KR20140101288A - Method and apparatus for scribing hardened glass substrate - Google Patents

Abstract

Provided are a scribing method and a scribing device through which a scribing line can be formed with reliability by folding even on a reinforced glass substrate. In the scribing method according to the present invention, by which the scribing line is processed on the reinforced glass substrate (M) where a compression stress layer is formed on a surface of the substrate, the surface of the substrate (M) is irradiated with a laser beam at a position inside one end edge of the substrate (M), a trigger groove (T) is formed as a scribing starting point for a cutter wheel (2) by the irradiation scar, and then the cutter wheel (2) abuts against the trigger groove (T) and pressure contact is performed on the surface of the substrate (M) from the trigger groove (T) so that the scribing line is formed.

Description

TECHNICAL FIELD [0001] The present invention relates to a scribing apparatus for scribing a tempered glass substrate,

The present invention relates to a method of scribing a tempered glass glass substrate and a scribing apparatus. The term "tempered glass" as used herein refers to glass produced so that a compressive stress layer in which a compressive stress remains in the substrate surface layer of a glass substrate is formed and tensile stress remains in the substrate.

The characteristic of the tempered glass is that it is hard to break with respect to external force due to the influence of the compressive stress layer. On the other hand, once cracks are generated on the surface of the substrate and progress to the inside of the substrate where residual tensile stress is present, It is easy to make.

Generally, in the process of dividing a glass substrate, first, a step of forming a scribe line having a finite depth on the surface of the substrate and then a step of pressing the substrate with a break bar or a brake roller along the scribe line from the back side of the substrate (See Patent Document 1 and Patent Document 2).

Specifically, as shown in Fig. 5, a scribe line S1 in the X direction is formed by a cutter wheel (also referred to as a scribing wheel) on the surface of the large-area mother substrate M, Direction and a Y-direction scribe line S2 intersecting with the Y direction. After the plurality of scribe lines intersecting in the X-Y direction are formed in this manner, the substrate M is transferred to the break apparatus and is bent along the scribe lines from the back side to be divided into unit substrates.

Methods for scribing a glass substrate with a cutter wheel include " outer cutting " and " inner cutting ", and a scribing method for cutting out and cutting is selectively used depending on the type, thickness, and application of the substrate (See Patent Document 2).

As shown in Fig. 6 (a), the electron mishandling occurs when the lowermost end of the cutter wheel K is slightly lower than the surface (the upper surface) of the substrate M, (Scribe start position) of the end portion (end portion). Then, the cutter wheel K is moved horizontally from the set position to collide with the end portion of the substrate. Further, the cutter wheel K is horizontally moved while being pressed with a predetermined scribing pressure to perform scribing.

Since the scribe line formed on the edge of the substrate reaches the end portion of the substrate, the breakage can be easily and accurately performed in the next step. On the other hand, since the blade edge of the cutter wheel collides with the end portion of the substrate, the end portion of the substrate is liable to be bent and may be irregularly broken from the end portion due to the tensile stress inside the substrate or may be pulled out (completely split). Further, the cutter wheel is also likely to be consumed by collision with the edge portion.

6 (b), the cutter wheel K is lowered from the upper side on the inner side (scribing start position) about 2 mm to 10 mm from the edge of the mother substrate M Scribing is carried out while causing the cutter wheel K to move horizontally while pressing the substrate M with a predetermined scribing pressure.

Since the cutter wheel does not collide with the edge portion of the end portion of the substrate, there is no risk of the end portion of the substrate being bent and the complete division of the substrate can be prevented. In addition, it is possible to suppress the wear of the cutting edge of the cutter wheel as compared with the cutting edge.

Therefore, in the scribing process of the tempered glass substrate, it is said that the " cutting edge "

Japanese Patent Publication No. 3074143 Japanese Laid-Open Patent Publication No. 2009-208237

However, even if it is intended to scribe the tempered glass substrate by internal splitting, since the tempered glass is brought into contact with the edge of the blade, the edge of the blade is hard to break into the surface of the substrate due to the influence of the residual compressive stress on the surface layer of the substrate, It is very bad. Therefore, there is a problem that slip occurs and scribe processing becomes rather difficult. In addition, scribing with a strong pressing load in order to cause the edge of the blade to be scratched may cause problems such as breakage at once due to the influence of the residual tensile stress inside the substrate, complete division, and the like.

As described above, unlike the conventional scribing process for a soda glass substrate or the like used for a tempered glass substrate, it is difficult to form a scribe line properly even if the glass substrate is broken or broken. This tendency becomes more pronounced for a substrate having a large residual compressive stress layer on the substrate surface and a large residual stress.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a scribe method and scribe apparatus capable of surely forming a scribe line by a method of " die cutting " even in a glass substrate made of tempered glass, which is difficult to process.

