CN108107617B - Substrate disconnection system - Google Patents
Substrate disconnection system Download PDFInfo
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- CN108107617B CN108107617B CN201710658411.3A CN201710658411A CN108107617B CN 108107617 B CN108107617 B CN 108107617B CN 201710658411 A CN201710658411 A CN 201710658411A CN 108107617 B CN108107617 B CN 108107617B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a substrate breaking system which can omit the checking operation of operators and can improve the operation efficiency after breaking. The substrate breaking system (1) comprises a substrate breaking device (3), a substrate inspection device (5) and a substrate conveying device (11). The substrate cutting device (3) is a device for cutting off the end of the bonded substrate (G). The bonded substrate (G) has a first substrate (G1) on the surface of which a scribe line (S) for cutting off the end member (GL) is formed, and a second substrate (G2) bonded to the back surface of the first substrate (G1). A substrate inspection device (5) inspects the end-removed state of the bonded substrate (G). The substrate conveying device (11) rotates the adsorption parts (47 a-47 d) adsorbing the bonded substrate (G) around the support (41 a) to convey the bonded substrate (G). A substrate breaking device (3) and a substrate inspection device (5) are arranged on the rotation path of the suction parts (47 a-47 d).
Description
Technical Field
The present invention relates to a substrate breaking system, and more particularly, to a substrate breaking system for cutting an end portion from a bonded substrate.
Background
In general, the manufacturing process of a liquid crystal panel includes a breaking process in which a substrate unit, which is a mother substrate of the liquid crystal panel, is cut out from a so-called bonded substrate in which a first substrate and a second substrate are bonded.
For example, a color filter is formed on a first substrate, and a Thin Film Transistor (TFT) for driving liquid crystal and a terminal for external connection are formed on a second substrate. The terminals of the second substrate are connected to an external device, and therefore need to be exposed. Therefore, the breaking step includes a step of breaking the first substrate and the second substrate along the scribe lines to create the outer shape of the substrate unit, and a step of breaking an end portion of the first substrate facing the terminal along the scribe lines to expose the terminal formed on the second substrate (see, for example, patent document 1).
Prior art documents
Patent document
Patent document 1: japanese patent laid-open No. 2003-241173
Disclosure of Invention
Technical problems to be solved by the invention
The substrate unit thus produced is then subjected to a post-treatment process such as polishing and cleaning. In order to smoothly perform the post-processing step, it is necessary to reliably remove the end portion of the first substrate and expose the terminals of the substrate unit in the breaking step. For this reason, the worker needs to check whether the terminals are properly exposed for each substrate unit, and needs to allocate the substrate units to be subjected to the post-processing process based on the check result.
The invention aims to provide a substrate breaking system which can omit the checking operation of an operator and can improve the operation efficiency after breaking.
Means for solving the problems
Next, various modes for solving the problems will be described. These means may be combined arbitrarily as required.
A substrate breaking system according to an aspect of the present invention includes a breaking device, an inspection device, and a conveyance device.
The breaking device is used for cutting off the end of the bonded substrate. The bonded substrate includes a first substrate having a scribe line formed on a front surface thereof for cutting off an end portion, and a second substrate bonded to a back surface of the first substrate.
The inspection device inspects the end portion removal state of the bonded substrate.
The conveying device conveys the bonded substrate by rotating the adsorption part adsorbing the bonded substrate around the support.
A breaking device and an inspection device are arranged on a rotation path of an adsorption part of a conveying device.
In this system, the breaking device cuts off an end portion of the bonded substrate, and then the conveying device conveys the bonded substrate to the inspection device. Then, the inspection device inspects the end portion removed state of the bonded substrate. After the inspection, the transfer device takes out the bonded substrate from the inspection device.
Thus, the inspection operation by the operator can be omitted, and the operation efficiency after disconnection can be improved.
The output device that outputs the substrate subjected to the inspection by the inspection device to the next process may be disposed on the rotation path of the suction portion.
