TWI488824B - The method and scribing device of glass substrate - Google Patents

The method and scribing device of glass substrate Download PDF

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Publication number
TWI488824B
TWI488824B TW101141761A TW101141761A TWI488824B TW I488824 B TWI488824 B TW I488824B TW 101141761 A TW101141761 A TW 101141761A TW 101141761 A TW101141761 A TW 101141761A TW I488824 B TWI488824 B TW I488824B
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cutter wheel
starting point
substrate
glass substrate
scribing
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TW101141761A
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Chinese (zh)
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TW201323363A (en
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Keisuke Tominaga
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Mitsuboshi Diamond Ind Co Ltd
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Priority claimed from JP2012243281A external-priority patent/JP5514282B2/en
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085On sheet material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/072Armoured glass, i.e. comprising reinforcement
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Description

強化玻璃基板之刻劃方法及刻劃裝置Method for sculpting strengthened glass substrate and scribing device

本發明係關於一種強化玻璃製之玻璃基板之刻劃方法、以及可用於該刻劃方法之刻劃裝置。The present invention relates to a method of scoring a glass substrate made of tempered glass, and a scribing apparatus usable in the scribing method.

此處,所謂的「強化玻璃」,係指藉由製造步驟中之利用離子交換之化學處理,而於玻璃基板之基板表面層形成殘留壓縮應力之壓縮應力層,於基板內部殘留拉伸應力而製造之玻璃。Here, the term "tempered glass" refers to a compressive stress layer in which a residual compressive stress is formed on a surface layer of a substrate of a glass substrate by chemical treatment by ion exchange in a manufacturing step, and tensile stress remains in the substrate. Made of glass.

強化玻璃之特徵為:具有因壓縮應力層之影響而對於外力而言難以破裂之性質,另一方面,具有一旦於基板表面產生龜裂並擴展至存在有殘留拉伸應力之基板內部,而於接下來使龜裂容易深入地滲透之性質。The tempered glass is characterized in that it has a property of being difficult to be broken by an external force due to the influence of the compressive stress layer, and on the other hand, it has a crack on the surface of the substrate and spreads to the inside of the substrate in which residual tensile stress exists. Next, the crack is easily penetrated into the nature.

一般於分斷玻璃基板之加工中採用如下之方法:首先,於基板表面形成有限深度之刻劃線,之後,從基板之背側沿著刻劃線利用裂斷桿或裂斷滾筒(break roller)進行按壓,藉此裂斷。Generally, the following methods are used in the processing of the split glass substrate: first, a scribe line is formed at a limited depth on the surface of the substrate, and then a break bar or a break roller is used along the scribe line from the back side of the substrate. ) Pressing to break.

在前者之形成刻劃線之步驟中,已知有藉由將圓盤狀之刀輪(亦稱為刻劃輪)對著基板表面按壓並同時使其轉動而進行刻劃之方法,例如揭示於專利文獻1等。作為刀輪,具有在圓周稜線部具有連續之小的凹凸之附溝槽之刀輪、以及在稜線部不具有凹凸之普通刀輪,並根據基板之種類或厚度而區分使用。In the step of forming the scribing line of the former, a method of scoring a disc-shaped cutter wheel (also referred to as a scoring wheel) against the surface of the substrate while rotating it is known, for example, revealing Patent Document 1 and the like. As the cutter wheel, a cutter wheel having a groove having continuous small irregularities at a circumferential ridge portion and a conventional cutter wheel having no irregularities at the ridge portion are used, and are used depending on the type or thickness of the substrate.

圖4係表示在將玻璃製之基板M(母基板)分別分斷 成為製品之單位基板時所進行之一般之交叉刻劃加工。首先,利用刀輪對著基板M之表面形成X方向之刻劃線S1,接著,形成與X方向交叉之Y方向之刻劃線S2。如此形成在XY方向交叉之多條刻劃線後,基板M被送至裂斷裝置,並沿著各刻劃線從背面側使其彎曲,藉此分斷成為單位基板。Figure 4 shows the separation of the substrate M (mother substrate) made of glass. The general cross scribe process performed when the unit substrate of the product is formed. First, the scribe line S1 in the X direction is formed on the surface of the substrate M by the cutter wheel, and then the scribe line S2 in the Y direction intersecting with the X direction is formed. When a plurality of scribe lines intersecting in the XY direction are formed in this manner, the substrate M is sent to the rupture device, and is bent from the back side along each scribe line, thereby being separated into a unit substrate.

在利用刀輪刻劃玻璃基板之方法中,有「外切」與「內切」。根據基板之種類或用途而選擇性地區分使用外切與內切之刻劃方法(參照專利文獻2)。In the method of scribing a glass substrate by a cutter wheel, there are "external cutting" and "inside cutting". The scribing method using the outer cut and the inner cut is selectively distinguished depending on the type or use of the substrate (see Patent Document 2).

前者之外切,如圖5(a)所示,將刀輪K之最下端以下降至較基板M之表面(上面)稍靠下方之狀態,設置於基板M之單側端部之外側位置(刻劃開始位置)。而且,使其從設置之位置水平移動,抵達並碰撞基板端部,進一步地以既定之刻劃壓進行按壓並同時使刀輪K水平移動,而進行刻劃。The former is cut out, and as shown in FIG. 5(a), the lowermost end of the cutter wheel K is lowered slightly below the surface (upper surface) of the substrate M, and is disposed at the outer side of the one-side end of the substrate M. (Scoring start position). Further, it is horizontally moved from the set position, reaches and collides with the end portion of the substrate, and is further pressed at a predetermined timing, and at the same time, the cutter wheel K is horizontally moved to perform scribing.

