CN112224883A - Array substrate conveying device - Google Patents
Array substrate conveying device Download PDFInfo
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- CN112224883A CN112224883A CN202011123225.8A CN202011123225A CN112224883A CN 112224883 A CN112224883 A CN 112224883A CN 202011123225 A CN202011123225 A CN 202011123225A CN 112224883 A CN112224883 A CN 112224883A
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- array substrate
- processed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the application provides an array substrate conveying device, which arranges a positioning component on the second part of a guide rail by arranging the positioning component, so that an array substrate to be processed slides on the positioning component and is aligned with the array substrate to be processed, then clamping the component to be processed by adopting the clamping component, clamping the array substrate to be processed in a first direction by adopting the first clamping unit and the second clamping unit, clamping the array substrate to be processed in a second direction by adopting the third clamping unit, so that the array substrate to be processed is clamped in the first direction and the second direction, therefore, the array substrate to be processed is prevented from being deviated or moved, and the technical problem that the array substrate is broken due to the deviation of the position of the array substrate when the array substrate is conveyed and rotated by the conventional array substrate conveying device is solved.
Description
Technical Field
The application relates to the technical field of display, in particular to an array substrate conveying device.
Background
In order to achieve flexibility, the flexible array substrate can be selected when the array substrate is adopted by an existing display panel, polyimide is adopted as a substrate, the array substrate is formed on a glass substrate, then the glass substrate is peeled, flexibility is achieved, but due to the fact that large compressive stress exists in the polyimide, the glass substrate is large in warping, when the glass substrate is conveyed and rotated on a machine table, the glass substrate is prone to shifting, and the array substrate is broken.
Therefore, the conventional array substrate conveying device has the technical problem that when the array substrate is conveyed and rotated, the array substrate is deviated in position to break the array substrate.
Disclosure of Invention
The embodiment of the application provides an array substrate conveying device, which is used for solving the technical problem that when the existing array substrate conveying device conveys and rotates an array substrate, the array substrate is deviated in position to cause array substrate fragmentation.
The embodiment of the application provides an array substrate conveyer, this array substrate conveyer includes:
the machine table comprises a base and at least two guide rails arranged on the base, wherein each guide rail comprises a first part attached to the base and a second part exceeding the base;
the positioning component is arranged on the second part of the guide rail and is used for enabling the array substrate to be processed to roll on the positioning component and finish alignment with the array substrate to be processed;
the clamping component, the clamping component includes first clamping unit, second clamping unit and third clamping unit, first clamping unit with the second clamping unit set up in the second part of guide rail, first clamping unit with the second clamping unit is used for the cooperation to carry out the centre gripping of first direction to the array substrate of treating, the third clamping unit is used for carrying out the centre gripping of second direction to the array substrate of treating.
In some embodiments, the positioning member includes a lifting unit, a bearing plate and balls, the bearing plate is disposed on the lifting unit, the ball array is disposed on the bearing plate, and the lifting unit is configured to lift the bearing plate when aligning with the array substrate to be processed, and to lower the bearing plate after the array substrate to be processed is clamped by the clamping member.
In some embodiments, the first clamping unit includes a first terminal disposed on the rail, and the first terminal is fixed to the rail on both sides.
In some embodiments, the second clamping unit includes a second terminal disposed on the guide rail, the second terminal is a movable member, and the second terminal is configured to move toward the first terminal when clamping the array substrate to be processed, and is matched with the first terminal to clamp the array substrate to be processed in a first direction.
In some embodiments, the second terminal is provided with a clamping groove, and the clamping groove is used for clamping the array substrate to be processed.
In some embodiments, a gasket is disposed within the clamping groove, the gasket being disposed around the clamping groove.
In some embodiments, the third clamping unit includes a driving unit, a positioning unit and a third terminal, the third terminal is disposed on the first portion of the guide rail, the third terminal is configured to move to the second portion of the guide rail when clamping the array substrate to be processed, the positioning unit is configured to position a clamping position of the third terminal, and the driving unit is configured to drive the third terminal to move to the clamping position when the array substrate to be processed needs to be clamped.
