JP5639634B2 - Substrate cutting system - Google Patents

Substrate cutting system Download PDF

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JP5639634B2
JP5639634B2 JP2012270621A JP2012270621A JP5639634B2 JP 5639634 B2 JP5639634 B2 JP 5639634B2 JP 2012270621 A JP2012270621 A JP 2012270621A JP 2012270621 A JP2012270621 A JP 2012270621A JP 5639634 B2 JP5639634 B2 JP 5639634B2
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substrate
strip
scribe
transport
line
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JP2013056830A (en
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生芳 高松
生芳 高松
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三星ダイヤモンド工業株式会社
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Description

  The present invention relates to a substrate cutting system used for processing to cut a bonded substrate using a cutter wheel (also referred to as a scribing wheel).
  FIG. 7 is a cross-sectional view of a laminated glass substrate used for manufacturing a liquid crystal panel. In a manufacturing process of a liquid crystal panel or the like, a large-area mother substrate M in which two thin glass substrates G1 and G2 (a first substrate G1 on the front side and a second substrate G2 on the back side) are bonded together with an adhesive 11 is used. Manufacturing a product from such a mother substrate M includes a process of dividing the unit substrate U as a product unit.
As a process for dividing each unit substrate U, a method using cross scribing is known. That is, as shown in FIG. 8, with respect to the first substrate G1 surface of the mother substrate M, and a scribe line S 1 in the X direction with a cutter wheel, and then, scribe lines Y direction crossing the X direction S Cross scribe to form 2 . In this way, after forming a plurality of scribe lines intersecting in the XY direction in a lattice shape, the mother substrate M is inverted, sent to the break device, and pressed by the break bar from the second substrate G2 side. The substrate G1 is bent along each scribe line. Thereby, the first substrate G1 is broken for each unit substrate U. At this time, since the second substrate G2 is not yet divided, the broken first substrate G1 is fixed to the second substrate G2 by the adhesive 11 and is not separated for each unit substrate U.
Subsequently, as shown in FIG. 9, the X-direction scribe line S 3 is similarly formed on the second substrate G 2, and then the Y-direction scribe line S 4 is formed. The second substrate G2 is broken by being sent to the breaking device. At this time, the mother substrate M is separated for each unit substrate U.
In this way, when the bonded substrate is divided, cross scribing and breaking are performed on each of the first substrate G1 and the second substrate G2.
  As a cutter wheel for forming a scribe line on the mother substrate M, a cutter wheel 1a having a smooth cutting edge ridge line portion 2 as shown in FIG. 10 (referred to as a normal cutter wheel 1a) and a cutting edge ridge line portion as shown in FIG. A cutter wheel 1b (referred to as a grooved cutter wheel 1b) is used in which a notch 3 (groove) is provided in 2 to make it difficult to slide with respect to the substrate and to improve permeability (see Patent Document 1).
  The former normal cutter wheel 1a grinds both sides of the cutting edge ridge line portion with a grindstone in order to form inclined surfaces on both sides of the cutting edge ridge line portion. The slanted surface is formed with irregularities of grinding streaks, but is fine and usually has a centerline average roughness Ra of the edge of the cutting edge of less than 0.4 μm (the centerline average roughness is “JIS B 0601-1982”). It is one of the parameters representing the surface roughness of industrial products specified in the above). Thus, the cutting edge of the normal cutter wheel 1a has a very smooth ridgeline surface.
  The latter grooved cutter wheel 1b is specifically an “APIO (registered trademark)” cutter wheel manufactured by Samsung Diamond Industrial Co., Ltd. This grooved cutter wheel is characterized in that the circumferential length of the notch (groove) is shorter than the circumferential length of the protrusion (the length of the ridge line between two adjacent notches). For example, in “APIO” having a wheel outer diameter of 3 mm, the depth of the notch is about 1 μm, and the circumferential length of the notch is about 4 to 14 μm (therefore, the circumferential length of the protruding portion is 14 μm or more). .
  When the bonded substrate is cut by a cutting method involving a breaking process after the scribing process, the circumferential length of the normal cutter wheel 1a (hereinafter abbreviated as N-type wheel 1a) or the notch is larger than the circumferential length of the protrusion. One of the shortened “APIO” cutter wheels (hereinafter abbreviated as A-type wheel 1b) is used.
