JP5161952B2 - Method for dividing bonded substrates - Google Patents

Description

  The present invention relates to a cutting method for cutting a bonded substrate using a cutter wheel (also referred to as a scribing wheel).

  FIG. 5 is a cross-sectional view of a laminated glass substrate used for manufacturing a liquid crystal panel. In a manufacturing process of a liquid crystal panel or the like, a large-area mother substrate M in which two thin glass substrates G1 and G2 (a first substrate G1 on the front side and a second substrate G2 on the back side) are bonded together with an adhesive 11 is used. Manufacturing a product from such a mother substrate M includes a process of dividing the unit substrate U as a product unit.

As a process for dividing each unit substrate U, a method using cross scribing is known. That is, as shown in FIG. 6, with respect to the first substrate G1 surface of the mother substrate M, and a scribe line S ₁ in the X direction with a cutter wheel, and then, scribe lines Y direction crossing the X direction S Cross scribe to form ₂ . In this way, after forming a plurality of scribe lines intersecting in the XY direction in a lattice shape, the mother substrate M is sent to the break device and pressed by the break bar from the second substrate G2 side. Bend along each scribe line. Thereby, the first substrate G1 is broken for each unit substrate U. At this time, since the second substrate G2 is not yet divided, the broken first substrate G1 is fixed to the second substrate G2 by the adhesive 11 and is not separated for each unit substrate U.

Subsequently, to the second substrate G2, as shown in FIG. 7, similarly to form a scribe line S ₃ in the X direction and then subjected to cross-box live for forming a scribe line S ₄ in the Y direction, then, The second substrate G2 is broken by being sent to the breaking device. At this time, the mother substrate M is separated for each unit substrate U.
In this way, when the bonded substrate is divided, cross scribing and breaking are performed on each of the first substrate G1 and the second substrate G2.

  As a cutter wheel for forming a scribe line on the mother substrate M, a cutter wheel 1a having a smooth cutting edge ridge line portion 2 as shown in FIG. 8 (referred to as a normal cutter wheel 1a) and a cutting edge ridge line portion as shown in FIG. A cutter wheel 1b (referred to as a grooved cutter wheel 1b) is used in which a notch 3 (groove) is provided in 2 to make it difficult to slide with respect to the substrate and to improve permeability (see Patent Document 1).

  The former normal cutter wheel 1a grinds both sides of the cutting edge ridge line portion with a grindstone in order to form inclined surfaces on both sides of the cutting edge ridge line portion. The slanted surface is formed with irregularities of grinding streaks, but is fine and usually has a centerline average roughness Ra of the edge of the cutting edge of less than 0.4 μm (the centerline average roughness is “JIS B 0601-1982”). It is one of the parameters representing the surface roughness of industrial products specified in the above). Thus, the cutting edge of the normal cutter wheel 1a has a very smooth ridgeline surface.

  The latter grooved cutter wheel 1b is specifically an “APIO (registered trademark)” cutter wheel manufactured by Samsung Diamond Industrial Co., Ltd. This grooved cutter wheel is characterized in that the circumferential length of the notch (groove) is shorter than the circumferential length of the protrusion (the length of the ridge line between two adjacent notches). For example, in “APIO” having a wheel outer diameter of 3 mm, the depth of the notch is about 1 μm, and the circumferential length of the notch is about 4 to 14 μm (therefore, the circumferential length of the protruding portion is 14 μm or more). .

  When the bonded substrate is cut by a cutting method involving a breaking process after the scribing process, the circumferential length of the normal cutter wheel 1a (hereinafter abbreviated as N-type wheel 1a) or the notch is larger than the circumferential length of the protrusion. One of the shortened “APIO” cutter wheels (hereinafter abbreviated as A-type wheel 1b) is used.

  The characteristics of the scribing process by the N-type wheel 1a and the A-type wheel 1b will be described. Since the N-type wheel 1a has a smooth finish on the edge of the cutting edge, the groove surface of the scribe line formed on the substrate is superior in that the end face strength is much more scratch-free than that formed by the A-type wheel 1b. Scribing is possible. On the other hand, the permeability (depth of the kerf) of the scribe line to be formed and the separability after the scribe line is formed are inferior to those of the A-type wheel 1b. Therefore, when cross scribing is performed in the X direction and the Y direction orthogonal to each other, an “intersection jump” phenomenon may occur in which a scribe line cannot be formed at the intersection.

  On the other hand, since the A-type wheel 1b has a notch formed in the edge of the cutting edge, the scribe line has better permeability than the N-type wheel 1a, and the depth of the formed groove is N-type wheel 1a. This makes it possible to perform a scribing process that is less deep and is less likely to slip on the substrate, and is less likely to cause “intersection jump” at the intersection when cross-scribing.

