CN110491813B - Double-sided wafer boat, wafer overturning device and wafer overturning method - Google Patents
Double-sided wafer boat, wafer overturning device and wafer overturning method Download PDFInfo
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- CN110491813B CN110491813B CN201810460718.7A CN201810460718A CN110491813B CN 110491813 B CN110491813 B CN 110491813B CN 201810460718 A CN201810460718 A CN 201810460718A CN 110491813 B CN110491813 B CN 110491813B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a double-sided wafer boat, a wafer overturning device and a wafer overturning method. The double-sided wafer boat comprises a cavity, a first surface and a second surface, wherein the first surface and the second surface are positioned at two opposite ends of the cavity; the cavity is used for accommodating a wafer; the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, and the first positioning structure and the second positioning structure are both used for limiting the position of the double-sided wafer boat in a wafer processing machine table. The invention fundamentally avoids the problem that the wafer is easy to be damaged in the turning process, ensures the yield of the wafer product and also improves the production efficiency of the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a double-sided wafer boat, a wafer overturning device and a wafer overturning method.
Background
In the manufacturing process of semiconductor wafers, the boat is used as a carrier of the wafers and plays an indispensable role in the production of the semiconductor wafers. From wafer production to finished product testing, the wafer boat can not be taken as a carrier. For example, in the diffusion process using a furnace, the wafers are first placed in a wafer boat, and then the wafer boat is placed in the furnace for processing.
On one hand, with the continuous development of semiconductor wafer production technology, not only the front side of the wafer is required to be processed, but also the back side of the wafer is required to be processed, so that the wafer needs to be turned over in the production process of the wafer; on the other hand, in the field of semiconductor manufacturing technology, in particular in the field of Micro-Electro-Mechanical systems (MEMS), it is often necessary to process thin, even ultra-thin wafers (e.g. wafers having a thickness of less than 400 microns). The wafer is very easy to crack or fragment during the process of turning the wafer.
Currently, there are two main ways of turning a wafer: vacuum adsorption mode and mechanical arm clamping mode. However, neither of these two flipping methods is suitable for thin wafer because: the wafer is too thin, and the wafer is easily damaged by vacuum adsorption and clamping of a mechanical arm, so that the yield of final wafer products is influenced. For such a wafer, the current common flipping manner is manual flipping. However, on one hand, manual turning causes contamination and even partial breakage of the wafer at the holding position, and the yield of the wafer is still affected; on the other hand, manual turning is time-consuming and labor-consuming, and the production efficiency of the wafer can be reduced.
Therefore, how to avoid the wafer from being damaged during the turning process and ensure the yield of the wafer product and the production efficiency of the wafer is a technical problem to be solved urgently at present.
Disclosure of Invention
The invention provides a double-sided wafer boat, a wafer overturning device and a wafer overturning method, which are used for solving the problem that wafers are easy to damage in the overturning process in the prior art, so that the yield of wafer products is ensured, and the production efficiency of the wafers is improved.
In order to solve the above problems, the present invention provides a double-sided wafer boat, comprising a cavity, and a first surface and a second surface located at two opposite ends of the cavity; wherein:
the cavity is used for accommodating a wafer;
the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, and the first positioning structure and the second positioning structure are both used for limiting the position of the double-sided wafer boat in a wafer processing machine table.
Preferably, the first positioning structure is a first protrusion or a first groove arranged on the first surface; the second positioning structure is a second protrusion or a second groove arranged on the second surface.
Preferably, the first locating formation is identical to the second locating formation.
Preferably, the cross-sectional shape of the first positioning structure along the direction parallel to the first surface and the cross-sectional shape of the second positioning structure along the direction parallel to the second surface are both H-shaped.
In order to solve the problems, the invention also provides a wafer overturning device which comprises a double-sided wafer boat, a transmission assembly and an overturning assembly;
the double-sided wafer boat comprises a cavity, a first surface and a second surface, wherein the first surface and the second surface are positioned at two opposite ends of the cavity; the cavity is used for accommodating a wafer; the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, and the first positioning structure and the second positioning structure are used for limiting the position of the double-sided wafer boat in a wafer processing machine platform;
the transmission assembly is used for transmitting the wafer between the cavity and the outside;
and the overturning assembly is connected with the double-sided wafer boat and is used for overturning the double-sided wafer boat along the direction vertical to the first surface or the second surface so as to realize the overturning of the wafer.
