TW201320228A - Multiplication system of flip chip mounters - Google Patents

Multiplication system of flip chip mounters Download PDF

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Publication number
TW201320228A
TW201320228A TW101141508A TW101141508A TW201320228A TW 201320228 A TW201320228 A TW 201320228A TW 101141508 A TW101141508 A TW 101141508A TW 101141508 A TW101141508 A TW 101141508A TW 201320228 A TW201320228 A TW 201320228A
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TW
Taiwan
Prior art keywords
flip chip
chip bonding
rail
bonding machine
wafer
Prior art date
Application number
TW101141508A
Other languages
Chinese (zh)
Other versions
TWI536487B (en
Inventor
Geun-Sik Ahn
Jeong-Ho Cho
Tae-Woo Kang
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020110116500A priority Critical patent/KR101672840B1/en
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of TW201320228A publication Critical patent/TW201320228A/en
Application granted granted Critical
Publication of TWI536487B publication Critical patent/TWI536487B/en

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Abstract

The present invention relates to a multiplication system of flip chip mounters, a plurality of flip chip mounters are managed on a production line, so as to smoothly supply or recover chips and substrates. Said multiplication system of flip chip mounters comprises: a plurality of the first to the nth (n is a natural number larger than 2) flip chip mounters are managed on a production line as a row; a plurality of first chip logistics apparatus having each one to be managed at each side of said flip chip mounters to transport and supply chips to said flip chip mounters toward a first direction; a first reciprocating conveyor is managed at the upper portion of said first chip logistics to transport substrates toward a second direction; and, second reciprocating conveyors to be respectively managed at each of the upper portion of said flip chip mounters to transport substrates toward said second direction.

