TW202136163A - End material removal apparatus and end material removal method - Google Patents

End material removal apparatus and end material removal method Download PDF

Info

Publication number
TW202136163A
TW202136163A TW109138388A TW109138388A TW202136163A TW 202136163 A TW202136163 A TW 202136163A TW 109138388 A TW109138388 A TW 109138388A TW 109138388 A TW109138388 A TW 109138388A TW 202136163 A TW202136163 A TW 202136163A
Authority
TW
Taiwan
Prior art keywords
sapwood
substrate
suction
inversion
conveying
Prior art date
Application number
TW109138388A
Other languages
Chinese (zh)
Inventor
中田勝喜
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2019228551A priority Critical patent/JP2021095313A/en
Priority to JP2019-228551 priority
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW202136163A publication Critical patent/TW202136163A/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54Article strippers, e.g. for stripping from advancing elements
    • B65H29/56Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products

Abstract

To provide an end material removal apparatus capable of surely removing an end material on the lower side of a bonded substrate. An end material removal apparatus includes a reversal table 5, a first robot arm and a controller. The reversal table 5 including a table adsorber 17 is vertically reversible, and the controller performs steps: facing the adsorption part 17 of the table 5 upward; arranging an end material M2a in the table adsorber 17 of the reversal table 5 in a state of facing a second substrate downward to a conveying device; adsorbing the end material M2a to the table adsorber 17; dividing a main body from the end material M2a by separating a mother from the reversal table 5 by the first robot arm; facing the table adsorber 17 and the end material M2a downward by vertically reversing the table 5; and dropping the end material M2a by releasing the adsorption of the end material M2a by the table adsorber 17.

Description

邊材除去裝置及邊材除去方法Sapwood removing device and sapwood removing method

本發明係關於一種邊材除去裝置,特別是將貼合基板之邊材自本體分離之邊材除去裝置及邊材除去方法。The present invention relates to a sapwood removing device, in particular to a sapwood removing device and a sapwood removing method for separating the sapwood attached to a substrate from the main body.

液晶裝置係由以將液晶層介置於中間之方式藉由密封材料將第1基板與第2基板貼合的貼合基板構成。於此種貼合基板中,於上述基板中之一者(例如第1基板)以圖案形成有彩色濾光片,於另一基板(例如第2基板)形成有TFT(Thin Film Transistor:薄膜電晶體)及連接端子。The liquid crystal device is composed of a bonded substrate in which a first substrate and a second substrate are bonded with a sealing material with a liquid crystal layer interposed therebetween. In this laminated substrate, color filters are patterned on one of the above-mentioned substrates (for example, the first substrate), and TFT (Thin Film Transistor) is formed on the other substrate (for example, the second substrate). Crystal) and connection terminals.

於上述貼合基板中,為與外部之電子機器連接,須使形成於第2基板之連接端子露出。於專利文獻1及專利文獻2,揭示有用以於作為液晶裝置之貼合基板中,使形成有連接端子之面露出(使貼合基板中之一基板之內側面露出)之基板之分離方法。 於專利文獻1所記載之邊材除去裝置,使用鼓風將邊材自製品部分分離除去。 於專利文獻2所記載之基板分斷裝置,使用吸附裝置將邊材自製品部分分離除去。 [先前技術文獻] [專利文獻]In the above-mentioned laminated substrate, in order to connect to an external electronic device, it is necessary to expose the connection terminal formed on the second substrate. Patent Document 1 and Patent Document 2 disclose a method for separating substrates useful in bonding substrates as liquid crystal devices, exposing the surface on which connection terminals are formed (exposing the inner surface of one of the bonded substrates). In the sapwood removing device described in Patent Document 1, the sapwood is separated and removed from the product portion using air blow. In the substrate cutting device described in Patent Document 2, the sapwood is separated and removed from the product portion using an adsorption device. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利特開2019-109292號公報 [專利文獻2]日本專利特開2017-95294號公報[Patent Document 1] Japanese Patent Laid-Open No. 2019-109292 [Patent Document 2] Japanese Patent Laid-Open No. 2017-95294

[發明所欲解決之問題][The problem to be solved by the invention]

然而,先前之裝置中,於貼合基板之邊材位於下側之情形,難以除去邊材。However, in the previous device, it is difficult to remove the sapwood when the sapwood to be bonded to the substrate is located on the lower side.

本發明之目的在於於邊材除去裝置中,確實地除去位於貼合基板之下側之邊材。 [解決問題之技術手段]The object of the present invention is to reliably remove the sapwood located on the lower side of the laminated substrate in the sapwood removing device. [Technical means to solve the problem]

以下,說明複數個態樣作為用以解決問題之手段。該等態樣可根據需要任意組合。Hereinafter, a plurality of aspects will be explained as a means to solve the problem. These aspects can be combined arbitrarily as needed.