  The characteristics of the scribing process by the N-type wheel 1a and the A-type wheel 1b will be described. Since the N-type wheel 1a has a smooth finish on the edge of the cutting edge, the groove surface of the scribe line formed on the substrate is superior in that the end face strength is much more scratch-free than that formed by the A-type wheel 1b. Scribing is possible. On the other hand, the permeability (depth of the kerf) of the scribe line to be formed and the separability after the scribe line is formed are inferior to those of the A-type wheel 1b. Therefore, when cross scribing is performed in the X direction and the Y direction orthogonal to each other, an “intersection jump” phenomenon may occur in which a scribe line cannot be formed at the intersection.
  On the other hand, since the A-type wheel 1b has a notch formed in the edge of the cutting edge, the scribe line has better permeability than the N-type wheel 1a, and the depth of the formed groove is N-type wheel 1a. This makes it possible to perform a scribing process that is less deep and is less likely to slip on the substrate, and is less likely to cause “intersection jump” at the intersection when cross-scribing.
On the other hand, as a kind of grooved cutter wheel, in addition to the “APIO” cutter wheel shown in FIG. 11, for the purpose of performing scribe with higher penetration than this, as shown in FIG. A grooved cutter wheel 1c (for example, “Penett (registered trademark)” cutter wheel manufactured by Samsung Diamond Industrial Co., Ltd.) in which the circumferential length of the notch is longer than the circumferential length of the protruding portion is also manufactured. The “Penett” cutter wheel of the type in which the circumferential length of the notch is longer than the circumferential length of the protrusion (hereinafter abbreviated as “P-type wheel 1c”) increases the impact of the protrusion on the substrate and forms a deep vertical crack. (See Patent Document 1).
This type is a highly penetrating cutter wheel that can be completely divided (full cut processing) by allowing the cracks to penetrate into the back surface in the scribe process.
Therefore, there is known a cutting method in which a highly penetrating P-type wheel 1c is used to divide the first substrate and the second substrate suddenly and completely in a scribe process in the first direction and the second direction.
FIG. 13 and FIG. 14 are diagrams showing a processing procedure for dividing by performing scribing to be a full cut using the P-type wheel 1c.
First, the first substrate G1 surface of the mother substrate M, performs scribe as a full cut line B 1 in the X direction in the P-type wheel 1c, then to the second substrate G2 surface of inverting the substrate performs scribe as a full cut line B 2 in the X direction. Thus, without performing the breaking step, is divided along the full cut line B 1, B 2 in the X direction, a plurality of strip-shaped substrate Mx is cut out.
Then, with respect to the strip-shaped substrate Mx, sequentially performs a scribe as a full cut line B 3 along the Y direction crossing the X direction on the first substrate G1, then strip substrate Mx inverts the second substrate on G2 in sequentially performed scribe as a full cut line B 4 along the Y direction. Thus, is divided along the Y direction of the full-cut line B 3, B 4, is divided into a plurality of unit substrates U. As described above, by adopting the full cut processing by the P-type wheel 1c, the breaking process becomes unnecessary, which is excellent in that the process can be shortened.
International Publication Number WO2007 / 004700
  As described above, the strip substrate is cut out from the mother substrate along the X direction by the scribe processing and the break processing, and then cut along the Y direction to be divided into unit substrates. Therefore, an object of the present invention is to provide a substrate cutting system suitable for efficiently executing such a series of processing.
In addition, the cutting process using the P-type wheel 1c in which the circumferential length of the notch of the edge of the blade edge is longer than the circumferential length of the protruding portion is a full-cut processing due to the large impact of impact on the substrate. On the other hand, a large impact at impact causes the end face strength of the bonded substrate to deteriorate.
For this reason, when liquid crystal or the like is sealed in the unit substrate U divided by the P-type wheel 1c, the end face strength is weak, so that a problem such as occurrence of liquid crystal leakage may occur and the yield may be reduced.
  Therefore, the present invention aims to shorten the process by reducing the number of times of the break process and the substrate inversion as much as possible as compared with the dividing method in which the cross scribing is performed, and when the mother substrate which is a bonded substrate is divided into unit substrates. An object of the present invention is to provide a substrate cutting system capable of giving sufficient end face strength to the dividing plane.