In some embodiments, the third terminal includes a first set of terminals for moving to a position spaced apart by a length of one-third of the array substrate to be processed from one end of the array substrate to be processed when the array substrate to be processed is held, and a second set of terminals for moving to a position spaced apart by a length of two-thirds of the array substrate to be processed from one end of the array substrate to be processed when the array substrate to be processed is held.
In some embodiments, the drive unit comprises a linear motor.
In some embodiments, the array substrate transfer apparatus further comprises an anti-slip member for preventing the array substrate to be processed from slipping.
Has the advantages that: the embodiment of the application provides an array substrate conveying device, which comprises a machine table, a positioning member and a clamping member, the machine table comprises a base and at least two guide rails arranged on the base, each guide rail comprises a first part attached to the base and a second part exceeding the base, the positioning members are arranged on the second parts of the guide rails, used for rolling the array substrate to be processed on the positioning component and completing the alignment with the array substrate to be processed, the clamping member includes a first clamping unit, a second clamping unit and a third clamping unit, the first clamping unit and the second clamping unit are disposed at a second portion of the guide rail, the first clamping unit and the second clamping unit are used for clamping the array substrate to be processed in a first direction in a matched mode, and the third clamping unit is used for clamping the array substrate to be processed in a second direction; through setting up the locating component, set up the locating component in the second part of guide rail, make pending array substrate slide on the locating component, with pending array substrate counterpoint, then adopt the clamping component to treat and carry out the centre gripping to the component, adopt first clamping unit and second clamping unit to treat the array substrate and carry out the centre gripping of first direction, adopt the third clamping unit to treat the array substrate and carry out the centre gripping of second direction, make pending array substrate all by the centre gripping in first direction and second direction, thereby avoided pending array substrate to appear squinting or removing, thereby when having solved current array substrate conveyer and having existed conveying and rotatory array substrate, array substrate position appears squinting and leads to the technical problem of array substrate fragment.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a first schematic view of an array substrate conveying apparatus according to an embodiment of the present disclosure.
Fig. 2 is a second schematic view of an array substrate conveying apparatus according to an embodiment of the present disclosure.
Fig. 3 is a third schematic view of an array substrate conveying apparatus according to an embodiment of the present disclosure.
Fig. 4 is a fourth schematic view of an array substrate conveying apparatus according to an embodiment of the present disclosure.
Fig. 5 is a fifth schematic view of an array substrate conveying apparatus according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The embodiment of the application aims at the technical problem that when the existing array substrate conveying device conveys and rotates an array substrate, the position of the array substrate deviates to cause array substrate fragment, and the embodiment of the application is used for solving the problem.
As shown in fig. 1 and 2, an embodiment of the present application provides an array substrate conveying apparatus, including:
the apparatus 11 includes a base 111, and at least two guide rails 112 disposed on the base 111, where the guide rails 112 include a first portion 1121 attached to the base 111 and a second portion 1122 extending beyond the base 111;
a positioning member 12 disposed on the second portion 1122 of the guide rail 112, for sliding the array substrate 2 to be processed on the positioning member 12 to complete alignment with the array substrate 2 to be processed;
the clamping member 13, the clamping member 13 includes a first clamping unit 131, a second clamping unit 132 and a third clamping unit 133, the first clamping unit 131 and the second clamping unit 132 are disposed on the second portion 1122 of the guide rail 112, the first clamping unit 131 and the second clamping unit 132 are configured to cooperate to clamp the array substrate 2 to be processed in the first direction 101, and the third clamping unit 133 is configured to clamp the array substrate 2 to be processed in the second direction 102.