本發明之一觀點之邊材除去裝置係用以自具有第1基板、與貼合於第1基板且於表面形成有用以切離邊材之劃線之第2基板的貼合基板之第2基板之本體除去邊材者,且具備反轉台、搬送裝置、及控制部。 反轉台具有吸附部且可上下反轉。 搬送裝置將貼合基板搬送至反轉台。 控制部執行下述步驟。 ◎使反轉台之吸附部朝向上方。 ◎利用搬送裝置以使第2基板朝向下側之狀態將邊材配置於反轉台之吸附部。 ◎使邊材吸附於吸附部。 ◎藉由利用搬送裝置使貼合基板自反轉台離開而將本體自邊材分斷。 ◎藉由使反轉台上下反轉而使吸附部及邊材朝向下方。 ◎藉由使吸附部解除邊材之吸附而使邊材掉落。 於該裝置中,可容易地除去貼合基板之下側之基板之邊材。The sapwood removal device of one aspect of the present invention is used for a second bonded substrate having a first substrate and a second substrate bonded to the first substrate with a scribe line to cut off the sapwood on the surface. The body of the substrate removes sapwood, and is equipped with a reversing table, a conveying device, and a control unit. The reversing table has a suction part and can be reversed up and down. The transfer device transfers the bonded substrate to the inversion table. The control unit executes the following steps. ◎ Make the suction part of the reversal table face upward. ◎The sapwood is placed on the suction part of the reversal table with the second substrate facing down by the conveying device. ◎Adsorb the sapwood to the suction part. ◎The main body is separated from the sapwood by separating the bonded substrate from the reversing table by the conveying device. ◎The suction part and sapwood face downwards by inverting the reversing table up and down. ◎The sapwood can be dropped by removing the adsorption of the sapwood from the suction part. In this device, the sapwood of the substrate attached to the lower side of the substrate can be easily removed.

控制部亦可於使邊材掉落之步驟後,執行利用搬送裝置將貼合基板配置於反轉台上之步驟。 於該裝置中,可利用反轉台載置邊材掉落後之貼合基板。After the step of dropping the sapwood, the control unit may perform the step of arranging the bonded substrate on the inversion table by the conveying device. In this device, the reversal table can be used to place the bonded substrate after the sapwood has fallen.

控制部亦可於使貼合基板自反轉台離開之步驟中,利用搬送裝置使貼合基板自反轉台朝斜上方移動。 於該裝置中,由於作用於貼合基板之本體之露出面的載荷較小,故露出面之精度較高。In the step of separating the bonded substrate from the inversion table, the control unit may use the conveying device to move the bonded substrate from the inversion table obliquely upward. In this device, since the load acting on the exposed surface of the body of the bonded substrate is small, the accuracy of the exposed surface is high.

本發明之邊材除去方法係用以於包含具有吸附部且可上下反轉之反轉台、與將貼合基板搬送至反轉台之搬送裝置的邊材除去裝置中,自具有第1基板、與貼合於第1基板且於表面形成有用以切離邊材之劃線之第2基板的貼合基板之第2基板之本體除去邊材者,且具備下述步驟。 ◎使反轉台之吸附部朝向上方 ◎利用搬送裝置以使第2基板朝向下側之狀態將貼合基板之第2基板之邊材配置於反轉台之吸附部 ◎使邊材吸附於吸附部 ◎藉由利用搬送裝置使貼合基板自反轉台離開而將本體自邊材分斷 ◎藉由使反轉台上下反轉而使吸附部及邊材朝向下方 ◎藉由使吸附部解除邊材之吸附而使邊材掉落 於該方法中,可容易地除去位於貼合基板之第2基板之邊材。The sapwood removal method of the present invention is used in an sapwood removal device including a reversing table with a suction part that can be reversed up and down, and a conveying device for transporting the bonded substrate to the reversing table, with a first substrate , And the body of the second substrate of the bonded substrate bonded to the first substrate and formed on the surface of the second substrate with the scribe line to cut off the sapwood, and the sapwood is removed, and the following steps are provided. ◎ Make the suction part of the reversal table face upward ◎Using the conveying device to place the sapwood of the second substrate of the bonded substrate on the suction part of the inversion table with the second substrate facing down ◎Adsorb the sapwood to the suction part ◎The main body is separated from the sapwood by separating the laminated substrate from the reversing table by the conveying device ◎The suction part and sapwood face downwards by inverting the reversing table up and down ◎The sapwood can be dropped by removing the adsorption of the sapwood from the suction part In this method, the sapwood located on the second substrate of the bonded substrate can be easily removed.

亦可於使邊材掉落之步驟後,進而具備利用搬送裝置將貼合基板配置於反轉台上之步驟。 於該方法中,可利用反轉台載置邊材掉落後之基板。After the step of dropping the sapwood, the step of arranging the laminated substrate on the inversion table by the conveying device may be further provided. In this method, an inversion table can be used to place the substrate after the sapwood has fallen.

