CN104882397A - 一种双焊头自动上下料装置 - Google Patents

一种双焊头自动上下料装置 Download PDF

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CN104882397A
CN104882397A CN201510283807.5A CN201510283807A CN104882397A CN 104882397 A CN104882397 A CN 104882397A CN 201510283807 A CN201510283807 A CN 201510283807A CN 104882397 A CN104882397 A CN 104882397A
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CN104882397B (zh
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梁国康
梁国城
唐军成
程飞
罗宇
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Advanced Optoelectronic Equipment (shenzhen) Co Ltd
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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Abstract

本发明涉及一种双焊头自动上下料装置,包括共用上料机构、共用取料机构、左进出料机构、右进出料机构、左收料机构和右收料机构。本发明设计了两个独立的进出料和收料系统,并共用一个上料机构与取料机构,使基板可以交替输送至两个独立的进出料和收料系统中进行固晶作业,大大提高生产效率;本发明结构紧凑、布局合理、自动化程度高,设备整体运行稳定,使用寿命长且易于维护。

Description

一种双焊头自动上下料装置
技术领域
[0001] 本发明涉及半导体封装设备技术领域,具体说是一种双焊头固晶机自动上下料装置。
背景技术
[0002]固晶机是LED封装生产线中的关键设备,其固晶过程是:点胶机构先在基板的固晶工位上点胶,然后由摆臂(也称取晶臂)将LED晶粒从晶圆上取出,再将其转移到已点胶的固晶工位上。当整片基板上所在固晶点都把晶粒固上,基板就从工作台上取出,并重新放一片空的基板,再开始固晶。
[0003] 现有的单一上下料系统,生产效率低,无法满足企业的大规模生产要求。
发明内容
[0004] 为了克服上述现有技术的缺陷,本发明所要解决的技术问题是提供一种生产效率高的双焊头固晶机自动上下料装置。
[0005] 为了解决上述技术问题,本发明采用的技术方案为:
[0006] 一种双焊头自动上下料装置,包括共用上料机构、共用取料机构、左进出料机构、右进出料机构、左收料机构和右收料机构;
[0007] 所述共用上料机构包括上料平台和上料盒,所述上料平台上设置有第一输送带,所述上料盒设置在第一输送带的上方,所述上料盒的侧面设置有用于将上料盒内的基板抬升到取料高度的上料臂;
[0008] 所述共用取料机构包括导轨、取料装置和驱动机构,所述导轨水平设置在上料盒的上方且垂直于第一输送带的输送方向,所述取料装置可滑动地设置在导轨上且与取料高度平齐,所述驱动机构驱动所述取料装置沿导轨滑动;
[0009] 所述左进出料机构和右进出料机构分别设置在上料平台的左右两侧,所述左收料机构与左进出料机构对应设置,所述右收料机构与右进出料机构对应设置,所述左进出料机构和右进出料机构分别包括进出料平台,所述左收料机构和右收料机构分别包括收料盒,所述进出料平台上设置有第二输送带,所述第二输送带的一端与固晶机的工作盒装置连接,所述第二输送带的另一端与对应收料机构的收料盒连接。
[0010] 其中,所述取料装置为真空吸料头或机械手。
[0011] 其中,所述驱动机构包括马达和皮带,所述皮带与取料装置连接,所述马达通过皮带驱动取料装置沿导轨滑动。
[0012] 本发明的有益效果在于:区别于现有技术,本发明设计了两个独立的进出料和收料系统,并共用一个上料机构与取料机构,使基板可以交替输送至两个独立的进出料和收料系统中进行固晶作业,大大提高生产效率;本发明结构紧凑、布局合理、自动化程度高,设备整体运行稳定,使用寿命长且易于维护。
附图说明
[0013] 图1所示为本发明实施方式的双焊头自动上下料装置的爆炸图。
[0014] 图2所示为本发明实施方式的双焊头自动上下料装置的结构示意图。
[0015] 图3所示为本发明实施方式的取料装置为真空吸料头时的工作示意图。
[0016] 图4所示为本发明实施方式的取料装置为机械手时的工作示意图。
[0017] 标号说明:
[0018] 1-共用上料机构;2-共用取料机构;3-左进出料机构;4-右进出料机构;5-左收料机构;6-右收料机构;7-基板;10-上料平台;11-上料盒;12-上料臂;20-导轨;21-取料装置;22-驱动机构;30-进出料平台;50-收料盒。
具体实施方式
[0019] 为详细说明本发明的技术内容、所实现目的及效果,以下结合实施方式并配合附图予以说明。
[0020] 本发明最关键的构思在于:设计两个独立的进出料和收料系统,并共用一个上料机构与取料机构,使基板可以交替输送至两个独立的进出料和收料系统中进行固晶作业,从而大大提尚生广效率。
[0021] 请参照图1至图4所示,本发明的双焊头自动上下料装置,包括共用上料机构1、共用取料机构2、左进出料机构3、右进出料机构4、左收料机构5和右收料机构6 ;
[0022] 所述共用上料机构I包括上料平台10和上料盒11,所述上料平台10上设置有第一输送带,所述上料盒11设置在第一输送带的上方,所述上料盒11的侧面设置有用于将上料盒11内的基板抬升到取料高度的上料臂12 ;
[0023] 所述共用取料机构2包括导轨20、取料装置21和驱动机构22,所述导轨20水平设置在上料盒11的上方且垂直于第一输送带的输送方向,所述取料装置21可滑动地设置在导轨20上且与取料高度平齐,所述驱动机构22驱动所述取料装置21沿导轨20滑动;
[0024] 所述左进出料机构3和右进出料机构4分别设置在上料平台10的左右两侧,所述左收料机构5与左进出料机构3对应设置,所述右收料机构6与右进出料机构4对应设置,所述左进出料机构3和右进出料机构4分别包括进出料平台30,所述左收料机构5和右收料机构6分别包括收料盒50,所述进出料平台30上设置有第二输送带,所述第二输送带的一端与固晶机的工作盒装置连接,所述第二输送带的另一端与对应收料机构的收料盒50连接。
[0025] 本发明的工作过程如下:
[0026] 1、将基板放置于上料平台10的第一输送带上,第一输送带将基板传送至上料盒11内,然后上料臂12将上料盒11内的基板抬升到取料高度;
[0027] 2、驱动机构22先驱动取料装置21沿导轨20滑动至上料盒11的上方取基板(当取料装置21为真空吸料头时,真空吸料头吸住基板7,如图3所示;当取料装置21为机械手时,机械手夹持住基板7,如图4所示),取基板完毕后,再驱动取料装置21沿导轨20滑动至左进出料机构3的进出料平台30上方或右进出料机构4的进出料平台30上方进行放料,通过交替输送的方式,将基板输送至左进出料机构3或右进出料机构4,然后进出料平台30上的第二输送带将基板输送至固晶机的工作盒装置内进行固晶作业,固晶完成后,第二输送带再将基板输送至对应收料机构的收料盒50内,即左进出料机构3内的基板输送至左收料机构5的收料盒50内,右进出料机构4内的基板输送至右收料机构6的收料盒50内。左进出料机构3和左收料机构5组成的作业系统,与右进出料机构4和右收料机构6组成的作业系统为两个独立的作业系统。
[0028] 从上述描述可知,本发明的有益效果在于:区别于现有技术,本发明设计了两个独立的进出料和收料系统,并共用一个上料机构与取料机构,使基板可以交替输送至两个独立的进出料和收料系统中进行固晶作业,大大提高生产效率;本发明结构紧凑、布局合理、自动化程度高,设备整体运行稳定,使用寿命长且易于维护。
[0029] 进一步的,所述取料装置21为真空吸料头或机械手。
[0030] 进一步的,所述驱动机构22包括马达和皮带,所述皮带与取料装置21连接,所述马达通过皮带驱动取料装置21沿导轨20滑动。
[0031] 请参照图1至图4所示,本发明的实施例一为:
[0032] 一种双焊头自动上下料装置,包括共用上料机构1、共用取料机构2、左进出料机构3、右进出料机构4、左收料机构5和右收料机构6 ;
[0033] 所述共用上料机构I包括上料平台10和上料盒11,所述上料平台10上设置有第一输送带,所述上料盒11设置在第一输送带的上方,所述上料盒11的侧面设置有用于将上料盒11内的基板抬升到取料高度的上料臂12 ;
[0034] 所述共用取料机构2包括导轨20、取料装置21和驱动机构22,所述导轨20水平设置在上料盒11的上方且垂直于第一输送带的输送方向,所述取料装置21可滑动地设置在导轨20上且与取料高度平齐,所述驱动机构22驱动所述取料装置21沿导轨20滑动;
[0035] 所述左进出料机构3和右进出料机构4分别设置在上料平台10的左右两侧,所述左收料机构5与左进出料机构3对应设置,所述右收料机构6与右进出料机构4对应设置,所述左进出料机构3和右进出料机构4分别包括进出料平台30,所述左收料机构5和右收料机构6分别包括收料盒50,所述进出料平台30上设置有第二输送带,所述第二输送带的一端与固晶机的工作盒装置连接,所述第二输送带的另一端与对应收料机构的收料盒50连接。
[0036] 所述取料装置21为真空吸料头或机械手。
[0037] 所述驱动机构22包括马达和皮带,所述皮带与取料装置21连接,所述马达通过皮带驱动取料装置21沿导轨20滑动。
[0038] 综上所述,本发明提供的双焊头自动上下料装置,可同时进行两次固晶作业,生产效率高,而且结构紧凑、布局合理、自动化程度高,设备整体运行稳定,使用寿命长且易于维护。
[0039] 以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等同变换,或直接或间接运用在相关的技术领域,均同理包括在本发明的专利保护范围内。