The discarding portion that discards the substrate subjected to the inspection by the inspection apparatus may be disposed on the rotation path of the suction portion.
The disconnecting device, the inspection device, the output device, and the disposal unit may be disposed at equal intervals around the column of the transport device.
Effects of the invention
In the substrate breaking system according to the present invention, the inspection operation by the operator can be omitted, and the operation efficiency after breaking can be improved.
Drawings
Fig. 1 is a schematic plan view of a substrate disconnection system as an embodiment of the present invention.
Fig. 2 is a schematic view of a substrate breaking apparatus.
Fig. 3 is a schematic perspective view of the substrate transport apparatus.
Fig. 4 is a schematic perspective view of the substrate inspection apparatus.
Fig. 5 is a block diagram showing a control configuration of the substrate disconnection system.
Fig. 6 is a flowchart showing a control operation of the substrate disconnection system.
Fig. 7 is a flowchart showing a control operation of the substrate disconnection system.
Fig. 8 is a flowchart showing a control operation of the substrate disconnection system.
Fig. 9 is a flowchart showing a control operation of the substrate disconnection system.
Fig. 10 is a schematic diagram of a substrate breaking apparatus for explaining a substrate breaking operation.
Fig. 11 is a schematic diagram of a substrate breaking apparatus for explaining a substrate breaking operation.
Fig. 12 is a schematic diagram of a substrate breaking apparatus for explaining a substrate breaking operation.
Fig. 13 is a schematic diagram of a substrate breaking apparatus for explaining a substrate breaking operation.
Fig. 14 is a schematic diagram of a substrate breaking apparatus for explaining a substrate breaking operation.
Fig. 15 is a schematic plan view of a substrate disconnection system for explaining a substrate inspection operation and subsequent processing.
Fig. 16 is a schematic plan view of a substrate disconnection system for explaining a substrate inspection operation and subsequent processing.
Fig. 17 is a schematic plan view of a substrate disconnection system for explaining a substrate inspection operation and subsequent processing.
Fig. 18 is a schematic plan view of a substrate disconnection system for explaining a substrate inspection operation and subsequent processing.
Fig. 19 is a schematic plan view of a substrate disconnection system for explaining a substrate inspection operation and a subsequent process.
Fig. 20 is a schematic plan view of the substrate disconnection system for explaining the substrate inspection operation and the subsequent processing.
Fig. 21 is a schematic plan view of a substrate disconnection system for explaining a substrate inspection operation and a subsequent process.
Fig. 22 is a schematic plan view of a substrate disconnection system for explaining a substrate inspection operation and subsequent processing.
Detailed Description
1. First embodiment
(1) Substrate disconnection system
The substrate breaking system 1 will be described with reference to fig. 1 to 4. Fig. 1 is a schematic plan view of a substrate disconnection system as an embodiment of the present invention. Fig. 2 is a schematic view of a substrate breaking apparatus. Fig. 3 is a schematic perspective view of the substrate transport apparatus. Fig. 4 is a schematic perspective view of the substrate inspection apparatus.
The substrate separation system 1 is a system that removes and inspects the end member GL located at the end portion of one surface of the bonded substrate G (hereinafter referred to as "substrate G") and further performs the next process according to the inspection result.
The substrate breaking system 1 has a substrate breaking device 3. The substrate breaking device 3 removes the end material GL located at the end of one surface of the substrate G. The substrate cutting device 3 is a cutting device for cutting off an end portion of the bonded substrate. As shown in fig. 2, the substrate G includes a first substrate G1 and a second substrate G2 bonded to the first substrate G1. Here, the scribe line S is formed on the surface of the first substrate G1, and the end member GL is removed along the scribe line S.
The substrate disconnection system 1 includes a substrate inspection device 5. The substrate inspection apparatus 5 is an apparatus for inspecting the end portion removed state of the substrate G from which the end member GL is removed.