In order to achieve the above object, the present invention takes the following technical means. That is, the scribing method of the present invention is a scribing method for forming a scribe line on a tempered glass substrate on which a compressive stress layer is formed on a surface of a substrate, comprising: (a) A trigger groove forming step of irradiating the surface of the substrate with a laser beam and forming a trigger groove which becomes a scribing origin of the cutter wheel by the irradiation scratch; And a scribing step of rolling the scribing line along the planned scribing line to form a scribing line.

The scribing apparatus according to the present invention is a scribe apparatus for forming a scribe line on a tempered glass substrate on which a compressive stress layer is formed on the surface of a substrate. The scribe apparatus includes a table on which the substrate is placed, A scribing head for integrally holding or individually supporting a cutter wheel for rolling the scribe line along the planned scribing line on the substrate to form a scribe line; A wheel elevating means for moving the scribing head supported by the scribing head, a moving means for relatively moving the scribing head along the surface of the substrate, and a controller for controlling the scribing operation by the laser irradiating portion and the cutter wheel Wherein the control unit is configured to control the temperature of the substrate (A) irradiating the surface of the substrate with a laser beam and irradiating the surface of the substrate with the scribing head as a scribing origin of the cutter wheel (B) Next, control is performed to form a scribe line by moving the cutter wheel to the upper side of the trigger groove and descending to a position where the cutter wheel abuts against the substrate, and rolling along the planned scribe line .

It is preferable that the trigger groove has a depth of 2.5 mu m or more, a width of 15 to 50 mu m, and a length of 50 to 250 mu m.

According to the present invention, even if the tempered glass substrate is used, the trigger groove can be processed by the laser beam at a position inwardly than the one end edge of the substrate, and scribing is performed with the cutter wheel starting from the trigger groove. The edge of the cutter wheel abuts against the stepped portion formed at the end of the trigger groove at the initial stage of power transmission of the wheel so that the engagement with the substrate is improved and the occurrence of problems such as slip can be avoided. Thereby, even if the tempered glass substrate is used, there is an effect that the scribe can be reliably performed by the " die-cutting " method.

In the present invention, it is preferable that the trigger groove is formed to have a length that allows the cutter wheel to run in the trigger groove.

Thus, since the cutter wheel rotates in the trigger groove to reach the stepped portion, it is possible to further enhance the engagement of the cutter wheel with respect to the substrate.

1 is a view showing an embodiment of a scribing apparatus used in the scribing method of the present invention.
Fig. 2 is an explanatory diagram showing a scribing step by the scribing apparatus of Fig. 1;
3 is a cross-sectional view along the longitudinal direction for explaining the trigger groove.
4 is a cross-sectional view along the width direction for explaining the trigger groove.
5 is a plan view for explaining a scribing method of a conventional glass substrate.
Fig. 6 is an explanatory diagram of a scribing method for the inner break and the outer break.

(Mode for carrying out the invention)

Hereinafter, the scribing method and the scribing apparatus according to the present invention will be described in detail with reference to the drawings.

1 is a schematic view showing an example of a scribing apparatus used for forming a scribe line on a tempered glass substrate having a compressive stress layer on a substrate surface.

This scribing apparatus SC is provided with a table 3 on which a tempered glass substrate M is placed. The table 3 is provided with a support mechanism for supporting the substrate M placed on the table 3 in a fixed position. In this embodiment, as the support mechanism, the substrate M is attracted and supported through a plurality of small air suction holes (not shown) opened on the surface of the table 3. [ The table 3 is capable of moving along the horizontal rail 4 in the Y direction (forward and backward direction of the sheet of Fig. 1) and is rotatably supported by a screw shaft 5 rotated by a motor (not shown) . Further, the table 3 is capable of rotating in a horizontal plane by a rotary drive unit 6 incorporating a motor.

A bridge 9 including support shafts 7 and 7 on both sides formed between the table 3 and a beam 8 horizontally extending in the X direction, And is formed to extend over the table 3.

A guide 10 extending horizontally in the X direction is formed in the beam 8 and a scribe head 11 can be moved in the X direction along the beam 8 by the motor 13 Respectively. The scribe head 11 is provided with a laser irradiation unit 1 for condensing a laser beam by a green laser on a substrate surface and a cutter wheel 2 supported by a liftable cutter holder 12, . In the present embodiment, the laser irradiation unit 1 and the cutter wheel 2 are attached to the same scribe head 11 with a slight gap therebetween, but they can be attached to individual scribe heads. In either case, the interval between them is known, and is used as a reference in the setting information of the " wheel adjustment length " 33 described later.

