JP6551661B2 - Method and apparatus for scribing brittle material substrate - Google Patents

Description

  The present invention relates to a method and an apparatus for scribing a brittle material substrate, and more specifically, it divides a glass substrate used for a flat panel display (hereinafter referred to as "FPD"), or various semiconductor wafers, ceramics, etc. The present invention relates to a scribing method and a scribing apparatus for forming a plurality of products by dividing a brittle material substrate by forming a plurality of scribe lines intersecting each other on the surface of the brittle material substrate.

  FPD related products have various applications in liquid crystal display panels, liquid crystal projector substrates, organic EL elements and the like, and are used as display means for images and characters. In this type of FPD, for example, a liquid crystal display panel formed by bonding a pair of glass substrates is divided into a predetermined size after bonding a pair of large mother glasses in the manufacturing process.

  The mother glass substrate is divided by applying a load to the cutter wheel of the scribe unit moved above the surface of the mother glass substrate using a scribe device and rotating the cutter wheel along one direction. Move. Such work is sequentially moved from the progress start position and repeated a predetermined number of times to form first scribe lines parallel to each other in the first direction.

  Thereafter, the traveling direction of the cutter wheel is changed to a direction intersecting (non-parallel) with the first direction to form a second scribe line in a second direction intersecting with the first scribe line in the first direction. To do.

  Then, the glass substrate having the intersecting scribe line is sent to the breaking mechanism, and the substrate is divided along the scribing line by applying predetermined bending stress to the substrate with the scribing line as a central axis in the breaking mechanism. Thereby, a liquid crystal display panel of a desired size can be obtained.

Japanese Patent No. 4203015

  When the cutting edge of the cutter wheel used in the scribing device or other scribing cutter is not processed in advance and the uneven cut surface as shown in FIG. 2A is not formed, when scribing on the brittle material substrate, the so-called “ The phenomenon of "intersection fly" occurs. This refers to a phenomenon in which a scribe line that should be formed along a predetermined breaking line cannot be formed when the cutter wheel passes near the previously formed scribe line. This is because stress remains on both sides of the previously formed scribe line, and later when the cutter wheel crosses the previously formed scribe line, the crack is directed downward to the brittle material substrate of the cutter wheel against the brittle material substrate. This is because the force that generates the pressure is weakened, and a desired scribe line cannot be formed smoothly.

  Therefore, in the past Applicant's invention (refer to Japanese Patent No. 4203015), the scribing method in which the scribe line in the first direction and the scribe line in the second direction intersecting with each other does not cause any intersection. This prevents defects such as notches due to intersection jumps, cracks due to the pressing of the substrates, and scraping. However, in the case of the scribing method that does not cause any intersection as described above, the machining speed is lowered because the raising and lowering of the cutter wheel must be repeated in the scribing process.

  In view of the above-mentioned drawbacks of the prior art, the present invention effectively reduces the processing time by adjusting the load of the cutter wheel when forming the scribe line, and when scribing a part of brittle substrate material, There is provided a scribing method and apparatus that suppresses the dependence on the shape and special processing of the cutter wheel and that is less likely to cause defects in substrate products such as so-called burrs, scrapes, and socks.

  In order to solve this problem, a method of scribing a brittle material substrate according to the present invention is a method of scribing a brittle material substrate including a first surface and a second surface with respect to the first surface, the scribing method (A) setting a plurality of planned dividing lines extending along each of at least a first direction and a second direction not parallel to the first direction on the first surface of the brittle material substrate. Step (B): A scribe line is formed along a plurality of planned dividing lines set by the scribe unit, and a variable load is applied to the scribe unit, whereby at least one first line is formed in the first direction. Forming at least one second scribe line in a second direction crossing the first scribe line and forming a scribe line of The at least one first scribe line and the at least one second scribe line intersect to form at least one intersection, and (C) the at least one first scribe line. The load applied to the scribe unit when scribing a line is P1 when the scribe unit is not in the vicinity of the at least one intersection, and when the scribe unit is in the vicinity of the at least one intersection. (D) The load applied to the scribe unit when scribing the at least one second scribe line is the load when the scribe unit is not in the vicinity of the at least one intersection. Is P2, and the scribing unit is in the vicinity of the at least one intersection point A load of M2, and (E) M1, M2 are both smaller than at least P1 and P2, and not zero. According to this, the situation of defects such as so-called chipping, squeezing, sage or the like caused by the intersection fly is reduced.