The substrate disconnection system 1 has a substrate output device 7. The substrate output device 7 outputs the substrate G whose inspection result is normal to the next process.
The substrate disconnection system 1 includes a substrate discarding part 9. The substrate discarding part 9 is a place where the substrate G having a defective inspection result and not being cut again is discarded.
The substrate disconnection system 1 includes a substrate conveyance device 11. The substrate transport device 11 transports the substrate G among the substrate breaking device 3, the substrate inspection device 5, and the substrate discharge device 7.
(2) Substrate breaking device
The substrate breaking apparatus 3 will be described with reference to fig. 2. The substrate breaking apparatus 3 includes a plurality of heads 21 and a table 22.
The plurality of heads 21 are arranged in the direction perpendicular to the drawing sheet of fig. 2 and supported by a support mechanism such as a stand not shown. Each head 21 is vertically movable by a drive mechanism M1, and includes a pressing portion 21a and an adsorbing portion 21b. The substrate G is placed on the stage 22 so that the first substrate G1 is positioned above. The substrate G is disposed such that the end member GL is positioned outside the end surface of the table 22, i.e., such that the mounting surface of the table 22 is not present below the end member GL. The table 22 can be moved in the left-right direction of fig. 2 by a drive mechanism M2 including a drive motor, a guide mechanism, and the like.
The pressing portion 21a of the head portion 21 presses the end member GL against the substrate G from the first substrate G1 side. Thereby, the end member GL is broken along the scribe line S.
The suction portion 21b is disposed on a side of the pressing portion 21a (a side along the moving direction of the table 22). The suction unit 21b is formed of a porous material, and is connected to the vacuum pump P via a passage or the like provided inside the head 21 and an external pipe 23.
The lower surface of the pressing portion 21a is a pressing surface that is pressed downward while being in contact with the end member GL. The lower surface of the suction portion 21b is formed to protrude downward (toward the first substrate G1) from the pressing surface, and serves as a suction surface for sucking the terminal member GL.
(3) Substrate inspection device
The substrate inspection apparatus 5 will be described with reference to fig. 3. The substrate inspection apparatus 5 includes an inspection section conveyor 27 (an example of a conveying section). The inspection section conveyor 27 is a belt conveyor. The inspection section conveyor 27 moves the substrate G thereon between a loading position 27a and an inspection position 27b. The mounting position 27a and the inspection position 27b are arranged in the left-right direction in fig. 1, but the direction is not particularly limited.
The substrate inspection apparatus 5 includes an inspection unit 29. The inspection unit 29 has a door 31 that spans the inspection position 27b, and a displacement sensor 33 provided movably in the longitudinal direction below a crossbar 31a of the door 31. The displacement sensor 33 measures the height of the surface of the substrate G based on the reflected light by irradiating the substrate G with laser light, for example. The displacement sensor 33 is moved along the crossbar 31a of the door 31 by a linear movement mechanism 35 (fig. 5).
As described above, when the substrate G is supplied to the mounting position 27a, the inspection portion conveyor 27 conveys the substrate G from the mounting position 27a to the inspection portion 29. Once the inspection is completed, the inspection portion conveyor 27 conveys the substrate G from the inspection portion 29 to the placement position 27a.
(4) Substrate output device
As shown in fig. 1, the substrate discharge device 7 has a discharge conveyor 37. The output conveyor 37 is a belt conveyor.
The carry-out conveyor 37 moves the substrate G thereon between a loading position 37a and a carrying-out position 37 b.
(5) Substrate discarding part
As shown in fig. 1, the substrate disposal unit 9 includes a disposal box 39. The waste bin 39 has an opening that opens to the upper side.