於採用外切時,由於在基板端不會產生刀輪滑動之問題,且形成之刻劃線到達基板之端部,因此在下一步驟中容易且正確地進行裂斷。另一方面,由於刀刃碰撞基板端部,因此恐有在基板端部產生切損,且因基板內部之拉伸應力之影響而導致從端部不規則地破裂、或被全切等之虞。此外,刀輪亦因與邊緣部分之碰撞而容易耗損。When the outer cutting is employed, since the problem of the sliding of the cutter wheel does not occur at the end of the substrate, and the formed score line reaches the end portion of the substrate, the crack is easily and accurately performed in the next step. On the other hand, since the blade edge collides with the end portion of the substrate, there is a fear that the end portion of the substrate is cut, and the end portion is irregularly broken or completely cut due to the influence of the tensile stress inside the substrate. In addition, the cutter wheel is also easily worn out due to collision with the edge portion.

後者之內切,如圖5(b)所示,將刀輪從上方下降至距基板之端緣2 mm~10 mm左右之內側(刻劃開始位置)而以既定之刻劃壓使其抵接基板,且進行按壓同時使刀輪 水平移動而進行刻劃。In the latter, as shown in Fig. 5(b), the cutter wheel is lowered from the upper side to the inner side (the scoring start position) of about 2 mm to 10 mm from the edge of the substrate, and is pressed at a predetermined time to be pressed. Connect the substrate and press it while making the cutter wheel Plan by moving horizontally.

於採用內切時,由於刀輪未與基板端部之邊緣部分碰撞,因此不會有在基板端部產生切損之虞,與外切相比亦可抑制刀刃之耗損。但是,在使刀輪從抵接基板之狀態往水平方向移動時,有刀刃之侵入不良而滑動,導致無法進行刻劃之情形。When the inner cut is used, since the cutter wheel does not collide with the edge portion of the end portion of the substrate, there is no possibility of cutting at the end portion of the substrate, and the wear of the blade can be suppressed as compared with the outer cut. However, when the cutter wheel is moved in the horizontal direction from the state in which the blade is abutted, the blade is inadvertently invaded and slipped, and the scribing cannot be performed.

如此,外切與內切各具有優點與缺點。因此,根據基板之種類或用途而區分使用外切與內切。Thus, both the outer and the inner cut have advantages and disadvantages. Therefore, the use of the outer and inner cuts is distinguished depending on the type or use of the substrate.

專利文獻1:日本專利第3074143號公報Patent Document 1: Japanese Patent No. 3074143

專利文獻2:日本特開2009-208237號公報Patent Document 2: Japanese Laid-Open Patent Publication No. 2009-208237

近年來,在被使用於行動電話等之覆蓋玻璃等之玻璃製品中,被期望使用稱為所謂之強化玻璃(亦稱為化學強化玻璃)之玻璃。如上所述,強化玻璃係以在基板表面層殘留壓縮應力之方式而被製造,藉此,可獲得儘管玻璃之板厚較薄亦難以破裂之玻璃。In recent years, in glass products such as cover glass used for mobile phones and the like, it is desirable to use a glass called so-called tempered glass (also referred to as chemically strengthened glass). As described above, the tempered glass is produced in such a manner that residual compressive stress remains on the surface layer of the substrate, whereby a glass which is hard to be broken although the thickness of the glass is thin can be obtained.

因此,一旦使用強化玻璃,則具有可製造薄且輕、而且堅固之覆蓋玻璃之優點。另一方面,作為覆蓋玻璃,必需進行從大面積之母基板切出所欲之大小、所欲之形狀之單位製品之加工。Therefore, once tempered glass is used, there is an advantage that a thin, light, and strong cover glass can be manufactured. On the other hand, as the cover glass, it is necessary to perform processing for cutting out a unit product having a desired size and a desired shape from a large-area mother substrate.

在利用外切對強化玻璃形成刻劃線之情形,一旦在基板端部刀刃碰撞時,進行較表面壓縮應力層更深地刻劃,則受到基板內部之殘留拉伸應力之影響,恐有發生一次性地完全被分斷之不良情況之虞。因此,使用強化玻璃利用 內切之刻劃者較外切為佳。In the case where the scribe line is formed by the dicing of the tempered glass, once the edge of the substrate is collided, the surface is subjected to deeper scribe by the surface compressive stress layer, which may be affected by the residual tensile stress inside the substrate. Sexually completely broken the bad situation. Therefore, use tempered glass The inner cut is better than the outer cut.

然而,即使欲利用內切進行刻劃,在使刀刃抵接時,由於係為強化玻璃之故,因此亦有因基板表面層之殘留壓縮應力之影響而導致刀刃難以侵入基板表面,使刀刃之對基板之作用非常地不良而產生滑動。因此,反而產生刻劃加工變得困難之問題。此外,一旦為了使刀刃侵入而以較強之按壓負載進行刻劃,則將有因基板內部之殘留拉伸應力之影響而導致一次性地破裂或完全分斷等之不良情形。However, even if the incision is to be scribed, when the blade is abutted, since it is tempered glass, there is also a problem that the blade is hard to intrude into the surface of the substrate due to the residual compressive stress of the surface layer of the substrate, so that the blade is The effect on the substrate is very poor and slippage occurs. Therefore, there is a problem that the scoring process becomes difficult. Further, when the blade is intruded and scored with a strong pressing load, there is a problem that the film is broken or completely broken due to the influence of the residual tensile stress inside the substrate.

