TW201431804A - Scribing method for reinforced glass substrate and scribing device thereof - Google Patents

Abstract

The present invention provides a scribing method and a scribing device, which can use the inner cut method to rightly form the scribing lines, even for a reinforced glass substrate. The solving means is a scribing method of processing the scribing lines for the reinforced substrate M whose surface has a compressed stress layer, in which a laser beam is used to irradiate the surface of the substrate M from the position closer to the inner side than one end edge of the substrate M, the irradiated trace is used to be the trigger groove T of the scribing start point of the cutter wheel Z, the cutter wheel 2 is abutted against the trigger groove T and then uses it as a start point to form a scribing line on the surface of the substrate M by carrying out a pressing rotation.

Description

Method for sculpting strengthened glass substrate and scribing device

The invention relates to a method and a scribing device for tempering a glass substrate made of glass. Here, the "tempered glass" is a glass produced by forming a compressive stress layer having a residual compressive stress on a surface layer of a substrate of a glass substrate and leaving a tensile stress inside the substrate. The characteristics of the tempered glass have the following properties: they are not easily broken by the external force due to the influence of the compressive stress layer, but conversely, if cracks are generated on the surface of the substrate and progress to the inside of the substrate where residual tensile stress is present, Make the crack easy to deepen the soak.

In general, in the process of breaking a glass substrate, a step of forming a scribe line by first forming a finite depth on the surface of the substrate, and then breaking the rod or breaking by scribe line from the back side of the substrate is employed. A breaking method in which the roller is pressed and broken, (see Patent Document 1 and Patent Document 2). Specifically, as shown in FIG. 5, a scribe line S1 in the X direction is formed by a cutter wheel (also referred to as a scribe wheel) on the surface of the large-area mother substrate M, and then a Y-direction crossing the X direction is formed. Mark S2. After forming a plurality of scribe lines intersecting in the X-Y direction, the substrate M is sent to the rupture device, and is bent into a unit substrate by being bent from the back side along each scribe line.

In the method of scribing a glass substrate with a cutter wheel, there are methods of "external cutting" and "inscribed", and the outer cutting and the inner cutting are selectively used depending on the type, thickness, and use of the substrate. Method of drawing (refer to Patent Document 2).

The former is cut outside, as shown in Fig. 6(a), the lower end of the cutter wheel K is lowered below The state slightly below the surface (upper surface) of the substrate M is set to the outer side position (scratch start position) of the one end side of the substrate M. Then, it is horizontally moved from the set position, collides with the end portion of the substrate, and is slid, and is further scribed in such a manner that the cutter wheel K is horizontally moved while being pressed at a predetermined timing.

In the outer cutting method, the entry (intrusion) of the cutter wheel at the end portion of the substrate is improved, and since the formed score line reaches the end portion of the substrate, the breakage can be easily and correctly performed in the next step. On the other hand, the tip end of the cutter wheel collides with the end portion of the substrate. Therefore, there is a possibility that the end portion of the substrate is notched, and the end portion is irregularly broken or completely cut due to the tensile stress inside the substrate. Breaking) and so on. In addition, the cutter wheel is also easily worn out due to collision with the edge portion.

In the latter, as shown in FIG. 6(b), the cutter wheel K is lowered from above and pressed with a predetermined scribe on the inner side (scratch start position) of about 2 mm to 10 mm from the edge of the mother substrate M. The substrate M is attached to the substrate M, and the cutter wheel K is horizontally moved while being pressed.

In the inscribed method, since there is no collision between the cutter wheel and the edge portion of the end portion of the substrate, there is no need to worry about the occurrence of a gap at the end portion of the substrate, and the complete division of the substrate is prevented. In addition, the wear of the front end of the cutter wheel can be suppressed compared to the external cutting method. Therefore, in the scribe process of the tempered glass substrate, the method of "inscribed" is better than "external cutting".

