TWI774883B - Scribing method and scribing device for bonding substrates - Google Patents

Abstract

The present invention provides a scribing method and a scribing device for bonding substrates. The method suppresses the deformation of the terminal region during scribing, and can obtain a high-quality product.

The scribing method of the bonded substrate is to cut off a part of the edge portion of the first substrate 1 The edge portions of the two substrates 2 form the bonding substrates of the terminal area T, and the upper and lower substrates are divided in the direction of the terminal area T by the upper and lower cutting wheels 3a and 3b. It includes: a selection step, which is to select a preset appropriate cut-in amount that does not exceed the terminal failure point of the terminal area; Scribing; the scribing step is to scribble the terminal area with a second scribing load smaller than the first scribing load; and the retreat step is performed at the terminal end of the terminal area, the cutter wheel does not stop Escape from the terminal.

Description

Scribing method and scribing device for bonding substrates

The present invention relates to a scribing method for processing scribe lines for dividing an adhesive substrate (or also called an adhesive mother substrate, hereinafter referred to as "mother substrate") formed by bonding two substrates, especially The invention relates to a scribing method and a scribing device for a mother substrate having a terminal area at the edge.

The mother substrate for the manufacture of liquid crystal display panels is a first substrate (also called a CF side substrate) on which a plurality of color filter patterns have been formed, and a pattern on which a plurality of TFTs and terminal regions have been formed through a sealing material encapsulating the liquid crystal. The second substrate (also known as the TFT side substrate) is bonded. Then, the mother substrate is divided into unit products by subjecting the mother substrate to dicing processing along the grid-shaped dividing line to be divided by a cutter wheel or the like. In addition, the terminal area is formed by cutting the upper CF-side substrate at a position moved inward from the edge by a desired width (terminal width) (see Patent Documents 1 and 2).

FIGS. 2( a ) to 4 show an example of a step of cutting out a unit product from a mother substrate. Here, the case where 8 unit products are cut out from the mother substrate M will be described.

First, as shown in FIGS. 1 and 7( a ), first and second cutter wheels 3 a and 3 b arranged up and down so as to face each other across the mother substrate M are used to align the CF side of the mother substrate M. Each of the substrate 1 and the TFT-side substrate 2 is scribed by crimping the first and second cutter wheels 3a and 3b along a line to be divided in the X direction, thereby engraving a scribe line S1 on each of the substrates. Next, as shown in FIG.7(b), the dicing line S2 for terminal area formation is formed in the CF side board|substrate 1 by the 1st cutter wheel 3a. The scribe line S1 is formed by incision to the extent that a crack occurs in the thickness direction of the substrate, and is divided by bending the substrate or the like in a subsequent step. Divided from scribe line S1 The mother substrate M is as shown in Fig. 3(a), (b), and becomes a rectangular substrate M1 each containing 4 unit products, and the end of the CF-side substrate 1 divided by the scribe line S2 is regarded as a fractional material E. is removed, and the terminal region T is exposed.

Next, after rotating the rectangular substrate M1 by 90 degrees, the first and second cutter wheels 3a and 3b are simultaneously pressed along the planned dividing line and the first and second cutter wheels 3a and 3b are scribed, and the scribe line S3 is engraved on each substrate. The lane S3 is divided, and the unit product M2 shown in FIG. 4 is cut out.

字形的情況。 In addition, the terminal region T is not only formed on one side of the unit product as shown above, but also formed on the left and right sides as shown in FIG. 5(a), along the adjacent side as shown in FIG. In the case of forming an L shape on both sides, or forming along three sides of the unit product if the illustration is omitted

glyph case.

