually mounted on the suction nozzle assembly 1744 and glue dipping assembly 1746 of the two welding head mechanisms 1704; manually placing two magazine assemblies 201 filled with non-patch material sheets into the material sheet feeding mechanism 2; placing two empty tablet magazines in the same position of the blanking mechanism 3; in the same way as in the third step, the jig 57 with the chip magazine 58 is placed on the jig base 52 of the first station;
starting a program through the display screen 15, the pushing system 203 pushes the tablet from the tablet magazine onto the track conveying mechanism 12 and conveys the tablet forward along the track; the ejector mechanism ejects and holds the web 19 when the first web is delivered to the middle rail assembly 1205 and also holds it by the same ejector mechanism when the second web is delivered to the front rail assembly 1206;
Repeating steps six through eleven above, the two horn mechanisms 1704 each pick up chips from station one and mount to two webs on the front rail assembly 1206 and the middle rail assembly 1205, respectively;
after chip-on-web lamination is completed, the material ejection mechanisms are retracted, the track conveying mechanisms 12 continue to convey the webs to the discharging position, and the pushing device pushes the prepared webs into the discharging material box.
In this embodiment, a disc may also be placed in the clamp ring 914 of the second station, and the jig 57 with the chip magazine 58 is placed through the disc, so that the two bonding tool mechanisms 1704 draw chips from the first station and the second station, respectively.
Embodiment two: two kinds of chips are attached for illustration.
The difference from the first embodiment is that: different suction nozzles 17443 and different glue dipping needles 174614 are manually arranged on the suction nozzle assembly 1744 and the glue dipping assembly 1746 of the two welding head mechanisms 1704, and different chips are respectively placed on the first station and the second station.
Embodiment III: three kinds of chips are attached for illustration.
The difference from the first embodiment is that:
different suction nozzles 17443 and different glue dipping needles 174614 are manually mounted on the suction nozzle assembly 1744 and the glue dipping assembly 1746 of the two welding head mechanisms 1704;
The suction nozzle 17443 and the glue dipping needle 174614 which are used in the process are manually placed on the quick-change mechanism 8;
manually placing different chips into a first station and a second station according to assembly requirements;
performing chip mounting operation in the same way as the above steps; when the suction nozzle 17443 or the glue dipping needle 174614 needs to be replaced, the welding head mechanism 1704 is driven by the linear motion assembly 1703 to move to the quick-change mechanism 8, the suction nozzle 17443 and the glue dipping needle 174614 on the suction nozzle assembly 1744 and the glue dipping assembly 1746 are hung on the empty space of the quick-change mechanism 8, and move to the positions of the suction nozzle 17443 and the glue dipping needle 174614 needed in the quick-change mechanism 8, and the new suction nozzle 17443 and the new glue dipping needle 174614 are respectively replaced; after replacing the new suction nozzle 17443 and the dipping needle 174614, the horn mechanism 1704 performs coordinate adjustment of the new suction nozzle 17443 and the dipping needle 174614 by the recognition device 7.
Wherein the suction nozzle 17443 is attracted to the suction nozzle assembly 1744 by magnetic force, the glue dipping needle 174614 is attracted to the glue dipping assembly 1746 by magnetic force, and after the welding head mechanism 1704 hangs the suction nozzle 17443 or the glue dipping needle 174614 from the side of the quick-change mechanism 8 to the empty space, the welding head mechanism 1704 applies upward force to the suction nozzle assembly 1744 or the glue dipping assembly 1746 to separate the suction nozzle 17443 or the glue dipping needle 174614 therefrom, so as to realize the lowering of the old suction nozzle 17443 or the glue dipping needle 174614; in the same manner, a new suction nozzle 17443 or dipping needle 174614 is attached to the suction nozzle assembly 1744 or dipping assembly 1746.
The invention can meet the requirements of +/-7 microns precision and six different chips (the most mounting technology of the existing chips in the industry, and the productivity of the prior art is calculated by the technology), and the UPH can reach 600 to 700. And the integration level of the functions is very high, and the volume is only 1.4m multiplied by 1.2m multiplied by 2m in height.
The invention can improve the production efficiency and reduce the manual labor, the culture and management cost on the premise of ensuring the mounting precision to be +/-7 microns.
The above description is intended to illustrate the invention and not to limit it, the scope of which is defined by the claims, and any modifications can be made within the scope of the invention.

