TW201511907A - Breaking method and breaking device for brittle material substrate - Google Patents
Breaking method and breaking device for brittle material substrate Download PDFInfo
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- TW201511907A TW201511907A TW103114169A TW103114169A TW201511907A TW 201511907 A TW201511907 A TW 201511907A TW 103114169 A TW103114169 A TW 103114169A TW 103114169 A TW103114169 A TW 103114169A TW 201511907 A TW201511907 A TW 201511907A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
本發明是關於一種由玻璃或陶瓷等脆性材料所構成之基板的裂斷方法及裂斷裝置。本發明尤其是關於一種在表面形成有凸部、在背面於前段步驟中形成有刻劃線(切槽)之脆性材料基板(以下，簡稱「基板」)之裂斷方法及其裂斷裝置。 The present invention relates to a cracking method and a cracking device for a substrate comprising a brittle material such as glass or ceramic. More particularly, the present invention relates to a method for breaking a brittle material substrate (hereinafter, simply referred to as "substrate") in which a convex portion is formed on a surface thereof and a scribe line (grooving) is formed in a step of a back surface, and a cracking device therefor.
習知例如，在專利文獻1~專利文獻3等中揭示有在基板表面，利用刀輪(亦稱刻劃輪)或固定刀刃、或雷射光束等之刻劃手段，形成相互正交之X方向及Y方向之刻劃線，之後，藉由從該刻劃線相反側之面施加外力而使基板撓曲、或進行壓彎等，從而沿刻劃線裂斷基板，並取出晶片等之單位製品的方法。 For example, Patent Document 1 to Patent Document 3 and the like disclose that X is orthogonal to each other by a scribing means such as a cutter wheel (also referred to as a scoring wheel) or a fixed blade or a laser beam on the surface of the substrate. The direction and the Y direction are scribed, and then, by applying an external force from the surface on the opposite side of the scribe line, the substrate is bent or bent, and the substrate is broken along the scribe line, and the wafer or the like is taken out. The method of unit products.
此外，用於使基板沿刻劃線撓曲而進行裂斷之手段，習知有各種之手段。 Further, various means are known for the means for causing the substrate to be broken by bending the score line.
圖6，係表示一般所使用之裂斷方法之一例的圖式。如圖6(a)所示，將基板W’貼附於由切割環(dicing ring)(未圖示)所支持之具有彈力性之黏著性的切割帶材(dicing tape)16。在基板W’之下面，在前段步驟中形成有相互正交之多條刻劃線S，將貼附有該基板W’的切割帶材16，隔著緩衝片(cushion sheet)18而載置於水平的平台17上。此時，使形成有基板W’之刻劃線S之面成為下側。然後，如圖6(b)所示，從基板W’之上方使裂斷桿19下降 而使基板W’沿刻劃線S撓曲，藉此進行裂斷。 Fig. 6 is a view showing an example of a cracking method generally used. As shown in Fig. 6(a), the substrate W' is attached to a dicing tape 16 having an elastic adhesiveness supported by a dicing ring (not shown). On the lower surface of the substrate W', a plurality of scribe lines S which are orthogonal to each other are formed in the preceding step, and the dicing tape 16 to which the substrate W' is attached is placed via a cushion sheet 18. On the horizontal platform 17. At this time, the surface on which the scribe line S of the substrate W' is formed is set to the lower side. Then, as shown in Fig. 6(b), the split rod 19 is lowered from above the substrate W'. On the other hand, the substrate W' is deflected along the scribe line S, thereby being broken.
圖7係表示其他裂斷方法之圖式。在該方法中，取代上述緩衝片18，配置夾著刻劃線S並承受基板W’之一對承受刀20、20。而且，藉由從貼附於切割帶材16之基板W’之與設置有刻劃線S之面為相反側之面，將裂斷桿19按壓於基板W’，而使基板W’與上述同樣地沿刻劃線S撓曲從而裂斷。 Figure 7 is a diagram showing another method of breaking. In this method, in place of the above-mentioned buffer sheet 18, the pair of dicing lines S and the pair of receiving blades 20, 20 are received by sandwiching the scribe line S. Further, the substrate W' is pressed against the substrate W' by pressing the cracking rod 19 against the substrate W' from the surface of the substrate W' attached to the dicing tape 16 opposite to the surface on which the scribe line S is provided. Similarly, it is deflected along the score line S to be broken.
