TWI739869B - Substrate breaking system - Google Patents

Abstract

The present invention provides a substrate breaking system that can omit inspection operations performed by operators and improve the efficiency of work after fracture.

The substrate cutting system 1 includes a substrate cutting device 3, a substrate inspection device 5, and a substrate conveying device 11. The substrate cutting device 3 is a device for cutting off the end of the bonded substrate G. The bonded substrate G has a first substrate G1 and a second substrate G2. The first substrate G1 has a scribe line S formed on the surface to cut off the end material GL. The second substrate G2 is bonded to the back surface of the first substrate G1 . The substrate inspection device 5 inspects the end removal state of the bonded substrate G. The substrate transfer device 11 transfers the bonded substrate G from the cutting device 3 to the substrate inspection device 5, and takes it out from the substrate inspection device 5 after the inspection.

Description

Substrate breaking system

The present invention relates to a substrate cutting system, and more particularly to a substrate cutting system for cutting off the ends from a bonded substrate.

Generally speaking, the manufacturing process of a liquid crystal panel includes a breaking process, which cuts out a so-called bonded substrate formed by bonding a first substrate and a second substrate to a substrate unit that becomes the prototype of the liquid crystal panel.

For example, a color filter is formed on a first substrate, and a thin film transistor (TFT) for driving liquid crystal and a terminal for external connection are formed on the second substrate. Since the terminals of the second board are connected to external devices, they must be exposed. Therefore, the breaking process includes not only the process of breaking the first substrate and the second substrate along the scribe line to form the outer shape of the substrate unit, but also the first facing the terminal in order to expose the terminal formed on the second substrate. A process in which the end of the substrate is broken along the scribe line (for example, refer to Patent Document 1).

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-241173

Patent Document 1 describes the following method of breaking a liquid crystal panel, which is in a liquid crystal panel formed by facing a thin film transistor array substrate and a color filter substrate, and the terminal is exposed by breaking and removing the ends .

The substrate unit formed in the above manner is then supplied to a post-processing process such as polishing or cleaning. In order to smoothly perform the post-processing process, the end of the first substrate must be reliably removed during the breaking process to expose the terminals of the substrate unit. Therefore, the operator must check whether the terminals are properly exposed on the substrate units one by one, and assign the substrate units to be supplied to the post-processing process based on the inspection results.

The object of the present invention is to provide a substrate breaking system that can omit inspection work performed by the operator and improve the work efficiency after fracture.

Hereinafter, as a means to solve the problem, a plurality of aspects will be explained. These aspects can be combined arbitrarily as needed.

A substrate cutting system of one aspect of the present invention includes a cutting device, an inspection device, and a conveying device.

The breaking device is a breaking device used to cut off the end of the bonded substrate. The bonded substrate has a first substrate and a second substrate, the first substrate is formed with a scribe line for cutting off the end on the surface, and the second substrate is bonded to the back surface of the first substrate.

The inspection device inspects the removal state of the end of the bonded substrate.

The transfer device transfers the bonded substrate from the cutting device to the inspection device, and takes it out from the inspection device after the inspection.

In this system, the cutting device cuts off the end of the bonded substrate, and secondly, the conveying device conveys the bonded substrate to the inspection device. Next, the inspection device inspects the end removal state of the bonded substrate. After the inspection, the transport device takes out the bonded substrate from the inspection device.

In this way, the inspection work performed by the operator can be omitted, and the work efficiency after the breakage becomes higher.

The inspection device may have an inspection section, a placement section, and a transport section. It is also possible to supply the substrate to the mounting part by a conveying device. The transport unit may transport the substrate between the placement unit and the inspection unit.

In this system, when the substrate is supplied to the placement section, the transport section transports the substrate from the placement section to the inspection section. After the inspection is completed, the transport section transports the substrate from the inspection section to the placement section.

The transfer device can also transfer the substrate from the inspection device to the breaking device.

In this system, the substrate judged to be defective by the inspection device is returned to the breaking device, and the end portion is cut off again thereafter.

The conveying device may also have a single driving source for conveying the bonded substrate.

In this system, the structure of the conveying device is simple and easy to control.