On the other hand, as a type of grooved cutter wheel, in addition to the “APIO” cutter wheel shown in FIG. 9, for the purpose of performing scribe with higher penetration than this, as shown in FIG. A grooved cutter wheel 1c (for example, “Penett (registered trademark)” cutter wheel manufactured by Samsung Diamond Industrial Co., Ltd.) in which the circumferential length of the notch is longer than the circumferential length of the protruding portion is also manufactured. The “Penett” cutter wheel of the type in which the circumferential length of the notch is longer than the circumferential length of the protrusion (hereinafter abbreviated as “P-type wheel 1c”) increases the impact of the protrusion on the substrate and forms a deep vertical crack. (See Patent Document 1).
This type is a highly penetrating cutter wheel that can be completely divided (full cut processing) by allowing the cracks to penetrate into the back surface in the scribe process.

Therefore, there is known a cutting method in which a highly penetrating P-type wheel 1c is used to divide the first substrate and the second substrate suddenly and completely in a scribe process in the first direction and the second direction.
FIG. 11 and FIG. 12 are diagrams showing a processing procedure for dividing by performing scribing to be a full cut using the P-type wheel 1c.

First, the first substrate G1 surface of the mother substrate M, performs scribe as a full cut line B ₁ in the X direction in the P-type wheel 1c, then to the second substrate G2 surface of inverting the substrate performs scribe as a full cut line B ₂ in the X direction. Thus, without performing the breaking step, is divided along the full cut line B _1, B ₂ in the X direction, a plurality of strip-shaped substrate Mx is cut out.
Then, with respect to the strip-shaped substrate Mx, sequentially performs a scribe as a full cut line B ₃ along the Y direction crossing the X direction on the first substrate G1, and then the second substrate G2 inverts the rectangular substrate Mx sequentially performed scribe as a full cut line B ₄ along the Y direction above. Thus, is divided along the Y direction of the full-cut line B _3, B _4, is divided into a plurality of unit substrates U. As described above, by adopting the full cut processing by the P-type wheel 1c, the breaking process becomes unnecessary, which is excellent in that the process can be shortened.

International Publication Number WO2007 / 004700

The cutting process using the P-type wheel 1c in which the circumferential length of the notch of the edge of the cutting edge is longer than the circumferential length of the protruding portion allows full cutting due to the large impact of impact on the substrate by the protruding area. However, on the other hand, a large impact impact causes the end face strength of the bonded substrate to deteriorate.
For this reason, when liquid crystal or the like is sealed in the unit substrate U divided by the P-type wheel 1c, the end face strength is weak, so that a problem such as occurrence of liquid crystal leakage may occur and the yield may be reduced.

  Therefore, the present invention aims to shorten the process by omitting the breaking process as much as possible as compared with the dividing method in which cross scribing is performed, and is sufficient for the dividing surface when the mother substrate which is a bonded substrate is divided into unit substrates. An object of the present invention is to provide a dividing method capable of providing a sufficient end face strength.

In order to achieve the above object, the present invention takes the following technical means. That is, the method for dividing a bonded substrate according to the present invention is to divide the bonded substrate in which the first substrate and the second substrate are bonded into a lattice shape in a first direction and a second direction intersecting each other. A method for dividing a bonded substrate by dividing the bonded substrate into unit substrates, the first cutter wheel (N-type wheel) having no notch on the edge of the blade edge, and notches and protrusions alternately on the edge of the edge A second cutter wheel (P-type wheel) that is formed and has a circumferential length of the notch longer than a circumferential length of the protruding portion is used.
First, scribing is performed with the first cutter wheel along the first direction of the first substrate, and scribing is performed with the second cutter wheel along the first direction of the second substrate, and then the first substrate is performed. A break process is performed along the first direction to form a plurality of strip-like bonded substrates in which unit substrates are arranged in a row.
Next, scribing is performed with the first cutter wheel along the second direction of the second substrate of each strip-shaped bonded substrate, and full scribing is performed with the second cutter wheel along the second direction of the first substrate. I do. Next, a break process is performed along the second direction of the second substrate to divide the strip-like bonded substrate into unit substrates.