In addition, in the case where the first and second cutter wheels 3a, 3b are used to scribe the upper and lower sides of the substrate, except for "simultaneous cutting" in which the first and second cutter wheels 3a, 3b travel at the same opposing positions , and as shown in Fig. 6(a), the first and second cutter wheels 3a, 3b are driven in a forward and backward direction with respect to the scribing direction. The cutter wheels 3a and 3b run with a left-right offset in the scribing direction, and the first and second cutter wheels (not shown in the figure) run with a left-right offset in the scribing direction. Transfer cutting" can be used flexibly according to the thickness and type of the substrate, the position of the upper and lower dividing lines, etc. Generally, in the case where the terminal area exists at the start or end of the scribe line, in order to make the first and second cutter wheels come into contact with the substrate at the same time or leave the substrate at the same time, the “pre-cut” or “pre-and-shift cut” is often used. method.

[Preceding Patent Documents] [Patent Literature]

[Patent Document 1] WO2005/087458

[Patent Document 2] Japanese Patent Laid-Open No. 2015-13783

In the above-mentioned dividing process of the mother substrate, the upper and lower sides of the mother substrate M are scribed by the first and second cutter wheels 3a and 3b for each of the CF side substrate 1 and the TFT side substrate 2 in the in-process area. At this time, conventionally, the cutter wheel train is made to travel to the end of the substrate with a predetermined pressing load and stop, and then performs an operation of vertically retreating to separate from the substrate.

On the other hand, when a portion of the terminal area has been scribed, as shown in FIG. 8, the second cutter wheel 3b is in a state where the portion of the terminal area T does not have the CF side substrate 1 on the upper side, and only the lower side is pushed in. TFT side substrate 2 and scribe. Generally, for TFT side substrates as thin as 0.3mm to 1.0mm, a cutter wheel with a diameter of 2mm to 3mm is used to scribe lines with a load of 4N to 8N. However, when scribing the part of the terminal area T, the upper substrate is cut. Since the terminal area T cannot be supported by the upper CF side substrate 1 and the opposite first cutter wheel 3a, as shown in FIG. The phenomenon of deformation with the root R as the base point. The deformation of the terminal region T becomes larger when the substrate is thinner and the width of the terminal is wider.

In addition, after the cutter wheel stops at the end of the board, it takes a little time (0.18 seconds according to the measured value) to retreat up and down. Therefore, the load continues to act on the board during the stop time, which is the main reason for the deformation of the terminal area T. . When this kind of deformation occurs, the terminal area T is broken, or excessive advance phenomenon occurs, which becomes the cause of defective products. The excessive advance phenomenon is that the crack of the dicing road extends from directly below the wheel to the front of the scribe line, and is in the predetermined direction. The dash did not happen.

In addition, in the case of performing "pre-run and shift cutting", the first and second cutter wheels travel with a left and right offset in the scribing direction. Therefore, the deformation of the substrate becomes asymmetrical when viewed from the advancing direction of the scribe line, and a phenomenon called "insufficient verticality" is likely to occur, which is a phenomenon called "insufficient verticality", which tends to form cracks that form scribe lines obliquely to the thickness direction of the substrate.

Therefore, the present invention is in view of the above-mentioned problems, and its main object is to provide a sticky A scribing method and a scribing device for bonded substrates, the scribing method for bonded substrates suppresses the deformation of the terminal area during scribing even when the substrate is thin and the terminal width is wide, so that no damage or excessive advance can be obtained. , High-quality products with insufficient verticality.

In order to achieve this object, in the present invention, the following technical means are adopted. That is, in the scribing method of the bonded substrate of the present invention, a portion of the edge portion of the first substrate is cut off and the terminal region is formed on the edge portion of the second substrate by using the substrates facing each other. 2. The cutter wheel scribes lines in the direction of the terminal area, and performs the processing of scribe lines for dividing on the upper and lower sides of the substrate. The scribing method of the bonded substrate is made so that the second substrate having the terminal area is scribed. The second cutter wheel of the line is moved along a travel line parallel to the surface of the second substrate to the vicinity of the terminal position of the terminal area, and from the vicinity of the terminal position of the terminal area to the end of the terminal area. The terminal position is instructed to travel gradually away from the surface of the terminal area, and when reaching the terminal position of the terminal area, the terminal area is withdrawn from the terminal area at a stop time zero instant.