Claims (13)

1. A high-precision multifunctional chip loader is characterized in that: the multifunctional chip pick-and-place device comprises a shell (14), wherein a control device (18) is arranged at the bottom position inside the shell (14), a multifunctional chip pick-and-place device (16) is arranged above the control device (18), a multifunctional double-station welding head mechanism (17) is arranged above the multifunctional chip pick-and-place device (16) in a matched mode, and the multifunctional double-station welding head mechanism (17) is arranged at the top position inside the shell (14); the structure of the multifunctional double-station welding head mechanism (17) is as follows: the welding head comprises a welding head top plate (1701), wherein two opposite edges of the bottom surface of the welding head top plate are provided with welding head side plates (1702), a linear motion assembly (1703) is arranged on the bottom surface of the welding head top plate (1701) between the two welding head side plates (1702), and two welding head mechanisms (1704) are arranged below the linear motion assembly (1703) in parallel; the structure of the single welding head mechanism (1704) is as follows: the welding head comprises a welding head installation base assembly (1741) fixedly arranged on a linear motion assembly (1703), a Z-axis driving assembly (1742) is arranged on the welding head installation base assembly (1741), a first support plate (1743) is arranged on the Z-axis driving assembly (1742), and the first support plate (1743) is driven by a Z-axis driving motor (174210) to move up and down; one end of the first support plate (1743) is provided with a glue dipping component (1746), the other end of the first support plate (1743) is provided with a suction nozzle component (1744), and the first support plate (1743) beside the suction nozzle component (1744) is also provided with a camera component (1745); the glue dipping component (1746) has the structure that: the device comprises a support plate II (174615) fixedly arranged on a support plate I (1743), an air cylinder (174601) is fixedly arranged on the support plate II (174615) along the vertical direction, a guide rail I (174603) is arranged on the support plate II (174615) beside the air cylinder (174601), the guide rail I (174603) is parallel to the movement direction of the air cylinder (174601), and a slide block I (174604) sliding along the guide rail I (174603) is arranged on the guide rail I; the output end of the air cylinder (174601) and the first slide block (174604) are jointly provided with a third support plate (174602); a second guide rail (174605) is arranged on the third support plate (174602) along the vertical direction, a second slide block (174606) sliding along the second guide rail (174605) is arranged on the second slide block (174606), a needle seat (174607) is arranged on the second slide block (174606), and a glue dipping needle head (174614) is arranged at the bottom of the needle seat (174607); the top of the third supporting plate (174602) is provided with a first mounting block (174608), a guide shaft (174609) vertically penetrating through the first mounting block (174608) is arranged, the bottom end of the guide shaft (174609) extends into the top of the needle seat (174607), and a compression spring (174616) is sleeved on the guide shaft (174609) between the first mounting block (174608) and the needle seat (174607); the side of the third supporting plate (174602) is provided with a second mounting block (174612) with an L-shaped structure, the side of the needle seat (174607) is provided with a third mounting block (174613) with an L-shaped structure, the second mounting block (174612) and the third mounting block (174613) are oppositely arranged to form a 'mouth' -shaped structure, the inner side surface of the second mounting block (174612) is provided with a lower contact, the inner side surface of the third mounting block (174613) is provided with an upper contact, and the upper contacts are positioned above the lower contacts and are in contact with each other; the lower part of the side edge of the second supporting plate (174615) is provided with a fourth mounting block (174610) with an L-shaped structure, and the bottom of the fourth mounting block (174610) is provided with a large screw rod (174611); the large screw (174611) penetrates through the mounting block four (174610), and the large screw (174611) is located below the support plate three (174602).
2. The high precision multi-functional chip mounter according to claim 1, wherein: the structure of the Z-axis driving component (1742) is as follows: the welding head comprises a mounting block five (174201) and a mounting block six (174206) which are fixedly arranged on a welding head mounting base assembly (1741) and are arranged at intervals up and down, a screw rod (174204) is jointly arranged on the mounting block five (174201) and the mounting block six (174206), and a supporting plate five (174205) is arranged on the screw rod (174204) between the mounting block five (174201) and the mounting block six (174206) in a matched mode; the upper end part of the screw rod (174204) extends out of the mounting block five (174201), and the upper end head of the screw rod (174204) is provided with a belt wheel I (174207); the bottom of the mounting block five (174201) is provided with a Z-axis driving motor (174210), the