(6) Substrate conveying device
The substrate transport apparatus 11 will be described with reference to fig. 1 and 4. The substrate transport apparatus 11 includes a rotating unit 41. The rotating portion 41 includes a support column 41a extending in the vertical direction and four arm portions 41b extending in the horizontal direction from the upper end of the support column 41 a. The four arm portions 41b are arranged at 90-degree intervals in a plan view. The support 41a is rotatable about a vertical axis by a drive motor 43 (fig. 5), and the support 41a is a rotation axis. In this way, the substrate transport apparatus 11 has the drive motor 43 as a single drive source, and therefore is simple in structure and easy to control.
The substrate transport apparatus 11 includes a first holding device 45a, a second holding device 45b, a third holding device 45c, and a fourth holding device 45d, which are attached to the lower portion of the front end of the arm portion 41b. The first to fourth holding devices 45a to 45d respectively include: a first adsorption part 47a, a second adsorption part 47b, a third adsorption part 47c, and a fourth adsorption part 47d having openings facing downward; and a first ascending/descending unit 49a, a second ascending/descending unit 49b, a third ascending/descending unit 49c, and a fourth ascending/descending unit 49d that support the first to fourth suction units 47a to 47d so as to be vertically movable, respectively. The first to fourth adsorption portions 47a to 47d are connected to a vacuum pump not shown. The first to fourth elevating sections 49a to 49d are, for example, air cylinders.
Note that, in fig. 4, the third suction portion 47c is shown at the raised position by a solid line and at the machining position by a broken line.
As shown in fig. 1, the substrate breaking device 3, the substrate inspection device 5, the substrate discharge device 7, and the substrate discarding section 9 are disposed around a support column 41a of the rotating section 41 of the substrate conveying device 11. Specifically, the devices are arranged at 90-degree intervals in this order.
The first to fourth holding devices 45a to 45d, which are the tips of the arm portion 41b of the rotating portion 41, can be positioned above the substrate breaking device 3, the substrate inspection device 5, the substrate discharge device 7, and the substrate discarding portion 9.
In the first to fourth holding devices 45a to 45d, the first to fourth suction portions 47a to 47d can be lowered by the first to fourth ascending and descending portions 49a to 49d, respectively, and then the substrate G positioned in the substrate breaking device 3, the substrate inspection device 5, or the substrate carrying-out device 7 is sucked or released from the suction by the first to fourth suction portions 47a to 47d, and then the first to fourth suction portions 47a to 47d are raised.
(7) Control structure of substrate breaking system
The control structure of the substrate separation system 1 will be described with reference to fig. 5. Fig. 5 is a block diagram showing a control configuration of the substrate disconnection system.
The substrate disconnection system 1 has a controller 81. The controller 81 is a computer system having a processor (e.g., CPU), a storage device (e.g., ROM, RAM, HDD, SSD, etc.), and various interfaces (e.g., a/D converter, D/a converter, communication interface, etc.). The controller 81 executes a program stored in a storage unit (corresponding to a part or all of a storage area of the storage device) to perform various control operations.
The controller 81 may be constituted by a single processor, or may be constituted by a plurality of processors provided independently for the respective controls.
A part or all of the functions of the respective components of the controller 81 may be implemented as a program executable by a computer system constituting the controller 81. Further, a part of the functions of each constituent part of the controller 81 may be configured by a custom IC.
The controller 81 is connected to the inspection unit conveyor 27, the linear motion mechanism 35, the drive motor 43, the first to fourth suction units 47a to 47d, and the first to fourth raising/lowering units 49a to 49d. The controller 81 sends control signals to these devices to perform control.
The controller 81 is connected to a displacement sensor 33. The controller 81 receives the detection signal from the displacement sensor 33, and determines the state of the substrate G and the subsequent processing based on the detection signal.
Although not shown, a sensor for detecting the size, shape, and position of the substrate G, a sensor and a switch for detecting the state of each device, and an information input device are connected to the controller 81.
(8) Basic operation of substrate breaking system
The basic operation of the substrate separation system 1 will be described with reference to fig. 6 to 22. Fig. 6 to 9 are flowcharts showing control operations of the substrate disconnection system. Fig. 10 to 14 are schematic diagrams of the substrate breaking device for explaining the substrate breaking operation. Fig. 15 to 22 are schematic plan views of the substrate disconnection system for explaining the substrate inspection operation and the subsequent processing.