亦可於使貼合基板自反轉台離開之步驟中,利用搬送裝置使貼合基板自反轉台朝斜上方移動。 於該方法中,由於作用於貼合基板之本體之露出面的載荷較小,故露出面之精度較高。 [發明之效果]In the step of separating the bonded substrate from the reversing table, the conveying device may be used to move the bonded substrate from the reversing table obliquely upward. In this method, since the load acting on the exposed surface of the body of the bonded substrate is small, the accuracy of the exposed surface is high. [Effects of Invention]

於本發明之邊材除去裝置及邊材除去方法中,可確實地除去貼合基板之第2基板之邊材。In the sapwood removing device and the sapwood removing method of the present invention, the sapwood of the second substrate to which the substrate is bonded can be reliably removed.

1.第1實施形態 (1)邊材除去裝置之構造 使用圖1~圖3說明邊材除去裝置1(邊材除去裝置之一例)之構造。圖1係第1實施形態之邊材除去裝置之模式性立體圖。圖2係反轉機構之模式性立體圖。圖3係邊材除去裝置之模式性側視圖。 圖1及圖2中,基板搬送方向為第1方向(箭頭符號X),與其正交者為第2方向(箭頭符號Y)。1. The first embodiment (1) The structure of the sapwood removal device The structure of the sapwood removing device 1 (an example of the sapwood removing device) will be described using FIGS. 1 to 3. Fig. 1 is a schematic perspective view of the sapwood removing device of the first embodiment. Figure 2 is a schematic perspective view of the reversal mechanism. Figure 3 is a schematic side view of the sapwood removal device. In FIGS. 1 and 2, the substrate conveying direction is the first direction (arrow X), and the direction orthogonal to it is the second direction (arrow Y).

分斷對象為母基板M(貼合基板之一例)。母基板M如圖3所示,為包含2塊基板即第1基板M1(第1基板之一例)與第2基板M2(第2基板之一例)之貼合玻璃。 邊材除去裝置1係用以將母基板M之第2基板M2(第2基板之一例)之本體P2(本體之一例)自邊材M2a(邊材之一例)分斷(即除去邊材M2a)之裝置。The object of separation is the mother substrate M (an example of a bonded substrate). As shown in FIG. 3, the mother substrate M is a laminated glass including two substrates, namely, a first substrate M1 (an example of the first substrate) and a second substrate M2 (an example of the second substrate). The sapwood removal device 1 is used to separate the main body P2 (an example of the main body) of the second substrate M2 (an example of the second substrate) of the mother substrate M from the sapwood M2a (an example of the sapwood) (that is, remove the sapwood M2a). ) Of the device.

邊材除去裝置1具備反轉機構3。反轉機構3具有反轉台5(反轉台之一例)。反轉台5可上下反轉。反轉台5之第1面5a為平坦之面。 反轉機構3具有台吸附裝置17(吸附部之一例)。台吸附裝置17設於反轉台5之第2面5b側,且於反轉台5之側方朝第2方向延伸。於台吸附裝置17設有複數個吸附孔(未圖示)。複數個吸附孔經由通氣道(未圖示)連通於真空泵等之負壓產生裝置35(後述)。The sapwood removing device 1 includes a reversing mechanism 3. The reversing mechanism 3 has a reversing table 5 (an example of the reversing table). The reversing table 5 can be reversed up and down. The first surface 5a of the inversion table 5 is a flat surface. The reversing mechanism 3 has a stage suction device 17 (an example of a suction unit). The stage suction device 17 is provided on the second surface 5b side of the inversion stage 5 and extends in the second direction on the side of the inversion stage 5. The suction device 17 on the stage is provided with a plurality of suction holes (not shown). The plurality of adsorption holes are communicated with a negative pressure generating device 35 (described later) such as a vacuum pump via an air passage (not shown).

反轉機構3具有固定於反轉台5之旋轉軸19、旋轉自如地支持旋轉軸19之支持構造21、及包含馬達等之旋轉驅動裝置37(後述)。 旋轉軸19係沿第2方向延伸設置,且設於反轉台5之兩端部。The reversing mechanism 3 has a rotating shaft 19 fixed to the reversing table 5, a support structure 21 that rotatably supports the rotating shaft 19, and a rotation driving device 37 (described later) including a motor and the like. The rotating shaft 19 extends in the second direction and is provided at both ends of the reversing table 5.

邊材除去裝置1具有第1機械臂7(搬送裝置之一例)。第1機械臂7為多關節機器人,可使第1吸附手9(後述)升降,且向側方移動。第1機械臂7具有包含馬達等之第1臂驅動裝置33(後述)。 邊材除去裝置1具有第1吸附手9(搬送裝置之一例)。第1吸附手9可吸附及搬送母基板M。第1吸附手9安裝於第1機械臂7之前端。The sapwood removing device 1 has a first robot arm 7 (an example of a conveying device). The first robot arm 7 is a multi-joint robot that can move the first suction hand 9 (described later) up and down, and move it sideways. The first robot arm 7 has a first arm driving device 33 (described later) including a motor and the like. The sapwood removing device 1 has a first suction hand 9 (an example of a conveying device). The first suction hand 9 can suction and transport the mother substrate M. The first suction hand 9 is attached to the front end of the first robot arm 7.

