TW201922645A - Scribing method and cutting method capable of forming a crack that is deep enough on a substrate under the condition that a scribe line is formed at a position directly above and below a sealing element - Google Patents

Abstract

An object of the present invention is to provide a scribing method and a scribing device, which form a crack that is deep enough on a substrate under the condition that a scribe line is formed at a position directly above and below a sealing element. The solution of the present invention is that when the scribe line is formed on a motherboard G on which two pieces of glass substrate G1 and G2 are bonded together by the sealing element SL, a scribing roller 301 is pushed and pressed at a position facing the sealing element SL on the surface of the glass substrate G1, while enabling the scribing roller 301 to move along the sealing element SL, at the same time a scribing roller 401 having a blade edge angle greater than that of the scribing roller 301 is pushed and pressed on the surface of the glass substrate G2, while enabling the scribing roller 401 to move along the sealing element SL.

Description

Scribing method and cutting method

The present invention relates to a scribing method for forming a scribe line on a substrate and a dicing method for dicing a substrate on which a scribe line has been formed.

In the past, the dicing of a brittle material substrate such as a glass substrate was performed by a scribe process in which a scribe line was formed on the surface of the substrate, and a dicing process in which a predetermined force was applied to the surface of the substrate along the formed scribe line. In the scribing process, the blade end of the scribing roller is pressed along the predetermined scribe line while being pressed by the substrate surface. The scribing is formed by using a scribing device having a scribing head.

Patent Document 1 below describes a method for cutting out a liquid crystal panel from a motherboard. In this method, a substrate on which a thin film transistor (TFT) is formed through a sealing member is bonded to a substrate on which a color filter (CF) is formed, whereby a motherboard is formed. Each liquid crystal panel is obtained by cutting the motherboard. The sealing element is disposed in such a manner that a space as a liquid crystal injection region can be left in a state in which two substrates are bonded together.

In the case of cutting the main board of the above configuration, a method may be employed in which two scribing heads are used to form a scribe line on both sides of the main board (for example, refer to Patent Document 2). In this case, the two scribing heads are arranged by sandwiching the main board. The two scribing rollers are in the same position when the main board is viewed from a plan view. In this state, the two scribing rollers move simultaneously in the same direction, and a scribe line is formed on each surface of the motherboard. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-2006-137641 (Patent Document 2) JP-A-2012-240902

[Problems to be solved by the invention]

As also described in the above Patent Document 1, in the conventional motherboard, there is a region where the sealing member does not enter between adjacent liquid crystal injection regions. Thus, as described above, when the scribe lines are formed on both sides of the main board by the two scribe lines, the scribe lines can be formed in the area where the sealing member is not involved. If the scribe line is formed in this way and the motherboard is cut, a frame area of a predetermined width is left around the liquid crystal injection region of the liquid crystal panel.

However, in recent years, in particular, in the liquid crystal panel for mobile devices, the frame region is extremely narrow as much as possible, and it has gradually become mainstream. In response to this requirement, a configuration is required in which the area where the sealing member is not interposed is omitted on the motherboard, and the adjacent liquid crystal injection regions are only separated by the sealing member. In this case, the scribe lines are formed directly above and below the sealing member.

However, when the scribe line is formed at a position directly above and below the sealing member in this manner, particularly when the thickness of the glass substrate is as thin as 0.4 mm or less, cracks between the two glass substrates are insufficient. The problem was confirmed by the invention team of the application. If the breaking process is performed in a state where the crack is insufficient in this manner, it is feared that fine cracks, breakage, and the like may occur at the edge of the broken substrate, and the strength of the glass substrate may be lowered.

In view of the related problems, an object of the present invention is to provide a scribing method and a scribing apparatus which can form a deep crack on a substrate in a case where a scribe line is formed directly above and below a sealing member of a thin glass substrate. . [Means to solve the problem]

The inventor of the present invention changes the blade angle of the scribing roller for scribing the respective scribing positions above and below the main board by attempting to make a scribe line at a position directly above and below the sealing member, thereby It was found that deeper cracks were formed on the respective substrates.