Description

Flip chip bonding machine multiplication system
The present invention relates to a multiplication system of a flip chip bonding machine capable of smoothly supplying and recycling wafers and substrates by arranging a plurality of flip chip bonding machines on one production line.
The existing flip chip bonding machine works as follows: that is, one of the wafers carrying the plurality of layers of the wafer cassette is taken out, moved to the work area, and the moving wafer is placed on the wafer carrier that can move to the x and y axes. Thereafter, the wafer mold is adsorbed or separated, and then the lower surface of the mold is positioned at the upper portion by rotation, and the mold is moved to the mounting region and mounted on the substrate. For example, Fig. 1 is a schematic view showing a process of performing an installation work in a series of flip chip (may also be a "mold") project.
However, in the step before the process is performed on the flip chip bonding machine, it is necessary to smoothly supply the wafer of the mold and the substrate to be bonded. Also, in the process, it is necessary to effectively utilize the most limited space and to improve production with an optimized system.
The present invention has been made to solve the above problems, and an object thereof is to provide a flip chip bonding machine arranged in a row in order to improve production, which can be improved with the most limited area and an optimal system interface. A multiplication system for the production of flip chip bonding machines.
The problem to be solved by the present invention is not limited to the above problems, and those skilled in the art can clearly understand other problems not mentioned by the following description.
In order to solve the above problems, one aspect of the multiplication system of the flip chip bonding machine of the present invention includes: first to nth (n is a natural number of 2 or more) flip chip bonding machines, which are one column Disposed on the production line; the first wafer streaming device is respectively located on one side of the plurality of sets of flip chip bonding machines, and is transported to the flip chip bonding machine in a first direction; the first reciprocating transport The substrate transports the substrate in a second direction on the upper portion of each of the first wafer transfer devices, and the second shuttle transports the substrate in the second direction on an upper portion of each of the flip chip bonding machines.
Other specific matters of the present invention are included in the detailed description and the drawings.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and methods for achieving the advantages and features of the present invention will become more apparent from the accompanying drawings. However, the present invention is not limited to the following embodiments and can be embodied in other various forms. This embodiment is intended to provide a more complete range of the invention to those skilled in the art to which the invention pertains, and the invention is defined only by the patent application. In the description, the same symbol indicates the phase The same components.
In the absence of other definitions, all terms (including technical and scientific terms) used in the specification are to be interpreted as meanings that are understood by those skilled in the art to which the invention belongs. Terms that are commonly used and that are defined in the dictionary are not abnormal or over-interpreted without explicit deliberate definition.
2 is a plan view of a flip chip multiplication system according to an embodiment of the present invention, and FIG. 3 is a partial plan view showing a wafer transfer in a multiplication system of a flip chip bonding machine according to an embodiment of the present invention. .
First, referring to FIG. 2, a multiplication system of a flip chip bonding machine according to an embodiment of the present invention includes: a multi-array flip chip bonding machine 110, 120, 130, a multi-array first wafer logistics device 310, 320, 330. A plurality of arrays of first reciprocating conveyors 410, 420, 430, and a plurality of arrays of second reciprocating conveyors 210, 220, 230.
Fig. 2 shows an example in which three sets of flip chip bonding machines are arranged in one column, but it is not limited thereto. For example, a list of n sets of flip chip bonding machines can be configured on the production line. At this time, each set of flip chip bonding machine is referred to as a first flip chip bonding machine, a second flip chip bonding machine, ... nth (n is a natural number of 2 or more) flip chip stickers Machine. For convenience of explanation, in the present invention, a case where n is 3 will be described as an example.
Each set of flip chip bonding machines may include a front arch 103 (refer to FIG. 3) and a rear arch 105 (refer to FIG. 3). Front arch 103 and rear The arches 105 are respectively subjected to a fitting work. To this end, it is necessary to supply the substrate 13 and the wafer 11 to the front arch 103 and the rear arch 105 of each set of flip chip bonding machines.
Each set of first wafer streamers 310, 320, 330 supplies wafers to each of the flip chip bonding machines 110, 120, 130, respectively. This will be described in further detail with reference to FIG.
Fig. 3 is a view showing a first flip chip bonding machine 110 and a first wafer stream on the side of the first flip chip bonding machine 110 in the multiplication system of the flip chip bonding machine of Fig. 2. Portions of device 310 and second wafer streamer device 400.
The first wafer streamer device 310 receives the wafer 11 from the second wafer streamer device 400. To this end, a wafer transfer portion (not shown) that is transferred to the first wafer transfer device 310, for example, by the wafer 11 transported by the second wafer transfer device 400, may be further included.
The first wafer transfer device 310 transports the wafer 11 supplied from the second wafer transfer device 400 downward (referred to as the "first direction" based on the drawing of Fig. 3).
