TW201339112A - Scribing wheel, scribing device, scribing method , manufacturing method for display panel and display panel - Google Patents

Abstract

The present invention provides a scribing wheel which is suitable to split a brittle material substrate and has an attached groove with higher permeability, and also provides a scribing device using the scribing wheel. The groove 44 of the scribing wheel 40 is formed by a manner that the width L of the groove 44 is in the range of 2.0 to 3.2 times the depth H of the groove 44. Thereby, the scribing wheel 40 and the scribing device 10 can form cracks having high permeability on the brittle material substrate 17 even under the condition of less splitting load.

Description

Scribing wheel, scribing device, scribing method, manufacturing method of display panel, and display panel

The present invention relates to a scribing wheel, a scribing device, a scribing method for a brittle material substrate, a manufacturing method for a display panel, and a display panel when a scribing is formed on a surface of a brittle material substrate, and more particularly, The ridge line portion of the wheel is formed with a plurality of grooves of the scribing wheel, a scribing device using the scribing wheel formed with such a groove, a scribing method, a manufacturing method of the display panel, and a display panel.

In the manufacture of a liquid crystal panel or the like, when a glass substrate is separated, a scribing device is usually used, and a scribing wheel of the scribing device is used to form a crack in a direction perpendicular to the plane of the substrate.

As such a scribing wheel, a scribing wheel is generally known which is formed by grinding a circular plate made of a hard alloy or a sintered diamond from both outer peripheral surfaces, and is formed into a substantially V-shaped cross section on the outer peripheral edge. The knife is shaped and formed as a ridgeline of the tip.

On the other hand, as described in Patent Document 1, it is known that a grooved scribing wheel which forms a deeper crack can be formed by forming a groove at a fixed interval on the ridge line of the blade edge.

The grooved scribing wheel alternately contacts the substrate by the protruding tip portion and the groove portion alternately on the substrate. As a result, a scribe line is formed on the surface of the substrate while facing the impact of the substrate, so that the depth of the vertical crack extending along the scribe line becomes deeper than that formed by the scribe wheel without the above groove. The depth of the crack. Furthermore, the so-called scribing means the mark of the scribe line formed on the surface of the substrate of the brittle material. The trace includes a scribing wheel to impart a plastic deformation portion of the brittle material substrate or a micro crack generated in a horizontal direction on the surface of the substrate.

Further, according to the grooved scribing wheel, the blade tip portion is collectively subjected to the load of the crimping, whereby the depth of the vertical crack becomes deeper, and therefore, the scribe wheel having the groove is higher in permeability.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 3074143

Regarding the grooved scribing wheel having high permeability as described above, it has been found that the use of the depth of the groove and the groove width (the length in the extending direction of the ridge line) are different, and after the glass substrate is separated, the glass is cut. In terms of breaking the substrate of a brittle material such as a substrate, the relationship between the depth of the groove and the groove width is important.

That is, if the groove width is too large with respect to the depth of the groove, the edge angle of the blade edge portion between the groove and the groove becomes excessively obtuse, and the embedding (cutting) of the brittle material substrate is deteriorated. Further, when scribing is performed using the grooved scribing wheel, the glass piece corresponding to the shape of the groove portion is peeled off from the glass substrate due to passage of time, and becomes a relatively large cullet. Due to the shape of the groove and the size of the scribing wheel, when the vertical crack is formed on the brittle material substrate, the glass piece is peeled off, cullet is easily generated, and the cullet which is generated becomes large, and the larger shard is generated on the brittle material substrate. The glass will have an adverse effect in the steps after the breaking step and the breaking step.

Moreover, the grooved scribing wheel can form a deep vertical crack by impacting, and conversely, it also produces a micro crack in the horizontal direction. Therefore, there is a scribe line as compared with the scribing wheel without the groove. The tendency to widen the line width.

Moreover, the scribing formed by the scribing wheel usually also breaks the brittle material substrate. Thereafter, it remains on the end surface of the substrate. Therefore, if the line width of the scribe line is widened, various problems may occur.

For example, a display panel such as a liquid crystal panel used in a display device is intended to have a narrow frame because it is intended to be small, to improve design, and to realize an ultra-large panel for connecting a plurality of panels. Even if the scribe line remains in the frame area, there is no problem as long as the width of the frame area is sufficiently wide. However, if the width of the frame area becomes insufficient as the narrow frame is developed, the display panel is assembled using the display panel. After that, the frame is exposed from the outside of the display device.

Further, the glass fragments are peeled off from the scribe lines remaining on the surface of the substrate, and the glass shards adhere to the surface of the substrate or scratch the wiring of the display panel.

Further, regarding the grooved scribing wheel having high permeability, it has been found that the depth of the groove and the width of the groove (the length of the groove in the extending direction of the ridge line) are different, and after the division of the glass substrate, The line width is wide, and the relationship between the depth of the groove and the width of the groove is important.

That is, it is understood that if the width of the groove is too large with respect to the depth of the groove, not only the vertical crack is stretched, but also the crack is largely extended in the horizontal direction, so that the line width of the scribe line is widened.

Therefore, the present inventors have carried out various studies in order to eliminate this problem, and finally designed to eliminate the width of the groove to a specific range by the depth of the groove by the scribe wheel in which a plurality of grooves are formed on the ridge line. This problem is thus completed by the present invention.

That is, the present invention has been made in order to solve the above problems, and an object thereof is to provide a grooved scribing wheel, a scribing device, a scribing method, and a display panel which are most suitable for breaking a brittle material substrate and having high permeability. Method and display panel.

In order to achieve the above object, an scribe wheel according to an aspect of the present invention is characterized in that it has a ridge line along a circumferential portion of the circular plate and a knives including inclined surfaces on both sides of the ridge line. A plurality of grooves are formed on the ridge line, and the groove depth is 2 μm or more, and the width of the groove in the side view direction is 35 μm or less and 3.2 times or less the depth of the groove.