In order to achieve the above object, the present invention takes the following technical means. That is, the substrate cutting system according to the present invention includes a first transport mechanism for transporting a mother substrate in a first direction, a transport path of the first transport mechanism, and a first direction with respect to both surfaces of the mother substrate. A first scribe mechanism that forms a scribe line in a second direction perpendicular to the substrate; and the substrate along the scribe line formed on the mother substrate, provided on the downstream side of the first scribe mechanism on the conveyance path of the first conveyance mechanism. A first break mechanism that breaks the substrate into a strip-shaped substrate, a second transport mechanism that is disposed in parallel with the first transport mechanism and transports the strip-shaped substrate in a direction opposite to the first direction, and a first transport A first arm that attracts the strip-shaped substrate from the transport path of the mechanism and reverses the front and back, and the strip-shaped substrate reversed by the first arm sucks and turns 90 °, and is placed on the transport path of the second transport mechanism. Put A second arm, a second scribing mechanism that is provided on a transport path of the second transport mechanism and forms a scribe line in a second direction perpendicular to the first direction with respect to both surfaces of the strip-shaped substrate; provided on the downstream side of the second scribing mechanism conveying path, along said scribe line formed on the strip-like substrate and a second breaking mechanism to the unit substrate by breaking the strip substrate, a first scribing The mechanism and the second scribing mechanism consist of the first cutter wheel that has no notch on the edge of the cutting edge, the notch and the protrusion formed alternately on the edge of the cutting edge, and the circumferential length of the notch from the circumferential length of the protrusion. Using the lengthened second cutter wheel, the first cutter wheel and the second cutter wheel are arranged so as to face each other up and down across the mother substrate or strip substrate, One, both first scribing mechanism and a second scribing mechanism is in the so that the second cutter wheel is arranged such that the upper side of the mother board or the strip-like substrate.
  According to the present invention, the first transport mechanism that processes the mother substrate into a strip-shaped substrate and the second transport mechanism that processes the strip-shaped substrate processed by the first transport mechanism into a unit substrate are parallel to each other. When the strip-shaped substrates arranged in a line and processed by the first transport mechanism are moved to the second transport mechanism, the substrate is reversed and rotated by 90 °. The work place where the unit substrate is placed can be brought close to the work place where the unit substrate is taken out from the second transport mechanism.
  In the above invention, the first scribe mechanism and the second scribe mechanism are configured such that the first cutter wheel having no notch on the edge of the blade edge, the notch and the protrusion are alternately formed on the edge of the edge, and the circumferential length of the notch Using a second cutter wheel whose length is longer than the circumferential length of the protrusion, the first cutter wheel and the second cutter wheel are arranged so as to face each other up and down across the mother substrate or strip substrate. Also good.
  According to the present invention, one of the first substrate and the second substrate is scribed so as to be fully cut by the second cutter wheel, and the other is scribed by the first cutter wheel. Therefore, in the breaking process, it is possible to cut into a strip-like substrate (in the first scribe mechanism) and a unit substrate (in the second scribe mechanism) just by breaking the side scribed by the first cutter wheel. Omitted.
Here, it is preferable that both the first scribe mechanism and the second scribe mechanism are arranged so that the second cutter wheel comes above the mother substrate or the strip-shaped substrate.
By making the upper side of the first scribe mechanism and the upper side of the second scribe mechanism the same type of second cutter wheel, the end surfaces of the X- and Y-directions of the unit substrate finally cut out are orthogonal to each other, One of the first substrate and the second substrate is formed by a first cutter wheel (N-type wheel), and the other is formed by a second cutter wheel (P-type wheel).
Therefore, both the end surfaces of the unit substrate in the X direction and the Y direction are divided in a state where one end surface processed by the first cutter wheel and one end surface processed by the second cutter wheel are formed. In both the direction and the Y direction, one end face of the substrate is always processed by the first cutter wheel having a high end face strength, and the end face strength is averaged to perform a balanced scribe. . Further, since the cross section formed by only the substrate end face with weak end face strength is eliminated, average end face strength is ensured.
Furthermore, according to the present invention, since no cross scribing is performed, the intersection skip phenomenon does not occur.
Furthermore, when performing scribing with the first scribing mechanism and the second scribing mechanism, the first substrate and the second substrate are simultaneously squeezed from above and below by performing a scribe that is fully cut and a scribe of a finite depth. Can be omitted.