The first wafer displacing device 310 carries the wafer 11 downwardly, and is transported to the wafer carrier 111 on the front gantry 103 of the flip chip bonding machine 110 and/or to the wafer carrier 112 located in the rear gantry 105. Wafer 11. To this end, the wafer transfer portion for picking up the wafer 11 transported by the first wafer wagging device 310 and transporting it to the wafer carriers 111, 112 may be disposed on the wafer carrier 111 of the front arch 103 and the rear arch 105, respectively. Near 112 (omitted figure Show).
The wafers supplied to the wafer stages 111, 112 are subjected to flip chip bonding work on the substrate 13. In this regard, as shown in Figure 1, this process can be done in a conventional manner. However, for the sake of understanding, this will be further specifically described below. The module of the Die Flip Turret Head rotates the supply wafer 11 to the wafer carriers 111, 112 in a turntable manner and picks up the wafers one by one. The picked wafer is placed on a die shuttle (Die Shuttlle) at a transfer head and transferred. A shuttle mounting head is a device that can pick up a plurality of wafers at the same time. For example, when six wafers are prepared for the mold shuttle, the bonding head moves to a position where it can be picked up. The bonding head simultaneously picks up 6 wafers and immerses the wafers in the solder after inspection with a vision module, and then mounts the wafers on the substrate.
The wafer 11 used is again transferred to the first wafer streamer by a wafer transfer portion (not shown). That is, the first wafer wadding device 310 receives the wafers 11 that have been used at the wafer carriers 111, 112 of the flip chip bonding machine 110, and transports the wafers 11 in the opposite direction to the first direction, and transfers them to the second wafer. Logistics device 400.
Next, in order to supply and transport the substrate, the first reciprocating conveyors 410, 420, 430 and the second reciprocating conveyors 210, 220, 230 are used. In order to facilitate the description of the components, the first figure in the multiplication system of the flip chip bonding machine of FIG. 2 will be described based on FIG. The wafer bonding machine 110 is located on a portion of the first wafer transfer device 110 and the second wafer transfer device 400 on the first flip chip bonding machine 110 side. The above description is of course applicable to the second flip chip bonding machine, the nth flip chip bonding machine and the first wafer streaming device 320, 330 on one side thereof.
As shown, the first shuttle conveyor 410 is located at an upper portion of each of the first wafer streamers 310. Since FIG. 3 is a plan view, it is not easy to confirm, but the substrate 13 is moved or placed at a higher position than the wafer 11 is transported. Moreover, the transfer of the wafer 11 by the first wafer wagging device 310 and the transfer of the substrate 13 by the first reciprocating conveyor are performed separately from each other. This can be confirmed by the figures 4 to 10.
4 to 10 are plan views for explaining the position of the first reciprocating conveyor of the multiplication system of the flip chip bonding machine according to an embodiment of the present invention.
Based on the third drawing, the first reciprocating conveyor 410 moves the substrate from the left side to the right side (hereinafter referred to as "second direction"). The first reciprocating conveyor may include a front rail 413 that participates in the work performed by the front arch 103 and a rear rail 411 that participates in the work performed by the rear arch 105. The front rail 413 and the rear rail 411 move the substrate in the first direction by the conveyor.
In addition, the second reciprocating conveyor 210 is located at an upper portion of the flip chip bonding machine 110. Moreover, since the first reciprocating conveyor 410 is to receive the substrate 13 from the second reciprocating conveyor 210, the second The position of the duplex conveyor 210 is the same as the height of the first shuttle conveyor 410.
The second shuttle conveyor 210 can include four rails 211, 213, 215, 217. Each of the guide rails is referred to as a first rail 211, a second rail 213, a third rail 215, and a fourth rail 217, respectively. Here, for convenience of explanation, the second reciprocating conveyor includes four guide rails, and if it is possible to include more than four guide rails as needed, it should be considered that the present invention includes an embodiment including four or more guide rails.
Among the four guide rails 211, 213, 215, 217, the first rail 211 and the second rail 213 participate in the work performed in the rear arch, and the third rail 215 and the fourth rail 217 participate in the execution of the front arch jobs.
Further, the guide rails 411, 413 of the first reciprocating conveyor 410 and the guide rails 211, 213, 215, 217 of the second reciprocating conveyor 210 are not connected to each other. As can be seen from FIG. 3, the flip chip bonding machine 110 and the first wafer streamer 310 are spaced apart from each other.
Further, the guide rails 211, 213, 215, and 217 of the second reciprocating conveyor 210 are fixed, and the guide rails 411, 413 of the first reciprocating conveyor 410 are movable in the opposite directions of the first direction and the first direction.
For example, the rear rail 411 of the first reciprocating conveyor 410 can be moved in the opposite direction of the first direction and the first direction to be able to receive the substrates from the first rail 211 and the second rail 213 of the second reciprocating conveyor 210, respectively. 13. Moreover, the front rail 413 of the first reciprocating conveyor 410 can be opposite to the first direction and the first direction. Moving so as to be able to receive the substrate 13 from the third rail 215 and the fourth rail 217 of the second reciprocating conveyor 210, respectively.