output end of the Z-axis driving motor (174210) extends upwards out of the mounting block five (174201), the end head of the output end of the Z-axis driving motor (174210) is provided with a belt wheel two (174209), and the belt wheel one (174207) is connected with the belt wheel two (174209) through a belt (174208); a third guide rail (174202) is further arranged on the welding head installation base assembly (1741) beside the screw rod (174204), the third guide rail (174202) is parallel to the screw rod (174204), and a third slider (174203) sliding along the third guide rail (174202) is arranged on the third guide rail; one end of a fifth supporting plate (174205) is sleeved on the screw rod (174204), and the other end of the fifth supporting plate (174205) is fixedly arranged with a third sliding block (174203).
3. The high precision multi-functional chip mounter according to claim 1, wherein: the suction nozzle assembly (1744) has the structure that: the device comprises a support plate six (17441) fixedly arranged with a support plate one (1743), wherein a linear and rotary actuator (17442) is fixedly arranged on the side surface of the support plate six (17441), a suction nozzle (17443) is arranged at the output end of the linear and rotary actuator (17442), and the suction nozzle (17443) is connected with an external air source; a height sensor is also arranged at the side of the linear and rotary actuator (17442) beside the suction nozzle (17443); the camera assembly (1745) is structured to: the lens comprises a support plate seven (17452) fixedly arranged with a support plate one (1743), a first zoom lens (17453) is fixedly arranged on the side face of the support plate seven (17452), and a first CCD camera (17451) is arranged at the top of the first zoom lens (17453).
4. The high precision multi-functional chip mounter according to claim 1, wherein: the structure of the multifunctional chip pick-and-place device (16) is as follows: the automatic feeding device comprises a working platform (1), a rail conveying mechanism (12) is arranged across the working platform (1), a tablet feeding mechanism (2) and a tablet discharging mechanism (3) are respectively arranged at two ends of the rail conveying mechanism (12) positioned outside the working platform (1), and a first station and a second station are sequentially arranged on the working platform (1) along the direction of the rail conveying mechanism (12); a recognition device (7) is arranged on the working platform (1) positioned at the interval between the first station and the second station, and a quick-change mechanism (8) is arranged above the recognition device (7);
The first station is structured as follows: the device comprises a chip feeding mechanism (5) fixedly arranged on a working platform (1), wherein a glue dipping disc assembly (4) is arranged between the chip feeding mechanism (5) and a track conveying mechanism (12); the structure of the station II is as follows: comprises a wafer feeding mechanism (9) fixedly arranged on a working platform (1), wherein a wafer ejection mechanism (10) is arranged on the working platform (1) positioned at the bottom of the wafer feeding mechanism (9); and a glue dipping disc assembly (4) which is the same as the first station is arranged between the wafer feeding mechanism (9) and the track conveying mechanism (12).
5. The high-precision multifunctional chip mounter according to claim 4, wherein: the chip feeding mechanism (5) has the structure that: the device comprises a small platform I (51) fixedly arranged on a working platform (1) through support legs, wherein a jig base (52) is arranged on the small platform I (51), a plurality of lower air holes (53) are formed in the jig base (52), the lower air holes (53) are connected with an external air source, and sealing gaskets (54) are arranged on the jig base (52) corresponding to the lower air holes (53); the three side edges of the upper surface of the jig base (52) are provided with baffle strips (55), and a jig (57) is arranged on the jig base (52) positioned on the inner side of the three side baffle strips (55); a magnet (56) is embedded on the jig base (52) positioned at the inner side of the barrier strip (55); the structure of the jig (57) is as follows: the jig comprises a jig bottom plate (571) arranged on a jig base (52), jig handles (572) are arranged at the ends of the jig bottom plate (571), a plurality of acupuncture points for placing chip material boxes (58) are arranged on the jig bottom plate (571), and the acupuncture points are in one-to-one correspondence with the lower air holes (53); an upper air hole (574) communicated with the lower air hole (53) is formed in the jig bottom plate (571) corresponding to the acupuncture point, and a sealing ring (573) is arranged on the jig bottom plate (571) corresponding to the upper air hole (574); a plurality of limiting pins (59) and a clamping mechanism (575) are arranged on the jig bottom plate (571) corresponding to the acupuncture points, the limiting pins (59) are arranged at two adjacent edges of each acupuncture point, and the clamping mechanism (575) is arranged at the opposite angles of the limiting pins (59); the structure of the buckle mechanism (575) is as follows: the fixture comprises a clamping base (5751) fixedly arranged on a fixture bottom plate (571), wherein the clamping base (5751) is of an 'L' -shaped structure, rotating shafts (5752) are arranged on two side walls penetrating through the clamping base (5751), and clamping pieces (5754) of L-shaped structures are rotatably arranged on the rotating shafts (5752) inside the clamping base (5751); screw (5753) are installed through the side wall of the clamping piece (5754), a spring (5755) is sleeved on the screw (5753), and the end part of the spring (5755) is fixedly installed on the bottom plate (571) of the jig.
