KR100582848B1 - Device for Cutting of nonmetal - Google Patents

Abstract

The present invention relates to a cutting device of a non-metal material such as glass, in particular, to improve the overall layout of the device for cutting the substrate in panel units can be carried out faster with a minimum of equipment and a minimum layout area The present invention relates to a new type of non-metal cutting device.

To this end, the present invention, the main cutting portion for cutting the loaded substrate in a plurality of panel units while moving in the horizontal and vertical direction of the substrate; A pair of cutting stages on which a cutting process is performed while the substrate is mounted, and alternately moved toward a position where the cutting process is performed by the main cutting unit and a carrying out process position of the cut substrate; And, it provides a non-metal cutting device, characterized in that it comprises a stage transfer unit: is operated to move each cutting stage to each process position.

Non-Metal Cutting Machines, Cutting Stages, Clamps, Lifters

Description

Device for Cutting of Nonmetal

1 is a plan view schematically showing the configuration of a conventional non-metal cutting device

Figure 2a is a plan view schematically showing the configuration of a non-metal material cutting apparatus according to the present invention

Figure 2b is a side view schematically showing the configuration of a non-metal material cutting apparatus according to the present invention

Figure 3 is a schematic side view showing a state in which the second stage is moved downward during the alternating process between the cutting stages of the non-metallic cutting device according to the present invention

Figure 4a is a plan view showing a state in which the first stage is transported to the unloading position during the alternating process between the cutting stages of the non-metallic cutting device according to the invention

Figure 4b is a side view showing a state in which the first stage is transported to the unloading position during the alternating process between the cutting stages of the non-metallic cutting device according to the present invention

Figure 5 is a side view showing the moved state of each cutting stage by the lifting unit during the alternating process between each cutting stage of the non-metallic cutting device according to the invention

6 is a plan view illustrating a state in which a second stage is clamped to a clamp during an alternate process between cutting stages of a non-metal cutting apparatus according to the present invention;

FIG. 7 is a side view illustrating a process in which a second stage is transferred to a position for a cutting process during an alternate process between cutting stages of a non-metallic cutting device according to the present invention; FIG.

Figure 8 is a side view showing a state in which the first stage is raised to the position for the pick-up process during the alternating process between the cutting stages of the non-metallic cutting device according to the invention

Explanation of symbols for the main parts of the drawings

100. Main cutting unit 110. Laser cutting unit

120. Moving unit 121. First linear guide

122. 2nd linear guide 123. Linear motor

130. Alignment section 210,220. Cutting stage

310. First Transfer Unit 311. Clamp

312.Guide rails 313. First drive unit

320. Second conveying unit 321. First lifter

322. Second lift 323. Second drive unit

510. Pickup unit 520. Dummy removal unit

The present invention relates to an apparatus for cutting a substrate used in a display device, such as a liquid crystal display device, and in particular, to minimize the process for cutting the substrate to allow faster progress of the work and for cutting the substrate The present invention relates to a new type of non-metal cutting device capable of reducing the layout.

In general, in the process of manufacturing flat panel display devices such as liquid crystal display devices (LCDs), a non-metallic cutting device cuts a single bonded substrate on which a pattern is formed in each panel unit to fit a product size. To do the job.

1 of the accompanying drawings shows a conventional basic layout for performing such a substrate cutting operation.

That is, the conventional layout for cutting a substrate is largely aligned with the alignment unit 10, the first loading unit 20, the first cutting unit 30, the first unloading unit 40, and the rotating unit 50. And a second loading part 60, a second cutting part 70, and a second unloading part 80.

Here, the alignment unit 10 is configured to serve to align the position of the loaded substrate.

In addition, the first loading part 20 is configured to carry the role of conveying the substrate on which the alignment is completed to the first cutting part 30.

In addition, the first cutting unit 30 is configured to primarily cut the substrate carried by the first loading unit 20, and although not shown, a rotary cutter for cutting the substrate or the wafer. And a cutting stage on which the substrate is seated.

In addition, the first unloading part 40 is configured to carry out the first cut-out substrate from the first cutting part 30 and to convey it to the rotating part 50.

In addition, the rotating unit 50 is configured to perform the role of inverting the primarily cut substrate by 90 °.

In addition, the second loading unit 60 is configured to carry the substrate inverted by the rotating unit 50 and to convey the second substrate 70 to the second cutting unit 70.