第1吸附手9之吸附部本體9a於下側具有水平之吸附面9b,於此處吸附作為加工對象之母基板M。於吸附面9b設有複數個空氣吸附孔(未圖示)。空氣吸附孔經由通氣道(未圖示)連通於負壓產生裝置35。 第1吸附手9將母基板M之第1基板M1吸附固定。The suction part main body 9a of the first suction hand 9 has a horizontal suction surface 9b on the lower side, and suctions the mother substrate M as the processing target there. A plurality of air adsorption holes (not shown) are provided on the adsorption surface 9b. The air adsorption hole communicates with the negative pressure generating device 35 via an air passage (not shown). The first suction hand 9 sucks and fixes the first substrate M1 of the mother substrate M.

邊材除去裝置1具有第2機械臂41。第2機械臂41具有與第1機械臂7相同之功能。第2機械臂41具有包含馬達等之第2臂驅動裝置45(後述)。 邊材除去裝置1具有第2吸附手49。第2吸附手49可吸附及搬送母基板M。第2吸附手49安裝於第2機械臂41之前端。第2吸附手49之空氣吸附孔(未圖示)經由通氣道(未圖示)連通於負壓產生裝置35。The sapwood removing device 1 has a second robot arm 41. The second robot arm 41 has the same function as the first robot arm 7. The second robot arm 41 has a second arm drive device 45 (described later) including a motor and the like. The sapwood removing device 1 has a second suction hand 49. The second suction hand 49 can suction and transport the mother substrate M. The second suction hand 49 is attached to the front end of the second robot arm 41. The air suction hole (not shown) of the second suction hand 49 communicates with the negative pressure generating device 35 via an air passage (not shown).

(2)邊材除去裝置之控制構成 使用圖4說明邊材除去裝置1之控制構成。圖4係顯示邊材除去裝置之控制構成之方塊圖。 邊材除去裝置1具有控制器31。控制器31為具有處理器(例如CPU(Central Processing Unit:中央處理單元))、記憶裝置(例如ROM(Read Only Memory:唯讀記憶體)、RAM(Random Access Memory:隨機存取記憶體)、HDD(Hard Disk Drive:硬碟驅動器)、SSD(Solid State Drive:固態驅動器)等)、及各種介面(例如A/D(Analog/Digital:類比/數位)轉換器、D/A(Digital/Analog:數位/類比)轉換器、通信介面等)之電腦系統。控制器31藉由執行保存於記憶部(對應於記憶裝置之記憶區域之一部分或全部)之程式,來進行各種控制動作。(2) Control structure of sapwood removal device The control structure of the sapwood removing device 1 will be described using FIG. 4. Fig. 4 is a block diagram showing the control structure of the sapwood removing device. The sapwood removing device 1 has a controller 31. The controller 31 has a processor (for example, CPU (Central Processing Unit)), a memory device (for example, ROM (Read Only Memory), RAM (Random Access Memory)), HDD (Hard Disk Drive: hard disk drive), SSD (Solid State Drive: solid state drive, etc.), and various interfaces (such as A/D (Analog/Digital: analog/digital) converter, D/A (Digital/Analog) : Digital/analog) converters, communication interfaces, etc.) computer systems. The controller 31 performs various control actions by executing programs stored in the memory portion (corresponding to part or all of the memory area of the memory device).

控制器31可以單一之處理器構成,但亦可由用於各控制而獨立之複數個處理器構成。 控制器31之各要件之功能之一部分或全部可作為可由構成控制器31之電腦系統執行之程式實現。此外,控制器31之各要件之功能之一部分亦可藉由定製IC(Integrated Circuit:積體電路)構成。The controller 31 may be constituted by a single processor, but may also be constituted by a plurality of independent processors for each control. Part or all of the functions of the various elements of the controller 31 can be implemented as programs that can be executed by the computer system constituting the controller 31. In addition, a part of the functions of each element of the controller 31 can also be formed by a customized IC (Integrated Circuit).

控制器31可控制第1臂驅動裝置33、負壓產生裝置35、旋轉驅動裝置37、及第2臂驅動裝置45。 另,於控制器31,雖未圖示,但連接有檢測基板之大小、形狀及位置之感測器、用以檢測各裝置之狀態之感測器及開關、以及資訊輸入裝置。The controller 31 can control the first arm driving device 33, the negative pressure generating device 35, the rotation driving device 37, and the second arm driving device 45. In addition, although not shown in the figure, the controller 31 is connected with sensors for detecting the size, shape and position of the substrate, sensors and switches for detecting the state of each device, and an information input device.