In addition, in the scribing method of another aspect of the present invention, a part of the edge portion of the first substrate is cut away and a terminal region is formed on the edge portion of the second substrate, by using two opposing substrates. The cutting tool wheel scribes lines in the direction of the terminal area, and the cutting lines are processed on the upper and lower sides of the substrate for dividing. The scribing method of the bonded substrate is characterized by selecting the point that has been memorized and explored in advance and does not exceed the terminal failure point. One of the scribing recipes of at least one processing condition with an appropriate cutting amount, and then scribing the bonded substrate according to the processing condition.

Furthermore, in the scribing method of the present invention, a first scribing load is applied in the product area where the first substrate and the second substrate are bonded, and a second scribing load is smaller than the first scribing load. Two scribed loads are scribed at least in this terminal area.

In addition, the present invention is also characterized by a scribing device, which is performed on the top and bottom of an adhesive substrate where a part of the edge portion of the first substrate is cut off and a terminal area is formed on the edge portion of the second substrate. For the processing of dicing lanes for dividing, the scribing device includes: a worktable, which holds the bonded substrate to be processed; upper and lower cutting wheels are arranged to be able to rise and fall on the bonded substrate held by the worktable via a lifting mechanism. up and down, and travel toward the direction of the terminal area of the bonded substrate; the control unit performs the overall processing of the substrate processing by the cutter wheel; and the scribing prescription memorized by the control unit; the scribing prescription is made into a description The data of the processing conditions, the data of the processing conditions include: the cutting amount that the terminal area will not be damaged when the cutter wheel cuts the part of the terminal area and scribes the line, and the cutting amount used to scribe the line in the product area of the bonded substrate A first scribing load and a second scribing load smaller than the first scribing load for scribing in the terminal area, the control unit is made to select one of the scribing recipes, and then scribing according to the processing conditions line, and the lifting mechanism is raised and lowered so that the cutter wheel is retracted from the terminal area in front of the terminal end of the terminal area.

In the present invention, as described above, when the second substrate having the terminal area is scribed by the cutter wheel, since the terminal area travels from the vicinity of the terminal area to the terminal position in such a manner as to gradually move away from the surface of the terminal area, Therefore, the pressing force of the cutter wheel on the terminal area is relieved, and since the cutter wheel is made to retreat from the terminal area at the zero moment of the stop time when the cutter wheel reaches the end position of the terminal area, it is not loaded during the stop time as in the past. Continuously acts on the terminal area. Therefore, deformation of the terminal region at the time of scribing termination is suppressed, and there is an effect of preventing breakage or excessive advance of the terminal region.

In addition, another aspect of the present invention is that when the cutting wheel is used to cut into the terminal area and scribe the line, an appropriate cutting amount is selected that does not exceed the terminal breakage point where the terminal area is deformed and damaged, and then the cut is made according to the processing conditions. line, so the deformation of the terminal area at the end of the scribing line of the cutter wheel is suppressed. Therefore, even under conditions where the deformation of the terminal region is likely to increase, such as when the substrate is thin or when the terminal width is wide, it is possible to reliably prevent the terminal region from being damaged, excessively advanced, and insufficient verticality.

Furthermore, the product area is scribed with a relatively large first scribing load, and the second scribing load that is smaller than the first scribing load when scribing the terminal area that is prone to deformation is scribed, thereby suppressing the Terminal area T Under the deformation, deeper vertical cracks can be formed in the area of the product that occupies most of the cutting track. Thereby, the separability of the subsequent step can be improved, the dividing step can be simplified, or the deterioration of the product quality accompanying the failure of the dividing can be suppressed.

In this invention, the first cutter wheel for scribing the first substrate may be moved along a travel line parallel to the surface of the first substrate when it reaches the vicinity of the end position of the first substrate. And from the vicinity of the end position of the first substrate to the end position of the first substrate, the drive is gradually separated from the surface of the first substrate, and when the end position of the first substrate is reached, the stop time is zero instant. retreat from the first substrate. Therefore, since the first cutter wheel for scribing the first substrate also retreats instantaneously at the end of the substrate, after the second cutter wheel retreats, the load only continuously acts on the first cutter wheel during the stop time of the first cutter wheel. The terminal of a substrate does not occur, and the deformation of the first substrate and the mother substrate as a whole can be suppressed.