The embodiment of the application provides an array substrate conveying device, which comprises a machine table, a positioning member and a clamping member, the machine table comprises a base and at least two guide rails arranged on the base, each guide rail comprises a first part attached to the base and a second part exceeding the base, the positioning members are arranged on the second parts of the guide rails, used for rolling the array substrate to be processed on the positioning component and completing the alignment with the array substrate to be processed, the clamping member includes a first clamping unit, a second clamping unit and a third clamping unit, the first clamping unit and the second clamping unit are disposed at a second portion of the guide rail, the first clamping unit and the second clamping unit are used for clamping the array substrate to be processed in a first direction in a matched mode, and the third clamping unit is used for clamping the array substrate to be processed in a second direction; through setting up the locating component, set up the locating component in the second part of guide rail, make pending array substrate slide on the locating component, with pending array substrate counterpoint, then adopt the clamping component to treat and carry out the centre gripping to the component, adopt first clamping unit and second clamping unit to treat the array substrate and carry out the centre gripping of first direction, adopt the third clamping unit to treat the array substrate and carry out the centre gripping of second direction, make pending array substrate all by the centre gripping in first direction and second direction, thereby avoided pending array substrate to appear squinting or removing, thereby when having solved current array substrate conveyer and having existed conveying and rotatory array substrate, array substrate position appears squinting and leads to the technical problem of array substrate fragment.
It should be noted that, as shown in fig. 1, the first direction in fig. 1 refers to a front-back direction, and the second direction refers to a left-right direction, but the first direction and the second direction may be other directions, so that an included angle is formed between the first direction and the second direction, and the array substrate to be processed may be stably clamped, for example, the included angle in fig. 1 is a right angle, and the array substrate to be processed is clamped from front, back, left, and right, so as to avoid the array substrate to be processed from shifting.
It should be noted that the array substrate to be processed refers to an array substrate that is not finished to be prepared, and includes a substrate located under a substrate of the array substrate, and a film layer located on the substrate.
In one embodiment, as shown in fig. 2, the positioning member 12 includes a lifting unit 121, a bearing plate 122 and balls 123, the bearing plate 122 is disposed on the lifting unit 121, the balls 123 are disposed on the bearing plate 122 in an array, the lifting unit 121 is configured to lift the bearing plate 122 when aligning with the array substrate 2 to be processed, and to lower the bearing plate 122 after the array substrate 2 to be processed is clamped by the clamping member 13, so that when the array substrate to be processed slides on the positioning member and aligns with the array substrate to be processed, the array substrate to be processed can be positioned by the balls matching with the array substrate to be processed, for example, grooves matching with the balls are disposed on the array substrate to be processed, and during the positioning, the balls and the bearing plate can be lifted by using the lifting action of the lifting unit, so that when aligning with the array substrate to be processed, the bearing plate and the balls are lifted, the alignment of the array substrate conveying device and the array substrate to be processed is realized, after the alignment is completed, the balls and the bearing plate are lowered after the array substrate to be processed is clamped by the clamping component, so that the influence of the positioning component on the array substrate to be processed in the subsequent process is avoided, meanwhile, the groove is formed in the array substrate to be processed, when the groove is aligned with the balls, the positioning component also realizes the function of fixing and preventing the deviation, and the deviation is avoided when the array substrate to be processed is transferred to the array substrate conveying device.
In one embodiment, the distance between the adjacent balls is equal to one twentieth to one tenth of the length of the array substrate to be processed, when the density of the balls is set, the distance between the balls can be set according to the length of the array substrate to be processed, the setting density of the balls is not too large, so that the balls and the array substrate to be processed can be accurately positioned, and therefore, the distance between the adjacent balls can be set to be equal to one twentieth to one tenth of the length of the array substrate to be processed.
In an embodiment, the material of the ball includes one of silicon nitride and silicon oxide, when the ball is disposed, in order to enable the array substrate to be processed to slide when alignment is not completed, therefore, when the material of the ball is selected, a material with a smaller friction coefficient may be selected, so that the array substrate to be processed is easier to slide, alignment is completed, and the surface of the ball may be as smooth as possible, so as to reduce the friction between the ball and the array substrate to be processed.