(3)邊材除去裝置之基板分斷動作 使用圖5~圖13說明邊材除去裝置1之基板分斷動作。圖5係基板分斷動作控制之流程圖。圖6~圖13係顯示基板分斷動作之模式性側視圖。 以下說明之控制流程圖為例示,各步驟可根據需要省略及更換。又,亦可同時執行複數個步驟,或將一部分或全部重疊執行。 再者,控制流程圖之各區塊不限於單一之控制動作,可置換為以複數個區塊表現之複數個控制動作。 另,以下之控制動作藉由控制器31對各種裝置之指令而實現。(3) The substrate breaking action of the sapwood removal device The substrate cutting operation of the sapwood removing device 1 will be described with reference to FIGS. 5 to 13. Figure 5 is a flow chart of the control of the substrate breaking action. Figures 6-13 are schematic side views showing the substrate breaking action. The control flow chart described below is an example, and each step can be omitted and replaced as needed. In addition, multiple steps may be executed at the same time, or some or all of them may be executed overlapped. Furthermore, each block of the control flowchart is not limited to a single control action, and can be replaced with a plurality of control actions represented by a plurality of blocks. In addition, the following control actions are realized by commands from the controller 31 to various devices.

步驟S1中,如圖3所示,將反轉台5反轉而使台吸附裝置17朝向上側。具體而言,藉由控制器31控制旋轉驅動裝置37而執行上述動作。 步驟S2中,第1機械臂7將母基板M搬入反轉台5之區域。具體而言,藉由控制器31控制第1機械臂7而執行上述動作。此時,第2基板M2位於下側,因此,邊材M2a為潛入第1基板M1之端部之下側的狀態。In step S1, as shown in FIG. 3, the inversion table 5 is inverted so that the table suction device 17 faces the upper side. Specifically, the controller 31 controls the rotation driving device 37 to perform the above-mentioned operations. In step S2, the first robot arm 7 carries the mother substrate M into the area of the inversion table 5. Specifically, the controller 31 controls the first robot arm 7 to perform the above-mentioned operations. At this time, the second substrate M2 is located on the lower side, and therefore, the sapwood M2a is in a state of submerging under the end of the first substrate M1.

步驟S3中,如圖6所示,第1機械臂7將母基板M之第2基板M2之邊材M2a抵接於台吸附裝置17。具體而言,藉由控制器31控制第1機械臂7來執行上述動作。 步驟S4中,台吸附裝置17吸附邊材M2a。具體而言,藉由控制器31控制負壓產生裝置35來執行上述動作。In step S3, as shown in FIG. 6, the first robot arm 7 abuts the sapwood M2a of the second substrate M2 of the mother substrate M to the stage suction device 17. Specifically, the controller 31 controls the first robot arm 7 to perform the above-mentioned operations. In step S4, the stage suction device 17 sucks the sapwood M2a. Specifically, the controller 31 controls the negative pressure generating device 35 to perform the above-mentioned actions.

步驟S5中,如圖7所示,第1機械臂7使第1吸附手9離開反轉台5。具體而言,藉由控制器31控制第1機械臂7來執行上述動作。其結果,母基板M之第2基板M2之本體P2被從邊材M2a分斷(即邊材被從基板分離除去)。 該步驟中,第1機械臂7使母基板M自反轉台5朝斜上方移動。因此,作用於母基板M之第1基板M1之露出面的載荷較小,故露出面之精度較高。In step S5, as shown in FIG. 7, the first robot arm 7 moves the first suction hand 9 away from the inversion table 5. Specifically, the controller 31 controls the first robot arm 7 to perform the above-mentioned operations. As a result, the main body P2 of the second substrate M2 of the mother substrate M is separated from the sapwood M2a (that is, the sapwood is separated and removed from the substrate). In this step, the first robot arm 7 moves the mother substrate M from the inversion stage 5 obliquely upward. Therefore, the load acting on the exposed surface of the first substrate M1 of the mother substrate M is small, so the accuracy of the exposed surface is high.

步驟S6中,如圖8所示,藉由使反轉台5上下反轉,而使台吸附裝置17及邊材M2a朝向下方。具體而言,藉由控制器31控制旋轉驅動裝置37來執行上述動作。 步驟S7中,如圖9所示,台吸附裝置17解除邊材M2a之吸附。其結果,邊材M2a掉落。具體而言,藉由控制器31控制負壓產生裝置35來執行上述動作。In step S6, as shown in FIG. 8, by inverting the inverting table 5 up and down, the table suction device 17 and the sapwood M2a are directed downward. Specifically, the controller 31 controls the rotation driving device 37 to perform the above-mentioned actions. In step S7, as shown in FIG. 9, the table suction device 17 releases the suction of the sapwood M2a. As a result, the sapwood M2a falls. Specifically, the controller 31 controls the negative pressure generating device 35 to perform the above-mentioned actions.