如此,針對強化玻璃與針對從以往既被使用之鈉玻璃基板等之刻劃加工有所不同,即使藉由外切或內切,亦難以良好地形成刻劃線。該傾向係基板表面之壓縮應力層愈厚而殘留應力愈大之基板較為明顯。As described above, the tempered glass is different from the dicing process for the soda glass substrate or the like which has been used in the past, and it is difficult to form the scribe line well even by external cutting or incision. This tendency is that the thicker the compressive stress layer on the surface of the substrate is, the larger the residual stress is, the more obvious the substrate is.

在此,本發明之目的在於提供一種即使是加工困難之強化玻璃製玻璃基板,亦能夠利用內切確實地形成刻劃線之刻劃方法。Accordingly, an object of the present invention is to provide a method of scribing a scribed line by using an inscribed tempering glass substrate, which is difficult to process.

為了達成上述目的,在本發明中採用如下之技術性手段。亦即,在本發明之刻劃方法,係針對基板表面形成有壓縮應力層之強化玻璃基板,形成刻劃線之基板刻劃方法,且使用在刀刃稜線具有連續之凹凸之附溝槽刀輪,(a)將上述刀輪下降抵接於進入至較上述基板之一端緣更內側之起始地點,且於刻劃預定線之方向在與起始地點近旁之折返地點之間,以按壓狀態進行至少一往復之前進轉動與後退轉動而形成成為刀輪之侵入起點之溝槽,(b)接著,使刀輪以從上述起始地點通過上述溝槽上之方式,進行按 壓轉動直至刻劃預定線之終點位置,而形成刻劃線。In order to achieve the above object, the following technical means are employed in the present invention. That is, the scribing method of the present invention is a method for scribing a tempered glass substrate having a compressive stress layer formed on a surface of a substrate, forming a scribing substrate, and using a grooved cutter wheel having continuous irregularities on the ridgeline of the blade (a) lowering the cutter wheel to a starting point that enters to the inner side of one end of the substrate, and in a direction of scribing the predetermined line between the return points near the starting point, in a pressed state Performing at least one reciprocating forward rotation and backward rotation to form a groove which becomes an intrusion starting point of the cutter wheel, and (b) subsequently, pressing the cutter wheel through the groove from the starting point The pressure is rotated until the end position of the predetermined line is scored to form a score line.

使上述刀輪往復之距離、亦即從起始地點至折返地點之距離較佳為0.5 mm~3 mm,尤其較佳為2 mm左右。The distance at which the cutter wheel reciprocates, that is, the distance from the starting point to the returning position is preferably 0.5 mm to 3 mm, particularly preferably about 2 mm.

此外,從另一觀點來看本發明之基板刻劃裝置,係在玻璃基板之表面形成刻劃線之基板刻劃裝置,具備:平台,載置玻璃基板;刻劃頭,保持於刀刃稜線具有連續之凹凸之附溝槽刀輪;刻劃頭升降機構,係以使上述刀輪對於上述玻璃基板之表面取得接觸狀態與離開狀態之方式,使上述刻劃頭升降;掃描機構,使上述刻劃頭於沿著上述玻璃基板表面之方向移動;以及控制部,進行利用上述刻劃頭升降機構之升降動作、及利用上述掃描機構之刻劃頭之移動動作之控制;且一旦上述控制部在已設置上述基板之狀態以使刻劃頭來到進入至較上述基板之一端緣更內側之起始地點之方式開始控制,則(a)使上述刀輪下降抵接於上述起始地點,於刻劃預定線之方向在與起始地點近旁之折返地點之間,以按壓狀態進行至少一往復之前進轉動與後退轉動而形成成為刀輪之侵入起點之溝槽,(b)接著,進行使刀輪以從上述起始地點通過上述溝槽上之方式,進行按壓轉動直至刻劃預定線之終點地點,而進行形成刻劃線之動作之控制。Further, from another viewpoint, the substrate scribing apparatus of the present invention is a substrate scribing apparatus which forms a score line on the surface of a glass substrate, and has a platform for mounting a glass substrate; the scribing head is held at the edge of the blade a grooved cutter wheel with continuous irregularities; the scoring head lifting mechanism is configured to raise and lower the scoring head in such a manner that the cutter wheel obtains a contact state and a leaving state with respect to a surface of the glass substrate; and the scanning mechanism enables the engraving The control unit moves in a direction along the surface of the glass substrate; and the control unit controls the lifting operation by the scoring head elevating mechanism and the movement operation of the scribing head by the scanning mechanism; and once the control unit is The state of the substrate is set such that the scribe head comes into control at a starting point that is further inside than the edge of one of the substrates, and (a) the cutter wheel is lowered to abut the starting point, The direction in which the predetermined line is scored is between the retracted position near the starting point, and at least one reciprocating forward and backward rotation is performed in a pressed state to form a cutter wheel. a groove that intrudes into the starting point, and (b) next, the cutter wheel is pressed and rotated from the starting point to the end point of the predetermined line to perform the operation of forming the score line. control.