Further, by using the upper cutters as the second cutter wheels, the next break mechanism can be divided only by a simple break mechanism such as a break bar that presses downward from above.
The first cutter wheel and the second cutter wheel preferably have the same wheel diameter.
In general, the wheel diameter needs to increase the pressing load at the time of cutting as the thickness of the substrate to be scribed increases, so the wheel diameter is determined depending on the thickness of the substrate to be scribed. Both the first cutter wheel and the second cutter wheel are used, and similarly, both the first cutter wheel and the second cutter wheel are used for scribing the second substrate. The same diameter is preferable.
It is a top view which shows an example of the cutting system used when implementing the cutting method of this invention. It is a perspective view which shows the scribing apparatus which is a part of the cutting system of FIG. It is a perspective view which shows the breaking apparatus which is a part of the parting system of FIG. It is a figure which shows the processing procedure by the cutting method of this invention, and the processing state in each process. FIG. 5 is a diagram illustrating a processing procedure and a processing state in each step following FIG. 4. It is a schematic diagram which shows the state of the end surface of the unit board | substrate cut | disconnected using the cutting method by this invention. It is sectional drawing of the bonding glass substrate used for manufacture of a liquid crystal panel. It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the shape of a normal cutter wheel (N type wheel). It is a figure which shows the shape of a cutter wheel with a groove | channel (A type wheel). It is a figure which shows the shape of a cutter wheel with a groove | channel (P type wheel). It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the processing procedure of the conventional bonded substrate board.
  The detail of the board | substrate cutting system concerning this invention is demonstrated in detail based on drawing. Note that the embodiment described below is merely an example, and it is needless to say that various aspects can be taken without departing from the spirit of the present invention.
(Configuration of the cutting system)
FIG. 1 is a schematic plan view showing an embodiment of a substrate cutting system MS of the present invention.
The mother substrate M to be processed is formed by bonding two glass substrates G1 and G2 so that unit substrates (unit structures) to be a liquid crystal panel are arranged in a grid in the XY direction (plane direction) of the substrate. In addition, a product can be obtained by dividing the mother plate M into unit substrates.
  The cutting system MS is roughly classified into a first line 100 for processing the X direction of the mother substrate M, and a second line for processing the Y direction of the mother substrate M, that is, the Y direction of a strip-shaped substrate Mx described later. The line 200 includes a transfer mechanism 300 for transferring the strip-shaped substrate Mx from the first line 100 to the second line 200.
For convenience of explanation, an xyz coordinate system is defined in the cutting system MS as shown in FIG. That is, at the machining start position (first table 101 described later) of the cutting system MS, the X direction of the mother substrate M matches the x direction of the xyz coordinate system of the cutting system MS, and the Y direction and the y direction match. It shall be. Further, the y direction coincides with the substrate transport direction of the cutting system MS.
The mother substrate M is placed so that the upper side (front side) is the second substrate G2, and the lower side (back side) is the first substrate G1.
First, the first line 100 will be described. In the first line 100, a first table 101, a scribe device 102, a second table 103, a break device 104, and a third table 105 are arranged in series in this order.
A pair of conveyor belts 106 that are independently driven are attached to the first table 101, the second table 103, and the third table 105, and the mother board M is sequentially supported in the y direction while being supported thereon. It is supposed to be. It should be noted that a gap having a width that does not interfere with the conveyance of the substrate is formed between the adjacent conveyor belts 106 at the positions of the scribing device 102 and the breaking device 104, so that the scribing process and the breaking process are performed in this gap. It is.
FIG. 2 is a perspective view showing the structure of the scribing apparatus 102 (the scribing apparatus 202 described later has the same structure except that the width in the x direction is different). For convenience of explanation in FIG. 2, the illustration of the conveyor belt 106 is omitted, and only the positions of the tables 101 and 103 are shown by a one-dot chain line so that the back side can be shown.
The scribing device 102 is arranged at the boundary between the first table 101 and the second table 103, and when the mother substrate M is transported to a position where it can be processed, a P-type wheel for performing a scribing process that becomes a full cut. 111P (see FIG. 12) is arranged on the upper side of the machining site, and an N-type wheel 112N (see FIG. 10) for scribing to form a groove of a finite depth is arranged to face the lower side of the machining site. It is.