步驟S8中,如圖10所示,第1機械臂7將邊材除去完畢之母基板M,配置於反轉台5之第1面5a。具體而言,藉由控制器31控制旋轉驅動裝置37來執行上述動作。如此,可利用反轉台5載置邊材M2a掉落後之母基板M。 步驟S9中,如圖11所示,第1吸附手9解除對母基板M之吸附,進而離開母基板M。具體而言,藉由控制器31控制負壓產生裝置35及第1機械臂7來執行上述動作。In step S8, as shown in FIG. 10, the mother substrate M from which the sapwood has been removed by the first robot arm 7 is placed on the first surface 5a of the inversion table 5. Specifically, the controller 31 controls the rotation driving device 37 to perform the above-mentioned actions. In this way, the mother substrate M after the sapwood M2a has fallen can be placed on the inversion table 5. In step S9, as shown in FIG. 11, the first suction hand 9 releases the suction of the mother substrate M, and then leaves the mother substrate M. Specifically, the controller 31 controls the negative pressure generating device 35 and the first robot arm 7 to perform the above operations.

步驟S10中,如圖12所示,第2機械臂41將第2吸附手49抵接於母基板M。具體而言,藉由控制器31控制第2機械臂41來執行上述動作。 步驟S11中,第2吸附手49吸附母基板M。具體而言,藉由控制器31控制負壓產生裝置35來執行上述動作。 步驟S12中,如圖13所示,第2機械臂41將母基板M自反轉台5之區域搬出。具體而言,藉由控制器31控制第2機械臂41而執行上述動作。In step S10, as shown in FIG. 12, the second robot arm 41 abuts the second suction hand 49 against the mother substrate M. Specifically, the controller 31 controls the second robot arm 41 to perform the above-mentioned operations. In step S11, the second suction hand 49 suctions the mother substrate M. Specifically, the controller 31 controls the negative pressure generating device 35 to perform the above-mentioned actions. In step S12, as shown in FIG. 13, the second robot arm 41 unloads the mother substrate M from the area of the inversion table 5. Specifically, the controller 31 controls the second robot arm 41 to perform the above-mentioned operations.

於該邊材除去裝置1中,可容易地除去母基板M之第2基板M2之邊材M2a。In this sapwood removing apparatus 1, the sapwood M2a of the second substrate M2 of the mother substrate M can be easily removed.

2.其他實施形態 以上說明了本發明之一實施形態,但本發明並非限定於上述實施形態者,可於不脫離發明主旨之範圍內進行各種變更。尤其,本說明書所記載之複數個實施形態及變化例可根據需要進行任意組合。2. Other implementation forms One embodiment of the present invention has been described above, but the present invention is not limited to the above-mentioned embodiment, and various changes can be made without departing from the spirit of the invention. In particular, the plural embodiments and modification examples described in this specification can be combined arbitrarily as needed.

於將2塊脆性材料基板貼合之貼合脆性材料基板,包含將玻璃基板貼合之液晶基板、電漿顯示面板、有機EL(Electro Luminescence:電致發光)顯示面板等之平面顯示面板、與將矽基板、藍寶石基板等貼合於玻璃基板之半導體基板。 基板之種類未特別限定。基板包含單板之玻璃、半導體晶圓、陶瓷基板。 [產業上之可利用性]In the bonded brittle material substrates bonded to two brittle material substrates, including flat display panels such as liquid crystal substrates bonded to glass substrates, plasma display panels, organic EL (Electro Luminescence) display panels, and Bonding silicon substrate, sapphire substrate, etc. to the semiconductor substrate of the glass substrate. The type of substrate is not particularly limited. Substrates include single-plate glass, semiconductor wafers, and ceramic substrates. [Industrial availability]

本發明可廣泛應用於將貼合基板之邊材自本體分離之邊材除去裝置及邊材除去方法。The invention can be widely used in the sapwood removing device and the sapwood removing method for separating the sapwood from the body of the laminated substrate.

1:邊材除去裝置 3:反轉機構 5:反轉台 5a:第1面 5b:第2面 7:第1機械臂 9:第1吸附手 9a:吸附部本體 9b:吸附面 17:台吸附裝置 19:旋轉軸 21:支持構造 31:控制器 33:第1臂驅動裝置 35:負壓產生裝置 37:旋轉驅動裝置 41:第2機械臂 45:第2臂驅動裝置 49:第2吸附手 M:母基板 M1:第1基板 M2:第2基板 M2a:邊材 P2:本體 S1~S12:步驟1: Sapwood removal device 3: Reversal mechanism 5: Reversal stage 5a: side 1 5b: Side 2 7: The first robotic arm 9: The first adsorption hand 9a: Adsorption part body 9b: Adsorption surface 17: Adsorption device 19: Rotation axis 21: Support structure 31: Controller 33: 1st arm drive device 35: Negative pressure generating device 37: Rotary drive device 41: 2nd robotic arm 45: 2nd arm drive device 49: The second adsorption hand M: Mother board M1: The first substrate M2: The second substrate M2a: Sapwood P2: body S1~S12: steps