根據本發明,使刀輪於起始地點與折返地點之間進行至少一往復轉動。在最初之去路之轉動中形成少許痕跡,且在緊接之回路之轉動中加深痕跡而成為小的溝槽。所形成之溝槽,係作為用以形成刻劃線之觸發器(trigger)(刀 輪侵入用溝槽)而發揮作用。在使刀輪進行至少一往復之後,再次使其從起始地點轉動至刻劃預定線之終點地點,藉此,對起始地點近旁之相同位置進行至少3次刻劃,至少於第3次在起點部分使刀刃之侵入變得容易,而可不滑動地較佳地形成刻劃線。According to the invention, the cutter wheel is caused to reciprocate at least one reciprocatingly between the starting point and the returning point. A slight trace is formed in the rotation of the initial path, and the trace is deepened in the rotation of the immediately following circuit to become a small groove. The groove formed is used as a trigger for forming a scribe line (knife) The wheel invades the groove) and functions. After the cutter wheel is subjected to at least one reciprocation, it is again rotated from the starting point to the end point of the planned line, thereby performing at least 3 scribes on the same position near the starting point, at least for the third time. It is easy to invade the blade at the starting point portion, and the score line can be preferably formed without sliding.

此外,由於形成刻劃線時之刀刃之侵入變得容易,因此即使使刻劃線形成時之刀輪之按壓負載小於最初之起點之溝槽形成時之按壓負載,亦能充分地形成刻劃線,藉此,可減輕刻劃線形成時之刀輪對基板之強加負載而不會有基板之破裂或完全分斷。Further, since the intrusion of the blade at the time of forming the score line becomes easy, even if the pressing load of the cutter wheel when the score line is formed is smaller than the pressing load at the time of forming the groove at the initial starting point, the scoring can be sufficiently formed. The wire can thereby reduce the load imposed on the substrate by the cutter wheel when the score line is formed without cracking or complete breaking of the substrate.

在本發明中,刀輪之轉動速度較佳為:使形成刻劃線時之速度較上述往復移動時之速度為快。In the present invention, the rotational speed of the cutter wheel is preferably such that the speed at which the score line is formed is faster than the speed at which the reciprocating movement is performed.

藉此,可確實地進行成為刀輪之侵入起點之溝槽之加工,並且可迅速地進行刻劃線之形成。Thereby, the processing of the groove which is the starting point of the intrusion of the cutter wheel can be surely performed, and the formation of the score line can be quickly performed.

在以下,根據圖式詳細地說明本發明之刻劃方法之細節。In the following, details of the scribing method of the present invention will be described in detail based on the drawings.

圖1係表示為了在強化玻璃基板形成刻劃線而使用之刻劃裝置之一例子之概略的前視圖。Fig. 1 is a schematic front view showing an example of a scribing device used to form a score line on a tempered glass substrate.

該刻劃裝置A,具備載置強化玻璃基板M之平台1。平台1,具備有能夠將載置於其上之基板M保持於固定位置之保持機構。在本實施例中,作為該保持機構,係透過在平台1開口之許多小的空氣吸附孔(未圖示)而吸附保持基板M。此外,平台1,可沿著水平軌道2於Y方向(圖 1之前後方向)移動,且藉由利用馬達(未圖示)而旋轉之螺桿軸3而驅動。進一步地,平台1可藉由內置有馬達之旋轉驅動部4而於水平面內旋動。This scribing device A includes a stage 1 on which a tempered glass substrate M is placed. The platform 1 is provided with a holding mechanism capable of holding the substrate M placed thereon in a fixed position. In the present embodiment, as the holding means, the substrate M is adsorbed and held by a plurality of small air suction holes (not shown) opened in the stage 1. In addition, the platform 1 can be along the horizontal track 2 in the Y direction (figure 1 is moved in the front and rear directions), and is driven by a screw shaft 3 that is rotated by a motor (not shown). Further, the platform 1 can be rotated in a horizontal plane by a rotary drive unit 4 having a built-in motor.

具備有夾著平台1而設置之兩側之支撐柱5、5以及往X方向水平延伸之導引桿6之橋架7,係跨越平台1上而設置。A bridge 7 having support posts 5, 5 provided on both sides of the platform 1 and guide bars 6 extending horizontally in the X direction is provided across the platform 1.

在導引桿6,設置有往X方向水平延伸之導路8,以可沿著該導路8移動之方式設置有刻劃頭9,且藉由馬達12而驅動。The guide rod 6 is provided with a guide path 8 extending horizontally in the X direction so as to be movable along the guide path 8 to be provided with the scribing head 9 and driven by the motor 12.

在刻劃頭9之下端,可升降地安裝有夾持具10,且於夾持具10安裝有刀輪11。在本發明中,作為該刀輪11,可使用於圓周稜線部具有連續之小的凹凸之附溝槽刀輪。At the lower end of the scribing head 9, a gripper 10 is detachably mounted, and a cutter wheel 11 is attached to the gripper 10. In the present invention, as the cutter wheel 11, a grooved cutter wheel having a continuous small unevenness in the circumferential ridge portion can be used.