The P-type wheel 111P is arranged on the upper side of the processing part and the N-type wheel 112N is arranged on the lower side, because the break bar 131 is lowered from the top during the break process described later, This is because it is easier to break than to raise and break.
  The P-type wheel 111P is attached to the support body 113 (scribing head) and the N-type wheel 112N is attached to the support body 114 (scribing head) so as to be vertically movable, and the pressing load during scribing can be adjusted. is there. The supports 113 and 114 are attached to be movable along the guides 117 of the upper and lower guide bars 116 horizontally bridged in the x direction by the support pillars 115 on both sides, and are moved in the x direction by driving the motor 118. It is.
  In addition, a camera 120 is provided on each of a pair of pedestals 119 that can move in the x direction and the y direction. The pedestal 119 moves along the guide 122 extending in the x direction on the support base 121. The camera 120 can automatically adjust the focus of imaging by moving up and down, and an image captured by the camera 120 is displayed on the monitor 123.
  An alignment mark (not shown) for specifying the position is provided on the surface of the mother substrate M placed on the conveyor belt 106 (see FIG. 1) on the tables 101 and 103. Is taken to adjust the position of the mother board M. Specifically, the alignment mark on the surface of the mother board M supported by the conveyor belt 106 is imaged by the camera 120 and the position of the alignment mark is specified. Based on the position of the specified alignment mark, a positional deviation and a direction deviation at the time of placing the surface of the mother substrate M are detected by image processing. As a result, at the time of scribing (and full-cut scribing) with respect to the mother substrate M, the scribing start position is finely adjusted in the y direction with respect to the positional deviation. For the direction deviation, a scribe line is formed by a linear interpolation operation combining a scribe operation in the x direction and the y direction. Specifically, the direction adjustment is performed by linking the movement in the y direction by the conveyor belt 106 and the movement in the x direction by driving the motor 118.
  FIG. 3 is a perspective view showing the structure of the breaking device 104 (the scribing device 204 described later has the same structure except that the width in the x direction is different). In FIG. 3, for convenience of explanation, the illustration of the conveyor belt 106 is omitted, and only the positions of the tables 103 and 105 are shown by a one-dot chain line. Furthermore, since the camera for specifying the position by the alignment mark and the support mechanism thereof are the same as the structure described in FIG. 2, a part of the description is omitted by giving the same reference numerals.
The break device 104 is arranged at the boundary between the second table 103 and the third table 105. When the mother substrate M is transported, the break bar 131 above the substrate is lowered to press the substrate surface. It is. A V-shaped groove is formed on the lower surface of the break bar 131, and when pressing the mother board M on which a scribe line along the X direction of the board is pressed, the V-shape is not touched. It is possible to press while avoiding the groove.
The break bar 131 is provided with a piston 132 for vertical driving at the center, and guide rods 133 are provided on both sides. Also, one end of the piston 132 is fixed to a pedestal 135 that is horizontally bridged in the x direction by the support pillars 134 on both sides, and the left and right guide rods 133 are configured to pass through the holes 136. Thereby, when the piston 132 moves the break bar 131 up and down, the break bar 131 does not run sideways.
  Here, a series of operations of the first line 100 will be described with reference to FIG. The mother substrate M placed on the first table 101 is transported to the scribing device 102, subjected to simultaneous upper and lower scribing (upper cut on the upper side) in the X direction of the substrate, and is carried out to the second table 103. Further, it is transported from the second table 103 to the break device 104 and subjected to a break process, and the strip-shaped substrate Mx in which unit substrates are arranged in a line in the x direction is carried out to the third table 105.
  Next, the transfer mechanism 300 will be described. The transfer mechanism 300 transfers the strip-shaped substrate Mx, which has been processed by the first line 100 and carried to the third table 105, to the second line 200, and performs a process of inverting the substrate Mx during the transfer.
The transfer mechanism 300 includes a first arm 301, a first arm driving device 302, a fourth table 303, a second arm 304, and a second arm driving device 305.
The first arm 301 includes a rod-shaped arm main body 301a and a suction pad 301b on which a strip-shaped substrate Mx can be attached and detached by a vacuum suction mechanism (not shown). The arm main body 301a and the suction pad 301b are controlled by the first arm driving device 302 to perform vertical movement (z movement) and forward / backward movement (y movement) and to reverse the sucked strip-shaped substrate Mx. A rotational motion about 301a is performed.