Such a scribing wheel can form a deeper crack on the brittle material substrate with less cutting load, thereby suppressing the groove of the scribing wheel to cause the generation of broken glass. Further, such a scribing wheel can suppress the line width of the scribe line formed on the surface of the brittle material substrate from being widened.

A scribing device according to another aspect of the present invention is characterized in that it has a ridge line along a circumferential portion of the circular plate and a blade including inclined surfaces on both sides of the ridge line, and a plurality of grooves are formed on the ridge line. a scribing wheel having a depth of 2 μm or more, a width of the groove in a side view direction of 35 μm or less, and 3.2 times or less a depth of the groove; and the scribing device includes: a bracket The scribing wheel is rotatably held; and the scribing head is mounted with the above bracket.

Such a scribing device can form a deep crack on the brittle material substrate with less cutting load, and suppress the generation of broken glass due to the groove of the scribing wheel, so that it is the most suitable for breaking the brittle material substrate. Permeability scribing device. Further, such a scribing device can suppress the line width of the scribe line formed on the surface of the brittle material substrate from being widened.

Another method of scribing according to another aspect of the present invention is characterized in that it is a scribing method for forming a scribing brittle material substrate on a brittle material substrate using a scribing wheel, and is used as a scribing wheel as follows: along a disc The circumferential portion has a ridge line and a blade including inclined surfaces on both sides of the ridge line, and a plurality of grooves are formed on the ridge line, the groove has a depth of 2 μm or more, and the groove width in the side view direction is 35 Μm or less and 3.2 times or less the depth of the groove; the scribing method applies a load to the scribing wheel to rotate the surface of the brittle material substrate to form a scribe line.

Such a scribing method can form a deep crack on the brittle material substrate with less cutting load, and suppress the generation of cullet due to the groove of the scribing wheel. Moreover, the scribing method of such a brittle material substrate can suppress the line width of the scribe line formed on the surface of the brittle material substrate Widening.

A method of manufacturing a panel for display according to another aspect of the present invention is characterized in that the method for manufacturing a panel for displaying a scribing wheel is used, and the scribing wheel is used as follows: a ridge line is formed along a circumferential portion of the disc. And a blade including the inclined surface on both sides of the ridge line, wherein the plurality of grooves are formed on the ridge line, the groove has a depth of 2 μm or more, and the groove width in the side view direction is 35 μm or less, and is the above The manufacturing method is to apply a load to the scribing wheel to form a scribe line while rotating on the surface of the mother substrate, and to divide the mother substrate to obtain the display panel.

According to the manufacturing method of such a display panel, the line width of the scribe line can be suppressed from being widened, and the width of the scribe line remaining at the end portion of the substrate can be made small.

A display panel according to another aspect of the present invention includes: a display region in which a plurality of pixels are formed, and a frame region around the display region; and a streaking mark is formed at an end portion of the frame region, The width of the scribe line is 15 μm or less.

Such a display panel can suppress the influence of the scribe line formed at the end portion of the frame region.

10‧‧‧ scribe device

11‧‧‧Mobile Station

12a, 12b‧‧‧ rails

13‧‧‧Ball screw

14, 15‧‧ ‧ motor

16‧‧‧ mounting table

17‧‧‧Battery material substrate

18‧‧‧CCD camera

19‧‧ ‧Bridge

20a, 20b‧‧ ‧ pillar

21‧‧‧Drawing head

22‧‧‧ Guides

23‧‧‧ bracket joint

23a‧‧‧Rotary shaft

23b‧‧‧Connector

24a, 24b‧‧‧ bearing

24c‧‧‧ spacer

25‧‧‧ openings

26‧‧‧Internal space

27‧‧‧ magnet

28‧‧‧ parallel sales

30‧‧‧ bracket

31‧‧‧Installation Department

31a‧‧‧ inclined section

31b‧‧‧flat

32‧‧‧ Keep slot

33a, 33b‧‧‧Support

34a, 34b‧‧‧ support holes

40‧‧‧marking wheel

41, 41a‧‧‧ substrate

41‧‧‧ Body Department

42‧‧‧knife

43‧‧‧Tool tip

44‧‧‧ slots

45‧‧‧through holes

50‧‧ ‧ sales

60‧‧‧Display panel

61‧‧‧Display area

62‧‧‧Border area

70‧‧‧ mother substrate

71‧‧‧Dashing

71a‧‧‧Scratch marks

72‧‧‧ vertical crack

73‧‧‧Front frame

74‧‧‧ display device

Fig. 1 is a schematic view showing a scribing apparatus in the embodiment.

Fig. 2 is a front view of a holder joint included in the scribing device in the embodiment.

Figure 3 is a perspective view of the stent in the embodiment.

Figure 4 is a partial enlarged view of the stent in the embodiment.

Fig. 5(a) is a side view of the scribing wheel in the embodiment, Fig. 5(b) is a front view of the scribing wheel, and Fig. 5(c) is a partially enlarged view of the scribing wheel.

Figure 6 (a) is a plan view and an enlarged view of the mother substrate, Figure 6 (b) is a cross-sectional view of CC in Figure 6 (a), Figure 6 (c) is after the mother substrate in Figure 6 (b) is broken Sectional view.

Figure 7 is a cross-sectional view of the display device.

Fig. 8 is a table showing the scribing wheels of Experimental Examples 1 to 8.

Fig. 9 is a table showing the results of scribing of the scribing wheels of Experimental Examples 1 to 8.

Fig. 10 is a graph showing the line width of the scribe lines formed by the scribing wheels of Experimental Examples 1 to 8.