In addition, the scribing recipe can be prepared to include not only the thickness of the substrate, but also the width of the associated terminal area, the diameter of the cutter wheel to be used, the type of the blade edge, and the travel speed of the cutter wheel.

Thereby, the selection range of the scribing prescription is widened, and the scribing of various substrates can be dealt with.

E: fractional material

h: Change amount of Z-axis address

M: Motherboard

M1: Rectangular substrate

M2: Unit product

N1,N2: Near the terminal position

P: Product area

R: the root of the terminal area

SD: Crossed prescription

S1, S2, S3: cutting lanes

T: Terminal area

Z: axis address

1: First substrate (CF side substrate)

2: Second substrate (TFT side substrate)

3a: The first cutter wheel

3b: Second cutter wheel

4: Workbench

5: Fixtures

6: Scribing head

7: Support column

8: Guide rod

9: Guide

10: Motor

11: Computer

12: Control Department

13: Input part

14: Display part

15,16: Travel line

1 is a diagram showing an example of a scribing apparatus for implementing the scribing method of the present invention.

FIG. 2( a ) is a plan view showing an example of a mother substrate to be processed.

FIG. 2( b ) is a front view showing an example of a mother substrate to be processed.

[Fig. 3(a)] is a plan view showing a rectangular substrate divided from the mother substrate of Figs. 2(a) and (b).

[Fig. 3(b)] is a side view showing a rectangular substrate divided from the mother substrate of Figs. 2(a) and (b).

Fig. 4 is a perspective view showing a unit product cut out from the rectangular substrate shown in Figs. 3(a) and (b).

[FIG. 5(a), (b)] is a perspective view which shows another example of formation of the terminal area formed in the unit product.

[FIG. 6(a), (b)] It is explanatory drawing which shows the scribing means of a pre-cut and a shift cut.

7( a ) and ( b ) are explanatory diagrams at the time of processing the scribe lines on the mother substrate.

[FIG. 8] It is an explanatory diagram at the time of scribing the terminal area by the second cutter wheel.

[FIG. 9] It is an explanatory drawing which shows the upward warping phenomenon when a line is scribed in the terminal area by the second cutter wheel.

[FIG. 10] It is an explanatory drawing which shows the favorable state at the time of scribing in the terminal area by the 2nd cutter wheel.

[FIG. 11] It is an explanatory drawing which shows the scribing process by the 1st, 2nd cutter wheel.

[FIG. 12] It is an explanatory drawing which shows the scribing process of the terminal area by the 1st, 2nd cutter wheel.

[ Fig. 13] Fig. 13 is an explanatory diagram showing an example of a ruled prescription.

14 is a block diagram showing the structure of a computer attached to the scribing device.

Hereinafter, the details of the present invention will be described.

FIG. 1 is a perspective view schematically showing an example of a scribing apparatus for implementing the scribing method of the present invention. The scribing device includes: a horizontal table 4, which attracts and holds the mother substrate M to be processed; and a first cutting wheel 3a and a second cutting wheel 3b, which face each other across the table 4 are arranged above and below the table 4. The table 4 is divided into front and rear at a predetermined interval along the Y direction in FIG. 1 , and the first cutter wheel 3a and the second cutter wheel 3b are arranged in the interval.

The first and second cutter wheels 3a and 3b are respectively held by upper and lower clamps 5 and 5, and the clamps 5 and 5 are mounted on the scribing heads 6 and 6 so as to be able to be raised and lowered via a lift mechanism (not shown). Furthermore, the scribe heads 6 and 6 are mounted so as to be movable along the guide members 9 and 9 of the guide rods 8 and 8 which are horizontally bridged in the X direction by the support columns 7 and 7 on both sides, and are formed as It can move in the X direction by the rotation of the motors 10 and 10 .