A first invention of the present invention relates to a scribing method in which a scribe line is formed on a main board on which a first substrate and a second substrate are bonded together by a sealing member. In the scribing method according to the first aspect of the invention, the first blade is pressed along the sealing member at a position facing the sealing member on the surface of the first substrate, and the first blade is moved along the sealing member. A scribe line is formed on the surface of the first substrate. Further, at the same time as the movement of the first blade, a second scribing roller having a blade angle larger than that of the first scribing roller is rotated along the sealing member, and a scribe line is formed on the surface of the second substrate.

According to the scribing method of the first aspect of the invention, it is possible to form a deep crack on the main plate in the case where the scribe line is formed at a position directly above and below the sealing member.

In the scribing method according to the first aspect of the invention, the difference between the blade edge angle of the first scribing roller and the blade edge angle of the second scribing roller is preferably set to 5° or more and 25° or less. In this way, the depth of the crack can be effectively deepened.

A second invention of the present invention relates to a cutting method of cutting a main board to which a first substrate and a second substrate are bonded together by a sealing member. The cutting method of the second invention includes: a scribing process of rotating a first scribing roller along the sealing member at a position facing the sealing member on a surface of the first substrate, and forming a scribing surface on the surface of the first substrate Simultaneously with the movement of the first scribing roller, the second scribing roller having a larger blade edge than the first scribing roller is formed along the sealing member to form a scribe line on the surface of the second substrate; and the breaking process Stress is applied to the motherboard along the second scribe line, and is disconnected only from the side of the second substrate of the motherboard G.

According to the cutting method of the second aspect of the invention, in the same manner as the scribing method of the first invention described above, in the case where the scribe line is formed at a position directly above and below the sealing member, a deep crack can be formed on the main board and borrowed. The main board is cut by one disconnection process, and the strength of the main board can be kept relatively high without causing fine cracks, breakage, or the like at the edge of the first substrate and the second substrate. [Effect of the invention]

As described above, according to the present invention, it is possible to provide a scribing method and a cutting method in which a deep crack is formed on a substrate in a case where a scribe line is formed at a position directly above and below the sealing member. The effects or significance of the present invention will become more apparent from the description of the embodiments shown below. However, the embodiments shown below are merely one of the examples when the present invention is implemented, and the present invention is not limited by the contents described in the following embodiments.

Embodiments of the present invention will be described below with reference to the drawings. Further, in each of the drawings, the X-axis, the Y-axis, and the Z-axis which are perpendicular to each other are attached for convenience. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.

<Scribing Device> FIGS. 1(a) and 1(b) are diagrams showing the structure of the scribing device 1 in a mode. Fig. 1(a) is a view of the scribing device 1 as seen from the positive side of the Y-axis, and Fig. 1(b) is a view of the scribing device 1 as seen from the positive side of the X-axis.

Referring to Fig. 1(a), the scribing device 1 includes a conveyor belt 11, pillars 12a, 12b, guide rails 13a, 13b, guide rails 14a, 14b, sliding units 15, 16, and two scribing heads 2.

As shown in FIG. 1(b), the conveyor belt 11 is provided along the Y-axis direction except where the scribing head 2 is disposed. A main board G is placed on the conveyor belt 11. The motherboard G has a substrate structure in which a pair of glass substrates are bonded to each other. The main board G is fed out by the conveyor belt 11 along the Y-axis direction.

The pillars 12a, 12b are vertically disposed by sandwiching the conveyor belt 11 on the base of the scribing device 1. The guide rails 13a, 13b and the guide rails 14a, 14b are respectively parallel to the X-axis direction and are spanned between the pillars 12a, 12b. The slide units 15, 16 are respectively disposed on the guide rails 13a, 13b and the guide rails 14a, 14b in a free sliding state. On the guide rails 13a, 13b and the guide rails 14a, 14b, a predetermined drive mechanism is provided, by which the slide units 15, 16 are moved in the X direction.

The slide units 15, 16 are respectively mounted with the scribing heads 2. The scribing tools 30, 40 are attached to the scribing head 2 on the positive side of the Z-axis and the scribing head 2 on the negative side of the Z-axis, with the main plates G facing each other. The scribing head 2 is moved in the X-axis direction in a state where the scribing roller held by the scribing tools 30, 40 is pressed by the surface of the main plate G. Thereby, a scribe line is formed on the surface of the motherboard G.