專利文獻1：日本特開2013-071335號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2013-071335
專利文獻2：日本特開2012-131216號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2012-131216
專利文獻3：日本特開2011-212963號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2011-212963
供裂斷之基板W’，在多數的情形，係以平坦之面形成供裂斷桿按壓之面。因此，如圖8所示，能夠使裂斷桿19之直線狀之下端稜線部19a，對基板W’以遍及其全域之方式並以均等之按壓負載按壓。 In the case where the cracked substrate W' is formed, in many cases, the surface to be pressed by the splitting bar is formed in a flat surface. Therefore, as shown in Fig. 8, the linear lower end ridge portion 19a of the rupture rod 19 can be pressed against the substrate W' with a uniform pressing force over the entire region.
但是根據基板，例如圖1(a)所示般，存在有沿基板W之周邊部形成有凸部1，在由該凸部1所包圍之區域內，形成有區分單位製品之X-Y方向之刻劃線S的情形。 However, according to the substrate, for example, as shown in FIG. 1(a), the convex portion 1 is formed along the peripheral portion of the substrate W, and in the region surrounded by the convex portion 1, the XY direction is distinguished from the unit product. The case of scribing S.
在如此般之情形，一旦如圖8所示般利用遍及其全長呈直線狀地形成有前端稜線部19a之裂斷桿19按壓圖1之基板W，將使凸部1附近之按壓力較其他部分為強而使施於基板W上面之負載不均等。因此，存在有如下之問題點：存在有使刻劃線S之龜裂(裂紋)斜偏地進展而分斷、或於分斷面產生碎屑(缺欠)等之情況而成為不良品，使製品良率惡化。 In such a case, as shown in FIG. 8, when the cracking rod 19 having the tip end ridge portion 19a formed linearly over its entire length is pressed against the substrate W of FIG. 1, the pressing force in the vicinity of the convex portion 1 is made higher than that of the other. The part is strong and the load applied to the substrate W is uneven. Therefore, there is a problem in that cracks (cracks) of the score line S are gradually deviated and are broken, or debris (absence) is generated in the cross section, and the like is caused to be defective. Product yields deteriorated.
此外，亦存在有如下之問題點：在成為裂斷桿19之刃前端的前端稜線 部19a中，由於基板W之凸部1抵接的部分承受較其他部分更大之負載，因此在反覆地使用下將產生局部性的磨耗，而成為無法使用作為具有平坦表面之基板之裂斷用。 In addition, there is also the following problem: the front edge ridge at the front end of the blade which becomes the split rod 19 In the portion 19a, since the portion where the convex portion 1 of the substrate W abuts is subjected to a larger load than the other portions, local wear is caused by repeated use, and the crack as a substrate having a flat surface cannot be used. use.
因此，本發明之目的在於提供一種能夠解決上述課題、且能夠以裂斷桿對在表面具有凸部之基板較完美地進行裂斷之裂斷方法及其裂斷裝置。 Accordingly, an object of the present invention is to provide a cracking method and a cracking device which can solve a problem in which the substrate having a convex portion on a surface thereof is cut by a cracking rod.
為了解決上述課題，在本發明中提出了如以下般之技術性的手段。亦即，本發明之脆性材料基板之裂斷方法，係對在一面形成有凸部、且在另一面形成有刻劃線的脆性材料基板，從與形成有該刻劃線之面相反側之面以裂斷桿進行按壓，藉此使該脆性材料基板撓曲而沿該刻劃線裂斷，其特徵在於：在該裂斷桿之前端之直線狀稜線部，於相對於供裂斷之脆性材料基板之該凸部的部分，形成供該凸部嵌入之凹部，並以於裂斷桿之按壓時對脆性材料基板之裂斷桿按壓面全域施予均等之按壓負載之方式進行裂斷。 In order to solve the above problems, the following technical means have been proposed in the present invention. That is, the method for breaking the brittle material substrate of the present invention is a brittle material substrate having a convex portion formed on one surface and a scribed line on the other surface, from the side opposite to the surface on which the scribe line is formed. The surface is pressed by the rupture rod, whereby the brittle material substrate is deflected and broken along the scribe line, and the linear ridge portion at the front end of the rupture rod is opposite to the crack The portion of the convex portion of the brittle material substrate forms a concave portion into which the convex portion is fitted, and is configured to break the pressing force of the cracking rod pressing surface of the brittle material substrate in a uniform manner when the cracking rod is pressed. .