6. The high-precision multifunctional chip mounter according to claim 4, wherein: the structure of the wafer feeding mechanism (9) is as follows: the feeding device comprises a second small platform (901) fixedly arranged on a working platform (1) through supporting legs, wherein a feeding motor (903) is arranged at the end part of the bottom surface of the second small platform (901) through a motor substrate (902), a first feeding belt wheel (904) is arranged at the output end of the feeding motor (903) through the second small platform (901) and at the end head, a mandrel (907) is rotatably arranged on the motor substrate (902) beside the first feeding belt wheel (904), the mandrel (907) penetrates through the motor substrate (902), a second feeding belt wheel (906) and a third feeding belt wheel (908) are respectively arranged at the two ends of the mandrel (907), and the first feeding belt wheel (904) is connected with the second feeding belt wheel (906) through a small belt (905); a large bearing (912) is arranged on a small platform II (901) beside a motor substrate (902), a ring seat (913) is arranged in the large bearing (912), the ring seat (913) penetrates through the small platform II (901), a large belt wheel (911) is fixedly arranged at the bottom of the ring seat (913), the large belt wheel (911) is connected with a feeding belt wheel III (908) through a large belt (910), and a tensioning wheel (909) is arranged at the bottom of the small platform II (901) outside the large belt (910); the top of the ring seat (913) is provided with a clamping ring (914), the outer edge of the clamping ring (914) extends outwards to form a step for installing a wafer ring, and a baffle (915) is also installed on the clamping ring (914) beside the wafer ring.
7. The high-precision multifunctional chip mounter according to claim 4, wherein: the structure of the crystal ejection mechanism (10) is as follows: the device comprises a bottom supporting seat (1011) fixedly arranged on a working platform (1), wherein a groove is formed in the middle of the bottom supporting seat (1011), first sliding rails (1010) are symmetrically arranged at two ends of the groove, a first sliding block (1012) is arranged on each first sliding rail (1010), a first lead screw (1016) is further arranged at the groove, a first nut (1009) is sleeved on each first lead screw (1016), a sliding plate (1013) is simultaneously arranged at the tops of the first nut (1009) and the first sliding block (1012), a first motor (1008) is further fixed at the outer side of the bottom supporting seat (1011), and the output end of each first motor (1008) is connected with the head of each first lead screw (1016) through a first belt transmission mechanism (1015); the installation direction of the sliding plate (1013) is perpendicular to the bottom supporting seat (1011), a second sliding rail (1014) is fixed on the sliding plate (1013), a second sliding block (1003) is installed on the second sliding rail (1014), a second screw rod (1005) parallel to the second sliding rail is arranged beside the second sliding rail (1014), a second nut (1004) is installed on the second screw rod (1005), a thimble connecting seat (1002) is simultaneously fixed on the second sliding block (1003) and the second nut (1004), and a thimble seat assembly (1001) is installed on the thimble connecting seat (1002); the outer side of the sliding plate (1013) is also fixed with a second motor (1006), and the output end of the second motor (1006) is connected with a second screw rod (1005) through a second belt transmission mechanism (1007).
8. The high-precision multifunctional chip mounter according to claim 4, wherein: the structure of the glue dipping disc assembly (4) is as follows: the device comprises a rubber disc base (41) fixedly arranged on the outer side wall of a rail conveying mechanism (12) and in an L-shaped structure, wherein a rubber disc motor (43) is arranged at the bottom of the rubber disc base (41), the output end of the rubber disc motor (43) upwards penetrates through the rubber disc base (41), and a rubber disc belt wheel I (42) is arranged at the end part of the output end of the rubber disc motor (43); a rubber disc support plate (46) is arranged on the outer side wall of the track conveying mechanism (12) beside the rubber disc base (41), a rubber disc (47) is arranged on the top surface of the rubber disc support plate (46), the rubber disc (47) is rotationally connected with the rubber disc support plate (46) through a rotating shaft in the middle, the rotating shaft penetrates out of the rubber disc support plate (46) downwards, and a rubber disc belt wheel II (45) is arranged at the lower end part of the rotating shaft; the first rubber disc belt wheel (42) is connected with the second rubber disc belt wheel (45) through a rubber disc belt (44); a rubber scraping knife (48) is also arranged on the rubber tray support plate (46) beside the rubber tray (47); one end of the scraping knife (48) is connected with the rubber disc support plate (46) through a small screw rod (49), and the other end of the scraping knife (48) is suspended above the rubber disc (47).