In the present embodiment, the scribing tools 30, 40 holding the scribing rollers 301, 401 are used. The scribing rollers 301, 401 respectively form a V-shaped blade on the outer circumference of the disc, and have small grooves at a predetermined interval on the ridgeline of the blade. Further, the scribing roller 301 of the scribing tool 30 and the scribing roller 401 of the scribing tool 40 have different blade angles in the ridge lines. The scribing method of this embodiment will be described below.

<Embodiment 1> Figs. 2(a) to 2(c) are views for explaining a scribing method of the embodiment 1. Fig. 2(a) is a schematic view of the vicinity of the scribe line position from the negative side of the Y-axis, and Fig. 2(b) is a pattern view near the scribe line position from the positive side of the X-axis, and Fig. 2(c) is from Z. The positive side of the axis looks at the pattern diagram near the line position.

As shown in Fig. 2(a), in the present scribing method, the scribing head 301 of the scribing head 301 of the scribing head 2 on the upper side (the positive side of the Z-axis) has a blade edge angle θ1 and a lower side (Z-axis negative side). The scribing wheel 401 of 2 has a different blade edge angle θ2, and the blade edge angle θ2 is larger than the blade edge angle θ1. Specifically, the blade angle θ2 of the scribing roller 401 is 5 to 25 degrees larger than the blade edge angle θ1 of the scribing roller 301. The two scribing rollers 301 and 401 are attached to the scribing tools 30 and 40 in a rotatable state with the shafts 301a and 401a as rotation axes, respectively.

Referring to Fig. 2(b), the main board G is formed by bonding two glass substrates G1 and G2 through the sealing member SL. A thin film transistor (TFT) is formed on the glass substrate G1, and a color filter (CF) is formed on the glass substrate G2. The liquid crystal is injected into the region R by the sealing member SL and the two glass substrates G1, G2, and then the liquid crystal is injected into the liquid crystal injection region R. The two scribing rollers 301 and 401 are positioned in a state in which they are not shifted from each other in the Y-axis direction. The scribing roller 301 is pressed by the surface of the glass substrate G1 at a position directly above the sealing element SL, and the scribing roller 401 is pressed by the surface of the glass substrate G2 at a position directly below the sealing element SL.

As shown in FIG. 2(c), the sealing elements SL are arranged in a lattice shape. The two scribing rollers 301, 401 move in the positive direction of the X-axis along the sealing member SL. Thereby, as shown in FIGS. 2(b) and 2(c), the scribe lines L1 and L2 are formed on the surfaces of the glass substrates G1 and G2, respectively.

<Experiment 1> The inventive team of the present application performed an experiment of forming a scribe line on the re-master board G according to the scribing method shown in Figs. 2(a) to (c). The results of this experiment and experiment will be explained below.

In this experiment, a substrate (main board) in which glass substrates G1 and G2 each having a thickness of 0.2 mm were bonded together through a sealing member SL was used. The scribing rollers 301, 401 respectively form a V-shaped blade on the outer circumference of the disc and have a small groove at a predetermined interval on the ridgeline of the blade. The scribing rollers 301, 401 have a diameter of 3 m, a small groove number of 750, a groove depth of 1.5 μm, and a scribing roller 401 having a blade edge angle θ2 of 125°.

As shown in FIGS. 2(a) to 2(c), the scribing rollers 301 and 401 of this configuration are pressed and moved by the glass substrates G1 and G2 to perform a scribing operation. When the scribing operation is performed, the load applied to the scribing rollers 301, 401 is controlled to 7N. Further, the moving speed of the scribing rollers 301 and 401 is set to a fixed value (200 mm/sec).

Under the above conditions, the blade edge angle θ1 of the scribing roller 301 was set to 120°, and then the amount of penetration of cracks in the glass substrates G1 and G2 was measured. As a comparative example, the amount of penetration of cracks when the blade edge angle θ1 of the scribing roller 301 and the blade edge angle θ2 of the scribing roller 401 were 125° were also measured. In each measurement, the amount of ribs was measured in addition to the amount of penetration of the crack.

Figure 3 shows the experimental results. Fig. 3 is a graph showing the amount of penetration of the crack and the amount of ribs by numerical values, which are the results when the blade angle θ1 of the scribing roller 301 is 120° and 125°, respectively.