此外，由其他觀點所完成之本發明之脆性材料基板之裂斷裝置，係對在一面形成有凸部、且在另一面形成有刻劃線的脆性材料基板，從與形成有該刻劃線之面相反側之面以裂斷桿進行按壓，藉此使該脆性材料基板撓曲而沿該刻劃線裂斷，其特徵在於：在該裂斷桿之前端之直線狀稜線部，於相對於供裂斷之脆性材料基板之該凸部的部分，形成供該凸部嵌入之凹部。 Further, the cracking device for a brittle material substrate of the present invention which is completed from another viewpoint is a brittle material substrate having a convex portion formed on one surface and a scribed line on the other surface, and the scribe line is formed and formed. The surface on the opposite side of the surface is pressed by the rupture rod, whereby the brittle material substrate is deflected and broken along the scribe line, and the linear ridge portion at the front end of the rupture rod is opposite A concave portion into which the convex portion is fitted is formed in a portion of the convex portion of the fractured brittle material substrate.
在本發明中，由於在裂斷桿之前端稜線部，形成可嵌入供裂斷之基板之凸部的凹部，並以於裂斷桿之按壓時對脆性材料基板之裂斷桿 按壓面全域施予均等之按壓負載之方式進行裂斷，因此，能夠抑制於裂斷時因如習知般之負載不均等而導致不規則龜裂的產生、及在分斷面產生碎屑，而能夠對基板沿刻劃線較完美地進行裂斷。 In the present invention, since the end ridge portion before the splitting bar forms a concave portion that can be fitted into the convex portion of the substrate for cracking, and the cracking rod for the brittle material substrate when the cracking bar is pressed Since the pressing surface is uniformly applied to the pressing load in the entire region, it is possible to suppress the occurrence of irregular cracks and the generation of debris in the cross-section due to the conventional load unevenness at the time of the cracking. The substrate can be broken perfectly along the scribe line.
在本發明中，亦可構成為：該裂斷桿之凹部的深度形成為與該脆性材料基板之凸部的高度相等，該凹部之寬度，以該凸部能夠充分地嵌入之尺寸形成。 In the present invention, the depth of the concave portion of the splitting bar may be equal to the height of the convex portion of the brittle material substrate, and the width of the concave portion may be formed by a size in which the convex portion can be sufficiently fitted.
藉此，能夠使裂斷桿對基板之凸部及平坦之表面部分以均等之負載按壓，並且能夠防止裂斷桿之凹部於嵌入基板之凸部時碰觸凸部之邊緣而產生破損般之不良情況。 Thereby, the cracking rod can be pressed against the convex portion and the flat surface portion of the substrate with an equal load, and the concave portion of the cracking rod can be prevented from being damaged when the concave portion of the cracking member is in contact with the edge of the convex portion. Bad situation.
A‧‧‧裂斷裝置 A‧‧‧cracking device
S‧‧‧刻劃線 S‧‧ scribe
W‧‧‧脆性材料基板 W‧‧‧Battery material substrate
1‧‧‧凸部 1‧‧‧ convex
2‧‧‧平台 2‧‧‧ platform
9‧‧‧裂斷桿 9‧‧‧crack
9a‧‧‧裂斷桿之直線狀之稜線部 9a‧‧‧The straight ridgeline of the split rod
9b‧‧‧裂斷桿之凹部 9b‧‧‧The recess of the broken rod
11‧‧‧切割帶材 11‧‧‧Cutting strip
12‧‧‧緩衝片 12‧‧‧buffer
圖1，係表示藉由本發明之裂斷方法及裂斷裝置裂斷之基板之一例的圖式。 Fig. 1 is a view showing an example of a substrate which is broken by the cracking method and the breaking device of the present invention.
圖2，係表示本發明之裂斷裝置之一例的立體圖。 Fig. 2 is a perspective view showing an example of the breaking device of the present invention.
圖3，係表示利用圖2之裂斷裝置進行之裂斷步驟的圖式。 Fig. 3 is a view showing a breaking step by the breaking device of Fig. 2.
圖4，係表示於切割帶材貼附有基板之狀態的立體圖。 Fig. 4 is a perspective view showing a state in which a substrate is attached to a dicing tape.