Using the first and second cutter wheels 3a, 3b of the scribing device, the mother substrate M is processed with the cutting lines S1, S2 according to the same procedure as the procedure shown in FIGS. 2(a) to 4 above. , while cutting A rectangular substrate M1 with terminal regions T is obtained. Then, the rectangular substrate M1 is processed by the dicing line S3 along the line to be divided, and the unit product M2 having the product area P and the terminal area T is cut out. Here, the product region P is a region having each of the first substrate (CF side substrate) 1 and the second substrate (TFT side substrate) 2 , the terminal region T is the CF side substrate 1 with the terminal width cut in advance, and only the TFT The area where the side substrate remains.

In the present invention, when the processing of the scribe line S3 is performed on the rectangular substrate M1 having the terminal region T, it is performed by the following means. That is, when the second substrate (TFT side substrate) 2 having the terminal region T is pressed and scribed by the second cutter wheel 3b, the pair of the second cutter wheel 3b when the terminal region T is broken is searched in advance. The cutting amount of the substrate is preset to the breaking cutting amount, and the second cutting wheel 3b is pushed in and scribing within the range of processing conditions that does not exceed the appropriate cutting amount for the breaking cutting amount during scribing, thereby relaxing the terminal area. The deformation of T eliminates the occurrence of damage in the terminal area T.

The inventors conducted a scribing experiment using the first and second cutter wheels 3a, 3b with a diameter of 2 mm, and a scribing method of "pre-cutting" with an incision amount of 1.0 mm on the TFT side substrate. 2 The thickness of 0.3mm and the terminal width of 6mm are bonded substrates (rectangular substrate M1) for dicing. As a result, as shown in FIG. 9, the terminal area T was broken due to the deformation, and it was confirmed that the change amount h of the Z-axis address of the second cutter wheel 3b at that time was 0.41 mm. In addition, the Z-axis address refers to the position of the movement track of the cutter wheel along the thickness direction of the substrate during scribing, and the change amount h means that the position where the cutter wheel contacts the substrate is used as a reference (point O ), corresponding to the change of the actual cutter wheel position corresponding to the set cutting amount.

In addition, with respect to the same bonded substrates as above, a scribing experiment was performed by setting the incision amount of 0.1 mm to 0.9 mm, respectively. The results are shown in Table 1. According to this result, the cut-in amount is 0.1mm~0.3mm, the maximum change of the Z-axis address in the terminal area T is 0.4mm or less, which is within the range above the terminal failure point, but when the cut-in amount is more than 0.5mm, it is the Z-axis address. The maximum amount of change exceeds the terminal breakage point, and the possibility of breakage in the terminal region T increases. Therefore, 0.1 mm to 0.3 mm is an appropriate cut-in amount. In fact, in the case of the cut-in amount of 0.3 mm in Table 1, the maximum change amount of the Z-axis address in FIG. 10 is 0.253 mm, the deformation of the terminal area T is suppressed to be small, and the destruction of the terminal area T does not occur. .

By performing this scribing experiment on the bonded substrates with a thickness of 0.1mm to 1.0mm, the maximum variation of the Z-axis address for each board thickness is classified and set to an appropriate cut-in amount that does not exceed the terminal failure point. Then, the set value is used as a scribing recipe, and the control unit of the computer attached to the scribing device is memorized in advance, and when scribing is started, a desired cutting amount corresponding to the substrate to be processed is selected from the recipe, and Use computer control to draw lines.

11 and FIG. 12 , the scribing process performed on the second substrate including the terminal area T, the starting point of the scribe line is located in the product area P, and the terminal area T is located at the end point of the scribe line. FIG. 11 is an explanatory view showing the scribing process by the first and second cutter wheels, and FIG. 12 is an explanatory view showing the scribing process by the terminal regions of the first and second cutter wheels.