  The fourth table 303 has a pair of table surfaces arranged in parallel with the longitudinal direction as the x direction, and is installed at a position away from the third table 105 in the front (+ y direction). Between the pair of table surfaces, a retreat space K having a width that allows the first arm 301 to enter and a width that allows the strip-shaped substrate Mx to be placed on the table surface is provided.
The second arm 304 includes a rod-shaped arm main body 304a and a suction pad 304b on which a strip-like substrate Mx can be attached and detached by a vacuum suction mechanism (not shown), and is controlled by the second arm driving device 305. One end of the arm main body 304a is supported by the second arm driving device 305 so as to perform vertical movement (z movement) and swivel movement.
The turning motion is rotated 90 ° from the fourth table 303, and the strip-like substrate Mx sucked by the suction pad 304b is placed on the fifth table 201 of the second line 200 described later.
  A series of operations of the transfer mechanism 300 will be described. When the strip-shaped substrate Mx is transported to a preset delivery position on the third table 105, the first arm 301 descends (-z movement) with the suction pad 301b downward from above, and the strip to be transferred. Adhere to the upper surface of the substrate Mx. The first arm 301 ascends (+ z movement) while adsorbing the strip-shaped substrate Mx, then advances toward the fourth table 303 (+ y movement), and reverses (rotates 180 ° around the arm main body 301a). ) Then, in a state where the lower surface side of the strip-shaped substrate Mx is sucked by the suction pad 301b, it moves to above the fourth table 303, and the movement in the y direction is stopped at this position. Subsequently, the first arm 301 is lowered (−z movement) so as to enter the retreat space K of the fourth table 303. At this time, when the strip-shaped substrate Mx comes into contact with the table surface, the suction is released and the strip-shaped substrate Mx is placed on the table 303.
Next, the second arm 304 descends from the upper side of the strip-shaped substrate Mx on the fourth table 303 with the suction pad 301b facing downward (−z movement), and is attracted to the upper surface of the strip-shaped substrate Mx.
The second arm 304 ascends while adsorbing the strip-shaped substrate Mx (+ z movement), and then turns 90 ° toward the fifth table 201 of the second line 200. Then, after stopping the turning when it comes to the upper side of the fifth table 201, it is lowered (-z movement), the strip-like substrate Mx is placed on the conveyor belt 106 of the fifth table 201, the suction is released, and again. Wait until the next transport at the raised position.
On the other hand, the first arm 301 rises from the retreat space K (+ z movement) and moves backward (−y movement) toward the third table 105 while the second arm 304 is turning toward the fifth table 201. The arm body 301a is inverted (rotated 180 °). Then, it waits for the next conveyance above the delivery position of the third table 105.
With the above operation, the transfer of the strip-shaped substrate Mx to the second line 200 side is completed.
  At the processing start position (fifth table 201) of the second line 200, the strip-shaped substrate Mx has rotated 90 ° from when it was placed on the first line 100, so the Y-direction of the strip-shaped substrate Mx is It coincides with the x direction of the xyz coordinate system. Since the strip-shaped substrate Mx is inverted by the first arm 301, the upper side (front side) is the first substrate G1, and the lower side (back side) is the second substrate G2.
Next, the second line 200 will be described. In the second line 200, a fifth table 201, a scribe device 202, a sixth table 203, a break device 204, and a seventh table 205 are arranged in this order in series.
A pair of conveyor belts 106 that are independently driven are attached to the fifth table 201, the sixth table 203, and the seventh table 205, so that the strip-shaped substrates Mx are sequentially conveyed. It should be noted that a gap having a width that does not hinder the conveyance of the substrate is formed between adjacent conveyor belts at the positions of the scribing device 202 and the breaking device 204, so that the scribing process and the breaking process are performed in this gap. It is.
  The scribing device 202 and the breaking device 204 have the same basic structure as the scribing device 102 and the breaking device 104 described in FIG. 2 and FIG. 3 except for the width (dimension in the x direction). Refer to The description other than each table 201, 203, 205 is omitted by using the same reference numerals.