In addition, the second cutting unit 70 is configured to perform secondary cutting of the substrate carried by the second loading unit 60, and although not illustrated, the second cutting unit 70 may have the same substrate as the first cutting unit 30 described above. Or it comprises the rotary cutter which cuts a wafer etc., and the cutting stage in which a board | substrate is mounted.

The second unloading unit 80 is configured to transfer the cut substrate to the tester.

Therefore, when the bonding substrate, in which the bonding between the thin film transistor substrate TFT substrate and the color filter substrate C / F substrate is completed, is loaded, the alignment is performed by the alignment unit 10, and the substrate on which the alignment is performed is performed. It is conveyed to the said 1st cutting part 30 by the 1st loading part 20. FIG.

In this state, the substrate is primarily cut along the transverse direction (loaded direction) by the operation of the first cutting unit 30.

Subsequently, the first cut substrate is conveyed to the rotating part 50 by the first unloading part 40 to rotate 90 °, and the rotated substrate is transferred to the second loading part 60. Thereby, the secondary cutting is performed along the direction perpendicular to the direction in which it is conveyed to the second cutting portion 70 and cut first.

As a result, the substrate is separated into a plurality of unit panels, and the dummy part is removed, and the substrate is removed from the second cutout 70 by the second unloading part 80 to the inspector 90. Delivered.

In this case, the tester 90 performs a test according to the operation of the liquid crystal display device separated into the unit panel.

However, in the conventional layout for cutting a substrate having the above-described series of configurations, since the operation for cutting the substrate into the unit panel is performed at the first cutting portion 30 and the second cutting portion 70, the substrate for the cutting is performed. The problem was that it took a long time to return the.

In addition, as the work for cutting the substrate into the unit panel is sequentially performed by a plurality of equipment, the overall layout area is inevitably large.

In addition, there is a problem that the overall manufacturing cost increases due to the large number of various devices constituting the layout.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned various problems, and an object of the present invention is to improve the overall layout of an apparatus for cutting a substrate in units of panels, thereby having a minimum of equipment and a minimum layout area. It is to provide a new type of non-metal cutting device for the progress of the work.

In order to achieve the above object, the present invention includes a main cutting unit for cutting the loaded substrate into a plurality of panel units while moving in the horizontal and vertical direction of the substrate; A pair of cutting stages on which a cutting process is performed while the substrate is mounted, and alternately moved toward a position where the cutting process is performed by the main cutting unit and a carrying out process position of the cut substrate; And, it provides a non-metal cutting device, characterized in that it comprises a stage transfer unit: is operated to move each cutting stage to each process position.

Hereinafter, a preferred embodiment of the non-metallic material cutting device according to the present invention will be described in more detail with reference to FIGS. 2A to 8.

First, FIGS. 2A and 2B are conceptual views schematically showing a layout of a non-metal cutting apparatus according to an embodiment of the present invention.

That is, the layout of the non-metal cutting apparatus according to the embodiment of the present invention is largely the main cutting unit 100, a pair of cutting stages (210, 220), the stage transfer unit, the loading unit 410 and the unloading unit ( 420).

At this time, the loading unit 410 and the unloading unit 420 is an apparatus for loading and unloading the substrate 1 to be cut, and is composed of a loader having a general robot arm. It is set as an Example.

In addition, the main cutting part 100 constituting the non-metal material cutting device of the present invention is a plurality of the substrate 1 loaded by the loading unit 410 while moving along the horizontal and vertical direction of the substrate 1 It is configured to cut in units of panels 1a.

The main cutting unit 100 is a laser cutting unit 110 made to enable cutting of the substrate using a laser (laser), and to move the laser cutting unit 110 in the horizontal and vertical direction of the substrate It comprises a mobile unit 120.

In this case, the mobile unit 120 includes a first linear guide 121, a second linear guide 122, a first linear motor 123, and a second linear motor 124. Yes.

The first linear guide 121 is installed to guide the movement of the laser cutting unit 110 along the horizontal direction of the cutting stages 210 and 220.

The second linear guide 122 is installed to guide the movement of the laser cutting unit 110 along the longitudinal direction of the cutting stages 210 and 220.

The first linear motor 123 is installed to move the laser cutting unit 110 along the first linear guide 121 by driving the first linear motor 123.

The second linear motor 124 is installed to move the laser cutting unit 110 along the second linear guide 122 by driving the second linear motor 124.