For the TFT-side substrate 2, the appropriate cutting amount and the first scribing load as described above are selected, and the second cutter wheel 3b is pressed against the starting point of the scribing. By rolling the second cutter wheel 3b at a predetermined travel speed (scribing speed), a cutting line is formed in the product area P. Next, when scribing the terminal area T, a second scribing load that is smaller than the first scribing load, for example, by 20 to 50%, is selected. Specifically, the scribing load changes from a predetermined distance inward from the terminal area T, and a scribe line is formed by the second scribing load at the distance from the root R of the terminal area T to the terminal end, that is, the distance corresponding to the terminal width w. In order to reliably act as the second scribe load from the root portion R of the terminal area T, it is preferable to change the load from the inner side of the terminal area T, that is, near the terminal area T of the product area P. On the other hand, when the scribing load in the product region P is small, the depth of the vertical crack becomes shallow, and there is a possibility that a division failure may occur in a subsequent division step. Therefore, the ratio of the product area P to the terminal area It is better to change the load 1~2mm inward from the root R of T. In this way, the deformation of the terminal region can be further suppressed, and in particular, when the deformation of the substrate is asymmetrical when viewed from the advancing direction of the scribe line due to shifting cutting, the occurrence of insufficient verticality can be suppressed.

Further, at the terminal portion of the terminal area T, as shown in FIG. 12, the traveling line 15 along the horizontal is moved to the vicinity N2 of the terminal position of the terminal area T, and from the vicinity N2 of the terminal position of the terminal area T to the terminal area The terminal position of T is made to travel gradually and slightly away from the surface of the terminal area T. Furthermore, when the terminal position of the terminal area T is reached, it is made to retreat in the vertical direction at the moment of zero stop time. Specifically, the second cutter wheel 3b is separated from the surface of the terminal region T from the end position inward, for example, 10 μm, so that the terminal region T can be reliably retracted in the vertical direction without stopping at the end position.

Next, the scribing operation of the first substrate (CF side substrate) 1 will be described. In this embodiment, the scribing operation is simultaneously performed on the first substrate (CF side substrate) 1 and the second substrate (TFT side substrate) 2 by the first cutter wheel 3a and the second cutter wheel 3b. On the CF side substrate 1, the cutting amount and the above-mentioned first scribing load are also selected in the same way as the TFT side substrate 2, and the first cutter wheel 3a is pressed against the starting point of the scribing line, and then the product area is executed at a predetermined scribing speed. P's dash. Next, scribing is performed with a second scribing load smaller than the first scribing load, for example, by 20 to 50%, between the terminal regions T of the opposing TFT substrate being scribed. Specifically, at the same time as the load applied by the second cutter wheel 3b of the TFT-side substrate starts to change, the load on the CF-side substrate is also forced to change, and at a distance corresponding to the terminal width w of the TFT-side substrate, the second Scribe load for scribing. That is, it is preferable to change the load from a position 1 to 2 mm inward by adding the terminal width w to the end portion of the self-product region P. In this way, since the loads of the first cutter wheel 3a and the second cutter wheel 3b are changed simultaneously, the load applied to the mother substrate does not become uneven. Therefore, deformation of the entire mother substrate can be suppressed.

Also, the first cutter wheel 3a is moved along the horizontal travel line 16 on the surface of the first substrate to the vicinity N1 of the end position of the first substrate, and from the vicinity N1 of the end position of the CF side substrate 1 to the end position Drive in such a way that it gradually and slightly moves away from the surface of the first substrate. Moreover, to reach the The terminal position of a substrate is ordered to retreat to the vertical direction instantaneously at the zero stop time. Specifically, by starting to separate from the surface of the CF-side substrate 1 from the end position inward, eg, 10 μm inward, the CF-side substrate 1 can be reliably retracted in the vertical direction without stopping at the end position. Furthermore, since the first cutter wheel 3a for scribing the CF-side substrate 1 in this way also retreats at the end of the substrate, the load continues to act only on the CF-side substrate 1 during the stop time of the first cutter wheel. Terminal things don't happen. Therefore, the deformation|transformation of the CF side board|substrate 1 and the mother board|substrate M as a whole can also be suppressed.