With the substrate breaking system of the present invention, the inspection operation performed by the operator can be omitted, and the operation efficiency after breaking becomes higher.

1‧‧‧Substrate Breaking System

3‧‧‧Substrate breaking device

5‧‧‧Substrate inspection device

7‧‧‧Substrate removal device

9‧‧‧Substrate waste section

11‧‧‧Substrate conveying device

27‧‧‧Conveyor for inspection department

27a‧‧‧Placement position

27b‧‧‧Check position

29‧‧‧Inspection Department

31‧‧‧door

31a‧‧‧crossbar

33‧‧‧Displacement sensor

35‧‧‧Direct Acting Mechanism

37‧‧‧Exit conveyor

37a‧‧‧Placement position

37b‧‧‧Move out location

39‧‧‧Abandoned Box

41‧‧‧Rotating part

41a‧‧‧pillar

41b‧‧‧arm

43‧‧‧Drive motor

45a‧‧‧The first holding device

45b‧‧‧Second holding device

45c‧‧‧The third holding device

45d‧‧‧4th holding device

81‧‧‧Controller

G‧‧‧Laminated substrate

G1‧‧‧The first substrate

G2‧‧‧Second substrate

GL‧‧‧End Material

Fig. 1 is a schematic top view of a substrate cutting system as an embodiment of the present invention.

Figure 2 is a schematic diagram of the substrate breaking device.

Fig. 3 is a schematic perspective view of the substrate conveying device.

Fig. 4 is a schematic perspective view of the substrate inspection device.

Fig. 5 is a block diagram showing the control structure of the substrate cutting system.

Fig. 6 is a flow chart showing the control action of the substrate cutting system.

Fig. 7 is a flow chart showing the control action of the substrate cutting system.

Fig. 8 is a flow chart showing the control action of the substrate cutting system.

Fig. 9 is a flowchart showing the control action of the substrate cutting system.

Fig. 10 is a schematic diagram of a substrate breaking device for explaining the substrate breaking action.

Fig. 11 is a schematic diagram of a substrate breaking device for explaining the substrate breaking action.

Fig. 12 is a schematic diagram of a substrate breaking device for explaining the substrate breaking action.

FIG. 13 is a schematic diagram of a substrate cutting device for explaining the substrate cutting operation.

Fig. 14 is a schematic diagram of a substrate breaking device for explaining the substrate breaking action.

FIG. 15 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 16 is a schematic top view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 17 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 18 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 19 is a schematic top view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 20 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 21 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

FIG. 22 is a schematic plan view of the substrate cutting system for explaining the substrate inspection operation and subsequent processing.

1. The first embodiment

(1) Substrate breaking system

The substrate cutting system 1 will be described with reference to FIGS. 1 to 4. Fig. 1 is a schematic top view of a substrate cutting system as an embodiment of the present invention. Figure 2 is a schematic diagram of the substrate breaking device. Fig. 3 is a schematic perspective view of the substrate conveying device. Fig. 4 is a schematic perspective view of the substrate inspection device.

The substrate cutting system 1 is a system that removes and inspects the end material GL located at the end of one surface of the bonded substrate G (hereinafter referred to as "substrate G"), and then executes the next process according to the inspection result.

The substrate cutting system 1 has a substrate cutting device 3. The substrate cutting device 3 removes the end material GL located at the end of one surface of the substrate G. The substrate cutting device 3 is a cutting device for cutting off the end of the bonded substrate. As shown in FIG. 2, the substrate G is composed of a first substrate G1 and a second substrate G2 bonded to the first substrate G1. Here, a scribe line S is formed on the surface of the first substrate G1, and the end material GL is removed along the scribe line S.

The substrate cutting system 1 has a substrate inspection device 5. The substrate inspection device 5 is a device for inspecting the end removal state of the substrate G from which the end material GL has been removed.

The substrate cutting system 1 has a substrate carry-out device 7. The substrate unloading device 7 is an apparatus for unloading the substrate G whose inspection result is normal to the next process.

The substrate cutting system 1 has a substrate discarding part 9. The board discarding part 9 is a place where the board G whose inspection result is bad and will not be re-disconnected is discarded.