  More preferably, the region near the intersection is a rhombus region defined by two intersecting first scribe lines and parallel lines separated from the second scribe line by 0.2 mm to 1.0 mm. More preferably, the region near the intersection is a rhombus region defined by two parallel lines separated from the first scribe line and the second scribe line by 0.5 mm to 0.7 mm, respectively. It is. Generally, the thickness of the brittle material substrate is 0.025 to 40 mm.

  When the brittle material substrate to be scribed is a liquid crystal substrate, the thickness of the substrate is 0.3 to 0.7 mm, and the more preferable range of P1 and P2 is between 0.05 MPa and 0.11 MPa, It can be set to 0.08 MPa, and a more preferable M1 is 0.05 MPa. In another embodiment, P1 and P2 are 0.11 MPa, the range of M1 is between 0.05 MPa and 0.07 MPa, and the range of M2 is between 0.05 MPa and 0.09 MPa.

  The present invention is also a brittle material substrate scribing apparatus for dividing the brittle material substrate, wherein the brittle material substrate is scribed by the above method. It is assumed that the scribe unit has a cutter wheel and that the blade portion does not have an uneven tooth shape is selected according to the type of substrate, or that the blade portion has an uneven tooth shape. it can. The scribing unit is controlled by a progress control means, and the progress control means is controlled such that the scribing speed of the scribing unit is 10 to 1000 mm / sec. According to the apparatus of the present invention, it is possible to effectively reduce the phenomenon of intersection jumping and product defects resulting therefrom.

  According to the present invention having such characteristics, it is possible to reduce the situation of defects such as so-called chipping, cockle and soge caused by jumps in intersection. Also, according to the apparatus of the present invention, the phenomenon of intersection jumping and product defects resulting from this can be effectively reduced.

FIG. 1 is a schematic front view of a scribing apparatus for a brittle material substrate according to a first embodiment of the present invention. FIG. 2A is a side view of the cutter wheel used in the present invention as seen from the rotational axis direction. FIG. 2B is a front view seen from a direction perpendicular to the rotation axis of the cutter wheel used in the present invention. FIG. 2C is an enlarged view of a cutting edge shown in FIG. 2A. FIG. 3A is a side view of a modification of the cutter wheel used in the present invention viewed from the direction of the rotation axis. FIG. 3B is a front view seen from a direction perpendicular to the rotation axis of a modified example of the cutter wheel used in the present invention. FIG. 4 is an enlarged cross-sectional view of a vertical crack generated when the brittle material substrate is scribed by the cutter wheel shown in FIG. FIG. 5 is a plan view of an example of a brittle material substrate for explaining the scribing method of the present invention. FIG. 6A is a plan view of another example of a brittle material substrate for explaining the scribing method of the present invention. FIG. 6B is a local enlarged view of FIG. 6A, showing a region K near the intersection of the first scribe line and the second scribe line. FIG. 6C is a local enlarged view of FIG. 6A, showing a region K near the intersection of the first scribe line and the second scribe line.

  The features of the present invention and the effects thereby will be described below by way of examples. However, these embodiments do not limit the scope of protection sought by the present invention.

  FIG. 1 is a schematic front view of a scribing apparatus 100 for a brittle material substrate according to the present invention. The scribing apparatus 100 is provided with a vacuum suction means, a suction means by static electricity, an adhesion means, etc., which are not shown, and generally sucks a brittle material substrate G to be divided having a thickness of between 0.025 to 40 mm. It has a horizontally rotatable work table 1 to be fixed. The work table 1 is supported by a pair of parallel guide rails 2, 2, and can be moved along the guide rails 2, 2 by a ball screw 3 in the Y-axis direction (direction orthogonal to the paper surface).