Comparing the positions of the rear rail 411 and the front rail 413 in FIG. 2 with the positions of the rear rail 411 and the front rail 413 in FIG. 4, the rear rail 411 and the front rail 413 in FIG. 2 are respectively associated with the first rails 211 and the fourth rails. The guide rails 217 are located on the same line, but in FIG. 4, the rear rails 411 and the front rails 413 are located on the same line as the second rails 213 and the third rails 215, respectively.
That is, the rear rail 411 and the front rail 413 of the first reciprocating conveyor 410 are changed in positions opposite to the first direction or the first direction, and the second reciprocating conveyor from the upper portion of the first flip chip bonding machine 110 The substrate 13 is received by the substrate 210 and then transferred to the second reciprocating conveyor 220 at the upper portion of the second flip chip bonding machine 120.
Further, the rear rail 421 and the front rail 423 of the first reciprocating conveyor 420 disposed on the upper portion of the first wafer hopper 320 on the side of the second flip chip bonding machine 120 are also from the second flip chip bonding machine. The second reciprocating conveyor 220 at the upper portion 120 receives the substrate 13 and is transferred to the second reciprocating conveyor 230 at the upper portion of the third flip chip bonding machine 130.
In the same manner, the rear rail and the front rail of the first reciprocating conveyor disposed on the upper portion of the first wafer streamer on the side of the n-1 flip chip bonding machine are also pasted from the n-1 flip chip The second reciprocating conveyor on the upper portion of the assembly receives the substrate 13 and is transferred to the second reciprocating conveyor on the upper portion of the nth flip chip bonding machine.
Returning to Fig. 3, among the four guide rails 211, 213, 215, and 217 of the second reciprocating conveyor 210, the first rail 211 and the fourth rail 217 are guide rails capable of performing the bonding work.
That is, in the front arch 103 and the rear arch 105 of the flip chip 110, the flip chip bonding operation as described in FIG. 1 and the corresponding description is performed at the positions of the first rail 211 and the fourth rail 217.
As a result, the first rail and the fourth rail of the second reciprocating conveyor located in the upper portion of the first to nth flip chip bonding machines arranged in a line are transferred to the substrate 13 of the first reciprocating conveyor, that is, It is the substrate on which the bonding work has been completed.
The substrate on which the bonding work is completed does not need to be subjected to the bonding work, and should pass through the multiplication system of the flip chip bonding machine of the present invention, which is performed on the second rail and the third rail.
That is, as shown in Fig. 2, the substrate 13 from which the bonding work has been completed from the first rail 211 and the fourth rail 217 is recovered by the rear rail 411 and the front rail 413, respectively. At this time, the rear rail 411 moves in the first direction, and the front rail 413 moves in the opposite direction of the first direction. As shown in FIG. 4, the first rail 413 is transported to the upper portion of the second flip chip bonding machine 120. The position of the two rails 223 and the third rails 225. Thereafter, the rear rail 411 and the front rail 413 transfer the recovered substrate to the second rail 223 and the third rail 225.
Moreover, after the substrate thus transferred passes through the second rail 223 and the third rail 225, it continues to pass through the same production line through the multiplication system of the flip chip bonding machine. In other words, as shown in Figure 4, The rear rail 421 and the front rail 423 disposed on the upper portion of the first wafer arranging device 320 on the side of the second flip chip bonding machine 120 are respectively transferred to the upper portion of the third flip chip bonding machine 130. The second rail 233 and the third rail 235 are then disposed on the upper rail 431 and the front rail 433 of the upper portion of the first wafer arranging device 330 on one side of the third flip chip bonding machine 130, respectively, and are transferred to the outside. .
As described above, the movement of the substrate in which the first flip chip bonding machine has finished the bonding operation has been described. In the present invention, a plurality of (n) rows of the flip chip bonding machine are disposed on the production line, and the bonding operation is also performed on the second to nth flip chip bonding machines. The movement of the substrate to which the second flip chip bonding machine performs the bonding operation will be described below.
The substrate 13 for performing the bonding operation on the second flip chip bonding machine 120 is disposed on the rear rail 411 and the front rail 413 of the upper portion of the first wafer arranging device 310 on the side of the first flip chip bonding machine 110. The substrate received from the second rail 213 and the third rail 215 disposed on the upper portion of the first flip chip bonding machine 110. For this reason, the rear rail 411 and the front rail 413 should be located at the position shown in FIG.
Then, the rear rail 411 and the front rail 413 are respectively moved in opposite directions of the first direction and the first direction to a position as shown in FIG. 6, and then the substrates are respectively transferred to the second flip chip bonding machine 120. The first rail 221 and the fourth rail 227 of the upper second reciprocating conveyor 220.
The first rail 221 and the fourth rail 227 disposed on the upper portion of the second flip chip bonding machine 120 are guide rails that perform flip chip bonding work, and thus the substrate exiting the rail is a substrate on which the bonding work has been completed. Therefore, the bonded working substrate is not subjected to the bonding work in the future and needs to pass through the multiplication system of the flip chip bonding machine of the present invention, which is performed on the second rail and the third rail.
