JP2018015923A - Dividing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dividing device which can divide an end material part from a bonding substrate to remove the end material part in a more secure manner.SOLUTION: A dividing device 10 includes: a break bar 103 which presses a position located on a surface of a second substrate 30b, which is opposite to the first substrate 30a, and corresponding to a scribe line L1 to divide the first substrate 30a along the scribe line L1; a suction part 102 which suctions a divided end material part 31; and a moving mechanism which moves the suction part 102 in a direction away from the second substrate 30b.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a cutting apparatus that folds and divides a substrate at the position of a scribe line formed on the substrate.

  In general, the manufacturing process of a liquid crystal panel includes a breaking process of cutting out a substrate unit serving as a prototype of a liquid crystal panel from a so-called bonded substrate obtained by bonding a first substrate and a second substrate. For example, a color filter is formed on the first substrate, and a thin film transistor (TFT) for driving liquid crystal and a terminal for external connection are formed on the second substrate. Since the terminal of the second substrate is a part connected to an external device, it needs to be exposed. For this reason, in the breaking process, the first substrate and the second substrate are each broken along the scribe line to generate the outer shape of the substrate unit, and further, the terminals formed on the second substrate are exposed. The step of breaking the end portion of the first substrate facing the terminal along the scribe line is included.

  Patent Document 1 below describes a method for cutting a liquid crystal panel in which a thin film transistor array substrate and a color filter substrate are bonded to face each other, and a terminal is exposed by cutting and removing an end material portion. ing.

JP 2003-241173 A

In the liquid crystal panel, the width of the terminal area is becoming considerably narrow as the display area is enlarged. For this reason, the width | variety of the end material part cut | disconnected in order to expose a terminal is also quite narrow. When the width of the end material portion becomes narrow in this way, the cut end material portion may not be removed from the liquid crystal panel in the conventional method of blowing air to the end material portion and blowing off the end material portion as in the past. . For this reason, the method of removing an end material part more reliably was desired.
In view of such a problem, an object of the present invention is to provide a cutting apparatus that can more reliably cut and remove an end material portion from a bonded substrate.

  The main aspect of the present invention is that the end material portion is moved along the scribe line from a substrate formed by bonding a first substrate on which a scribe line defining the end material portion is formed and a second substrate. A cutting device for cutting and removing, and abutting against the end material part before splitting, and adsorbing part for sucking the end material part after splitting, opposite to the end material part across the scribe line A pressing member that is in contact with the surface of the first substrate on the side, and the surface of the second substrate on the opposite side of the first substrate in a state where both the suction portion and the pressing member are in contact with the first substrate. A pressing unit that presses a position corresponding to the scribe line to divide the first substrate along the scribe line; and a moving mechanism that moves the suction unit in a direction away from the second substrate.

  According to the cutting apparatus according to this aspect, the end material part cut by the pressing part is pulled and removed in a direction away from the second substrate as the suction part moves. Therefore, the end material part can be reliably removed from the substrate.

  In the cutting apparatus according to this aspect, the suction portion and the pressing portion may be configured to be moved integrally by the moving mechanism. For example, the suction part and the pressing part may be supported by a support part so as to sandwich the substrate, and the support part may be moved by the moving mechanism. If it carries out like this, if a press part is located in the position corresponding to a scribe line for parting of an end material part, an adsorption part will be located in the position which adsorbs an end material part. Therefore, the end material portion can be efficiently divided and removed with a simple configuration.

  In the cutting apparatus according to this aspect, the moving mechanism may be configured to start the movement of the suction unit at least in a direction perpendicular to the surface of the second substrate on the first substrate side. In this case, the end material portion is quickly separated from the second substrate with the movement of the suction portion, so that the surface of the end material portion on the second substrate side does not rub against the surface of the second substrate. Therefore, it is possible to avoid scratching the surface of the second substrate.

  In this case, the moving mechanism may be configured to start moving the suction portion in an oblique direction away from both the scribe line and the surface of the second substrate on the first substrate side. Also in this case, since the end material portion is quickly separated from the second substrate with the movement of the suction portion, the surface of the end material portion on the second substrate side does not rub against the surface of the second substrate. Furthermore, since the separation end surface on the scribe line side of the end material portion is quickly separated from the separation end surface on the scribe line side of the first substrate, these separation end surfaces do not come into contact with each other when the end material portion is removed. . Therefore, the separation end surface on the first substrate side is not damaged, and the end surface strength on the first substrate side can be kept high.