  A guide rod 4 is provided above the work table 1 along an X-axis direction (left and right direction in the drawing) orthogonal to the Y-axis direction. The guide bar 4 is provided with a scribe unit 5 that can slide in the X-axis direction along the guide bar 4 and a motor 6 that drives and slides the scribe unit 5.

  At the lower part of the scribe unit 5, there are provided a cutter support portion 7 that can be moved up and down and swingable, and a cutter wheel 8 that is rotatably attached to the lower end of the cutter support portion 7. Also, the brittleness on the worktable 1 above the guide rod 4 so that the cutting device of the brittle material substrate can adjust the position of the worktable 1 based on the marks and move the divided substrate to the accurate scribing and dividing position A pair of CCD cameras 9 which identify the alignment marks of the material substrate G are provided.

  The scribing apparatus 100 includes load control means and progress control means including operation software and an apparatus interface. When the load control means and the movement control means are formed by scribing the first scribe line along the first direction and the second scribe line along the second direction on the surface of the brittle material substrate The slide operation of the scribing unit 5 is controlled, and the load applied to the cutter wheel 8 through the cutter support 7 is controlled. Thereby, when the cutter wheel 8 forms at least two intersecting first scribe lines and second scribe lines, the scribe load exerted on the brittle material substrate G from the cutter wheel can be adjusted.

  As a modification, the scribe unit 5 may be fixed to the guide rod 4 (and therefore the motor 6 is not required), and the work table 1 may be an XY table type that can move along the X-axis and Y-axis directions. Good. Alternatively, the work table 1 may be fixed and the scribe unit 5 may be of a type that can move along the X-axis and Y-axis directions.

  FIG. 2 is an example of a cutter wheel used in the present invention. The cutter wheel 8 has a blade portion having a ridge line and an inclined surface on the outer periphery, and has a tooth-like unevenness on the blade portion, and when rotating and scribing, it is short periodically with respect to the surface of the brittle material substrate G Impact can be given. Conventionally, if a blade portion of a cutter wheel is formed by providing a fine groove with a predetermined interval on the edge of the blade edge, i.e., forming a continuous protrusion, when forming a scribe line intersecting along two directions, It is known that the projections formed on the ridges of the cutter wheel can produce a concentrated impact on the brittle material substrate. When the cutter wheel passes a stress residue near the previous scribe line, the pressure on the cutter wheel against the brittle material substrate can be maintained. In particular, for some brittle substrate materials, a vertical crack of a desired sufficient depth can be obtained at a predetermined scribe position in an actual operation, so a division operation is performed by a break mechanism etc after scribing, and an ideal defect Products can be divided into

  2A is a side view of the appearance of the cutter wheel 8 seen from the direction of the rotation axis, FIG. 2B is a front view of the appearance of the cutter wheel 8 seen from the direction perpendicular to the rotation axis, and FIG. 2C is shown in FIG. 2A It is an enlarged view of a blade edge line. As shown in FIG. 2C, a U-shaped groove 11 is formed in the cutting edge ridge line 10 of the cutter wheel 8, and a protrusion 12 having a height h exists for each pitch P. As an example, the cutter wheel 8 has an outer diameter of 2.5 mm, a thickness of 0.65 mm, a blade edge angle 2θ of 125 °, a number of protrusions of 125, a protrusion height h of 5 μm, and a pitch P of 63 μm. It is done. As another example, the outer diameter is 2.0 mm, the thickness is 0.65 mm, the blade edge angle 2θ is 105 °, the number of protrusions is 360, the protrusion height h is 3 μm, and the pitch P is 63 μm. Also good.