In one embodiment, the first clamping unit comprises first terminals arranged on the guide rails, the first terminals are fixed on the guide rails on two sides, when the first clamping unit is arranged, the first clamping unit can be arranged into a group of first terminals, the group of first terminals are respectively arranged on the guide rails on two sides, and the first terminals are parallel, so that when the array substrate to be processed is transferred to the array substrate conveying device, the array substrate to be processed can be blocked by the first terminals, and then the first terminals cooperate with the second terminals to fix the array substrate to be processed in a first direction, so that the array substrate to be processed is prevented from being shifted in the first direction.
In one embodiment, the second clamping unit includes a second terminal disposed on the guide rail, the second terminal is a movable member, the second terminal is configured to move in a direction of the first terminal when clamping the array substrate to be processed, and clamp the array substrate to be processed in a first direction in cooperation with the first terminal, and when clamping the array substrate to be processed in the first direction in cooperation with the first clamping unit and the second clamping unit, the second clamping unit may be composed of a movable member, for example, a second terminal, and when the array substrate to be processed is located on the array substrate transport device, the array substrate to be processed is blocked by the first terminal, and then the second terminal is moved so that the array substrate to be processed is clamped between the first terminal and the second terminal in the first direction, so that the array substrate to be processed does not move in the first direction, and because the second terminal is a movable component, the second terminal can be correspondingly moved according to the size of the array substrate to be processed, so that the first terminal and the second terminal can clamp the array substrate to be processed with various sizes.
In an embodiment, as shown in fig. 2, a clamping groove 1321 is formed in the second terminal, the clamping groove 1321 is used for clamping the array substrate to be processed, when the array substrate to be processed is clamped by using the first terminal and the second terminal, in order to further improve the clamping stability and prevent the array substrate to be processed from deviating, the clamping groove may be formed in the second terminal, the second terminal moves towards the first terminal, and when the array substrate to be processed is clamped, the clamping groove may clamp the array substrate to be processed, so that one end of the array substrate to be processed is clamped in the clamping groove and cannot move in the vertical direction, and thus the deviation of the array substrate to be processed is further prevented.
In an embodiment, the height of the clamping groove is greater than the thickness of the array substrate to be processed, when the array substrate to be processed is clamped by the clamping groove, regarding the height of the clamping groove, in order to facilitate the clamping groove to clamp the array substrate to be processed, the height of the clamping groove can be greater than the thickness of the array substrate to be processed, and meanwhile, regarding the clamping effect of the clamping groove, the height of the clamping groove is not too large, so that the height of the clamping groove is slightly greater than the thickness of the array substrate to be processed, for example, the difference range between the height of the clamping groove and the thickness of the array substrate to be processed is equal to one twentieth to one tenth of the height of the clamping groove.
In one embodiment, the gasket is arranged in the clamping groove, the gasket is arranged around the clamping groove, the gasket is arranged in the clamping groove, when the array substrate to be processed is clamped by the clamping groove, the gasket can prevent the clamping groove from damaging the array substrate to be processed, so that the array substrate to be processed is prevented from being scratched, and when the gasket is selected, a flexible material can be selected as the material of the gasket.
In one embodiment, the third clamping unit includes a driving unit, a positioning unit and a third terminal, the third terminal is disposed on the first portion of the guide rail, the third terminal is configured to move to the second portion of the guide rail when clamping the array substrate to be processed, the positioning unit is configured to position a clamping position of the third terminal, the driving unit is configured to drive the third terminal to move to the clamping position when the array substrate to be processed needs to be clamped, when clamping the array substrate to be processed in the second direction using the third clamping unit, the array substrate to be processed can be clamped by the third terminal, and the second portion of the guide rail cannot be blocked when the array substrate to be processed is transferred to the array substrate transferring device, so that the third terminal is disposed on the first portion of the guide rail, and when clamping the array substrate needs to be processed, move the third terminal to the second part of guide rail, thereby treat that the array substrate of handling carries out the centre gripping on the second direction, to the removal of third terminal, can pass through the positioning unit location, drive unit driven mode makes the third terminal remove, thereby make the third terminal remove the position of centre gripping array substrate of handling, and owing to adopted the positioning unit, make the position that sets up of third terminal comparatively accurate, when setting up the third terminal, can pass through the positioning unit, set up the third terminal in the centre of treating the array substrate, thereby make the third terminal treat that the array substrate of handling carries out the centre gripping.