The substrate cutting system 1 has a substrate conveying device 11. The substrate transfer device 11 is a device that transfers the substrate G between the substrate cutting device 3, the substrate inspection device 5, and the substrate unloading device 7.

(2) Substrate breaking device

The substrate cutting device 3 will be described with reference to FIG. 2. The substrate cutting device 3 has a plurality of heads 21 and stages 22.

The plurality of heads 21 are arranged in the vertical direction of the paper surface of FIG. 2 and are supported by a support mechanism such as a bracket (not shown). Each head 21 is movable up and down by the drive mechanism M1, and has a pressing part 21a and a suction part 21b. The stage 22 mounts the substrate G so that the first substrate G1 is positioned above. In addition, the substrate G is arranged such that the end material GL is located more outside than the end surface of the table 22, that is, the placing surface of the table 22 does not exist below the end material GL. The table 22 can be moved in the left-right direction in FIG. 2 by a drive mechanism M2 including a drive motor or a guide mechanism.

The pressing portion 21a of the head 21 presses the end material GL against the substrate G from the side of the first substrate G1. Thereby, the end material GL is divided along the scribe line S.

The suction portion 21b is arranged on the side of the pressing portion 21a (the side along the moving direction of the table 22). The suction part 21b is formed of a porous material, and is connected to the vacuum pump P via a channel or the like provided inside the head 21 and an external pipe 23.

The lower surface of the pressing portion 21a becomes a pressing surface that contacts the end material GL and presses downward. In addition, the lower surface of the suction portion 21b is formed to protrude downward (on the first substrate G1 side) than the pressing surface, and becomes a suction surface for sucking the end material GL.

(3) Board inspection device

The board inspection apparatus 5 will be described with reference to FIG. 3. The substrate inspection apparatus 5 has an inspection part conveyor 27 (an example of a conveyance part). The inspection department conveyor 27 is a belt conveyor. The inspection part conveyor 27 moves the substrate G thereon between the placement position 27a and the inspection position 27b. Although the placement position 27a and the inspection position 27b are arranged in the left-right direction in FIG. 1, the direction is not particularly limited.

The substrate inspection apparatus 5 has an inspection unit 29. The inspection portion 29 has a door 31 that straddles the inspection position 27b and a displacement sensor 33 that is arranged to be movable in the length direction under the crossbar 31a of the door 31. The displacement sensor 33 irradiates the substrate G with laser light and measures the height of the surface of the substrate G based on the reflected light, for example. The displacement sensor 33 moves along the cross bar 31a of the door 31 by the linear motion mechanism 35 (FIG. 5).

As described above, when the substrate G is supplied to the placement position 27a, the inspection section conveyor 27 transports the substrate G from the placement position 27a to the inspection section 29. After the inspection, the inspection unit conveyor 27 transports the substrate G from the inspection unit 29 to the placement position 27a.

(4) Board unloading device

As shown in FIG. 1, the board|substrate carrying-out apparatus 7 has the carrying-out part conveyor 37. The unloading part conveyor 37 is a belt conveyor.

The unloading part conveyor 37 moves the board|substrate G thereon between the placing position 37a and the unloading position 37b.

(5) Board waste section

As shown in FIG. 1, the board discarding part 9 has a discarding box 39. The waste box 39 has an opening opened on the upper side.

(6) Substrate conveying device

The substrate conveying device 11 will be described with reference to Figs. 1 and 4. The substrate conveying device 11 has a rotating unit 41. The rotating part 41 has a pillar 41a extending in the vertical direction and four arms 41b extending from the upper end of the pillar 41a in the horizontal direction. The four arms 41b are arranged at 90-degree intervals in a plan view. The pillar 41a can be rotated around the vertical axis by the driving motor 43 (FIG. 5). In this way, the substrate transfer device 11 has the drive motor 43 as a single drive source, and therefore has a simple structure and easy control.

