CN104882397A - Dual-welding head automatic load/unload device - Google Patents
Dual-welding head automatic load/unload device Download PDFInfo
- Publication number
- CN104882397A CN104882397A CN201510283807.5A CN201510283807A CN104882397A CN 104882397 A CN104882397 A CN 104882397A CN 201510283807 A CN201510283807 A CN 201510283807A CN 104882397 A CN104882397 A CN 104882397A
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- Prior art keywords
- feeding
- take out
- conveyer belt
- discharging mechanism
- out device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a dual-welding head automatic load/unload device comprising a sharing load mechanism, a sharing remove mechanism, a left in/out mechanism, a right in/out mechanism, a left receiving mechanism and a right receiving mechanism. Two independent in/out and receiving mechanisms are designed; the sharing load mechanism and the sharing remove mechanism are employed; a substrate can be alternatively conveyed to two independent in/out and receiving mechanisms for crystal solidification work, thus greatly improving production efficiency; the dual-welding head automatic load/unload device is compact in structure, reasonable in layout, high in automation level, stable in whole equipment operation, long in life, and easy to maintain.
Description
Technical field
The present invention relates to semiconductor packaging device technical field, is a kind of two soldering tip bonder automatic loading and unloading device specifically.
Background technology
Bonder is the key equipment in LED production line, its die bond process is: glue applying mechanism first puts glue on the die bond station of substrate, then by swing arm (also claiming crystal taking arm), LED grain is taken out from wafer, then transferred to and put on the die bond station of glue.On die bond point in place on entire substrate is all solid crystal grain, substrate just takes out from workbench, and relays the substrate of a slice sky, then starts die bond.
Existing single loading and unloading system, production efficiency is low, cannot meet the large-scale production requirement of enterprise.
Summary of the invention
In order to overcome the defect of above-mentioned prior art, technical problem to be solved by this invention is to provide the high two soldering tip bonder automatic loading and unloading devices of a kind of production efficiency.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is:
A kind of two soldering tip automatic loading and unloading device, comprises shared feed mechanism, shares material fetching mechanism, left feeding-discharging mechanism, right feeding-discharging mechanism, left receiving mechanism and right receiving mechanism;
Described shared feed mechanism comprises material loading platform and upper magazine, described material loading platform is provided with the first conveyer belt, described upper magazine is arranged on the top of the first conveyer belt, and the side of described upper magazine is provided with the material loading arm for the substrate in upper magazine being lifted to feeding height;
Described shared material fetching mechanism comprises guide rail, take out device and driving mechanism, described guide rail be horizontally set on magazine top and perpendicular to the throughput direction of the first conveyer belt, described take out device to be slidably disposed on guide rail and concordant with feeding height, and described driving mechanism drives described take out device along slide;
Described left feeding-discharging mechanism and right feeding-discharging mechanism are separately positioned on the left and right sides of material loading platform, described left receiving mechanism is corresponding with left feeding-discharging mechanism to be arranged, described right receiving mechanism is corresponding with right feeding-discharging mechanism to be arranged, described left feeding-discharging mechanism and right feeding-discharging mechanism comprise input and output material platform respectively, described left receiving mechanism and right receiving mechanism comprise rewinding box respectively, described input and output material platform is provided with the second conveyer belt, one end of described second conveyer belt is connected with the work box device of bonder, the other end of described second conveyer belt connects with the rewinding box of corresponding receiving mechanism.
Wherein, described take out device is vacuum intake head or manipulator.
Wherein, described driving mechanism comprises motor and belt, and described belt is connected with take out device, and described motor passes through belt drives take out device along slide.
Beneficial effect of the present invention is: be different from prior art, the present invention devises two independently input and output material and material-receiving systems, and share a feed mechanism and material fetching mechanism, make substrate Alternating Transportation to two independently can carry out die bond operation in input and output material and material-receiving system, greatly enhance productivity; Compact conformation of the present invention, rationally distributed, automaticity is high, and Whole Equipment is stable, long service life and be easy to safeguard.
Accompanying drawing explanation
Figure 1 shows that the explosive view of two soldering tip automatic loading and unloading devices of embodiment of the present invention.
Figure 2 shows that the structural representation of two soldering tip automatic loading and unloading devices of embodiment of the present invention.
The operating diagram when take out device that Figure 3 shows that embodiment of the present invention is vacuum intake head.
The operating diagram when take out device that Figure 4 shows that embodiment of the present invention is manipulator.