  FIGS. 3A and 3B are other examples of the cutter wheel used in the present invention. The blade portion of the cutter wheel 8 shown in FIGS. 3A and 3B does not have tooth-like irregularities.

  According to the method of changing the load applied to the cutter wheel of the scribe unit in the vicinity region K of the intersection of the first scribe line and the second scribe line by the scribe device 100, the intersection of the present invention is as follows. The object of reducing the flying phenomenon can be realized.

  FIG. 4 is a cross-sectional view of a substrate on which a scribe line remains after scribing a brittle material substrate 1 having a cutting edge load of 0.08 MPa, a scribe speed of 300 mm / sec, and a thickness of 1.1 mm by the cutter wheel 8. Show. The brittle material substrate 1 has a first surface F and a second surface S with respect to the first surface. On the first surface of the brittle material substrate 1, a plurality of dividing lines are set in advance. The planned dividing line extends at least along each of the first direction and the second direction, and the first direction and the second direction are not parallel and intersect each other after scribing along the planned dividing line. A scribe line is formed.

  The cutter wheel 8 of the scribing unit 5 rolls along a plurality of set dividing lines to form (scribe) a scribing line, and at least one first scribing line L (or in the first direction) (or First scribe lines L1, L2, and L3) shown in FIG. 5 are formed, and at least one second scribe line R (or the first scribe line R shown in FIG. 5) in the second direction intersecting the first scribe line is formed. Two scribe lines R1, R2, R3), and at least one first scribe line L and at least one second scribe line R intersect to form at least one intersection A. The first and second scribe lines L and R preferably have a groove shape formed by the cutter wheel 8 and further include vertical cracks extending further downward by the cutting pressure of the cutter wheel 8. More preferably, the scribe line is formed so that the vertical crack (measured value is 962 μm) substantially penetrates the plate thickness. In this way, since it is possible to appropriately divide along the scribe line during the dividing operation of the next step, it is possible to improve the yield rate.

  Subsequently, control of the sliding operation of the scribing unit 5 and the load applied to the cutter wheel 8 by the load control means and the movement control means will be described. It is preferable that the scribing speed of the scribing unit 5 controlled by the progress control means is 10 to 1000 mm / sec.

  Before the scribing operation, the forming position and the distance between the first scribe lines L1 to L3, the forming position and the distance between the second scribe lines R1 to R3, the scribing line start position, the scribing line stop position, the load conversion Data such as the start position and the load conversion stop position are used as variables, and input to a computer on which software constituting load control means and travel control means is installed.

  As shown in FIG. 5, the upper left corner of the brittle material substrate G is used as a reference point O, and the predetermined formation positions of the first scribe lines L1 to L3 and the distances between them are also input to the computer. Here, for convenience of explanation, a simple input numerical value is taken as an example, and the scribe line L1 is 10 mm from the reference point O to the X axis (right side), and the scribe line L2 is from the reference point O to the X axis (right side) The scribing line L3 is set to 100 mm so as to be positioned at 200 mm.

  In the present embodiment, the load applied to the cutter wheel 8 is controlled by a load control means comprising software and an interface device. Among them, the blade edge load of the cutter wheel 8 when the cutter wheel 8 scribes a portion of the first scribe line L other than the vicinity region K of the intersection of the first scribe line and the second scribe line is P1 ( For example, it is set to 0.08 MPa). Similarly, the cutting edge load of the cutter wheel 8 when the cutter wheel 8 scribes a portion of the second scribe line R other than the region K near the intersection of the first scribe line and the second scribe line is P2 ( For example, it is set to 0.08 MPa).

  The cutter wheel 8 respectively scribes the first scribe line L and the second scribe line R using the set loads P1 and P2. As shown in FIG. 5, the first scribe line L1 is scribed downward from the uppermost edge of the substrate shown in the drawing, and the second scribe line R1 is moved from the position on the left side of the substrate shown in the drawing to the right. It can be scribe.