圖5，係表示利用圖2之裂斷裝置進行之裂斷步驟的剖面圖。 Fig. 5 is a cross-sectional view showing a breaking step by the breaking device of Fig. 2.
圖6，係表示習知一般的裂斷方法之一例的說明圖。 Fig. 6 is an explanatory view showing an example of a conventional general breaking method.
圖7，係表示習知的裂斷方法之其他例的說明圖。 Fig. 7 is an explanatory view showing another example of a conventional breaking method.
圖8，係用以說明習知的裂斷方法中的裂斷桿之形態的剖面圖。 Figure 8 is a cross-sectional view showing the form of a split rod in a conventional breaking method.
在以下，根據圖1至圖5針對本發明之基板裂斷方法及基板 裂斷裝置之實施態樣進行說明。圖1係表示藉由本發明裂斷之基板W之形態之一例的圖式。基板W，如圖1(a)之立體圖、圖1(b)之剖面圖、圖1(c)之俯視圖所示般，沿上面周邊部以描繪四角形之框的方式形成凸部1，在由該凸部1所包圍之區域內，在與設置有凸部1之面相反側之面於前段步驟中形成區分單位製品之X-Y方向之刻劃線S。 Hereinafter, the substrate cracking method and substrate of the present invention according to FIGS. 1 to 5 The embodiment of the breaking device will be described. Fig. 1 is a view showing an example of a form of a substrate W which is broken by the present invention. As shown in the perspective view of FIG. 1(a), the cross-sectional view of FIG. 1(b), and the top view of FIG. 1(c), the substrate W is formed with a rectangular frame along the peripheral portion of the upper surface. In the region surrounded by the convex portion 1, a scribe line S which distinguishes the XY direction of the unit product is formed in the step of the preceding step on the surface opposite to the surface on which the convex portion 1 is provided.
圖2係表示本發明之裂斷裝置A之一例的圖式。 Fig. 2 is a view showing an example of the breaking device A of the present invention.
裂斷裝置A，具備有載置並保持基板W之平台2。平台2，成為可沿水平之導軌3於Y方向移動，且藉由利用馬達M進行旋轉之螺桿軸4而驅動。進一步地，平台2，成為可藉由內藏馬達之旋轉驅動部5而於水平面內旋動。 The breaking device A is provided with a stage 2 on which the substrate W is placed and held. The platform 2 is movable in the Y direction along the horizontal guide rail 3, and is driven by the screw shaft 4 that is rotated by the motor M. Further, the platform 2 is rotatable in a horizontal plane by the rotary drive unit 5 of the built-in motor.
由夾著平台2而設置的兩側之支持柱6、6、及於X方向水平延伸之樑(橫樑)7所構成之橋部13，設置成跨越平台2上。在樑7，設置有藉由流體汽缸8而朝向平台2上下動之長條板狀之裂斷桿9。裂斷桿9，於其下端具備有已將前端部變細之直線狀的稜線部9a。該稜線部9a之既定位置、亦即在下述之裂斷動作時相對於載置於平台2上之基板W之凸部1的位置，設置有供凸部1嵌入之凹部9b(參照圖3(a))。 A bridge portion 13 composed of support columns 6, 6 provided on both sides sandwiching the platform 2 and beams (beams) 7 extending horizontally in the X direction is disposed across the platform 2. In the beam 7, a long plate-shaped cracking rod 9 that is moved up and down toward the platform 2 by the fluid cylinder 8 is provided. The split rod 9 is provided at its lower end with a linear ridge portion 9a having a tapered tip end portion. The predetermined position of the ridge portion 9a, that is, the position of the convex portion 1 of the substrate W placed on the stage 2 at the predetermined position, that is, the concave portion 9b into which the convex portion 1 is fitted is provided (refer to FIG. 3 (refer to FIG. 3 a)).
如圖3(a)所示，裂斷桿9之凹部9b的深度H與基板W之凸部1的高度h相等，凹部9b之寬度L1，以基板W之凸部1能夠充分地嵌入之方式形成為稍微較凸部1之寬度L2長。 As shown in Fig. 3(a), the depth H of the concave portion 9b of the split rod 9 is equal to the height h of the convex portion 1 of the substrate W, and the width L1 of the concave portion 9b is such that the convex portion 1 of the substrate W can be sufficiently embedded. It is formed to be slightly longer than the width L2 of the convex portion 1.