The substrate transfer device 11 has a first holding device 45a, a second holding device 45b, a third holding device 45c, and a fourth holding device 45d, which are attached to the lower portion of the front end of the arm 41b. The first holding device 45a to the fourth holding device 45d respectively have: a first suction portion 47a, a second suction portion 47b, a third suction portion 47c, and a fourth suction portion 47d having an opening facing downward; The 4th adsorption|suction part 47a-47d is supported as the 1st raising/lowering part 49a, the 2nd raising/lowering part 49b, the 3rd raising/lowering part 49c, and the 4th raising/lowering part 49d which can move up and down. The first to fourth suction parts 47a to 47d are connected to a vacuum pump (not shown). The first to fourth lifting parts 49a to 49d are, for example, air cylinders.

In addition, in FIG. 4, the 3rd adsorption|suction part 47c shows the rising position with a solid line, and shows a processing position with a broken line.

As shown in FIG. 1, the substrate cutting device 3, the substrate inspection device 5, the substrate unloading device 7, and the substrate discarding part 9 are arranged around the pillar 41 a of the rotating part 41 of the substrate conveying device 11. Specifically, the devices are arranged at 90-degree intervals in the order described above.

The front end of the arm 41b of the rotating part 41, that is, the first to fourth holding devices 45a to 45d can be located above the substrate cutting device 3, the substrate inspection device 5, the substrate removal device 7, and the substrate discarding portion 9.

The first to fourth holding devices 45a to 45d can lower the first to fourth suction parts 47a to 47d respectively by the first to fourth lifting parts 49a to 49d, and then the first to fourth suction parts 47a ~47d adsorbs or de-adsorbs the substrate G located in the substrate cutting device 3, the substrate inspection device 5, or the substrate unloading device 7, and then the first to fourth adsorption parts 47a to 47d can be raised.

(7) The control structure of the substrate breaking system

The control structure of the substrate cutting system 1 will be described with reference to FIG. 5. Fig. 5 is a block diagram showing the control structure of the substrate cutting system.

The substrate cutting system 1 has a controller 81. The controller 81 is a computer with a processor (for example, CPU), a memory device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A/D converter, D/A converter, communication interface, etc.) system. The controller 81 performs various control actions by executing programs stored in the memory portion (corresponding to part or all of the memory area of the memory device).

Although the controller 81 may also be constituted by a single processor, it may also be constituted by a plurality of independent processors for each control.

Part or all of the functions of each element of the controller 81 can also be implemented as a program executable by the computer system constituting the controller 81. In addition, a part of the function of each element of the controller 81 may also be formed by a customized IC.

The inspection part conveyor 27, the linear motion mechanism 35, the drive motor 43, the 1st suction part 47a-the 4th suction part 47d, and the 1st lifting part 49a-the 4th lifting part 49d are connected to the controller 81. The controller 81 controls these devices by sending control signals.

A displacement sensor 33 is connected to the controller 81. The controller 81 receives the detection signal from the displacement sensor 33, and determines the state of the substrate G and subsequent processing based on the detection signal.

In addition, a sensor for detecting the size, shape and position of the substrate G, a sensor and a switch for detecting the state of each device, and an information input device are connected to the controller 81, but not shown.

(8) Basic actions of the substrate breaking system

The basic operation of the substrate cutting system 1 will be described with reference to FIGS. 6-22. Figures 6-9 are flowcharts showing the control actions of the substrate cutting system. Figures 10-14 are schematic diagrams of the substrate cutting device for explaining the substrate cutting action. Figures 15-22 are schematic top views of the substrate cutting system for explaining the substrate inspection action and subsequent processing.

The control flow chart described below is an example, and each step can be omitted and replaced if necessary. In addition, multiple steps may be executed at the same time, or some or all of the steps may be overlapped.

Furthermore, each block of the control flowchart is not limited to a single control action, and can be replaced with a plurality of control actions represented by a plurality of blocks.

In addition, the substrate G is prepared before the breaking operation described below, and a scribe line S is formed on the surface of the first substrate G1 (the surface on the side where the second substrate G2 is not bonded) by a scribe line forming device not shown.

In step S1, the substrate G is placed on the substrate cutting device 3.

Specifically, the substrate G is placed on the placement surface of the table 22. More specifically, as shown in FIG. 2, the first substrate G1 with the scribe line S formed on the surface is positioned above, and the scribe line S and the end portion (the part that becomes the end material) GL are located on the mounting surface of the stage 22 The substrate G is arranged further outside. Furthermore, it is arranged so that the end material GL is located directly below the pressing portion 21a of the head 21 and deviated from the suction portion 21b (in a manner that the suction portion 21b does not contact the end material GL when the head 21 is lowered).