  The scribing operation will be described in more detail below. The cutter wheel load in progress is in the region K (including the intersection itself, as shown in the enlarged view of FIG. 6A) of the cutter wheel 8 at the intersection of the predetermined first scribe line and the second scribe line. It does not change basically except when it is located. When the cutter wheel 8 travels to a region K near the intersection of the first scribe line and the second scribe line, the load of the cutter wheel 8 that scribes the first scribe line L is changed to M1, and the second scribe is performed. The load of the cutter wheel 8 for scribing the line R is changed to M2. Both M1 and M2 are smaller than P1 and P2. Also, P1 can be larger than P2, and P1 can be smaller than P2.

  In order to set a change in load in the area K near the intersection of the scribe lines, first, a predetermined direction in the X axis direction (rightward in FIGS. 5 and 6A) from the reference point O of the first scribe lines L1 to L3. The positions are each entered into the computer.

  Subsequently, the numerical value of the scribe line start position of the predetermined first scribe line L1 is input. In this embodiment, it is at the top edge of the substrate or at a position slightly away from the top edge of the substrate.

  Further, the first load conversion start position B1 of the predetermined first scribe line L1 in progress of scribe is input. The load conversion start position B1 is set at a predetermined distance upward along the Y-axis direction from the predetermined formation position of the second scribe line R1, for example, 0.5 mm in this embodiment.

  Subsequently, the numerical value of the first load conversion stop position B2 of the predetermined first scribe line L1 is input. The load conversion stop position B2 is set at a predetermined distance downward in the Y axis direction from the predetermined formation position of the second scribe line R1, that is, 0.5 mm in this embodiment.

  As described above, as shown in FIGS. 6A, 6B, and 6C, the second load conversion start position B3 and the second load conversion stop of the first scribe line L1 are formed on the brittle substrate having a predetermined size. Numerical values of a position B4, a third load conversion start position B5, a third load conversion stop position B6, a fourth load conversion start position B7, and a fourth load conversion stop position B8 are sequentially set. . Setting and inputting the numerical values of the positions of the predetermined first scribe lines L2 and L3 are performed in the same manner as in the above method.

  Next, predetermined positions in the Y-axis direction (downward in FIGS. 5 and 6A) from the reference point O of the second scribe lines R1 to R3 are input to the computer.

  Subsequently, the numerical value of the scribe line start position A1 of the predetermined second scribe line R1 is input. The scribe line start position A1 of the second scribe line R1 is a predetermined distance to the right along the X-axis direction from the predetermined formation position of the first scribe line L1, in this example, 0.5 mm away. In the example shown in, the position is 10.5 mm on the X axis.

  Further, the first load conversion start position A2 of the predetermined second scribe line R1 is input. The load conversion start position A2 is a predetermined distance leftward from the predetermined formation position of the first scribe line L2 along the X-axis direction, 0.5 mm in this example, that is, in the example shown in FIG. 6A. The position is 99.5 mm on the X axis.

  Subsequently, the numerical value of the first load conversion stop position A3 of the predetermined second scribe line R1 is input. The load conversion stop position A3 is a predetermined distance to the right along the X-axis direction from the predetermined formation position of the first scribe line L2, 0.5 mm in this example, that is, in the example shown in FIG. 6A. The position is 100.5 mm on the X axis.

  Finally, the scribe line stop position A4 of the predetermined second scribe line R1 is input. The scribe line stop position A4 is a predetermined distance leftward from the predetermined formation position of the first scribe line L3 along the X-axis direction, 0.5 mm in this example, that is, in the example shown in FIG. 6A. The position is 199.5 mm on the X axis.

  The load conversion start positions B1, B3, A2, etc., and the load conversion stop positions B2, B4, A3, etc. are each in the process in which the computer forms the first and second scribe lines L1 to L3 and R1 to R3. This is for changing the load applied to the cutting edge of the cutter wheel 8 at each of the positions to M1 and M2. More preferably, M1 is smaller than P1 and smaller than P2. For example, when P1 and P2 are 0.08 MPa, M1 is set to 0.05 MPa.