Of course, the configuration of the mobile unit 120 may be applied to various other configurations that can move the laser cutting unit 110 along the horizontal or vertical direction of the cutting stage (210, 220).

In addition, the structure for cutting the substrate 1 in units of each panel 1a may also be configured not only as the laser cutting unit 110 but also as a rotary cutter used for cutting various substrates or wafers, although not illustrated.

In addition, the process position for cutting the substrate 1, for example, the main cut part 100 may be further provided with an alignment part 130 for aligning the substrate placed on the cutting stages 210 and 220 at the corresponding position.

In this case, although the alignment unit 130 is not shown in detail, the alignment unit 130 may be configured to push the long sides and short sides of the substrate 1 mounted on the cutting stages 210 and 220 so that alignment for cutting may be performed. The two diagonal edges of the substrate 1 may be pushed to form various alignments such that alignment may be performed for cutting.

In addition, the pair of cutting stages 210 and 220 constituting the non-metal cutting device of the present invention is a cutting process is carried out with the substrate 1 is placed, the cutting process is performed by the main cutting unit 100 It is comprised so that a movement to the process position and the carrying out process position of the cut | disconnected board | substrate 1 alternately is possible.

Each of the cutting stages 210 and 220 is formed in the same manner as the shape of a general cutting stage on which the substrate 1 is seated for cutting a conventional substrate.

In addition, the stage transfer unit constituting the non-metal material cutting device of the present invention is configured to move the respective cutting stages 210 and 220 to each process position, that is, a process position for cutting and a process position for carrying out.

The stage transfer unit includes a first transfer unit 310 for reciprocating the cutting stages 210 and 220 back and forth, and a second transfer unit 320 for reciprocating the cutting stages up and down.

The first transfer part 310 is provided at a process position for cutting the substrate 1, and moves back and forth to transfer the cutting stages 210 and 220 at the corresponding position to a process position for carrying out the cut substrate 1. It is possible.

At this time, the first transfer part 310 is a clamp 311 for clamping at least two circumferential surfaces (preferably front and rear surfaces) of the cutting stages 210 and 220, and guides the movement path of the clamp 311, respectively. It comprises a guide rail 312, and a first driving unit 313 for providing a driving force for the movement of the clamp 311.

The clamp 311 is formed to clamp a portion of the cutting stages 210 and 220 by partially recessed in front and rear surfaces of the respective cutting stages 210 and the cutting stages 210 and 220 by a separate configuration (not shown). Is operated to clamp.

In addition, the second transfer part 320 is provided at a process position for carrying out the substrate 1, and is configured to be capable of vertically reciprocating up and down to transfer the cutting stages 210 and 220 transferred to the corresponding position up and down.

At this time, the second transfer part 320 is configured to include a lifting unit and a second driving unit 323 as shown in Figure 2b.

The lifting unit is configured to be raised and lowered while supporting both sides of the cutting stages 210 and 220, respectively, and includes a first lifter 321 and a second lifter 322 provided with a predetermined distance up and down.

At this time, the first lifter 321 and the second lifter 322 are operable to grip both sides of each cutting stage (210, 220), the second driving unit 323 is the first lifter (321) and The second lifter 322 is driven to move up or down at the same time.

Meanwhile, the cut substrate 1 may be disposed at a position where the second transfer part 320, which is a process position for carrying out the cut substrate 1, of the layout of the non-metal cutting apparatus according to the embodiment of the present invention is provided. Pick-up unit 510 for picking up each unit of the panel (1a) is carried out in a later step is preferably further provided.

At this time, the pickup unit 510 is configured to pick up by vacuum suction the respective cut unit panels (1a).

In addition, each of the unit panels 1a carried by the pickup unit 510 is received at a process position between the portion where the pickup unit 510 is provided and the unloading unit 420. Preferably, the dummy removing unit 520 is further provided to perform the removal of the dummy portion that has not been removed.

In the drawings according to an exemplary embodiment of the present invention, reference numeral 1 denotes a substrate, and 1a represents a panel.

Hereinafter, the process of cutting the substrate by the non-metallic material cutting device of the present invention having a series of configurations described above in the order of the process as follows.