Claims (3)

1.一种双焊头自动上下料装置,其特征在于:包括共用上料机构、共用取料机构、左进出料机构、右进出料机构、左收料机构和右收料机构; 所述共用上料机构包括上料平台和上料盒,所述上料平台上设置有第一输送带,所述上料盒设置在第一输送带的上方,所述上料盒的侧面设置有用于将上料盒内的基板抬升到取料高度的上料臂; 所述共用取料机构包括导轨、取料装置和驱动机构,所述导轨水平设置在上料盒的上方且垂直于第一输送带的输送方向,所述取料装置可滑动地设置在导轨上且与取料高度平齐,所述驱动机构驱动所述取料装置沿导轨滑动; 所述左进出料机构和右进出料机构分别设置在上料平台的左右两侧,所述左收料机构与左进出料机构对应设置,所述右收料机构与右进出料机构对应设置,所述左进出料机构和右进出料机构分别包括进出料平台,所述左收料机构和右收料机构分别包括收料盒,所述进出料平台上设置有第二输送带,所述第二输送带的一端与固晶机的工作盒装置连接,所述第二输送带的另一端与对应收料机构的收料盒连接。
2.根据权利要求1所述的双焊头自动上下料装置,其特征在于:所述取料装置为真空吸料头或机械手。
3.根据权利要求1所述的双焊头自动上下料装置,其特征在于:所述驱动机构包括马达和皮带,所述皮带与取料装置连接,所述马达通过皮带驱动取料装置沿导轨滑动。
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CN109545726A (zh) * 2018-11-07 2019-03-29 Tcl王牌电器(惠州)有限公司 一种物料移取装置和物料封装生产线

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