The control flow described below is merely an example, and each step may be omitted or replaced as necessary. Further, a plurality of steps may be performed simultaneously, or a part or all of them may be performed in an overlapping manner.
Furthermore, each block of the control flow is not limited to a single control operation, and may be replaced with a plurality of control operations expressed by a plurality of blocks.
Before the following breaking operation, the substrate G is prepared, and the scribe lines S are formed on the surface of the first substrate G1 (the surface to which the second substrate G2 is not bonded) by a scribe line forming apparatus (not shown).
In step S1, the substrate G is placed on the substrate breaking device 3.
Specifically, the substrate G is placed on the placement surface of the table 22. More specifically, as shown in fig. 2, the substrate G is disposed such that the first substrate G1 having the scribe lines S formed on the surface thereof is positioned above the substrate G, and the scribe lines S and the end portions (portions to be end members) GL are positioned outside the mounting surface of the table 22. Further, the end member GL is arranged so as to be positioned directly below the pressing portion 21a of the head portion 21 and to be displaced from the suction portion 21b (when the head portion 21 is lowered, the suction portion 21b does not contact the end member GL).
In step S2, the substrate breaking device 3 performs a breaking operation.
Specifically, as shown in fig. 10, the controller 81 lowers the head 21 and presses the end member GL downward with the pressing portion 21 a. At this time, since there is no mounting surface of the table 22 below the end member GL, the pressing portion 21a presses the end member GL portion, so that a crack is formed on the first substrate G1 starting from the scribe line S, and the end member GL is completely cut (full cut).
Next, as shown in fig. 11, the controller 81 raises the head 21 and further moves the table 22 leftward in fig. 11. At this time, the table 22 is moved so that the suction portion 21b of the head 21 is positioned directly above the end member GL.
Next, as shown in fig. 12, the controller 81 lowers the head 21 to bring the suction portion 21b into contact with the end member GL. Thereby, the end member GL is adsorbed and held by the adsorbing portion 21b. In this state, as shown in fig. 13, the head 21 is raised. Thereby, the end member GL is cut off from the first substrate G1. Thereafter, as shown in fig. 14, the controller 81 retracts the table 22 (moves rightward in the figure) to retract the substrate G from below the head 21. Then, if the adsorption portion 21b releases the adsorption, the end member GL falls to the end member storage place.
Next, the operation of the substrate transport apparatus 11 to transport the substrate G from the substrate breaking apparatus 3 to the substrate inspection apparatus will be described with reference to steps S3 to S5.
In step S3, the first suction portion 47a of the first holding device 45a performs the descending/suction/ascending operation. At this time, as shown in fig. 15, the first holding device 45a is positioned above the substrate G. Specifically, the controller 81 drives the first elevating unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to suck the substrate G to the first suction unit 47a, and drives the first elevating unit 49a to raise the first suction unit 47 a. As a result, the substrate G is sucked up from the table 22 of the substrate breaking device 3.
In step S4, the rotating portion 41 of the substrate transport apparatus 11 rotates by 90 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating portion 41 by 90 degrees clockwise in the drawing. As a result, as shown in fig. 16, the substrate G is positioned above the placement position 27a of the inspection section conveyor 27 of the substrate inspection apparatus 5.
In step S5, the first adsorption part 47a of the first holding device 45a performs the lowering/releasing/raising operation. Specifically, the controller 81 drives the first ascending/descending unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to desorb the substrate G from the first suction unit 47a, and drives the first ascending/descending unit 49a to ascend the first suction unit 47 a. As a result, as shown in fig. 3 and 16, the substrate G is placed at the placement position 27a of the inspection unit conveyor 27 of the substrate inspection apparatus 5.