First, the cutting stage (hereinafter, referred to as “first stage”) of any one of the pair of cutting stages 210 and 220 before the cutting process of the substrate 1 proceeds to the main cutting. In addition to being located in the part 100, another cutting stage (hereinafter referred to as a “second stage”) 220 is positioned on a space in which the second transfer part 320, which is a process position for carrying out, is provided.

In this state, the substrate 1 to be cut is loaded by the loading unit 410 on the upper surface of the first stage 210 in the space where the main cutting unit 100 is located.

Subsequently, the substrate 1 loaded into the first stage 210 is aligned by the alignment unit 130.

When the position alignment is completed, the cutting of the substrate 1 is performed while driving the laser cutting unit 110 constituting the main cutting unit 100.

At this time, the lazy cutting unit 110 is guided by the first linear guide 121 and the second linear guide 122 by the driving of the linear motor 123 constituting the moving unit of the first stage 210 of the The substrate 1 is cut in units of each panel 1a while being moved along the horizontal and vertical directions.

When the cutting of the substrate 1 in each panel 1a unit is completed by the series of processes described above, the laser cutting unit 110 constituting the main cutting unit 100 is returned to its original position, and each panel 1a unit The first stage 210 on which the cut substrate 1 of the furnace is mounted is transferred to a carrying out process position of the substrate 1 provided with the second transfer part 320.

The carrying out process of the first stage 210 is performed by driving the first transfer unit 310 and the second transfer unit 320 constituting the stage transfer unit, which will be described in more detail as follows.

First, when cutting of the substrate 1 is completed, the clamps 311 of the first transfer part 310 forming the stage transfer part clamp the front and rear surfaces of the first stage 210, respectively.

Its state is the same as that of Figure 2a and 2b attached.

Of course, the clamping process of the first stage 210 by the clamp 311 may be performed before the cutting process of the substrate.

In addition, while the first driving unit 313 is driven, the clamp 311 is guided by the guide rail 312 and is transferred to a process position where the substrate is carried out.

Therefore, the first stage 210 clamped to the clamp 311 is carried out to the process position where the substrate 1 is carried out.

At this time, the second stage 220 is located at the process position where the substrate 1 is carried out, as shown in FIG. 2B.

However, as shown in FIG. 3, the second stage 220 is moved downward while being clamped to the second lifter 322 of the second transfer part 320 before carrying in the first stage 210. Therefore, the occurrence of interference due to the carrying out of the first stage 210 is prevented.

That is, since the second stage 220 is moved by a predetermined distance toward the lower side from the position where the first stage 210 is carried before the first stage 210 is carried in between each stage (210,220) Interference due to loading can be prevented.

In addition, as shown in FIGS. 4A and 4B attached by the above process, the first stage 210 is positioned above the second stage 220 and clamped to the first lifter 321 constituting the lifting unit. do.

In this case, while the clamp 311 is operated, the first stage 210 forms a state in which the clamps 311 are released from the clamps 311.

Thereafter, the driving of the second conveying unit 320 is performed, and thus the upward movement of the lifting unit is performed as shown in FIG. 5. As a result, the first stage 210 is in an elevated state and the second stage 220 is It is located between the clamps 311.

Subsequently, as the clamp 311 is driven while the front and rear surfaces of the second stage 220 are clamped as shown in FIG. 6, the second lifter 322 which clamps both sides of the second stage 220 is clamped. ) Is performed to release the clamping of the second stage 220.

Accordingly, the second stage 220 is clamped only by the clamp 311.

When the first driving unit 313 is driven in the above state, as shown in FIG. 7, the clamp 311 is guided by the guide rail 312 to a cutting process position of the substrate where the main cutting unit 100 is located. The second stage 220 is also transferred to the cutting process position of the substrate on which the main cut part 100 is located.

Thereafter, while the second transfer part 320 is driven again, the downward movement of the lifting unit is performed as shown in FIG. 8, so that the first stage 210 seated on the first lifter 321 is moved downward.

As a result, the position shift between the first stage 210 and the second stage 220 is performed by the above-described series of processes.

In addition, in the second stage 220, the loading and cutting process of the substrate 1 to be cut is performed, and in the first stage 210, each unit panel of the substrate cut in units of panels by the pickup unit 510. (1a) Stars are taken out.

At this time, each unit panel 1a carried by the pickup unit 510 is removed by the unloading unit 420 after the removal of the dummy part which is carried out to the dummy removing unit 520 and not removed. Unloaded into a process, for example an inspection process.