To this end, the rear rail 421 and the front rail 423 disposed on the upper portion of the first wafer displacing device 320 on the side of the second flip chip bonding machine 120 respectively receive the substrate at the position as shown in FIG. 6, and respectively Moving in the opposite direction to the first direction and the first direction becomes the position as shown in Fig. 7. Then, the rear rail 421 and the front rail 423 respectively transport the substrate to the second rail 233 and the third rail 235 disposed on the upper portion of the third flip chip bonding machine 130, and are disposed on the third flip chip bonding machine 130. The rear rail 431 and the front rail 433 of the upper portion of the first wafer wagging device 330 on one side receive the substrate and are respectively transferred to the outside.
As apparent from the above description, the substrate that is moved to perform the bonding operation on the first rail and the fourth rail of the n-th flip chip bonding machine is similar to the case where the bonding operation is performed in the second flip chip bonding machine. The simple description is as follows: the substrate transferred to the n-1 flip chip bonding machine through the second rail and the third rail passes through the first wafer disposed on the side of the n-1 flip chip bonding machine. The upper rail and the front rail of the upper part of the logistics device are transferred to the first rail and the fourth rail of the n-th flip chip bonding machine to perform the bonding work, and then the substrates are Further, the rear rail and the front rail provided on the upper portion of the first wafer transfer device on the side of the nth flip chip bonding machine are respectively transferred to the outside.
Moreover, if the nth flip chip bonding machine is disposed in the last flip chip bonding machine, the substrate that performs the bonding work on the nth flip chip bonding machine does not need to be moved to the second rail or the third rail. It is more efficient to transfer to the outside and to transfer to the outside after moving on the first rail or the fourth rail. To this end, the first reciprocating conveyor disposed at the upper portion of the first wafer arranging device disposed on the side of the nth flip chip of the last flip chip bonding machine does not necessarily include the front rail and the rear rail. It can also be represented by a single track.
Fig. 11 is a schematic view showing the moving direction of the substrate in accordance with the end of the bonding operation of the substrate in the multiplication system of the flip chip bonding machine according to the embodiment of the present invention.
In summary, in the embodiment in which the guide rails are four in total, the first guide rail and the fourth guide rail are guide rails for performing the fitting work, and the second guide rail and the third guide rail are the substrates for performing the transfer work or the completion of the paste. The role of the working substrate. When the number of guide rails exceeds four or more, the number of guide rails that perform the bonding work and the guide rails of the transfer substrate can be determined depending on the situation.
Further, the substrate which has not been subjected to the bonding work does not need to be bonded to the nth flip chip bonding machine, and can be executed in the next n+1 flip chip bonding machine. At this time, the second rail of the second reciprocating conveyor of the upper portion of the nth flip chip bonding machine should be The third rail is transported.
The above content is determined, and the judgment is that the second rail and the third rail of the second reciprocating conveyor that is transferred to the upper portion of the n-th flip-chip bonding machine when the n-th flip-chip bonding machine is performing the bonding work That is, when the nth flip chip bonding machine does not perform the bonding work, it can be transferred to the first rail and the fourth rail of the second reciprocating conveyor on the upper portion of the nth flip chip bonding machine.
The embodiments of the present invention have been described above with reference to the drawings, but it should be understood that those skilled in the art can be embodied in other specific forms without departing from the scope of the invention. Therefore, the embodiments described above are intended to be illustrative only and not to limit the scope of the invention.
11‧‧‧ wafer
13‧‧‧Substrate
110, 120, 130‧‧‧Flip Chip Laminator
210, 220, 230‧‧‧Second reciprocating conveyor
211, 221, 231‧‧‧ first rail
213, 223, 233‧‧‧ second rail
215, 225, 235‧‧‧ third rail
217, 227, 237‧‧‧ fourth rail
310, 320, 330‧‧‧ first wafer logistics device
400‧‧‧Second wafer logistics unit
410, 420, 430‧‧‧ first reciprocating conveyor
411, 421, 431‧‧‧ rear rails
413, 423, 433‧‧‧ front rails
103‧‧‧Front arch
105‧‧‧ Rear arch
108, 109‧‧‧Mold shuttle
112‧‧‧ wafer carrier
Figure 1 shows an overview of the process before the bonding work in a series of flip chip projects.
2 is a flip chip bonding machine according to an embodiment of the present invention The plan of the multiplication system.
Figure 3 is a flip chip bonding in accordance with an embodiment of the present invention. A partial plan view of the machine multiplication system used to illustrate the handling of the wafer.
4 to 10 are views showing flip chip crystals according to an embodiment of the present invention. A plan view of the position of the first reciprocating conveyor of the multiplying system of the sheet laminating machine.
Figure 11 is a flip chip bonding in accordance with an embodiment of the present invention. In the multiplication system of the machine, a schematic view of a direction in which the substrate moves in accordance with the end of the mounting operation of the substrate will be described.
11‧‧‧ wafer
13‧‧‧Substrate
110, 120, 130‧‧‧Flip Chip Laminator
210, 220, 230‧‧‧Second reciprocating conveyor
211, 221‧‧‧ first rail
213, 223‧‧‧Second rail
215, 225‧‧‧ third rail
217, 227‧‧‧ fourth rail
231, 233, 235, 237‧‧
310, 320, 330‧‧‧ first wafer logistics device
400‧‧‧Second wafer logistics unit
410, 420, 430‧‧‧ first reciprocating conveyor
411, 421, 431‧‧‧ rear rails
413, 423, 433‧‧‧ front rails