  In the cutting device according to this aspect, in the state where the substrate is supported by a support table so that the first substrate is on the upper side in the vertical direction with respect to the second substrate, the pressing portion is the second substrate. In the case of a configuration in which the surface of the substrate is pressed from below in the vertical direction, a more desirable effect can be exhibited. In the case of this configuration, the divided end material part is easily left on the upper surface of the second substrate without dropping off due to gravity. Therefore, in the case of such a configuration, as described above, the end material portion that tends to remain on the upper surface of the second substrate can be reliably removed by pulling and removing the end material portion with the suction portion.

  As described above, according to the present invention, it is possible to provide a cutting apparatus that can cut and remove the end material portion from the bonded substrate more reliably.

  The effects and significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.

1A and 1B are a plan view and a side view, respectively, schematically showing the configuration of the scribing apparatus according to the embodiment. FIG. 2A is a diagram schematically showing the upper surface of the substrate on which the scribe line according to the embodiment is formed. FIG. 2B is a diagram schematically illustrating a method for forming a scribe line according to the embodiment. FIG.2 (c) is a figure which shows typically the board | substrate from which the end material part which concerns on embodiment was removed. FIGS. 3A and 3B are a side view and a main part perspective view, respectively, showing the configuration of the pressing mechanism of the scribing apparatus according to the embodiment. FIGS. 3C and 3D are a side view and a main part perspective view showing the configuration of the pressing mechanism of the scribing apparatus according to the embodiment, respectively. 4A and 4B are a plan view and a side view schematically showing the configuration of the cutting apparatus according to the embodiment. FIG.4 (c) is the side view which looked at the support part vicinity of the cutting device which concerns on embodiment from the X-axis negative side. FIG. 4D is a side view showing the positional relationship between the cutting device and the scribe device according to the embodiment. FIG. 5 is a block diagram illustrating a configuration of the cutting system according to the embodiment. FIG. 6A and FIG. 6B are side views for explaining the operation of the cutting apparatus according to the embodiment. 7A and 7B are side views for explaining the operation of the cutting apparatus according to the embodiment. FIGS. 8A and 8B are side views for explaining the operation of the cutting apparatus according to the embodiment. 9A and 9B are side views for explaining the operation of the cutting apparatus according to the embodiment. FIGS. 10A and 10B are side views schematically showing the configuration of the cutting apparatus according to the modified example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, XYZ axes orthogonal to each other are added for convenience. The XY plane is parallel to the horizontal plane, and the positive Z-axis direction is a vertically upward direction.

  The present embodiment is a liquid crystal panel formed by bonding a first substrate on which a color filter is formed and a second substrate on which a thin film transistor (TFT) for driving liquid crystal and a terminal for external connection are formed. It is related with the cutting system which cuts and removes the end material part above a terminal from the mother board | substrate of this. Hereinafter, the mother substrate is simply referred to as “substrate 30”.

  First, the configuration of the scribing apparatus 20 for forming a scribe line on the substrate 30 will be described.

1A and 1B are a plan view and a side view, respectively, schematically showing the configuration of the scribe device 20.
The scribing device 20 includes a support table 201 on which the substrate 30 is placed. The support table 201 is installed on the ground by the legs 202. A belt conveyor 203 for transporting the substrate 30 placed on the support table 201 in the X-axis positive direction is disposed on the X-axis negative side of the support table 201. Similarly, a belt conveyor 204 for conveying the substrate 30 transferred from the belt conveyor 203 in the X axis positive direction is also arranged on the X axis negative side of the support table 201. The substrate 30 is placed on the support table 201 such that the first substrate is on the upper side in the vertical direction.

  Two support columns 205 are provided at a substantially intermediate position in the X-axis direction of the support table 201, and a guide 206 is installed on these support columns 205. A support plate 207 is attached to the guide 206 so as to be movable in the Y-axis direction, and a scribe head 208 is attached to the support plate 207. The support plate 207 is driven in the Y-axis direction by a motor (not shown). Thereby, the scribe head 208 moves in the Y-axis direction.

  A scribing wheel 208 a is attached to the lower end of the scribe head 208. The scribing head 208 is moved in the Y-axis direction while the scribing wheel 208a is pressed against the upper surface of the substrate 30 with a predetermined load. Thereby, a scribe line is formed on the upper surface of the substrate 30.