As shown in Fig. 4, the cutter wheel 2 is formed of a disk-like hard disk member having a blade tip 2a on the circumferential ridgeline. The blade 2 has a diameter of 2 to 3 mm and a blade angle? Of 100 to 150 degrees at an obtuse angle Is used.

Next, a control system of the scribing device SC will be described with reference to Fig.

The scribing device SC is provided with a control unit 20. [ The control unit 20 includes a CPU 21 for performing arithmetic processing required for control, a memory 22 (storage unit) for storing control programs and necessary setting information, an input device 23 for inputting and outputting setting information and operation, And a display device 24 used as an input operation screen or a monitor screen of the device status.

In the control unit 20, the setting information necessary for the control is stored in the memory 22 in advance so that the desired scribing operation can be performed by the control program and the setting information.

The setting information stored in the memory 22 as setting information necessary for the scribing includes information on the output power of the laser irradiation, the start position of laser irradiation (trigger machining), the pressing load of the cutter wheel, The trigger width 31, the trigger width 32, and the wheel position adjustment length 33, as information related to the present invention, .

The " trigger length " 31 and the " trigger width " 32 are information set to set the length L or width W of the trigger formed by laser irradiation to a desired value. Based on this setting information, the number of irradiation pulses of the laser and the movement distance at the time of trigger formation of the scribe head are calculated and the trigger T of the length L and the width W conforming to the setting information is processed .

The "wheel position adjustment length" 33 is obtained by firstly forming the trigger T by the laser irradiating unit 1 and thereafter changing the adjustment length E required for bringing the cutter wheel 2 into contact with the trigger forming position ). That is, since the laser irradiation unit 1 and the cutter wheel 2 are attached to the scribe head 11 at a predetermined interval, the cutter wheel 2 is positioned at the position of the trigger T formed by the laser irradiation It is necessary to move the cutter wheel 2 downward so as to contact the cutter wheel 2 with the same distance as the interval. Therefore, the wheel position adjustment length E, which is the movement distance, is set in advance.

Next, a scribing method using the scribing device SC will be described.

2 (a) and 2 (b), on the substrate M on the planned scribing line in the right direction in the drawing, the substrate M is arranged inside (for example, A laser beam is irradiated from the laser irradiating unit 1 to the point P 1 (the start point of the trigger processing) where the laser beam has entered into the laser processing unit ), Thereby processing the elongated trigger groove T along the planned scribing line.

The depth D of the trigger groove T (see FIGS. 3 and 4) can be adjusted in the range of 2.5 μm to 4 μm according to the output power of the irradiation laser, An appropriate depth is set. The length L of the trigger groove T is in the range of 50 to 250 mu m and the width W is in the range of 15 to 50 mu m.

The values of the length L and the width W of the trigger groove T are set as the above-described "trigger length" 31 and the "trigger width" 32. However, 2) and the angle of the blade edge. The adjustment of the length L of the trigger groove T can be performed by moving the laser irradiation unit 1 along the guide 10 (see Fig. 1) as shown in Fig. 2 (b) Adjustment of the width W direction of the trigger groove T can be performed by moving the table in the Y direction (forward and backward direction) by the screw shaft 5. [

After the trigger groove T is machined, the scribe head 11 is moved based on the adjustment length E stored in the " wheel position adjustment length " To the right. Subsequently, as shown in Fig. 2 (c), the cutter wheel 2 is lowered to the trigger groove T, and along the planned scribing line while pressing the substrate M, . 2 (d), the cutter wheel 2 is brought into contact with the stepped portion 15 formed at the end portion of the trigger groove T, And scribing can be surely performed to the end position P2 of the scheduled scribing line without slipping. Since the step 15 is low at 2.5 to 4 占 퐉 and is formed at the end of the trigger groove T, irregular fracture or cracking due to the impact when the cutter wheel 2 abuts There is no work.

When the cutter wheel 2 is lowered to the trigger groove T and the cutter wheel 2 is steered in the trigger groove T so as to touch the step portion 15, ) Should be set in advance in consideration of the freezing distance. As a result, the engagement of the cutter wheel 2 with respect to the substrate M can be further promoted.

3, when the depth D of the trigger groove T is set to 3 mu m and a cutter wheel having a diameter of 2 mm is used as the length of the trigger groove T, The front and rear length L1 of the cutting edge portion of the cutter wheel 2 that fits comfortably in the cutting edge T is 154.8 占 퐉. 3, the scale ratios of the cutter wheel 2 and the trigger groove T are changed and displayed for convenience of explanation.