Referring to Fig. 3, when the blade edge angle θ1 is 120° and the blade edge angle θ1 is 125°, the amount of ribs and the amount of penetration of cracks in the glass substrate G1 are large, and in particular, the amount of penetration of cracks is larger than the amount of ribs. At least one of the glass substrates G1, G2 generates cracks with a large amount of permeation, whereby the main board G can be appropriately cut in the breaking process.

For example, as shown in the comparative example (the same as θ1 and θ2), when the amount of cracks in the glass substrates G1 and G2 is less than or equal to half the thickness (0.2 mm) of the glass substrates G1 and G2, it is necessary to The glass substrates G1, G2 are respectively disconnected on both sides of the motherboard G. When the glass substrates G1 and G2 are respectively disconnected from both sides of the main board G in this manner, the edges of the glass substrates G1 and G2 may be slightly cracked or broken, resulting in the glass substrates G1 and G2. The strength is reduced.

On the other hand, when θ1 is larger than θ2, the amount of penetration of cracks in the glass substrate G2 is small, and the amount of penetration of cracks in the glass substrate G1 is large. When the amount of penetration of cracks in the glass substrate G1 is large in this manner, stress can be applied to the substrate G2 along the scribe line of the glass substrate G2 having a small amount of penetration of the crack in the breaking process, only from the motherboard One side of G performs a disconnection action. When this breaking operation is performed, the glass substrate G1 having a deep crack is also cut along the crack at the same time. When the glass substrates G1 and G2 are disconnected from only one side of the main board G in this manner, the glass substrates G1 and G2 can be formed without causing fine cracks, breakage, or the like at the edge of the glass substrates G1 and G2. The strength is kept quite high.

From the above reasons, it is understood that in the cutting process of the main board G, it is preferable to cause cracks to occur in any of the glass substrates G1 and G2 with a large amount of permeation. In this experiment, the difference in angle between the two scribing rollers 301 and 401 is 5°, but the difference in the angle is larger, and the amount of permeation of the crack of the glass substrate G1 is confirmed as compared with the comparative example (θ1=θ2). The tendency to become bigger. Therefore, the difference in angle between the two scribing rollers 301, 401 is preferably 5 or more. On the other hand, when the difference between the blade angles θ1 and θ2 is too large, the scribe rollers 301, 401 may have problems such as rib formation or cracks occurring in the horizontal direction of the substrate, and the difference between the blade angles θ1 and θ2. It should be 25° or less. By setting the blade angles θ1 and θ2 of the two scribing rollers 301 and 401 in this manner, the opening operation of the main board G can be appropriately performed.

<Experiment 2> The inventors of the present application further changed the blade edge angle θ1 of the scribing roller 301 and the scribing load to perform an experiment of forming a scribing on the main board G. The results of this experiment and experiment will be explained below.

In the present experiment, the mother board G to which the glass substrates G1 and G2 having a thickness of 0.2 mm were bonded together through the sealing member SL was used. Further, the scribing rollers 301 and 401 are the same as the above-described experiment 1 except for the blade edge angle θ1 of the scribing roller 301. In the present experiment, the blade angle θ1 of the scribing roller 301 was set to 105°, 115°, and 125°. The blade angle θ2 of the scribing roller 401 is all 125°, and the difference between the blade angles θ1 and θ2 is 20°, 10°, and 0°, respectively. Further, the moving speed of the scribing rollers 301 and 401 is set to a fixed value (300 mm/sec).

Under the above conditions, the depth of the ribs in the glass substrates G1 and G2 and the amount of penetration of the cracks were measured while changing the load applied to the scribing tools 30 and 40, and the cutting at the time of forming the scribing was also evaluated. Sex and subsequent separation in the process.

Fig. 4 and Fig. 5 (a) to (f) show experimental results. Fig. 4 is a graph showing the amount of ribs and the amount of permeation of cracks, and the evaluation of the cutting property and the separation property by symbols. Fig. 5 is a photograph of the surface of the main board G after the scribing, and a photograph of the cross-section after the separation, and Fig. 5 (a) and (b) are photographs and cross-sectional photographs showing the cutting property and the separation property in a good state, respectively. (c) and (d) are surface photographs and cross-sectional photographs showing that the separation property is in a bad state. In the case of Fig. 5(c), it is a photograph of the surface of one of the separated substrates.