圖1係第1實施形態之邊材除去裝置之模式性立體圖。 圖2係反轉機構之模式性立體圖。 圖3係邊材除去裝置之模式性側視圖。 圖4係顯示邊材除去裝置之控制構成之方塊圖。 圖5係顯示基板分斷動作之模式性側視圖。 圖6係顯示基板分斷動作之模式性側視圖。 圖7係顯示基板分斷動作之模式性側視圖。 圖8係顯示基板分斷動作之模式性側視圖。 圖9係顯示基板分斷動作之模式性側視圖。 圖10係顯示基板分斷動作之模式性側視圖。 圖11係顯示基板分斷動作之模式性側視圖。 圖12係顯示基板分斷動作之模式性側視圖。 圖13係顯示基板分斷動作之模式性側視圖。Fig. 1 is a schematic perspective view of the sapwood removing device of the first embodiment. Figure 2 is a schematic perspective view of the reversal mechanism. Figure 3 is a schematic side view of the sapwood removal device. Fig. 4 is a block diagram showing the control structure of the sapwood removing device. Fig. 5 is a schematic side view showing the breaking action of the substrate. Fig. 6 is a schematic side view showing the breaking action of the substrate. Fig. 7 is a schematic side view showing the breaking action of the substrate. Fig. 8 is a schematic side view showing the breaking action of the substrate. Fig. 9 is a schematic side view showing the breaking action of the substrate. Fig. 10 is a schematic side view showing the breaking action of the substrate. Fig. 11 is a schematic side view showing the breaking action of the substrate. Fig. 12 is a schematic side view showing the breaking action of the substrate. Fig. 13 is a schematic side view showing the breaking action of the substrate.

5:反轉台 5: Reversal stage

17:台吸附裝置 17: Adsorption device

19:旋轉軸 19: Rotation axis

M2a:邊材 M2a: Sapwood

Claims (6)

一種邊材除去裝置,其係用於自具有第1基板及第2基板的貼合基板之上述第2基板之下述本體除去上述邊材者,該第2基板係貼合於上述第1基板且於表面形成有用於自本體切離邊材之劃線,且包含: 反轉台,其具有吸附部且可上下反轉; 搬送裝置,其將上述貼合基板搬送至上述反轉台;及 控制部,其執行以下步驟:使上述反轉台之上述吸附部朝向上方;利用上述搬送裝置以使上述第2基板朝向下側之姿勢,將上述邊材配置於上述反轉台之上述吸附部;使上述邊材吸附於上述吸附部;藉由利用上述搬送裝置使上述貼合基板離開上述反轉台,而將上述本體自上述邊材分斷;藉由使上述反轉台上下反轉,而使上述吸附部及上述邊材朝向下方;及藉由使上述吸附部解除上述邊材之吸附,而使上述邊材掉落。A sapwood removing device for removing the sapwood from the following body of the second substrate of a bonded substrate having a first substrate and a second substrate, the second substrate being bonded to the first substrate And a scribe line for cutting off the sapwood from the main body is formed on the surface, and includes: Reversing table, which has a suction part and can be reversed up and down; A conveying device that conveys the above-mentioned bonded substrate to the above-mentioned inversion stage; and A control unit that performs the following steps: turn the suction portion of the inversion table upward; use the transport device to position the second substrate toward the lower side, and arrange the sapwood on the suction portion of the inversion table The sapwood is adsorbed to the suction part; the body is separated from the sapwood by using the conveying device to move the bonded substrate away from the inversion table; by inverting the inversion table up and down, The suction part and the sapwood are directed downward; and the sapwood is dropped by releasing the suction of the sapwood by the suction part. 如請求項1之邊材除去裝置,其中上述控制部於使上述邊材掉落之步驟後,執行利用上述搬送裝置將上述貼合基板配置於上述反轉台上之步驟。Such as the sapwood removing device of claim 1, wherein the control unit executes the step of arranging the laminated substrate on the inversion table by the conveying device after the step of dropping the sapwood. 如請求項1或2之邊材除去裝置,其中上述控制部於使上述貼合基板離開上述反轉台之步驟中,利用上述搬送裝置使上述貼合基板自上述反轉台朝斜上方移動。According to the sapwood removal device of claim 1 or 2, wherein the control unit uses the conveying device to move the bonded substrate obliquely upward from the inverting table in the step of separating the bonded substrate from the inverting table. 一種邊材除去方法,其係用於包含具有吸附部且可上下反轉之反轉台、及將貼合基板搬送至上述反轉台之搬送裝置的邊材除去裝置中,自具有第1基板及第2基板的貼合基板之上述第2基板之上述本體除去上述邊材者,該第2基板係貼合於上述第1基板且於表面形成有用於自本體切離邊材之劃線,且包含以下步驟: 使上述反轉台之上述吸附部朝向上方; 利用上述搬送裝置以使上述第2基板朝向下側之狀態,將上述邊材配置於上述反轉台之上述吸附部; 使上述邊材吸附於上述吸附部; 藉由利用上述搬送裝置使上述貼合基板離開上述反轉台,而將上述本體自上述邊材分斷; 藉由使上述反轉台上下反轉,而使上述吸附部及上述邊材朝向下方;及 藉由使上述吸附部解除上述邊材之吸附,而使上述邊材掉落。A method for removing sapwood, which is used in an sapwood removing device including a reversing table with a suction part that can be reversed up and down, and a conveying device that conveys the bonded substrate to the reversing table, and has a first substrate The body of the second substrate of the bonded substrate of the second substrate is removed from the sapwood, and the second substrate is attached to the first substrate and has a scribe line for cutting off the sapwood from the body formed on the surface, And includes the following steps: Make the suction part of the reversal platform face upward; Arranging the sapwood on the suction part of the inversion table by using the conveying device with the second substrate facing downward; Adsorbing the sapwood to the adsorption part; Separating the main body from the sapwood by using the conveying device to separate the bonded substrate from the reversing table; By inverting the above-mentioned inversion table up and down, the above-mentioned suction part and the above-mentioned sapwood are directed downward; and The adsorption of the sapwood is released by the adsorption part, so that the sapwood is dropped. 如請求項4之邊材除去方法,其中於使上述邊材掉落之步驟後,進而具備利用上述搬送裝置將上述貼合基板配置於上述反轉台上之步驟。The method for removing sapwood according to claim 4, wherein after the step of dropping the sapwood, the step of arranging the bonded substrate on the inversion table by the conveying device is further provided. 如請求項4或5之邊材除去方法,其中於使上述貼合基板離開上述反轉台之步驟中,利用上述搬送裝置使上述貼合基板自上述反轉台朝斜上方移動。The method for removing sapwood according to claim 4 or 5, wherein in the step of separating the bonded substrate from the reversing table, the conveying device is used to move the bonded substrate obliquely upward from the reversing table.
TW109138388A 2019-12-18 2020-11-04 End material removal apparatus and end material removal method TW202136163A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019228551A JP2021095313A (en) 2019-12-18 2019-12-18 End material removal apparatus and end material removal method
JP2019-228551 2019-12-18