Fig. 11 is a photograph of a scribe line formed using the scribing wheels of Experimental Example 1, Experimental Example 4, and Experimental Example 6.

Fig. 12 is a graph showing the crack lengths of the scribe lines formed by the scribing wheels of Experimental Examples 1 to 8.

Hereinafter, embodiments of the present invention will be described using the drawings. However, the embodiments described below are examples for embodying the technical idea of the present invention, and the present invention is not intended to be limited to the embodiments. The invention is also applicable to other embodiments included in the scope of the claims.

A schematic view of the scribing device 10 of the embodiment is shown in FIG. The scribing device 10 includes a mobile station 11. Further, the moving table 11 is screwed to the ball screw 13, and is driven by the motor 14, and the ball screw 13 is rotated, thereby being movable in the y-axis direction along the pair of guide rails 12a, 12b.

On the upper surface of the mobile station 11, a motor 15 is provided. The motor 15 is used to rotate the upper stage 16 in the xy plane to be positioned at a specific angle. The brittle material substrate 17 is placed on the mounting table 16 and held by a vacuum suction mechanism or the like (not shown). Further, the brittle material substrate 17 as a scribing target is a brittle material substrate such as a glass substrate, a ceramic substrate, a sapphire substrate, or a tantalum substrate.

The scribing device 10 includes two CCD (Charge Coupled Device) cameras 18 above the brittle material substrate 17, and takes an alignment mark formed on the surface of the brittle material substrate 17. Further, in the scribing device 10, the bridge portion 19 is bridged in the x-axis direction by the pillars 20a and 20b so as to straddle the movable table 11 and the upper stage 16 thereof.

A guide 22 is mounted to the bridge portion 19, and the scribing head 21 is disposed along the guide 22 at the x Move in the direction of the axis. Further, in the scribing head 21, the bracket 30 is attached to the spacer bracket 23.

2 is a front view of the bracket joint 23 to which the bracket 30 is mounted. 3 is a perspective view of the bracket 30. Further, Fig. 4 is an enlarged view of a portion of the side surface of the holder 30 as viewed in the direction A of Fig. 3.

The bracket joint 23 has a substantially columnar shape and includes a rotating shaft portion 23a and a joint portion 23b. In the state in which the bracket joint 23 is attached to the scribing head 21, in the rotating shaft portion 23a, the two spacers 24a, 24b for rotatably holding the bracket joint 23 are attached via the cylindrical spacer 24c. . Further, in Fig. 2, a front view of the bracket joint 23 is shown, and a cross-sectional view of the bearings 24a, 24b and the spacer 24c attached to the rotating shaft portion 23a is also shown.

The cylindrical joint portion 23b is provided with an internal space 26 having a circular opening 25 on the lower end side. A magnet 27 is embedded in the upper portion of the internal space 26. Further, the bracket 30 freely attached and detached by the magnet 27 is inserted and mounted in the internal space 26.

As shown in FIG. 3, the bracket 30 is substantially cylindrical and formed of a magnet metal. Further, a mounting portion 31 for positioning is provided on the upper portion of the bracket 30. The mounting portion 31 is formed by cutting out the upper portion of the bracket 30, and includes an inclined portion 31a and a flat portion 31b.

Further, the mounting portion 31 side of the bracket 30 is inserted into the internal space 26 via the opening 25. At this time, the upper end side of the bracket 30 is attracted by the magnet 27, and the inclined portion 31a of the mounting portion 31 comes into contact with the parallel pin 28 passing through the internal space 26, whereby the positioning and fixing of the bracket 30 to the bracket joint 23 is performed. Further, when the bracket 30 is detached from the bracket joint 23, the bracket 30 can be easily detached by being pulled downward.

At a lower portion of the bracket 30, a retaining groove 32 formed by cutting the bracket 30 is provided. Further, the support portions 33a, 33b are located at the lower portion of the bracket 30 which is cut out to provide the holding groove 32 with the holding groove 31 interposed therebetween. A scribing wheel 40 is rotatably disposed in the holding groove 32. Further, support holes 34a and 34b are formed in the support portions 33a and 33b, respectively, and the support holes 34a and 34b support the pin 50 for rotatably holding the scribing wheel 40 in advance.

Then, as shown in FIG. 4, the pin 50 is inserted into the pin hole 45 of the scribing wheel 40, and both ends of the pin 50 are disposed in the support holes 34a, 34b, thereby rotating the scribing wheel 40 arbitrarily The bracket 30 is mounted. Further, the support hole 34a has a step inside, and the opening diameter of the holding groove 32 side is larger than the opening diameter of the other side.

Next, the details of the scribing wheel 40 will be described. Fig. 5(a) is a side view of the scribing wheel 40, Fig. 5(b) is a front view of the scribing wheel 40, and Fig. 5(c) is an enlarged view of a portion indicated by a circle B of Fig. 5(a).

The scribing wheel 40 mainly includes a body portion 41, a blade 42, a blade edge 43, and a groove 44.

The body portion 41 has a disk shape. A through hole 45 that penetrates the main body portion 41 along the rotation axis is provided in the vicinity of the center of the main body portion 41. A pin 50 is inserted into the through hole 45, and the scribing wheel 40 is rotatably held by the bracket 30 via the pin 50. Further, an annular blade 42 is formed on the outer circumference of the main body portion 41.

The blade 42 is an annular body formed by a concentric inner circumference and an outer circumference centered on the rotation axis. Further, the blade 42 is substantially V-shaped in the front view, and the thickness of the blade 42 along the rotation axis gradually decreases toward the blade edge 43 as the ridge portion. That is, the blade 42 includes inclined faces that are both sides of the ridge line of the blade edge 43.