9. The high-precision multifunctional chip mounter according to claim 4, wherein: the structure of the tablet feeding mechanism (2) is the same as that of the tablet discharging mechanism (3), and the specific structure of the tablet feeding mechanism (2) is as follows: including blowing base subassembly (204), fixed mounting has X to motion subassembly (206) on blowing base subassembly (204), and still fixed mounting has Z to motion subassembly (205) on blowing base subassembly (204) of X to motion subassembly (206) side, install magazine fork arm (214) on Z to motion subassembly (205), magazine direction subassembly (202) are installed to the both sides face of Z to motion subassembly (205), install magazine subassembly (201) in magazine direction subassembly (202).
10. The high precision multi-functional chip mounter according to claim 9, wherein: the structure of the material box guiding component (202) is as follows: the device comprises four adjusting plates (208), wherein the four adjusting plates (208) are enclosed into a quadrilateral structure through fasteners, guide plates (207) are vertically arranged on each adjusting plate (208), gear cylinders (209) are arranged at the bottoms of the two guide plates (207), and guide rods are arranged at the output ends of the gear cylinders (209); the end part of one adjusting plate (208) is locked with a connecting locking plate (210); the structure of the Z-direction movement assembly (205) is as follows: the automatic feeding device comprises a frame plate (211), wherein a motor seat (217) is fixed at the bottom of the frame plate (211), a large motor (215) is installed on the motor seat (217), a synchronizing mechanism (216) is installed on an output shaft of the large motor (215), a third screw rod (212) is connected to an output end of the synchronizing mechanism (216), the third screw rod (212) penetrates through the vertical direction of the whole frame plate (211), a connecting seat (213) which moves up and down along the third screw rod (212) is installed on the third screw rod (212), a nut matched with the third screw rod (212) is arranged inside the connecting seat (213), and a material box fork rod (214) is fixed on the outer side surface of the connecting seat (213); the structure of the pushing system (203) is as follows: the novel automatic feeding device comprises a right angle plate (222), wherein a reinforcing plate (223) is arranged on the inner side of the right angle plate (222), a rear plate (234) is fixed on the outer side surface of the right angle plate (222), a small motor (224) is fixed on the back of the rear plate (234), a synchronous wheel (228) is arranged on an output shaft of the small motor (224), a synchronous belt (226) is arranged between the two synchronous wheels (228), a pushing rod (225) is arranged above the synchronous belt (226) in a meshed mode through a connecting block (227), the pushing rod (225) and the connecting block (227) simultaneously walk along with the synchronous belt (226), and a sliding block is further arranged on the inner side of the pushing rod (225) and walks along a guide rail; the structure of the discharging base assembly (204) is as follows: including unloading bottom plate (229), the bottom of unloading bottom plate (229) is supported fixedly through supporting angle bar (233), blowing box (232) are installed to unloading bottom plate (229) upper surface one end, install X on unloading bottom plate (229) inside blowing box (232) to motion subassembly (206), and the concrete structure of X to motion subassembly (206) is: the automatic feeding device comprises a double-shaft air cylinder (221), wherein a piston rod (220) is installed at the output end of the double-shaft air cylinder (221), a locking block (219) is installed at the head of the piston rod (220), and a pushing box fork (218) with a U-shaped structure is fixed on the locking block (219); the upper surface of the discharging box (232) is also provided with a discharging strip (230) and a flange (231).
11. The high-precision multifunctional chip mounter according to claim 4, wherein: the track conveying mechanism (12) has the structure that: adopting a segmented structure, which is respectively a front track assembly (1206), a middle track assembly (1205) and a rear track assembly (1204); the front track assembly (1206) and the rear track assembly (1204) have the same structure and are symmetrically arranged at two ends of the middle track assembly (1205), and a track pushing assembly (1208) is further arranged in the rear track assembly (1204).