Label declaration:
1-shares feed mechanism; 2-shares material fetching mechanism; The left feeding-discharging mechanism of 3-; The right feeding-discharging mechanism of 4-; The left receiving mechanism of 5-; The right receiving mechanism of 6-; 7-substrate; 10-material loading platform; The upper magazine of 11-; 12-material loading arm; 20-guide rail; 21-take out device; 22-driving mechanism; 30-input and output material platform; 50-rewinding box.
Embodiment
By describing technology contents of the present invention in detail, realized object and effect, accompanying drawing is coordinated to be explained below in conjunction with execution mode.
The design of most critical of the present invention is: design two independently input and output material and material-receiving systems, and share a feed mechanism and material fetching mechanism, make substrate Alternating Transportation to two independently can carry out die bond operation in input and output material and material-receiving system, thus greatly enhance productivity.
Please refer to shown in Fig. 1 to Fig. 4, of the present invention pair of soldering tip automatic loading and unloading device, comprise shared feed mechanism 1, share material fetching mechanism 2, left feeding-discharging mechanism 3, right feeding-discharging mechanism 4, left receiving mechanism 5 and right receiving mechanism 6;
Described shared feed mechanism 1 comprises material loading platform 10 and upper magazine 11, described material loading platform 10 is provided with the first conveyer belt, described upper magazine 11 is arranged on the top of the first conveyer belt, and the side of described upper magazine 11 is provided with the material loading arm 12 for the substrate in upper magazine 11 being lifted to feeding height;
Described shared material fetching mechanism 2 comprises guide rail 20, take out device 21 and driving mechanism 22, described guide rail 20 be horizontally set on magazine 11 top and perpendicular to the throughput direction of the first conveyer belt, described take out device 21 to be slidably disposed on guide rail 20 and concordant with feeding height, and described driving mechanism 22 drives described take out device 21 to slide along guide rail 20;
Described left feeding-discharging mechanism 3 and right feeding-discharging mechanism 4 are separately positioned on the left and right sides of material loading platform 10, described left receiving mechanism 5 is corresponding with left feeding-discharging mechanism 3 to be arranged, described right receiving mechanism 6 is corresponding with right feeding-discharging mechanism 4 to be arranged, described left feeding-discharging mechanism 3 and right feeding-discharging mechanism 4 comprise input and output material platform 30 respectively, described left receiving mechanism 5 and right receiving mechanism 6 comprise rewinding box 50 respectively, described input and output material platform 30 is provided with the second conveyer belt, one end of described second conveyer belt is connected with the work box device of bonder, the other end of described second conveyer belt connects with the rewinding box 50 of corresponding receiving mechanism.
The course of work of the present invention is as follows:
1, be positioned over by substrate on the first conveyer belt of material loading platform 10, substrate is sent in upper magazine 11 by the first conveyer belt, and then the substrate in upper magazine 11 is lifted to feeding height by material loading arm 12;
2, driving mechanism 22 first drive take out device 21 to get substrate along the top that guide rail 20 slides into upper magazine 11 (when take out device 21 is for vacuum intake head, vacuum intake head holds substrate 7, as shown in Figure 3, when take out device 21 is manipulator, manipulator clamping lives substrate 7, as shown in Figure 4), after getting substrate, drive take out device 21 to slide into above the input and output material platform 30 of left feeding-discharging mechanism 3 or above the input and output material platform 30 of right feeding-discharging mechanism 4 along guide rail 20 again and carry out blowing, by the mode of Alternating Transportation, substrate is delivered to left feeding-discharging mechanism 3 or right feeding-discharging mechanism 4, die bond operation is carried out in the work box device that substrate is delivered to bonder by the second conveyer belt then on input and output material platform 30, after die bond completes, substrate is delivered in the rewinding box 50 of corresponding receiving mechanism by the second conveyer belt again, namely the substrate in left feeding-discharging mechanism 3 is delivered in the rewinding box 50 of left receiving mechanism 5, substrate in right feeding-discharging mechanism 4 is delivered in the rewinding box 50 of right receiving mechanism 6.The operating system that left feeding-discharging mechanism 3 and left receiving mechanism 5 form, the operating system formed with right feeding-discharging mechanism 4 and right receiving mechanism 6 is two independently operating systems.