  In the second line 200, the strip-shaped substrate Mx placed on the fifth table 201 is transported to the scribing device 202, and the upper and lower simultaneous scribing processing (the upper side is full cut) in the Y direction of the strip-shaped substrate Mx is performed. It is carried out to the sixth table 203. Furthermore, the breaker 204 is transported from the sixth table 203 to perform a break process, and the unit substrate U is unloaded to the seventh table 205.
(Processing procedure)
Next, a bonded substrate processing procedure by the entire cutting system MS described above will be described with reference to the drawings. 4 and 5 are diagrams showing a processing procedure according to the cutting method of the present invention and a processing state in each step.
First, the mother substrate M is placed on the first table 101 of the first line 100 with the second substrate G2 side up and the X direction of the substrate coincides with the x direction.
Then conveys the scribing apparatus 102, the second substrate G2 to form a full-cut line B 1 by P-type wheel 111P, scribe line S 1 at the same time the first substrate G1 of finite depth by N-type wheel 112N And are carried out to the second table 103. As a result, as shown in FIG. 4 (a), the second substrate G2 full cut line B 1 is formed, a state in which the scribe line S 1 of the finite depth is formed in the first substrate G1.
Subsequently, the mother substrate M is transported from the second table 103 to the breaking device 104, and as shown in FIG. 4B, the first substrate G1 is broken by the pressing by the break bar from the second substrate G2 side to be full. a cut line B 2, is carried out to the third table 105. As a result, the strip-shaped substrate Mx is formed.
Then, the strip-shaped substrate Mx is reversed by the transfer mechanism 300 and transferred to the fifth table 201 of the second line 200 through the fourth table 303. At this time, the strip-shaped substrate Mx is placed on the fifth table 201 of the second line 200 with the first substrate G1 side up and the Y direction coincides with the x direction.
Then, by conveying a strip substrate Mx scribe device 202, the first substrate G1 to form a full-cut line B 3 by P-type wheel 111P, finite depth by N-type wheel 112N is the second substrate G2 simultaneously The scribe line S 3 is formed and carried out to the sixth table 203. As a result, as shown in FIG. 5 (a), the first substrate G1 full cutting line B 3 is formed, the second substrate G2 in a state where the scribe line S 3 finite depth is formed.
Subsequently, the strip-shaped substrate Mx is transported from the sixth table 203 to the breaking device 204, and as shown in FIG. 5B, the second substrate G2 is broken by pressing from the first substrate G1 side with a break bar. the full cut line B 4, is carried out to the seventh table 205. As a result, the unit substrates U are divided into pieces.
  FIG. 6 is a schematic diagram showing the state of the end face strength of the unit substrate U separated by the above-described procedure. In the dividing plane, since one of the first substrate G1 and the second substrate G2 is scribed (full cut) with the P-type wheel 111P and the other with the N-side wheel 112N, the end surface strength E1 of one substrate is strong, The end surface strength E2 of the other substrate is weaker than that. The end surface strength of the bonded substrate as a whole is averaged, and the end surface strength as the bonded substrate can be ensured by the presence of the substrate having the higher end surface strength.
In the present embodiment, the scribe lines and full cut lines formed on the upper and lower substrates G1 and G2 are all end faces on the same plane, but stepped surfaces are formed for the formation of terminal regions for electrical connection with the outside. Even in the case of the end face where the slab is formed, the present invention can be applied as it is only by increasing the number of scribes formed during the processing.
Further, although the present embodiment is intended for a mother substrate in which two sheets of glass are bonded together, it can also be used in a bonded substrate made of a brittle material other than a glass substrate.
In the above embodiment, the strip-shaped substrate Mx is reversed by the transfer mechanism 300. Accordingly, the first line 100 and the second line 200 are preferable because the scribing devices 102 and 202 and the breaking devices 104 and 204 having the same configuration can be used. However, the first line 100 and the second line 200 can be used without reversing the strip-shaped substrate Mx. There may be cases where it is desired to carry out the dividing method of the invention.
In that case, for example, in the scribing device 202 on the second line 200 side, the upper side is changed to be the first cutter wheel (N-type wheel 112N), and the lower side is changed to the second cutter wheel (P-type wheel 111P). In the breaking device 204 on the second line 200 side, the break bar 131 is pressed upward from the bottom of the strip substrate Mx, and a back plate such as hard rubber is placed on the top of the strip substrate Mx. By making it, the parting process which has the same end surface intensity | strength as embodiment mentioned above is attained.