The blade edge 43 is provided along the outermost peripheral portion of the blade 42. Further, a blade edge 43 and a groove 44 are alternately formed on the outermost peripheral portion of the blade 42. Again, details regarding the slot 44 will be described below.

The scribing wheel 40 is formed of a super hard alloy or a sintered diamond. Further, the scribing wheel 40 may be used as a film coated with a hard material such as diamond on a substrate such as a cemented carbide.

For example, the scrim wheel 40 made of sintered diamond is mainly made of a combination of diamond particles, an additive containing the remainder, and a bonding material. The average particle diameter of the diamond particles is 1.5 μm or less. Moreover, the content of the diamond in the sintered diamond is in the range of 75.0 to 90.0 vol%.

As the additive, for example, at least one selected from the group consisting of tungsten, titanium, niobium and tantalum can be preferably used. Ultrafine particle carbide of the above elements. The content of the ultrafine particle carbide in the sintered diamond is in the range of 3.0 to 10.0 vol%, and the ultrafine particle carbide contains 1.0 to 4.0 vol% of titanium carbide and the remaining part of tungsten carbide.

As the bonding material, an iron group element is usually preferably used. Examples of the iron group element include cobalt, nickel, iron, and the like. Among them, cobalt is preferred. Further, the content of the bonding material in the sintered diamond is preferably the remainder of the diamond and the ultrafine particle carbide, more preferably in the range of 3.0 to 20.5 vol%.

Next, a method of manufacturing the scribing wheel 40 will be described. First, the diamond particles, the additive, and the bonding material are mixed, and the mixture is sintered at a high temperature and an ultrahigh pressure at which the diamond is thermodynamically stable. Thereby, a sintered diamond is produced. At the time of the sintering, the pressure in the mold of the ultrahigh pressure generating device is in the range of 5.0 to 8.0 GPa, and the temperature in the mold is in the range of 1500 to 1900 °C.

The sintered diamond from the manufacture is then cut into a circular plate of the desired radius. Then, an inclined surface is formed on each of the peripheral portions of the circular plate by cutting both sides, thereby forming a scribing wheel 40 having a V-shaped blade 42.

Then, the blade edge 43 as the ridge line of the scribing wheel 40 is abutted against the disk-shaped grindstone so that the U-shape shown in FIG. 5(C) is formed on the blade edge 43. Shaped groove 44. At this time, the grindstone is retracted each time a groove 44 is formed. Then, after the scribing wheel 40 is rotated by a rotation angle corresponding to a specific pitch, the next groove 44 is formed by abutting the grindstone again. In this way, the cutting edge 43 and the groove 44 are alternately arranged at equal intervals to the front end of the blade 42 of the scribing wheel 40.

Next, the size of the scribing wheel 40 will be described. The outer diameter Dm of the scribing wheel 40 is 1.0 to 10.0 mm, preferably 1.0 to 7.0 mm, and particularly preferably 1.0 to 5.0 mm. When the outer diameter Dm of the scribing wheel 40 is less than 1.0 mm, the operability of the scribing wheel 40 is lowered. On the other hand, when the outer diameter Dm of the scribing wheel 40 is larger than 10.0 mm, there is a case where vertical cracks cannot be formed when the slash is formed deep in the brittle material substrate 17.

Further, the thickness Th of the scribing wheel 40 is 0.4 to 1.2 mm, preferably 0.4 to 1.1 mm. When the thickness Th of the scribing wheel 40 is less than 0.4 mm, there is a case where workability and workability are lowered. On the other hand, when the thickness Th of the scribing wheel 40 is larger than 1.2 mm, the cost of the material and the manufacturing for the scribing wheel 40 becomes high.

Further, the blade edge angle θ1 of the blade 42 is usually an obtuse angle and is in the range of 90 ≦ θ1 ≦ 160 (deg), preferably 90 ≦ θ1 ≦ 140 (deg). Further, the specific angle of the blade edge angle θ1 is appropriately set depending on the material, thickness, and the like of the cut brittle material substrate 17.

Further, the groove 44 is formed such that the width L of the groove is 2.0 to 3.2 times the depth H of the groove. Further, the line indicated by a broken line in FIG. 5(c) indicates the line of the blade edge 43 before the groove 44 is formed on the scribing wheel 40. Moreover, the depth H of the groove is the deepest distance from the virtual line. Further, the width L of the groove means the length of the virtual straight line connecting the ends of the groove. Further, the width W of the ridge line is the length of the blade edge 43.

Here, the depth H of the groove is set according to the outer diameter of the scribing wheel 40 and the material and thickness of the brittle material substrate 17 to be cut. Further, the depth H of the groove is set in the range of 2.0 to 14 μm, and preferably in the range of 3.0 to 11.0 μm, more preferably in the range of 5.0 to 11.0 μm. When the depth H of the groove is less than 2.0 μm, it is difficult to form a deep vertical crack on the brittle material substrate. Further, when the depth H of the groove is larger than 14 μm, the volume of the groove becomes large, so that not only the crack in the vertical direction but also the crack extends in the horizontal direction, resulting in a widening of the line width of the scribe line. Further, the crack in the horizontal direction is further stretched by the passage of time, so that a plurality of horizontal cracks are combined, whereby the generation of relatively large cullet is unavoidable. Further, since the length of the crack in the horizontal direction depends on the volume of the groove, the width L of the groove is set to be 2.0 to 3.2 times the depth H of the groove, and the effect becomes particularly large when the depth H of the groove is 5.0 μm or more. .

Further, the width L of the groove is set in the range of 5.0 to 35 μm, preferably in the range of 7.0 to 30 μm. When the width of the groove exceeds 35 μm, the volume of the groove also becomes large, so that the width of the scribe line is widened, and the generation of large cullet cannot be avoided.