FIG. 2A is a diagram schematically showing the upper surface of the substrate 30 on which scribe lines are formed.
Two scribe lines L <b> 1 and L <b> 2 are formed on the upper surface of the substrate 30. The scribe line L1 is for removing the end material portion from the substrate 30, and the scribe line L2 is for dividing the substrate 30. The scribe line L2 is formed deeper than the scribe line L1. A scribe line L2 for dividing the substrate may be further formed at a position directly below the scribe line L2 on the lower surface of the substrate 30.

  As shown in FIG. 2B, the scribe line L1 is formed at a position slightly on the X-axis negative side with respect to the region of the terminal T1 formed on the upper surface of the second substrate 30b. Of the substrate 30, only the first substrate 30 a is folded along the scribe line L <b> 1 by the cutting device 10 described later. Thereafter, the bent end material portion 31 is removed from the substrate 30. As a result, as shown in FIG. 2C, the terminal T1 formed on the upper surface of the second substrate 30b is exposed.

  Returning to FIGS. 1A and 1B, a support frame 209 is installed at the end of the support table 201 on the X axis positive side. The support frame 209 is a plate-shaped frame member, and supports the end of the substrate 30 on the X axis positive side when the substrate 30 is divided by the dividing device 10 as described later. By installing the support frame 209, an opening 210 extending in the Y-axis direction is formed at the end on the X-axis positive side of the support table 201. As will be described later, the break bar 103 of the cutting apparatus 10 moves in the Z-axis direction through the opening 210.

  Further, a bridge 211 is further installed at the end of the support table 201 on the X axis positive side. The bridge 211 is integrated with the support frame 209. The bridge 211 is provided with a pressing mechanism for pressing the upper surface of the substrate 30.

  FIGS. 3A and 3B are a side view and a main part perspective view showing the structure of the pressing mechanism, respectively. For convenience, only the upper frame portion of the bridge 211 is shown in FIG. FIG. 3B also shows a frame portion that supports the substrate 30 in the support frame 209.

  As shown in FIGS. 3A and 3B, three air cylinders 212 are installed downward in the upper frame portion of the bridge 211. These air cylinders 212 are provided with pressing members 213 extending in the Y-axis direction. The air cylinder 212 is driven by an air pressure source (not shown). 3A and 3B show a state where the air cylinder 212 is contracted.

  From this state, when the air cylinder 212 is extended by the air pressure source, the pressing member 213 is lowered, and the upper surface of the substrate 30 is pressed by the pressing member 213 as shown in FIGS. Thereby, the edge part of the X-axis positive side of the board | substrate 30 is fixed. As will be described later, in this state, the cutting device 10 divides the end material portion 31 along the scribe line L1 and divides the substrate 30 along the scribe line L2.

Next, the configuration of the cutting apparatus 10 will be described with reference to FIGS.
FIGS. 4A and 4B are a plan view and a side view schematically showing the configuration of the cutting apparatus 10.
The cutting device 10 includes a frame-shaped support portion 101 extending in the Y-axis direction. The support portion 101 is configured by connecting two upper plate portions 101a and a lower plate portion 101b parallel to the XZ plane by a plate-like connecting portion 101c parallel to the YZ plane. The suction part 102 is installed on the lower surface of the upper plate part 101a. Moreover, the break bar 103 is attached to the lower plate portion 101b. Furthermore, an opening 101d that penetrates in the Z-axis direction is formed in the lower plate portion 101b. As will be described later, the opening 101d is for allowing the end material portion 31 dropped from the adsorption portion 102 to pass when the adsorption portion 102 releases the adsorption of the end material portion 31.

FIG. 4C is a side view of the vicinity of the support portion 101 as viewed from the X-axis negative side.
As shown in FIG. 4C, three air cylinders 104 are installed upward on the lower plate portion 101 b, and a break bar 103 is attached to these air cylinders 104. The air cylinder 104 is driven by an air pressure source (not shown). FIG. 4C shows a state where the air cylinder 104 is contracted. The break bar 103 and the air cylinder 104 constitute a pressing portion that presses the lower surface of the substrate 30 to divide the substrate 30 and the end material portion 31.