At this time, the scribing conditions such as the scribing speed are set so that the first cutter wheel 3a and the second cutter wheel 3b retreat from the mother substrate M at the same time, in other words, before the first cutter wheel 3a reaches the CF-side substrate. It is preferable that the second cutter wheel 3b reaches the terminal position of the terminal region T of the TFT side substrate 2 at the same time as the terminal position. Therefore, since the first cutter wheel 3a and the second cutter wheel 3b are retracted instantaneously at the end of the mother substrate M, the load acting on the mother substrate M does not become uneven. Therefore, the deformation|transformation of the whole mother board|substrate M can also be suppressed.

In addition, since the terminal region T does not exist in the CF-side substrate 1, as the cut-in amount in the CF-side substrate 1, the same appropriate cut-in amount as the TFT-side substrate 2 may be used, or a larger cut-in amount may be used. Cut in amount. This is because the P-based CF-side substrate 1 and the TFT-side substrate 2 are bonded to each other in the product region, and the CF-side substrate 1 uses an incision amount exceeding the terminal breaking point, so that deformation of the substrate destruction does not occur.

FIG. 13 is a diagram showing an example of the scribed prescription SD. In each underlined prescription SD, a number for identification is attached to each prescription as shown in prescription No.1...No.n. In each scribing prescription SD, the thickness of the substrate, the amount of incision, the width of the terminal, the diameter of the cutter wheel used, the type of the blade tip, the travel speed of the cutter wheel, and the scribing load are used as scribing information. Categorize and describe. Then, when the operator selects one of the recipes suitable for the scribing process to be performed in the future, the control unit reads the recipe, and controls the lift amount of the cutter wheel according to the content described in the scribing recipe SD, and executes the Line processing.

FIG. 14 is a block diagram showing the structure of the computer 11 . The computer 11 includes: a control unit 12, which is realized by computer hardware such as CPU, RAM, ROM, etc.; an input unit 13; and a display unit 14, which is a display unit. Displays the processing menu or action status. The control unit 12 performs the overall processing operations of the substrate, such as the suction and holding of the substrate by the table 4, the movement of the scribing heads 6 and 6 by the motor 10, and the lifting and lowering of the cutter wheels 3a and 3b by the lifting mechanism. control. The input unit 13 is an interface for the operator to input various operation instructions or data to the scribing device.

In the present invention, as described above, when the second cutter wheel 3b cuts into the portion of the terminal region T and scribes a line, the position of the cutter wheel that is broken due to the deformation of the terminal region T is regarded as the terminal breaking point, and the selected Do not exceed the appropriate cutting amount of the terminal failure point, carry out scribing, and the terminal cutter wheel in the terminal area will not stop and retreat from the terminal area. This makes it possible to suppress the deformation of the terminal area T at the time of the scribing termination of the second cutter wheel 3b even under the condition that the deformation of the terminal area T is easy to occur in which the thickness of the substrate is thin and the terminal width is wide, so that damage can be reliably prevented. Terminal area T. In addition, by reducing the scribing load at the time of scribing in the terminal area T, and increasing the scribing load outside the terminal area T, defects such as excessive advance and insufficient verticality can be suppressed, and high-quality products can be obtained. .

The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to only the above-mentioned embodiments, and appropriate modifications and changes are possible within the scope of achieving the object of the present invention without departing from the scope of the claims.

For example, in the present embodiment, the mother substrate M is arranged on the table 4 so that the CF side substrate 1 is the upper surface, but the TFT side substrate 2 may be arranged as the upper surface. In this case, the first cutter wheel 3a is arranged below the table, and the second cutter wheel 3b is arranged above the table, respectively.