  The order of the input of each numerical value can be arbitrarily changed, and is not limited to the above example. In addition, the position of the reference point O does not necessarily have to be located at the upper left corner of the brittle material substrate G, but is at any other position on the substrate surface, a position other than the corner, or a predetermined position such as the center of any side. May be located.

  In another embodiment, the brittle substrate G is a liquid crystal substrate and has a thickness of 0.3 to 0.7 mm, more preferably 0.4 mm. The range of the cutter wheel loads P1 and P2 is more preferably between 0.05 MPa and 0.11 MPa, and a value of 0.08 MPa generally close to the middle can be used. When the scribe unit is in the region K near the intersection of the first scribe line and the second scribe line, the load M1 of the cutter wheel 8 is set to 0.05 MPa, and M2 is set to a value smaller than P1 and P2. Is more preferable.

  In another specific embodiment, the brittle substrate G is a liquid crystal substrate and has a thickness of 0.3 to 0.7 mm, more preferably 0.4 mm. When the cutter wheel loads P1 and P2 are 0.11 MPa, and the scribe unit is in the region K near the intersection of the first scribe line and the second scribe line, the range of the load M1 of the cutter wheel 8 is 0.05 MPa to 0 0.07 MPa, and the range of M2 is between 0.05 MPa and 0.09 MPa.

  An example of one scribing step is described below. The scribing unit is slid along the guide bar 4 to above the scribing start position of the first scribing line L1. Since the first scribe lines L1 to L3 start scribing from the edge of the substrate 1, scribing is started at a location where a slight distance is moved along the first extension line of the substrate outward along the first scribe line L1 It can be a position.

  After reaching the scribing start position, the sliding of the scribing unit is temporarily stopped, the cutter supporting portion 7 is lowered, and the cutter wheel 8 provided in the cutter supporting portion 7 is lowered to the scribe line starting position. Then, a cutting edge load P1 is applied to the cutter wheel 8 to start scribing. When the cutter wheel 8 enters the vicinity area K of the intersection of the predetermined first scribe line and the second scribe line, the load is adjusted to M1. Thus, the first scribe lines L1 to L3 are sequentially formed.

  Thereafter, the workbench 1 rotates 90 ° and scribes the second scribe lines R1 to R3. At this time, the scribing unit 5 is controlled by the movement control means, and slides along the guide rod 4 to the upper side of the scribing start position of the second scribing line R1.

  After reaching the scribe start position, it is temporarily stopped, the cutter support portion 7 is lowered, the cutter wheel 8 provided on the cutter support portion 7 is lowered to the scribe line start position A1, and the cutting edge load P2 is applied to the cutter wheel 8. And scribe. When the cutter wheel 8 moves to the right and proceeds to the load conversion start position A2, the load is lowered to M2, and after passing through the region K near the intersection of the first scribe line and the second scribe line, that is, load conversion. At the stop position A3, the load is returned to P2, and the scribing is continued to the scribe line stop position A4. Thus, the second scribe lines R1 to R3 are gradually scribed.

  It is also possible to first scribe the first scribe line L1, then scribe the second scribe line R1, and further scribe the first scribe line L1. The order of scribing is not limited to this, and the order of scribing can be changed according to the actual situation.

  The area K near the intersection where the scribing is performed by the low loads M1 and M2 is more preferably 0.2 mm to 1.0 mm away from the two intersecting first and second scribe lines. Within the rhombus region defined by parallel lines. Further, a rhombus region defined by parallel lines separated from each other by 0.5 mm to 0.7 mm from the two intersecting first scribe lines and second scribe lines may be used. Actually, when forming two scribe lines that intersect perpendicularly to each other, the position where the lower loads M1 and M2 are used is the position K shown in FIGS. 6B and 6C.