Publications (1)

Publication Number Publication Date
TW202136163A true TW202136163A (en) 2021-10-01

Family

ID=76344855

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109138388A TW202136163A (en) 2019-12-18 2020-11-04 End material removal apparatus and end material removal method

Country Status (4)

Country Link
JP (1) JP2021095313A (en)
KR (1) KR20210078406A (en)
CN (1) CN112987348A (en)
TW (1) TW202136163A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017095294A (en) 2015-11-20 2017-06-01 三星ダイヤモンド工業株式会社 Substrate cutting device
JP2019109292A (en) 2017-12-15 2019-07-04 三星ダイヤモンド工業株式会社 End material removing device and end material removing method

Also Published As

Publication number Publication date
CN112987348A (en) 2021-06-18
JP2021095313A (en) 2021-06-24
KR20210078406A (en) 2021-06-28

Similar Documents

Publication Publication Date Title
TWI667210B (en) Sap material removing device and method
TW201929625A (en) Device and method for removing end material capable of removing an end material for exposing an inner surface of one of the bonded substrates without damaging the surface to be exposed
TWI746589B (en) Substrate breaking system
JP6287547B2 (en) Inverting device for brittle material substrate
TW202136163A (en) End material removal apparatus and end material removal method
JP6287548B2 (en) End material separating method and end material separating apparatus for brittle material substrate
WO2013058129A1 (en) Separation device, separation system and separation method
JP6474275B2 (en) Processing equipment
JP2007234681A (en) Semiconductor manufacturing apparatus
JP6331656B2 (en) Method and apparatus for conveying brittle material substrate
TW201929079A (en) Substrate cutting apparatus capable of removing end material from the substrate
TW201927507A (en) Substrate overturning device capable of effectively carrying out overturning of a substrate in a relatively small space
TW201930212A (en) Edge material removing device and edge material removing method comprising an adsorption transfer device and an edge material pressing device
JP2021098627A (en) Substrate pickup device and substrate pickup method
KR101274657B1 (en) Robot
JP6325906B2 (en) Submerged wafer isolation method and submerged wafer isolation device
JP7029187B2 (en) Board reversing device and dividing system
JP6631785B2 (en) Method and apparatus for manufacturing glass film laminate
JP7076828B2 (en) Positioning device and positioning transfer system
JP2011095698A (en) Method of cutting off liquid crystal cell mother substrate and automated cutting system of the same
JP2015208937A (en) Breaking device for brittle material substrate
JP2019102584A (en) Substrate suction device
JP2019108234A (en) Pickup device
JP2008177284A (en) Apparatus and method for loading electronic component
JP2004106416A (en) Scribing device