Referring to Fig. 4, in the case where the blade angle θ1 of the scribing roller 301 is 105°, when the scribing load is in the range of 6N to 7.5N, the amount of permeation in the glass substrate G1 is 190 μm or more, and the glass substrate G2 is saturated. The amount is 40 μm or more. At this time, as shown in FIGS. 5(a) and 5(b), the glass substrates G1 and G2 can be scribed with good separation. When the scribing load is 5.5 N or less, the rib pattern occurs in a part of the scribe line in terms of the cutting property, and as shown in FIGS. 5(c) and (d), the separation is not possible along the scribe line. Bad conditions of normal separation. On the other hand, when the scribing load is 7.5 N, ribs and vertical cracks are generated almost in the entire region of the substrate thickness of the glass substrate G1, so the measurement of the amount of ribs and the amount of permeation cannot be performed, but the light force can be light. Both of the glass substrates G1 and G2 were separated, and the separation property was good. Further, when the load is increased and the scribing load is 8 N, on the glass substrate G1, as shown in FIGS. 5(e) and (f), there is an irregular crack toward the front of the scribing roller when scribing. The phenomenon that has developed and is called "running ahead" has resulted in a decline in the quality of cuts.

Similarly, when the blade edge angle θ1 of the scribing roller 301 is 115°, when the scribing load is in the range from 7N to 9N, the amount of permeation in the glass substrate G1 is 130 μm or more, and the amount of permeation in the glass substrate G2. When it is 60 μm or more, it is possible to perform a scribing operation in which the cutting property and the separation property are good.

On the other hand, when the blade edge angle θ1 of the scribing roller 301 is 125°, when the scribing load is increased, the amount of ribs and the amount of permeation in the glass substrates G1 and G2 also increase, but in the glass substrates G1 and G2. The difference in the amount of ribs and the amount of permeation becomes small. In particular, the amount of increase in the glass substrate G1 is relatively small when the blade angle θ1 is the same load of 105° and 115°. Therefore, it is understood that the separation property of the glass substrate G1 is lowered within a wide range of the load. When the scribing load is increased to 10 N, the glass substrates G1 and G2 can be normally cut and separated. However, it is understood that the cutting property and the separation property are good when the blade angle θ1 is 105° or 115°. The load required for the scribing action is quite high and the load range is also narrow.

As described above, when any of the glass substrates G1, G2 can generate cracks with a large amount of permeation, the main board G can be appropriately cut in the breaking process.

Furthermore, the greater the difference between the blade angle θ1 and the blade edge angle θ2, the smaller the load that can perform a good scribing operation. In other words, although the blade angle of the scribing roller 401 does not change, the range of the appropriate scribing load moves toward the low load side for the glass substrates G1, G2, and the load range is equal to the blade angle θ1 and the blade edge angle θ2. The comparative examples are also extensive.

<Embodiment 2> In the scribing method (the scribing method 1) in the above embodiment, the scribing roller 301 on the positive side of the Z-axis and the scribing roller 401 on the negative side of the Z-axis are oriented in the scribing direction (X-axis) The positive direction is crossed at the same position. In other words, the scribing rollers 301, 401 hold the main board G in opposite directions. On the other hand, in the second embodiment, the scribing roller 301 is located at a position facing the scribing direction (the positive X-axis direction) and at a distance W1 from the front surface of the scribing roller 401 to move the two scribing rollers. 301, 401.

6(a) and 6(b) are diagrams for explaining the second embodiment. Fig. 6(a) is a schematic view showing the vicinity of the scribe line position from the negative side of the Y-axis, and Fig. 6(b) is a schematic view showing the vicinity of the scribe line position from the positive side of the X-axis.

In the second embodiment, as in the first embodiment, the blade edge angle θ2 of the scribing roller 401 on the side opposite to the blade edge angle θ1 of the scribing roller 301 is increased. Further, as shown in FIG. 6(a), the two scribing rollers 301, 401 are separated by a distance W1 along the scribing direction (X-axis direction). In other words, the scribing roller 401 having a large blade angle is located at a distance W1 from the rear of the scribing roller 301. In this state, the two scribing rollers 301 and 401 are pressed by the glass substrates G1 and G2, respectively. The sealing member SL moves in the positive direction of the X-axis. Thereby, it becomes easy to form a deep vertical crack on the glass substrate G1.