  The suction part 102 has a large number of holes formed on the lower surface. The adsorption part 102 is formed with flow paths connected to these holes, and this flow path is connected to an air pressure source (not shown). By setting the flow path to a negative pressure by the air pressure source, the lower surface of the suction portion 102 is in the suction state. Thereby, the end material part 31 is adsorb | sucked to the lower surface of the adsorption | suction part 102 so that it may mention later.

  4A and 4B, a guide member 105 extending in the X-axis direction is installed on the side surface of the support portion 101 on the X-axis positive side. The guide member 105 is mounted on the mounting base 107 via the rail 106 so as to be movable in the X-axis direction. A motor 108 is installed on the top surface of the mounting base 107. A ball screw 108 a joined to the drive shaft of the motor 108 is screwed into a screw receiver 105 a of the guide member 105. As a result, the guide member 105 moves in the X-axis direction in accordance with the drive of the motor 108.

  Further, the X-axis positive side surface of the mounting base 107 is attached to the two support columns 110 via a pair of sliders 109. Thereby, the mounting base 107 is movable in the Z-axis direction. Further, a screw receiver 111 that is screwed with the ball screw 112 is installed on the side surface of the mounting base 107 on the X axis positive side. The ball screw 112 is driven by a motor (not shown). This motor is mounted on, for example, a frame member (not shown) that connects the upper ends of the pair of columns 110.

  FIG. 4D is a side view showing the positional relationship between the cutting device 10 and the scribe device 20. As in FIG. 3B, only the upper frame portion of the bridge 211 is illustrated in FIG. 4D, and only the frame portion of the support frame 209 that supports the substrate 30 is illustrated.

  As shown in FIG. 4D, the cutting device 10 is installed in the vicinity of the end portion on the X axis positive side of the scribe device 20. When the support portion 101 is in the position of FIG. 4D, the break bar 103 is positioned below the opening 210, and the suction portion 102 is positioned above the support frame 209.

FIG. 5 is a block diagram showing a configuration of the cutting system. The cutting system includes a cutting device 10 and a scribe device 20.
The dividing system includes a control unit 11, a mechanism unit 12, a suction unit 13, a sensor unit 14, and an input / output unit 15. The control unit 11 includes an arithmetic processing circuit such as a CPU (Central Processing Unit) and a memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory), and controls each unit according to a program stored in the memory. The mechanism unit 12 includes the mechanisms of the cutting device 10 and the scribe device 20 illustrated in FIGS. 1 (a) to 4 (d). The suction unit 13 includes a pipe, a flow path, and the like that apply the air pressure source and the pressure of the air pressure source to the air cylinders 104 and 212 and holes formed in the lower surface of the suction unit 102. The sensor unit 14 includes various sensors for detecting the position of the substrate 30 on the conveyance path, the positions of the guide member 105 and the mounting base 107, and the like. The input / output unit 15 includes a monitor, a keyboard, a touch panel, and the like, and is used for designating and inputting the size and division position of the substrate 30 and displaying the progress of the division.

Next, with reference to FIGS. 6A to 9B, the operation of the cutting apparatus 10 will be described.
6A and 6B are side views for explaining the operation of the cutting apparatus 10, respectively. For convenience, FIGS. 6A and 6B schematically show only the configuration necessary for dividing the substrate 30. Similarly, FIGS. 7A to 9B schematically show only the configuration necessary for dividing the substrate 30.

  When the dividing operation of the substrate 30 starts, the control unit 11 conveys the substrate 30 supported by the support table 201 in the X-axis positive direction as shown in FIG. The end on the side is protruded from the support table 201 by a predetermined amount. Accordingly, the scribe line L1 is positioned above the opening 210. Further, the control unit 11 moves the mounting base 107 and the guide member 105 to position the support unit 101 so that the break bar 103 is positioned directly below the scribe line L1.

  Next, the control unit 11 moves the mounting base 107 in the negative Z-axis direction as shown in FIG. As a result, the suction unit 102 comes into contact with a region on the X axis positive side with respect to the scribe line L1 on the upper surface of the substrate 30. At this time, the boundary on the negative side of the X axis of the suction portion 102 is at a position away from the positive side of the X axis by a predetermined distance with respect to the scribe line L1. Further, the control unit 11 drives the air cylinder 212 to press the pressing member 213 against the upper surface of the substrate 30. Thereby, the X-axis negative side is pressed down from the scribe line L1 on the upper surface of the substrate 30.