在對基板W進行裂斷時，首先，如圖4所示，將基板W以刻劃線S成為下方之方式貼附於由切割環10所支持之具有彈力性之黏著性的切割帶材11。然後如圖3(a)所示，將已貼附有該基板W之切割帶材11，隔著緩衝片12載置保持於裂斷裝置A之平台2上。此時，使形成有基板W 之刻劃線S之面成為下側。 When the substrate W is ruptured, first, as shown in FIG. 4, the substrate W is attached to the dicing tape 11 having elastic adhesiveness supported by the dicing ring 10 so that the scribe line S becomes downward. . Then, as shown in FIG. 3(a), the dicing tape 11 to which the substrate W has been attached is placed and held on the stage 2 of the rupturing device A via the buffer sheet 12. At this time, the substrate W is formed. The surface of the scribe line S is the lower side.
然後如圖3(b)所示，從基板W之上方使裂斷桿9朝向刻劃線S下降並按壓基板W，使刻劃線S在緩衝片12上撓曲並使刻劃線S之龜裂往厚度方向浸透而裂斷基板W。 Then, as shown in FIG. 3(b), the split rod 9 is lowered from the upper side of the substrate W toward the score line S and the substrate W is pressed, so that the score line S is deflected on the buffer sheet 12 and the score line S is pressed. The crack penetrates in the thickness direction to break the substrate W.
在利用該裂斷桿9進行裂斷時，如圖5(a)、(b)所示，由於基板W之凸部1嵌入於裂斷桿9之凹部9b，並且凹部9b之深度H形成為與凸部1之高度h相等，因此使裂斷桿9之凹部9b與直線狀之稜線部9a對基板W之按壓負載均等。藉此，能夠抑制如習知般因負載不均等導致不規則龜裂之產生及在分斷面產生碎屑，而能夠對基板W沿刻劃線S較完美地進行裂斷。 When the crack is broken by the split rod 9, as shown in Figs. 5(a) and 5(b), the convex portion 1 of the substrate W is fitted into the concave portion 9b of the split rod 9, and the depth H of the concave portion 9b is formed as Since the height h of the convex portion 1 is equal to each other, the pressing load of the concave portion 9b of the split rod 9 and the linear ridge portion 9a to the substrate W is equal. As a result, it is possible to suppress the occurrence of irregular cracks due to load unevenness and the like, and to generate debris in the cross-section, so that the substrate W can be perfectly broken along the scribe line S.
在本發明中，在上述實施例中，雖為於基板W之下面鋪設有緩衝片12，藉由以裂斷桿9按壓而使基板W撓曲，但亦可取代緩衝片12，設置如圖7所示般之夾著刻劃線S並承受基板W’之一對承受刀20、20。 In the present invention, in the above embodiment, the buffer sheet 12 is laid on the lower surface of the substrate W, and the substrate W is deflected by pressing with the rupture rod 9. However, instead of the buffer sheet 12, it may be arranged as shown in the figure. As shown in Fig. 7, the scribe line S is sandwiched and received by one of the substrates W' to receive the knives 20, 20.
以上，雖已針對本發明之代表性的實施例進行了說明，但本發明並不限定於上述之實施例構造。例如，亦可省略上述之切割帶材11。此外在本發明中，可在達成該目的、不脫離申請專利範圍之範圍內適當地進行修正、變更。 Although the representative embodiments of the present invention have been described above, the present invention is not limited to the configuration of the above-described embodiments. For example, the above-described dicing tape 11 can also be omitted. Further, in the present invention, it is possible to appropriately modify and change the scope of the invention without departing from the scope of the invention.
本發明可應用於以裂斷桿對在一面形成有凸部、在另一面形成有刻劃線之玻璃或陶瓷等脆性材料基板進行裂斷時。 The present invention can be applied to a case where a brittle material substrate such as glass or ceramic having a convex portion formed on one surface and a scribed line formed on the other surface is broken by a split rod.