12. The high precision multi-functional chip mounter according to claim 11, wherein: the rear track assembly (1204) is structured to: the automatic pressing device comprises a rear rail mounting base (411), wherein a rear rail front side plate (405) is mounted at the rear end of the upper surface of the rear rail mounting base (411), a rear rail rear side plate (406) is mounted at intervals parallel to the rear rail front side plate (405), a rear rail transmission motor (412) is mounted at the front end position of the upper surface of the rear rail mounting base (411) through a transmission motor mounting block (413), a rear rail transmission shaft (414) is mounted at the output end of the rear rail transmission motor (412) through a speed reducer, the rear rail transmission shaft (414) passes through the rear rail rear side plate (406) and the rear rail front side plate (405) at the same time, a plurality of small rollers are mounted on the inner sides of the rear rail rear side plate (406) and the rear rail front side plate (405), a material sheet (19) is mounted on the small rollers in a matched mode on the spaced transmission belt (407), a pressing wheel fixing block (403) is also mounted on the top surface of the rear rail rear side plate (406) and the rear rail front side plate (405), and a pressing wheel (401) is mounted on the pressing wheel fixing block (401); the front end position of the upper surface of the rear track mounting base (411) is also provided with a rear track turntable (410), the rear end connected with the rear track turntable (410) is provided with a large nut, the large nut is sleeved on a rear track screw shaft (409), and the rear track screw shaft (409) passes through a rear track rear side plate (406) and is fixed with a rear track fixing block (408); the rear rail mounting base (411) is symmetrically provided with rear rail sliding rails (417), the rear rail sliding rails (417) are provided with rear rail sliding blocks (416) sliding along the rear rail sliding rails, and the rear rail sliding blocks (416) are locked with rear rail rear side plates (406) through rear rail connecting blocks (415); the track pushing assembly (1208) is of a structure that: the automatic feeding device comprises a base plate (811) fixed through a heightening block (404), wherein standing blocks (801) are symmetrically arranged at two ends of the upper surface of the base plate (811), an upper fixing plate (802) is arranged at the top of each of the two standing blocks (801), a sliding rail (806) is fixed on the upper surface of each of the upper fixing plates (802), sliding blocks are arranged on the sliding rails (806) in a matched mode, a cuboid sliding plate (807) is fixed on each sliding block, a pushing arm mounting plate (804) is fixed at one end of the top of each sliding plate (807), a pushing arm (803) is arranged at the head of each pushing arm mounting plate (804), and one end of each pushing arm (803) is connected with each pushing arm mounting plate (804) through a tension spring (805); the bottom of the base plate (811) is also fixed with a driving motor (812), the output end of the driving motor (812) passes through the base plate (811) and is provided with a driving belt (808) through rollers, the driving belt (808) is provided with an L-shaped plate (809) and a tooth-shaped plate (810) in a relatively meshed manner, and the top of the L-shaped plate (809) is locked with the sliding plate (807); the structure of middle part track subassembly (1205) is: the device comprises middle rail supporting seats (506) arranged at intervals, wherein middle rail working tables (507) are fixed on the upper surfaces of the middle rail supporting seats (506), middle rail front side plates (502) are arranged at the rear end positions of the upper surfaces of the middle rail working tables (507), middle rail rear side plates (511) are arranged at intervals in parallel with the middle rail front side plates (502), and rail jacking components (20) are arranged on the middle rail front side plates (502) and the middle rail rear side plates (511); a middle rail transmission motor (512) is fixed on the middle rail workbench (507), the middle rail transmission motor (512) is provided with a middle rail transmission shaft (513) through a speed reducer, the middle rail transmission shaft (513) simultaneously passes through a middle rail rear side plate (511) and a middle rail front side plate (502), a plurality of small rollers are arranged on the inner sides of the middle rail rear side plate (511) and the middle rail front side plate (502), a conveyor belt is wound on the small rollers, the spaced conveyor belts are matched with the conveyed material sheets (19), and the material sheets (19) are pressed on the two side plates through pressing strips (501); the middle rail workbench (507) is also provided with a middle rail turntable (505), the rear end connected with the middle rail turntable (505) is provided with a large nut, the large nut is sleeved on a middle rail screw shaft (504), and the middle rail screw shaft (504) passes through a middle rail rear side plate (511) and is fixed with a middle rail fixing block (503); a middle rail sliding rail (508) is symmetrically arranged on the middle rail workbench (507), a middle rail sliding block (509) sliding along the middle rail sliding rail (508) is arranged on the middle rail sliding rail (508), and the middle rail sliding block (509) is locked with a middle rail rear side plate (511) through a middle rail connecting block (510); the track liftout subassembly (20) structure is: including second support (2004) that the interval symmetry set up, the inboard top of two second supports (2004) is fixed with liftout cylinder (2002), liftout plate (2003) are fixed to the output of liftout cylinder (2002), and the outside of one of them second support (2004) is fixed with cylinder mounting plate (2006) and sensor mount pad (2008), be fixed with on cylinder mounting plate (2006) and keep off material cylinder (2005), be fixed with photoelectric sensor (2007) on sensor mount pad (2008).