In step S2, the substrate cutting device 3 performs a breaking operation.

Specifically, as shown in Fig. 10, the controller 81 lowers the head 21, and presses the end material GL downward by the pressing portion 21a. At this time, since there is no mounting surface of the table 22 under the end material GL, by pressing the end material GL part by the pressing portion 21a, a crack is formed in the first substrate G1 starting from the scribe line S, and the end All the material GL is cut off.

Then, as shown in FIG. 11, the controller 81 raises the head 21, and further moves the stage 22 to the left in FIG. 11. At this time, the table 22 is moved so that the suction portion 21b of the head 21 is located directly above the end material GL.

Then, as shown in FIG. 12, the controller 81 lowers the head 21, and makes the suction part 21b abut on the end material GL. Thereby, the end material GL is sucked and held by the sucking portion 21b. In this state, as shown in FIG. 13, the head 21 is raised. Thereby, the end material GL is cut away from the first substrate G1. Thereafter, as shown in FIG. 14, the controller 81 retreats the stage 22 (moves to the right in the figure), and retreats the substrate G from below the head 21. Then, if the suction is released by the suction part 21b, the end material GL will drop to the end material placement place.

Next, the operation of the substrate transfer device 11 to transfer the substrate G from the substrate cutting device 3 to the substrate inspection device will be described using steps S3 to S5.

In step S3, the first suction part 47a of the first holding device 45a performs the lowering, suction, and raising operations. At this time, as shown in FIG. 15, the first holding device 45a is positioned above the substrate G. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to suction the substrate G to the first suction portion 47a, and drives the first elevating portion 49a to cause the first suction portion 47a. The suction portion 47a rises. As a result, the substrate G is lifted from the table 22 of the substrate cutting device 3.

In step S4, the rotating part 41 of the substrate conveying device 11 rotates 90 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating part 41 clockwise in the figure by 90 degrees. As a result, as shown in FIG. 16, the substrate G is positioned above the placement position 27a of the inspection portion conveyor 27 of the substrate inspection apparatus 5.

In step S5, the first suction portion 47a of the first holding device 45a performs descending, releasing, and ascending operations. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to de-suction the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to cause the The 1 suction portion 47a rises. As a result, as shown in FIGS. 3 and 16, the substrate G is placed on the placement position 27 a of the inspection part conveyor 27 of the substrate inspection apparatus 5.

In step S6, the inspection part conveyor 27 moves the board|substrate G to the inspection position 27b. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIGS. 3 and 17, the substrate G is placed on the inspection position 27 b of the inspection unit conveyor 27.

In step S7, the displacement sensor 33 detects the disconnected state. Specifically, the controller 81 drives the linear motion mechanism 35 to move the displacement sensor 33 along the cross bar 31 a, and receives the detection signal from the displacement sensor 33 at the same time. At this time, the displacement sensor 33 detects the distance between the non-processed part of the substrate G and the end material removal part. Therefore, the height information of the end material removal part is obtained.

In step S8, the controller 81 determines whether the disconnection state is normal. If yes, the procedure moves to step S10 (FIG. 7), if no, the procedure moves to step S9.

In step S9, the controller 81 determines whether to perform re-disconnection. If yes, the procedure moves to step S15 (Figure 8), if not, the procedure moves to step S19 (Figure 9).

Hereinafter, using steps S10 to S14 of FIG. 7, the operation when it is YES in step S8, that is, the substrate disconnection is normal, will be described.

In step S10, the inspection part conveyor 27 moves the board|substrate G to the mounting position 27a. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIG. 18, the board|substrate G is arrange|positioned at the mounting position 27a.

Next, the operation of the substrate transfer device 11 to transfer the substrate G from the substrate inspection device 5 to the substrate transfer device 7 will be described using steps S11 to S13.

In step S11, the first suction part 47a of the first holding device 45a performs the lowering, suction, and raising operations. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to suction the substrate G to the first suction portion 47a, and drives the first elevating portion 49a to cause the first suction portion 47a. The suction portion 47a rises. As a result, the substrate G is lifted from the substrate inspection device 5.