  Next, the control unit 11 drives the air cylinder 104 to raise the break bar 103 as shown in FIG. Thereby, the surface of the substrate 30 opposite to the surface on which the scribe line L1 is formed is pushed by the break bar 103, and stress is applied to the substrate 30 in the direction in which the scribe line L1 opens. Due to this stress, the first substrate 30a on the upper side of the substrate 30 is folded at the position of the scribe line L1. As a result, the end material portion 31 is separated from the substrate 30. The pressing position of the break bar 103 does not necessarily have to be a position directly below the scribe line L1, and may be slightly shifted from a position immediately below the scribe line L1 as long as a stress that breaks the first substrate 30a can be applied.

  Next, the control unit 11 controls the suction unit 13 to set the lower surface of the suction unit 102 to a negative pressure. Thereby, the end material part 31 is adsorbed by the adsorbing part 102. Further, as shown in FIG. 7B, the control unit 11 lowers the break bar 103 and retracts the break bar 103 from the substrate 30.

  Thereafter, as shown in FIG. 8A, the control unit 11 moves the guide member 105 in the X-axis positive direction while moving the mounting base 107 in the Z-axis positive direction, and moves the support unit 101 obliquely upward. Move to. As a result, the suction portion 102 installed in the support portion 101 moves in an oblique direction away from both the scribe line L1 and the surface of the second substrate 30b on the first substrate 30a side, and the end material portion 31 is separated from the substrate 30. It is. Thereafter, the control unit 11 cancels the suction of the suction unit 102. At this time, the control unit 11 may set the lower surface of the adsorption unit 102 to a positive pressure. Thereby, the end material part 31 leaves | separates from the lower surface of the adsorption | suction part 102, and falls. The dropped end material part 31 falls further downward through an opening 101d formed in the support part 101, and is collected in a collection box (not shown).

  After the end material portion 31 is removed in this way, the control unit 11 conveys the substrate 30 supported by the support table 201 in the X-axis positive direction as shown in FIG. The end on the X axis positive side is jumped out of the support table 201 by a predetermined amount. As a result, the scribe line L2 is positioned above the opening 210. In addition, the control unit 11 moves the mounting base 107 and the guide member 105 to position the support unit 101 so that the break bar 103 is positioned directly below the scribe line L2.

  Next, the control unit 11 moves the mounting base 107 in the negative Z-axis direction as shown in FIG. As a result, the suction unit 102 comes into contact with a region on the X axis positive side with respect to the scribe line L2 on the upper surface of the substrate 30. At this time, the boundary on the negative side of the X axis of the suction portion 102 is at a position away from the positive side of the X axis by a predetermined distance with respect to the scribe line L2. Further, the control unit 11 drives the air cylinder 212 to press the pressing member 213 against the upper surface of the substrate 30. Thereby, the X-axis negative side is pressed down from the scribe line L2 on the upper surface of the substrate 30.

  Further, the control unit 11 drives the air cylinder 104 to raise the break bar 103. Thereby, the surface of the substrate 30 opposite to the surface on which the scribe line L2 is formed is pushed by the break bar 103, and stress is applied to the substrate 30 in the direction in which the scribe line L2 opens. Due to this stress, both the first substrate 30a and the second substrate 30b constituting the substrate 30 are folded at the position of the scribe line L2. Thereby, the substrate unit 32 is separated from the substrate 30. Also in this case, the pressing position of the break bar 103 does not necessarily have to be directly below the scribe line L2. If a stress that breaks both the first substrate 30a and the second substrate 30b can be applied, the break bar 103 is not directly below the scribe line L2. It may be slightly deviated from the position.

  Thereafter, the control unit 11 lowers the break bar 103 and retracts the break bar 103 from the substrate 30 as shown in FIG. Further, the control unit 11 moves the support member 101 obliquely upward by moving the guide member 105 in the X-axis positive direction while moving the mounting base 107 in the Z-axis positive direction. Along with this, the suction portion 102 moves obliquely upward. At this time, the control unit 11 does not set the suction unit 102 to the suction state. Or the control part 11 may set the lower surface of the adsorption | suction part 102 to a positive pressure. Thereby, the board | substrate unit 32 does not move with the adsorption | suction part 102, but remains on the upper surface of the support frame 209 like FIG.9 (b).