When the width W of the trigger groove T is narrow when the cutter wheel 2 is lowered to the trigger groove T, the left and right sloping surfaces of the cutter wheel 2 are cut into the trigger groove T So that the substrate M may be irregularly broken or may have a problem such as a front diameter of cracks. It is therefore preferable to set the width W of the trigger groove T so that the left and right edges of the trigger groove T do not touch the cutter wheel 2. [

For example, when the depth of the trigger groove T is 3 占 퐉 and the cutter wheel 2 having a blade angle of 130 degrees is used, as shown in Fig. 4, The width W of the trigger groove T is larger than the above 12.87 占 퐉 and has a margin such as 15 占 퐉 and 15 占 퐉, for example, since the distance L2 connecting the right and left oblique surfaces at the positions where the? Preferably 20 mu m. However, if the width W is excessively widened, it becomes difficult to function as a trigger groove. Accordingly, it is possible to prevent a problem caused by forcibly pressing the edge of the cutter wheel into the narrow trigger groove.

After the scribe line in the X direction in FIG. 1 is processed in this way, the table 3 is rotated 90 degrees in the horizontal direction, and all of the scribe lines in the Y direction orthogonal to the X direction are processed in the same manner as described above . In this way, the intersecting scribe lines in the X-Y direction are processed.

In the above embodiment, the process of forming the trigger groove T by the laser beam irradiation and the scribing process by the cutter wheel 2 are performed every time one scribe line is formed. However, The trigger groove T may be formed and then the scribing process by the cutter wheel 2 may be performed from the trigger groove T. [

While the present invention has been described with reference to the exemplary embodiments, it is to be understood that the present invention is not limited to the specific embodiments thereof, but may be modified and changed without departing from the scope of the present invention. It is possible.

The scribing method of the present invention can be used when scribing a tempered glass substrate having a compressive stress layer on its surface.

M: Tempered glass substrate
T: Trigger home
1: laser irradiation unit
2: Cutter wheel
3: Table
15: step portion of the trigger groove
20:
21: CPU
22: Memory
23: Input device
24: Display device
31: Trigger length setting information
32: Trigger width setting information
33: Wheel position adjustment length setting information

Claims (7)

A scribe method for forming a scribe line on a tempered glass substrate in which a compressive stress layer is formed on a surface of a substrate,
(a) a laser beam is irradiated onto the surface of the substrate at a position inwardly of one edge of the substrate, and a trigger groove, which becomes a scribe origin of the cutter wheel by the irradiation marks, A trigger groove forming step of forming a groove,
(b) a scribing step of descending the cutter wheel to a position where it abuts the trigger groove, and rolling the scribe line along the planned scribing line to form a scribe line. The method according to claim 1,
Wherein the trigger groove is formed in a length that allows the cutter wheel to run in the trigger groove. The method according to claim 1,
Wherein the trigger groove has a width of 15 to 50 占 퐉. 4. The method according to any one of claims 1 to 3,
Wherein the trigger groove has a length of 50 to 250 mu m. The method according to claim 1,
Wherein the trigger groove has a depth of 2.5 mu m or more. A scribing apparatus for forming a scribe line on a tempered glass substrate in which a compressive stress layer is formed on a surface of a substrate,
A table on which the substrate is placed,
A laser irradiation unit for irradiating a laser beam for forming a trigger groove on the surface of the substrate;
A scribe head integrally holding or individually supporting a cutter wheel for rolling and rolling along a planned scribing line on the substrate to form a scribe line;
Wheel lifting means for lifting and lowering the cutter wheel supported by the scribe head,
Moving means for relatively moving the scribe head along the surface of the substrate,
And a control unit for controlling the scribing operation by the laser irradiation unit and the cutter wheel,
When the control is started in a state in which the scribing head is set such that the laser irradiating unit is located above a point that is inwardly inward of the one end of the substrate,
(a) irradiating the surface of the substrate with a laser beam, forming a trigger groove serving as a scribing origin of the cutter wheel by the irradiation scratch,
(b) a scribe line is formed by moving the cutter wheel to a position above the trigger groove, lowering the cutter wheel to a position where the cutter wheel abuts against the substrate, and rolling it along the planned scribing line to form a scribe line. The method according to claim 6,
The laser irradiating unit is a laser irradiating unit for irradiating a laser beam on a surface of a substrate to be controlled so that a trigger groove having a trigger length of 50 to 250 mu m and a trigger width of 15 to 50 mu m can be machined on the substrate surface along the direction of the planned scribe line Scribe device.

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