圖2係表示附溝槽刀輪11之一例子,圖2(a)係側視圖,圖2(b)係前視圖。該附溝槽刀輪11形成有在直徑2 mm~6 mm且厚度0.6 nm~1.5 mm左右之超硬合金製之圓盤碟11a之外周部用以形成成為刀刃之稜線11b之角度α(約100度~140度),且在該稜線11b形成有連續之小的凹凸11c。另外,作為該附溝槽刀輪11,例如亦可使用Mitsuboshi Diamond Industrial股份有限公司製造之刻劃輪「APIO(註冊商標)」。Fig. 2 is a view showing an example of the grooved cutter wheel 11, Fig. 2(a) is a side view, and Fig. 2(b) is a front view. The grooved cutter wheel 11 is formed with an angle α of a peripheral portion of the disc 11a made of a superhard alloy having a diameter of 2 mm to 6 mm and a thickness of about 0.6 nm to 1.5 mm to form a ridge line 11b which becomes a blade edge. 100 degrees to 140 degrees), and a continuous small unevenness 11c is formed in the ridge line 11b. In addition, as the grooved cutter wheel 11, for example, a scribe wheel "APIO (registered trademark)" manufactured by Mitsuboshi Diamond Industrial Co., Ltd. may be used.

接著,根據圖1說明關於刻劃裝置A之控制系統。刻劃裝置A具備有控制部20。控制部20由電腦系統所構成,該電腦系統藉由如以下的部分而構成:CPU(Central Processing Unit,中央處理單元)21,對控制進行所需之運 算處理;記憶體22(記憶部),記憶控制程式或所需之設定資訊;輸入裝置23,進行用以設定資訊或操作之輸入輸出;以及顯示裝置24,被用以作為輸入操作畫面或裝置狀況之監控畫面。Next, a control system relating to the scoring device A will be described based on Fig. 1 . The scribing device A is provided with a control unit 20. The control unit 20 is constituted by a computer system which is constituted by a CPU (Central Processing Unit) 21 for performing control on a desired basis. Computing processing; memory 22 (memory), memory control program or required setting information; input device 23 for inputting and outputting information or operations; and display device 24 for use as an input operation screen or device Monitoring screen of the situation.

在控制部20中,預先將控制所需之設定資訊記憶於記憶體22,藉此,可藉由控制程式與設定資訊而進行所欲之刻劃動作。The control unit 20 stores the setting information required for the control in the memory 22 in advance, whereby the desired scribing operation can be performed by the control program and the setting information.

若對所記憶之設定資訊中關於在本發明中相關之資訊具體地進行說明,則刻劃時之刻劃頭之移動速度資訊22a、按壓基板之按壓負載資訊22b、刻劃頭之移動距離資訊22c,係在加工開始前預先藉由輸入而設定。If the information related to the present invention is specifically described in the stored setting information, the moving speed information 22a at the time of the marking, the pressing load information 22b pressing the substrate, and the moving distance information of the scribe head are specifically described. 22c is set in advance by input before the start of processing.

對於刻劃頭之移動速度資訊22a,可輸入設定1個或2個數值,於輸入2個數值時,記憶為「第一移動速度」、「第二移動速度」,如以下利用圖3進行敍述般,於往復移動時(圖3(c)、(d))以「第一移動速度」進行掃描,在到達刻劃結束地點之刻劃時(圖3(e))以「第二移動速度」進行掃描。於僅輸入1個數值時,記憶為「第一移動速度」(第一移動速度與第二移動速度被視為相同而處理),刻劃加工中(圖3(c)、(d)、(e))刻劃頭始終以「第一移動速度」進行掃描。For the moving speed information 22a of the scribing head, one or two numerical values can be input, and when two numerical values are input, the memory is "first moving speed" and "second moving speed", which will be described below using FIG. Generally, when reciprocating (Fig. 3 (c), (d)), the scan is performed at "first moving speed", and when the scoring end point is reached (Fig. 3 (e)), "the second moving speed" is used. Scan. When only one value is input, the memory is "first moving speed" (the first moving speed and the second moving speed are treated as the same), and the scribing process is performed (Fig. 3(c), (d), ( e)) The scribe head is always scanned at the "first moving speed".

亦可對按壓負載資訊22b輸入設定1個或2個數值,於輸入2個數值時,記憶為「第一按壓負載」、「第二按壓負載」,如以下利用圖3進行敍述般,於往復移動時(圖3(c)、(d))以「第一按壓負載」進行壓接同時進行掃 描,在到達刻劃結束地點之刻劃時(圖3(e))以「第二按壓負載」進行壓接同時進行掃描。於輸入1個數值時,記憶為「第一按壓負載」(第一按壓負載與第二按壓負載被視為相同而處理),且刻劃加工中(圖3(c)、(d)、(e))始終以該「第一按壓負載」進行壓接同時進行掃描。It is also possible to input one or two values to the press load information 22b, and when the two values are input, the memory is the "first press load" and the "second press load", as described below with reference to FIG. When moving (Fig. 3 (c), (d)), press the "first pressing load" while sweeping When the scribe is reached at the end of the scoring (Fig. 3(e)), the second pressing load is used to perform the pressing while scanning. When one value is input, the memory is "first pressing load" (the first pressing load and the second pressing load are treated as the same), and the scribing process is performed (Fig. 3(c), (d), ( e)) Always perform the simultaneous pressing with the "first pressing load".

移動距離資訊22c,可輸入設定1個數值,如以下利用圖3進行敍述般,記憶為往復移動時(圖3(c)、(d))之從起始地點至折返點之「移動距離L」。The movement distance information 22c can be input and set by one numerical value. As described below with reference to Fig. 3, the memory is a reciprocating movement (Fig. 3 (c), (d)) from the starting point to the turning point "moving distance L" "."