In step S6, the inspection section conveyor 27 moves the substrate G to the inspection position 27b. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-described operation. As a result, as shown in fig. 3 and 17, the substrate G is placed at the inspection position 27b of the inspection section conveyor 27.
In step S7, the displacement sensor 33 detects the off state. Specifically, the controller 81 drives the linear motion mechanism 35 to receive the detection signal from the displacement sensor 33 while moving the displacement sensor 33 along the crossbar 31 a. At this time, the displacement sensor 33 detects the distance between the non-processed portion and the end material removing portion of the substrate G. Thus, height information of the end material removing portion is obtained.
In step S8, the controller 81 determines whether the off state is normal. If yes, the process proceeds to step S10 (fig. 7), and if no, the process proceeds to step S9.
In step S9, the controller 81 determines whether or not to perform the re-disconnection. If yes, the process proceeds to step S15 (fig. 8), and if no, the process proceeds to step S19 (fig. 9).
Next, the operation in the case where the substrate is normally disconnected, which is yes in step S8, will be described with reference to steps S10 to S14 in fig. 7.
In step S10, the inspection portion conveyor 27 moves the substrate G to the mounting position 27a. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-described operation. As a result, as shown in fig. 18, the substrate G is placed at the placement position 27a.
Next, the operation of the substrate transport apparatus 11 to transport the substrate G from the substrate inspection apparatus 5 to the substrate carry-out apparatus 7 will be described with reference to steps S11 to S13.
In step S11, the first suction portion 47a of the first holding device 45a performs the lowering/suction/raising operation. Specifically, the controller 81 drives the first elevating unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to suck the substrate G to the first suction unit 47a, and drives the first elevating unit 49a to raise the first suction unit 47 a. As a result, the substrate G is sucked up from the substrate inspection apparatus 5.
In step S12, the rotating portion 41 rotates by 90 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating portion 41 by 90 degrees clockwise in the drawing. As a result, as shown in fig. 19, the substrate G is positioned above the placement position 37a of the carry-out conveyor 37 of the substrate carrying-out apparatus 7.
In step S13, the first adsorption part 47a of the first holding device 45a performs the lowering/releasing/raising operation. Specifically, the controller 81 drives the first elevating unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to desorb the substrate G from the first suction unit 47a, and drives the first elevating unit 49a to raise the first suction unit 47 a. As a result, as shown in fig. 19, the substrate G is placed at the placement position 37a of the output conveyor 37 of the substrate output device 7.
In step S14, the output conveyor 37 conveys the substrate G. Specifically, the controller 81 drives the output conveyor 37 to execute the above-described operation. As a result, as shown in fig. 20, the substrate G moves to the output position 37b side.
After that, the process returns to step S1. In this case, the next substrate holding operation is performed by the third holding device 45 c. It should be noted that since the third holding device 45c is already disposed above the substrate breaking device 3, the rotation portion 41 does not need to be rotated.
As described above, the substrate breaking device 3 cuts the end member GL of the bonded substrate G, and the substrate transport device 11 transports the substrate G to the substrate inspection device 5. Next, the substrate inspection apparatus 5 inspects the end portion removed state of the substrate G. After the inspection, the substrate transport apparatus 11 takes out the substrate G from the substrate inspection apparatus 5. Thus, the inspection operation by the operator can be omitted, and the operation efficiency after disconnection can be improved.
Next, the case where the operation is "yes" in step S9, that is, the case where the operation is turned off again will be described with reference to steps S15 to S18 in fig. 8.
In step S15, the inspection portion conveyor 27 moves the substrate G to the mounting position 27a. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-described operation. As a result, as shown in fig. 18, the substrate G is placed at the placement position 27a.
Next, the operation of the substrate transport apparatus 11 to transport the substrate G from the substrate inspection apparatus 5 to the substrate breaking apparatus 3 will be described with reference to steps S16 to S18.