Further, the width W of the ridge line is preferably 10 to 30 μm. When the width of the ridge line is less than 10 μm, the load cannot be sufficiently transmitted to the substrate, so that the vertical crack cannot be sufficiently penetrated. On the other hand, when the width of the ridge line is larger than 30 μm, horizontal cracks are likely to occur.

Further, it is preferable that the width L of the groove is 1.0 to 3.2 times the width W of the ridge line, and more preferably 1.0 to 1.8 times. When it is less than 1.0 times, the vertical crack cannot be sufficiently stretched, and on the other hand, when it is more than 3.2 times, the width of the scribe line is wide, and the cullet becomes large.

Further, as long as the depth of the groove and the width of the groove are satisfied, the shape of the groove may have various shapes such as a U shape, a V shape, and a trapezoidal shape.

Further, the edge angle θ2 of the blade edge 43 indicated by θ2 in Fig. 5(c) is preferably in the range of 115 ≦ θ2 ≦ 135 (deg) which is the intersection point of the groove 44 and the blade edge 43. The angle of intersection between the tangent from the groove side and the tangent from the tool tip side is indicated. The reason for this is that if the edge angle becomes too large, the embedding (cutting) of the brittle material substrate is deteriorated. Further, the angle (tangential crossing angle) θ3 at which the two tangent lines passing through the intersection x of the groove 44 and the blade edge 43 in the groove 44 is preferably in the range of 60 ≦ θ3 ≦ 90 (deg).

Here, the influence of the line width LW of the scribe line formed on the surface of the brittle material substrate when the brittle material substrate is divided by the scribing wheel will be described using a specific example. Fig. 6(a) is a plan view and an enlarged view of a mother substrate which is a brittle material substrate, Fig. 6(b) is a cross-sectional view taken along line CC in Fig. 6(a), and Fig. 6(c) is a mother in Fig. 6(b) A cross-sectional view of the substrate after it has been broken. 7 is a cross-sectional view of the display device.

A brittle material substrate on which a scribe line is formed on a surface of a substrate by a scribing wheel is used to manufacture a large-sized glass substrate for a display panel 60 such as a liquid crystal panel. This glass substrate is also referred to as a mother substrate 70. Usually, the mother substrate 70 is used to manufacture a plurality of display panels 60 at a time. Further, the plan view of the mother substrate shown in (a) of FIG. 6 is not only the entire mother substrate but only a part.

First, as shown in FIG. 6(a), on the mother substrate 70, in each of the display panels 60 Into pixels and so on. Specifically, the display panel 60 includes a display area 61 and a frame area 62 around the display area 61. A plurality of pixels including switching elements, color filters, and the like are formed in the display area 61, and are formed in the frame region 62. A wiring or an external connection terminal or the like for transmitting various signals to each pixel of the display area 61.

Next, as shown in FIGS. 6(a) and 6(b), in the mother substrate 70 in which the display panel 60 is formed with a pixel or the like, the load scribing wheel 40 is rotationally moved along the boundary of the display panel 60. . Thereby, the scribe line 71 is formed on the surface of the mother substrate 70. Further, the scribe line 71 includes a plastic deformation region generated by the load of the scribing wheel 40 on the surface of the mother substrate 70 and a crack in the horizontal direction.

Then, as shown in FIG. 6(b), since the scribe line 71 is formed, the vertical crack 72 extends in the vertical direction of the mother substrate 70 from the substantially center of the scribe line 71 along the scribe line 71.

Then, by applying stress to the mother substrate 70 on which the scribe lines 71 and the vertical cracks 72 are formed, as shown in FIG. 6(c), the mother substrate 70 is divided into each panel, thereby completing the display panel 60.

Then, as shown in FIG. 7, the frame region 62 of the display panel 60 is covered by the frame-shaped outer frame 73, and a control substrate (not shown) or the like is connected to the display panel 60, whereby the display device 74 is manufactured. .

Here, if the line width LW of the scribe line 71 formed on the mother substrate 70 is widened, the following problems occur.

First, as shown in FIG. 6(c), the scribe line 71 is also divided into the display panel 60, and remains on the substrate end surface of the display panel 60 as a scribe line 71a at a ratio of about one-half of the line width LW. . If the frame width a of the frame region 62 is sufficiently wide, there is no problem. However, if the frame width a is narrowed due to the narrow frame, the proportion of the scribe line 71a in the frame width a increases. Therefore, even if the scribing mark 71a is completely covered by the outer frame 73 from the front direction, the scribing mark 71a is directly exposed when the display device 74 is viewed obliquely, or diffused reflection occurs due to the scribing mark 71a, resulting in a stroke. The line mark 71a becomes conspicuous.

Moreover, if the frame width a is widened in order to prevent the scribing marks 71a from being observed, there is a problem that the number of the display panels 60 manufactured by the mother substrate 70 is reduced. Moreover, if the width of the outer frame 73 is widened, there is a problem that the cost increases or the outer frame 73 overlaps the display area 61.

When a plurality of scribe lines 71a including the scribe lines 71 are left on the surface of the substrate end portion of the display panel 60 after the display device 74 is used, the final horizontal cracks are connected to each other by vibration or the like, and a small piece is generated. Broken glass, and scratches such as wiring due to the broken glass. Therefore, if it is intended to completely remove the scribe line 71a remaining on the display panel 60, additional steps such as polishing are required, resulting in an increase in cost.

In addition, when the display panel 60 is formed by laminating two mother substrates 70 as in the case of a liquid crystal panel, wiring or the like is formed on the same surface as the surface on which the scribe lines 71 are formed, and therefore, it is formed. The possibility of cutting the wiring or the like by the scribe line 71 is also small. However, if the mother substrate 70 to be used is one piece and the display panel 60 having a wiring or the like formed directly on the same surface as the surface of the mother substrate 70 on which the scribe line 71 is formed, there is also a formation of the display panel 60. The line 71 cuts off the wiring or the like.