S‧‧‧刻劃線 S‧‧ scribe
W‧‧‧脆性材料基板 W‧‧‧Battery material substrate
1‧‧‧凸部 1‧‧‧ convex
2‧‧‧平台 2‧‧‧ platform
9‧‧‧裂斷桿 9‧‧‧crack
9a‧‧‧裂斷桿之直線狀之稜線部 9a‧‧‧The straight ridgeline of the split rod
9b‧‧‧裂斷桿之凹部 9b‧‧‧The recess of the broken rod
11‧‧‧切割帶材 11‧‧‧Cutting strip
12‧‧‧緩衝片 12‧‧‧buffer
H‧‧‧凹部之深度 H‧‧‧Deep depth
h‧‧‧凸部之高度 H‧‧‧ Height of the convex part
L1‧‧‧凹部之寬度 L1‧‧‧Width of the recess
L2‧‧‧凸部之寬度 L2‧‧‧Width of the convex part
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013203709A JP6154713B2 (en) | 2013-09-30 | 2013-09-30 | Method and apparatus for breaking brittle material substrate |
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| TW201511907A true TW201511907A (en) | 2015-04-01 |
| TWI619588B TWI619588B (en) | 2018-04-01 |
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| TW103114169A TWI619588B (en) | 2013-09-30 | 2014-04-18 | Fracture method and device for brittle material substrate |
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| JP (1) | JP6154713B2 (en) |
| KR (1) | KR102172680B1 (en) |
| CN (1) | CN104511973B (en) |
| TW (1) | TWI619588B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI632040B (en) * | 2017-07-10 | 2018-08-11 | 煜峰投資顧問有限公司 | Apparatus and method for breaking brittle substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106514884A (en) * | 2015-09-09 | 2017-03-22 | 三星钻石工业股份有限公司 | Cutting method and device for brittle substrate |
| JP6967276B2 (en) * | 2017-12-28 | 2021-11-17 | 三星ダイヤモンド工業株式会社 | Break device |
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| JPS62121906U (en) * | 1986-01-24 | 1987-08-03 | ||
| JPH01210295A (en) * | 1988-02-19 | 1989-08-23 | Ngk Insulators Ltd | Cutting method and cutting device of brittle material |
| CN1259264C (en) * | 2001-06-28 | 2006-06-14 | 三星钻石工业股份有限公司 | Device and method for breaking fragile material substrate |
| JP4169565B2 (en) * | 2002-10-11 | 2008-10-22 | 三星ダイヤモンド工業株式会社 | Brittle material substrate break method, apparatus and processing apparatus therefor |
| JP2004216729A (en) * | 2003-01-15 | 2004-08-05 | Seishin Shoji Kk | Device for splitting substrate with split groove |
| CN102026925B (en) * | 2008-04-14 | 2013-06-05 | 三星钻石工业股份有限公司 | Method for processing fragile material substrate |
| JP2010159187A (en) | 2009-01-09 | 2010-07-22 | Epson Imaging Devices Corp | Method and apparatus for breaking substrate, and breaking bar |
| JP5167161B2 (en) * | 2009-01-30 | 2013-03-21 | 三星ダイヤモンド工業株式会社 | Breaking device for brittle material substrate |
| JP2010229005A (en) * | 2009-03-30 | 2010-10-14 | Mitsuboshi Diamond Industrial Co Ltd | Method for dividing brittle material substrate |
| JP5216040B2 (en) * | 2010-03-31 | 2013-06-19 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate |
| JP5187421B2 (en) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
| JP2012193080A (en) | 2011-03-17 | 2012-10-11 | Seiko Epson Corp | Break method and break apparatus |
| JP2013071335A (en) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | Method for dicing mother substrate |
| TWI488824B (en) * | 2011-12-05 | 2015-06-21 | Mitsuboshi Diamond Ind Co Ltd | The method and scribing device of glass substrate |
| JP5824365B2 (en) * | 2012-01-16 | 2015-11-25 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
-
2013
- 2013-09-30 JP JP2013203709A patent/JP6154713B2/en not_active Expired - Fee Related
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| TWI632040B (en) * | 2017-07-10 | 2018-08-11 | 煜峰投資顧問有限公司 | Apparatus and method for breaking brittle substrate |
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| Publication number | Publication date |
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| KR20150037481A (en) | 2015-04-08 |
| JP6154713B2 (en) | 2017-06-28 |
| JP2015066831A (en) | 2015-04-13 |
| CN104511973A (en) | 2015-04-15 |
| TWI619588B (en) | 2018-04-01 |
| KR102172680B1 (en) | 2020-11-02 |
| CN104511973B (en) | 2017-09-22 |
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