From foregoing description, beneficial effect of the present invention is: be different from prior art, the present invention devises two independently input and output material and material-receiving systems, and share a feed mechanism and material fetching mechanism, make substrate Alternating Transportation to two independently can carry out die bond operation in input and output material and material-receiving system, greatly enhance productivity; Compact conformation of the present invention, rationally distributed, automaticity is high, and Whole Equipment is stable, long service life and be easy to safeguard.
Further, described take out device 21 is vacuum intake head or manipulator.
Further, described driving mechanism 22 comprises motor and belt, and described belt is connected with take out device 21, and described motor is slided along guide rail 20 by belt drives take out device 21.
Please refer to shown in Fig. 1 to Fig. 4, embodiments of the invention one are:
A kind of two soldering tip automatic loading and unloading device, comprises shared feed mechanism 1, shares material fetching mechanism 2, left feeding-discharging mechanism 3, right feeding-discharging mechanism 4, left receiving mechanism 5 and right receiving mechanism 6;
Described shared feed mechanism 1 comprises material loading platform 10 and upper magazine 11, described material loading platform 10 is provided with the first conveyer belt, described upper magazine 11 is arranged on the top of the first conveyer belt, and the side of described upper magazine 11 is provided with the material loading arm 12 for the substrate in upper magazine 11 being lifted to feeding height;
Described shared material fetching mechanism 2 comprises guide rail 20, take out device 21 and driving mechanism 22, described guide rail 20 be horizontally set on magazine 11 top and perpendicular to the throughput direction of the first conveyer belt, described take out device 21 to be slidably disposed on guide rail 20 and concordant with feeding height, and described driving mechanism 22 drives described take out device 21 to slide along guide rail 20;
Described left feeding-discharging mechanism 3 and right feeding-discharging mechanism 4 are separately positioned on the left and right sides of material loading platform 10, described left receiving mechanism 5 is corresponding with left feeding-discharging mechanism 3 to be arranged, described right receiving mechanism 6 is corresponding with right feeding-discharging mechanism 4 to be arranged, described left feeding-discharging mechanism 3 and right feeding-discharging mechanism 4 comprise input and output material platform 30 respectively, described left receiving mechanism 5 and right receiving mechanism 6 comprise rewinding box 50 respectively, described input and output material platform 30 is provided with the second conveyer belt, one end of described second conveyer belt is connected with the work box device of bonder, the other end of described second conveyer belt connects with the rewinding box 50 of corresponding receiving mechanism.
Described take out device 21 is vacuum intake head or manipulator.
Described driving mechanism 22 comprises motor and belt, and described belt is connected with take out device 21, and described motor is slided along guide rail 20 by belt drives take out device 21.
In sum, provided by the invention pair of soldering tip automatic loading and unloading device, can carry out twice die bond operation, production efficiency is high simultaneously, and compact conformation, rationally distributed, automaticity is high, and Whole Equipment is stable, long service life and be easy to safeguard.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalents utilizing specification of the present invention and accompanying drawing content to do, or be directly or indirectly used in relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. a two soldering tip automatic loading and unloading device, is characterized in that: comprise shared feed mechanism, share material fetching mechanism, left feeding-discharging mechanism, right feeding-discharging mechanism, left receiving mechanism and right receiving mechanism;
Described shared feed mechanism comprises material loading platform and upper magazine, described material loading platform is provided with the first conveyer belt, described upper magazine is arranged on the top of the first conveyer belt, and the side of described upper magazine is provided with the material loading arm for the substrate in upper magazine being lifted to feeding height;
Described shared material fetching mechanism comprises guide rail, take out device and driving mechanism, described guide rail be horizontally set on magazine top and perpendicular to the throughput direction of the first conveyer belt, described take out device to be slidably disposed on guide rail and concordant with feeding height, and described driving mechanism drives described take out device along slide;
Described left feeding-discharging mechanism and right feeding-discharging mechanism are separately positioned on the left and right sides of material loading platform, described left receiving mechanism is corresponding with left feeding-discharging mechanism to be arranged, described right receiving mechanism is corresponding with right feeding-discharging mechanism to be arranged, described left feeding-discharging mechanism and right feeding-discharging mechanism comprise input and output material platform respectively, described left receiving mechanism and right receiving mechanism comprise rewinding box respectively, described input and output material platform is provided with the second conveyer belt, one end of described second conveyer belt is connected with the work box device of bonder, the other end of described second conveyer belt connects with the rewinding box of corresponding receiving mechanism.
2. according to claim 1 pair of soldering tip automatic loading and unloading device, is characterized in that: described take out device is vacuum intake head or manipulator.