13. A method of using the high precision multifunctional chip mounter according to claim 1, characterized in that: the method comprises the following operation steps:
step one: starting a power supply;
step two: manually placing a magazine assembly (201) filled with non-patch material sheets (19) into a magazine guide assembly (202) of a material sheet feeding mechanism (2); placing the empty cartridge assembly (201) into a cartridge guide assembly (202) of a blanking mechanism (3);
step three: manually placing the chip material boxes (58) on a jig base plate (571) of the jig (57), limiting the single chip material boxes (58) relative to the jig base plate (571) through limiting pins (59) and a clamping mechanism (575), placing the jig (57) on a jig base (52) of a first station through a jig handle (572), and limiting the jig (57) by a baffle strip (55) on the jig base (52);
if the incoming material is a wafer in the wafer ring form, feeding is performed through a station II: manually placing the wafer ring on a clamping ring (914) of a station II, and limiting the wafer ring by the edge of the clamping ring (914) and a baffle plate (915);
step four: clicking a start button on a display screen (15) through a mouse;
Step five: a pushing system (203) pushes the single material sheets (19) from the material box assembly (201) to the track conveying mechanism (12); the track conveying mechanism (12) conveys the material sheet (19) to the first station or the second station, and when the material sheet reaches the corresponding working position, the track ejection assembly (20) ejects the material sheet (19);
step six: the welding head mechanism (1704) starts to work, and the camera assembly (1745) moves to the chip to be pasted on the material sheet (19) on the track conveying mechanism (12) under the drive of the linear movement assembly (1703) to take a picture, so as to confirm the coordinates of the position of the chip to be pasted or the wafer;
step seven: under the drive of the linear motion assembly (1703), the glue dipping assembly (1746) moves to the position right above the glue dipping disc assembly (4), the air cylinder (174601) works, the glue dipping needle head (174614) and the needle head seat (174607) move downwards along the first guide rail (174603) along with the third support plate (174602), so that the glue dipping needle head (174614) stretches into the glue dipping disc (47) to dip glue, and the air cylinder (174601) moves reversely to drive the glue dipping needle head (174614) to move upwards;
step eight: under the drive of the linear motion assembly (1703), the glue dipping assembly (1746) moves to the position right above the material sheet (19) on the track conveying mechanism (12), so that the glue dipping needle head (174614) is positioned on the material sheet (19) at the position where a chip or a wafer is to be pasted, the work of the air cylinder (174601) in the seventh step is repeated, so that the glue dipping needle head (174614) is contacted with the material sheet (19), and glue is applied to the appointed position of the material sheet (19); the glue dipping needle head (174614) is retracted under the action of the air cylinder (174601);
Step nine: under the drive of the linear motion assembly (1703), the camera assembly (1745) moves to the position one or the position two, so that a first CCD camera (17451) in the camera assembly (1745) is positioned right above a chip or a wafer, the chip is amplified and shot through the first CCD camera (17451) and a first zoom lens (17453), and the coordinates of the chip or the wafer are calculated and confirmed through an internal algorithm;
step ten: under the drive of the linear motion assembly (1703), the suction nozzle assembly (1744) moves to the position one or the position two, so that the suction nozzle (17443) is positioned right above the chip or the wafer in the step nine, and the suction nozzle (17443) sucks the chip or the wafer under the action of an external air source;
step eleven: under the drive of the linear motion assembly (1703), the suction nozzle assembly (1744) moves to the track conveying mechanism (12) to enable the suction nozzle (17443) to be positioned right above a chip or a wafer to be pasted on the material sheet (19), an external air source is disconnected, the suction nozzle (17443) puts down the chip or the wafer, and the suction nozzle (17443) applies proper force to the chip or the wafer under the action of the linear rotary actuator (17442) to enable the chip or the wafer to be firmly pasted on the material sheet (19); thus completing the pasting action of the single chip or the wafer;
Step twelve: repeating the steps six to eleven, after the chips or wafers on the material sheets (19) are covered, retracting the track ejection assembly (20), continuously conveying the finished material sheets (19) to a blanking position by the track conveying mechanism (12), and pushing the finished material sheets into the blanking mechanism (3) by the track pushing assembly (1208).
CN201910816381.3A 2019-08-30 2019-08-30 High-precision multifunctional chip loader and use method thereof Active CN110491809B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910816381.3A CN110491809B (en) 2019-08-30 2019-08-30 High-precision multifunctional chip loader and use method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910816381.3A CN110491809B (en) 2019-08-30 2019-08-30 High-precision multifunctional chip loader and use method thereof