According to the present invention, in the first direction, one of the first substrate and the second substrate (first substrate) is scribed by the first cutter wheel, and the other (second substrate) is fully cut by the second cutter wheel. It is scribed to become. Therefore, in the breaking process, the side scribed by the first cutter wheel can be cut into strips by simply breaking, and the breaking process on the other side is omitted.
Also, in the second direction, one of the first substrate and the second substrate (second substrate) is scribed by the first cutter wheel, and the other (first substrate) is fully cut by the second cutter wheel. It is scribed. Accordingly, in the break process, similarly, the side scribed by the first cutter wheel can be cut into the unit substrate only by breaking, and the break process on the other side is omitted.
And about the end surface of each of the 1st direction of the unit board | substrate finally cut out, and a 2nd direction, one side is formed by the 1st cutter wheel (N type wheel) among a 1st board | substrate and a 2nd board | substrate, and the other Is formed by a second cutter wheel (P-type wheel).
Therefore, for both the first direction and the second direction, the end face processed by the first cutter wheel and the end face processed by the second cutter wheel are divided one by one, and the first direction and In any of the second directions, one end face of the substrate is always processed by the first cutter wheel having high end face strength, and the end face strength is averaged to perform balanced scribe. Further, since the cross section formed by only the substrate end face with weak end face strength is eliminated, average end face strength is ensured.
Furthermore, according to the present invention, since no cross scribing is performed, the intersection skip phenomenon does not occur.

Here, it is preferable that the first cutter wheel and the second cutter wheel have the same wheel diameter.
In general, the wheel diameter needs to increase the pressing load at the time of cutting as the thickness of the substrate to be scribed increases, and therefore the wheel diameter is determined depending on the thickness of the substrate to be scribed. Since both the first cutter wheel and the second cutter wheel are used for the second substrate, and similarly, both the first cutter wheel and the second cutter wheel are used for scribing the second substrate. Are preferably the same diameter.

It is a front view which shows an example of the scribe apparatus used when implementing the cutting method of this invention. It is a figure which shows the procedure of the dividing method of this invention. FIG. 3 is a diagram illustrating a procedure of the dividing method of the present invention following FIG. 2. It is a schematic diagram which shows the state of the end surface of the unit board | substrate cut | disconnected using the cutting method by this invention. It is sectional drawing of the bonding glass substrate used for manufacture of a liquid crystal panel. It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the shape of a normal cutter wheel (N type wheel). It is a figure which shows the shape of a cutter wheel with a groove | channel (A type wheel). It is a figure which shows the shape of a cutter wheel with a groove | channel (P type wheel). It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the processing procedure of the conventional bonded substrate board.

  The details of the method for dividing a bonded substrate according to the present invention will be described in detail with reference to the drawings. Note that the embodiment described below is merely an example, and it is needless to say that various aspects can be taken without departing from the spirit of the present invention.

FIG. 1 is a schematic front view showing an embodiment of a scribing device used when carrying out the cutting method of the present invention.
The mother substrate M to be processed is formed by bonding two glass substrates together, and patterning so that the unit structures to be a liquid crystal panel are arranged in a grid pattern in the XY direction. Product can be obtained by dividing.

The scribing device SC includes a table 4 that can be rotated with the mother board M placed horizontally, a rail 5 that supports the table 4 so as to be movable in one direction (perpendicular to the plane of FIG. 1), and a table 4. A guide bar 6 bridged in a direction orthogonal to the rail 5 (left and right direction in FIG. 1), two scribe heads 7a and 7b provided movably along the guide bar 6, and a scribe head Cutter holders 8a and 8b are mounted on the lower ends of 7a and 7b so as to be movable up and down.
The cutter holder 8a is attached with a first cutter wheel 12 (N-type wheel) having no groove on the edge of the cutting edge. Notches and protrusions are alternately formed on the edge of the cutting edge of the cutter holder 8b. A second cutter wheel 13 (P-type wheel) having a circumferential length longer than the circumferential length of the protrusion is attached.

  The outer diameters of the two wheels are the same, and specifically, the wheel diameters are both 3 mm. The notch depth of the second cutter wheel 13 is 5 μm, the circumferential length of the notch is 30 μm to 40 μm, and the number of notches is 170 (therefore, the notch pitch is 55 μm (3 mm × π / 170)). .

  The break device is not particularly limited and is not shown because a general break device may be used.For example, a break bar that can be raised and lowered is provided, and the break bar is pressed from the back side of the substrate along the scribe line to bend. Therefore, a break device that breaks can be used.