Patent Document 1: Japanese Patent No. 3074143

Patent Document 2: Japanese Laid-Open Patent Publication No. 2009-208237

However, even if the tempered glass substrate is to be scribed by the incision method, when the front end of the knives is abutted, the tempered glass is reinforced, and the front end of the slab is hard to intrude into the surface of the substrate due to the residual compressive stress of the surface layer of the substrate. The front end of the knife enters the substrate very poorly. Therefore, except In addition to the slippage, there is also a problem that the scribing process becomes difficult. Further, in order to invade the tip end of the blade, if it is scored with a strong pressing load, there is a possibility that the blade is broken or completely broken due to the influence of the residual tensile stress inside the substrate.

As described above, the tempered glass substrate is different from the conventional dicing process for a soda glass substrate or the like, and it is difficult to form the scribe line well by the use of the external cutting method or the inscribed method. In this tendency, the substrate having a large compressive stress layer on the surface of the substrate and having a large residual stress is more conspicuous.

Accordingly, an object of the present invention is to provide a scribing method and a scribing apparatus which can form a score line in an "inscribed" manner even in a glass substrate made of tempered glass which is difficult to process.

In order to achieve the above object, the following technical means are implemented in the present invention. That is, the scribing method of the present invention is a scribing method in which a tempered glass substrate having a compressive stress layer formed on a surface of a substrate is formed with a scribe line, and has: (a) a position further inside than one end edge of the substrate Irradiating the surface of the substrate with a laser beam, and forming a trigger groove processing step of the trigger groove which is the starting point of the scoring wheel of the cutter wheel; (b) lowering the cutter wheel to abut the trigger groove The position is a step of scribing along the scribed line to form a scribe line.

Further, the scribing device of the present invention is a scribing device in which a tempered glass substrate having a compressive stress layer formed on a surface of a substrate is formed with a scribe line, and has a scribing head which is a platform on which the substrate is placed for irradiation. a laser irradiation portion that forms a laser beam that triggers a groove on a surface of the substrate, and is integrally held with a cutter wheel for forming a scribe line by pressing and rotating along a predetermined line set on the substrate, or respectively Individually maintained; the wheel lifting means is a lifting wheel that is held at the scribe head; the moving means moves the scribe head relative to each other along the surface of the substrate; and controls a portion that controls the laser irradiation unit and the scoring operation performed by the cutter wheel; the control unit once the scoring head has been set such that the laser irradiation portion comes to a position further inside than one end edge of the substrate When the control is started in the upper position, the following control is performed: (a) irradiating the surface of the substrate with a laser beam, and the irradiation mark forms a trigger groove which becomes the starting point of the scoring wheel; (b) Next, The cutter wheel is moved above the trigger groove and lowered to a position abutting against the substrate, and is pressed and pressed along the line to be scored to form a score line.

The trigger trench is preferably formed to have a depth of 2.5 μm or more, a width of 15 to 50 μm, and a length of 50 to 250 μm.

According to the present invention, even if the glass substrate is reinforced, the trigger groove can be processed by the laser beam at a position closer to the inner side than the edge of one of the substrates, and the trigger groove is used as a starting point for scribing by the cutter wheel, so At the initial stage of the rotation of the cutter wheel, the tip end of the cutter wheel can be brought into contact with the step portion formed at the end portion of the trigger groove, and the entry into the substrate is improved, and the sliding or the like is not caused. Thereby, even if it is a tempered glass substrate, the effect of the slashing can be performed by the method of "inscribed".

In the present invention, the trigger groove can be formed to contribute to the length of travel of the cutter wheel in the trigger groove. Thereby, since the cutter wheel travels in the trigger groove to abut the step portion, the entry of the cutter wheel to the substrate can be further facilitated.

M‧‧‧ strengthened glass substrate

T‧‧‧Trigger groove

1‧‧‧Laser Department

2‧‧‧Cutter wheel

3‧‧‧ platform

15‧‧‧Trigger groove step

20‧‧‧Control Department

21‧‧‧CPU

22‧‧‧ memory

23‧‧‧ Input device

24‧‧‧ display device

31‧‧‧Trigger length setting information

32‧‧‧Trigger width setting information

33‧‧‧ Wheel adjustment length setting information (wheel position adjustment length)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an embodiment of a scoring apparatus used in the scribing method of the present invention.