In step S12, the rotating part 41 is rotated by 90 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating part 41 clockwise in the figure by 90 degrees. As a result, as shown in FIG. 19, the substrate G is positioned above the placement position 37 a of the unloading portion conveyor 37 of the substrate unloading device 7.

In step S13, the first suction portion 47a of the first holding device 45a executes lowering, releasing, and raising operations. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to de-suction the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to cause the The 1 suction portion 47a rises. As a result, as shown in FIG. 19, the substrate G is placed on the placement position 37 a of the transport conveyor 37 of the substrate transport apparatus 7.

In step S14, the unloading part conveyor 37 conveys the board|substrate G. Specifically, the controller 81 drives the unloading part conveyor 37 to perform the above-mentioned operations. As a result, as shown in FIG. 20, the board|substrate G is moved to the carrying-out position 37b side.

After that, the procedure returns to step S1. In this case, the third holding device 45c performs the next substrate holding operation. In addition, since the third holding device 45c is already arranged above the substrate cutting device 3, it is not necessary to rotate the rotating part 41.

As described above, the substrate cutting device 3 cuts off the end material GL to which the substrate G is bonded, and then the substrate conveying device 11 conveys the substrate G to the substrate inspection device 5. Next, the substrate inspection device 5 inspects the end removal state of the substrate G. After the inspection, the substrate transport device 11 takes out the substrate G from the substrate inspection device 5. In this way, the inspection work performed by the operator can be omitted, and the work efficiency after the breakage becomes higher.

Hereinafter, using steps S15 to S18 in FIG. 8, the case where it is YES in step S9, that is, the re-breaking is performed will be described.

In step S15, the inspection part conveyor 27 moves the board|substrate G to the mounting position 27a. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIG. 18, the board|substrate G is arrange|positioned at the mounting position 27a.

Next, the operation of the substrate transfer device 11 to transfer the substrate G from the substrate inspection device 5 to the substrate cutting device 3 will be described using steps S16 to S18.

In step S16, the first suction part 47a of the first holding device 45a performs the lowering, suction, and raising operations. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to suction the substrate G to the first suction portion 47a, and drives the first elevating portion 49a to cause the first suction portion 47a. The suction portion 47a rises. As a result, the substrate G is lifted from the substrate inspection device 5.

In step S17, the rotating part 41 rotates 270 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating part 270 degrees in the clockwise direction in the figure. As a result, as shown in FIG. 19, the substrate G is positioned above the placement position 37 a of the unloading portion conveyor 37 of the substrate unloading device 7.

In step S18, the first suction portion 47a of the first holding device 45a executes lowering, releasing, and raising operations. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to de-suction the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to cause the The 1 suction portion 47a rises. As a result, as shown in FIG. 21, the substrate G is placed on the table 22 of the substrate cutting device 3.

After that, the procedure returns to step S2. In this case, the first holding device 45a performs the next substrate holding operation. In addition, since the first holding device 45a is already arranged above the substrate cutting device 3, it is not necessary to rotate the rotating part 41.

As described above, the substrate transfer device 11 transfers the substrate G from the substrate inspection device 5 to the substrate cutting device 3. Therefore, the substrate G judged to be defective by the substrate inspection device 5 is returned to the substrate cutting device 3, and the end material GL is cut off again thereafter.

Hereinafter, using steps S19 to S22 in FIG. 9, the case where the result is No in step S9, that is, no re-breaking will be performed.

In step S19, the inspection part conveyor 27 moves the board|substrate G to a mounting position. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-mentioned operations. As a result, as shown in FIG. 18, the board|substrate G is arrange|positioned at the mounting position 27a.

Next, the operation of the substrate transfer device 11 to transfer the substrate G from the substrate inspection device 5 to the substrate discarding section 9 will be described using steps S20 to S22.

In step S20, the first suction part 47a of the first holding device 45a performs a descending, sucking, and ascending operation. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to suction the substrate G to the first suction portion 47a, and drives the first elevating portion 49a to cause the first suction portion 47a. The suction portion 47a rises. As a result, the substrate G is lifted from the substrate inspection device 5.