  In actual test results, when scribing two intersecting first and second scribe lines with a fixed load, two methods are used regardless of which of the front and rear scribe loads is smaller. The defect status and proportion of the manufactured products were about the same. However, when the load is reduced in the region K near the intersection of the first scribe line and the second scribe line by the method of the present invention, the state and rate of product defects are clearly improved.

  As an example of the material of the brittle material substrate 1 divided by the present invention, a glass, liquid crystal panel, wafer, ceramics substrate, or a brittle material substrate such as a plasma display panel (PDF) or an organic EL display device was bonded. Examples include a flat panel display (FPD) or a mother bonded substrate such as a transmissive projector substrate and a reflective projector substrate.

  The substrate is further divided after completion of scribing. For example, the brittle material substrate can be divided along the scribe line to form a plurality of products by mechanical division methods such as shearing, punching, cutting, vibration, and bending division.

  Although the above description mainly describes the case of forming a scribe line on a glass substrate which is a kind of brittle material substrate, the present invention is not limited to this. For example, the scribing device and scribing method of the present invention are also applied to liquid crystal display panels. Can be effectively applied to realize the object of the present invention.

Reference Signs List 1 work table 2 guide rail 3 ball screw 4 guide bar 5 scribe unit 6 motor 7 cutter support 8 cutter wheel 10 edge ridge 11 groove 12 protrusion 100 scribe device A1 scribe line start position A2 load conversion start position A3 load conversion stop position A4 Scribe line stop position B1, B3, B5, B7 Load conversion start position B2, B4, B6, B8 Load conversion stop position G brittle material substrate K Near area L, L1 to L3 first scribe line R, R1 to R4 Second scribe line

Claims (10)

A scribing method for forming a scribe line on a brittle material substrate including a first surface and a second surface relative to the first surface, wherein the scribing method comprises:
(A) setting a plurality of planned dividing lines extending along each of at least a first direction and a second direction not parallel to the first direction on the first surface of the brittle material substrate; ,
(B) At least one first scribe line is formed in the first direction by scribing along a plurality of predetermined dividing lines set by the scribing unit and applying a variable load to the scribing unit And forming at least one second scribe line in a second direction intersecting the first scribe line, and
The at least one first scribe line and the at least one second scribe line intersect to form at least one intersection;
(C) The load applied to the scribing unit when forming the at least one first scribing line is a load when the scribing unit is not in the vicinity of the at least one intersection point is P1; The load is M1 when is in the region near the at least one intersection point,
(D) The load applied to the scribing unit when scribing the at least one second scribing line is such that the load when the scribing unit is not in a region near the at least one intersection is P2; The load is in the vicinity of the at least one intersection point is M2, and
(E) A scribing method for a brittle material substrate in which both M1 and M2 are at least smaller than P1 and P2 and not 0.   The method for scribing a brittle material substrate according to claim 1, wherein P1 = P2.   The method for scribing a brittle material substrate according to claim 1, wherein P1> P2.   The method for scribing a brittle material substrate according to claim 1, wherein P1 <P2.   The region near the intersection is a rhombus region defined by two intersecting first scribe lines and parallel lines separated from the second scribe line by 0.2 mm to 1.0 mm. A method of scribing a brittle material substrate as described above.   The method for scribing a brittle material substrate according to claim 1, wherein the thickness of the brittle material substrate is 0.025 to 40 mm.   The method for scribing a brittle material substrate according to claim 6, wherein the brittle material substrate is a liquid crystal substrate with a thickness of 0.3 to 0.7 mm.   The method for scribing a brittle material substrate according to claim 1, wherein the range of P1 and P2 is between 0.05 MPa and 0.11 MPa.   The brittle material substrate scribing method according to claim 1, wherein the range of M1 is between 0.05 MPa and 0.07 MPa, and the range of M2 is between 0.05 MPa and 0.09 MPa.   A scribing apparatus for a brittle material substrate which scribes a brittle material substrate by the scribing method for a brittle material substrate according to any one of claims 1 to 9.