In one embodiment, the drive unit comprises a linear motor drive and the positioning unit comprises an optical ruler.
In one embodiment, the third terminal includes a first group of terminals and a second group of terminals, the first group of terminals is used for moving to a position which is away from one end of the array substrate to be processed by a distance of one third of the length of the array substrate to be processed when clamping the array substrate to be processed, the second group of terminals is used for moving to a position which is away from one end of the array substrate to be processed by a distance of two thirds of the length of the array substrate to be processed when clamping the array substrate to be processed, namely when setting the third terminal, two groups of terminals can be set, one group of terminals is set at a position of one third of the length of the array substrate to be processed, the other group of terminals is set at a position of two thirds of the length of the array substrate to be processed, so that the first group of terminals and the second group of terminals of the third terminal are respectively set at a position of one third of the length of the array substrate to be processed, the array substrate to be, and a group of terminals is arranged at the junction of the two adjacent sections, so that the third terminal can stably clamp the array substrate to be processed.
In one embodiment, the third terminal may move in a first direction and a second direction, and when the third terminal clamps the array substrate to be processed, the third terminal may move in the first direction and the second direction, so that the array substrate to be processed may be clamped by the third terminal for array substrates to be processed with different sizes.
In one embodiment, the portions of the third terminals on the two sides of the guide rail are not parallel, that is, when the third terminals are arranged, the terminals on the two sides of the guide rail can be obliquely arranged, so that the array substrate to be processed is prevented from shifting by oblique clamping.
In an embodiment, the material of the third terminal includes one of silicon oxide and silicon nitride, and when the material of the third terminal is selected, the material having a certain hardness is selected as much as possible, so as to prevent the third terminal from being soft and unable to clamp the array substrate to be processed, and meanwhile, the third terminal should have a certain flexibility and be relatively smooth, so as to prevent the array substrate to be processed from being scratched by the third terminal.
In one embodiment, the material of the first terminal includes one of silicon oxide and silicon nitride, and the material of the second terminal includes one of silicon oxide and silicon nitride.
In one embodiment, as shown in fig. 2, the array substrate conveying device further includes an anti-slip member 14, the anti-slip member 14 is used for preventing the array substrate to be processed from slipping, and when the array substrate to be processed is disposed on the array substrate conveying member, in addition to clamping the array substrate to be processed in the first direction and the second direction, the anti-slip member may be disposed under the array substrate to be processed to increase friction, so as to further prevent the array substrate to be processed from slipping.
In this application embodiment, the theory of operation of locating means is through making the lift unit go up and down to drive loading board and ball lift, then make pending array substrate roll on the ball, and simultaneously, the second clamping unit in the clamping means promotes pending array substrate, make pending array substrate move towards first clamping unit with the correct direction, thereby make pending array substrate and ball counterpoint the completion, and simultaneously, first clamping unit and second clamping unit are handled array substrate and are carried out the centre gripping, then, through removing third clamping unit, make third clamping unit treat array substrate and carry out the centre gripping, thereby accomplish the centre gripping of handling array substrate.