接著,使用圖3說明使用該刻劃裝置A之刻劃方法。Next, a scribing method using the scribing device A will be described using FIG.

首先,預先使刀輪11來到刻劃加工之起始地點P1之正上方,以使刀輪11之移動方向與刻劃預定線一致之方式將基板M設置於平台1上。一般的基板M之設置方法為在平台1安裝定位用之止動部(未圖示)且與其抵接而進行定位,但亦可利用搬送機器人將基板載置於固定位置。此外,至基板載置為止之動作既可為手動亦可為自動。First, the cutter wheel 11 is brought to the front of the starting point P1 of the scribing process in advance so that the substrate M is placed on the stage 1 in such a manner that the moving direction of the cutter wheel 11 coincides with the planned line of scribing. In the general method of installing the substrate M, a positioning stopper (not shown) is attached to the platform 1 and positioned to abut against the positioning portion. However, the substrate may be placed at a fixed position by the transfer robot. Further, the operation until the substrate is placed may be either manual or automatic.

而且,如圖3(a)、(b)所示,在基板M之刻劃預定線上,使附溝槽刀輪11下降至進入至較基板M之一端緣(圖式之左端緣)更內側(例如3 mm之內側)之起始地點P1,以預先於預備試驗中求出之按壓負載(記憶為第一按壓負載資訊之負載)、例如0.05 MPa左右按壓,同時使其前進轉動至起始地點近旁之折返地點P2(記憶為移動距離資訊之距離)(參照圖3(c))。Further, as shown in FIGS. 3(a) and 3(b), on the scribed line of the substrate M, the grooved cutter wheel 11 is lowered to the inner side of one end edge (the left end edge of the drawing) of the substrate M. The starting point P1 (for example, the inner side of 3 mm) is pressed by a pressing load (memory is the load of the first pressing load information) obtained in the preliminary test, for example, about 0.05 MPa, and is rotated forward to the start. The return point P2 near the location (memory is the distance of the moving distance information) (refer to Figure 3 (c)).

進一步地,於折返地點P2持續維持著先前之按壓負載而折返使其後退轉動至起始地點P1,而形成溝槽(溝痕)T (參照圖3(d))。Further, at the returning point P2, the previous pressing load is continuously maintained and folded back to rotate back to the starting point P1 to form a groove (groove) T (Refer to Figure 3(d)).

之後,使用較先前之按壓負載為小之按壓負載(記憶為第二按壓負載之負載)、例如以0.01 MPa左右前進轉動至刻劃預定線之終點地點P3,而形成刻劃線S(參照圖3(e))。Thereafter, a scribe line S is formed by using a pressing load that is smaller than the previous pressing load (memory is the load of the second pressing load), for example, about 0.01 MPa, and is rotated to the end point P3 of the scribed line. 3(e)).

如此,藉由使刀輪11沿著起始地點P1→折返地點P2→起始地點P1進行一往復轉動而形成之溝槽T,係作為用以形成刻劃線S之觸發器(刀輪侵入用溝槽)而發揮作用。因此,於使刀輪11進行一往復之後,從起始地點P1轉動至刻劃預定線之終點地點P3時之刀刃之侵入變得容易,而可不滑動地較佳地形成刻劃線S。Thus, the groove T formed by reciprocating the cutter wheel 11 along the starting point P1 → the return point P2 → the starting point P1 is used as a trigger for forming the score line S (the cutter wheel intrusion It works with grooves). Therefore, after the cutter wheel 11 is reciprocated, the intrusion of the blade is facilitated when the starting point P1 is rotated to the end point P3 of the planned line, and the score line S is preferably formed without slipping.

此外,由於形成刻劃線S時之刀刃之侵入較為容易,因此即使使刻劃線形成時之刀輪11之按壓負載小於溝槽T之形成時之按壓負載,亦可充分地形成刻劃線S。藉此,可減輕刻劃線形成時之刀輪對基板之強加之負載,而不會有基板之破裂或完全分斷。Further, since the intrusion of the blade is easy when the score line S is formed, even if the pressing load of the cutter wheel 11 when the score line is formed is smaller than the pressing load when the groove T is formed, the score line can be sufficiently formed. S. Thereby, the load imposed on the substrate by the cutter wheel when the score line is formed can be reduced without cracking or complete breaking of the substrate.

使上述刀輪11往復之距離、亦即從起始地點P1至折返地點P2之距離L(記憶為移動距離資訊之距離),較佳為:設為0.5 mm~3 mm,尤其較佳為設為2 mm左右。The distance by which the cutter wheel 11 reciprocates, that is, the distance L from the starting point P1 to the returning point P2 (the distance stored as the moving distance information) is preferably set to 0.5 mm to 3 mm, and particularly preferably It is about 2 mm.

此外,刀輪11之轉動速度,較佳為:使往復移動時之速度(記憶為第一移動速度之速度)較慢,例如3 mm/秒左右,使形成刻劃線S時之速度(記憶為第二移動速度之速度)較快,例如100 mm/秒。藉此,可確實地進行成為最初之刀輪侵入起點之溝槽T之加工,並且可迅速地進行刻劃 線S之加工。Further, the rotational speed of the cutter wheel 11 is preferably such that the speed at which the reciprocating movement is performed (the speed at which the first moving speed is memorized) is slow, for example, about 3 mm/sec, so that the speed at which the score line S is formed (memory) The speed of the second moving speed is faster, for example 100 mm/sec. Thereby, the processing of the groove T which becomes the starting point of the first cutter wheel can be surely performed, and the scribing can be performed quickly Processing of line S.