Preferably, the first positioning structure is a first protrusion or a first groove arranged on the first surface; the second positioning structure is a second protrusion or a second groove arranged on the second surface.
Preferably, the first locating formation is identical to the second locating formation.
Preferably, the cross-sectional shape of the first positioning structure along the direction parallel to the first surface and the cross-sectional shape of the second positioning structure along the direction parallel to the second surface are both H-shaped.
Preferably, the device further comprises an alignment assembly; the alignment assembly comprises an alignment structure matched with the first positioning structure or the second positioning structure and is used for limiting the position of the double-sided boat on the wafer processing machine table.
In order to solve the above problems, the present invention further provides a wafer flipping method, comprising the steps of:
providing a double-sided wafer boat, wherein the double-sided wafer boat comprises a cavity, a first surface and a second surface, and the first surface and the second surface are positioned at two opposite ends of the cavity; the cavity is used for accommodating a wafer; the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, and the first positioning structure and the second positioning structure are used for limiting the position of the double-sided wafer boat in a wafer processing machine platform;
receiving a wafer transmitted from the outside and placing the wafer in the cavity;
and overturning the double-sided wafer boat along a direction vertical to the first surface or the second surface so as to realize the overturning of the wafer.
According to the double-sided boat, the wafer overturning device and the wafer overturning method, the positioning structures are respectively arranged on the two surfaces which are symmetrical about the center of the cavity in the double-sided boat, so that the two opposite surfaces can be used as the bottom surfaces to align the wafer machine, and in the process of overturning the wafer, a worker can overturn the wafer by directly overturning the double-sided boat vertically without carrying out vacuum adsorption or mechanical arm clamping on the wafer to be overturned, so that the problem that the wafer is easy to damage in the overturning process is fundamentally avoided, the yield of a wafer product is ensured, and the production efficiency of the wafer is also improved.
Drawings
FIG. 1 is a schematic structural diagram of a double-sided boat in accordance with an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a wafer flipping device before flipping a wafer according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a double-sided wafer boat receiving wafers to be flipped in an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a double-sided boat after being flipped in an embodiment of the present invention;
fig. 5 is a flow chart illustrating a wafer flipping method according to an embodiment of the invention.
Detailed Description
The following describes in detail embodiments of a double-sided boat, a wafer flipping apparatus and a wafer flipping method according to the present invention with reference to the accompanying drawings.
In the prior art, a wafer boat is used as a wafer carrier, and usually a positioning structure is disposed on only one side (generally, the bottom surface of the wafer boat) of the wafer boat, and a wafer processing machine is provided with an identification structure matched with the positioning structure. The single-sided wafer boat can only be placed in the wafer processing machine with the surface having the positioning structure as the bottom surface. Therefore, when the wafers in the wafer boat are turned over in the prior art, the wafers need to be taken out of the wafer boat and vacuum-sucked, held by a robot arm or manually operated, which is very likely to cause damage to the wafers.
To solve this problem, the present embodiment provides a double-sided boat, and fig. 1 is a schematic structural diagram of a double-sided boat according to an embodiment of the present invention. As shown in fig. 1, the double-sided boat 10 provided in the present embodiment includes a cavity 11, and a first surface 12 and a second surface 13 located at two opposite ends of the cavity 11; wherein: the cavity 11 is used for accommodating a wafer 16; the first surface 12 is provided with a first positioning structure 14, the second surface 13 is provided with a second positioning structure 15, and the first positioning structure 14 and the second positioning structure 15 are both used for defining the position of the double-sided boat 10 in a wafer processing machine. The wafer 16 in the present embodiment may be a wafer with any thickness, and is particularly suitable for a wafer with a thickness of 400 μm or less.
In the present embodiment, by providing the first positioning structure 14 and the second positioning structure 15 on the first surface 12 and the second surface 13 of the double-sided boat 10, respectively, during the use process, the first surface 12 can be used as the bottom surface of the double-sided boat 10, and the first positioning structure 14 can be used to define the position of the double-sided boat 10 in the wafer processing machine; the second surface 13 may also be used as a bottom surface of the double-sided substrate boat 10, and the second positioning structure 15 is used to define the position of the double-sided substrate boat 10 in the wafer processing machine. Thus, when the wafer 16 needs to be vertically turned, the double-sided boat 10 only needs to be turned in a direction perpendicular to the first surface 12 or the second surface 13, so that the wafer 16 in the cavity 11 can be vertically turned, the problem that the wafer is easily damaged in the turning process is avoided, and the yield of the wafer is ensured.