Next, the dividing operation of the mother substrate M will be described. 2 and 3 are diagrams showing a processing procedure according to the cutting method of the present invention.
On the table 4 of the scribing device SC, the mother substrate M is mounted so that the first substrate G1 side of the mother substrate M, which is a bonded substrate, faces up, and the X direction (first direction) coincides with the direction of the rail 5. Put. The first cutter wheel 12 (N-type wheel) sequentially forming a scribe line _{S 1} in the X direction using a (FIG. 2 (a)).
Subsequently, using the second cutter wheel 13 (P-type wheel) so that the substrate is turned upside down with the second substrate G2 side up so that the X direction (first direction) coincides with the rail 5 direction. They are sequentially formed a full cut line B ₂ in the X direction. Thereby, the second substrate G2 is divided into strips, but the second substrate G2 is not separated because it is fixed to the first substrate G1 with an adhesive. (FIG. 2 (b)).

Subsequently, the mother substrate M is moved to the breaking device. As the second substrate G2 is at the top, a strip of the first substrate G1 by bending the substrate manner to abut the scribe line S ₁ of the break bar along the back you just formed from the second substrate G2 side (Fig. 2 (c)). Thus, the unit substrates are divided into strip-shaped substrates Mx arranged in a line.

Subsequently, each of the cut-out strip-like substrates Mx is moved to the scribing device, and placed with the second substrate G2 facing upward, so that the Y direction (second direction) coincides with the direction of the rail 5. Then, by using the first cutter wheel 12 are sequentially formed scribe line S ₃ in the Y direction (Figure 3 (a)).
Subsequently, the strip-shaped substrate Mx is inverted so that the first substrate G1 faces upward, the Y direction (second direction) coincides with the direction of the rail 5, and then the second cutter wheel 13 is used for Y. sequentially forming a full-cut line _{B 4} in the direction (Figure 3 (b)).

Subsequently, the strip-shaped substrate Mx is moved to the breaking device. As the first substrate G1 is at the top, breaking the second substrate G2 by bending the substrate and the breaking bar along the back side of the scribe line S ₃ which have just formed from the first substrate G1 side into abutment (FIG. 3C). At this time, the first substrate G1 and the second substrate G2 are separated separately for each unit substrate U in a bonded state.

  FIG. 4 is a schematic diagram showing the state of the end face strength of the unit substrate U separated by the above-described procedure. In the dividing plane, since one of the first substrate G1 and the second substrate G2 is scribed by the first cutter wheel 12 and the other is scribed by the second cutter wheel 13, the end surface strength E1 of one substrate is strong, The end face strength E2 of the substrate is weaker than that. The end surface strength of the bonded substrate as a whole is averaged, and the end surface strength as the bonded substrate can be ensured by the presence of the substrate having the higher end surface strength.

In this embodiment, the scribe lines and full cut lines formed on the upper and lower substrates G1 and G2 are all end surfaces on the same plane. However, in the case of end surfaces where step surfaces are formed for the formation of terminal regions. Even so, the present invention can be applied as it is simply by increasing the number of scribing during processing.
Further, although the present embodiment is intended for a mother substrate in which two sheets of glass are bonded together, it can also be used in a bonded substrate made of a brittle material other than a glass substrate.

  The scribing method of the present invention can be used when a bonded substrate such as a glass substrate is cut.

M bonded substrate (mother substrate)
Mx strip substrate G1 first substrate G2 second substrate E1 strong end surface strength E2 weak end surface strength S ₁ scribe line B in the first direction (X direction) of the first substrate ₂ in the first direction (X direction) of the second substrate Full cut line S ₃ Second substrate (Y direction) scribe line B ₄ First substrate second direction (Y direction) full cut line 12 First cutter wheel (N-type wheel)
13 Second cutter wheel (P-type wheel)

Claims (2)

Bonding that divides the bonded substrate into unit substrates by dividing the bonded substrate in which the first substrate and the second substrate are bonded into a lattice shape in a first direction and a second direction intersecting each other. A method for dividing a substrate,
The first cutter wheel with no notch on the edge of the blade edge,
Using the second cutter wheel in which notches and protrusions are alternately formed on the edge of the blade edge, and the circumferential length of the notches is longer than the circumferential length of the protrusions,
While performing scribing with the first cutter wheel along the first direction of the first substrate, performing scribing to be full cut with the second cutter wheel along the first direction of the second substrate,
Next, a break treatment is performed along the first direction of the first substrate to form a plurality of strip-like bonded substrates in which the unit substrates are arranged in a line,
Next, scribing with the first cutter wheel along the second direction of the second substrate of each strip-shaped bonded substrate, and scribing to be full cut with the second cutter wheel along the second direction of the first substrate Done
Next, the method for dividing a bonded substrate is characterized in that a break treatment is performed along the second direction of the second substrate of each of the strip-shaped bonded substrates to divide each unit substrate. The method for dividing a bonded substrate according to claim 1, wherein the first cutter wheel and the second cutter wheel have the same wheel diameter.

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