In one embodiment, the specific operation of the array substrate transport apparatus is as follows, after the array substrate transport apparatus takes the array substrate to be processed, the positioning member is lifted, for example, as shown in fig. 4, the ball is lifted, and at the same time, the second clamping unit moves towards the direction of the substrate to clamp the array substrate to be processed, and at this time, the third clamping unit is located at the first part of the guide rail, as shown in fig. 3; then the third clamping unit moves to the second part of the guide rail, and the array substrate to be processed is clamped in the second direction, as shown in fig. 1, the first clamping unit, the second clamping unit and the third clamping unit are all located on the second part of the guide rail; then, after the array substrate to be processed is clamped by the third clamping unit, as shown in fig. 1 and 5, the positioning member descends, and the array substrate conveying device can move and rotate, at this time, the array substrate to be processed does not deviate due to clamping of the first clamping unit, the second clamping unit and the third clamping unit, and then when the array substrate to be processed needs to be conveyed to a next process, the third clamping unit is moved to the first part of the guide rail, and the second clamping unit is moved back to the original position, so that the conveying process is completed.
According to the above embodiment:
the embodiment of the application provides an array substrate conveying device, which comprises a machine table, a positioning member and a clamping member, the machine table comprises a base and at least two guide rails arranged on the base, each guide rail comprises a first part attached to the base and a second part exceeding the base, the positioning members are arranged on the second parts of the guide rails, used for rolling the array substrate to be processed on the positioning component and completing the alignment with the array substrate to be processed, the clamping member includes a first clamping unit, a second clamping unit and a third clamping unit, the first clamping unit and the second clamping unit are disposed at a second portion of the guide rail, the first clamping unit and the second clamping unit are used for clamping the array substrate to be processed in a first direction in a matched mode, and the third clamping unit is used for clamping the array substrate to be processed in a second direction; through setting up the locating component, set up the locating component in the second part of guide rail, make pending array substrate slide on the locating component, with pending array substrate counterpoint, then adopt the clamping component to treat and carry out the centre gripping to the component, adopt first clamping unit and second clamping unit to treat the array substrate and carry out the centre gripping of first direction, adopt the third clamping unit to treat the array substrate and carry out the centre gripping of second direction, make pending array substrate all by the centre gripping in first direction and second direction, thereby avoided pending array substrate to appear squinting or removing, thereby when having solved current array substrate conveyer and having existed conveying and rotatory array substrate, array substrate position appears squinting and leads to the technical problem of array substrate fragment.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above detailed description is provided for an array substrate conveying apparatus provided in the embodiments of the present application, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. An array substrate transfer apparatus, comprising:
the machine table comprises a base and at least two guide rails arranged on the base, wherein each guide rail comprises a first part attached to the base and a second part exceeding the base;
the positioning component is arranged on the second part of the guide rail and is used for enabling the array substrate to be processed to roll on the positioning component and finish alignment with the array substrate to be processed;
the clamping component, the clamping component includes first clamping unit, second clamping unit and third clamping unit, first clamping unit with the second clamping unit set up in the second part of guide rail, first clamping unit with the second clamping unit is used for the cooperation to carry out the centre gripping of first direction to the array substrate of treating, the third clamping unit is used for carrying out the centre gripping of second direction to the array substrate of treating.
2. The array substrate transport apparatus of claim 1, wherein the positioning member comprises a lifting unit, a carrier plate disposed on the lifting unit, and balls disposed on the carrier plate, the lifting unit being configured to raise the carrier plate when aligning with the array substrate to be processed and to lower the carrier plate after the array substrate to be processed is held by the holding member.
3. The array substrate conveying apparatus of claim 1, wherein the first clamping unit comprises a first terminal disposed on the guide rail, and the first terminal is fixed to the guide rail on both sides.
4. The array substrate conveying device according to claim 3, wherein the second clamping unit includes a second terminal disposed on the guide rail, the second terminal is a movable member, and the second terminal is configured to move in a direction of the first terminal when clamping the array substrate to be processed, and is configured to perform clamping in a first direction on the array substrate to be processed in cooperation with the first terminal.
5. The array substrate conveying device according to claim 4, wherein the second terminal is provided with a clamping groove for clamping the array substrate to be processed.
6. The array substrate conveying apparatus of claim 5, wherein a gasket is disposed in the clamping groove, and the gasket is disposed around the clamping groove.