Specifically, the wafers 16 are fixed inside the cavity 11 through a supporting structure, so that the wafers 16 do not slip off during the process of turning over the double-sided boat 10.
The specific shapes of the first positioning structure 14 and the second positioning structure 15 can be set by those skilled in the art according to actual needs, and the present embodiment does not limit this. In order to simplify the manufacturing process of the double-sided boat, preferably, the first positioning structure 14 is a first protrusion or a first groove disposed on the first surface 12; the second positioning structure 15 is a second protrusion or a second groove disposed on the second surface 13.
Since the cross-sectional shape of the mark structure on the single-sided boat in the horizontal direction in the prior art is generally H-shaped, and the mark structure matched with the positioning structure on the single-sided boat is also generally H-shaped, in order to facilitate matching with the existing wafer processing machine, without increasing the wafer production cost, preferably, the first positioning structure 14 is the same as the second positioning structure 15. More preferably, the cross-sectional shape of the first positioning structure 14 along the direction parallel to the first surface 12 and the cross-sectional shape of the second positioning structure 15 along the direction parallel to the second surface 13 are both H-shaped. Therefore, the position of the double-sided wafer boat can be limited by adopting the marking structure in the prior art, and the wafers are ensured to be stably placed in the cavity 11.
In order to solve the above problem, the present embodiment further provides a wafer flipping device, and fig. 2 is a schematic structural diagram of the wafer flipping device before flipping a wafer according to the present embodiment. As shown in fig. 2, the wafer flipping apparatus according to the present embodiment includes a double-sided boat 10, a transport assembly 26, and a flipping assembly 27.
The double-sided wafer boat 10 comprises a cavity 11, and a first surface 12 and a second surface 13 which are positioned at two opposite ends of the cavity 11; the cavity 11 is used for accommodating a wafer 16; the first surface 12 is provided with a first positioning structure 14, the second surface 13 is provided with a second positioning structure 15, and the first positioning structure 14 and the second positioning structure 15 are both used for limiting the position of the double-sided boat 10 in a wafer processing machine platform; the transmission assembly 26 is used for transmitting the wafer 16 between the cavity 11 and the outside; and the overturning component 27 is connected with the double-sided boat 10 and used for overturning the double-sided boat 10 along the direction vertical to the first surface 12 or the second surface 13 so as to realize the overturning of the wafer 16.
The transmission assembly 26 may be a robot.
In order to simplify the manufacturing process of the double-sided boat, preferably, the first positioning structure 14 is a first protrusion or a first groove disposed on the first surface 12; the second positioning structure 15 is a second protrusion or a second groove disposed on the second surface 13.
Since the cross-sectional shape of the mark structure on the single-sided boat in the horizontal direction in the prior art is generally H-shaped, and the mark structure matched with the positioning structure on the single-sided boat is also generally H-shaped, in order to facilitate matching with the existing wafer processing machine, without increasing the wafer production cost, preferably, the first positioning structure 14 is the same as the second positioning structure 15. More preferably, the cross-sectional shape of the first positioning structure 14 along the direction parallel to the first surface 12 and the cross-sectional shape of the second positioning structure 15 along the direction parallel to the second surface 13 are both H-shaped.
Since the first positioning structure 14 and the second positioning structure 15 in the double-sided substrate boat 10 have the same behavior structure as the bottom surface of a single-sided substrate boat in the prior art, the position of the double-sided substrate boat 10 can be defined by using an identification structure matched with the positioning structure in the single-sided substrate boat in the prior art. In order to expand the application range of the wafer flipping apparatus provided in this embodiment and simplify the wafer flipping operation, preferably, the wafer flipping apparatus further includes an alignment assembly 25; the alignment assembly 25 includes an alignment structure 252 that mates with the first positioning structure 14 or the second positioning structure 15 to define the position of the two-sided substrate boat 10 on the wafer processing station. Specifically, if the first positioning structure 14 or the second positioning structure 15 is a convex structure with an H-shaped cross section, the alignment structure 252 is correspondingly a concave structure with an H-shaped cross section; if the first positioning structure 14 or the second positioning structure 15 is a groove structure with an H-shaped cross section, the alignment structure 252 is a corresponding protrusion structure with an H-shaped cross section.
Fig. 3 is a schematic structural diagram of a double-sided boat receiving a wafer to be flipped in an embodiment of the present invention, and fig. 4 is a schematic structural diagram of the double-sided boat flipped in an embodiment of the present invention. To facilitate wafer flipping, the alignment assembly 25 preferably further includes a mark structure 251, and the mark structure 251 is matched with the third positioning structure on the bottom surface of the single-sided boat 20.