Claims (12)

  1. A multiplication system for a flip chip bonding machine, comprising: a multi-array flip chip bonding machine arranged in a row on a production line; a first wafer logistics device respectively located on the multi-array flip chip bonding One side of the machine, the wafer is transported in a first direction and supplied to the flip chip bonding machine; the first reciprocating conveyor transports the substrate in a second direction at an upper portion of each of the first wafer streaming devices; The reciprocating conveyor transports the substrate in the second direction on the upper portion of each of the flip chip bonding machines.
  2. The multiplication system of a flip chip bonding machine according to the first aspect of the invention, wherein the gap is arranged to cut a closed circuit of the wafer matching pattern.
  3. The multiplication system of a flip chip bonding machine according to claim 1, wherein the first reciprocating conveyor receives the previous flip-chip from the multi-array flip chip bonding machine. The substrate conveyed by the second reciprocating conveyor on the upper portion of the wafer bonding machine is transferred to the second reciprocating conveyor of the upper portion of the flip chip bonding machine of the front flip chip bonding machine.
  4. A flip chip bonding machine as described in claim 1 A multiplication system, characterized in that the first reciprocating conveyor comprises a front rail and a rear rail.
  5. The multiplication system of a flip chip bonding machine according to claim 4, wherein the front rail and the rear rail are movable in opposite directions of the first direction and the first direction.
  6. The multiplication system of a flip chip bonding machine according to claim 5, wherein the rear rail receives the second reciprocating conveyor from the upper portion of the front flip chip bonding machine a substrate carried by the rail and transported to the second rail of the second reciprocating conveyor of the upper portion of the next set of flip chip bonding machines, or received by the upper portion of the front flip chip bonding machine The substrate carried by the second rail of the second reciprocating conveyor is conveyed to the first rail of the second reciprocating conveyor of the upper portion of the next set of flip chip bonding machines.
  7. The multiplication system of a flip chip bonding machine according to claim 5, wherein the front rail receives the second reciprocating conveyor from the upper portion of the front flip chip bonding machine a substrate carried by the three rails and transported to the fourth rail of the second reciprocating conveyor of the upper portion of the next set of flip chip bonding machines, or Receiving a substrate carried by the fourth rail of the second reciprocating conveyor on the upper portion of the front flip chip bonding machine, and transferring the substrate to the second reciprocating conveyance of the upper portion of the next set of flip chip bonding machines The third rail of the machine.
  8. The multiplication system of a flip chip bonding machine according to claim 2, wherein the first rail and the fourth rail are guide rails for performing a bonding work.
  9. The multiplication system of a flip chip bonding machine according to claim 1, wherein the first wafer streaming device receives the wafer from the flip chip bonding machine, and faces the The wafer is carried in the opposite direction of one direction.
  10. A multiplication system for a flip chip bonding machine according to claim 1, wherein the system further comprises a second wafer streaming device disposed in the first direction, the second wafer streaming device The wafer is transported in a first direction while being supplied to the first wafer streamer or recovered from the first wafer streamer and transported.
  11. The multiplication system of a flip chip bonding machine according to claim 2, wherein the flip chip bonding machine comprises a front arch and a rear arch. The first rail and the second rail participate in the operation of the rear arch, and the third rail and the fourth rail participate in the work of the front arch.
  12. A transfer method of a flip chip bonding machine multiplication system for arranging a plurality of flip chip bonding machines in a row on a production line for supplying and recycling wafers, mounting on a substrate, and Transferring the substrate and transferring the wafer and the substrate in the flip chip bonding machine multiplication system, the method comprising: transporting the wafer in a first direction by a first wafer streaming device located on one side of the flip chip bonding machine And a step of supplying to the flip chip bonding machine; a step of mounting the wafer from the wafer supplied through the flip chip bonding machine and mounting the substrate; and passing the upper portion of the flip chip bonding machine a second reciprocating conveyor carrying the substrate in a second direction and transferring to a first reciprocating conveyor located at an upper portion of the first wafer streaming device; and passing the first reciprocating conveyor toward The substrate is transported in a second direction and transferred to a second reciprocating conveyor located at an upper portion of the next flip chip bonding machine of the flip chip bonding machine.
TW101141508A 2011-11-09 2012-11-08 Multiplication system of flip chip mounters TWI536487B (en)