Fig. 2 is an explanatory view showing a scribing step using the scoring apparatus of Fig. 1.

Figure 3 is a cross-sectional view showing the length direction of the trigger groove.

Figure 4 is a cross-sectional view showing the trigger groove in the width direction.

Fig. 5 is a plan view showing a conventional method of scribing a glass substrate.

Fig. 6 is an explanatory view showing a method of dicing the inner cut and the outer cut.

In the following, details of the scribing method and scoring apparatus of the present invention will be described in detail based on the drawings. Fig. 1 is a schematic view showing an example of a scribing device used for forming a scribe line on a tempered glass substrate having a compressive stress layer on a surface of a substrate.

The scribing device SC includes a stage 3 on which the tempered glass substrate M is placed. The platform 3 is provided with a holding mechanism for holding the substrate M placed thereon in a fixed position. In the present embodiment, as the holding means, the holding substrate M is sucked and held by a plurality of small air suction holes (not shown) opened on the surface of the stage 3. Further, the platform 3 is movable along the horizontal rail 4 in the Y direction (the front and rear directions of the paper of Fig. 1), and is driven by a threaded shaft 5 that is rotated by a motor (not shown). Further, the platform 3 can be rotated in a horizontal plane by the rotary drive unit 6 of the built-in motor.

A bridge 9 having support columns 7, 7 on both sides sandwiching the platform 3 and beams (beams) 8 extending horizontally in the X direction is provided across the platform 3. The beam 8 is provided with a guide member 10 extending horizontally in the X direction, and the guide member 10 is mounted with a scribing head 11 so as to be movable in the X direction by the motor 13 by the motor 13. A laser irradiation unit 1 that illuminates a laser beam of a green laser on a substrate surface and a cutter wheel that is held by the liftable wheel holder 12 are attached to the scribing head 11. 2. Further, in the present embodiment, the laser irradiation unit 1 and the cutter wheel 2 are attached to the same scribe head 11 with a slight interval therebetween, but they may be attached to individual scribe heads. Also in any case, the interval between the two is known and can be the following Refer to the setting information of the position adjustment length 33.

As shown in FIG. 4, the cutter wheel 2 is formed by using a disc body made of a superhard alloy having a tip end 2a of a circumferential ridge line, and has a diameter of 2 to 3 mm and a tip end angle α of 100 to 150. The degree of obtuse.

Next, the control system for the scribing device SC will be described with reference to Fig. 1 . The scribing device SC is provided with a control unit 20. The control unit 20 performs an input/output for setting information or operations by a CPU (Central Processing Unit) 21 that performs necessary calculation processing for control, a storage control program or a memory 22 (memory unit) that necessary setting information. The input device 23 and the computer system constituted by the display device 24 as a monitor screen for inputting an operation screen or device status are configured. The control unit 20 stores the setting information necessary for the control in the memory 22 in advance, whereby the desired scribing operation can be performed by the control program and the setting information. The setting information stored as the necessary setting information for the scribing process and stored in the memory 22 includes, of course, the output power of the laser irradiation, the information on the start position of the laser irradiation (trigger processing), and the cutter wheel. The pressing load and the scanning distance for forming the scribe line by the cutter wheel are included, and the information relating to the present invention further includes "trigger length" 31, "trigger width" 32, and "wheel position adjustment length" 33. Information. The "trigger length" 31 and the "trigger width" 32 are information for setting the length L or the width W of the trigger formed by the laser irradiation to a desired value. Based on the setting information, the number of irradiation pulses of the laser or the moving distance at the time of trigger formation of the scribe head is calculated, and the trigger L of the length L and the width W in accordance with the setting information is processed. In addition, the "wheel position adjustment length" 33 is setting information for adjusting the length E necessary for the cutter wheel 2 to abut against the trigger formation position after the trigger T is formed by the laser irradiation unit 1. In other words, the laser irradiation unit 1 and the cutter wheel 2 are attached to the scribing head 11 at a predetermined interval. Therefore, in order to make the cutter wheel 2 abut against the thunder At the position of the trigger T formed by the irradiation, it is necessary to move the cutter wheel to the same extent as the interval and then fall to abut. Therefore, the moving distance, that is, the adjustment length E of the wheel position, is set in advance.