[Industrial Availability]

The scribing method and the scribing device for the bonded substrate of the present invention can be used in the processing of scribe lines for dividing the bonded substrate having the terminal area.

h: Change amount of Z-axis address

P: Product area

R: the root of the terminal area

T: Terminal area

Z: axis address

1: First substrate (CF side substrate)

2: Second substrate (TFT side substrate)

3b: Second cutter wheel

Claims (9)

A scribing method for bonding substrates, for the bonding substrates in which a part of an edge portion of a first substrate is cut off and a terminal area is formed on the edge portion of a second substrate, by using two cutter wheels facing each other Scribe in the direction of the terminal area, and perform scribe lines for dividing on the upper and lower sides of the first and second substrates. The scribing method of the bonded substrate is as follows: Make the second substrate with the terminal area The second cutter wheel for scribing is moved along a travel line parallel to the surface of the second substrate to the vicinity of the terminal position of the terminal area, and from the vicinity of the terminal position of the terminal area to the terminal area The terminal position is to drive gradually away from the surface of the terminal area, and when reaching the terminal position of the terminal area, the terminal area is withdrawn from the terminal area at a stop time zero instant. The scribing method for bonding substrates as claimed in claim 1, wherein the first cutter wheel for scribing the first substrate is made along the line with the first cutting wheel near the end position of the first substrate. A travel line parallel to the surface of a substrate moves, and from the vicinity of the terminal position of the first substrate to the terminal position of the first substrate is made to travel gradually away from the surface of the first substrate to reach the first substrate At the end position of the substrate, it is retracted from the first substrate at the moment of zero stop time. The scribing method for bonding substrates as claimed in claim 2, wherein the first cutter wheel and the second cutter wheel are simultaneously retracted from the terminal regions of the first substrate and the second substrate. A scribing method for bonding substrates, for the bonding substrates in which a part of an edge portion of a first substrate is cut off and a terminal area is formed on the edge portion of a second substrate, by using two cutter wheels facing each other Scribe in the direction of the terminal area, and process the dicing lines on the top and bottom of the first and second substrates. The scribing method of the bonded substrate is: select the one that has been memorized and explored in advance and does not exceed the terminal failure point. Processing of at least one appropriate amount of incision One of the scribing recipes of the condition data, and then scribe the bonded substrate according to the processing conditions. The scribing method for bonding substrates as claimed in claim 4, wherein the second cutter wheel for scribing the second substrate having the terminal area is formed to reach the edge near the terminal position of the terminal area. Moving along a travel line parallel to the surface of the second substrate, and from the vicinity of the terminal position of the terminal area to the terminal position of the terminal area, the terminal area is driven gradually away from the surface of the terminal area to reach the terminal. At the terminal position of the area, the terminal area is withdrawn at the instant of zero stop time. The scribing method for bonding substrates according to any one of the claims 1 to 5 of the claimed scope, wherein a first scribing line is used to load a scribing line in the product area where the first substrate and the second substrate are bonded; A second scribing load with a smaller first scribing load scribes at least the terminal area. The scribing method for bonding substrates according to claim 4 or 5, wherein the scribing recipe is prepared by classifying the thickness of each substrate, and selecting the cutting amount corresponding to the substrate to be processed from the recipe and scribing. The scribing method for bonding substrates as claimed in claim 4 or 5, wherein the scribing recipe includes the width of the terminal area, the diameter of the cutter wheel used and the type of cutting edge, and the travel speed of the cutter wheel information. A scribing device for bonding substrates, wherein a part of the edge portion of a first substrate is cut off and a scribe line for dividing is performed on the upper and lower surfaces of the bonding substrate where the edge portion of the second substrate forms a terminal area, the The scribing device for bonding substrates includes: a worktable, which holds the bonded substrates to be processed; a first cutting wheel and a second cutting wheel, which are arranged on the worktable so as to be able to be lifted and lowered through a lifting mechanism. The upper and lower sides of the held bonded substrates run opposite to each other in the direction of the terminal regions of the bonded substrates; the control unit performs the overall processing of the substrate processing by the first and second cutting wheels; and the control unit Memorized scribing recipe; the scribing recipe is the data that describes the processing conditions of the cutting amount that will not cause damage to the terminal area when the second cutter wheel cuts into the terminal area and scribes the line, select the scribed line One of the recipes, and then draw a line according to the processing conditions.

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