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TWI501324B (en) * 2013-07-25 2015-09-21 Hanmi Semiconductor Co Ltd Flip chip bonding device
TWI571992B (en) * 2015-06-15 2017-02-21 韓華泰科股份有限公司 Method for revision of bump realization in flip chip
TWI647781B (en) * 2016-09-02 2019-01-11 宰體有限公司 Flip device handler having the same

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CN104276378B (en) * 2013-07-01 2016-08-31 韩华泰科株式会社 Conveyer module
KR102069291B1 (en) 2019-03-14 2020-01-23 (주)올포랜드 System for imaging sea road view

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JP3592924B2 (en) * 1998-03-11 2004-11-24 松下電器産業株式会社 IC chip supply method, supply device, and strip-shaped tape-like support used therein
JP3857949B2 (en) * 2002-04-22 2006-12-13 松下電器産業株式会社 Electronic component mounting equipment
KR100634869B1 (en) * 2005-05-30 2006-10-17 삼성전자주식회사 Apparatus for attaching multi-die
JP4582181B2 (en) * 2008-04-08 2010-11-17 ソニー株式会社 Component mounting apparatus and manufacturing method of mounted products
JP5206654B2 (en) * 2009-12-01 2013-06-12 パナソニック株式会社 Component mounting apparatus and board conveying method in component mounting apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501324B (en) * 2013-07-25 2015-09-21 Hanmi Semiconductor Co Ltd Flip chip bonding device
TWI571992B (en) * 2015-06-15 2017-02-21 韓華泰科股份有限公司 Method for revision of bump realization in flip chip
TWI647781B (en) * 2016-09-02 2019-01-11 宰體有限公司 Flip device handler having the same

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Publication number Publication date
KR20130051254A (en) 2013-05-20
KR101672840B1 (en) 2016-11-08
TWI536487B (en) 2016-06-01
CN103107118B (en) 2016-01-20
CN103107118A (en) 2013-05-15

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