Next, a scribing method using the scribing device SC will be described. First, as shown in FIGS. 2(a) and 2(b), the laser beam is directed from the laser irradiation unit 1 to one end edge of the substrate M in the right direction of the substrate M (the left end of the figure). The edge is further irradiated to the inner side (for example, the inner side of 5 mm) at the point P1 (the starting point of the trigger processing) to locally melt and sublimate the surface of the substrate M (local partial ablation), thereby processing along the predetermined line. Slender trigger groove T. The depth D of the trigger trench T (refer to FIGS. 3 and 4) can be adjusted in the range of 2.5 μm to 4 μm by irradiating the output power of the laser, and the appropriate depth is set according to the thickness of the compressive stress layer of the substrate M. . Further, the length of the trigger trench T is formed in the range of 50 to 250 μm, and the width W is formed in the range of 15 to 50 μm. The value of the length L or the width W of the trigger groove T is set to the above-mentioned "trigger length" 31 and "trigger width" 32, but the diameter or knife of the cutter wheel 2 used in the scribing step described below is used. Select the value for the front end angle. Further, the adjustment of the length L direction of the trigger groove T can be performed by moving the laser irradiation unit 1 along the guide 10 (refer to FIG. 1) as shown in FIG. 2(b), and further, the trigger groove The adjustment of the width W of the T can be performed by moving the stage in the Y direction (front-rear direction) by the threaded shaft 5.

After the triggering groove T has been processed, the scribe head 11 is moved to directly above the triggering groove T based on the adjusted length E stored in the "wheel position adjustment length" 33. Next, as shown in FIG. 2(c), the cutter wheel 2 is lowered toward the trigger groove T, and the substrate M is pressed against the substrate M while being scribed along the predetermined line and rotated in the longitudinal direction of the trigger groove T. At the initial stage of the rotation, the cutter wheel 2 abuts on the step portion 15 formed at the end portion of the trigger groove T as shown in Fig. 2(d), whereby the entry to the substrate M can be improved, and Scratched to the point where it does not slip The terminal position P2 of the predetermined line is scored. Further, since the step portion 15 has a drop of 2.5 μm to 4 μm and is formed at the end portion of the trigger groove T, irregular breakage or cracking due to an impact when the cutter wheel 2 abuts does not occur.

Further, when the cutter wheel 2 is lowered to the trigger groove T and rotated, in order to make the cutter wheel 2 travel in the trigger groove T and abut against the step portion 15, the length L of the trigger groove can be increased in advance by the travel distance. set up. Thereby, the entry of the cutter wheel 2 with respect to the substrate M can be further facilitated. As the length of the triggering groove T to which the traveling distance has been added, for example, when the depth D of the triggering groove T is set to 3 μm and the cutter wheel having a diameter of 2 mm has been used, as shown in FIG. 3, due to the sneak-in trigger groove The front end portion of the front end portion of the cutter wheel 2 of T is 154.8 μm, and therefore, the travel distance is added to about 200 μm which is an appropriate length. In addition, in FIG. 3, for the convenience of description, the scale ratio of the cutter wheel 2 and the trigger groove T is changed and shown.

In addition, when the cutter wheel 2 is lowered to the trigger groove T, if the width W of the trigger groove T is narrow, the left and right slopes of the front end of the cutter wheel 2 will be pressed into the trigger groove T reluctantly. The substrate M is in an unfavorable condition such as irregular breakage or cracking. Therefore, the width W of the trigger groove T can be set to such an extent that the edge portion of the trigger groove T does not abut against the cutter wheel 2. For example, in the case where the depth of the trigger groove T is 3 μm and the cutter wheel 2 having the tip angle of the blade of 130 degrees is used, as shown in FIG. 4, the link is 3 μm from the front end of the front end of the cutter wheel 2 The distance L2 between the left and right slopes is 12.87 μm, so the width W of the trigger groove T may be larger than the above-mentioned 12.87 μm and has an excessive value, for example, 15 μm, preferably 20 μm. However, when the width W is too wide, it is difficult to function as a trigger groove, and therefore it is preferably 50 μm or less. Thereby, it is possible to prevent a problem caused by the blade tip of the cutter wheel being strongly pressed into the trigger groove having a narrow width.