  The substrate cutting system of the present invention can be used when a bonded substrate such as a glass substrate is cut.
M bonded substrate (mother substrate)
Mx Strip-shaped substrate U Unit substrate G1 First substrate G2 Second substrate E1 Strong end surface strength E2 Weak end surface strength B 1 Full cut line S in the first direction (X direction) of the second substrate S 1 First direction of the first substrate ( X direction) scribe line B 2 first substrate (first direction) (X direction) full cut line B 3 first substrate second direction (Y direction) full cut line S 3 second substrate (second direction) Y direction) scribe line B 4 Full cut line 100 in the second direction (Y direction) of the second substrate 1st line (first transport mechanism)
200 Second line (second transport mechanism)
300 Transfer mechanism (including substrate reversal mechanism)
102 Scribing device (first scribing mechanism)
104 Break device (1st break mechanism)
111P Cutter wheel with groove (P-type wheel)
112N Normal cutter wheel (N-type wheel)
202 Scribe device (second scribe mechanism)
204 Break device (second break mechanism)

Claims (3)

  1. A first transport mechanism for transporting the mother substrate in the first direction;
    A first scribe mechanism which is provided on a conveyance path of the first conveyance mechanism and forms a scribe line in a second direction perpendicular to the first direction with respect to both surfaces of the mother substrate;
    A first breaking mechanism provided on the downstream side of the first scribe mechanism on the conveyance path of the first conveyance mechanism, and breaking the substrate along a scribe line formed on the mother substrate to form a strip-shaped substrate;
    A second transport mechanism disposed in parallel with the first transport mechanism, for transporting the strip-shaped substrate in a direction opposite to the first direction;
    A first arm that adsorbs the strip-shaped substrate from the transport path of the first transport mechanism and reverses the front and back;
    A second arm that adsorbs the strip-shaped substrate reversed by the first arm and turns 90 °, and is placed on the transport path of the second transport mechanism;
    A second scribe mechanism that is provided on the conveyance path of the second conveyance mechanism and forms a scribe line in a second direction perpendicular to the first direction with respect to both surfaces of the strip-shaped substrate;
    A second break mechanism provided on the downstream side of the second scribe mechanism on the transport path of the second transport mechanism, and breaking the strip substrate along a scribe line formed on the strip substrate to form a unit substrate. Prepared ,
    The first scribe mechanism and the second scribe mechanism are
    A first cutter wheel having no notch on the edge of the blade edge, and a second cutter wheel in which notches and protrusions are alternately formed on the edge of the edge of the blade and the circumferential length of the notches is longer than the circumferential length of the protrusion. Using, the first cutter wheel and the second cutter wheel are arranged so as to face up and down across the mother substrate or strip substrate, and
    Each of the first scribe mechanism and the second scribe mechanism is a substrate cutting system in which a second cutter wheel is arranged above the mother substrate or the strip-shaped substrate .
  2.   2. The substrate cutting system according to claim 1, wherein a position at which the mother substrate is placed by the first transport mechanism and transport is started and a position at which the unit substrate is transported and taken out by the second transport mechanism are arranged side by side.
  3. The substrate cutting system according to claim 1 or 2, wherein the first cutter wheel and the second cutter wheel have the same wheel diameter .
JP2012270621A 2012-12-11 2012-12-11 Substrate cutting system Expired - Fee Related JP5639634B2 (en)

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JP2002316829A (en) * 2001-04-17 2002-10-31 Seiko Epson Corp Method for cutting glass substrate, method for manufacturing electro-optic device, electro-optic device, electronic apparatus and scribed groove former
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KR100832292B1 (en) * 2002-02-19 2008-05-26 엘지디스플레이 주식회사 Cutter of liquid crystal panel
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JP4256724B2 (en) * 2003-06-05 2009-04-22 三星ダイヤモンド工業株式会社 Method and apparatus for scribing brittle material substrate
JP2005001264A (en) * 2003-06-12 2005-01-06 Sharp Corp Parting device and parting method
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TWI369339B (en) * 2008-06-25 2012-08-01 Mitsuboshi Diamond Ind Co Ltd
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