3. according to claim 1 pair of soldering tip automatic loading and unloading device, it is characterized in that: described driving mechanism comprises motor and belt, described belt is connected with take out device, and described motor passes through belt drives take out device along slide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510283807.5A CN104882397B (en) | 2015-05-28 | 2015-05-28 | A kind of pair of soldering tip automatic loading and unloading device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510283807.5A CN104882397B (en) | 2015-05-28 | 2015-05-28 | A kind of pair of soldering tip automatic loading and unloading device |
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| Publication Number | Publication Date |
|---|---|
| CN104882397A true CN104882397A (en) | 2015-09-02 |
| CN104882397B CN104882397B (en) | 2017-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510283807.5A Active CN104882397B (en) | 2015-05-28 | 2015-05-28 | A kind of pair of soldering tip automatic loading and unloading device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105564966A (en) * | 2015-12-30 | 2016-05-11 | 深圳翠涛自动化设备股份有限公司 | Feeding and discharging system of multi-worktable die bonder |
| CN109545726A (en) * | 2018-11-07 | 2019-03-29 | Tcl王牌电器(惠州)有限公司 | A kind of material traversing taking device and material packing producing line |
| CN109712925A (en) * | 2019-03-06 | 2019-05-03 | 上海赢朔电子科技股份有限公司 | A kind of feeding mechanism of transistor |
| CN110491809A (en) * | 2019-08-30 | 2019-11-22 | 恩纳基智能科技无锡有限公司 | High-accuracy multifunctional loader and its application method |
| CN112224883A (en) * | 2020-10-20 | 2021-01-15 | Tcl华星光电技术有限公司 | Array substrate conveying device |
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| US20030145939A1 (en) * | 2002-02-06 | 2003-08-07 | Ahn Seung Chul | Dual die bonder for a semiconductor device and a method thereof |
| CN101673795A (en) * | 2009-07-20 | 2010-03-17 | 英展有限公司 | Double-row track feeding type specific feeding system for vertical LED lead frame |
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| CN102244141A (en) * | 2011-06-21 | 2011-11-16 | 中国电子科技集团公司第二研究所 | On-line full-automatic silicon wafer loading and unloading machine |
| CN203521465U (en) * | 2013-10-25 | 2014-04-02 | 深圳市新益昌自动化设备有限公司 | Led die bonder |
| CN204614766U (en) * | 2015-05-28 | 2015-09-02 | 先进光电器材（深圳）有限公司 | A kind of two soldering tip automatic loading and unloading device |
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2015
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20030145939A1 (en) * | 2002-02-06 | 2003-08-07 | Ahn Seung Chul | Dual die bonder for a semiconductor device and a method thereof |
| CN101673795A (en) * | 2009-07-20 | 2010-03-17 | 英展有限公司 | Double-row track feeding type specific feeding system for vertical LED lead frame |
| CN102157399A (en) * | 2011-01-27 | 2011-08-17 | 南通富士通微电子股份有限公司 | Automatic charging system of semiconductor packaging equipment |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105564966A (en) * | 2015-12-30 | 2016-05-11 | 深圳翠涛自动化设备股份有限公司 | Feeding and discharging system of multi-worktable die bonder |
| CN105564966B (en) * | 2015-12-30 | 2018-01-16 | 深圳翠涛自动化设备股份有限公司 | A kind of loading and unloading system of more workbench bonders |
| CN109545726A (en) * | 2018-11-07 | 2019-03-29 | Tcl王牌电器(惠州)有限公司 | A kind of material traversing taking device and material packing producing line |
| CN109545726B (en) * | 2018-11-07 | 2021-08-24 | Tcl王牌电器(惠州)有限公司 | Material moving and taking device and material packaging production line |
| CN109712925A (en) * | 2019-03-06 | 2019-05-03 | 上海赢朔电子科技股份有限公司 | A kind of feeding mechanism of transistor |
| CN110491809A (en) * | 2019-08-30 | 2019-11-22 | 恩纳基智能科技无锡有限公司 | High-accuracy multifunctional loader and its application method |
| CN110491809B (en) * | 2019-08-30 | 2023-11-28 | 恩纳基智能科技无锡有限公司 | High-precision multifunctional chip loader and use method thereof |
| CN112224883A (en) * | 2020-10-20 | 2021-01-15 | Tcl华星光电技术有限公司 | Array substrate conveying device |
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|---|---|
| CN104882397B (en) | 2017-08-25 |
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