A problem similar to the above can be solved by suppressing that the line width LW of the scribe line 71 formed on the surface of the mother substrate 70 is widened to make the line width LW as narrow as possible. Therefore, as a scribing method for suppressing the line width of the scribe line, the present embodiment is subjected to a scribing method in which the depth H of the groove 44 is 2 μm or more, and the width L of the groove 44 is 35 μm or less and 3.2 times the depth H. The scribing wheel 40 below applies a load to the scribing wheel 40 to rotate the surface of the brittle material substrate 17 to form a scribe line. Further, the scribing method can be used to suppress the line width of the scribe line from widening, thereby realizing a scribe line having a narrow line width.

Specific results of the breaking of the brittle material substrate 17 by the scribing method of the present embodiment will be described. First, as the scribing wheel 40 in which the depth H of the groove 44 is 2 μm or more and the width L of the groove 44 is 35 μm or less and 3.2 times or less the depth H is used as the scribing method of the present embodiment, the first and second embodiments are employed. 3 or 3 scribing wheels.

Specifically, in the scribing wheel of Embodiment 1,

Outer diameter Dm 2.0 mm

Thickness Th 0.65 mm

Tip angle θ1 115°

The depth of the groove H 10.7 μm

Slot width L 28.0 μm

L/H 2.6

The number of protrusions is 170.

Moreover, in the scribing wheel of Embodiment 2,

Outer diameter Dm 2.0 mm

Thickness Th 0.65 mm

Tip angle θ1 115°

The depth of the groove H 9.3 μm

Slot width L 26.0 μm

L/H 2.8

The number of protrusions is 180.

Moreover, in the scribing wheel of Embodiment 3,

Outer diameter Dm 2.0 mm

Thickness Th 0.65 mm

Tip angle θ1 115°

The depth of the groove H 7.7 μm

Slot width L 24.0 μm

L/H 3.1

The number of protrusions is 190.

Further, in order to compare with the scribing wheels of the first, second, and third embodiments, the two scribing wheels of Comparative Examples 1 and 2 were used to divide the brittle material substrate 17.

In the scribing wheel of Comparative Example 1,

Outer diameter Dm 2.0 mm

Thickness Th 0.65 mm

Tip angle θ1 115°

The depth of the groove H 10.7 μm

Slot width L 38.0 μm

L/H 3.6

The number of protrusions is 135.

Moreover, in the scribing wheel of Comparative Example 2,

Outer diameter Dm 2.0 mm

Thickness Th 0.65 mm

Tip angle θ1 115°

The depth of the groove H 7.7 μm

Slot width L 37.0 μm

L/H 4.8

The number of protrusions is 140.

In this way, the division of the 0.7 mm thick glass substrate was performed using five scribing wheels. Then, after observing the line width of the formed scribe line, the line widths of Examples 1, 2, and 3 were narrower than those of Comparative Examples 1 and 2 in which the groove width L was larger than the groove depth H. The reason for this is considered to be that, for example, in the case of Example 1 and Comparative Example 1 in which the depth H of the groove is the same, Comparative Example 1 in which the width of the groove is wide is also in the horizontal direction (parallel to the direction of the glass substrate surface). A crack is generated on the crack, and the crack stretches as time passes. As a result, the scribing wheel 1 of Comparative Example 1 was widened in width, and conversely, the scribing wheel of Example 1 suppressed the line width. Further, as the crack spreads in the horizontal direction, a relatively large glass piece (broken glass) corresponding to the volume of the groove is produced. Further, in the case of Example 3 and Comparative Example 2 which are the depth H of the groove, the same result was obtained.

Further, in the case of Example 1 and Comparative Example 1 in which the depth H of the grooves was the same, in Comparative Example 1 in which the width L of the grooves was wide, a plurality of glass sheets (broken glass) having a shape corresponding to the grooves were generated. That is, as the crack spreads in the horizontal direction, a relatively large cullet corresponding to the volume of the groove is produced. The cullet which is equivalent to a relatively large volume of the groove is difficult to remove if it is attached to the glass substrate, and has the possibility of adversely affecting the step of the breaking step or the subsequent steps (for example, scratching the surface of the glass substrate) Higher, so the production of such broken glass is not good. On the other hand, in the case of Example 1 in which the width L of the groove is small, the glass piece is not easily peeled off even after scribing. The reason for this is that the groove L is formed on the surface of the glass substrate in accordance with the ridge line corresponding to the protrusion, and the dotted line constituting the scribe line becomes long, and the ratio of the broken portion of the broken line corresponding to the groove becomes small. As a result, the scribe line can be formed with a small underline load, and as a result, the occurrence of stress which peels the glass sheet having the shape corresponding to the groove from the glass surface can be suppressed. Further, since the width L of the groove was small, the size of the cullet produced was also smaller than that of Comparative Example 1, and the influence by the cullet was extremely lower than that of Comparative Example 1. The result is the same in Example 3 and Comparative Example 2 in which the depth of the groove is the same.

Further, in the case of Comparative Examples 1 and 2 in which the width L of the groove is larger than the depth H of the groove, the load required for the vertical crack penetration tends to be larger than those of the first, second, and third embodiments. For example, in the case of dividing a 0.7 mm thick glass substrate, if it is attempted to compare the cutting load when the depth of the vertical crack is formed, that is, the vertical crack having a permeation amount of 400 μm or more, the examples 1, 2, and 3 are cut. Breaking load 7.5 kgf ( 73.5N) will produce vertical cracks of 400 μm or more. In contrast, in Comparative Examples 1 and 2, the load is 10 kgf ( 98.0N) will produce vertical cracks above 400 μm.