7. The array substrate transferring apparatus of claim 1, wherein the third clamping unit comprises a driving unit, a positioning unit and a third terminal, the third terminal is disposed at the first portion of the guide rail, the third terminal is configured to move to the second portion of the guide rail when clamping the array substrate to be processed, the positioning unit is configured to position a clamping position of the third terminal, and the driving unit is configured to drive the third terminal to move to the clamping position when the array substrate to be processed needs to be clamped.
8. The array substrate transfer device of claim 7, wherein the third terminal comprises a first set of terminals for moving to a distance of one-third of the length of the array substrate to be processed from one end of the array substrate to be processed when the array substrate to be processed is held, and a second set of terminals for moving to a distance of two-thirds of the length of the array substrate to be processed from one end of the array substrate to be processed when the array substrate to be processed is held.
9. The array substrate transfer device of claim 7, wherein the driving unit comprises a linear motor.
10. The array substrate transfer device of claim 1, further comprising an anti-slip member for preventing the array substrate to be processed from slipping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011123225.8A CN112224883A (en) | 2020-10-20 | 2020-10-20 | Array substrate conveying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011123225.8A CN112224883A (en) | 2020-10-20 | 2020-10-20 | Array substrate conveying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112224883A true CN112224883A (en) | 2021-01-15 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048826A (en) * | 2012-12-20 | 2013-04-17 | 深圳市华星光电技术有限公司 | Locating device and location method of polarizing plate |
| CN103863814A (en) * | 2014-03-25 | 2014-06-18 | 彭富国 | Automatic feeding and discharging device and method |
| CN104882397A (en) * | 2015-05-28 | 2015-09-02 | 先进光电器材（深圳）有限公司 | Dual-welding head automatic load/unload device |
| CN107601047A (en) * | 2017-09-27 | 2018-01-19 | 徐州嘉恒玻璃制品有限公司 | A kind of glass clamping device |
| CN107826740A (en) * | 2017-11-24 | 2018-03-23 | 苏州索力旺新能源科技有限公司 | A kind of quick-feeding device of extra quality position |
| CN107986009A (en) * | 2017-12-26 | 2018-05-04 | 深圳连硕自动化科技有限公司 | A kind of remover-and-replacer all-in-one machine |
| CN111332795A (en) * | 2020-03-26 | 2020-06-26 | Tcl华星光电技术有限公司 | Substrate conveying mechanism |
| CN111470282A (en) * | 2020-04-24 | 2020-07-31 | 上海世禹精密机械有限公司 | Circuit board backflow conveying system |
-
2020
- 2020-10-20 CN CN202011123225.8A patent/CN112224883A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048826A (en) * | 2012-12-20 | 2013-04-17 | 深圳市华星光电技术有限公司 | Locating device and location method of polarizing plate |
| CN103863814A (en) * | 2014-03-25 | 2014-06-18 | 彭富国 | Automatic feeding and discharging device and method |
| CN104882397A (en) * | 2015-05-28 | 2015-09-02 | 先进光电器材（深圳）有限公司 | Dual-welding head automatic load/unload device |
| CN107601047A (en) * | 2017-09-27 | 2018-01-19 | 徐州嘉恒玻璃制品有限公司 | A kind of glass clamping device |
| CN107826740A (en) * | 2017-11-24 | 2018-03-23 | 苏州索力旺新能源科技有限公司 | A kind of quick-feeding device of extra quality position |
| CN107986009A (en) * | 2017-12-26 | 2018-05-04 | 深圳连硕自动化科技有限公司 | A kind of remover-and-replacer all-in-one machine |
| CN111332795A (en) * | 2020-03-26 | 2020-06-26 | Tcl华星光电技术有限公司 | Substrate conveying mechanism |
| CN111470282A (en) * | 2020-04-24 | 2020-07-31 | 上海世禹精密机械有限公司 | Circuit board backflow conveying system |
Non-Patent Citations (1)
| Title |
|---|
| 陈铭: "《综合自动化系统研究》", 31 October 2019, 黄河水利出版社 * |
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Application publication date: 20210115 |