For example, as shown in fig. 2, a single-sided boat 20 carrying wafers 16 to be vertically flipped is provided, the single-sided boat 20 includes a bottom surface 22, a receiving cavity 21 and a handle 24, the bottom surface 22 has a third positioning structure 23 thereon, the receiving cavity 21 is used for receiving the wafers 16, and the handle 24 is used for being grasped by a user to move the single-sided boat 20, so as to realize the transfer of the wafers 16. The single-sided wafer boat 20 and the double-sided wafer boat 10 are both disposed in the alignment assembly 25, the third positioning structure 23 of the single-sided wafer boat 20 is engaged with the mark structure 251, and the second positioning structure 15 of the second surface 13 of the double-sided wafer boat 10 is engaged with the alignment structure 252. The transfer assembly 26 transfers the pre-flipped wafer 16 into the chamber 11 with the front side of the wafer 16 facing away from the alignment assembly 25 and the back side facing the alignment assembly 25, as shown in fig. 3. Thereafter, the flip assembly 27 flips the double-sided substrate boat 10 in a direction perpendicular to the first surface 12 or the second surface 13, such that the front surface of the wafer 16 and the first surface 12 face the alignment assembly 25, the back surface of the wafer 16 and the second surface 13 face away from the alignment assembly 25, as shown in fig. 4, thereby vertically flipping the wafer 16. Thereafter, the wafers 16 that have completed the vertical inversion can be transferred into the accommodating cavities 21 of the single-sided boat 20 by the transfer assembly 26, so as to start the processing of the back surfaces of the wafers 16. The front surface of the wafer 16 refers to a surface on which a device structure has been formed, and the back surface of the wafer 16 refers to a surface opposite to the front surface.
In order to solve the above problems, the present embodiment further provides a wafer flipping method, and fig. 5 is a schematic flow chart of the wafer flipping method according to the embodiment of the present invention. As shown in fig. 5, the wafer flipping method provided in this embodiment includes the following steps:
step S51, providing a double-sided wafer boat, wherein the double-sided wafer boat comprises a cavity, a first surface and a second surface, and the first surface and the second surface are positioned at two opposite ends of the cavity; the cavity is used for accommodating a wafer; the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, and the first positioning structure and the second positioning structure are both used for limiting the position of the double-sided wafer boat in a wafer processing machine table. The specific structure of the double-sided boat can be seen in fig. 1.
And step S52, receiving the wafer transmitted from the outside and placing the wafer in the cavity.
Step S53, flipping the double-sided wafer boat in a direction perpendicular to the first surface or the second surface to flip the wafer.
The double-sided boat, the wafer turnover device and the wafer turnover method provided by the embodiment have the advantages that the two surfaces which are symmetrical about the center of the cavity in the double-sided boat are respectively provided with the positioning structures, so that the two opposite surfaces can be used as the bottom surfaces to align the wafer machine, and therefore, in the process of turning over the wafer, a worker does not need to carry out vacuum adsorption or mechanical arm clamping on the wafer to be turned over, but directly turns over the double-sided boat vertically to turn over the wafer, the problem that the wafer is easy to damage in the turning over process is fundamentally avoided, the yield of wafer products is ensured, and the production efficiency of the wafer is also improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A double-sided boat is characterized by comprising a cavity, a first surface and a second surface, wherein the first surface and the second surface are positioned at two opposite ends of the cavity and are symmetrical relative to the cavity; wherein:
the cavity is used for accommodating a wafer, so that the front surface of the wafer faces to the first surface, the back surface of the wafer faces to the second surface, and the back surface is opposite to the front surface;
the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, the first positioning structure and the second positioning structure are both used for limiting the position of the double-sided boat in a wafer processing machine, and the first positioning structure and the second positioning structure are the same, so that the first surface and the second surface can be used as the bottom surface of the double-sided boat to align the same alignment structure of the double-sided boat and the wafer processing machine;
and the double-sided boat is overturned along the direction vertical to the first surface or the second surface so as to vertically overturn the wafers in the cavity.
2. The double-sided boat of claim 1, wherein the first positioning structure is a first protrusion or a first groove disposed on the first surface; the second positioning structure is a second protrusion or a second groove arranged on the second surface.
3. The double-sided substrate boat of claim 1, wherein the first positioning structures and the second positioning structures are H-shaped in cross-section parallel to the first surface and the second surface.