以下所示之表1,係表示利用本發明之內切刻劃法進行刻劃之試驗結果,表2,係表示利用習知之內切刻劃法進行刻劃之試驗結果。Table 1 shown below shows the test results of the scribe by the inscribed scribe method of the present invention, and Table 2 shows the test results of the scribe by the conventional inscribed scribe method.

於該試驗中,分別準備8個(編號1~8)稜線角度(α)不同之直徑2 mm之附溝槽刀輪,利用本發明之內切刻劃法、與習知之內切刻劃法進行刻劃試驗。In this test, eight grooved cutter wheels (numbered 1 to 8) having a ridgeline angle (α) of 2 mm in diameter were prepared, respectively, using the inscribed scribe method of the present invention, and the conventional inscribed scribe method. Conduct a scratch test.

其結果,於習知之刻劃法(表2)中,表示施力不良或先龜裂之×標記較多,刻劃線之加工非常地不穩定,相對於此,於本發明之刻劃法(表1)中,如○標記所示般可於較廣之範圍內穩定地形成刻劃線。As a result, in the conventional scribe method (Table 2), there are many × marks indicating that the urging force is poor or the first crack is generated, and the processing of the scribe line is extremely unstable, whereas the scribe method of the present invention is relatively unstable. In (Table 1), the score line can be stably formed over a wide range as indicated by the mark ○.

以上,說明了關於本發明之代表性之實施例,但本發明並不限定於上述實施形態。例如,於上述實施例中,使刀輪11在從起始位置P1至折返地點P2之間進行一往復,但亦可根據強化玻璃之種類或厚度進行二往復。在此情形時之往復動作時之移動速度、按壓負載,亦參照第一移動速度、第一按壓負載之數值而進行刻劃。The representative embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. For example, in the above embodiment, the cutter wheel 11 is reciprocated from the start position P1 to the return position P2, but it is also possible to perform two reciprocations depending on the type or thickness of the tempered glass. In this case, the moving speed and the pressing load at the time of the reciprocating operation are also scored with reference to the values of the first moving speed and the first pressing load.

此外,於上述實施例中,使刻劃線形成時之刀輪11之按壓負載較用以加工溝槽T之往復時之按壓負載為小,但亦可不改變往復時之按壓負載而對刻劃預定線全長進行刻劃。Further, in the above embodiment, the pressing load of the cutter wheel 11 at the time of forming the score line is smaller than the pressing load when the groove T is reciprocated, but the pressing load at the time of reciprocation may be scribed. The entire length of the line is scored.

於其他本發明中,為了達成其目的,可於不脫離申請專利範圍之範圍內適當進行修正、變更。In the other aspects of the invention, modifications and changes may be appropriately made without departing from the scope of the invention.

本發明之刻劃方法能夠利用於刻劃強化玻璃基板之情形。The scribing method of the present invention can be utilized in the case of scoring a tempered glass substrate.

M‧‧‧脆性材料基板M‧‧‧Battery material substrate

P1‧‧‧起始地點P1‧‧‧ starting point

P2‧‧‧折返地點P2‧‧‧Return location

S‧‧‧刻劃線S‧‧ scribe

T‧‧‧溝槽T‧‧‧ trench

11‧‧‧刀輪11‧‧‧Cutter wheel

圖1,係表示本發明之刻劃方法所使用之刻劃裝置之一實施例之前視圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing an embodiment of a scoring apparatus used in the scribing method of the present invention.

圖2,係表示圖1之刀輪之一例子之前視圖及左側視圖。Fig. 2 is a front view and a left side view showing an example of the cutter wheel of Fig. 1.

圖3,係表示本發明之刻劃方法之順序之俯視圖。Fig. 3 is a plan view showing the sequence of the scribing method of the present invention.

圖4,係表示一般的玻璃基板之交叉刻劃加工之圖式。Fig. 4 is a view showing a cross-scouring process of a general glass substrate.

圖5,係表示利用刀輪之習知之刻劃方法之圖式。Fig. 5 is a view showing a conventional scribing method using a cutter wheel.

11‧‧‧刀輪11‧‧‧Cutter wheel

M‧‧‧基板M‧‧‧ substrate

T‧‧‧溝槽T‧‧‧ trench

S‧‧‧刻劃線S‧‧ scribe

L‧‧‧移動距離L‧‧‧Moving distance

P1‧‧‧起始地點P1‧‧‧ starting point

P2‧‧‧折返地點P2‧‧‧Return location

P3‧‧‧終點地點P3‧‧‧ Destination Location

Claims (6)