In the above manner, after the scribe line in the X direction in FIG. 1 is sequentially processed, the stage 3 is rotated 90 degrees in the horizontal direction, and all scribes in the Y direction orthogonal to the X direction are formed by the same means as described above. line. In this way, the scribe lines in the X-Y direction where the phases intersect are processed.

In the above embodiment, although the processing steps of the trigger groove T irradiated with the laser beam and the scribing step using the cutter wheel 2 are performed for forming each of the scribe lines, the predetermined line may be scribed in advance. A triggering groove T is formed, and then a scribing step using the cutter wheel 2 is performed from the triggering groove T.

The present invention has been described with reference to the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described above, and may be appropriately modified or changed within the scope of the invention.

The scribing method of the present invention can be utilized in the case of scribing a tempered glass substrate having a compressive stress layer on its surface.

L‧‧‧Trigger length

M‧‧‧ strengthened glass substrate

T‧‧‧Trigger groove

1‧‧‧Laser Department

2‧‧‧Cutter wheel

15‧‧‧Trigger groove step

P1‧‧‧Starting point of trigger processing

P2‧‧‧ End position of the planned line

Claims (8)

A method for scribing a tempered glass substrate, wherein the tempered glass substrate having a compressive stress layer formed on a surface of the substrate is formed with a scribe line, wherein: (a) is located further inside than one end edge of the substrate, Irradiating the surface of the substrate with a laser beam, and forming a trigger groove processing step of the trigger groove which is the starting point of the scoring wheel of the cutter wheel; (b) lowering the cutter wheel to a position abutting the trigger groove a step of scribing along the scribed line to form a scribe line. The method of marking a tempered glass substrate according to claim 1, wherein the triggering groove forms a length that facilitates travel of the cutter wheel within the trigger groove. The method for scoring a tempered glass substrate according to claim 1 or 2, wherein the width of the trigger groove is 15 to 50 μm. The method for scoring a tempered glass substrate according to claim 1 or 2, wherein the length of the trigger groove is 50 to 250 μm. The method for scoring a tempered glass substrate according to claim 3, wherein the length of the trigger trench is 50 to 250 μm. The method for scoring a tempered glass substrate according to claim 1, wherein the depth of the trigger trench is formed to be 2.5 μm or more. A scribing device is formed by forming a scribe line on a tempered glass substrate having a compressive stress layer formed on a surface of a substrate, and is characterized in that: a scribing head is provided, and a platform on which the substrate is placed is irradiated for use in the substrate a laser illuminating portion of the laser beam that forms the trigger groove, and a predetermined line pressure for scribe along the substrate The cutter wheels that are rotated to form the score line are integrally held or individually held; the wheel lifting and lowering means is to lift and hold the cutter wheel of the score head; and the moving means is to mark the surface along the surface of the substrate a relative movement of the head; and a control unit that controls the laser irradiation unit and the scoring operation performed by the cutter wheel; the control unit once the scoring head has been set to the laser irradiation unit to reach one end of the substrate When the edge is controlled to enter the position above the inner side, the following control is performed: (a) irradiating the surface of the substrate with a laser beam, and the irradiation mark forms a trigger groove which becomes the starting point of the scoring wheel. (b) Next, the cutter wheel is moved above the trigger groove and lowered to a position abutting the substrate, and the scribe line is formed by crimping rotation along the predetermined line. The scouring device for tempered glass substrate according to claim 7, wherein the laser illuminating portion has a length of 50 to 250 μm on the surface of the substrate in a direction along which the predetermined line is scribed, and the width of the trigger is 15~50μm narrow-width trigger groove is used for control.