4. A wafer turnover device is characterized by comprising a double-sided wafer boat, a transmission assembly and a turnover assembly; the double-sided wafer boat comprises a cavity, a first surface and a second surface, wherein the first surface and the second surface are positioned at two opposite ends of the cavity and are symmetrical relative to the cavity; the cavity is used for accommodating a wafer, so that the front surface of the wafer faces to the first surface, the back surface of the wafer faces to the second surface, and the back surface is opposite to the front surface; the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, the first positioning structure and the second positioning structure are both used for limiting the position of the double-sided boat in a wafer processing machine, and the first positioning structure and the second positioning structure are the same, so that the first surface and the second surface can be used as the bottom surface of the double-sided boat to align the same alignment structure of the double-sided boat and the wafer processing machine;
the transmission assembly is used for transmitting the wafer between the cavity and the outside;
and the overturning assembly is connected with the double-sided wafer boat and is used for overturning the double-sided wafer boat along the direction vertical to the first surface or the second surface so as to realize the vertical overturning of the wafer.
5. The wafer turnover device of claim 4, wherein the first positioning structure is a first protrusion or a first groove disposed on the first surface; the second positioning structure is a second protrusion or a second groove arranged on the second surface.
6. The wafer flipping device of claim 4, wherein a cross-sectional shape of the first positioning structure along a direction parallel to the first surface and a cross-sectional shape of the second positioning structure along a direction parallel to the second surface are both H-shaped.
7. The wafer flipping apparatus of claim 4, further comprising an alignment assembly; the alignment assembly comprises an alignment structure matched with the first positioning structure or the second positioning structure and is used for limiting the position of the double-sided boat on the wafer processing machine table.
8. A wafer overturning method is characterized by comprising the following steps:
providing a double-sided wafer boat, wherein the double-sided wafer boat comprises a cavity, a first surface and a second surface, the first surface and the second surface are positioned at two opposite ends of the cavity and are symmetrical relative to the cavity; the cavity is used for accommodating a wafer, so that the front surface of the wafer faces to the first surface, the back surface of the wafer faces to the second surface, and the back surface is opposite to the front surface; the first surface is provided with a first positioning structure, the second surface is provided with a second positioning structure, the first positioning structure and the second positioning structure are both used for limiting the position of the double-sided boat in a wafer processing machine, and the first positioning structure and the second positioning structure are the same, so that the first surface and the second surface can be used as the bottom surface of the double-sided boat to align the same alignment structure of the double-sided boat and the wafer processing machine;
receiving a wafer transmitted from the outside and placing the wafer in the cavity;
and overturning the double-sided boat along a direction vertical to the first surface or the second surface so as to realize vertical overturning of the wafer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810460718.7A CN110491813B (en) | 2018-05-15 | 2018-05-15 | Double-sided wafer boat, wafer overturning device and wafer overturning method |
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| CN201810460718.7A CN110491813B (en) | 2018-05-15 | 2018-05-15 | Double-sided wafer boat, wafer overturning device and wafer overturning method |
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| CN112928050A (en) * | 2019-12-06 | 2021-06-08 | 上海新微技术研发中心有限公司 | Wafer transfer apparatus and wafer transfer method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164689A (en) * | 1998-11-27 | 2000-06-16 | Dainippon Screen Mfg Co Ltd | Substrate-holding jig and substrate-processing device |
| CN202796889U (en) * | 2012-10-11 | 2013-03-13 | 中芯国际集成电路制造(北京)有限公司 | Turnable wafer boat |
| CN104465461A (en) * | 2014-11-26 | 2015-03-25 | 上海华力微电子有限公司 | Wafer overturning device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060075917A (en) * | 2004-12-29 | 2006-07-04 | 동부일렉트로닉스 주식회사 | Wafer cassette guide and the wafer stage with the same |
| CN204144231U (en) * | 2014-10-29 | 2015-02-04 | 中芯国际集成电路制造(北京)有限公司 | Brilliant boat |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164689A (en) * | 1998-11-27 | 2000-06-16 | Dainippon Screen Mfg Co Ltd | Substrate-holding jig and substrate-processing device |
| CN202796889U (en) * | 2012-10-11 | 2013-03-13 | 中芯国际集成电路制造(北京)有限公司 | Turnable wafer boat |
| CN104465461A (en) * | 2014-11-26 | 2015-03-25 | 上海华力微电子有限公司 | Wafer overturning device |
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