一種強化玻璃基板之刻劃方法,係對於基板表面形成有壓縮應力層之強化玻璃基板形成刻劃線,其特徵在於:使用於刀刃稜線具有連續之凹凸之附溝槽刀輪,(a)使上述刀輪下降抵接於進入至較上述基板之一端緣更內側之起始地點,於刻劃預定線之方向在與起始地點近旁之折返地點之間,以按壓狀態進行至少一往復之前進轉動與後退轉動而形成成為刀輪之侵入起點之溝槽,(b)接著,使刀輪以從上述起始地點通過上述溝槽上之方式,進行按壓轉動直至刻劃預定線之終點地點,而形成刻劃線;使形成刻劃線時之刀輪之按壓負載,較形成成為刀輪之侵入起點之溝槽時之刀輪之按壓負載為小。 A method for scribing a tempered glass substrate, wherein the tempered glass substrate having a compressive stress layer formed on a surface of the substrate is formed with a scribe line, which is characterized by: a grooved cutter wheel having continuous ridges and ridges on the edge of the blade, (a) The cutter wheel descends against a starting point that enters to the inner side of one of the end edges of the substrate, and performs at least one reciprocating advancement in a pressing state between the direction of the predetermined line and the reentry point near the starting point. Rotating and retreating to form a groove that becomes an intrusion starting point of the cutter wheel, and (b) subsequently, the cutter wheel is pressed and rotated to pass through the groove from the starting point until the end point of the predetermined line is scored. The scribe line is formed; the pressing load of the cutter wheel when the scribe line is formed is smaller than the pressing load of the cutter wheel when the groove which becomes the starting point of the cutter wheel is formed. 如申請專利範圍第1項之強化玻璃基板之刻劃方法,其中,使刀輪之形成刻劃線時之轉動速度較上述往復移動時之轉動速度為快。 The method of scoring a tempered glass substrate according to the first aspect of the invention, wherein the rotational speed of the scoring wheel when forming the score line is faster than the rotational speed of the reciprocating movement. 如申請專利範圍第1或2項之強化玻璃基板之刻劃方法,其中,從上述起始地點至折返地點之距離為0.5mm~3mm。 The method for scoring a tempered glass substrate according to claim 1 or 2, wherein the distance from the starting point to the turning point is 0.5 mm to 3 mm. 一種刻劃裝置,係於玻璃基板之表面形成刻劃線,其特徵在於具備:平台,載置玻璃基板;刻劃頭,保持於刀刃稜線具有連續之凹凸之附溝槽刀輪; 刻劃頭升降機構,以使上述刀輪對於上述玻璃基板之表面取得接觸狀態與離開狀態之方式使上述刻劃頭升降;掃描機構,使上述刻劃頭在沿著上述玻璃基板之表面之方向移動;以及控制部,進行利用上述刻劃頭升降機構之升降動作、及利用上述掃描機構之刻劃頭之移動動作之控制;其中,上述控制部一旦在上述基板已被設置之狀態下以使刻劃頭來到進入至較上述基板之一端緣更內側之起始地點之方式開始控制,則(a)使上述刀輪下降抵接於上述起始地點,於刻劃預定線之方向在與起始地點近旁之折返地點之間,以按壓狀態進行至少一往復之前轉進動與後退轉動而形成成為刀輪之侵入起點之溝槽,(b)接著,使刀輪以從上述起始地點通過上述溝槽上之方式進行按壓轉動直至刻劃預定線之終點地點,而進行形成刻劃線之動作之控制;使形成刻劃線時之刀輪之按壓負載,較形成成為刀輪之侵入起點之溝槽時之刀輪之按壓負載為小。 A scribing device is formed on a surface of a glass substrate to form a scribe line, which is characterized in that: a platform is disposed on which the glass substrate is placed; and the scribing head is held by the grooved cutter wheel having continuous ridges on the edge of the blade edge; The scribing head elevating mechanism is configured to raise and lower the scribing head by bringing the cutter wheel into a contact state and a leaving state with respect to a surface of the glass substrate; and the scanning mechanism is configured to cause the scribing head to be along a surface of the glass substrate And a control unit that performs a lifting operation by the above-described scoring head elevating mechanism and a control of a moving operation of the scribing head by the scanning mechanism; wherein the control unit is in a state in which the substrate is already provided When the scribing head comes to the starting point to enter the inner side of one end of the substrate, (a) the cutter wheel is lowered to abut the starting point, and the direction of the predetermined line is Between the reversing points near the starting point, at least one reciprocating forward and backward rotation are performed in a pressed state to form a groove which becomes an intrusion starting point of the cutter wheel, and (b) next, the cutter wheel is made from the above starting point Pressing and rotating by means of the above-mentioned groove until the end point of the predetermined line is scored, and the control of forming the scribe line is performed; and the cutter wheel forming the scribe line is formed The pressing load, the pressing load becomes more form of cutter wheel when the starting point of the groove intrusion of the cutter wheel is small. 如申請專利範圍第4項之刻劃裝置,其中,上述控制部具備:記憶部,可分別記憶上述(a)之往復轉動時、與上述(b)之直至刻劃預定線之終點地點之轉動時之刻劃頭之移動速度,且根據該記憶部所記憶之移動速度,而決定上述(a)之往復轉動、與上述(b)之直至刻劃預定線之終點地 點之轉動時之移動速度。 The scoring device of claim 4, wherein the control unit includes a memory unit that can respectively record the rotation of the (a) reciprocating rotation and the end point of the (b) to the predetermined line of scoring The moving speed of the head is momentarily determined, and the reciprocating rotation of the above (a) and the end point of the predetermined line up to (b) are determined according to the moving speed memorized by the memory unit. The speed of movement when the point is rotated. 如申請專利範圍第4或5項之刻劃裝置,其中,上述控制部具備:記憶部,可分別記憶上述(a)之往復轉動時、與上述(b)之直至刻劃預定線之終點地點之轉動時之刻劃頭之按壓負載。 The scoring device of claim 4, wherein the control unit includes a memory unit that memorizes the end point of the (a) reciprocating rotation and the end point of the (b) to the scoring line. The pressing load of the head when turning.
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