In step S16, the first suction portion 47a of the first holding device 45a performs the descending/suction/ascending operation. Specifically, the controller 81 drives the first ascending/descending unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to suck the substrate G to the first suction unit 47a, and drives the first ascending/descending unit 49a to ascend the first suction unit 47 a. As a result, the substrate G is sucked up from the substrate inspection apparatus 5.
In step S17, the rotating portion 41 rotates 270 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating portion 270 degrees clockwise in the drawing. As a result, as shown in fig. 19, the substrate G is positioned above the placement position 37a of the carry-out conveyor 37 of the substrate carrying-out apparatus 7.
In step S18, the first suction portion 47a of the first holding device 45a performs the lowering/releasing/raising operation. Specifically, the controller 81 drives the first elevating unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to desorb the substrate G from the first suction unit 47a, and drives the first elevating unit 49a to raise the first suction unit 47 a. As a result, as shown in fig. 21, the substrate G is placed on the table 22 of the substrate breaking device 3.
After that, the process returns to step S2. In this case, the first holding device 45a performs the next substrate holding operation. It should be noted that since the first holding device 45a is already disposed above the substrate breaking device 3, the rotation portion 41 does not need to be rotated.
As described above, the substrate transport apparatus 11 transports the substrate G from the substrate inspection apparatus 5 to the substrate breaking apparatus 3. Therefore, the substrate G determined to be defective by the substrate inspection device 5 is returned to the substrate disconnecting device 3, and then the end member GL is cut again.
Next, a case where the disconnection is not performed again, which is no in step S9, will be described with reference to steps S19 to S22 in fig. 9.
In step S19, the inspection portion conveyor 27 moves the substrate G to the placement position. Specifically, the controller 81 drives the inspection unit conveyor 27 to execute the above-described operation. As a result, as shown in fig. 18, the substrate G is placed at the placement position 27a.
Next, the operation of the substrate transport device 11 to transport the substrate G from the substrate inspection device 5 to the substrate disposal unit 9 will be described with reference to steps S20 to S22.
In step S20, the first suction portion 47a of the first holding device 45a performs the descending/suction/ascending operation. Specifically, the controller 81 drives the first elevating unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to suck the substrate G to the first suction unit 47a, and drives the first elevating unit 49a to raise the first suction unit 47 a. As a result, the substrate G is sucked up from the substrate inspection apparatus 5.
In step S21, the rotating portion 41 rotates 180 degrees. Specifically, the controller 81 drives the drive motor 43 to rotate the rotating portion 180 degrees clockwise in the drawing. As a result, as shown in fig. 22, the substrate G is positioned above the waste box 39 of the substrate waste unit 9.
In step S22, the first adsorption part 47a of the first holding device 45a performs the lowering/releasing/raising operation. Specifically, the controller 81 drives the first ascending/descending unit 49a to lower the first suction unit 47a, drives the first suction unit 47a to desorb the substrate G from the first suction unit 47a, and drives the first ascending/descending unit 49a to ascend the first suction unit 47 a. As a result, as shown in fig. 22, the substrate G is discarded in the discard box 39 of the substrate discard unit 9.
After that, the process returns to step S1. In this case, the second holding device 45b performs the next substrate holding operation. It should be noted that since the second holding device 45b is already disposed above the substrate breaking device 3, the rotation portion 41 does not need to be rotated.
2. Other embodiments
While one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification may be arbitrarily combined as needed.
(1) The number of the arm portions of the substrate transport apparatus is not limited to four. The number of the arm portions may be one to three or five or more.
(2) The rotation direction of the rotating portion of the substrate transport apparatus is not limited to the clockwise direction in the drawing. The direction may be counterclockwise in the drawing, or a combination of clockwise and counterclockwise directions may be appropriate.
(3) The angle between the devices disposed around the substrate transport apparatus is not limited to the above embodiment.