In step S21, the rotating part 41 rotates 180 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating part 180 degrees in the clockwise direction in the figure. As a result, as shown in FIG. 22, the substrate G is positioned above the waste box 39 of the substrate waste portion 9.

In step S22, the first suction portion 47a of the first holding device 45a executes lowering, releasing, and raising operations. Specifically, the controller 81 drives the first elevating portion 49a to lower the first suction portion 47a, drives the first suction portion 47a to de-suction the substrate G from the first suction portion 47a, and drives the first elevating portion 49a to cause the The 1 suction portion 47a rises. As a result, as shown in FIG. 22, the board|substrate G is discarded in the discarding box 39 of the board|substrate discarding part 9. As shown in FIG.

After that, the procedure returns to step S1. In this case, the second holding device 45b performs the next substrate holding operation. In addition, since the second holding device 45b is already arranged above the substrate cutting device 3, it is not necessary to rotate the rotating part 41.

2. Other implementation forms

Although one embodiment of the present invention has been described above, the present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the spirit of the invention. In particular, the plural embodiments and modifications described in this specification can be combined arbitrarily as needed.

(1) The number of arms of the substrate transfer device is not limited to four. The number of arms can also be 1 to 3, and can also be 5 or more.

(2) The rotation direction of the rotating part of the substrate conveying device is not limited to the clockwise direction in the figure. It can also be the counterclockwise direction of the figure, or the clockwise direction and the counterclockwise direction can be combined appropriately.

(3) The angle between the devices arranged around the substrate conveying device is not limited to the above-mentioned embodiment.

(4) In the above-mentioned embodiment, it is determined after the inspection whether to return the substrate G to the substrate cutting device 3 or to discard it, but this determination may not be performed. In this case, the substrate G whose breaking state is bad must be returned to the substrate breaking device 3 or must be discarded.

(5) The shape and transport structure of the substrate transport device are not limited to the above-mentioned embodiment. For example, the transport between each device can also be performed by a plurality of separate transport devices.

(6) The substrate holding structure of the substrate conveying device is not limited to the above-mentioned embodiment.

(7) The sensor of the substrate inspection apparatus is not limited to the above-mentioned embodiment.

[Industrial availability]

The present invention can be widely applied to a substrate cutting system for cutting off the end from the bonded substrate.

1‧‧‧Substrate Breaking System

3‧‧‧Substrate breaking device

5‧‧‧Substrate inspection device

7‧‧‧Substrate removal device

9‧‧‧Substrate waste section

11‧‧‧Substrate conveying device

27‧‧‧Conveyor for inspection department

27a‧‧‧Placement position

27b‧‧‧Check position

29‧‧‧Inspection Department

31‧‧‧door

37‧‧‧Exit conveyor

37a‧‧‧Placement position

37b‧‧‧Move out location

39‧‧‧Abandoned Box

41‧‧‧Rotating part

41a‧‧‧pillar

41b‧‧‧arm

45a‧‧‧The first holding device

45b‧‧‧Second holding device

45c‧‧‧The third holding device

45d‧‧‧4th holding device

G‧‧‧Laminated substrate

Claims (4)

A substrate cutting system comprising: a cutting device for cutting off the end of a bonded substrate having a first substrate and a second substrate, and the first substrate is formed on the surface to cut off the end Scribing, the second substrate is attached to the back of the first substrate; an inspection device that inspects the end removal state of the attached substrate; and a transport device that transports the attached substrate from the cutting device to the above The inspection device is taken out from the inspection device after the inspection. The inspection device has: an inspection portion, a door that spans the inspection position, and a displacement sensor provided on the crossbar of the door; The transfer device is supplied with a substrate; and a transfer section that transfers the substrate between the placement section and the inspection section. For example, the substrate cutting system of the first item of the scope of patent application, wherein the transfer device transfers the substrate from the inspection device to the cutting device. Such as the substrate cutting system of the first item in the scope of patent application, wherein the above-mentioned conveying device has a single driving source for conveying the above-mentioned bonded substrate. For example, the substrate cutting system of the second item of the scope of patent application, wherein the above-mentioned conveying device has a single driving source for conveying the above-mentioned bonded substrate.

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