Publications (2)

Publication Number Publication Date
CN110491809A CN110491809A (en) 2019-11-22
CN110491809B true CN110491809B (en) 2023-11-28

Family

ID=68555794

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910816381.3A Active CN110491809B (en) 2019-08-30 2019-08-30 High-precision multifunctional chip loader and use method thereof

Country Status (1)

Country Link
CN (1) CN110491809B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112542409B (en) * 2020-12-10 2024-03-12 广州市力驰微电子科技有限公司 Packaging structure for power chip and application method thereof
CN113782473B (en) * 2021-08-03 2023-10-27 恩纳基智能科技无锡有限公司 Mounting structure of double-station flexible welding head mechanism for chip production
CN114364248B (en) * 2022-01-21 2022-09-13 合肥鑫铭电子科技有限公司 Automatic paster equipment of SMT piece formula electronic components
CN114589061B (en) * 2022-03-04 2022-12-16 东莞市耀野自动化有限公司 Die bonder
CN114769776B (en) * 2022-03-09 2023-05-05 恩纳基智能科技无锡有限公司 High-precision mounting equipment with intelligent welding head assembly and use method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709214A (en) * 2012-05-07 2012-10-03 深圳翠涛自动化设备股份有限公司 Multihead rotary chip bonder
CN104882397A (en) * 2015-05-28 2015-09-02 先进光电器材（深圳）有限公司 Dual-welding head automatic load/unload device
KR101573274B1 (en) * 2014-10-10 2015-12-01 에스티에스반도체통신 주식회사 Semiconductor die bonding apparatus and method of bonding stage alignment thereof
CN107305916A (en) * 2016-04-22 2017-10-31 中山市泓昌光电科技有限公司 A kind of CSP encapsulation LED chip mounter and its processing technology
CN107369639A (en) * 2017-07-27 2017-11-21 深圳市新益昌自动化设备有限公司 A kind of line LED bonders
CN109037133A (en) * 2018-08-14 2018-12-18 广州晶睿达科技有限公司 A kind of novel chip positioning device
CN109727889A (en) * 2017-10-30 2019-05-07 财团法人工业技术研究院 The method and chip-packaging structure that chip bonding device, chip engage
CN210403668U (en) * 2019-08-30 2020-04-24 恩纳基智能科技无锡有限公司 High-precision multifunctional chip loader

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100924548B1 (en) * 2007-11-09 2009-11-02 주식회사 하이닉스반도체 Die bonding apparatus
KR102247033B1 (en) * 2014-04-16 2021-05-03 삼성전자주식회사 Die bonding apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709214A (en) * 2012-05-07 2012-10-03 深圳翠涛自动化设备股份有限公司 Multihead rotary chip bonder
KR101573274B1 (en) * 2014-10-10 2015-12-01 에스티에스반도체통신 주식회사 Semiconductor die bonding apparatus and method of bonding stage alignment thereof
CN104882397A (en) * 2015-05-28 2015-09-02 先进光电器材（深圳）有限公司 Dual-welding head automatic load/unload device
CN107305916A (en) * 2016-04-22 2017-10-31 中山市泓昌光电科技有限公司 A kind of CSP encapsulation LED chip mounter and its processing technology
CN107369639A (en) * 2017-07-27 2017-11-21 深圳市新益昌自动化设备有限公司 A kind of line LED bonders
CN109727889A (en) * 2017-10-30 2019-05-07 财团法人工业技术研究院 The method and chip-packaging structure that chip bonding device, chip engage
CN109037133A (en) * 2018-08-14 2018-12-18 广州晶睿达科技有限公司 A kind of novel chip positioning device
CN210403668U (en) * 2019-08-30 2020-04-24 恩纳基智能科技无锡有限公司 High-precision multifunctional chip loader

Also Published As

Publication number Publication date
CN110491809A (en) 2019-11-22

Similar Documents

Publication Publication Date Title
CN110491809B (en) High-precision multifunctional chip loader and use method thereof
CN108526886B (en) Camera automatic assembly machine
WO2023060966A1 (en) Automatic pin inserting apparatus having carrier
CN210403669U (en) Multifunctional chip picking and placing device
CN103496008B (en) A kind of novel stamp lathe of FPC of automatic loading/unloading
CN210403668U (en) High-precision multifunctional chip loader
CN215815812U (en) Full-automatic lens chip dispensing and pasting machine
CN113002150B (en) Full-automatic screen printing machine for wafer
CN214477372U (en) Radiating cover mounting equipment
CN112333998B (en) Surface-mounted electronic component device for PCB
CN114799604A (en) Full-automatic welding equipment
CN112936729A (en) Automatic feeding and discharging module system
CN210881262U (en) Film tearing device
CN113458749A (en) Automatic assembly production line for touch screen
CN111977112A (en) Multi-station automatic labeling equipment
CN219173393U (en) Bulk vibration feeding, detecting and classifying equipment
CN116744561A (en) Automatic laminating and feeding equipment for FPC
CN205961589U (en) Reinforcing machine
CN215830901U (en) Automatic assembly production line for touch screen
CN212099685U (en) Man-machine mixed weaving auxiliary material pasting system
CN212083847U (en) Polaroid pasting device for glass substrate
CN210418661U (en) Sticky patch mounting production line
CN210390433U (en) Screen printing equipment
CN109592156B (en) Bending and mounting equipment and bending method thereof
CN114449881A (en) Assembly method based on PCB surface-mounted electronic component device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: 214037 C1-8, Jinshanbei Science and Technology Industrial Park, Wuxi City, Jiangsu Province

Patentee after: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd.

Country or region after: China

Address before: 214037 3rd Floor, 30-23 Huixi Road, Wuxi City, Jiangsu Province

Patentee before: ENERGY INTELLIGENT TECHNOLOGY WUXI CO.,LTD.

Country or region before: China

CP03 Change of name, title or address