(4) In the above embodiment, it is determined whether to return the substrate G to the substrate breaking device 3 or to discard the substrate G after the inspection, but this determination may not be performed. In this case, the substrate G having a defective cut state is returned to the substrate cutting device 3 or discarded without fail.
(5) The shape and the conveyance structure of the substrate conveyance device are not limited to those of the above embodiments. For example, the conveyance between the respective apparatuses may be performed by a plurality of independent conveyance apparatuses.
(6) The substrate holding structure of the substrate transport apparatus is not limited to the above embodiment.
(7) The sensor of the substrate inspection apparatus is not limited to the above embodiment.
Possibility of industrial utilization
The present invention can be widely applied to a substrate breaking system for cutting off an end portion from a bonded substrate.
Description of the reference numerals
1 substrate breaking system 3 substrate breaking device
5 substrate inspection device 7 substrate output device
9 substrate discarding part 11 substrate conveying device
27 inspection part conveyor 27a loading position
31 door 31a crossbar
33 displacement sensor 35 linear motion mechanism
37 output conveyor 37a loading position
41 rotating part 41a support
45a first holding means 45b second holding means
45c third holding device 45d fourth holding device
81 controller G bonding substrate
G1 first substrate G2 second substrate
GL end material
Claims (4)
1. A substrate disconnection system includes:
a cutting device for cutting off an end of a bonded substrate, the bonded substrate having a first substrate and a second substrate, the first substrate having a scribe line formed on a surface thereof for cutting off the end, the second substrate being bonded to a back surface of the first substrate on a side opposite to the surface;
an inspection device that inspects an end-removed state of the bonded substrate, the inspection device having a conveyor that conveys the bonded substrate between a placement position and an inspection position;
a conveying device for conveying the bonded substrate by rotating an adsorbing portion for adsorbing the bonded substrate around an axis; and
a controller that determines whether or not to again break the bonded substrate when a broken state of an end portion of the bonded substrate is not normal, and if so, controls the transport device to transport the bonded substrate to the breaking device,
wherein the disconnecting device and the inspection device are disposed on a rotation path of the suction portion.
2. The substrate disconnect system of claim 1,
the substrate breaking system further includes an output device that outputs the bonded substrate subjected to the inspection by the inspection device to a next process,
wherein the output device is disposed on a rotation path of the adsorption part.
3. The substrate disconnect system of claim 2,
the substrate cutting system further includes a discarding part that discards the bonded substrate inspected by the inspection device,
wherein the disposal unit is disposed on a rotation path of the adsorption unit.
4. The substrate disconnection system of claim 3,
the disconnecting device, the inspection device, the output device, and the disposal unit are disposed at equal intervals around the axis.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2016-228713 | 2016-11-25 | ||
| JP2016228713A JP6829870B2 (en) | 2016-11-25 | 2016-11-25 | Board division system |
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| CN108107617A CN108107617A (en) | 2018-06-01 |
| CN108107617B true CN108107617B (en) | 2023-01-03 |
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| CN201710658411.3A Active CN108107617B (en) | 2016-11-25 | 2017-08-03 | Substrate disconnection system |
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| JP (1) | JP6829870B2 (en) |
| KR (1) | KR102353465B1 (en) |
| CN (1) | CN108107617B (en) |
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| US11920222B2 (en) | 2018-04-24 | 2024-03-05 | Sumitomo Electric Industries, Ltd. | Composite sintered material |
| CN110053089B (en) * | 2019-04-09 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Panel cutting device |
| KR102176872B1 (en) * | 2020-05-07 | 2020-11-10 | 주식회사 탑 엔지니어링 | End material removing device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2018083374A (en) | 2018-05-31 |
| JP6829870B2 (en) | 2021-02-17 |
| KR102353465B1 (en) | 2022-01-21 |
| TWI746589B (en) | 2021-11-21 |
| CN108107617A (en) | 2018-06-01 |
| KR20180059337A (en) | 2018-06-04 |
| TW201832888A (en) | 2018-09-16 |
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