The reason for this is considered to be that if the width L of the groove is too large with respect to the depth H of the groove, the edge angle of the blade edge 43 indicated by θ2 in Fig. 5(c) becomes large, resulting in biting of the brittle material substrate (cutting in). ) is getting worse. As described above, the groove 44 is formed in advance so that the width L of the groove is 3.2 times or less with respect to the depth H of the groove. When it is necessary to form the same amount of vertical cracks on the brittle material substrate 17, the cut can be made. The breaking load becomes smaller. Therefore, it can be less The cutting load effectively generates vertical cracks, and therefore, the generation of cullet can be further reduced.

Next, the result of performing the breaking of the brittle material substrate 17 of the scribing method of the present embodiment using the scribing wheels different from those of the first, second, and third embodiments will be described. The scribing wheels used were those of Experimental Examples 1 to 8. The scribing wheels of Experimental Examples 1 to 8 had an outer diameter Dm of 2.0 mm, a thickness Th of 0.65 mm, and a cutting edge angle θ1 of 100°. FIG. 8 is a table showing other elements of Experimental Examples 1 to 8. In Fig. 8, the depths H of the grooves of Experimental Examples 1 to 8, the width L of the grooves, the width W of the ridge lines, the number of protrusions, L/H, and L/W are shown.

As shown in Fig. 8, the width L of the groove is 2.0 to 3.2 times the depth H of the groove, and the scribing wheel of the experimental example 2 to 8 is used, and the scribing wheel of the experimental example 1 is L/H. It is 3.8.

Then, using the scribing wheels of Experimental Examples 1 to 8, a load was applied to the scribing wheels, and the other side was rotated on the surface of the brittle material substrate, and scribing was performed so as to form a scribe line. Fig. 9 is a table showing the results of scribing using the scribing wheels of Experimental Examples 1 to 8. In Fig. 9, the cut region of the scribing wheel of Experimental Examples 1 to 8, the line width LW of the scribe line formed on the brittle material substrate, and the length of the crack are shown.

This cut-off area refers to a load area in which a good scribe line can be formed in terms of cutting a brittle material substrate. This load zone measures the minimum load based on the generation of the rib-shaped grain called the rib mark, and measures the minimum load to the horizontal crack or the crack of the substrate, etc. The value of the maximum load. As shown in Fig. 9, the cut regions were different depending on the scribing wheels of Experimental Examples 1 to 8, and the scribing wheels of Experimental Examples 2 to 8 were lower in the cutting region than the experimental example 1.

Further, as shown in Fig. 9, the load for forming the scribe line for measuring the line width LW is three modes: the minimum load (Min) of the cut region plus the load obtained by 1 N (hence, the load in each scribing wheel) Different), 10N load, and 15N load.

The line width LW is the maximum value of the crack in the horizontal direction appearing on the surface of the brittle material substrate. Further, the line width LW was measured by three loads. Furthermore, Figure 10 is the line to be measured. The wide LW draws the curve from the winner. Moreover, FIG. 11 is an actual photograph of the scribe line formed using the scribing wheel of Experimental Example 1, Experimental Example 4, and Experimental Example 6.

The length of the crack is the maximum value of the crack in the vertical direction appearing on the substrate of the brittle material. The length of the crack was also measured by three loads. Further, Fig. 12 is a graph obtained by plotting the length of the crack obtained.

Further, other conditions when scribing using the scribing wheels of Experimental Examples 1 to 8 are as follows.

Brittle material substrate: 0.7 mm glass substrate (single board, billet glass)

Marking device: Scribe device manufactured by Samsung Diamond Industry Co., Ltd. (MS type)

Marking speed: 300 mm/sec

As shown in FIG. 8 to FIG. 12, when the scribing wheel of the experimental example 1 in which L/H is not 3.2 or less (L/H is 3.8) is used, the experimental example with L/H of 3.2 or less is used. The line width is wider than that of the 2~8 scribing wheel.

In particular, in the case of dividing the glass substrate for a panel, the line width LW of the scribe line is preferably about 30 μm. The reason for this is that if the line width LW is 30 μm, the scribe line 71a of the scribe line 71 shown in FIG. 7 is about 15 μm, and if it is the scribe line 71a of this degree, it is less likely to be generated even if the frame is narrowed. The problem of the scribe mark 71a and the like can be recognized. Further, the scribing wheels of Experimental Examples 2 to 8 are often set to a low load (the load of Min+1N or the load of 10N in Fig. 9) in the cut region, and the line width LW is It is about 30 μm, or it is greatly narrower than 30 μm.

Further, as shown in FIG. 12, the scribing wheels of Experimental Examples 2 to 8 have a thickness of about 70 to 80% with respect to the thickness of the substrate, and particularly a crack of 600 μm or more under a load of 10 N, so that it is known that It also has a high permeability. Further, in Experimental Examples 2 and 3, the same permeability as in Experimental Example 1 was obtained while suppressing the increase in the line width.

Further, as shown in FIG. 8, the relationship between the width L of the groove and the width W of the ridge line is as an experimental example. The L/W of the scribing wheel of 1 was 3.3, whereas the scribing wheels of Experimental Examples 2 to 8 had an L/W of 3.2 or less. Further, as shown in FIGS. 8 and 10, the L/W of the scribing wheel is more preferably 1.8 or less in terms of suppressing the widening of the line width.