  Thereafter, the control unit 11 causes the suction conveyance unit 40, which is separately arranged, to adsorb the upper surface of the substrate unit 32, lifts the substrate unit 32 with the suction conveyance unit 40, and removes the substrate unit 32 for a predetermined separation process. Transport to installation position. After the substrate unit 32 is thus transported, the control unit 11 returns the cutting device 10 and the scribe device 20 to the state shown in FIG. 6A, and performs the operations shown in FIGS. 6B to 9B. repeat. Thereby, the board | substrate unit 32 is cut out sequentially.

<Effect of embodiment>
According to this embodiment, the following effects are produced.
As shown in FIG. 8A, the end material portion 31 divided by the break bar 103 is pulled and removed in a direction away from the second substrate 30b as the suction portion 102 moves. Therefore, the end material part 31 can be reliably removed from the substrate 30.

  In addition, the suction unit 102 and the break bar 103 are supported by the support unit 101 with the substrate 30 interposed therebetween, and are configured to move integrally with the movement of the support unit 101. For this reason, when the break bar 103 is positioned at a position corresponding to the scribe line L <b> 1 for dividing the end material portion 31, the suction portion 102 is positioned above the end material portion 31, i.e., a position where the end material portion 31 is sucked. It is done. Therefore, the end material part 31 can be divided and removed efficiently with a simple configuration.

  Further, the suction unit 102 starts moving at least in a direction perpendicular to the surface of the second substrate 30b on the first substrate 30a side when the end member 31 is pulled away from the substrate 30. The end material portion 31 is quickly separated from the second substrate 30b. For this reason, the surface of the end member 31 on the second substrate 30b side does not rub against the surface of the second substrate 30b, and it is possible to avoid scratching the surface of the second substrate 30b due to the rub.

  In particular, in the present embodiment, as shown in FIG. 8A, the suction unit 102 starts to move in an obliquely upward direction away from both the scribe line L1 and the surface of the second substrate 30b on the first substrate 30a side. Therefore, the separation end surface on the scribe line L1 side of the end material portion 31 is quickly separated from the separation end surface on the scribe line L1 side of the first substrate 30a. For this reason, when the end material part 31 is removed, these separation end faces do not contact each other. Therefore, the separation end surface on the first substrate 30a side is not damaged, and the end surface strength on the first substrate 30a side can be kept high.

  In the present embodiment, in the state where the substrate 30 is supported on the support table 201 so that the first substrate 30a is on the upper side in the vertical direction with respect to the second substrate 30b, the break bar 103 is connected to the second substrate 30b. Since the dividing device 10 is configured to press the lower surface from the lower side in the vertical direction, the divided end material portion 31 is easily left on the upper surface of the second substrate 30b without dropping off due to gravity. However, even in such a configuration, as described above, since the end material portion 31 is pulled and removed by the adsorption portion 102, the end material portion 31 that is likely to remain on the upper surface of the second substrate 30b is surely removed. Can do.

<Example of change>
Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made to the embodiment of the present invention other than the above.
For example, in the above-described embodiment, in the state where the substrate 30 is supported by the support table 201 so that the first substrate 30a is on the upper side in the vertical direction with respect to the second substrate 30b, the break bar 103 is connected to the second substrate 30b. Although the dividing device 10 is configured to press the lower surface from below in the vertical direction, the configuration of the dividing device 10 is not limited to this. For example, in a state where the substrate 30 is supported by the support table 201 so that the first substrate 30a is on the lower side in the vertical direction with respect to the second substrate 30b, the break bar 103 causes the upper surface of the second substrate 30b to move in the vertical direction. The cutting device 10 may be configured to press from below.

  Moreover, in the said embodiment, although the adsorption | suction part 102 moved to diagonally upward direction and it was the structure which removes the end material part 31 away from the board | substrate 30, it is the structure of the adsorption part 102 at the time of removing the end material part 31. The moving process is not limited to this. For example, after the suction unit 102 is moved upward (Z-axis positive direction) and the lower surface of the end member 31 is separated from the upper surface of the second substrate 30b, the suction unit 102 is moved in the horizontal direction (X-axis positive direction). The end material portion 31 may be moved away from the substrate 30.

  Moreover, in the said embodiment, although the adsorption | suction part 102 and the break bar 103 moved integrally with the movement of the support part 101, the adsorption | suction part 102 and the break bar 103 may move independently of each other.