Meanwhile, the carrying out of the substrate 1 in the cut state on the first stage 210 is completed and the cutting process of the substrate 1 loaded on the second stage 220 is completed by the above-described series of processes. When the first stage 210 and the second stage 220 is alternate again.

Although the position shift between the first stage 210 and the second stage 220 is not shown in order, the operation of each unit for the position shift between the first stage 210 and the second stage 220 is reversed. Is performed by.

That is, the first lifter 321 clamping the first stage 210 is moved by the first driving unit 313 in a state in which the first lifter 321 is moved upward by the driving of the second driving unit 323. 220 is carried into a portion where the second lifter 322 is positioned, and then the first lifter 321 and the second lifter 322 are moved downward by the driving of the second driving unit 323. After the first stage 210 is carried out.

At this time, the imported second stage 220 is clamped by the second lifter 322 and the clamping is released from the clamp 311, and the first stage 210 is transferred between the clamps 311. In this case, the clamping of the first stage 210 is performed by the clamp 311 and the clamping by the first lifter 321 is released.

As a result, the cutting of the substrate and the carrying out of each unit panel of the cut substrate are performed simultaneously by the above-described series of repetitive processes.

On the other hand, the non-metallic cutting device of the present invention according to the above embodiment is not applicable only to the process for cutting the liquid crystal display device.

That is, although not described or illustrated as an embodiment, not only may be applied to cut various kinds of glass or substrate, but also may be applied to a cutting process such as a wafer.

As described above, the non-metal cutting apparatus of the present invention improves the overall layout of the apparatus for cutting the substrate in panel units so that the progress of work can be made faster with minimum equipment and minimum layout area. Has an effect.

That is, since the process of cutting the substrate for each unit panel is performed only in the main cutting part, the first cutting part and the second cutting part need to be simultaneously used.

In particular, the structure for carrying out each unit panel of the cut substrate is performed simultaneously with the cutting process by a pair of stages and a stage transfer unit, thereby achieving an effect of improving work efficiency.

Claims (9)

A main cutting unit for cutting the loaded substrate into a plurality of panel units while moving in the horizontal and vertical directions of the substrate; A pair of cutting stages on which a cutting process is performed while the substrate is mounted, and alternately moved toward a position where the cutting process is performed by the main cutting unit and a carrying out process position of the cut substrate; And, Non-metal cutting device, characterized in that it comprises a stage conveying unit: operable to move the respective cutting stage to each process position. The method of claim 1, The main cutting part A laser cutting unit for cutting a substrate using a laser, Non-metal cutting device characterized in that it comprises a moving unit for moving the laser cutting unit in the horizontal and longitudinal direction of the substrate. The method of claim 2, The mobile unit A first linear guide guiding a movement of the laser cutting unit along a horizontal direction of the cutting stage; A second linear guide guiding movement of the laser cutting unit along a longitudinal direction of the cutting stage; And a linear motor driven to move the laser cutting unit. The method of claim 1, The stage transfer unit A first transfer part provided at a process position for cutting the substrate, the first transfer part being configured to move back and forth back and forth to transfer the cutting stage at the position to a process position for carrying out the cut substrate; And a second transfer part provided at a process position for carrying out the substrate, the second transfer part being provided to be able to reciprocate upward and downward to upwardly and downwardly move the cutting stage transferred to the corresponding position. The method of claim 4, wherein The first transfer unit A clamp for selectively clamping two opposing circumferential surfaces of the cutting stage, A guide rail for guiding a movement path of the clamp; Non-metal cutting device characterized in that it comprises a first drive unit for providing a driving force for the movement of the clamp. The method of claim 4, wherein The second transfer unit A lifting unit configured to raise and lower while selectively clamping two opposing surfaces of the cutting stage, and having a first lifter and a second lifter provided with a predetermined distance up and down; And a second driving unit driven to move the first and second lifters of the lifting unit up and down. The method of claim 1, And a aligning portion for aligning the substrate placed on the cutting stage at the position at the process position for cutting the substrate. The method of claim 1, In the process position where the cut substrate is carried out Non-metallic material cutting device characterized in that the pick-up unit is further provided to pick up the cut substrate in each panel unit and take it out in a post process. The method of claim 8, And a dummy removing unit configured to receive each panel taken out of the pick-up unit and to remove a dummy portion of the panel at a post-processing position of the process position at which the cut substrate is carried out.

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