In this manner, the scribing wheel of the experimental examples 2 to 8 in which the depth H of the groove is 2 μm or more, the width L of the groove is 35 μm or less, and the L/H is 3.2 or less is applied, and a load is applied to the scribing wheel. By rotating the surface of the brittle material substrate to form a scribe line, vertical cracks can be effectively generated with less cutting load in the same manner as the scribing wheels of Examples 1, 2, and 3, so that the crushing can be further reduced. The production of glass. Further, a scribing wheel of the experimental examples 2 to 8 in which the depth H of the groove is 2 μm or more, the width L of the groove is 35 μm or less, and L/H is 3.2 or less is used, and a load is applied to the scribing wheel to apply The surface of the brittle material substrate is rotated to form a scribe line, whereby the high-permeability can be maintained in the same manner as the scribing wheels of the first, second, and third embodiments, and the line width LW of the scribing line can be suppressed from widening. A line with a narrow line width can be achieved.

The reason for this is that if the width L of the groove becomes too large with respect to the depth H of the groove, the edge angle of the blade edge 43 indicated by θ2 in Fig. 5(c) becomes large, resulting in embedding (cut-in for the brittle material substrate). ) is getting worse. Therefore, as described above, by setting the width L of the groove to be 3.2 times or less with respect to the depth H of the groove, the cutting of the brittle material substrate is improved, and the crack is prevented from extending in the horizontal direction, so that the crack efficiency is favorably improved. Stretch in the vertical direction.

Further, if the width L of the groove becomes too large, the distance between the blade edge 43 first embedded in the substrate and the blade edge 43 which is secondarily embedded in the substrate becomes wider, and a large cullet is generated at the position of the groove due to the impact impact. . Therefore, at this time, the crack in the horizontal direction is largely extended. On the other hand, as described above, by making the width L of the groove to be 3.2 times or less with respect to the depth H of the groove, the interval between the blade edge 43 and the blade edge 43 is also narrowed, and the cullet produced here is also small. Therefore, the crack in the vertical direction can be stretched while suppressing the crack from extending in the horizontal direction.

On the other hand, when the width L of the groove is made smaller than the depth H of the groove as compared with the examples 1, 2, 3 or the experimental examples 2 to 8, the specific comparative example is not particularly described, for example. When L/H becomes 1.9, it will result in a finer glass containing the scribe line. The cullet of the particles enters the trough, so that the broken glass accumulates in the trough every time the break is broken, so the amount of permeation will gradually decrease, which is not preferable.

Therefore, as described in the present embodiment, the groove 44 of the scribing wheel 40 can be formed so that the width of the groove 44 is 2.0 to 3.2 times the depth of the groove 44, thereby realizing the most suitable brittle material. The substrate 17 and the higher permeability can suppress the scribing wheel 40 in which the line width of the scribe line is widened. Further, by using such a scribing wheel 40 in the scribing device 10, the scribing device 10 exhibiting the above effects can be obtained.

Further, in the present embodiment, a method of polishing the disk-shaped grindstone is described as a method of forming the groove 44 in the blade 42 of the scribing wheel 40, but it may be, for example, laser processing. Other methods such as forming the groove wheel of the groove.

Further, in the present embodiment, the scribing device 10 is configured to be attached via the bracket joint 23 when the bracket 30 holding the scribing wheel 40 is attached to the scribing head 21. However, the scribing device 10 can also be configured to mount the bracket 30 directly on the scribing head 21.

Further, in the present embodiment, the scribing device 10 is provided with a scribing device provided with a guide 22 and a bridge portion 19 for moving the scribing head 21, or a mounting table 16 on which the brittle material substrate 17 is placed. The moving table 11 is rotated, but is not limited to such a scribing device 10. For example, in order to allow the user to hold the scribing head 21 on which the bracket 30 is mounted, one portion of the scribing head 21 is shaped like a handle, and the user holds the handle to move it to perform the brittle material substrate 17 . The so-called manual scribe device is broken.

Claims (8)

A scribing wheel characterized in that it has a ridge line along a circumferential portion of the circular plate and a blade including inclined surfaces on both sides of the ridge line, and a plurality of grooves are formed on the ridge line, and the groove The depth is 2 μm or more, and the width of the groove in the side view direction is 35 μm or less and 3.2 times or less the depth of the groove. The scribing wheel of claim 1, wherein the groove has a width of the groove of 2.0 or more times the depth of the groove. A scribing apparatus comprising: a bracket that rotatably holds a scribing wheel as claimed in claim 1 or 2; and a scribing head to which the bracket is mounted. A method for scribing a substrate of a brittle material, characterized in that a scribing wheel is used to form a scribing layer on a brittle material substrate, and as a scribing wheel, the following is used: a ridge line along a circumferential portion of the disc, and including a blade formed by the inclined surfaces on both sides of the ridge line, wherein a plurality of grooves are formed on the ridge line, the groove has a depth of 2 μm or more, and the groove width in the side view direction is 35 μm or less, and the groove is The depth is 3.2 times or less; a load is applied to the scribing wheel to rotate on the surface of the brittle material substrate to form a scribe line. The scribing method of the brittle material substrate according to claim 4, wherein the groove is used as the scribing wheel, and the width of the groove is 2.0 times or more the depth of the groove. A method of scribing a brittle material substrate according to claim 4 or 5, which is carried out in the manufacture of a display panel using the above-described brittle material substrate. A manufacturing method of a display panel, characterized in that it uses a scribing wheel Further, as the scribing wheel, a blade having a ridge line along a circumferential portion of the disk and an inclined surface including both sides of the ridge line is formed, and a plurality of grooves are formed on the ridge line, and the groove has a depth of 2 μm or more, the width of the groove in the side view direction is 35 μm or less, and is 3.2 times or less the depth of the groove; a load is applied to the scribing wheel to rotate on the surface of the mother substrate to form a surface. The above-mentioned mother substrate is cut and the above-mentioned display panel is obtained by dividing the above-mentioned mother substrate. A display panel having a display region in which a plurality of pixels are formed and a frame region around the display region, and a scribe line is formed at an end portion of the frame region, and the width of the scribe line is wide It is 15 μm or less.