  In the above embodiment, as shown in FIG. 9B, the substrate unit 32 remaining on the upper surface of the support frame 209 is transported to another place by the suction transport unit 40, but the suction unit 102 is used. The substrate unit 32 may be transported. For example, as shown in FIG. 10A, a belt conveyor 41 that conveys the substrate unit 32 in the Y-axis direction is arranged on the X-axis positive side of the support frame 209, and the substrate is placed on the belt conveyor 41 by the suction unit 102. You may comprise so that the unit 32 may be conveyed.

  In this case, as shown in FIG. 10A, after the substrate unit 32 is divided by the break bar 103, the adsorption unit 102 is operated to adsorb the substrate unit 32 to the adsorption unit 102. Then, as illustrated in FIG. 10B, the support unit 101 is moved obliquely upward, and the substrate unit 32 is moved together with the suction unit 102 to the upper side of the belt conveyor 41. Thereafter, the support unit 101 is lowered, the lower surface of the substrate unit 32 is brought closer to the upper surface of the belt conveyor 41, and the adsorption of the adsorption unit 102 is released. As a result, the substrate unit 32 is placed on the belt conveyor 41. Thus, the substrate unit 32 can be transported to another place with a simpler configuration.

  Moreover, in the said embodiment, although the scribe apparatus 20 was arrange | positioned in the upstream of the cutting apparatus 10, the board | substrate 30 with which the table corresponding to the support table 201 is arrange | positioned at the cutting apparatus 10 side, and the scribe lines L1 and L2 were formed. However, the structure installed in this table by the conveying apparatus provided separately or by the hand may be sufficient.

  In addition, it should be understood that the layout of the support table 201, the support frame 209, the suction unit 102, and the break bar 103 shown in the above embodiment is a schematic diagram for explaining the configuration and operation of the cutting apparatus 10 to the last. is there. According to the technical idea of the present invention, the configuration and layout of each part of the cutting apparatus 10 can appropriately cut the end material part 31 and the substrate unit 32 along the scribe line L1, and the end material part 31 and the board unit 32 are appropriately The structure and the layout can be adjusted as appropriate so that they can be conveyed.

  In addition, the embodiment of the present invention can be variously modified as appropriate within the scope of the technical idea shown in the claims.

10 Cutting device 30 Substrate 30a First substrate 30b Second substrate 31 End material portion 101 Support portion 102 Adsorption portion 103 Break bar (pressing portion)
104 Air cylinder (pressing part)
105 Guide member (movement mechanism)
106 rail (movement mechanism)
107 Mounting base (moving mechanism)
108 Motor (movement mechanism)
109 Slider (movement mechanism)
110 Prop (movement mechanism)
111 Screw receiver (moving mechanism)
112 Ball screw (movement mechanism)

Claims (6)

A cutting apparatus for cutting and removing the end material portion along the scribe line from a substrate formed by bonding a first substrate on which a scribe line defining the end material portion is formed and a second substrate. Because
An abutting portion that abuts the end material portion before dividing and adsorbs the end material portion after dividing,
A pressing member that contacts the surface of the first substrate on the opposite side of the end material portion across the scribe line;
With the suction portion and the pressing member both in contact with the first substrate, the first substrate is pressed by pressing a position corresponding to the scribe line on the surface of the second substrate opposite to the first substrate. A pressing portion for cutting along the scribe line;
A moving mechanism for moving the suction part in a direction away from the second substrate,
A cutting device characterized by that. The cutting device according to claim 1,
The suction part and the pressing part are moved together by the moving mechanism,
A cutting device characterized by that. The cutting apparatus according to claim 2,
The adsorption part and the pressing part are supported by a support part so as to sandwich the substrate,
The support is moved by the moving mechanism;
A cutting device characterized by that. The cutting apparatus according to any one of claims 1 to 3,
The moving mechanism starts the movement of the suction unit at least in a direction perpendicular to the surface of the second substrate on the first substrate side;
A cutting device characterized by that. The cutting device according to claim 4, wherein
The moving mechanism starts the movement of the suction unit in an oblique direction away from both the scribe line and the first substrate side surface of the second substrate.
A cutting device characterized by that. In the cutting device according to any one of claims 1 to 5,
The substrate is supported by a support table such that the first substrate is on the upper side in the vertical direction with respect to the second substrate,
The pressing portion presses the surface of the second substrate from the lower side in the vertical direction.
A cutting device characterized by that.