<Effects of Embodiment 2> According to this embodiment, the following effects can be obtained. As in the first embodiment, the scribe line L1 can be formed with a deep crack at a position directly above the sealing member SL. In particular, the amount of penetration of cracks in the substrate G1 can be further increased and cracks can be stably formed.

<Modifications> The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and the embodiments of the present invention may be variously modified in addition to the above.

For example, in the above embodiment, a scribe line roller having a small groove formed at a predetermined interval on the ridge line of the blade is used, but it is conceivable that the same effect can be obtained by using a scribe line roller which does not form a small groove on the ridge line. The size and shape of the scribing roller (blade) are not limited to those described in the above embodiment, and other sizes, shapes, and types of blades can be used as appropriate.

Further, in the above-described embodiment, the scribing roller 301 on the upper side of the main board G may be moved in front of the lower scribing wheel 401 in the scribing direction, and the lower side of the main board G may be used as the blade angle θ1. The wire roller 301 is moved in the direction of the scribe line in front of the upper side scribe roller 401 having a larger blade angle θ2. In this case as well, the same effects as described above can be obtained.

In addition, the structure, thickness, material, and the like of the motherboard G are not limited by the contents described in the above embodiments, and the scribe method of the above-described embodiment 1, 2 may be used for cutting the motherboard G of other structures. And cutting methods. The embodiments of the present invention can be variously modified within the scope of the technical idea shown in the claims.

1‧‧‧ scribe device

2‧‧‧Drawing head

11‧‧‧Conveyor belt

12a, 12b‧‧ ‧ pillar

13a, 13b, 14a, 14b‧‧‧ rails

15,16‧‧‧Sliding unit

30,40‧‧‧Drawing tools

301,401‧‧‧Dashing wheel

301a, 401a‧‧‧ axis

G‧‧‧ motherboard

G1, G2‧‧‧ glass substrate

L1, L2‧‧‧

R‧‧‧LCD injection area

SL‧‧‧ sealing element

W1‧‧‧ distance

Θ1, θ2‧‧‧ blade angle

Fig. 1 is a view schematically showing the configuration of a scribing apparatus of an embodiment. Fig. 2 is a view for explaining a scribing method of an embodiment. Fig. 3 is a view showing the experimental results obtained by the scribing method of the embodiment. Fig. 4 is a view showing the experimental results obtained by the scribing method of the embodiment. Fig. 5 is a view showing a state of a substrate obtained by performing a scribing method of a pattern. Fig. 6 is a view for explaining another scribing method of the embodiment.

Claims (5)

A scribing method for forming a scribe line on a main board on which a first substrate and a second substrate are bonded together by a sealing member, and a scribing roller formed on a periphery of the disc to form a V-shaped blade, wherein: a position facing the sealing member on the surface of the first substrate, rotating the first scribe line roller along the sealing member, forming a scribe line on the surface of the first substrate, and simultaneously moving along with the movement of the first scribe line The sealing element rotates a second scribe roller having a larger blade edge than the first scribe roller, and a scribe line is formed on the surface of the second substrate. The scribing method of claim 1, wherein a difference between a blade edge angle of the first scribing roller and a blade edge angle of the second scribing roller is set to be 5° or more and 25° or less. The scribing method of claim 1 or 2, wherein the second scribing roller is rotated at a displacement position at a predetermined distance from the first scribing roller in a direction along the sealing member. The scribing method of claim 3, wherein the second scribing roller is located behind the scribing direction with respect to the first scribing roller. A cutting method for cutting a main board to which a first substrate and a second substrate are bonded together by a sealing member, comprising: a scribing process at a position facing the sealing member on a surface of the first substrate; Rotating the first scribe line roller along the sealing element, forming a first scribe line on the surface of the first substrate, and rotating the blade edge angle along the sealing element along the first scribe line at the same time as the movement of the first scribe line a second scribe line roller having a large roller, a second scribe line formed on a surface of the second substrate; and a breaking process for applying stress to the motherboard along the second scribe line, only from the first portion of the motherboard G The side of the second substrate is disconnected.